Nokia 2608, RM-376 Service Manual

Page 1
Nokia Customer Care
Service Manual
RM-376 (Nokia 2608)
Mobile Terminal
Part No: (Issue 1)
Copyright © 2008 Nokia Corporation. All rights reserved.
Page 2

Amendment Record Sheet

Amendment Record Sheet
Amendment No Date Inserted By Comments
Issue 1 06/2008 Shelly Wang 09/2008 Shelly Wang update
RM-376
Page II Company Confidential Issue1
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Page 3
RM-376 Copyright

Copyright

Copyright © 2008 Nokia. All rights reserved. Reproduction, transfer, distribution or storage of part or all of the contents in this document in any form without the prior written permission of Nokia is prohibited. Nokia, Nokia Connecting People, and Nokia X and Y are trademarks or registered trademarks of Nokia Corporation. Other product and company names mentioned herein may be trademarks or tradenames of their respective owners. Nokia operates a policy of continuous development. Nokia reserves the right to make changes and improvements to any of the products described in this document without prior notice. Under no circumstances shall Nokia be responsible for any loss of data or income or any special, incidental, consequential or indirect damages howsoever caused. The contents of this document are provided "as is". Except as required by applicable law, no warranties of any kind, either express or implied, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose, are made in relation to the accuracy, reliability or contents of this document. Nokia reserves the right to revise this document or withdraw it at any time without prior notice. The availability of particular products may vary by region.
IMPORTANT
This document is intended for use by qualified service personnel only.
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Page 4
RM-376

Warnings and cautions

Warnings and cautions
Warnings
z IF THE DEVICE CAN BE INSTALLED IN A VEHICLE, CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES FITTED
WITH ELECTRONIC ENGINE MANAGEMENT SYSTEMS AND ANTI-SKID BRAKING SYSTEMS. UNDER CERTAIN FAULT CONDITIONS, EMITTED RF ENERGY CAN AFFECT THEIR OPERATION. IF NECESSARY, CONSULT THE VEHICLE DEALER/ MANUFACTURER TO DETERMINE THE IMMUNITY OF VEHICLE ELECTRONIC SYSTEMS TO RF ENERGY.
z THE PRODUCT MUST NOT BE OPERATED IN AREAS LIKELY TO CONTAIN POTENTIALLY EXPLOSIVE ATMOSPHERES,
FOR EXAMPLE, PETROL STATIONS (SERVICE STATIONS), BLASTING AREAS ETC.
z OPERATION OF ANY RADIO TRANSMITTING EQUIPMENT, INCLUDING CELLULAR TELEPHONES, MAY INTERFERE
WITH THE FUNCTIONALITY OF INADEQUATELY PROTECTED MEDICAL DEVICES. CONSULT A PHYSICIAN OR THE MANUFACTURER OF THE MEDICAL DEVICE IF YOU HAVE ANY QUESTIONS. OTHER ELECTRONIC EQUIPMENT MAY ALSO BE SUBJECT TO INTERFERENCE.
z BEFORE MAKING ANY TEST CONNECTIONS, MAKE SURE YOU HAVE SWITCHED OFF ALL EQUIPMENT.
Cautions
z Servicing and alignment must be undertaken by qualified personnel only. z Ensure all work is carried out at an anti-static workstation and that an anti-static wrist strap is worn. z Ensure solder, wire, or foreign matter does not enter the telephone as damage may result. z Use only approved components as specified in the parts list. z Ensure all components, modules, screws and insulators are correctly re-fitted after servicing and alignment. z Ensure all cables and wires are repositioned correctly. z Never test a mobile phone WCDMA transmitter with full Tx power, if there is no possibility to perform the
measurements in a good performance RF-shielded room. Even low power WCDMA transmitters may disturb nearby WCDMA networks and cause problems to 3G cellular phone communication in a wide area.
z During testing never activate the GSM or WCDMA transmitter without a proper antenna load, otherwise GSM
or WCDMA PA may be damaged.
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Page 5
RM-376 ESD protection

ESD protection

Nokia requires that service points have sufficient ESD protection (against static electricity) when servicing the phone. Any product of which the covers are removed must be handled with ESD protection. The SIM card can be replaced without ESD protection if the product is otherwise ready for use. To replace the covers ESD protection must be applied. All electronic parts of the product are susceptible to ESD. Resistors, too, can be damaged by static electricity discharge. All ESD sensitive parts must be packed in metallized protective bags during shipping and handling outside any ESD Protected Area (EPA). Every repair action involving opening the product or handling the product components must be done under ESD protection. ESD protected spare part packages MUST NOT be opened/closed out of an ESD Protected Area. For more information and local requirements about ESD protection and ESD Protected Area, contact your local Nokia After Market Services representative.
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Page 6
RM-376

Care and maintenance

Care and maintenance
This product is of superior design and craftsmanship and should be treated with care. The suggestions below will help you to fulfill any warranty obligations and to enjoy this product for many years.
z Keep the phone and all its parts and accessories out of the reach of small children. z Keep the phone dry. Precipitation, humidity and all types of liquids or moisture can contain minerals that will
corrode electronic circuits.
z Do not use or store the phone in dusty, dirty areas. Its moving parts can be damaged. z Do not store the phone in hot areas. High temperatures can shorten the life of electronic devices, damage
batteries, and warp or melt certain plastics.
z Do not store the phone in cold areas. When it warms up (to its normal temperature), moisture can form
inside, which may damage electronic circuit boards.
z Do not drop, knock or shake the phone. Rough handling can break internal circuit boards. z Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the phone. z Do not paint the phone. Paint can clog the moving parts and prevent proper operation. z Use only the supplied or an approved replacement antenna. Unauthorised antennas, modifications or
attachments could damage the phone and may violate regulations governing radio devices.
All of the above suggestions apply equally to the product, battery, charger or any accessory.
Page VI Company Confidential Issue1
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Page 7
RM-376 Company Policy

Company Policy

Our policy is of continuous development; details of all technical modifications will be included with service bulletins. While every endeavour has been made to ensure the accuracy of this document, some errors may exist. If any errors are found by the reader, NOKIA MOBILE PHONES Business Group should be notified in writing/email. Please state:
z Title of the Document + Issue Number/Date of publication z Latest Amendment Number (if applicable) z Page(s) and/or Figure(s) in error
Please send to:
NOKIA CORPORATION Nokia Mobile Phones Business Group Nokia Customer Care PO Box 86 FIN-24101 SALO Finland E-mail: Service.Manuals@nokia.com
Issue1 Company Confidential Page VII
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Page 8
RM-376

Battery information

Battery information
Note: A new battery's full performance is achieved only after two or three complete charge and
discharge cycles! The battery can be charged and discharged hundreds of times but it will eventually wear out. When the operating time (talk-time and standby time) is noticeably shorter than normal, it is time to buy a new battery. Use only batteries approved by the phone manufacturer and recharge the battery only with the chargers approved by the manufacturer. Unplug the charger when not in use. Do not leave the battery connected to a charger for longer than a week, since overcharging may shorten its lifetime. If left unused a fully charged battery will discharge itself over time. Temperature extremes can affect the ability of your battery to charge. For good operation times with Li-Ion batteries, discharge the battery from time to time by leaving the product switched on until it turns itself off (or by using the battery discharge facility of any approved accessory available for the product). Do not attempt to discharge the battery by any other means. Use the battery only for its intended purpose. Never use any charger or battery which is damaged. Do not short-circuit the battery. Accidental short-circuiting can occur when a metallic object (coin, clip or pen) causes direct connection of the + and - terminals of the battery (metal strips on the battery) for example when you carry a spare battery in your pocket or purse. Short-circuiting the terminals may damage the battery or the connecting object. Leaving the battery in hot or cold places, such as in a closed car in summer or winter conditions, will reduce the capacity and lifetime of the battery. Always try to keep the battery between 15°C and 25°C (59°F and 77° F). A phone with a hot or cold battery may temporarily not work, even when the battery is fully charged. Batteries' performance is particularly limited in temperatures well below freezing. Do not dispose of batteries in a fire! Dispose of batteries according to local regulations (e.g. recycling). Do not dispose as household waste.
Page VIII Company Confidential Issue1
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RM-376 Nokia 2608 Service Manual Structure

Nokia 2608 Service Manual Structure

1 General Information 2 Service Tools and Service Concepts 3 Baseband Troubleshooting 4 RF troubleshooting 5 System Module and User Interface 6 Glossary
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RM-376
Nokia 2608 Service Manual Structure
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Nokia Customer Care

1- General Information

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RM-376
General Information
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RM-376 General Information
Table of Contents
Product features and sales packages.................................................................................................................................................. 1-5
Mobile Enhancement...................................................................................................................................................................................... 1-6
Technical specifications .................................................................................................................................................................................1-6
Transceiver general specifications .................................................................................................................................... 1-6
Main RF characteristics for CDMA2000 Cell band 800.......................................................................................... 1-6
Battery endurance .......................................................................................................................................................................1-7
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RM-376
General Information
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RM-376 General Information

Product features and sales packages

Hardware features
z 800MHz, IS95, CDMA2000 1xRTT z Internal RF antenna z Internal vibrating alert z Internal hands free/music stereo speaker z Speech codes: QCELP and EVRC, z Micro USB charger
Display and keys
z Main display in 1.8”/128 x 160 pixel with 262K colors z Keys: 4-way navigation key, Menu/OK key (center select), send &end key, browser key (long-press ‘0’ key),
power key, soft keys
Connectivity
z Micro USB 1.1 Full Speed
Software features
z Operating system: Real-Time Executive (REX) Operating System z UI style: custom UI with Douglas 5 reference. z HTTP 1.1 z WAP2.0 browsing (OMA Download server access through WAP Gateway. Also must support OMA DRM) z BREW 3.1.5 z Show GIF, JPG and PNG image z Voice Memo recording supported time at least 90 seconds z 64 polyphonic ring chords and 25 pre-loaded ring tones. Support for MIDI,MP3, AAC, AAC+ and QCELP is
required
z Calendar, alarm clock, calculator, stopwatch, world clock, count timer, to-do list, timers, key guard and
notes/memo pad
z 3 pre-loaded themes (1 configurable carrier branded theme, 1 Nokia theme and 1 generic theme) and 10
pre-loaded wallpapers
z Downloadable ringtones and wallpapers via BREW z SDK for 3
rd
party application development for BREW
Memory
z Internal memory (1.5MB) z No external memory
Sales package
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RM-376
General Information
z Gift box z Box insert (if applicable, may change due to box size): standard battery, travel charger, product literature, user
guide, quick start guide, warranty information and carrier specific literature
z ATO items: engine, A-cover, key mat and battery cover

Mobile Enhancement

Data
Enhancement Typ e
Connectivity Cable CA-101
Power
Enhancement Typ e
Battery 870 mAh BL-5BT Travel charger AC-6U Vehicle Power Charger DC-6
Audio
Enhancement Typ e
Mono Headset HS-9 Stereo Headset HS-49
Car
Enhancement Typ e
Wireless plug-in car handsfree n/a

Technical specifications

Transceiver general specifications

Unit Dimensions (L x W x T) (mm) Weight (g) Volume (cm3)
Transceiver with BL-5BT 870 mAh li-ion battery
84 x 42 x 16.25 ~70 47

Main RF characteristics for CDMA2000 Cell band 800

Parameter Unit
Cellular system CDMA2000(800 MHz band) Rx frequency band Band class 0: 869 – 894 MHz Tx frequency band Band class 0: 824 – 849 MHz
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RM-376 General Information
Output power -60 dBm ~ 30 dBm Number of RF channels 832 Channel spacing 30 kHz

Battery endurance

Battery Talk time Stand-by
BL-5BT 870 mAh li-ion battery
Note: Operation times may vary depending on radio access technology used, operator network
configuration and usage.
At least 210 minutes (with standard battery)
Charging time
No more than 3 hours (from empty to full battery)
At least 240hours (with standard battery)
AC-6U
Video call
time
NA NA
Music playback
time
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RM-376
General Information
Page 1-8 Company Confidential Issue1
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Nokia Customer Care
2- Service Tools and Service
Concept
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RM-376
Service Tools and Service Concept
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RM-376 Service Tools and Service Concept
Table of Contents
Service tools........................................................................................................................................................................................................................ 2-5
Product Specific tools.................................................................................................................................................................2-5
General tools....................................................................................................................................................................................2-6
Cables .................................................................................................................................................................................................... 2-7
Service concepts..................................................................................................................................................................................................2-8
POS (Point of Sale) flash concept........................................................................................................................................2-8
Flash concept with Module Jig ............................................................................................................................................2-9
Covers-off BB/RF Troubleshooting using Module Jig........................................................................................2-10
Automated Tuning and Alignment concept..........................................................................................................2-11
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RM-376
Service Tools and Service Concept
List of Tables
Table1 MJ-209 attenuation table …………………………………………………………………………………………………………………….5
List of Figures
Figure 1 POS flash concept………………………………………………………………………………………………………………………………8 Figure 2 Flash concepts with Module Jig………………………………………………………………………………………………………….9 Figure 3 Cover-off BB/RF Troubleshooting using Module Jig…………………………………………………………………………10 Figure 4 Automated Tuning and Alignment concept ……………………………………………………………………………………11
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RM-376 Service Tools and Service Concept

Service tools

Product Specific tools

The table below gives a short overview of service tools that can be used for testing, error analysis and repair of product RM-376.
MJ-209 Module Jig The module jig offers engine module component level repair and analysis. Features:
z connection interfaces for CDMA antenna z galvanic connection to engine module test pads z lid interconnection with test points for measurements z connection to Displays, earpiece, headset and speakers
Note: There is one RF connection for CDMA
Table 1 MJ-209 attenuation table
Band (mid. ch.) Channel Frequency /MHz Attenuation Loss / dB
800 TX 824 – 849 MHz 800 RX 869 – 894 MHz
Set-up Guide 1
Prepare LCM module, FPC, board and MJ-209
2
Connect LCM module and board using FPC
3
Put 2 on MJ-209
4
Close MJ-209 SS-190 Dome sheet Alignment Jig SS-190 is a jig to align the adhesive dome sheet assembly onto the PWB
in the proper location during dome sheet replacement.
then start further testing
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RM-376
Service Tools and Service Concept

General tools

The table below gives a short overview of service tools that can be used for testing, error analysis and repair of product RM-376
RJ-230 Soldering RJ-230 is a jig to support component level exchange with soldering machines for the engine module.
PK-83 AMS SW Protection Key (USB) PK-83 is a hardware protection key with a USB interface to enable the use of the service software when connected to the USB port of the PC or Notebook. It is not possible to use the service software without PK-83
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RM-376 Service Tools and Service Concept

Cables

The table below gives a short overview of service tools that can be used for testing, error analysis and repair of product RM-376.
CA-101 Micro USB cable The CA-101 is a USB-to-micro USB data cable that allows connections between the PC and the phone.
PCS-1 Power Service Cable The PCS-1 power cable (DC) is used with a docking station, a module jig or a control unit to supply a controlled voltage.
CA-128RS RF Test Cable RF Test Cable for use with a Module Jig. CA-128RS RF cable allow RF function tests and RF tun
nds.
PCS ba Features include:
z most accurate RF connection to phone module under test z low attenuation and small “ripple” over the width of each band
Note: The RF Test Cable must be used for RF tuning.
SRT-6 Opening tool SRT-6 is used to open phone covers.
ing in CDMA Cell and
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Service concepts

POS (Point of Sale) flash concept

RM-376
Service Tools and Service Concept
Figure 1 POS flash concept
Type Description
Product specific tools
BL-5BT Battery
Other tools
Nokia Care Suite PC with Nokia Care Suite service software Cables CA-101 Micro USB cable
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RM-376 Service Tools and Service Concept

Flash concept with Module Jig

Figure 2 Flash concept with Module Jig
Type Description
Product specific tools
MJ-209 Module Jig
Other tools
Nokia Care Suite PC with Nokia Care Suite service software Cables CA-101 Micro USB cable PCS-1 Power Service Cable
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Covers-off BB/RF Troubleshooting using Module Jig

RM-376
Service Tools and Service Concept
Figure 3 Cover-off BB/RF Troubleshooting using Module Jig
Type Description
Product specific tools
MJ-209 Module Jig
Other tools
PK-83 AMS SW Protection Key (USB) Nokia Care Suite PC with Nokia Care Suite service software (L3 version)
R&S CMU200 with B89/PK800
module
Oscilloscope Multi-meter Probes used with Oscilloscope and Multi-meter Cables CA-101 Micro USB cable PCS-1 Power Service Cable CA-128RS RF Test Cable GPIB Cable
CDMA CALL BOX
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RM-376 Service Tools and Service Concept

Automated Tuning and Alignment concept

Figure 4 Automated Tuning and Alignment concept
Type Description
Product specific tools
MJ-209 Module Jig
Other tools
PK-83 AMS SW Protection Key (USB) Nokia Care Suite PC with Nokia Care Suite service software (L3 version)
R&S CMU200 with B89/PK800
module
Cables CA-101 Micro USB cable PCS-1 Power Service Cable CA-128RS RF Test Cable GPIB Cable
CDMA CALL BOX
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Service Tools and Service Concept
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Nokia Customer Care
3- Baseband
Troubleshooting
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RM-376
Baseband Troubleshooting
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RM-376 Baseband Troubleshooting
Table of Contents
Troubleshooting overview..........................................................................................................................................................................3-3
Dead or jammed device troubleshooting........................................................................................................................................3-4
General power checking...............................................................................................................................................................................3-5
Charging troubleshooting...........................................................................................................................................................................3-6
Keyboard troubleshooting..........................................................................................................................................................................3-7
Power key troubleshooting .......................................................................................................................................................................3-9
Vibra troubleshooting.................................................................................................................................................................................3-10
Display module troubleshooting........................................................................................................................................................3-11
Audio troubleshooting ...............................................................................................................................................................................3-12
Audio troubleshooting test instructions...................................................................................................................3-12
Internal receiver troubleshooting..................................................................................................................................3-17
Internal microphone troubleshooting.......................................................................................................................3-18
IHF speakers troubleshooting ..........................................................................................................................................3-19
External earphone troubleshooting ............................................................................................................................3-20
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RM-376
Baseband Troubleshooting
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RM-376 Baseband Troubleshooting

Troubleshooting overview

For practical reasons, troubleshooting is divided into two sections;
z Baseband troubleshooting z RF troubleshooting
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Dead or jammed device troubleshooting

Troubleshooting flow
RM-376
Baseband Troubleshooting
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RM-376 Baseband Troubleshooting

General power checking

Check the following voltages:
Signal
name
Regul
ator
Sleep Idle
Talk
Notes Supply
Mode
VREG
RFRX
VREG
RFTX
VREG
USB
VREG
RUIM
VREG
TCXO
VREG
MSMA
VREG
MSME1
VREG
MSME2
2.6 V
2.6 V
3.3 V
2.85 V
2.85 V
2.6 V
1.8 V
2.9 V
VREG
2.6 V
MSMP
VREG
1.2 V
CORE
MIC
1.8 V
BIAS
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Charging troubleshooting

Troubleshooting flow
RM-376
Baseband Troubleshooting
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RM-376 Baseband Troubleshooting

Keyboard troubleshooting

Context
There are two possible failure modes in the keyboard module:
z One or more keys can be stuck, so that the key does not react when a keydome is pressed. This kind of failure
is caused by mechanical reasons (dirt, rust)
z Malfunction of several keys at the same time; this happens when one or more rows or columns are failing
(shortcut or open connection). For a more detailed description of the keyboard and keymatrix, see section Keyboard.
If the failure mode is not clear, start with the Keyboard Test in L3 PST.
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Troubleshooting flow
RM-376
Baseband Troubleshooting
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RM-376 Baseband Troubleshooting

Power key troubleshooting

Troubleshooting flow
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Vibra troubleshooting

Troubleshooting flow
No No
RM-376
Baseband Troubleshooting
Yes
Yes
No
Yes
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RM-376 Baseband Troubleshooting

Display module troubleshooting

Troubleshooting flow
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RM-376
Baseband Troubleshooting

Audio troubleshooting

Audio troubleshooting test instructions

Single ended external earpiece and differential internal earpiece/IHF outputs can be measured either with a single ended or a differential probe. When measuring single ended, each output is measured against ground.
Note: Do not connect ground of single ended probe to 2nd signal of differential lines.
Internal handsfree output is measured using a current probe, if a special low-pass filter designed for measuring a digital amplifier is not available. Note also, that when using a current probe, input signal frequency must be set to 2kHz. The signal for input is single ended.
Required equipment
The following equipment is needed for the tests:
z Oscilloscope z Function generator (sine waveform) z Current probe (Internal handsfree PWM output measurement) z service software, Nokia L3 PST Fx.xx z Power supply 3.7V
Test procedure
Audio can be tested using MIT (*#648#). Four different audio loop paths can be activated:
• Receiver test
• Microphone test
• Speaker test
• Headset test Correct pins an signals for each test see following table.
Audio loop tests and test results
The results presented in the table apply, when no accessory is connected. Earpiece, internal mic and speaker are in place during measurement. Applying a headset accessory during measurement causes a significant drop in measured levels.
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RM-376 Baseband Troubleshooting
Measurement data
Receiver test
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Microphone test
RM-376
Baseband Troubleshooting
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RM-376 Baseband Troubleshooting
peaker test
S
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Headset test
RM-376
Baseband Troubleshooting
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RM-376 Baseband Troubleshooting

Internal receiver troubleshooting

Troubleshooting flow
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Internal microphone troubleshooting

Troubleshooting flow
RM-376
Baseband Troubleshooting
Yes
Yes
No
No
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RM-376 Baseband Troubleshooting

IHF speakers troubleshooting

Troubleshooting flow
No No
Yes
No
Yes
Yes
No
Yes
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External earphone troubleshooting

Troubleshooting flow
RM-376
Baseband Troubleshooting
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Nokia Customer Care

4- RF Troubleshooting

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RM-376
RF Troubleshooting
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RM-376 RF Troubleshooting
Table of Contents
General RF troubleshooting....................................................................................................................................................................... 4-2
Introduction to RF troubleshooting................................................................................................................................4-2
General information on RF troubleshooting............................................................................................................. 4-2
RF key components.....................................................................................................................................................................4-4
General voltage checking....................................................................................................................................................... 4-5
RF CallTest in Nokia CDMA L3 PST Fx.x.............................................................................................................................4-9
Receiver troubleshooting..........................................................................................................................................................................4-11
Introduction to receiver (RX) troubleshooting......................................................................................................4-11
Setup for RX Troubleshooting...........................................................................................................................................4-11
Cell Receiver Check from RF to DVGA............................................................................................................................4-13
Receiver RF test point..............................................................................................................................................................4-13
CELL 800 RX Path Troubleshooting...............................................................................................................................4-15
Transmitter troubleshooting..................................................................................................................................................................4-16
Setup for TX Troubleshooting...........................................................................................................................................4-18
Transmitter RF test point ......................................................................................................................................................4-19
CELL 800 TX Path Troubleshooting................................................................................................................................4-20
FM radio troubleshooting.........................................................................................................................................................................4-21
RF tunings ............................................................................................................................................................................................................4-23
Introduction to RF tunings.......................................................................................................................................................................4-23
Autotuning................................................................................................................................................................. 錯誤! 尚未定義書籤。
Figure Figure 1 RF TX Path voltage checking test points ………………………………………………………………………………………………4-6 Figure 2 Bottom side TX voltage checking test point…………………………………………………………………………………………4-7 Figure 3 RF RX voltage checking test point…………………………………………………………………………………………………………4-8
Figure4 RF Toolkit setup for RX troubleshooting……………………………………………………………………………………………....4-12
Figure 5 RX RF test points………………………………………………………………………………………………………………………………….4-14 Figure 6 Typical readings…………………………………………………………………………………………………………………………………..4-17 Figure 7 RF Toolkit setup for TX troubleshooting……………………………………………………………………………………………...4-18 Figure 8 TX RF test point……………………………………………………………………………………………………………………………………4-19 Figure 9 Auto tuning concept with CMU200/Agilent 8960 ………………………………………………………………………………4-24
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RM-376
RF Troubleshooting

General RF troubleshooting

Introduction to RF troubleshooting

Most RF semiconductors are static discharge sensitive
ESD protection must be applied during repair (ground straps and ESD soldering irons).
Pre-baking (TBD)
These parts are moisture sensitive and must be pre-baked prior to soldering:
z RFIC xxxx z PA xxxx
Discrete components
In addition to the key-components, there are a number of discrete components (resistors, inductors and capacitors) for which troubleshooting is done mainly by Capacitors: check for short circuits. Resistors: check value with an ohm meter.
Note: In-circuit measurements should be evaluated carefully
visual inspection.
Measuring equipment
All measurements should be done using:
z An oscilloscope for low frequency and DC measurements. Recommended probe: 10:1, 10Mohm//8pF.Title of
the Document + Issue Number/Date of publication
z A radio communication tester including RF generator and spectrum analyser, for example Rohde & Schwarz
CMU200. (Alternatively a spectrum analyser and an RF generator can be used. Some tests in this guide are not possible to perform if this solution is chosen).
Note: All measurements with an RF coupler should be performed in an RF-shielded environment because
nearby base stations can disturb sensitive receiver measurements. If there is no possibility to use RF shielded environment, testing at frequencies of nearby base stations should be avoided.
Level of repair
The scope of this guideline is to enable repairs at key-component level. Some key-components are not accessible, i.e. not replaceable. Please refer to the list of Non-replaceable RF components.

General information on RF troubleshooting

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RF key components

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RF Troubleshooting
SAW Filter
QSC6020
Power detector
RF connector
FEM
TQM613025
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RM-376 RF Troubleshooting

General voltage checking

R
F TX voltage checking
S
teps
Set up the main board in the module jig. The phone should be in local mode.
1.
2.
Check the following:
# Signal name Test point Voltage (all bands)
1 PA_ON C1801.2 On :2.35~2.85V , Off :0V 2 802 L PA_R0 C1 .2 ow mode :2.35~2.85V , High mode :0V 3 C1809 O VREG_TCXO .2 n :2.85V , Off :0V 4 VPH_PWR C1807.1 3.4~4.2V 5 VREG_RFTX C814.1 2.65V
*
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RF Troubleshooting
5
4
12
3
Figure 1 RF TX Path voltage checking test points
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RM-376 RF Troubleshooting
# Description Test Point Value RF Supply Lines Resistance to Ground
1 VREG_MSMP, C608.1 2.6V >290kΩ to ground 2 VPH_PWR, C514.1 V >200k to ground 3.4~4.2 3 VREG_MSMC, 4 VREG_MSMA, >37k to ground C615.1 2.6V 5 VREG_TCXO, C602.1 ~500kΩ to ground 2.85V 6 VREG_RFRX, >274k to ground C803.1 2.65V 7 VREG_RFTX, C808.1 2.65V ~276k to ground
Table 2 Bottom side TX vo
*Note: Always measure resistance m ff
C622.1 1.2V >18k to ground
ltage checking test and RF Supply Line Resistance to Ground
easure resistance with the phone powered o
points
Figure 2 Bottom side TX voltage checking test point
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RF RX voltage checking
# Description Test Point Value
1 2 3
XO_19.2M X801.1, X801.3 19.2 MHz VREG_RFRX C803.1 2.65V Rx bias R1705.2 122mV
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RF Troubleshooting
Figure 3 RF RX voltage checking test point
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RM-376 RF Troubleshooting

RF CallTest in Nokia CDMA L3 PST Fx.x

Context
Always start the troubleshooting procedure by running the RF CallTest in Nokia CDMA L3 PST. If a test fails, please follow the diagram below. If the phone is dead and you cannot perform the self tests, go to Dead or jammed device troubleshooting in the baseband troubleshooting section.

Setup for RX Troubleshooting

Use the following steps to configure FTM mode for RF troubleshooting.
1. Connect RF connector to a spectrum
2. Put PWB on the module jig, connect data service cable between PC and Module Jig and connect a power
supply
3. Launch Nokia CDMA L3 PST Fx.x Service Software and run RF Toolkit function
4. The RF and Testing box appears
5. Select “RF and Testing “
6. Press “START” Button
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Troubleshooting flow
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RF Troubleshooting
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RM-376 RF Troubleshooting

Receiver troubleshooting

Introduction to rece oubleshooting
RX can be tested by making a phone call or in local mode. For the local mode testing, use the RF CallTest in Nokia CDMA L3 PST service software. The main RX troubleshooting measurement is RSSI reading. This test measures the signal strength of the received signal.
iver (RX) tr

Setup for RX Troubleshooting

Use the following steps to nfigure FTM mode for RF troubleshooting.
1. Connect RF test connector to a CMU.
2. Connect mobile terminal to a PC via the Module Jig, and connect a power supply.
3. Open RF Toolkit in L3 program.
4. Set Start RF connection in “ connection ” box
5. Change to FTM in “phone mode setting” box.
6. Select a Band (Cellular) in “Band setting” box.
7. Write a channel in “RF channel setting” box.
Cellular Band Test channel : 384
< Set RF channel to 384 on CMU at the same time >
8. Select “0-LNA R0” in set LN
9. Key in -92.6 in AGC box and then click “dBm to AGC” button.
< Set RF level=-92.6 dBm on CMU >
10. Click “Get DVGA “button.( DVGA value is only operated in high gain mode )
11. Select “1--LNA R1” in set LNA range box
12. Key in -81.8 in AGC box, and then click “dBm to AGC” button.
< Set RF level=-81.8 dBm on CMU >
13. Click “Get LNA offset “button.
14. Repeat 11-13 steps for getting LNA offsets of LNA2 and LNA3.
<Key in -53.8 dBm and -43.8 dBm in AGC box corresponding to LNA2 and LNA3>
After testing, it’s necessary to change to “Online” in “Phone mode setting” box.
co
A range box
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8
4
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RF Troubleshooting
3
5
6
10
7
9
13
12
Figure4 RF Toolkit setup for RX troubleshooting
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Cell Receiver Check DVGA and LNA offset value

LNA Range DVGA LNA1 LNA2 LNA3
Input RF level (dBm) -92.6 -81.8 -53.8 -43.8
Reasonable offset value 10~70 80~152 160~277 280~430

Receiver RF test point

For the test points in below figure, an external signal source of –25 dBm was injected to the RF input. Set LNA GAIN STATE = 0 .The signal was then traced throughout the receiver chains. A CMU200 call box is recommended. (Open non-signaling mode, press the SG soft button, and then select CW.) Inject a continuous wave (CW) for Cell (881.52MHz) at a fixed –25 dBm power level. Measurements were taken with the RF Probe. Signal levels are approximate, and the accuracy may be +/- 2 dB or more depending on the probe position and grounding.
# Test Point Description Value
1 C1806.2 RF Connector to FEM -30dBm 2 C1814.1 FEM OUTPUT -33dBm 3 L1701.1 LNA IN -30dBm 4 L1711.1 RX SAW INPUT -22dBm 5 C1711.1 RX SAW OUTPUT -23dBm 6 L1709.2, L1707.1 RX MIXER IN -27dBm
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Figure 5 RX RF test points
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CELL 800 RX Path Troubleshooting

Troubleshooting flow
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Note:
• QSC6020 is underfilled and can not be replaced.
• Memory IC is underfilled and can not be replaced.
• The Shielding Cover can not be reused after removal.
• After using the heatgun, the

Transmitter troubleshooting

S
teps
1. mode
Set the phone to normal
2.
Use the following settings:
RM-376
RF Troubleshooting
domesheet needs to be replaced.
3. Check the basic TX parameters (i.e. power, phase error, modulation and switching spectrum), using a
communication analyzer (for example CMU200).
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Figure 6 Typical readings
4. Change the power level (RF controls) and make sure the power reading follows accordingly.
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RF Troubleshooting

Setup for TX Troubleshooting

se the following steps to configure FTM mode for RF troubleshooting.
U
1. Connect RF connector to a spectrum
2. Put PWB on the module jig, connect data service cable between PC and Module Jig and connect a power
supply
3. Launch Nokia CDMA L3 P The RF T ppears
4.
Set “Sta
5.
Set “Set Mode“ to “FTM”
6.
7. Set “Set Band ” to “Cellular band 800”
8. Set “Set Channel “ to Channel “384”
9. Set “Set PA Range” to “1” --> “R0=1”
10. Set “Waveform” to “ON”
11. Set “Set TX on/off” to “ON”
12. Set “Set TX AGC” to “80”
13. Get HDET value by setting “Set ADC Channel” to “4” and “Get ADC”.
oolkit box a
rt RF connection”
ST Fx.x Service Software and run RF Toolkit function
Figure 7 RF Toolkit setup for TX troubleshooting
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Transmitter RF test point

# Test Point Description Value
1 L1801.1, L1802.1 U100 DA differential output -12 dBm 2 L1801.2, L1802.2,
C1803.2, C1804.2 3 C1806.2 FEM output ( PA Low Gain MODE ) 6 dBm 4 C1806.1 FEM output to RF connector ( PA Low Gain
5 J1801 RF connector ( PA Low Gain MODE ) 13dBm
DA output to FEM input -15dBm
6dBm
MODE )
Figure 8 TX RF test point
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CELL 800 TX Path Troubleshooting

Troubleshooting flow
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FM radio troubleshooting

FM Voltage Test Point

# Test Point Description Value
1 C1602.1, C1603.1 Vph 3.4V~4.2V 2 C1604.2 Vreg_ MSMP 2.6V
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Troubleshooting flow
FM Fault
YES
Only noise is audible?
No
Connect headset to
phone jack J1001 and
listen to FM signal
NOK
YES
Check the soldering
points of C1601, B1004,
C1025, C1017, C1018 and
replace them
No FaultOK
RM-376
RF Troubleshooting
IS FM radio function OK?OK
OK
Go to Headset
troubleshooting
NOK
Check Vph=3.4~4.2V at
C1602, C1603
OK
Check Vreg_MSMP=2.6V
at C1604
OK
Replace U1601
OK
END
NOK
NOK
NO
Go to general power supply
troubleshooting
YES
NOK
OK
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F Troubleshooting
R

RF tunings

ntroduction to RF tunings
I
Important: Only perform
z one or more of the RF
Flash memory chip is replaced or corrupted.
z
RF ca
libration is always performed with the help of a product-specific module jig, never with an RF coupler.
Using
an RF coupler in the calibration phase will cause a complete mistuning of the RF part.
RF tunings if:
components have been replaced
Important: After RF component replacements, always use autotuning. Manual tunings are only
re
quired in rare cases.
Cable and adapter losses
bles and adapters have some losses. They have to be taken into account when the phone is tuned. As all RF
RF ca
s are frequency dependent, the user has to act very carefully and understand the measurement setup.
losse For RF attenuations of the module jig please refer to the Service tools section.
tuning
Auto
This phone can be tuned automatically. Auto
tune is designed to align the phone's RF part easier and faster. It performs calibrations, tunings and
mea
surements of RX and TX. The results are displayed and logged in a result file, if initiated.
H
ardware set up
Ha
rdware requirements for auto tuning:
z PC (Windows 2000/XP) with GPIB card z Power supply z Product specific module jig z Cables: CA-128RS (RF cable), CA-101 z PK-83 AMS SW protection key z Service Software, Nokia CDMA L3 PST Fx.x (x.x means version number)
Micro USB cable, PCS-1 Power Service Cable and GPIB cable
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RF Troubleshooting
Figure 9 Auto tuning concept with CMU200/Agilent 8960
Service software preparations
Install the phone-specific data package. This defines the phone-specific settings.
RF cable loss setting procedure
1. Make sure the phone (in the jig) is connected to the equipment. Else, some menus will not be shown in
CDMA L3 PST Fx.x
2. Select “RF and Testing” and click “cable loss”.
3. Select Band class to BC0 for 2608.
4. If RF cable loss is known, select “set ini” and enter the loss value.
5. If RF cable loss is unknown, select “calculate”.
6. In order to create a golden phone, we utilize CA-128RS as RF cable and set the loss to 0.5 dB.
7. Change RF cable (extend or replace it) and click “next” button.
8. Calculate the loss value, click “calculate” button.
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RF Troubleshooting
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Nokia Customer Care
5- System Module and User
Interface
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System Module and User Interface
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RM-376 System Module and User Interface
Table of Contents
Introduction ..........................................................................................................................................................................................................5-4
Phone description........................................................................................................................................................................5-4
Energy management .....................................................................................................................................................................................5-6
Battery and charging.................................................................................................................................................................5-6
Backup battery...............................................................................................................................................................................5-9
Normal and extreme voltages............................................................................................................................................5-9
Power key and system power-up..................................................................................................................................5-10
Power off.........................................................................................................................................................................................5-12
Modes of operation..................................................................................................................................................................5-13
Power distribution....................................................................................................................................................................5-14
Clock distribution.......................................................................................................................................................................5-16
USB....................................................................................................................................................................................................
...5-22
Charger interface.............................................................................................................................................................................................5-22
User Interface..................................................................................................................................................................................................
Displ
ay module...........................................................................................................................................................................5-23
...5-23
Keyboard and other keys.....................................................................................................................................................5-24
Audio concept.......................................... 5-26
.........................................................................................................................................................
Audio HW architecture...........................................................................................................................................................5-26
Internal mic
rophone...............................................................................................................................................................5-27
Internal earpiece........................................................................................................................................................................5-27
Internal speaker..........................................................................................................................................................................5-28
Vibra circuitry...................................................................................................
.............................................................................5-28
AV Connector.................................................................................................................................................................................5-29
Baseband technical specifications......................................................................................................................................................5-30
External interfaces................................
.....................................................................................................................................5-30
Charger connector and charging interface connections & electrical characteristics...................5-30
RF Description....................................................................................................................................................................................................5-31
Block diagram.............................................................................................................
.................................................................5-31
Receiver (RX)..................................................................................................................................................................................5-31
Transmitter (TX) ..........................................................................................................................................................................5-32
Frequency mappings...................................................................................................................................................................................5-35
CDMA 800 frequencies............................................................................................................................................................5-35
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System Module and User Interface

Introduction

Phone description

The mobile terminal using a CDMA single mode engine (Cellular/ 800) with Qualcomm baseband consists of the following ASICs:
z Qualcomm Single Chip 6020, including RF transmitter and receiver, Baseband and Power management
these three categories
z 32Mb Flash memory with 16Mb Psram memory
The QSC60X0 device represents QCT’s next generation of chipset architecture and enhancements for voice and entry-level multimedia handsets. The QSC60X0 device integrates the Mobile Station Modem™ (MSM™) baseband, radioOne RF, and power management functionality into a single 15 × 15 mm mini scale package (MSP). These functions perform all of the signal processing and power management tasks within a mobile device. This architecture reduces handset complexity, cost, time to market, and board-space requirements while providing many of the most popular features and functions. 3G products based on the QSC60X0 device may include:
z Voice centric phones z Music player enabled devices and applications z Camera phones (requires the QSC6030 device) z Entry level multimedia phones z Other applications and device
SC60X0-based products benefit from enhanced security, text, graphic and picture messaging, high quality
Q audio and speakerph me
gapixel image capture, and other applications using the core Wireless Internet Lauchpad features.
The s a seamless migration path from 2G to 3G services and applications,
QSC60X0 solution also provide
one support, polyphonic ringtones, voice capture, MP3/AAC/AAC+ music playback,
including the 4GV™ vocoder for increased voice capacity for CDMA2000® 1X networks. It is designed to exceed the evices for worldwide cdmaOne™ and 3G 1xMC systems, including those based
specifications of mobile d
upon the IS-95A/B and IS-2000 standards.
he QSC60x0 device extends the level of integration to include radio frequency and power management
T functions.
BL-5BT (870 mAh) lithium-ion battery is used as the main power source.
s
ey components
K
Function Description Item ref
Main chip Qualcomm QSC6020 U100 PA Oscillators Memory S71WS128PC0HF3SR0 U901 Battery BL-5BT Battery connector CN501 RF connector Charging IC BQ24072 U503
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System module block diagram
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Board and module connections
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Energy management

attery and charging
B
L-5BT battery
B
he 2608 uses a Lithium-Ion cell battery with a capacity of 870 mAh. QSC6020 reads the resistor inside the
T battery pack on the BSI line to identify the battery size. Different charging algorithm will be used for different battery sizes. The resistors are connected to the BSI pin inside the battery connector.
Figure 1 BL-5BT battery pack pin order
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Battery connector
The battery connector is a blade connector. It has three blades;
z BSI (Battery size indicator) z GND (Ground) z VBAT (Battery voltage)
The BSI line is used to recognize the battery capacity by a battery internal pull down resistor.
Figure 2 Battery Connector
Charging
This phone is charged through the Micro USB interface with the AC-6U travel charger.
Figure 3 AC-6U travel charger
The PM charge control is dependent on the charger type and the battery size. External components are needed for electromagnetic compatibility (EMC), and transient protection of the input to the baseband module. The charger’s DC input is through the Micro USB connector. This mobile terminal supports AC-6U & DC-6 chargers.
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System Module and User Interface
Figure 4 Simplied power flow diagram
Cha
rger Detection
nnecting a charger creates a voltage on the DC_PWR of the Charging IC. Charging starts when the PM detects
Co the DC_PWR input voltage level between 4.35V~6.6V and /PGOOD pin pulls to GND (/PGOOD is pin 7of charging IC). The charger detected when CHG_DEC_N_GPIO_53 pulls low (GND). The battery is charged in three phases: conditioning, constant current , and constant voltage. In all charge phases, an internal control loop monitors the IC junction temperature and reduces the charge current if the internal temperature threshold is exceeded. The charger power stage and charge current sense functions are fully integrated. The charger function has high accuracy current and voltage regulation loops, charge status display, and charge termination. The input current limit and charge current are programmable using external resistors.
Figure 5 Mobile terminal charger circuit
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Charger Control
In active m arging is controlled by charging IC. Charging current monitoring are used to limit cha
Cut Off MaxCurrent = 1.5A
Voltage= 6.6V
Max
ode, ch
rg a safe area.
ing into
voltage and

Backup battery

When the main battery is not atta supplies voltage to RTC in EM ASIC (N
ched EM ASIC (N2200) goes in backup mode using back-up battery that
2200).
Normal and extreme voltag
Energy management is mainly carri and AVILMA. These two circuits contain a o. In the table below, normal and extre
es
ed out in the two Application Specific Integrated Circuits (ASICs) BETTY number of regulators. In addition there are some external regulators to
me voltages are shown when a BL-5BT battery is used.
Voltage Voltage [V] Condition
General Conditions
Nominal voltage 3.7
Lower extreme voltage 3.145
Higher extreme voltage 4.230
(fast charging) 4.230
HW Shutdown Voltages Vmstr+ 2.1 ± 0.1 Off to on Vmstr+ 2.1 ± 0.1 Off to on
SW Shutdown Voltages Sw shutdown 3.20 In call Sw shutdown 3.20 In idle
Min Operating Voltage
Vcoff+ n 2.9 ± 0.1 Off to o
Vcoff- 2.6 ± 0.1 On to off
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System Module and User Interface

Power key and system power-up

The QSC6020 controls the power up and reset. The baseband can power up in the following w
z Pressing the Power button, which means to ground the KPD_PWR_N (“KPD_PWR_N” pin in 2608 schematic
pin of the QSC6020
z Connecting the charger to the charger input.
Afte ne of the above signals, the PM will start to enter reset mode. The watchdog starts, and if the
r receiving o
batt ge is greater than its threshold (3V), a 6ms delay starts to allow MSM to settle. After this delay
ery volta
ela egulator enables. Then, VERG_MSMP, VERG_MSMA & VERG_TCXO regulators are enabled
pses, the VERG_MSMC r
in s p_Clocks) delays between each regulator’s turn on. The
equence after MSMC. There is a 120us (4 Slee PON_RESET_N (“RESIN_N” pin in 2608 schematic) line holds low for another 20ms and is sent to MSM. Resets are generated for the MSM’s internal MCU and its internal DSP, and MSM sends TCXO_ON (“TCXO_EN” pin in 2608 schematic) signal to PM to enable TCXO. After PON_RESET_N goes high, MSM holds PS_HOLD at low state for
s and then drives PS_HOLD to high state. This will keep all regulators at on state in order to complete
200m this power on sequence. KPD_PWR_N key can be released a
fter PS_HOLD goes high.
The RESOUT_N fro d fla ory during power up and to put the flash memory in power d LC used to reset LCD module during power up. All baseb gulators a ed on w he dog runs and
and re re switch hen t PM is powered on. The QSC6020s internal watch resets during normal oper do tus. Then, and S and LCD module. Below figure repre e PM star ence fr t t
sents th t-up sequ om rese o power-on.
m QSC6020 is use to reset
D_RS from
ation. If the watch
LCD_R
sh mem
QSC6020 isown during sleep mode.
g expires, it will generate a reset signal to reset to MSM sta
low to reset flash memory QSC6020 drives RESOUT_N
ays:
)
Figure 6 Power-on/Power-off sequence and timing
The mobile terminal can use the power key or a charger to power up.
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Power Key
When the power key is pressed, the PM enters the power-up sequence. Pressing the power key causes the KPD_PWR_N (KPD_PWR_N pin in 2608 schematic) pin to GND. The KPD_PWR_N signal is not part of the keypad matrix. The power key is only connected to the PM. This means that when the power key is pressed, an interrupt will be generated to the MSM in order to power on the MCU. The MCU reads the QSC6020’s interrupt register and notifies that it is a KPD_PWR_N interrupt. The MCU reads the status of the KPD_PWR_N signal using the control bus. If the KPD_PWR_N signal stays low for a certain time, the MCU accepts this as a valid power-on state and continues with the software baseband initialization. If the power key does not indicate a valid power-on situation, the MCU powers off the baseband.
Charger
Charging is controlled by start-up charging circuitry in order to detect and start charging in cases the main battery is empty and the PM has no supply.
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External Supply Source is detected

Power off

While the PS_HOLD signal from the MSM is high, and the PM is in one of its power-on states. Under this condition, the PM continually monitors thr
z The MSM drives the PS_HOLD signal low responding to the pressing of the keypad power button z Battery volt z The PM die temperature exceeds its “severe” over-temperature threshold
age drops below power off threshold (Battery voltage < 3.2 V)
ee events that could trigger a power-off sequence:
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RM-376 System Module and User Interface

Modes of operation

Mode Description
Power-off In power-off mode, power (VPH_PWR) is supplied to the PM, RF PA,
vibrator, and keypad backlight LED. During this mode, the current consumption is approximately 8.8 uA
Sleep The mobile terminal enters sleep mode only when MSM makes the
request to PM through the SBI bus. PM then enters Power Saving Mode, and the VREG_MSMC VREG_MSMP regulators remain in power-on stage. The 32.768 kHz crystal is enabled. TCXO buffers are off. All other functions and regulators are controlled individually via SBI and are typically disabled for minimum power dissipation. It exits the Sleep mode either by the expiration of a sleep clock counter in the PM or by some external interrupt (generated by a charger connection, key press, headset connection, etc.). The TCXO is shut down in sleep mode and the 32.768 kHz sleep clock oscillator is used as a reference clock for the baseband.
Active erates normally. It scans
Charging Charging mode can function in parallel with any other operating mode.
In active mode, the mobile terminal op channels, listens to a base station, transmits and processes information. There are several sub-states under the active mode. Depending on the mobile terminal’s current state, there are states such as burst burst transmission, etc. In active mode, this is a normal operating mode for PM. VREG_MSMC, VREG_MSMP, VREG_MSMA, VREG_RUIM, VREG_RFRX, VREG_RFTX, and VREG_TCXO regulators are all turned on. TCXO oscillator is enabled, and TCXO buffers controlled individually via SBI.
A BSI resistor inside the battery pack indicates the battery type/ size. The resistor value corresponds to a specific battery capacity. The PM measures the battery voltage, temperature, size, and charging current. Charger control block inside the PM controls the charging current delivered from the charger to the battery and mobile terminal. The maximum battery voltage is limited by turning the PM switch off when the battery voltage reaches 4.2 V. The charging current is monitored by measuring the voltage drop across a 0.1 ohm resistor.
are turned on. All other functions and regulators are
reception,
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Power distribution

In normal operation, the baseband is powered by the mobile terminal‘s battery pack. The battery pack consists of one lithium-ion cell with a capacity o ion circuits. T
he PM controls the power distribution to the whole mobile terminal, which includes the baseband and the RF regulators, but excludes the RF power amplifier (RF PA) RF power amplifier drains power from the battery directly. The battery provides power directly to the following parts of the system:
z PM z RF PA z Vibrator z Keyboard , Electric torch light& LCD backlights
The heart of the power distribution is the power control block inside the PM. It includes all the voltage regulators and feeds the power to the entire system. The PM handles hardware power-up functions so that the regulators are not powered on and the power up reset (PURX) is not released if the battery voltage is less than 3 V. The baseband is powered by the following PM regulators:
f 870 mAh and safety and protect
Table 1 Baseband Regulators
Regulator Rating Current Voltage Notes
MSMC 300 mA 1.3 V Always enabled except during power-off mode
MSMA 150 mA 2.60 V
Enabled only when the system is powered on (Off during sleep and power-off modes)
MSMP 300 mA 2.60 V Always enabled except during power-off mode
RUIM 150 mA 2.85 V Enabled only when RUIM card is used
TCXO 50 mA 2.85 V
Enabled only when the system is powered on (Off during sleep and power-off modes)
Note: All output regulators voltage accuracy +/-2%
Below table includes the PM regulators for the RF.
Table 2 RF Regulators
Regulator Rating Current Voltage Notes
RFRX1 150 mA 2.60 V Enabled when the receiver is on
RFRX2 150 mA 2.60 V Enabled when the receiver is on
RFTX 150 mA 2.60 V Enabled when the transmitter is on
Note: All output regulators voltage accuracy +/-2%
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USB
or
Wall charger
VPH_PWR
Charging Block
Figure 7 Power Distribution
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Clock distribution

The SC6020 derives its internal clock from two clock inputs, TCXO and SLEEP_CLK.
Q
The main clock signal for the baseb re-compensated crystal oscillator).
he QSC6020’s TCXO clock input supports the frequency 19.2 MHz +/-2ppm. The SLEEP_CLK provides a 32.768
T kHz +/-20ppm clock source to drive the MSM controller into sleep mode. At this mode, most of the MSM is powered down and the TCXO is disabled.
System Clocks
The power management circuits include several clock circuits whose outputs are used for general housekeeping functions and elsewhere within the handset system. These circuits include the 19.2 MHz TCXO source, controller, and buffers; RC oscillator; 32 kHz crystal oscillator; SLEEP clock; and SMPS clock. The baseline configurations are shown in Figure 47, but some circuits offer multiple implementation options. Detailed descriptions of all these functions and their options (where applicable) are presented in the following subsections.
and generates from TCXO (Temperatu
Figure 8 TCXO and SLEEP_XTAL Block Diagram
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TCXO
The MSM device integrates a phase-locked loop from the TCXO clock input.
The PM optimizes TCXO operation that enables and disables appropriate circuits in the proper sequence. The controller is enabled by the signal from the MSM. When the selected transition occurs at TCXO_EN, the controller quickly enables the TCXO regulator and the input buffer, and begins counting SLEEP_CLK pulses. Within an initial power on period, the TCXO will be stabilized to its own calibrated frequency. This initial period, in units of 32.768 kHz clock pulses, is programmed into a timer within the controller. When the timer expires, the output buffer is enabled. It synchronizes with the TCXO input such that the TCXO_OUT signal is glitch free,
only valid TCXO pulses are output.
Figure 9 TCXO Enable Timing Diagram
The input buffer (TCXO_IN) accepts sinusoidal or square wave signals at or near 19.2 MHz. The input buffer (TCXO_IN) is powered from the TCXO regulator while the output buffer is powered by VREG_MSMP.
The regulator of TCXO is turned off after the TCXO_EN signal is removed. Upon power-up, the PM defaults to this SBI-controlled mode with the TCXO defaulted on. This assures the MSM will always have a clock available
immediately at power-up even if TCXO_EN is low.
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TCXO waveform (19.2MHz+/-2ppm)
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Figure 10 TCXO Timing at 25P0PC
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SLEEP Crystal Circuit for 32.768kHz
The 32.768 kHz cryst
power.
al oscillator is the primary SLEEP clock source when TCXO clocks are disabled to save
Figure 11 Sleep CLK Block Diagram
The 32.768 kHz crystal oscillator signal is generated by an external crystal (plus two shunt capacitors), which is supplemented by a PM internal inverter and buffer.
The crystal oscillator continues to run as long as a valid supply is present, even when the PM is powered down. This provides a continuous and accurate 32.768 kHz source. The oscillator halts when power from the external supply and main battery are removed.
The PM includes a circuit that continually monitors the crystal oscillator signal. If the crystal stops oscillating, the PM automatically switches to the RC oscillator and sends an MSM interrupt. Narrow pulses at the SLEEP_CLK output may occur during this switchover. The crystal oscillator dissipates little power, adjusting its bias current to the minimum required to maintain oscillation.
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SLEEP Clock waveform (32.768KHz +/-20ppm)
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Figure 12 Sleep_CLK Timing at 25P0PC
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