Nokia 3205 Service Manual 12rm11sys

CC Technical Documentation

RM-11 Series Transceivers

System Module

RM-11 System Module CC Technical Document atio n

Contents Page

Introduction.................................................................................................................... 4

BB Hardware Characteristics ......................................................................................4

Technical Summary .....................................................................................................5

Functional Description .................................................................................................5

Modes of Operation................................................................................................... 5

RM-11 BB Functional Blocks .....................................................................................7

UEM and UPP........................................................................................................... 8

Battery....................................................................................................................... 9

Charger Detection ................................................................................................... 11

Charger Interface Protection ................................................................................... 12

LED Driver Circuit.................................................................................................. 12

LCD Display ........................................................................................................... 13

RF Interface Block .................................................................................................. 14

Combo Memory Module......................................................................................... 14

Combo Memory Interface....................................................................................... 14

SRAM Memory Description................................................................................... 14

Flash Memory Description...................................................................................... 15

Flash Architecture................................................................................................... 15

Keyboard (UI Module)............................................................................................ 15

Keyboard ESD Protection....................................................................................... 15

Internal Audio ......................................................................................................... 16

External Audio Connector....................................................................................... 17

External Microphone Connection ........................................................................... 18

External Earphone Connection................................................................................ 18

IrDa Interface .......................................................................................................... 19

Vibra........................................................................................................................ 19

FM Radio................................................................................................................. 19

Camera .................................................................................................................... 20

Flashlight................................................................................................................. 20

System Connector (Tomahawk).............................................................................. 21

PWB Strategy ............................................................................................................22

PWB Construction................................................................................................... 22

PWB Immunity ....................................................................................................... 22

Keyboard................................................................................................................. 23

Audio Lines............................................................................................................. 23

Microphone Lines ................................................................................................... 23

EAR Lines............................................................................................................... 23

Charger Lines.......................................................................................................... 23

HEADINT............................................................................................................... 23

Battery Supply Filtering.......................................................................................... 23

System Connector ................................................................................................... 24

Mechanical Shielding.............................................................................................. 24

EMC Strategy ............................................................................................................24

Test Interfaces ............................................................................................................25

Production / After Sales Interface........................................................................... 25

Flash Interface......................................................................................................... 25

FBUS Interface........................................................................................................ 25

RM-11

CC Technical Documentation System Module

BB_RF Interface Connections ...................................................................................26

RF Functional Description .........................................................................................28

Circuit Diagrams and PWB Layout ........................................................................ 28

Receiver................................................................................................................... 28

Frequency Synthesizers........................................................................................... 29

Transmitter.............................................................................................................. 29

Antenna ................................................................................................................... 32

Software Compensations ...........................................................................................32

RF Frequency Plan.................................................................................................. 33

RM-11 System Module CC Technical Document atio n

Introduction

This chapter describes the system module for the RM-11 transceiver.

The baseband module includes the baseband engine chipset, the UI components, and the acoustic components. The RM-11 is a hand-portable, dual-band CDMA 800/1900 with AMPS. It has been designed using a DCT4 generation baseband (UEM/UPP) and RF module. RM-11 includes a template cutter and user-customizable template front and back covers. Other features include an integrated VGA camera, an IR, and a built-in flashlight.

The phone requires the BLD-3 battery with a nominal capacity of 780 mAh.

VGA

Figure 1: Interconnection diagram

BB Hardware Characteristics

Following are characteristics for the BB hardware:

• Hi-resolution (128x128 pixel) illuminated color display

• Active LCD pixel area: width 27.6mm X height 27.6mm

• ESD-proof keymat, with five individual keys for multiple key pressing

• Support for internal semi-fixed battery (Janette type BLD-3)

• Audio amplifier and SALT speaker for MIDI support

• Ringing volume 100dB @ 5cm (MIDI tones through SALT speaker)

• Stereo FM receiver as an accessory

• IrDa port/interface

• Internal vibra

• Supports voice dial activation via headset button

• Six white LEDs for the keymat on the UI board, and two for the LCD backlight in the LCD module

• Six-layer PWB, SMD with components on both sides of the PWB

RM-11

CC Technical Documentation System Module

Technical Summary

The baseband module is implemented using two main ASICs — the Universal Energy Management (UEM) and the Universal Phone Processor (UPP). The baseband module also contains an audio amplifier for MIDI support and a 128-Mbit Flash/ 8-Mbit SRAM combo IC. EMC shielding is implemented using a metallized plastic frame. On the other side, the engine is shielded with PWB ground openings. Heat generated by the circuitry is conducted out via the PWB ground planes. The RM-11 transceiver module is implemented on a 6-layer, FR-4 material PWB.

Functional Description

Modes of Operation

The RM-11 baseband engine has five different operating modes:

• No supply

• Acting dead

•Active

•Sleep

• Charging

No Supply Mode

In NO_SUPPLY mode, the phone has no supply voltage. This mode is due to the disconnection of the main battery or a low battery voltage level. The phone exits from NO_SUPPLY mode when a sufficient battery voltage level is detected. The battery voltage can rise either by connecting a new battery with VBAT > VMSTR+, or by connecting a charger and charging the battery voltage to above VMSTR+.

Acting Dead Mode

If the phone is powered off when the charger is connected, the phone is powered on and enters a state called Acting Dead. In this mode, no RF circuitry is powered up. To the user, the phone acts as if it is switched off. The phone issues a battery-charging alert and/or shows a battery charging indication on the display to acknowledge to the user that the battery is charging.

Active Mode

In active mode, the phone is in normal operation, scanning for channels, listening to a base station, transmitting, and processing information. There are several sub-states in the active mode depending on if the phone is in burst reception, burst transmission, etc. SW controls the RF regulators by writing the correct values into the UEM control registers. VR1A/B and VR2 can be enabled or disabled. VR4 - VR7 can be enabled, disabled, or forced into low quiescent current mode. VR3 is always enabled in active mode.

RM-11 System Module CC Technical Document atio n

Sleep Mode

The phone enters Sleep mode when both the MCU and the DSP are in stand-by mode. Both processors control sleep. When the SLEEPX low signal is detected, the UEM enters Sleep mode. In this mode, the VCORE, VIO and VFLASH1 regulators are put into low quiescent current mode. All RF regulators — with the exception of VR2 and VR3 — are disabled in sleep mode. When the SLEEPX is set high and is detected by the UEM, the phone enters Active mode and all functions are activated. Sleep mode is exited either by the expiration of a sleep clock counter in the UEM, or by some external interrupt generated by a charger connection, key press, headset connection, etc. While in Sleep mode, the main oscillator is shut down and the baseband section uses the 32 kHz sleep clock oscillator as its reference.

Charging Mode

Charging can be performed in parallel with any other operating mode. The Battery Size Indicator (BSI) resistor inside the battery pack indicates the battery type/size. The resistor value corresponds to a specific battery capacity and technology. Under UPP software control, the UEM's AD converters measure the battery voltage, temperature, size, and current. The charging control circuitry (CHACON) inside the UEM controls the charging current delivered from the charger to the battery. The battery voltage rise is limited by turning the UEM switch off when the battery voltage has reached VBATLim (programmable charging cut-off limits are 3.6V, 5.0V, 5.25V). Measuring the voltage drop across a 0.22 Ohm resistor monitors the charging current.

RM-11

CC Technical Documentation System Module

RM-11 BB Functional Blocks

Passive color STN 4096 colors

128/8 Mbit

UEMK

VGA

Figure 2: Baseband block assembly

RM-11 BB functional blocks are listed below:

• UEM and UPP

• Battery

•LED driver

•LCD display

• RF IF block

• Memory module

• Keyboard (UI module)

• External audio connector

•IrDa interface

•Vibra

•FM radio

• System connector (Tomahawk)

• PWB strategy

RM-11 System Module CC Technical Documentation

•EMC strategy

• Test interface

UEM and UPP

The UEM contains a series of voltage regulators to supply both the baseband module and the RF module. Both the RF and baseband modules are supplied with regulated voltages of 2.78 V and 1.8 V. The UEM contains six linear LDO (low drop-out) regulators for the baseband and seven regulators for RF circuitry. The RF regulator VR1 uses two LDOs and a charge pump. The VR1 regulator is used by the RF module. The core of the UPP is supplied with a programmable voltage of 1.0 V, 1.3 V, 1.5 V, or 1.8 V. Note that with the UEMK, VCORE supply voltage is set to 1.5 V.

The UPP operates from a 19.2 MHz clock generated in the RF ASIC. The DSP and MCU both contain phase locked loop (PLL) clock multipliers, which can multiply the system frequency by factors from 0.25 to 31. The actual execution speed is limited by the memory configuration and process size (Max. DSP speed for C035 is ~ 200MHz).

The UEM contains a real-time clock, sliced down from the 32768 Hz crystal oscillator. The UPP uses the 32768 Hz clock as the sleep clock.

The communication between the UEM and the UPP is done via the bi-directional serial busses, CBUS and DBUS. The CBUS is controlled by the MCU and operates at a speed of

1.08 MHz. The DBUS is controlled by the DSP and operates at a speed of 9.6 MHz. Both processors are located in the UPP.

The interface between baseband and RF is implemented in the UEM and UPP ASIC. The UEM provides A/D and D/A conversion of the in-phase and quadrature receive and transmit signal paths. It also provides A/D and D/A conversions of received and transmitted audio signals to and from the user interface. The UEM supplies the analog signals to the RF section according to the UPP DSP digital control. The RF ASIC is controlled via the UPP RFBUS serial interface. There are also separate signals for PDM-coded audio. Digital speech processing is handled by the DSP inside the UPP ASIC. The UEM is a dual voltage circuit with the digital parts running from the baseband supply (1.8 V) and the analog parts running from the analog supply of 2.78 V. The input battery voltage (VBAT) is also used directly by some UEM blocks.

The baseband supports both internal and external microphone inputs as well as speaker outputs. Input and output signal source selection and gain control are done by the UEM according to control messages from the UPP. Keypad tones, DTMF, and other audio tones are generated and encoded by the UPP and transmitted to the UEM for decoding. The RM-11 has two external serial control interfaces: FBUS and MBUS provided by the UEM. These busses can be accessed only through production test patterns. RM-11 also uses the UPP8MV3 and UEMK.

RM-11

CC Technical Documentation System Module

Battery

BLD-3 Li-ion (inbox battery) is used as the main power source. The BLD-3 has a capacity of 780 mAh.

Table 1: BLD-3 characteristics

Description Value

Nominal discharge cut-off voltage 3.1V

Nominal battery voltage 3.7V

Nominal charging voltage 4.2V

Maximum charger output current 850mA

Minimum charger output current 200mA

Cell pack impedance -20 ... 0

Cell pack impedance 0 ... +20

Cell pack impedance +20 ...+60

Cell pack impedance +60 ...+80

Table 2: Pin numbering of battery pack

180mΩ max

150mΩ max

130mΩ max

250mΩ max

Signal name Pin number Function

VBAT 1 Positive battery terminal

BSI 2 Battery capacity measurement (fixed resistor inside the

battery pack)

BTEMP 3 Battery temperature measurement (measured by ntc

resistor inside pack)

GND 4 Negative/common battery terminal

2(BSI) 3(BTEMP) 4(GND)

Figure 3: Battery pack contacts

Charge GND

The BSI fixed resistor value indicates the type and default capacity of a battery. The NTC-resistor measures the battery temperature.

RM-11 System Module CC Technical Documentation

Temperature and capacity information is needed for charge control. These resistors are connected to the BSI and BTEMP pins of the battery connector. The phone has 100 kW pull-up resistors for these lines so that they can be read by A/D inputs in the phone. For safety reasons, the phone software will shut the phone off if it senses a temperature of

38oC or higher on the BTEMP line.

Table 3: BSI resistor values

Parameter Min Typ Max Unit Notes

Battery size indicator resistor BSI 75 kΩ Battery size indicator (BLD-3)

Tolerance “1%

NTC thermistor BTEMP 47

VBATT

BSI

BTEMP

EMC

Figure 4: Interconnection diagram

Supply Voltage Regulation

The UEM ASIC controls supply voltage regulation. There are six separate regulators used by the baseband block. For a more detailed description about the regulator parameters, see the UEM ASIC Specification document.

4000

kΩ

Overcharge / Overdischarge protection

Battery temperature indicator (NTC pulldown) 47kΩ“5%

@ 25

Beta value (B). Tolerance “5%, 25

Li-Ion

C / 85 oC

Charging

The RM-11 baseband supports the NMP charger interface specified in the Janette

Charger Interface document. SW control is specified in the EM SW Specification, ISA EM Core SW Project document. The UEM ASIC controls charging, and external components

are used to provide EMC, reverse polarity, and transient protection of the charger input to the baseband module. The charger connection is through the system connector interface. Both 2- and 3-wire type chargers are supported. The operation of the charging circuit has been specified to limit the power dissipation across the charge switch and to ensure safe operation in all modes.

RM-11

CC Technical Documentation System Module

UEM

CHAR

VCHARin

Over Temp. Detection

WatchDog

Switch Driver

Current Ctrl Logic

Figure 5: UEM charging circuitry

Sensing/

Limit

Comp

VCHARout

Vmstr

VBATT

VBATTlim

VBATT

Charger Detection

Connecting a charger creates voltage on the VCHAR input to the UEM. When the VCHAR input voltage level rises above the VCHDET+ threshold, the UEM starts the charging process. The VCHARDET signal is generated to indicate the presence of the charger for the SW.

Energy Management (EM) SW controls the charger identification and acceptance. The charger recognition is initiated when the EM SW receives a "charger connected" interrupt. The algorithm basically consists of the following three steps:

1. Check that the charger output (voltage and current) is within safety limits.

2. Identify the charger.

3. Check that the charger is within the charger window.

If the charger is identified and accepted, the appropriate charging algorithm is initiated.

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