Nokia 3320 Service manual

Programmes After Market Services

Technical Documentation

[NMP Part No.0275514]

NPC-1 Cellular Phones

NPC-1 Issue 1: 10/2001

Issue 1 10/01

Copyrightã 2001 Nokia Corporation All Rights Reserved

Programmes After Market Services

Technical Documentation

Amendment Record Sheet

Amendment No Date Inserted By Comments

First Issue 10/2001 JoM

Issue 1 10/01

Copyrightã 2001 Nokia Corporation All Rights Reserved

Contents:

Programmes After Market Services

Technical Documentation

NPW-1 Overall Manual Contents

Section 1: Foreword
Section 2: General Information
Section 3: System Module
Section 4: Parts List
Section 5: Product Variants
Section 6: Service Software Instructions
Section 7: Service Tools
Section 8: Assembly & Disassembly Instructions
Section 9: Troubleshooting Instructions
Section 10: Accessories
Section 11: Schematics

Issue 1 10/01

Copyrightã 2001 Nokia Corporation All Rights Reserved

Programmes After Market Services

This document is intended for use by qualified service personnel only.

Company Policy

Our policy is of continuous development; details of all technical modifications will be
included with service bulletins.

While every endeavour has been m ade to ensure the accuracy of this document, some
errors may exist. If any errors are found by the reader, NOKIA MOBILE PHONES Ltd.
should be notified in writing.

Please state:

Technical Documentation

IMPORTANT

Title of the Document + Issue Number/Date of publication
Latest Amendment Number (if applicable)
Page(s) and/or Figure(s) in error

Please send to: Nokia Mobile Phones Ltd.

PAMS Technical Documentation
PO Box 86
FIN-24101 SALO
Finland

Issue 1 10/01

Copyrightã 2001 Nokia Corporation All Rights Reserved

Programmes After Market Services

Technical Documentation

Warnings and Cautions

Please refer to the phone's user guide f or instructions relating to operation, care and
maintenance including important safety information. Note also the following:

Warnings:

1. CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES FITTED WITH ELEC­TRONIC ENGINE MANAGEMENT SYSTEMS AND ANTI-SKID BRAKING SYS­TEMS. UNDER CERTAIN FAULT CONDITIONS, EMITTED RF ENERGY CAN
AFFECT THEIR OPERATION. IF NECESSARY, CONSULT THE VEHICLE DEALER/
MANUFACTURER TO DETERMINE TH E IMMUNITY OF VEHICLE ELECTRONIC
SYSTEMS TO RF ENERGY.

2. THE HANDPORTABLE TELEPHONE MUST NOT BE OPERATED IN AREAS LIKELY
TO CONTAIN POTENTIALLY EXPLOSIVE ATMOSPHERES EG PETROL STATIONS
(SERVICE STATIONS), BLASTING AREAS ETC.

3. OPERATION OF ANY RADIO TRANSMITTING EQUIPMENT, INCLUDING CELLU-

Cautions:

1. Servicing and alignment must be undertaken by qualified personnel only.

2. Ensure all work is carried out at an anti-static workstation and that an anti-

3. Ensure solder, wire, or foreign matter does not ent er the te lephone as dam-

4. Use only approved components as specified in the parts list.

5. Ensure all components, modules screws and insulators are corre ctly re-fit-

LAR TELEPHONES, MAY INTERFERE WITH THE FUNCTIONALITY OF INADE­QUATELY PROTECTED MEDICAL DEVICES. CONSULT A PHYSICIAN OR THE
MANUFACTURER OF THE MED ICAL DEVICE IF YOU HAVE ANY QUESTIONS.
OTHER ELECTRONIC EQUIPMENT MAY ALSO BE SUBJECT TO INTERFERENCE.

static wrist strap is worn.

age may result.

ted after servicing and alignmen t. Ensure all cables a nd wires are reposi­tioned correctly.

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Copyrightã 2001 Nokia Corporation All Rights Reserved

Programmes After Market Services

Technical Documentation

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Programmes After Market Services

NPC-1 Series Transceivers

General Information

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General Information PAMS Technical Documentation

Table of Contents

Page No

NPC-1 Product Selection............................................................................................... 4

Hand portables .............................................................................................................4

Desktop Option ............................................................................................................5

Mobile Holder (MBC-6) Option ..................................................................................6

Product and Module List................................................................................................ 7

Technical Specifications ................................................................................................ 8

General Specifications of Transceiver NPC-1 .............................................................8

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List of Figures

Page No

Fig 1 Hand portables, Nokia Design and Gradiente Design................................................4

Fig 2 Desktop option............................................................................................................5

Fig 3 Mobile Holder ...........................................................................................................6

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General Information PAMS Technical Documentation

NPC-1 Product Selection

Hand portables

The Nokia 3320 is a TDMA single band (SB), 800MHz + AMPS hand portable telephone.
This document describes the main characteristics of this phone.

Figure 1: Hand portables, Nokia Design and Gradiente Design

Table 1: Transceiver NPC-1

Name: Type Code: Material Code:

Transceiver (See Product Variants)

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PAMS Tec hnical Documentation General Information

Desktop Option

The desktop option allows the user to charge the phone from the mains.

Figure 2: Desktop option

1.

3.

ACP-7E

2.

ACP-8E
ACP-8K

7.

ACP-8X

8.

ACP-8U
ACP-8C

9.

ACP-8A

10.

4.

ACP-7C
ACP-7U

5.

ACP-7H
ACP-7X

6.

ACP-7A

Item Name: Type Code: Material Code:

1. Transceiver (See Product Variants)
2 Desk stand DCV-10 0675229

3. AC Travel Charger (Euro plug) 207-253 Vac ACP-7E 0675144

4. AC Travel Charger (US plug) 108-132 Vac ACP-7U 0675143
AC Travel Charger (US plug ) 198-242 Vac ACP-7C 0675158

5. AC Travel Charger (UK plug) 207-253 Vac ACP-7X 0675145
AC Travel Charger (UK plug ) 18 0-220 Vac ACP-7H 0675146

6. AC Travel Charger (Australia plug) 216-264 Vac ACP-7A 0675148

7. Performance Travel Charger Euro plug 90-264 Vac ACP-8E 0675195
Performance Travel Charger Korea plug 90-264 Vac ACP-8K 0675199

8. Performance Travel Charger UK plug 90-264 Vac ACP-8X 0675197

9. Performance Travel Charger US plug 90-264 Vac ACP-8U 0675196
Performance Travel Charger China plug 90-264 Vac ACP-8C 0675211

10. Performance Travel Charger Australia plug 90-264 V a c AC P -8A 0675214

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General Information PAMS Technical Documentation

Mobile Holder (MBC-6) Option

Figure 3: Mobile Holder

Item Name: Type Code: Material Code:

Mobile Holder MBC-6 0650026
Transceiver (Not included) (See Product Variants)
Swivel Mount HHS-9 0620037
Hands Free Microphone HFM-8 0690016
Hands Free Cigarette Lighter Charger PPH-1 0675182

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PAMS Tec hnical Documentation General Information

Product and Module List

Unit/Type: Product Code:

Transceiver NPC-1 See Product Variants
Standard Battery BLC-2 (Li-ION ) 850 mAh) 0670343
Standard Battery BMC-2 (NiMh) 900 mAh) 0670323
Standard Battery BMC-3(NiMh ) 850 mAh 0670324
AC Travel Charger ACP-7E (EURO) 207-253 Vac 0675144
AC Travel Charger ACP-7U (US) 108-132 Vac 0675143
AC Travel Charger ACP-7C (US) 198-242 Vac 0675158
AC Travel Charger ACP-7X (UK) 2 07-253 Vac 0675145
AC Travel Charger AC P - 7H ( UK) 180-220 Vac 0675146
AC Travel Charger ACP-7A (AUS) 216-264 Vac 0675148
Performance Travel Charger ACP-8E (EURO) 90-264 Vac 0675195
Performance Travel Charger ACP-8K (KOREA) 90-264 Vac 0675199
Performance Travel Charge r AC P - 8X (UK) 90-264 Vac 0675197
Performance Travel Charg e r AC P - 8U (US) 90-264 Vac 0675196
Performance Travel Charger ACP-8C (CHINA) 90-264 Vac 0675211
Performance Travel Charger ACP-8A (AUS) 90-264 Vac 0675214
Headset HDE-2 0694075
Headset HDC-5 0694059
Loopset LPS-3 0630244
Battery Charging Stand DDC-1 0675243
Desk Stand DCV-10 0675229
Swivel Mount HHS-12 0620054
HF Microphone HFM-8 0690016
Plug & Play HF Cigarette Lighter Charger PPH-1 0675182
Cigarette Lighter Charger LCH-8 0675231
Cigarette Lighter Charger LCH-9 0675120

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General Information PAMS Technical Documentation

Technical Specifications

General Specifications of Transceiver NPC-1

Parameter Unit

Cellular System TDMA800 + AMPS
RX frequency band 869.01... 893.97 MHz
TX frequency band 824.01... 848.97MHz
Output power -5...+28 dBm / 0.3 mW... 630mW
Number of RF channels 832
Channel spacing 30 kHz

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NPC-1 Series Transceivers

System Module

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NPC-1

System Module PAMS Technical Documentation

Table of Contents

Page No

System Module ...............................................................................................................1

Abbreviations................................................................................................................. 6

Transceiver NPC-1......................................................................................................... 8

Introduction ..................................................................................................................8

Operational Modes.................................................................................................... 9

Environmental Specifications ......................................................................................9

Normal and extreme voltages.................................................................................... 9

Temperature Conditions............................................................................................ 9

Engine Module............................................................................................................. 11

Baseband Module ......................................................................................................11

UEM ..........................................................................................................................11

Introduction to UEM............................................................................................... 11

Regulators................................................................................................................ 12

RF Interface............................................................................................................. 13

Charging Control..................................................................................................... 13

Digital Interface....................................................................................................... 13

Audio Codec............................................................................................................ 14

UI Drivers................................................................................................................ 14

IR interface.............................................................................................................. 14

AD Converters......................................................................................................... 14

UPP ............................................................................................................................14

Introduction............................................................................................................. 14

Blocks...................................................................................................................... 14

Flash Memory ............................................................................................................15

Introduction............................................................................................................. 15

User Interface Hardware .............................................................................................. 15

LCD ...........................................................................................................................15

Introduction............................................................................................................. 15

Interface................................................................................................................... 15

Keyboard ....................................................................................................................15

Introduction............................................................................................................. 15

Power Key............................................................................................................... 16

Keys......................................................................................................................... 16

Lights .........................................................................................................................16

Introduction............................................................................................................. 16

Interfaces................................................................................................................. 17

Technical Information............................................................................................. 17

Vibra ..........................................................................................................................17

Introduction............................................................................................................. 17

Interfaces................................................................................................................. 17

Audio HW.................................................................................................................... 18

Earpiece .....................................................................................................................18

Introduction............................................................................................................. 18

Microphone ................................................................................................................18

Introduction............................................................................................................. 18

Buzzer ........................................................................................................................18

Introduction............................................................................................................. 18

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Battery.......................................................................................................................... 18

Phone Battery .............................................................................................................18

Introduction............................................................................................................. 18

Interface................................................................................................................... 18

Battery Connector ......................................................................................................19

Accessories Interface ................................................................................................... 20

System connector .......................................................................................................20

Introduction............................................................................................................. 20

Interface................................................................................................................... 20

Technical Information............................................................................................. 21

PPH-1 Handsfree .......................................................................................................21

Introduction............................................................................................................. 21

Interface................................................................................................................... 22

IR module ..................................................................................................................22

Introduction............................................................................................................. 22

Interface................................................................................................................... 22

Technical Information............................................................................................. 22

Charger IF ..................................................................................................................22

Introduction............................................................................................................. 22

Interface................................................................................................................... 23

Test Interfaces.............................................................................................................. 23

Production Test Pattern ..............................................................................................23

Other Test Points .......................................................................................................23

EMC............................................................................................................................. 24

General .......................................................................................................................24

BB Component and Control IO Line Protection .......................................................24

Keyboard lines......................................................................................................... 24

C-Cover................................................................................................................... 24

PWB........................................................................................................................ 24

LCD......................................................................................................................... 25

Microphone ............................................................................................................. 25

EARP....................................................................................................................... 25

Buzzer...................................................................................................................... 25

IRDA....................................................................................................................... 25

System Connector Lines.......................................................................................... 25

Battery Connector Lines.......................................................................................... 25

MBUS and FBUS.................................................................................................... 25

Transceiver Interfaces.................................................................................................. 26

BB - RF Interface Connections .................................................................................26

BB Internal Connections ............................................................................................28

UEM Block Signal Description............................................................................... 28

UPP Block signals................................................................................................... 33

MEMORY Block Interfaces.................................................................................... 36

IR Block Interfaces.................................................................................................. 37

Audio Interfaces...................................................................................................... 37

Key/Display blocks................................................................................................. 39

Baseband External Connections.............................................................................. 40

Test Pattern for Production Tests............................................................................ 41

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RF Module ................................................................................................................... 42

Requirements .............................................................................................................42

Design ........................................................................................................................42

Software Compensations ...........................................................................................42

Main Technical Characteristics .................................................................................43

RF Frequency Plan.................................................................................................. 43

DC Characteristics .....................................................................................................43

Power Distribution Diagram ................................................................................... 43

Regulators................................................................................................................ 45

Receiver .....................................................................................................................45

AMPS/TDMA 800 MHz Front End........................................................................ 47

Frequency Synthesizers .............................................................................................48

Transmitter .................................................................................................................49

Common IF ............................................................................................................. 49

Cellular Band........................................................................................................... 49

Power Control ......................................................................................................... 49

Antenna Circuit....................................................................................................... 50

RF Performance....................................................................................................... 50

Antenna ........................................................................................................................50

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List of Figures

Page No

Fig 1 Interconnecting Diagram............................................................................................8

Fig 2 System Block Diagram (simple) ................................................................................11

Fig 3 Placement of keys.......................................................................................................16

Fig 4 Battery Connection Diagram......................................................................................19

Fig 5 BMC-2 Battery contacts (BMC-3, BLC-2 have same interface). ..............................19

Fig 6 System Connector.......................................................................................................20

Fig 7 Accessory Detection / External Audio .......................................................................21

Fig 8 4-wire, fully differential headset connector pin layout...............................................22

Fig 9 Top View of Production Test Pattern.........................................................................23

Fig 10 Test points Located Between UEM and UPP...........................................................24

Fig 11 RF Frequency Block Plan.........................................................................................43

Fig 12 Power distribution ....................................................................................................44

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Abbreviations

ACCH Analog Control Channel
A/D Analog to Digital conversion
AMPS Advanced Mobile Phone System
ANSI American National Standards Institute
ASIC Application Specific Integrated Circuit
AVCH Analog V oice Channel
BB Base Band
CSD Circuit Switched Data
CSP Chipped Scale Package. The same as uBGA.
CTIA Cellular Telecommunications Industry Association
D/A Digital to Analog conversion
DCCH Di gi tal Control Channel
DSP Digital Signal Processing
DTCH Digital Traffic Channel
EDMS El ectronic Data Management System
EFR Enhanced Full Rate (codec)
FCC Federal Communications Commission
IR Infrared
IrDA Infrared Data Association
IrMC Infrared Mobile Communications
IrOBEX IrDA Object Exchange Protocol
IS Interim Standard
ISA Intelligent Software Architecture
LED Light Emitting Diode
MCU Micro Control Unit / Master Control Unit
MO/MT Mobile Originated/Mobile Terminated (SMS)
OOR Out Of Range (mode)
OTA Over The Air (+ service like Programming etc.)
PC Personal Computer (PC Suite = PC program for phone memory function support)
PWB Printed Wired Board
PWM Pulse Width Modulation
RF Radio Frequency
SAR Specific Absorption Rate
SCF Software Component Factory
SMD Surface Mount Device
SMS Short Message Service
SPR Standard Product Requirement
TDD Text Device for the Deaf

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TDMA Time Division Multiple Access. Here: US digital cellular system.
TIA Telecommunications Industry Association
TTY Teletype
UEM Universal Energy Management, a Baseband ASIC.
UPP Universal Phone Processor, a Baseband ASIC.
VCTCXO Vol tage Controlled temperature Compensated Crystal Oscill ator
WAP Wireless Application Protocol (Browser)

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2

3

4

5

7

8

System Module PAMS Technical Documentation

Transceiver NPC-1

Introduction

The NPC-1 is a single band transceiver unit designed for TDMA800 networks. The trans­ceiver consists of the engine module (WS8) and the various assembly parts.

The transceiver has a full graphic display and the user interface is based o n a jack style
UI with two soft keys. An internal antenna is used in the phone, and there is no connec­tion to an external antenna. The transceiver also has a low leakage tolerant earpiece and
an omnidirectional microphone that provides excellent audio quality.

An integrated infrared (IR) link provides connec tion between two NPC-1 transcei vers or
between a transceiver and a PC (internal da ta), or a transceiver and a printer.

Figure 1: Interconnect ing Diagram

TRANSCEIVER

ANT

EXT

RF

Ostrich

LCD DRIVER

B & W

display

BACKLIGHT

BACKLIGHT

✉

RF

☎

6
9

0#

ENGINE

BB

USER INTERFACE

EARPIECE

AUDIO

(discr)

BUZZER

VIBRA

RTC
BACK-UP

BSI

BTemp

MIC

Ext. Aud io
Accessories

BATTER Y

JTAG

Prod.TEST I/F

INF R A R E D

Module

CHARGER

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Operational Modes

Below is a list of the phone’s different ope rational modes:

1 Power Off mode
2 Normal Mode (include various Active and Idle states):

• Analog Modes (800 MHz only):

•Analog Control Channel, ACCH

•Analog Voice Channel, AVCH

• Digital Modes (800 MHz):

•Control Channel, DCCH

•Digital Voice Channel, S-DTCH

•Digital Data Channel, D-DTCH
3 Sleep and OOR modes (both Analog and Digital)
4Local mode
5 Test mode

Environmental Specifications

Normal and extreme voltages

Voltage range:

• nominal battery voltage: 3.6 V

• maximum battery voltage: 5.0 V

• minimum battery voltage: 3.1 V

Temperature Conditions

Temperature range:

• ambient temperature: -30 - + 60 ×C

• PWB temperature: -30 - +85 ×C

• storage temperature range: -40 - + 85 ×C

All of the EIA/TIA-136-270A requirements are not exactly specified over the temperature

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range. For example, the RX sensitivity requirement is 3dB lower over the –30 - +60 °C
range.

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A

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PAMS Technical Documentation System Module

Engine Module

Baseband Module

The core part of the transceiver’s baseband (figure 1) consists of 2 ASICs, the UEM and
UPP, and flash memory. The following sections illustrate and explain these parts in detail.

Figure 2: System Block Diagram (simple)

PA suppl

SAFARI

RFIC CTRL

RFCLK

19.44MHz

UPP

MEMADDA
MEMCON

FLASH

RF Supplies

RF RX/T

PURX

RF RX/T

SLEEPCLOCK

32kHz

CBUS/DBUS

UDIO

BB Supplies

KLIGHT/ DLIGH

PWR ON

BASEBAND

UEM

EXTERNAL AUDIO

CHARGER CONNECTION

IR

EAR

MIC

BUZZER

IBR

BATTERY

System Connector

UEM

Introduction to UEM

UEM is the Universal Energy Management IC for digital hand portable phones. In addi­tion to energy management, it performs all the base band’s mixed-signal functions.

Most UEM pins have 2kV ESD protection, and those signals considered to be more easily
exposed to ESD, have 8kV protection within the UEM. These kinds of signals are (1) all
audio signals, (2) headset signals, (3) BSI, (4) Btemp, (5) Fbus and (6) Mbus signals.

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Regulators

The UEM has six regulators for baseband power supplies and seven regulators for RF
power supplies. The VR1 regulator has two outputs: (1) VR1a and (2) VR1b. In addition to
these, there are two current generators - IPA1 and IPA2 - for biasing purposes.

A bypass capacitor (1uF) is required for each regulator output to ensure stability.
Reference voltages for regulat ors require exter nal 1uF capacitors. Vref25RF is the refer-

ence voltage for the VR2 regulator, Vref25BB is the reference voltage for the VANA,
VFLASH1, VFLASH2, VR1 regulators, Vref278 is the re ference voltage for the VR3, VR4,
VR5, VR6, VR7 regulators, and VrefRF01 is the reference voltage for the VIO, VCORE reg­ulators and for the radio frequency (RF).

Table 1: UEM Regulators

BB RF Current

VANA: 2.78Vtyp 80mAmax VR1a:4.75V 10mAmax

VR1b:4.75V
Vflash1: 2.78Vtyp 70mAmax IPA2: 0-5mA
Vflash2: 2.78Vtyp

40mAmax
VSim: 1.8/3.0V 25mAmax VR3:2.7 8V 20m A
VIO: 1.8Vtyp

150mAmax
Vcore: 1.0-1.8V

200mAmax

VR2:2.78V 100mAmax

VR4: 2.78V 50mAmax

VR5: 2.78V 50mAmax

VR6: 2.78V 50mAmax
VR7: 2.78V 45mAmax

IPA1: 0-5mA

The VANA regulator supplies the baseband’s (BB) internal and ex ternal analog circuitry.
It is disabled in the Sleep mode.

The Vflash1 regulator supplie s the LCD, the IR-module and the digital parts of th e UEM
and Safari asic. It is enabled during startup an d goes into the low Iq-mode when in the
Sleep mode.

The VIO regulator supplies both the external and internal l ogic circuitries. It is used by
the LCD, flash, bluetooth and UPP. The regulator goes into the low Iq-mode when in the
Sleep mode.

The VCORE regulator supplies the D SP and the core part of the U PP. The voltage is pro­grammable and the startup default is 1.5V. The regulator goes into the low Iq-mode
when in the Sleep mode.

The VSIM regulator supplies the SIM card. NOT USED IN NPC-1.

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The VR1 regulator uses two LDO s and a charge pump. The charge pump requires one
external 1uF capacitor in the Vpump pin and a 220nF flying capacitor between the CCP
and CCN pins. In practice, the 220nF flying capacitor is f ormed by 2 x 100nF capacitors
that are parallel to each other. The VR1 regulator is used by the Safari RF ASIC.

The VR2 regulator is used to supply the (1) external RF parts, (2) lower band up con­verter, (3) TX power detector module and (4) Safari. In light load situatio ns, the VR2 reg­ulator can be set to the low Iq-mode.

The VR3 regulator supplies the VCTCXO and Safari in the RF. It is always enabled when
the UEM is active. When the UEM is in the Sleep mode, the VR3 is disabled.

The VR4 regulator supplies the RX frontends (LNA and RX mixers).
The VR5 regulator supplies the lower band PA. In light load situations, the VR5 regulator

can be set to the low Iq-mode.
The VR6 regulator supplies the higher band PA and TX amplifier. In light load situations,

the VR6 regulator can be set to the low Iq-mode.
The VR7 regulator supplies the VCO and Safari. In light load situations, the VR7 regulator

can be set to the low Iq-mode.
The IPA1 and IPA2 are programmable current gener ators. A 27kW/1%/100ppm external

resistor is used to improve the accuracy of the output current. The IPA1 is used by the
lower PA band and IPA2 is used by the higher PA band.

RF Interface

The interface between the baseband and the RF section is also handled by the UEM. It
provides A/D and D/A conversion of the in-pha se and quadrature receive and transmit
signal paths. It also provides A/D and D/ A conve rsions of receiv ed and transmitte d audio
signals to and from the UI section. The UEM supplies the analog AFC signal to the RF sec­tion, according to the UPP DSP digital control.

Charging Control

The CHACON block of the UEM asics controls charging. The needed functions for the
charging controls are the (1) pwm-controlled battery charging switch, (2) charger-moni­toring circuitry, (3) battery voltage monitori ng circuitry and (4) RTC supply circuitry for
backup battery charging (Not used in NPC-1). In addition to these, external component s
are needed for EMC protection of the charger input to the baseband module.

Digital Interface

Data transmission between the U EM and the UPP is impleme nted using two seri al con­nections, DBUS (programmable clock) for DSP and CBUS (1.0MHz GSM and 1.08MHz
TDMA) for MCU. The UEM is a dual voltage circuit: the digital parts are run from 1.8V
and the analog parts are run from 2.78V. The Vbat (3,6V) voltage regulators's input is
also used.

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Audio Codec

The baseband supports two external microphone input ar eas and one external ea rphone
output. The input can be taken from an internal microphone, a headset microphone or
from an external microphone signal source through a headset connector. The output for
the internal earpiece is a dual-ended type output, and the dif ferential output is capable
of driving 4Vpp to the earpiece with a 60 dB minimum signal as the total distortion ratio.
The input and output signal source se lection and gain control is performed inside the
UEM Asic, according to the c ontrol messages from the UPP. A buzzer a nd an external
vibra alert control signal are gener ated by the UEM with separate PWM outputs.

UI Drivers

There is a single output driver for the buzzer, vibra, display and keyboard l eds an d the IR
in the side of the UEM. These generate PWM square wave for the various devices.

IR interface

The IR interface is designed and implemented into th e UEM. The low frequency mode of
the IR module covers speeds up to 115.2 kbit/s. The device (Vis hay) transceivers integrate
a sensitive receiver and a built-in power driver. The combination of a thin, long resistive
and inductive wiring should be avoided. The input (Txd, SD/M ode) and the output Rxd
should be directly coupled to the I/O circuit. The VBAT regulator supplies the power to
transmit the led and serial resistor limits’ current. Upon rece ivi ng infra red data to IR led,
it goes straight to the UEM via the RXD line . The Vflash1 is the power supply f or the IR
module, except for transmission.The IR module has one control pin to control the shut
down. The control lever shifter is used to change the proper voltage for shutdown to the
IR module from the UPP.

AD Converters

The UEM is equipped with a 11-channel analog to digital converter. Some AD converter
channels (LS, KEYB1-2) are not used in NPC-1. The AD converters are calibrated in the
production line.

UPP

Introduction

NPC-1 uses the UPPv4M ASIC. The RAM size is 4M. The processor architecture consists of
both the DSP and the MCU processors.

Blocks

The UPP is internally partitioned into two main parts: (1) the Brain and (2) the Body.

1 The Processor and Memory System (that is, the Processor cores, Mega-cells,

internal memories, perip herals and external memory inter face) is known as the
Brain.

The Brain consists of the following blocks: (1) the DSP Subsystem (DSPSS), (2) the
MCU Subsystem (MCUSS), (3) the emulation control EMUCtl, (4) the program/
data RAM PDRAM and (5) the Brain Peripherals–subsystem (BrainPer).

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2 The NMP custom cellular logic functions are known as the Body.

The Body contains interfaces and functions needed fo r interfacing other base­band and RF parts. The body consists of, fo r example, the following sub-blocks:
(1) MFI, (2) SCU, (3) CTSI , (4) RxModem, ( 5) Acc IF, (6) UIF, (7) C oder, (8) BodyIF, (9)
PUP.

Flash Memory

Introduction

The NPC-1 transceiver uses a 32 Mbit f lash as its external memory. The VIO regulator is
used as a power supply for normal in-system op eration. An accelerated program/erase
operation can be obtained by supplying Vpp of 12 volt to the flash device.

The device has two read modes: asynchronous and burst. The Burst read mode is utilized
in NPC-1, except for the start-up, when the asynchronous read mode is used for a short
time.

User Interface Hardware

LCD

Introduction

NPC-1 uses a black & white GD46 84x48 full dot matrix graphical display. There are two
suppliers for this LCD: Seiko Epson and P hilips. The LCD module includes the LCD glass,
the LCD COG-driver, an elastomer connector and a metal frame. The LCD module is
included in the lightguide assembly module.

Interface

The LCD is controlled by the UI SW and the control signals are from the UPP asic. The VIO
and Vflash1 regulators supply the LCD with power.

The LCD has an internal voltage booster and a booster capacitor is required between
Vout and GND.

Pin 3 (Vss9) is the LCD driver’s ground and Pin 9 (GND) is used to ground the metal
frame.

Keyboard

Introduction

The NPC-1 keyboar d styl e fol lows the Nokia Jack style , withou t side keys for vol ume co n­trol. The PWR key is integrated so that it is part of the IR window an d located on top of
the phone.

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NPC-1

System Module PAMS Technical Documentation

Figure 3: Placement of keys.

Power Key

All signals for the keyboard come from the UPP asic, except PWRONX line for the power
key signal which is connect ed dir ectly to t he U EM. The pr essing o f the PWR k ey gro und s
the PWRONX line and the UEM generate s an inter rupt to U OO, which is then re cognized
as a PWR key press.

Keys

Other keys are detected so that w hen a key is pressed down, the metal dome connects
one S-line and one R-line of the UPP to the GND and creat es an interrupt for the SW.
This kind of detection is also known as metaldome detection. The matrix of how lines are
connected and which lines are used for differen t keys is described in the Table 1. The S­line S0 and R-line R5 are not used at all.

Table 2: Matrix of Key Detection Lines

S0 S1 S2 S3 S4

Returns /

Scans

R0 NC NC Send End NC
R1 NC Soft left Up Down Soft right
R2 NC 1 4 7 *
R3 NC 2 5 8 0
R4 NC 3 6 9 #
R5 NC NC NC NC NC

where NC = Not Connected

Lights

Introduction

NPC-1 has 10 LEDs for lighting purposes. Six of them are for the keyboard and four for
the display. The LED type is Osram LGM470, green light emitting and SMD through hole
mounted.

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PAMS Technical Documentation System Module

Interfaces

The display lights are controlled by a Dlight signal from the UEM. The Dlight output is the
PWM signal, which is used to control the average current going through the LEDs. When
the battery voltage changes, the new PWM v alue is written onto the PWM register. In
this way, the brightness of the lights remains the same with all battery voltages within
range. The frequency of the signal is fixed at 128Hz.

The keyboard lights are controlled by the Klight signal from the UEM. The Klight output is
also a PWM signal and is used in the same way as Dlight.

Technical Information

Each LED requires a hole in t he PWB, in which the body of the LED locates in hole and
terminals are soldered on the component side of the module PWB. The LEDs have a white
plastic body around the diode, and this directs the emitted light better to the UI-side.
The current for the LCD lights is limited by the resistor between the Vbatt and LEDs. For
the keyboard lights there are resistors in parallel.

Vibra

Introduction

The vibra is located on the D-cover and is connected by spring connectors on the bottom
left-hand side of the engine. The vibra motor is supplied by Namiki.

Interfaces

The vibra is controlled by the PWM signal VIBRA from the UEM. With this signal, it is
possible to control both the frequency and pulse width of the signal. The pulse widt h is
used to control the current when the bat tery vol tage changes. Wit h the freque ncy con­trol, it is possible to search for the optimum frequency to have silent and efficient vibrat­ing.

Table 3: Electrical Parameters

Parameter Requirement Unit

Rated DC Voltage 1.3 V

Rated speed

Rated current

9500 ±3000

115 ±20

rpm

mA

Starting current

Armature resist ant 8.6 ohm

Rated DC voltage being able to use 1.2 to 1.7 V

Starting DC voltage min. 1.2 V

150 ±20

mA

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System Module PAMS Technical Documentation

Audio HW

Earpiece

Introduction

The Philips Speaker System 13mm speaker capsule is used in NPC-1.
The speaker is a dynamic one. It is very sensitive and capable of producing relatively high

sound pressure also at low frequencies. The speaker capsule and the mechanics around it
together make the earpiece.

Microphone

Introduction

The microphone is an electret microphone with an omnidirec tional polar pattern. It con­sists of an electrically polarized membrane and a metal electrode which form a capacitor.
Air pressure changes (for example, sound) moves the membrane, which causes voltage
changes across the capacitor. Because the capacitance is t ypically 2 pF, a FET buffer is
needed inside the microphone capsule for the signal generated by the capacitor. Because
of the FET, the microphone needs a bias voltage.

The microphone manufacturers for the NPC-1 transceiver are Matsushita and Hosi den.

Buzzer

Introduction

The operating principle of the buzzer is magnetic. The diaphragm of the buzzer is made
of magnetic material and it is located in a magnetic f ield created by a perm anent mag­net. The winding is not attached to the diaphragm, as is the case with the speaker. The
winding is located in the magnetic circuit so tha t it can alter the magnetic field o f the
permanent magnet, thus changing the magnetic force affecting the diaphragm. The
buzzer's useful frequency range is approximately from 2 kHz to 5kHz.

The Buzzer manufacturer for the NPC-1 transceiver is Star.

Battery

Phone Battery

Introduction

The BMC-2 battery (Ni-MH 640mAh) is be used in the NPC-1 transceiver by default. It is
also possible to use the BMC-3 (Ni-MH 900mAh) and BLC-2 (Li-ion 850mA) batteries.

Interface

The battery block contains NTC and BSI resistors for tempe rature measur emen t and bat­tery identification. The BSI fixed resistor value indicates the chemistry and default

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UEM

Ni-MH

VBATT

GND

BTEMP

Battery

1 (+)

2(BSI)

3(BTEMP)

4(GND)

PAMS Technical Documentation System Module

capacity of a battery. The NTC-resistor measures the battery temperature. Temperature
and capacity information is needed for charge control. These resistors are connected to
BSI and BTEMP pins of the battery connector. The phone has pull-up resistors for these
lines so that they can be re ad by A/D inputs in the phone (see the figure below). Serial
resistors in the BSI and BTEMP lines are f or ESD protection. Both lines also have spark
caps to prevent ESD.

Figure 4: Battery Connection Di agram

C220
1n

C217
1n

R202/1
100k

R205/1
10k

R205/2
10k

VFLASH1VANA VBAT

R202/4
100k

C100
10p

connector

BSI

OVERCHARGE/
OVERDISCHARGE

PROTECTION

The batteries have a specific red line, which indicates if the battery has been subjected to
excess humidity. The batteries are delivered in the protection mode, which gives longer
storage time. The voltage seen in the outer terminals is zero (or floating), and the battery
is activated by connecting the charge r. The battery has internal protection for overvolt­age and overcurrent.

Figure 5: BMC-2 Battery contacts (BMC-3, BLC-2 have same interface).

Battery Connector

NPC-1 uses the spring type battery connector. This makes the phone easier to assemble

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PWMOUT(GND)

System Module PAMS Technical Documentation

in production and the connection between the battery and the PWB is more reliable. The
battery connector is manufactured by Molex.

Table 4: Battery Connector Interface

# Signal

name

1 VBAT (+)

2 BSI BSI

3 BTEMP BTEMP

4 GND GND GND GND

Connected from - to Batt.

(batt.)

(batt.)

(batt.)

VBAT I/O Vbat 3.0-5.1V Battery

UEM Out Ana Battery size

UEM Out Ana 40mA/

Accessories Interface

System connector

Introduction

NPC-1 uses accessories via a system connector.

I/O

Signal properties

A/D--levels--freq./timing

Gns

Switch

400mA

Description /

Notes

voltage

indicator

Battery

temperature

indicator

Ground

Interface

The interface is supported by fully differential 4-wire (XMICN, XMICP, XEARN and
XEARP) accessories. NPC-1 supports the HDC-5 headset, LPS-3 loopset and the PPH-1
car kit.

Figure 6: System Connector

GND

VIN

XMICN

XEARN

MICP

XMICP
XEARP

HEADINT

MICN

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MicGnd

PAMS Technical Documentation System Module

An accessory is de tecte d by t he Head Int-lin e, whi ch is connect ed to the XEARP inside the
system connector. When an accessory is connected, it disconnects XEARP from HEADINT,
and the UEM detects it and generates an interrupt ( UEMINT) to the MC U. After that, the
HOOKINT line is used to determine which accessory is connected. This is done by the
voltage divider, which consists of the phone's internal pull-up and accessory-specific
pull-down. The voltage generated by this divider is then read by the ad- converter of
UEM. The HOOKINT- interrupt is generated by the button in the headset or by the acces­sory external audio input.

Figure 7: Accessory Detection / External Audio

2.7V

Hookint

/MBUS

EAD

HeadintHeadint

MIC1&3 Bias

MIC1P
MIC1N

HF

HFCM

3...25k

UEM

Technical Information

ESD protection is made up by (1) spark caps, (2) a buried capacitor (Z152 and Z154-157)
and (3) ±8kV inside the UEM. The RF and BB noises are prevented by inductors.

PPH-1 Handsfree

Introduction

2.1V

33N

0.8V

33N

1k2

1.8V

0.3V

1k2

The PPH-1 handsfree device

• provides the charging and handsfree functionality

• has a built-in speaker

• and uses a phone microphone, but also has a connector for t he HFM-8 optional
external microphone (using HFM-8 mutes phone microphone)

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System Module PAMS Technical Documentation

Interface

A 4-wire interface is implemented with 2.5mm diame ter round plug/jack which is other­wise like a so-called standard stereo plug, but th e innermost contact is split into two.

Figure 8: 4-wire, fully differential headset connector pi n layo ut

2. XEAR N

4. XEAR P

5. H EADINT

3. XM IC P

1. XM IC N

IR module

Introduction

The IR module integrates a sensitive receiver and a built-in power driver complaint to the
IrDA 1.2 standard. The IR module is located at the top of the engine side, next to the
Power switch.

The IR module manufacturer for the NPC-1 transcei ver is Vishay.

Interface

The Vflash1 regulator supplies the IR module, except for the transmit LED. The transmit
LED is supplied by the VBAT regulator and the maximum current is limited by a se rial
resistor. The bypass capacitor is needed in the VBAT line for proper voltage. TXD and RXD
lines are connected to the UEM and shutdown is controlled by the UPP (GENIO(10))
through a level-shifter V350.

Technical Information

The IR interface is located in the UEM. The IR link supports speeds fr om 9600 bit/s to

1.152 MBit/s, up to 1m.

Charger IF

Introduction

The charger connection is implemente d through the system connector. The system con­nector supports charging with both plug chargers and desktop stand chargers.

There are three signals for charging. The cha rger GND pin is used for both desktop and
plug chargers as well as for charger voltage. The PWM cont rol line, which is needed for

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FBUS_TX

PAMS Technical Documentation System Module

3-wire chargers, is connected directly to the GND in the PWB module, so the NPC-1
engine does not provide any PWM control for chargers. Charging controlling is done
inside the UEM by switching the UEM’s intern al charger switch on and off.

Interface

The fuse F100 protects the phone from too high currents, for example, when broken or
pirate chargers are used. L100 protects the engine from RF noises, which may occur in
the charging cable. V100 protects the UEM ASIC from reverse polarity charging voltage
and from too high charging voltages. C106 is also used for ESD and EMC protection.
Spark gaps right after the charger plug are used for ESD protection.

Test Interfaces

Production Test Pattern

The interface for NPC-1 production testing is a 5pin pad layout in the BB area (see the
figure below). The production tester conne cts to these pads by using spring connectors.
The interface includes the MBUS, FBUSRX, FBUSTX, VPP and GND signals. The pad size i s

1.7mm. The same pads are used also for AS test e quipment, such as the module jig and
the service cable.

Other Test Points

As BB asics and flash memory are CSP components, the visibility of BB signals is very
poor. This makes the measuring of most of the BB signals impossible. In order to debug
the BB, at least to some level, the most important signals can be accessed from the

0.6mm test points. The figure below shows the test points located between the UEM and
the UPP. There is an opening in the baseband shield to provide access to these pads.

Figure 9: Top View of Production Test Pattern

2.

3. FBUS_RX

7.

MBUS

8.

G ND

6.

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X

System Module PAMS Technical Documentation

Figure 10: Test points Located Between UEM and UPP

UE M (D 200)

J414

EMC

General

The EMC performance of NPC-1’s baseband is improve d by using a shield to cover the
main components of the BB, such as the UEM, UPP and Flash. The UEM has internal pro­tection against a ±8kV ESD pulse. The BB-shield is soldered to the PWB and it also
increases the rigidity of the PWB in the BB area, thus improving the phone’s reliability.
The shield also improves the thermal dissipation by spreading the heat more widely.

DBUSCLKDBUSDA

J403

J413

J402

PURXSLEEPX

SLEEPCLK

J404

J405

UEMINT

CBUSDA

J407

J415

DBUSEN1X

UPP (D400)

CBUSENX

J408

J412

FBUS RX

CBUSCLK

J406

J409

MBUSTX MBUSR

FBUS TX

J411

J410

The BB and RF shield are connected together on the PWB and the protective metal deck
underneath the battery is grounded to RF shield.

BB Component and Control IO Line Protection

Keyboard lines

ESD protection for keyboard signals is implemented by using metaldome detection.
Grounded keydomes are very eff ective for ESD protectio n and do not require additional
components for ESD protection. The distance from the A-cover to the PWB is made
longer using spikes in the key mat. The C-cover metalliza tion also protects th e keyboard
lines.

C-Cover

The C-cover on the UI-side is metallized on the inne r sur face (partl y) and is gro unded to
the GND module. All areas in which the plated C-cover touches the PWB surface are
grounded and the solder masks are opened.

PWB

All edges are grounded on both sides of the PWB and the solder mask is opened in these
areas. The aim is that any ESD pulse faces the ground area when enter ing the phone, for
example, between the mechanics covers.

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All holes in the PWB are grounded and plated through holes. The only exception i s the
LED holes, which cannot be grounded.

LCD

ESD protection for LCD is implemented by connecting the metal fr ame of the LCD into
ground. The connection is only on one side, at the top of the LCD, which is not the best
solution. The software takes care of the LCD's crashing in case of an ESD pulse.

Microphone

The microphone’s metal cover is connected to the GND and ther e are spark gaps on the
PWB. The microphone is an asymmetrical circuit, which makes it w ell protected against
EMC.

EARP

The EARP is protected with C-cover metallization and with a plastic-fronted earpiece.

Buzzer

PWB openings with the C-cover metallization protect the buzzer from ESD.

IRDA

PWB openings with C-cover metallization protect IRDA lines fr om ESD.

System Connector Lines

Table 5: System Connector lines

System Connector signals that have EMC protection
Protection type VIN XMIXP XMICN XEARP XEARN HEADINT MICP
ferrite bead (600

/199MHz)
ferrite bead (420

/100MHz)
spark gaps XXXXXX
PWB capacitors XXXXXX
RC-circuit X X X X X
capacitor to

ground

X

XXXXX

XXXX X

Battery Connector Lines

BSI and BTEMP lines are protected by spark gaps and the RC-circuit (10k & 1n), in which
the resistors are size 0603.

MBUS and FBUS

The opening in the protective met al deck, underneath the battery, is so small that ESD
does not get into the MBUS and FBUS lines in the producti on test pattern.

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Transceiver Interfaces

The tables in the following sections illustrate the signals between the various transceiver
blocks.

BB - RF Interface Connections

All the signal descriptions and prope rt ies in th e following table s ar e valid only f or act ive
signals, and the signals are not necessarily present all the time .

Table 6: BB - RF Interface Signal Description

RIP Signal name Connected

from - to

RFICCNTRL(2:0) RF IC Control Bus from UPP to RF IC (SAFARI)

0 RFBUSCLK UPP RFIC In Dig 0/1.8V

1 RFBUSDA UPP/

RFIC

2 RFBUSEN1X UPP RFIC In Dig RFIC Chip Set X

PUL (2:0) Power Up Reset from UEM to RF IC (SAFARI)

0 PURX UEM RFIC Out Dig 0/1.8V 10us Power Up Reset for RFIC

GEN (28.0) General I/= Bus connected to RF, see also separate col lective GEN(28.0)

5TXP1 RFIC,

Lo­band
mixer

6 TXP2 R FIC UPP Out Dig 0/1.8V High band Tx enabled

RFIC
UPP

UPP Out Dig 0/1.8V 10 us Low Band Tx enabled

BB I/O Signal Properties

A/D Levels-F re q. /
Timing resolut ion

9.72
(0: <0.4V
1: >1.4V

I/O Dig Bi-directional RF Control serial

table
Control lines from UPP G E NIOs to RF

MHz

Description / Notes

RF Control serial bus bit clock

bus data.

SLCLK & SLEEPX not used in RF

RFCLK (not BUS -> no rip #) System Clock from RF to BB, original source VCTCXO, buffered (and fre-

quency shifted, WAM only) in RF IC (SAFARI)

RFCLK VCTCX

O ->
RFIC

RFClk
GND

SLOWAD(6:0) Slow Speed ADC Lines from RF block

5PDMID RF

RF UPP In Ana 0 System Clock slicer Ref GND, not

Power
detec­tion
module

UPP In ANA 800mVpp typ

(FET probed)
Bias DC

blocked at
UPP input

UEM In Ana 0/2.7V dig 0/VR2 Power detection module identifi-

19.44

MHz

System Clk from RF to BB

separated from pwb GND layer

cation to slow ADC (ch 5, previ­ous VCTCXO Temp) signal to
UEM

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Table 6: BB - RF Interface Signal Description

RIP Signal name Connected

from - to

6PATEMP RF

Power
detec­tion
module

RFCONV(9:0) RF-BB differential Anal og Signals: Tx I&Q, Rx I&Q and reference volt-

0 RXIP RFIC UEM In Ana 1.4Vpp max.
1RXIN
2 RXQP Diff. positive/negative quadra­3RXQN
4 TXIP UEM RFIC Out Ana 2.2Vpp max.
5TXIN
6 TXQP Diff. positive/negative quadra­7TXQN
9 VREFRFO1 UEM RFIC Out Vref 1.35 V RF IC Reference voltage from

UEM In Ana 0.1-2.7V - Tx PA T emperature to UEM, NTC

BB I/O Signal Properties

A/D Levels-F re q. /
Timing resolut ion

ages

diff. 0.5Vpp
typ bias

1.30V

diff. 0.6Vpp
typ bias

1.30V

Description / Notes

in Power Detection Module

Differential positive/negative in­phase Rx Signal

ture phase Rx Signal

Differential positive/negative in­phase Tx Signal

ture phase Tx Signal

UEM

RFAUXCON(2:9) RF-BB Analog Control Signals to/from UEM

1 TXPWRDET TXP

Det.

2AFC UEMVCTCXOOut Ana 0.1-2.4V Automatic Freq uency Cont rol for

VRF Globals instead of Bus Regulated RF Supply Voltages from UEM to RF. Current values are of the

VR1 A UEM RFIC Out Vreg 4.75 V

VR1 B UEM RFIC Out Vreg 4.75 V

VR2 UEM RFDiscr

VR3 UEM VCTCXOOut Vreg 2.78 V

VR4 U EM RFIC Out Vreg 2.78 V

UEM In Ana 0.1-2.4V 50 us Tx PW R D etector Signal to UEM

VCTCXO

regulator specifications, not the measured values of RF

./RFIC

+- 3%

+- 3%

Out Vreg 2.78 V

+- 3%

+- 3%

+- 3%

10mA
max.

10mA
max.

100
mA
max.

20mA
max.

50mA
max.

UEM, charge pump + linear reg­ulator output. Supply for UHF
synth phase det...

UEM, charge pump + linear reg­ulator output. Supply for Tx VHF
VCO.

UEM linear regulator. Supply
voltage for Tx IQ filter and IQ to
Tx IF mixer.

UEM linear regulator. P ower sup­ply to VCTCXO + RFCLK Buffer in
RF IC.

UEM linear regulator. P ower sup­ply for LNA/RFIC Rx chain.

VR5 U EM RFIC Out Vreg 2.78 V

+- 3%

50mA
max.

UEM linear regulator. P ower sup­ply for RF low band PA driver
section.

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Table 6: BB - RF Interface Signal Description

RIP Signal name Connected

from - to

VR6 U EM RFIC Out Vreg 2.78 V

VR7 UEM RFIC,

UHF
VCO

IPA1 UEM RF PA Out Iout 0-5 mA Settable Bias current for RF PA

IPA2 UEM RF PA Out Iout 0-5 mA Settable Bias current for RF PA

VFLASH1 UEM RFIC Out Iout 2.78V 12mA UEM linear regulator common

VBATT, Global

VBATTRF Batt

Conn

RFPA Out Vbatt3...5V 0...1A

BB I/O Signal Properties

A/D Levels-F re q. /
Timing resolut ion

+- 3%

Out Vreg 2.78 V

+- 3%

Description / Notes

50mA
max.

45mA UEM linear regulator. Power sup-

2A
peak

UEM linear regulator. P ower sup­ply for RF high band PA driver
section.

ply for RF Synthes.

L-Band

H-Band

for BB. RFIC digital parts and F
to BB digl. IF.

Raw Vbatt for RF PA

BB Internal Connections

UEM Block Signal Description

Table 7: UEM Block Signals to UPP

RIP Signal name Connected

from - to

RFCONVDA(5:0)* 1.8V digital interface between UPP and UEM. R F conv erter CLK. Rx and Tx

0RFCONVCLKUPP UEMInDig0/1.8V 4.86

1 RXID UEM UPP Out (PDM) RxI Data
2RXQD
3 TXID UPP UEM In (PDM) TxI Data
4TXQD
5 AUXDA UPP U EM In Auxiliary DAC Data

RFCONVCTRL(2:0)* 1.8V digital interface be tween UP P (DSP ) and UEM. RF c onverte r UEM RF

UEM I/O Signal Properties

A/D Levels-Freq./
Timing resolution

I&Q data (bit stream signals).

MHz/ Digi

3.24 MHz
/ Ana

IF bidirectional serial Control Bus, “DBUS”.

Description / Notes

RF Converter Clock

(PDM) RxQ Data

(PDM) TxQ Data

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PAMS Technical Documentation System Module

RIP Signal name Connected

from - to

0DBUSCLK UPP UEMInDig0/1.8V 9.72MHz Clock for Fast Control to UEM
1DBUSDA In/

2 DBUSENX In Fast Control Data Load / Enable

AUDUEMCTRL(3.0)* 1.8V digi tal interfac e betwee n UP P (M CU) and UEM . Bid ire ctio nal Contro l

0 UEMINT UEM UPP Out Dig 0/1.8V UEM Interrupt
1 CBUSCLK UPP UEM In 1.08MHz Clock for control/Audio Con-

2CBUSDA In/

3 CBUSENX In Control Data Load Signal

AUDIODA T A(1:0)* 1.8V digital au dio interfac e between UPP and UEM audio co dec. PDM data

0 EARDATA UPP UEM In Dig 0/1.8V 1.08Mbit/sPDM Data for Downlink Audio,

UEM I/O Signal Properties

A/D Levels-Freq./
Timing resolution

Out

Bus “CBUS”

Out

clocked by CBUSCLK

Description / Notes

Fast Control Data to/from UEM

to UEM

vertors in UEM

1.08Mbit/sControl data

clocked by CBUSCLK

1 MICDATA UEM UPP Out PDM Data forUplink Audio,

clocked bu CBUSCLK

PUSL(2:0)* P ower-Up & Sleep Control lines

0 PURX UEM UPP

RFIC

1 SLEEPX UPP UEM In Power Save Functions, 0 at

2 SLEEPCLK UEM UPP Out 32 KHz 32 KHz Sleep Clock

IACCDIF(5:0)* BB Internal 1.8V Digital Accessory Buses between UPP and 2.7V level

0IRTX

IRRX

1
2MBUSTX

MBUSRX

3
4FBUSTXI

FBUSRXI

5

UPP
UEM

UPP
UEM

UPP
UEM

UEM
UPP

UEM
UPP

UEM
UPP

Out Dig 0/1.8V Power Up Reset, 0 at reset

sleep

shifter UEM

OutInDig 0/1.8V 1.152

Mbit/s
max

In

Dig 0/1.8V 9k6 b/s

Out

In

Dig 0/1.8 V <115kb/s

Out

9k6 b/s
< 7 Mb/s

<1Mb/s
<115kb/s
<7Mb/s

Infrared Transmit
Infrared Receive

MBUS Transmit
MBUS Receive / FDL Clk

FBUS Transmit / FDL Tx
FBUS Receive / FDL Rx

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Table 8: UEM Block Signals to BB and RF

RIP Signal name Connected

from - to

SLOWAD(6:0)* SLow Speed ADC Lines, UEM extern al

0BSI BAT­1BTEMP
5PDMid RF

6PATEMP RF,

RFCONV(9:0)* RF - BB Analog Signals: Tx I&Q, Rx I&Q and ref

0 RXIP RFIC UEM In Ana 1.4Vpp max
1RXIN
2 RXQP Diff. positive/negative quadra­3RXQN
4 TXIP UEM RFIC Out Ana 2.2Vpp max
5TXIN
6 TXQP Differential positive/negative
7TXQN

TERY

PDMod

PDMod
NTC

UEM In Ana 0-2.7V Battery Size Indicator/FDL init

UEM In Ana 0-2.7V Power detect i on module identi-

UEM I/O Signal Properties

A/D Levels-Freq./
Timing resolution

diff.

0.5Vpp typ
bias 1.30V

diff.

0.6VppTyp
Bias 1.30V

Description / Notes

Battery Temperature

fication to slow ADC (ch, previ­ous VCTCXO Temp) signal to
UEM.

Differential positive/negative
in-phase Rx Signal

ture phase Rx Signal

Differential positive/negative
in-phase Tx Signal

quadrature phase Tx Signal

9 VREFRFO1 UEM RFIC Out Vref 1.35V RF IC Reference voltage from

UEM

HP INTERNAL AUDIO
AUDIO(4:0) HP Internal analog ear & microph one IF between UEM and Mic/Ear circuitry

0 EARP UEM Ear­1EARN

2 MIC1N Mic UEM In Ana 100mVpp
3MIC1P
4MICB1 Mic UEMOutV

EXTERNAL AUDIO INTERFACE
XAUDIO(9:0)* External Au dio IF between UEM and X-audio circuitry

0 HEADINT SysCon

/HSet

1 HF UEM SysCon

2 HFCM Ana 0.8 Vdc

piece

UEM In Dig 0/2.7V Input for Headset Connector

/HSet

Out Ana 1.25V Audio Differential s i g nal t o HP inter-

nal Earpiece.
Load resistance 32 ohm.

Audio Differential signal from HP

max diff.

2.1V typ./

bias

<600 uA

Out Ana 1.0Vpp

bias 0.8V

DC Bias Bias voltage for internal MIC

Audio External Earpiece Audio Signal

internal MIC, 2mV nominal

HeadInt Switch

Reference output for DC cou­pled external Earpiece

Page 30 ãNokia Corporation Issue 1 10/01

NPC-1

PAMS Technical Documentation System Module

RIP Signal name Connected

from - to

3 MICB2 UEM SysCon

/HSet

4MIC2P

MIC2N

5

6HOOKINT Sys

CHARGER INTERFACE
CHARGER lines, no bus*

VCHARGIN ChargerUEM In Vchr < 16 V

GND GND GND from/to Charger connec-

PWRONX * Power On Signal, see also the UI/keyboard

SysCon
/Head­set

Con

UEM In Ana 200mVpp

UEM In Ana/

UEM I/O Signal Properties

A/D Levels-Freq./
Timing resolution

Out V

2.1V typ/ 600

bias

uA

max diff

0...2.7V DC HS Button interrupt, External

Dig

<1.2 V

Description / Notes

Bias voltage for external MIC

Audio Differential signal from exter-

nal MIC

Audio Accessory Detect (EAD)

DC Vch from Charger Connector,

max. 20 V

tor

PWRONX UI UEM In Dig 0/Vbatt Power button
GND GND GND from/to Charger connec-

tor

RFAUXCONV(2:0) RF-BB auxilliary analog signals

0
1TXPWRDET TXPow.

Det.
Mod.

2 AFC UEM VCTCXOOut Ana 0.1-2.4V 11bits AFC control voltage to VCTCXO,

IRIF, no bus no rips UEM 2.7V signals to IR Module

IRLEDC UEM IR Out Dig 0/2.7V 9k6 -

IRRXN IR UEM In Dig 0/2.7V 9k6 -

UIDRV lines, no bus UEM drivers: sinking outputs to Buzzer, Vibra, KLED, DLED

BUZZO UEM Buzzer Out Dig 350mA max. /

UEM In Ana 0.1-2.7V Tx PWR Detector Output to

UEM

default about 1.3V

IR Tx signal to IR Module

1Mbit/s

IR Receiver signal from IR Mod-

Vbatt

1Mbit/s

1-5 kHz,
PWM vol

ule

Open collector sink switch out­put for Buzzer. Frequency con­trolled pitch, PWM for volume.

VIBRA UEM Vibra Out Dig 135mA max /

Vbatt

DLIGHT UEM UI Out Dig 100mA /

Vbatt

64/128/
256/512
Hz

Switch/
100Hz
pwm

Open collector sink switch/Fre­quency/ pwm output for buzzer

Open drain switch/pwm output
for display light

Issue 1 10/01 ãNokia Corporation Page 31

NPC-1

System Module PAMS Technical Documentation

RIP Signal name Connected

from - to

KLIGHT UEM UI Out Dig 100mA /

ACCDIF lines, no bus * Wired Digital Accessory Interface, only to test pattern

MBUS UEM Test

Pad 7

FBUSTXO UEM Test

Pad 2

FBUSRXO Test

Pad 3

RTCBATT lines, no bus * Connector pads for Real Ti me Clock back up battery

VBACK UEM RTC-

GND Global GND 0

VBB, Globals instead of Bus * Regulated BB Supply Voltages

UEM In Dig 0/2.7 V 9k6-

BATT

UEM I/O Signal Properties

A/D Levels-Freq./
Timing resolution

Switch/

Vbatt

In/

Dig 0/2.7 V 9k6bit/s Mbus bidirectional asynchro-

Out

Out Dig 0/2.7 V 9k6-

In/

Vsu

+2-3.3V For back up battery Li 6.8x1.4

Out

pply
/
Chrg

100Hz
pwm

115kbit/s

115kbit/s

Description / Notes

Open drain switch/pwm output
for key light

nous serial data bus/FDL clock,
0-8MHz depends on project

Fbus asynchronous serial data
output / FDL data out <1Mbit/s

Fbus asynchronous serial data
input/FDL in, 0-8Mbit/s
depends on project

2.3mAh@3.3V

VANA UEM Out Vreg 2.78V

+-3%

VFLASH1 UEM Out Vreg 2.78V

+-3%

VFLASH2 UEM Out Vreg 2.78V

+-3%

VIO UEM Out Vreg 1.8V

+-4.5%

VCORE UEM Out Vreg 1.0-1.8V

+-5%

VBACK UEM In/

Vreg 3.0 V No external use, only for RTC

Out

80mA
max.

70mA
max

40mA
max.

150mA
max.

200mA
max.

Disable in sleep mode

1.5mA max. in sleep mode.
VFLASH1 is always enabled
after power on.

VFLASH2 is disabled by default

1.5mA max. in sleep mode. VIO
is always enabled after power
on.

200 uA max. in sleep mode

battery charging/discharging.

Page 32 ãNokia Corporation Issue 1 10/01

NPC-1

PAMS Technical Documentation System Module

UPP Block signals

Table 9: UPP to UEM Interfaces

RFCCONVDA(5:0) See Table 8. UEM Block Signals to UPP / RFCCONVDA(5:0)
RFCONVCTRL(2:0) See Table 8. UEM Block Signals to UPP / RFCONVCTRL(2:0)
AUDUEMCTRL(3:0) See Table 8. UEM Block Signals to UPP / AUDUEMCTRL(3:0)
AUDIODATA(1:0) See Table 8. UEM Block Signals to UPP / AUDIODATA(1:0)
ISIMIF(2:0) See Table 8. UEM Block Signals to UPP / ISIMIF(2:0)
PUSL(2:0) See Table 8. UEM Block Signals to UPP / PUSL(2:0)
IACCDIF(5:0) See Table 8. UEM Block Signals to UPP / IACCDIF(5:0)

Table 1 0 : UPP - RF In ter f ace s

RFICCNTRL(2:0) See Table 7. BB - RF Interface Signal Description / RFICCNTRL(2:0)
GENIO(28:0)/rips 5 and 6 See Table 7. BB - RF Interface Signal Description / GENIO(28:0)
RFCLK & GND See Table 7. BB - RF Interface Signal Description / RFCLK (not BUS...)

Table 11: UPP Globals

RIP Signal name Connected

from - to

UPP Globals, no bus, no rip Power supplies and GND

VIO UPP UEM In Vreg 1.8V

VCORE UPP UEM In Vreg 1.0-1.8V

GND UPP VSSXX

X

UPP

I/O

Signal Properties
A/D Levels-Freq./
Timing resolution

20mA

+- 4.5%

+- 5%

0 Global GND

max.

100mA
max.

Description / Notes

UPP I/O power supply

UPP logics and processors’
power supply, settable to reach
the speed for various clock fre­quencies

Table 12: UPP to Memory Interfaces

MEMADDA(23:0)* See Table 16. Memory Interface Signals / MEMADDA(23:0)*

MEMCONT(9:0) See Table 16. Memory Interface Signals / MEMCONT(8:0)
GENIO(28:0) See Table 16. Memory Interface Signals / GENIO(28:0)

Table 13: UPP GENIOs. Collected,

RIP Signal name Connected

from - to

GENIO(28:0) General I/O Pins. Bolded lines are only valid for one product

although may be described also in other tables

UPP

I/O

Signal Properties
A/D Levels-Freq./
Timing resolution

Description / Notes

Issue 1 10/01 ãNokia Corporation Page 33

NPC-1

System Module PAMS Technical Documentation

RIP Signal name Connected

from - to

2 Not Used UP P In /

3 Not Used UPP Out Dig 0-1.8 V I n / Pull

4 LCDRstX UPP Dis-

play

5TXP1 UPP RF Out Dig 0-1.8 V Out / 0 Tx Power Enable (low Band)
6TXP2 UPP RF Out Dig 0-1.8 V Out / 0 Tx Power Enable (High Band)

7 Not Used UPP Out Dig 0-1.8 V I n / Pull

8 Not Used UPP Out Dig 0-1.8 V I n / Pull

9 Not Used UPP Out Dig 0-1.8 V I n / Pull

10 IRModSD UPP IR

Mod­ule

UPP

I/O

Dig 0-1.8 V In / Pull

Out

Out Dig 0-1.8 V Out / 0 Display reset

Out Dig 0-1.8 V I n / Pull

Signal Properties
A/D Levels-Freq./
Timing resolution

Up

Down

Down

Down

Down

Down

Description / Notes

IR Module Shut Down

11 Bandset UPP RF /

FMR

12 AData UPP In/

13 IR ModuleFIR UPP IR / RF Out Dig 0-1.8 V In / Pull UpFast IR

14 Not Us ed UPP In Dig 0-1.8 V In / Pull

15 Not Us ed UPP Out Dig 0-1.8 V In / Pull

16 Not Us ed UPP In Dig 0-1.8 V In / Pull

17 Not Us ed UPP In Dig 0-1.8 V In / Pull

18 Not Us ed UPP Out Dig 0-1.8 V In / Pull

19 Not Us ed UPP LPRF/RFIn/

20 Not Us ed UPP LPRF Out Dig 0-1.8 V O ut / 0 LPRF Data Out
21 Not Us ed UPP LPRF Out Dig 0-1.8 V I n / Pull UpLPRF Sync / Accessory Mute

Out Dig 0-1.8 V In / Pull UpLo/Hi Band Selection (DAMPS) /

Extended Band Selection (PDC)

Dig 0-1.8 V In / Pull

Out

Dig 0-1.8 V In / Pull

Out

Down

Down

Down

Up

Up

Down

Down

LPFR Data In / Accessory Buffer
Enable / PAGain

22 Not Us ed UPP LPRF Out Dig 0-1.8 V In / Pull

Down

23 FLSWRPX UPP FLASH Out Dig 0-1.8 V Out / 1 Write Protect, 0-active w h en

LPRF Interrupt/Accessory P ower
Up

protected

Page 34 ãNokia Corporation Issue 1 10/01

NPC-1

PAMS Technical Documentation System Module

RIP Signal name Connected

from - to

24 Not Us ed UPP Out Dig 0-1.8 V In / Pull

25 Not Us ed UPP In/

26 Not Us ed UPP Out Dig 0-1.8 V In / Pull

27 Not Us ed UPP In/

28 Not Us ed UPP Out Dig 0-1.8 V Out / 1

UPP

I/O

Dig 0-1.8 V In / Pull

Out

Dig 0-1.8 V In / Pull

Out

Signal Properties
A/D Levels-Freq./
Timing resolution

Up

Up

Down

Up

Table 14: UPP to Key/Display Interfaces

RIP Signal name Connected

from - to

KEYB(10:0)* Keyboard matrix

0P00 UPP KEY-

BOARD

UPP

I/O

In Dig 0-1.8 V Keyboard Matrix Line S0. Not

Signal Properties
A/D Levels-Freq./
Timing resolution

Description / Notes

Description / Notes

used.

1P01 UPP KEY­2P02 Keyboard Matrix Line S2
3P03 Keyboard Matrix Line S3
4P04 Keyboard Matrix Line S4
5P010 UPP KEY­6P011 Keyboard Matrix Line R1
7P012 Keyboard Matrix Line R2
8P013 Keyboard Matrix Line R3
9P014 Keyboard Matrix Line R4

10 P015 UPP KEY-

LCDUI lines, no bus * Display & UI Serial Interface

LCDCamClk UPP DIS-

LCDCamTxDa I/

BOAR
D

BOAR
D

BOARD

PLAY

In Dig 0-1.8 V Keyboard Matrix Line S1

In Dig 0-1.8 V Keyboard Matrix Line R0

In Dig 0-1.8 V Keyboard Matrix Line R5. Not

used.

Out Dig 0-1.8 V 4.86

MHz/

2.43 MHz

Dig 4.86

Out

MHz/

2.43
Mbit/s

Data clock for LCD serial bus,
the speed may vary according
to the display and direction
requirements.

Serial Data to/from LCD

LCDCSX Out Dig LCD Chip Select
GENIO(4) Out Dig LCD Reset, 0-active

Issue 1 10/01 ãNokia Corporation Page 35

NPC-1

System Module PAMS Technical Documentation

MEMORY Block Interfaces

Table 15: Memory Interface Signals

RIP Signal name Connected

from - to

MEMADDA(23:0)* External Memory Access / Data Bus

0-15EXTADDA

0:15

16-23EXTAD

16:23
MEMCONT(9:0) External Memory Control Bus
0ExtWrX Memor

1 ExtRdX Memor

2
3(FlsBAAX)

VPPCTRL

4FlsPS Mem-

Mem­ory

Mem­ory

y_WE

y_OE

Mem­ory
(VPP)

ory PS

UPP In/

UPP In Dig 0/1.8V 25 / 150 nsBurst Flash Address (16:23)

UPP In Dig 0-1.8V Write Strobe

UPP In Read Strobe

UPP In VPP = 1.8V, => VIO used inter-

UPP In/

I/O Signal Properties

A/D Levels-Freq./
Timing resolution

Dig 0/1.8V 25 / 150 nsBurst Flash Address (0:15) &

Out

Out

Description / Notes

Data (0:15)
Direct Mode Address (0:7)

Direct mode Data (8:15)

nally for VPP
VPP = 5/12V, VPP used

25 ns Burst Mode Fl ash Data Invert

Direct Mode Address (17)

5FlsAVDX Memor

y_AVD

6FlsCLK Mem-

nory
CLK

7FlsCSX Memor

y_CE

8FlsRDY Mem-

ory
RDY

9FlsRSTX Memor

y_RP

GENIO(28:0) General I/ O Pin used for extra control

23 FLSWRPX Memor

y_WP

Globals Pow er supplies and production test pad

VIO UEM FLASH In PWR 1.8V FLASH power supply

VPP Prod

TP 6

UPP In Flash Addr Data Valid/ Latch

Burst Addr
Direct Mode Address (18)

UPP In 50 MHz Burst Mode Flash Clock

Direct Mode Address (19)

UPP In Flash Chip Select

UPP Out Ready Signal for Flash

UPP Out Flash reset, 0 acti v e (FLSRPX)

UPP Out Dig 0/1.8V 0 Write Protect, 0-active pro-

tected.

FLASH In Vpp 0/(1.8)

/5/12V

FLASH programming/erasing
voltage control . 5 o r 12 exter­nal voltage for high speed pro­gramming

GND Global GND

Page 36 ãNokia Corporation Issue 1 10/01

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PAMS Technical Documentation System Module

IR Block Interfaces

Table 16: IR Block Sign al Description

RIP Signal name Connected

from - to

IRIF, no bus, no rips * Module IR Interface

IRLEDC UEM IR In Dig 0/2.7V 9k6 -

IRRXN IR UEM Out DIg 0/2.7V 9k6 -

GENIO(28:0) General I/O Bus

10 GENIO10 UPP IR In Dig 0/1.8V IR Module Shutdown, discrete

Globals

VBAT Bat-

tery

VFLASH1 UEM IR In Vreg 2.78V

GND

IR In Vbat 3.6V 1 =

IR-Module

I/O

Signal Properties
A/D Levels-Freq./
Timing resolution

+- 3%

1Mbit/s

1Mbit/s

500mA
peak @Tx

1=99uA
max.
@Rx

Description / Notes

IR Tx signal to IR Module

IR Receiver signal from IR Mod­ule

inverting level shifter to 2.7V

Transmitter IR LED pow e r sup­ply from battery 3.6V nominal,

3...5.1V total range
IR Receiver and Transmitter

power supply

Audio Interfaces

Table 17: Internal A udio

RIP Signal name Connected

from - to

HP INTERNAL AUDIO
AUDIO(4:0) HP Internal microphone and earpiece IF between UEM and Mic/Ear cir cui ty

0 EARP UEM Ear-

piece

1 EARN
2 MIC1N Mic UEM In Ana 100mVpp

3 MIC1P
4MICB1 Mic UEMOutV

System Connector HP Internal microphone IF between System Connector and Mic/ear circuitry

MIC+ Mic Audio

- UEM

AUDIO

I/O

Out Ana 1.25V Audio Differential s i g nal t o HP inter-

bias

In

Ana

Out

Bias

Signal Properties
A/D Levels-Freq./
Timing resolution

max diff.

2.1V typ./
<600 uA

2mV nom
2V2kohm

Audio, AC
coupled
to UEM

Audio
DC bias

Description / Notes

nal Earpiece.
Load resistance 32 ohm.

Differential signal from HP
internal MIC

Bias voltage for internal MIC

Mic bias and audio signal.
Microphone mounted into sys­tem connector

MIC In GND 0 (GND) AGND coupled to GND at UEM

Earpiece Connector Pads HP Internal IF between Earpiece and Mic/Ear circuitry

Issue 1 10/01 ãNokia Corporation Page 37

NPC-1

System Module PAMS Technical Documentation

RIP Signal name Connected

from - to

“1”-EARP EAR Audio

­UEM­EAR
P/N

AUDIO

I/O

Out Ana 1.25V Diff DC

Signal Properties
A/D Levels-Freq./
Timing resolution

coupled
Audio

Table 18: External Audio

RIP Signal name Connected

from - to

EXTERNAL AUDIO INTERFACE
XAUDIO(9:0)* External Au dio IF between UEM and X-audio circuitry

0 HEADINT SysCon

/HSet

1 HF UEM SysCon

2 HFCM Ana 0.8 Vdc

UEM Out Dig 0/2.7V Output to UEM for Headset

/HSet

AUDIO

I/O

In Ana 1.0Vpp

Signal Properties
A/D Levels-Freq./
Timing resolution

bias 0.8V

Audio ExternalEarpiece Audio Signal

Description / Notes

Differential audio signal to ear­piece 32 ohm

Description / Notes

Connector “HeadInt” Switch

Reference for DC coupled
external Earpiece

3MICB2 UEMSysCon

/HSet

4MIC2P

MIC2N

5

6HOOKINT Sys

7 Not used
8 Not used
9 Not used

System Connector HP Internal microphone IF between system connector and Mic/Ear circuitry

XMICP HS/HF

XMICN In Ana 2/60mV nom

SysCon
/Head­Set

Con

Mic

UEM Out Ana 200mVpp

UEM Out Ana/

Audio

- UEM

Out V

In
Out

2.1V tvp/ 600

bias

uA

Audio Differential signal from exter-

max diff

0...2.7 V DC HS Button interrupt, External

Dig

Ana
Bias

2/60mV nom
diff

2.1V bias
1kohm

diff
GND/1kohm

Audio
DC bias

Audio

Bias voltage for external MIC

nal MIC

Audio Accessory Detect (EAD)

Headset Mic bias and audio
signal 2mV nomi nal. HF Mic
signal 60mV nominal. Differen­tial symmetric input.
Accessory detection by bias
loadind (EAD channel of slow
ADC of UEM)
Hook interrupt by heavy bias
loading
Mic - connecting to GND
through lower part of split
symmetric lo ad resistor (2 x 1
kohm)

Page 38 ãNokia Corporation Issue 1 10/01

NPC-1

PAMS Technical Documentation System Module

RIP Signal name Connected

from - to

XEARP HS/HF
XEARN

INT Switch Audio

EAR/
Amp.

Audio

- UEM

- UEM

AUDIO

I/O

In Ana 100 mV nom

In Dig 0/2.7V HS interrupt from system con-

Signal Properties
A/D Levels-Freq./
Timing resolution

diff

Key/Display blocks

Table 19: KEY Block Interface Signal Description

RIP Signal name Connected

from - to

KEYB(10:0) Keyboard matrix, Roller key

0 P00 Not used UPP Out Dig 0/1.8V

KEY

I/O

Audio Quasi differential DC-coupled

Signal Propertie s
A/D Levels-Freq./

Timing resolut ion

Description / Notes

earpiece/HF amplifier signal to
accessory. DC biased to 0.8V;
XEARN a quiet refe ren c e
although have signal when
loaded due to internal series
resistor.

nector switch when plug
inserted.

Description / Notes

1 P01 Keyboard Keyboard Matrix Line
2 P02 Keyboard Keyboard Matrix Line
3 P03 Keyboard Keyboard Matrix Line
4 P04 Keyboard Keyboard Matrix Line
5 P10 Keyboard Keyboard Matrix Line
6 P11 Keyboard Keyboard Matrix Line
7 P12 Keyboard Keyboard Matrix Line
8 P13 Keyboard Keyboard Matrix Line
9 P14 Keyboard Keyboard Matrix Line
10 P15 Not Used

PWR_KEY P ower Key, not a member of the keyboard matrix

PWR_KEY Power key UEM Out Dig 0/Vbatt Power key, not a member of

the keyboard matrix

Table 20: Display block Signal Description

RIP Signal name Connected

from - to

Display

I/O

Signal Properties
A/D Levels-Freq./
Timing resolution

Description / Notes

LCDUI(2:0) Display & UI Serial Interface

0 LCDCAMCLK UPP Displ In Dig 0/1.8V 1 MHz Clock to LCD

Issue 1 10/01 ãNokia Corporation Page 39

NPC-1

System Module PAMS Technical Documentation

RIP Signal name Connected

from - to

1 LCDCAMTXD UPP Displ In/

2 LCDCSX UPP Displ In Dig 0/1.8V LCD Chip Select

GENIO(28:0) General I/O Pins

4 LCDRstX UPP Displ Out Dig 0/1.8V Out / 0 Display Reset, 0-active

Display

I/O

Dig 0/1.8V 1 MHz Data to/from LCD

Out

Signal Properties
A/D Levels-Freq./
Timing resolution

Description / Notes

Baseband External Connections

Table 2 1: System Connector Interface

RIP Signal name Connected

from - to

System Connector HP Internal microphone IF between System Connector and Mic/Ear circuitr y

XMICP HS/HF

Mic

XMICN In Ana 2/60mV

Audio

- UEMInOut

Sys Conn

I/O

Ana
Bias

Signal Properties
A/D Levels-F re q. /

Timing resolution

2/60mV
nom diff
2V2koh
m

nom diff

Audio
DC bias

Audio

Description / Notes

Headset Mic bias and audio sig­nal 2mV nominal. H f Mi c sig nal
60mV nominal. Di ff erential sym­metric output.
Accessory detection by bias load­ind.
Hook interrupt by heavy bias

loading.
XEARP HS/HF
XEARN

INT Switch Audio

CHARGER INTERFACE
CHARGER lines, no bus *

VCHARIN ChargerUEM I n V chr < 16V

GND GND GND from/to Charger connector

EAR/
Amp.

Audio­UEM

- UEM

In Ana 100mV

nom diff

In Dig 0/2.7V HS interrupt from system connec-

<1.2A

Audio Quasi differential DC-coupled

earpiece/HF amplifier signal to

accessory. DC biased to 0.8V;

XEARN a quiet referen c e

although have signal when

loaded due to internal series

resistor.

tor switch when plug inserted

DC Vch from Charger Connector, max

20V

Table 22: Battery Connector Interface

RIP Signal name Connected

from - to

GND Glo-

bally

VBAT Batt + Vbatt3.0-5.1V D C Batt e ry Voltage

Batt - Global GND

Batt Conn

I/O

Signal Properties
A/D Levels-Freq./
Timing resolution

Description / Notes

Page 40 ãNokia Corporation Issue 1 10/01

NPC-1

PAMS Technical Documentation System Module

RIP Signal name Connected

from - to

BSI UEM Ana

BTEMP UEM Btemp NTC Resistor, 100 kohm

Test Pattern for Production Tests

Table 23: Test Pattern Interface Signal Description

RIP Signal name Connected from

- to

2FBUSTX /

FDLTX

3FBUSRX /

FDLRX

6VPP Test

Test
Point

Test
Point

Point

UEM Out Dig 0/2.7V Fbus asynchronous serial data

UEM In Dig 0/2.7V Fbus asynchronous serial data

Mem­ory

Batt Conn

I/O

Ana

UI

I/O

Out Ana 0/5/12V Exte rnal Flash Programming

Signal Properties
A/D Levels-Freq./
Timing resolution

0-2.7V Pull down

res

Signal Properties
A/D Levels-Freq./
Timing resolution

Description / Notes

Battery Size Indicator Resistor,
100 kohm pull up to

2.78V(VFLASH)

pull up to 2.78V(VANA)

Description / Notes

output / FDL

input / FDL RxData

Voltage fo r Flash Memory

7MBUS / FDL-

CLK

8GND Test

Test
Point

Point

UEM In/

BB Ground

Dig 0/2.7V 9k6bit/s Mbus bidirectional asynchro-

Out

nous serial data bus/FDL Clock

Issue 1 10/01 ãNokia Corporation Page 41

NPC-1

System Module PAMS Technical Documentation

RF Module

Requirements

The NPC-1 RF module supports the following systems:

•AMPS

• TDMA800

Hence, the minimum transceiver performance requirements are described in TIA/EIA­136-270. The NPC-1 RF must follow the requirements in the revision A. The EMC require­ments are set by FCC 47CFR 15.107 (conducted emissions), 15.109 (radiated emissions,
idle mode) and 22.917 (radiated emissions, call mode).

Design

The RF design is centered around the SAFARI RF-IC. The SAFARI consists of receivers,
transmitter IF parts and all PLL's. RF filtering, 2G LNA, powe r amplifiers, TX upconverter
and TX power detection circuitry are left outside SAFARI.

The phone comprises of one single-sided 8 –layer PWB. A single multiwall RF shield i s
used and this sets the maximum component height to 2.0mm. An internal antenna is
located on the top of t he phone and there is room f or a 4.0mm high ceramic duplexer
under the antenna assembly.

Software Compensations

The following software compensations are required:

• Power levels temperature compensation

• Power levels channel compensation

• Power level reduction due to low battery Voltage

• TX Power Up/Down Ramps

• PA's bias reference currents vs. power, temp and operation mode

• RX IQ DC offsets

• RSSI channel compensation

• RSSI temperature compensation

Page 42 ãNokia Corporation Issue 1 10/01

NPC-1

2

F 2

F 2

BaseBand

PAMS Technical Documentation System Module

Main Technical Characteristics

RF Frequency Plan

The NPC-1 frequency plan is shown in the figure below. A 19.44 MHz VCTCXO is used for
UHF and VHF PLLs and as a baseband clock signal. All RF locals are generated in PLLs.

Figure 11: RF Freq uency Block Plan

Rx IF

0 MHz

RX IQ

Rx Channel Centre F requencies

TDMA800 869.04...893.97

Rx IF

135.54 MHz

F

Rx VHF

271.08 MHz

PLL

UHF

TDMA800 2009.16 MHz 2059.02 MHz

VCTCXO

19.44 MHz

PLL

PLL

Tx VHF

TDMA800: 361.08 MHz

Tx channel centre frequencies

TDMA800 824.04...848.97 MHz

Tx IF

180.54 MHz

TX IQ

Due to the AMPS mode, simultaneous reception and transmission, TX and RX IF frequen­cies are exactly 45MHz apart from each other. RXIF is 135.54 MHz and TXIF 180.54MHz.
The RXIF frequency is set so that it is not a multipl e of either of VHF's comparison fre ­quency (120k).

DC Characteristics

Power Distribution Diagram

Note: The current values in the figure below are not absolute values and cannot be
measured. These values represent maximum/typical currents drawn by the corre­sponding RF or SAFARI blocks in use, and are, therefore, dependent on the phone’s
operating mode and state.

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System Module PAMS Technical Documentation

Figure 12: Power distribution

Page 44 ãNokia Corporation Issue 1 10/01

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PAMS Technical Documentation System Module

Regulators

The regulator circuit is the UEM and the specifications can be found in the table below:

Table 24: Regu la tor specifications

Regulator name Output voltage (V) Regulator Max. cur-

Receiver

The receiver shows a superheterodyne structure with zero 2nd IF. Most of the receiver
functions are integrated in the RF ASIC. The only funct ions out of the c hip are duplex ers
and SAW filters.

RF total

rent (mA)

VR1 a/b 4.75 ± 3% 10 4

VR2 2.78 ± 3% 100 100
VR3 2.78 ± 3% 20 2
VR4 2.78 ± 3% 50 23
VR5 2.78 ± 3% 50 5
VR6 2.78 ± 3% 50 5
VR7 2.78 ± 3% 45 40

IPA1, IPA2 2.7 max. 1 ± 10%

3 ± 4%

3.5 ± 4%
5 ± 3%

VREFRF01 1.35 ± 0.5% 0.12 0.05

VFLASH1 2.78 ± 3% 70 1

1.3 – 5.0

An active 1st downconverter sets naturally high gain requi rements f or preceding sta ges.
Hence, losses in very select ive frontend filters are minimized dow n to the limits set by
filter technologies used and component sizes. LNA gain is set up to 16dB, which is close
to the maximum available stable gain from a single stage amplifier. LNAs are not exactly
noise matched in order to keep passband gain rippl e in minimum. Filters have relative
tight stopband requirements, which are not all set by the system requirements but the
interference free operation in t he fie ld. In this re ceive r stru cture, linear ity lies heavily on
mixer design. The 2nd order distortion re quirements of t he mixer are set by the 'half IF'
suppression. A fully balanced mix er topology is required. Additionally, the receiver 3rd
order IIP tends to depend on active mixer IIP3 linearity due to pretty high LNA gain.

IF stages include a narrowband SAW filter on the 1st IF and a integrated lowpass filter­ing on zero IF. SAW filter guarantee s 14dBc attenuation at alternating channels, which
gives acceptable receiver IMD performance wit h only moderate VHF local phase noise
performance. The local signal's partition to receiver selectivity and IMD depends then
mainly on the spectral purity of the 1st local. Zero 2nd IF stages inc lude most of receiv-

Issue 1 10/01 ãNokia Corporation Page 45

NPC-1

System Module PAMS Technical Documentation

ers signal gain, AGC control range and channel filtering.

Table 25: RF Characteristics

ITEM NMP Requirement TDMA, AMPS 800

RX frequency range, DAMPS 800 869.01...

893.97

LO frequency range 2009.1...

2059.2
1st IF frequency 135.54
Channel NBW, RF 28.6
IF 1 3dB roll off min. frequency (+-?f) 13
2nd IF min. 3dB bandwidth 16 / IQ-branch
Max total group delay at 3dB bandwidth
C/N for sensitivity, digital

analog
C/I for selectivity, digital

analog
Sensitivity, digital mode static ch (BER < 3%)

ANALOG MODE (sinad >12Db)
Adjacent channel selectivity, digital

analog
Alternate channel selectivity, digital

analog
IMD attentuation selectivity, digital

analog close spaced (60/120)
analog wide spaced (330/660)

Cascaded NF, digital
analog

Cascaded IIP 3, digital 120/240, 240/48 0 k Hz
analog 60/120 kHz
analog 330/660 kHz

Available receiver gain digital/analog 85 (min.)
RF front end gain control range, A G C 1 step 20

7

3.5
8

4

-110 (min.)

-116 (min.)
13

16*

45

65*

65

65*
70*

< 9.5
< 9.5

> -7.7

> -17*

> -8*

1st IF gain co nt rol range, A G C 2 step 30
R X 2nd IF gain control range, 8x6dB steps 42
Min signal level at RX-ADC input @ sensitivity

digital
analog

Input dynamic range -116... -2.0
Gain relative accuracy in receiving band ** 2
Gain absolute accuracy in receiving band ** 4
* referenced to the sensitivity level

** After production alignment

-31

-25

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PAMS Technical Documentation System Module

AMPS/TDMA 800 MHz Front End

Default vendor for 881.5MHz bandfilter is Murata, type 4146

Table 26: RX800 Front End Characteristics Ant to 1st Mixer

Parameter MIN TYP MAX Unit/Notes

Diplexer input loss 0.35 0.4 0.45 dB
Duplexer input loss 2.5 3 4.1 dB
LNA gain: High gain mode

Low gain mode
LNA noise figu re* 1.4 1.7 2.3 dB
LNA 3rd order intercept (IIP3)* -4 -3 -1.5 dBm
Bandfilter input loss 1.5 2 2.5 dB
Mixer gain* 6 7.5 8 dB
Mixer NF* 8 9 10.5 dB
Mixer IIP3* 4 4.5 5 dBm

Total:

Gain 18.2 18.6 20 dB
Noise Figure 4.6 5.5 7 dB
3rd order intercept (IIP3) -8.9 -7.5 -6.8 dBm
*see Safari spec/measurements

16

-4.5

16.5

-4

17.3

-3.8

dB
dB

Table 27: RF - IX Spe c ification

Parameter Minimum

Typical/
Nominal

Maximum Unit/Notes

Total

Pow er up time 0. 1 ms
Noise figure, total 9.5 dB
3rd order input intercept point -25 dBm
Max voltage gain,

Mixer + 2nd IF (IF+2nd AGC max)
Min voltage gain,

Mixer + 2nd IF (IF+2nd AGC min.)
Gain charge,

Mixer+2nd IF

IQ mixers + AMP2

RF input impedence differential 1.2 kohm/pF

RF input frequency range 135.54 MHz

78.5 dB

6dB

1.4 0.9 dB, temp

-30...+85 C

Issue 1 10/01 ãNokia Corporation Page 47

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System Module PAMS Technical Documentation

Parameter Minimum

Conversion gain @ RI=1kohm 23 .5 24 24.5 dB
IF AGC gain range (5x6 dB) 30 dB
IF AGC gain step (5 steps) 6 dB
IF AGC gain error relative to max gain -0.5 +0.5 dB
AMP2 gain 18 dB

-3dB frequency 21 25 29 kHz

LPF: 4th order Chebysev

LPF gain 0 dB
Corner frequency tuning range 14 17 kHz
Corner frequency tuning step 1 kHz
Attentuation @ 30 kHz * 24 dB
Attentuation @ 60 kHz * 55 dB
Attentuation @ 120 kHz * 80 dB
Attentuation @ 240 kHz * 60 dB

Typical/
Nominal

Maximum Unit/Notes

Attentuation @ >480 kHz * 40 dB

AGC

AGC gain range -6 36** dB
AGC gain range step

7 steps
AGC gain error relative to max gain -0.5 +0.5 dB
Max IF/2nd IF buffer output level 3 V pp (differential)

6dB

Frequency Synthesizers

NPC-1 synthesizer consists of three synthesizers, one UHF synthesizer and two VHF syn­thesizers. UHF synthesizer is based on integrated PLL and external UHF VCO, loop filter
and VCTCXO. Its main goal is to achieve the channel select ion f or the dual mode. Due to
the RX and TX architecture this UHF synthesizer is used for down conversion of the
received signal and for f inal up conversion in transmitter. Frequency divider by two is
integrated in Safari.

Two VHF synthesizers consists of: RX VHF Synthesizer includes integrated PLL and VCO
and external loop filter a nd r esonator. The output of RX-VHF PLL is used a s L O signal for
the second mixer in receiver. TX VHF Synthesizer includes integrated PLL and external
amplifier, loop filter and resonator. The output of TX-VHF PLL is used as a LO signal for
the IQ-modulator of the transmitter. See depicted block diagrams and synthesizer char­acteristics from synthesizer specification document [6].

Page 48 ãNokia Corporation Issue 1 10/01

NPC-1

PAMS Technical Documentation System Module

Transmitter

The transmitter RF architecture is up-conversion type (desired RF spectrum is low side
injection) whit (RF-) modulation and gain control at IF. The IF frequency is 180.54MHz.
The cellular band is 824.01-848.97MHz.

Common IF

The RF-modulator is integrated with PGA (Programma ble Gain Amplifier) and IF output
buffer inside SAFARI_T RFIC-chip (later as Safari) . I- and Q-signals, t hat are output sig­nals from BB-side SW IQ-modulator, have some filtering inside Safari before RF-modula­tion is performed. The required LO-signal from TXVCO is buffered with phase sifting in
Safari. After modulation (π/4 DQPSK or FM) the modulated IF signal is amplified in PGA.

Cellular Band

The maximum linear (balanced) IF signal level to 50Ω load is about –8 dBm.
For proper AMPS-mode receiver (duplex)sensitivity IF signal is filtered in strip-filter

before up-conversion. The upconverter mixer is actually a mixer with LO and output
driver being able to deliver about +6dBm linear output power. Note, that in this point,
term linear means –33dB ACP. The required LO power is about –6dBm. The LO signal is
fed from Safari.

Before power amplifier RF signal is filter in band filter. The typical insertion loss is about
–2.7dB, and maximum less than –3.5dB. The input and outp ut return losses are about –
10dB.

Power amplifier is 50Ω/50Ω module. It does not have own enable/disable control signal,
but it can be enabled by bias voltage and reference bias current signals. The gain window
is +27 to +31dB and linear output power is +30dBm (typical condition) with –28dB ACP.
The nominal efficiency is 50%.

Power Control

For power monitoring there is a power detector module (PDM) build up from a coupler, a
biased diode detector and an NTC resistor. RF signals are routed via this PDM. The RF iso­lation between couplers is sufficient not to loose filtering performance given by duplex
filters.

The diode output voltage and NTC voltage are routed to BB A/D converters for power
control purpose. The TX AGC SW takes samples from diode output volt age a nd compa res
that value to target value, and adjust BB I-and Q-signal amplitude and/or Safari PGA
settings to keep power control in balance.

NTC voltage is used for diode temperature compensation and for thermal shut down
when radio board’s temperature exceeds +85°C.

False TX indication is based on detected power measurement when carrier is not on.
The insertion loss of coupler is –0.42dB (max). Typical values for inser tion l oss is about -

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System Module PAMS Technical Documentation

0.2dB. The filtering performance of diplexer is taken in account in system calculations.
Signal levels

Table 28: Typical Sign al Le vels

Power Level PGA Pout

2 3 25.5/27.3
35-4dB
46-4dB
57-4dB
68-4dB
79-4dB
810-4dB
911-4dB

(For AMPS mode PL2 25.5 dBm, PL2 27.3 dBm for digital mode both bands)

Antenna Circuit

Here the antenna circuit stands for duplex filters and the diplexer. The cellular band
duplex filter is band pass type SAW filter with typical insertion loss about –2.0dB. The
insertion loss of the diplexer is-0.2 (max) and the typical value is about –0.1dB.

RF Performance

The outpu t po wer tu nin g ta rge t fo r po wer le vel 2 a fte r d iple xer (or aft er swit ch for exte r­nal RF) is +27.3dBm for π/4 DQPSK type of modulation and +25. 5dBm for FM type of
modulation. Power levels downwards from PL2 are –4dB below next to highest power
level, PL10 being –4.7dBm (and PL7 +6.5dBm with FM type of modulation). Modulation
accuracy and ACP shall be within limits specified in IS-136/137.

Antenna

The NPC-1 antenna solution is an internal single r esonance PIFA-antenna. In a single
band transceiver, a SMD compatible through chip can be used.

10 12 -4dB

Page 50 ãNokia Corporation Issue 1 10/01

Programmes After Market Services

NPC-1 Series Transceivers

P arts List

Issue 1 10/01 ãNokia Corporation

NPC-1

Parts List PAMS Technical Documentation

Table of contents

Page No

Parts List of WS8 (EDMS Issue 2.14)........................................................................... 3

Page 2 ãNokia Corporation Issue 1 10/01

NPC-1

PAMS Technical Documentation Parts List

P arts List of WS8 (EDMS Issue 2.14)

ITEM CODE DESCRIPTION VALUE TYPE

___________________________________________________________________________________

R150 1620031 Res network 0w06 2x1k0 j 04040404
R151 1430778 Chip resistor 10 k 5 % 0.063 W 3.000
R152 1430788 Chip resistor 22 k 5 % 0.063 W 1.000
R156 1430762 Chip resistor 2.2 k 5 % 0.063 W 1.000
R157 1430710 Chip resistor 22 5 % 0.063 W 1.000
R200 1419003 Chip resist o r 0.22 5 % 1210
R201 162010 3 Res network 0w06 2x22r j 04040404
R202 1430804 Chip resist o r 100 k 5 % 0.063 W 4.000
R203 1430087 Chip resist o r 100 k 5 % 0.063 W 2.000
R204 1430087 Chip resist o r 100 k 5 % 0.063 W 2.000
R205 1620077 Res network 0w06 2x10k j 06060606
R206 1430804 Chip resist o r 100 k 5 % 0.063 W 4.000
R207 1430804 Chip resist o r 100 k 5 % 0.063 W 4.000
R300 1412173 Chip resistor 33 5 % 0.1 W 1.000
R301 1411669 Chip resistor 22 5 % 0.1 W 1.000
R350 1419009 Chip resistor 4.7 5 % 1210
R356 1430804 Chip resist o r 100 k 5 % 0.063 W 4.000
R420 1430268 Chip resistor 27 k 1 % 0.063 W 0603
R427 1430778 Chip resistor 10 k 5 % 0.063 W 3.000
R450 1430770 Chip resistor 4.7 k 5 % 0.063 W 2.000
R709 1430700 Chip resistor 10 5 % 0.063 W 6.000
R712 1430700 Chip resistor 10 5 % 0.063 W 6.000
R721 1430774 Chip resistor 6.8 k 5 % 0.063 W 1.000
R722 1430772 Chip resistor 5.6 k 5 % 0.063 W 2.000
R723 1430764 Chip resistor 3.3 k 5 % 0.063 W 2.000
R724 1430691 Chip resistor 2.2 5 % 0.063 W 1.000
R741 1430770 Chip resistor 4.7 k 5 % 0.063 W 2.000
R742 1430772 Chip resistor 5.6 k 5 % 0.063 W 2.000
R743 1430764 Chip resistor 3.3 k 5 % 0.063 W 2.000
R744 1430742 Chip resist o r 390 5 % 0.063 W 1.000
R745 1430700 Chip resistor 10 5 % 0.063 W 6.000
R771 1430786 Chip resistor 18 k 5 % 0.063 W 1.000
R772 1430726 Chip resist o r 100 5 % 0.063 W 1.000
R773 1430700 Chip resistor 10 5 % 0.063 W 6.000
R774 1430700 Chip resistor 10 5 % 0.063 W 6.000
R791 1430778 Chip resistor 10 k 5 % 0.063 W 3.000
R792 1430700 Chip resistor 10 5 % 0.063 W 6.000
R818 1430268 Chip resistor 27 k 1 % 0.063 W 0603
R830 1430832 Chip resistor 2.7 k 5 % 0.063 W 1.000
R831 1430734 Chip resist o r 220 5 % 0.063 W 1.000
R900 1430718 Chip resistor 47 5 % 0.063 W 1.000
C101 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C102 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
C103 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
C104 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
C105 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
C106 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
C150 2312243 Ceramic cap. 4.7 u 10 % 0805
C151 2320783 Ceramic cap. 33 n 10 % 10 V 0402
C152 2320783 Ceramic cap. 33 n 10 % 10 V 0402
C155 2320783 Ceramic cap. 33 n 10 % 10 V 0402
C156 2320783 Ceramic cap. 33 n 10 % 10 V 0402
C157 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C159 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C160 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
C161 2320481 Ceramic cap. 5R 1 u 10 % 0603

Issue 1 10/01 ãNokia Corporation Page 3

NPC-1

Parts List PAMS Technical Documentation

C201 2320481 Ceramic cap. 5R 1 u 10 % 0603
C202 2320548 Ceramic cap. 33 p 5 % 50 V 0402
C203 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C204 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C205 2320481 Ceramic cap. 5R 1 u 10 % 0603
C206 2320481 Ceramic cap. 5R 1 u 10 % 0603
C207 2320481 Ceramic cap. 5R 1 u 10 % 0603
C208 2320481 Ceramic cap. 5R 1 u 10 % 0603
C211 2320481 Ceramic cap. 5R 1 u 10 % 0603
C212 2320481 Ceramic cap. 5R 1 u 10 % 0603
C213 2320481 Ceramic cap. 5R 1 u 10 % 0603
C215 2320481 Ceramic cap. 5R 1 u 10 % 0603
C217 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
C218 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C219 2320481 Ceramic cap. 5R 1 u 10 % 0603
C220 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
C221 2320481 Ceramic cap. 5R 1 u 10 % 0603
C222 2320481 Ceramic cap. 5R 1 u 10 % 0603
C223 2320481 Ceramic cap. 5R 1 u 10 % 0603
C224 2320481 Ceramic cap. 5R 1 u 10 % 0603
C225 2320481 Ceramic cap. 5R 1 u 10 % 0603
C226 2320481 Ceramic cap. 5R 1 u 10 % 0603
C228 2320481 Ceramic cap. 5R 1 u 10 % 0603
C229 2320481 Ceramic cap. 5R 1 u 10 % 0603
C230 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C231 2320481 Ceramic cap. 5R 1 u 10 % 0603
C232 2320481 Ceramic cap. 5R 1 u 10 % 0603
C233 2320481 Ceramic cap. 5R 1 u 10 % 0603
C234 2320481 Ceramic cap. 5R 1 u 10 % 0603
C235 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C236 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C237 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C238 2320491 Ceramic cap. 220 n 10 % 10 V 0603
C239 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C241 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C242 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C245 2320481 Ceramic cap. 5R 1 u 10 % 0603
C261 2312243 Ceramic cap. 4.7 u 10 % 0805
C262 2312243 Ceramic cap. 4.7 u 10 % 0805
C264 2320481 Ceramic cap. 5R 1 u 10 % 0603
C302 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C303 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C304 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C306 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C307 2320548 Ceramic cap. 33 p 5 % 50 V 0402
C308 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C350 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C351 2312243 Ceramic cap. 4.7 u 10 % 0805
C400 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C401 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C402 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C403 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C404 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C405 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C420 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
C450 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C451 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C454 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C700 2320552 Ceramic cap. 47 p 5 % 50 V 0402
C701 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C702 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C703 2320536 Ceramic cap. 10 p 5 % 50 V 0402

Page 4 ãNokia Corporation Issue 1 10/01

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PAMS Technical Documentation Parts List

C704 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C706 2320552 Ceramic cap. 47 p 5 % 50 V 0402
C707 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
C708 2320481 Ceramic cap. 5R 1 u 10 % 0603
C710 2320740 Ceramic cap. 680 p 10 % 50 V 0402
C711 2320481 Ceramic cap. 5R 1 u 10 % 0603
C712 2320552 Ceramic cap. 47 p 5 % 50 V 0402
C720 2320588 Ceramic cap. 1.5 n 5 % 50 V 0402
C721 2320783 Ceramic cap. 33 n 10 % 10 V 0402
C722 2320588 Ceramic cap. 1.5 n 5 % 50 V 0402
C723 2320522 Ceramic cap. 2.7 p 0.25 % 50 V 0402
C724 2320548 Ceramic cap. 33 p 5 % 50 V 0402
C725 2320520 Ceramic cap. 2.2 p 0.25 % 50 V 0402
C726 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
C740 2320590 Ceramic cap. 1.8 n 5 % 50 V 0402
C741 2320783 Ceramic cap. 33 n 10 % 10 V 0402
C742 2320588 Ceramic cap. 1.5 n 5 % 50 V 0402
C745 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C747 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C748 2320538 Ceramic cap. 12 p 5 % 50 V 0402
C749 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
C750 2320514 Ceramic cap. 1.2 p 0.25 % 50 V 0402
C751 2320520 Ceramic cap. 2.2 p 0.25 % 50 V 0402
C752 2320740 Ceramic cap. 680 p 10 % 50 V 0402
C753 2320481 Ceramic cap. 5R 1 u 10 % 0603
C770 2320580 Ceramic cap. 680 p 5 % 50 V 0402
C771 2480003 Ceramic cap. 1.000 1.000
C772 2320495 Ceramic cap. 1.0 n 5 % 50 V 0603
C773 2320466 Ceramic cap. 220 p 5 % 50 V 0603
C774 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C775 2320481 Ceramic cap. 5R 1 u 10 % 0603
C776 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C791 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C792 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C793 2320481 Ceramic cap. 5R 1 u 10 % 0603
C801 2320552 Ceramic cap. 47 p 5 % 50 V 0402
C802 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C803 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C806 2320552 Ceramic cap. 47 p 5 % 50 V 0402
C807 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C808 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C820 2320552 Ceramic cap. 47 p 5 % 50 V 0402
C821 2320552 Ceramic cap. 47 p 5 % 50 V 0402
C822 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C830 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C831 2320602 Ceramic cap. 4.7 p 0.25 % 50 V0402
C832 2320602 Ceramic cap. 4.7 p 0.25 % 50 V 0402
C833 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C834 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C900 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
C901 2320631 Ceramic cap. 180 p 5 % 25 V 0402
C902 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
C903 2320631 Ceramic cap. 180 p 5 % 25 V 0402
C904 2320005 Ceramic cap. 82 p 5 % 25 V 0603
C905 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C906 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C907 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C908 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
C910 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
C912 2320481 Ceramic cap. 5R 1 u 10 % 0603
C913 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C914 2320481 Ceramic cap. 5R 1 u 10 % 0603

Issue 1 10/01 ãNokia Corporation Page 5

NPC-1

Parts List PAMS Technical Documentation

C915 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C916 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C918 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
C919 2320635 Ceramic cap. 0.5 p 0.25 % 50 V0402
C921 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
C930 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C931 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
L100 3203743 Ferr.b ead 0r03 42r/100mh z 3a 0805 0805
L160 3203741 Ferrite bead 0r5 600r/100mhz 0603 0603
L161 3203741 Ferrite bead 0r5 600r/100mhz 0603 0603
L162 3203741 Ferrite bead 0r5 600r/100mhz 0603 0603
L163 3203741 Ferrite bead 0r5 600r/100mhz 0603 0603
L164 3203741 Ferrite bead 0r5 600r/100mhz 0603 0603
L730 3645333 Chip coil 27 n 2 % Q=40/250 MHz 0603
L746 3645331 Chip coil 47 n 2 % Q=38/200 MHz 0603
L750 3645145 Chip coil 39 n 5 % Q=12/100 MHz 0603
L751 3645145 Chip coil 39 n 5 % Q=12/100 MHz 0603
L820 3645211 Chip coil 6 n
L821 3646069 Chip coil 33 n 5 % Q=23/800 MHz 0402
L822 3646063 Chip coil 22 n 5 % Q=28/800 MHz 0402
L823 3646007 Chip coil 27 n 5 % Q=27/800 MHz 0402
L830 3643087 Chip coil 180 n 5 % Q=13/50 MHz 0805
L831 3643087 Chip coil 180 n 5 % Q=13/50 MHz 0805
L832 3645 067 Chip coi l 330 n 5 % Q=48/250 MHz 0805
L900 3646065 Chip coil 12 n 5 % Q=31/800 MHz 0402
L901 3646 083 Chip coi l 100 n 5 % Q=16/300 MHz 0402
L902 3646061 Chip coil 15 n 5 % Q=30/800 MHz 0402
L903 3643085 Chip coi l 5 n 1.5 A Q=35 0805
B200 4510219 Crystal 32.768 k +-30PPM 9PF
G780 4350279 Vco 2ghz 2.78v 10.5ma tdma
G790 4510307 VCTCXO 19.44 M 2.5PPM 2.78V
F100 5119019 SM, fuse f 1.5a 32v 0603 1.0 1.000
Z820 4511217 Saw filter 881.5+-12.5 M /3.5DB 3X3
Z830 4511209 Saw filter 135.54+-0.013 M /5.3DB
Z905 4511151 Saw filter 824-849 M /3.8DB 3X3 3X3
Z906 4512143 Dupl 824-849/869-894mhz 9.5x7.5 9.5x7.5
Z907 4550151 Thr c hi p 90 0+ - 100mhz/0. 1DB1.6X1.
T775 4550 153 Trans f b alun 2060 +-70mhz 2.0x1.252. 0x1 . 2 5
V100 4110028 Trans. supr. 16V 23 A 600 W DO214AA
V300 4860231 Led Green 0’SMD2
V301 4860231 Led Green 0’SMD2
V302 4860231 Led Green 0’SMD2
V303 4860231 Led Green 0’SMD2
V304 4860231 Led Green 0’SMD2
V305 4860231 Led Green 0’SMD2
V306 4860231 Led Green 0’SMD2
V307 4860231 Led Green 0’SMD2
V308 4860231 Led Green 0’SMD2
V309 4860231 Led Green 0’SMD2
V350 4210043 Transistor DTC143ZE npn RB V RBE+AD0­V351 4860101 Irm1020 2.7-5.5v 9.6kb-1.152mb/s 9.6KB-1.152MB/S
V725 4110953 Cap. diode 1SV280 SO
V744 4110911 Cap. diode MA2SV01 1/3 V SOD523
D200 4370805 Uem v4.4 w-dog ena to09h tfbga168 TFBGA168
D400 4370811 IC, v2.3 f741809c c05 ubga144 uPP
D450 4341209 IC, flash mem.
N750 4340233 Mrfic0916 rf amp 2500mhz sot143 SOT143
N801 4370777 IC, a807eegt bicmos6mSAFARI+AF8-T2 L
N900 4341179 IC, 900mhz (om5968) tssop10uPCONV
N901 4350311 IC, pow.amp. 3.5 V
N930 4350293 Pwr detector module 800/1900mhz 800/1900MHZ
S300 5209001 SM, sw tact spst 12v 50ma side k KEY

10 % Q=27/250 MHz 0603

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PAMS Technical Documentation Parts List

X900 5429 021 SM, conn rf 100v 1w 50r 2.2ghz
A100 9510612 Baseband shield dmd06548 hda62+afHDA62+AF
A900 9517071 RF shield assy dmc02311 hda62+aHDA62+AF

9854507 PWB WS8 108X40.84X 1.15 M8 4/PA
9854507 Pwb ws8 108x40.84x1.15 m8 4/pa

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Parts List PAMS Technical Documentation

Page 8 ãNokia Corporation Issue 1 10/01

Programmes After Market Services

NPC-1 Series Transceivers

Product Variants

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Product Variants PAMS Technical Documentation

Table of Contents

Page No

Transceiver NPC-1......................................................................................................... 4

Modules and Transceiver Structure .............................................................................4

Assembly Parts of the Basic Transceiver NPC-1 ........................................................6

Assembly Parts of NPC-1NB Product Variants (Nokia Design) .................................8

Assembly Parts of NPC-1NG Product Variants (Gradiente Design) ........................10

Product Variants ........................................................................................................11

Page No

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List of Figures

Page No

Fig 1 Exploded view of Basic Transceiver NPC-1..............................................................5

Fig 2 Exploded view of NPC-1NB product variants (Nokia Design) .................................7

Fig 3 Exploded view of NPC-1NG product variants (Gradiente design)............................9

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Transceiver NPC-1

The NPC-1 transceiver is a TDMA single band (SB), 800 MHz + AMPS hand portable.

NOTE: The Service Manual is intended for use by qualified service pe rsonnel only.

Modules and Transceiver Structure

Custom Transceiver

ATO Transceiver

1A-cover
2Keymat
3 Co-label, if needed
4Type label
5 Software settings

• CSF-file

• SW Language package (PPM)

Basic Transceiver NPC-1 0506131

• RF/System Module 0201800

• Mechanics MNPC1 0262389

• Software SW NPC-1 0242181

The Basic Transceiver NPC-1 consists of the System, Mechanics and Software -modules.
After FINUI testing, the Basic Transceiver is a tested engine. All NPC-1 product variants
are based on the Basic Transceiver.

Note: This is the basic structure of the phone. The Basic Transceiver codes vary

according to the manufacturing site.

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PAMS Technical Documentation Product Variants

Figure 1: Explod ed view of Basic Transc eiver NPC-1

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Assembly Parts of the Basic Transceiver NPC-1

EDMS
CIRCUIT REF./
ITEM Q’TY CODE DESCRIPTION VALUE, TYPE

I001 9480128 C-cover assy (Perlos/Intesys) DMC02910-EN
I002 5140067 Speaker (Philips)
I003 9480570 Speaker gasket (Intesys) DMD06256-EN
I004 4850139 LCD module assy (Seiko) DMC02760-EN
I004 4850139 LCD module assy (Philips) DMC02877-EN
I005 5407797 MG elastomer (Seiko, ShinEtsu) DMD05452-EN
I005 5407803 MG elastomer (Philips, ShinEtsu) DMD06217-EN
I006 9854439 PWB DMD05311-EN
I007 5460043 System connector assy (Molex) SD-91343-003

SD-91343-004

I008 5140201 Microphone assy (Matsuhita/Hoseiden)

DMC02719 &

DMC02720-EN
I009 9490264 D-cover assy SB (Eloteq / Yoo Sung DMC02594-EN
I010 9451702 D-cover (Perlos/Intesys) DMD05560-EN
I011 5140203 Buzzer assy (Star) DMC04025-EN
I012 5409143 Battery connector (Molex) SD-91360-001
I013 6800053 Vibra assy (Namiki) DMC02420-EN
I014 9510566 Release spring (AK Stamping) DMD05608-EN
I015 9451703 IR-window/PWR key (Perlos / Intesys) DMD05562-EN
I016 9510561 Metal Deck (AK Stamping) DMD05244-EN
I017 0660221 Antenna assy SB (Allgon) S39700.1
I018 9451706 Battery latch (Perlos / Intesys) DMD05561-EN
I019 6 6290093 Screws (Camcar/SFS) DMD05615-EN

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Figure 2: Exploded view of NPC-1N B pr odu ct vari ants (Nokia Design)

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Assembly Parts of NPC-1NB Product Variants (Nokia Design)

EDMS
CIRCUIT REF./
ITEM Q’TY CODE DESCRIPTION VALUE, TYPE

I020 A-cover assy DMC03110-EN

9456940 Navy Blue Not painted

9458147 Cingular Techno Blue Not painted
I021 9790444 Keymat assy (Nokia) (ShinEtsu) DMC03128-EN
1021 9790515 Keymat assy (Hebrew) (ShinEtsu) DMC03854-EN
1022 0506165 Basic Transceiver NPW-1(Nokia TMC)
1022 0504959 Basic Transceiver NPW-1(NMP/Alliance)
1022 0506166 Basic Transceiver NPW-1(NMP/Reynosa)
10 23 9370583 T ypelabel (General) DMP04504-EN
1024 0670323 Battery BMC-2 (Americas) DMD05235-EN
1024 0670335 Battery BMC-2 (Brazil) DMD05235-EN
1024 0670324 Battery BMC-3 DMD05236-EN
1024 0670343 Battery BLC-2 DMD05559-EN
I025 9456825 B-cover assy DMC03011-EN

9458148 Cingular Techno Blue Not painted

9456946 Navy Blue Not painted

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Figure 3: Exploded view of NPC-1NG product variants (Gradiente design)

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Assembly Parts of NPC-1NG Product Variants (Gradiente Design)

EDMS
CIRCUIT REF./
ITEM Q’TY CODE DESCRIPTION VALUE, TYPE

I026 A-cover assy (Intesys-Metagal) DMC03110-EN

9497128 Paradise G. Orange Painted

9497129 Orchid G. Purple Painted

9490369 Mica G. Purple Painted

9490370 S erpent G. Green Painted

9490371 Thunder G. Grey Painted

9490396 Waterfall G. Blue Painted

9490260 Navy Blue Not painted
I027 9790474 Keymat (Gradiente) (ShinEtsu) DMC03231-EN
I022 0506065 Basic Transceiver NPC-1(NMP/Manaus)
I023 9370583 Typelabel (Gradiente) DMP05083-EN
I024 0670335 Battery BMC-2 (Brazil) DMD05235-EN
I024 0620285 Battery BMC-3 DMD05236-EN
I024 0670279 Battery BLC-2 DMD05559-EN
I028 9456825 B-cover assy (Intesys-Metagal) DMC03472-EN

9490373 Paradise G. Orange Painted

9490374 Orchid G. Purple Painted

9490375 Mica G. Purple Painted

9490376 Serpent G. Green Painted

9490377 Thunder G. Grey Painted

9490395 Waterfall G. Blue Painted

9496959 Navy Blue Not painted

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Product Variants

Some of the existing custom 3320 transceiver variants are listed below:

1 0503270 Nokia default english transceiver
2 0506315 Nokia default spanish transceiver
3 0505859 Bellsouth Chile transceiver
4 0505860 Bellsouth peru Subsidy lock transceiver
5 0506325 Central America and Caribbean Spanish LTA with subsidy lock trans-

ceiver
6 0506304 Russia transceiver
7 0505858 Telcel Mexico transceiver
8 0505861 Chile Telefonica transceiver

Some of the existing customer 3320 Brazilian transceiver variants are listed below:

1 0505802 Nokia do Brasil default transceiver
2 0503269 Gradiente transceiver
3 0506179 Telemig (Telesystem wireless) transceiver
4 0506180 Amazonia (Telesystem wireless) transceiver
5 0506181 ATL (Algar) transceiver
6 0506182 TESS (Telia) transceiver
7 0506183 BCP (Bellsouth) transceiver
8 0506185 Maxitel (Telecom Italia) transceiver

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Programmes After Market Services

NPC-1 Series Transceivers

Service Software Instructions

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NPC-1

Service Software Instructions PAMS Technical Documentation

Table of Contents

Page No

Phoenix........................................................................................................................... 3

Introduction ..................................................................................................................3

Setting up Phoenix .......................................................................................................3

HW requirements for using Phoenix ...........................................................................3

Installing Phoenix ........................................................................................................4

Uninstalling Phoenix ...................................................................................................4

Data Packages ..............................................................................................................5

Starting a session .........................................................................................................5

Concepts.................................................................................................................... 5

Selecting a connection............................................................................................... 5

Selecting a product.................................................................................................... 5

Phoenix environment................................................................................................. 6

Using components..................................................................................................... 6

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PAMS Technical Documentation Service Software Instructions

Phoenix

Introduction

This section briefly describes how to install the Phoenix software and includes some
basic information on how to use the program. For more detailed information, please refer
to the Phoenix’s Help -files. Each feature in Phoenix has its own Help function, which
can be activated while running the program.

Press the F1 key or the feature's Help-button to activate a Help -file.

Setting up Phoenix

1 Download the latest release. Please contact your regiona l After Market Services

point for information on where to download the latest release.

Download and read the release notes, whic h will have useful information on the

software version you are using.
2 Install Phoenix by executing the phoenix installation package and follow the

instructions on the screen.

Note: In some products the setup may require you to reboot the computer. In

either case, the setup will register Phoenix components. This process
can take several minutes.

3 Download the latest data packages for the products you will be using.

By default, the program files are stored under C:\Program Files\Nokia\Phoenix

The Phoenix program has been built using component architecture. This mea ns
that the actual program is very small and most of the program’s f unctionality i s
divided into dynamically loaded modules (DLLs).

The data packages will create product spe cific directories under the insta llation
directory.

HW requirements for using Phoenix

Table 1: HW requirements for AMS

Minimum HW requirements for AMS
Processor 233 Mhz
RAM 64 MB
Needed disk space 50 - 100 MB

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Table 2: Recommended HW for Windows 2000

Recommended HW for Windows 2000
Processor 700 Mhz
RAM 512 MB
Needed disk space 50 - 100 MB

Table 3: Supported Operating Systems

Supported Operating Systems
Windows 95
Windows 98
Windows NT 4.0
Windows 2000

Installing Phoenix

1 Before you start installing the program, check that

• the dongle is attache d to the parallel port. Contact your supervisor in order to
obtain a suitable dongle.

• you have administrator rights (Windows NT or Windows 2000). This is required
in order to be able to install Phoenix.

2 The installation checks that the latest supported dongle driver version is

installed. The dongle driver is installed if there is no previous installa tion of the
dongle driver or if the installed dongle driver is older than the latest supported
version.

3 Reboot your PC before using Phoenix, if you are requested to do so.

Uninstalling Phoenix

Uninstalling another Phoenix version

1 Make sure that the dongle is attached.
2 Go to the Control Panel and select Add/Remove Programs.
3Select TSS4 Phoenix Release xx.yy .zzz for uninstallation and click Add/Remove.
4Click OK to remove the application

You may be required to reboot your PC after uninstallation.

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Note: If you have different product packages installed, the components are unin-

stalled only if they are not included in other product packages.

Data Packages

Data Packages (DP) is a name for a helpful feature in the Phoenix software. This type of
feature provides a flexible way of distributing and installing Phoenix and its data files.

All product-specific data is separated from the pr ogram code and installed separately.
This means that the installation is performed in at least two steps.

Each product will have its own DP. The FPS-8 flashing equipment also has its own pack­age.

Starting a session

Concepts

In the Phoenix context, Product means the cellular phone attached to a PC. More specif­ically, it is a particular type of phone.

Connection means the type of cable used to attach the phone to the port to which the
other end of the cable is attached.

Selecting a connection

The connection defines the cable and the comm unications port that will be used when
connecting to the phone.

1 Active connections are l isted in the toolbar’s Connection pull-down menu. You

should make sure that the connection is correct before using the software.
Change it, if necessary.

In case the connection is the wrong one, you need to create a new one.
2Select Settings from the pull-down menu.
3Select Add in the Connection List Dialog and in fill the relevant fields in the Con-

nection setup dialog.

Selecting a product

Many of Phoenix’s features are product-specific. It is, therefore, mandatory to choose the
product you will be working on at the beginning of the session.

1Select File - Scan Product (or hold the Ctrl key down and press R). Phoenix will

scan the connected product and load additional menus which ar e designed for
the product. If the product is not supported then an error message will be dis­played and a different Phoenix data package may be required.

2 If you want to manually choose the product or if the phone is dead , select File -

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Choose Product. You will be presented with a list of available products.

After the product selection, you will see an addit ional menu item on the main
menu. If you take a look at the available menu items, you will see that their num­ber has increased.

Phoenix environment

You can configure the program’s main toolbar and the product or t ool -specific options
to your liking.

You can control which toolbars are visible by selecting View and Toolbars from the pull­down menu. The visible toolbars are marked with a check.

The rest of the options are product or tool -specific. The tool-specific options are set
using the associated toolbar.

Using components

When working with Phoenix, each task gene rally has its own component that will per ­form the task. The first thing, therefore, is to open the desired component.

Opening a component means that you open a tool window within Phoenix.

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Programmes After Market Services

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Service T ools

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Service Tools PAMS Technical Documentation

Table of Contents

Page No

Module Jig (MJS-18, 0770299) ...................................................................................5

Product Code............................................................................................................. 5

POS Dongle (FLS-4, 0774263) ...................................................................................6

Product Code............................................................................................................. 6

FPS-8 Flash Prommer for heavy flash (0080321, sales pack) .....................................7

Product Code............................................................................................................. 7

FPS-8C Flash Prommer for heavy parallel flash (0080396) .......................................8

Product Code............................................................................................................. 8

Docking Station (JBV-1, 0770298) and Docking Station Adapter (MJF-2, 0770300) 9

Product Code............................................................................................................. 9

Galvanic Contact (GAC-1, 0770301) ........................................................................10

Product Code........................................................................................................... 10

Coupler (CPL-1, 0770287) ........................................................................................11

Product Code........................................................................................................... 11

Audio box (JBA-8, 0770320) ....................................................................................12

Product Code........................................................................................................... 12

Audio Cable (ADS-4, 0730222) ................................................................................13

Product Code........................................................................................................... 13

Mbus/Fbus Cable (XCS-4, 0730178) ........................................................................14

Product Code........................................................................................................... 14

Flash Adapter (FLA-13, 0770297).......................................................................... 15

Product Code........................................................................................................... 15

Soldering Jig (MJS-27, 0775287) ..............................................................................16

Product Code........................................................................................................... 16

Printer Cable (AXP-8, 073F000) ...............................................................................17

Product Code........................................................................................................... 17

D9-D9 Cable (AXS-4, 0730090) ...............................................................................18

Product Code........................................................................................................... 18

Audio Cable (ADS-3, 0730197) ................................................................................19

Product Code........................................................................................................... 19

DC Cable (SCB-3, 0730114) .....................................................................................20

Product Code........................................................................................................... 20

MBUS Cable (DAU-9S, 0730108) ............................................................................21

Product Code........................................................................................................... 21

Power Cable (PCS-1, 0730012) .................................................................................22

Product Code........................................................................................................... 22

RF Cable (XRF-1, 0730085) .....................................................................................23

Product Code........................................................................................................... 23

Service Cable (XCS-4, 0730178) ..............................................................................24

Product Code........................................................................................................... 24

Power Pack, (DDC-10, 0670405) ..............................................................................25

SW Security Device (PKD-1, 0750018) ....................................................................26

Product Code........................................................................................................... 26

Flashing and Testing Setups ........................................................................................ 27

POS flash (FLS-4, 0081482 - Setup 1) ......................................................................27

Product Code........................................................................................................... 27

Flashing, testing and tuning with covers on (Setups 2a, 2b and 2c) ..........................28

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Service tool setup 2a ............................................................................................... 29

Service tool setup 2b............................................................................................... 29

Service tool setup 2c ............................................................................................... 30

Flashing and testing with covers off (Setup 3) ..........................................................31

Parallel Flash (Setup 4) ..............................................................................................32

Service tool setup 4................................................................................................. 32

Warranty and user data transfer (Setup 5) .................................................................33

Service tool setup 5:................................................................................................ 33

Page No

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List of Figures

Page No

Fig 1 View of Module Jig MJS-18 ......................................................................................5

Fig 2 View of POS Dongle, FLS-4......................................................................................6

Fig 3 View of Flash Prommer for heavy flash, FPS-8.........................................................7

Fig 4 View of Flash Prommer for heavy parallel flashing ..................................................8

Fig 5 View of Docking Station, JBV-1................................................................................9

Fig 6 Docking station and docking station adapter..............................................................9

Fig 7 View of Galvanic Contact, GAC-1 ............................................................................10

Fig 8 View of Coupler, CPL-1.............................................................................................11

Fig 9 View of Audio Box, JBA-8........................................................................................12

Fig 10 View of Audio Cable, ADS-4).................................................................................13

Fig 11 View of Mbus/Fbus Cable, XCS-4...........................................................................14

Fig 12 View of Flash Adapter, FLA-13...............................................................................15

Fig 13 View of Soldering Jig, MJS-27................................................................................16

Fig 14 View of Printer Cable, AXP-8..................................................................................17

Fig 15 View of D9-D9 Cable AXS-4 ..................................................................................18

Fig 16 View of Audio Cable ADS-3 ..................................................................................19

Fig 17 View of DC Cable SCB-3 ........................................................................................20

Fig 18 View of MBUS Cable DAU-9S ...............................................................................21

Fig 19 View of Power Cable PCS-1....................................................................................22

Fig 20 View of RF Cable XRF-1.........................................................................................23

Fig 21 View of Service Cable XMS-3.................................................................................24

Fig 22 DDC-10 Power Pack ................................................................................................25

Fig 23 View of Power Pack, DDC-10 .................................................................................25

Fig 24 View of SW Security Device PKD-1.......................................................................26

Fig 25 View of POS flash....................................................................................................27

Fig 26 Service tool setup 2a.................................................................................................29

Fig 27 Service tool setup 2b ................................................................................................29

Fig 28 Service tool setup 2c.................................................................................................30

Fig 29 Service tool setup 3 ..................................................................................................31

Fig 30 Service tool setup 4 ..................................................................................................32

Fig 31 Service tool setup 5 .................................................................................................33

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Module Jig (MJS-18, 0770299)

This jig allows phone PWB -level service and troubleshooting.
Electric circuits have to be protected against over-voltage and over-current.

Product Code

MJS-18: 0770299

Figure 1: View of Module Jig MJS-18

Table 1: Spare parts for MJS-18

Item Description Type Designation Code Supplier

1 Fuse T2A 5x20
2 Test prope GSS-19-3.9-G 540A007 IDI
3 Test probe GKS079 301050A1300 54OY001 INGUN
4 RF probe HRC2901-0 2100 2 978F005 SMK
5 System Connector

Assembly

5460043 Molex

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POS Dongle (FLS-4, 0774263)

The POS flash concept needs the Flash Adapter and cable between the phone and the
FLS-4.

Product Code

FLS-4: 0774263

Figure 2: View of POS Dongle, FLS-4

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FPS-8 Flash Prommer for heavy flash (0080321, sales pack)

The FPS-8 flash prommer is used for heavy flashing.

Product Code

FPS-8: 0080321

Figure 3: View of Flash Prommer for heavy flash, FPS-8

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FPS-8C Flash Prommer for heavy parallel flash (0080396)

The FPS-8C Flash Prommer is used for heavy parallel flashing.

Product Code

FPS-8C: 0080396

Figure 4: View of Flash Prommer for heavy parallel flashing

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Docking Station (JBV-1, 0770298) and Docking Station Adapter (MJF-2,

0770300)

The Docking Station and Docking Station Adapter are needed for Mbus, Fbus, RF and
Audio connections. This setup allows a connection be tween flash prommers. When the
audio box is connected, it has to be connected to the phone’s audio connector. The Dock­ing Station can be powered by the FPS-8 or an external power supply.

Product Code

JBV-1: 0770298

MJF-2: 0770300
Spare parts for MJF-2 test pin: 540Y207 (test probe code)

Figure 5: View of Docking Station, JBV-1

Figure 6: Docking station and docking station adapter

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Galvanic Contact (GAC-1, 0770301)

The GAC-1 adapter is needed for the RF conne ction. The GAC-1 adapter makes galvanic
connections to assembled handset RF-switches p ossible. Via this ad apter, the handset is
connected to the RF measuring and test equipment.

Note: Unnecessary usage of the handset’s RF-switch must be avoided.

Product Code

GAC-1: 0770301

Figure 7: View of Galvan ic Contact, GAC-1

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