This means that the phone does not use any current at all when the supply is connected and/or power key
is pressed. It is assumed that the voltage supplied is 3.6VDC. The UEMCLite will prevent any functionality at
battery/supply levels below 2.9VDC.
If this kind of failure is presenting itself immediately after FLALI, it is most likely caused by ASIC's missing
contact with PWB.
If the MCU doesn’t service the watchdog register within the UEMCLite, the operations watchdog will run out
after approximately 32 seconds. Unfortunately, the service routine can not be measured.
Troubleshooting flow
Figure 10 Troubleshooting when phone does not stay on or phone is jammed
The flash programming can be done via the pads on the PWB (J2060). If failed, then follow up the trouble
shooting flow chart.
In case of flash failure in the FLALI station, swap the phone and send it back to the care program for further
analysis. Possible failures could be short-circuit of balls under µBGAs (UEMCLite, UPP4M, FLASH), or missing
or misaligned components.
In flash programming error cases, the flash prommer can give some information about a fault. The fault
information messages could be:
Phone doesn't set FBUS_TX line low
Because of the use of uBGA components, it is not possible to verify if there is a short circuit in the control and
address lines of MCU (UPP8M) and the memory (flash).
The flash programming can be done via the easy flash connector. If failed, then follow up the trouble shooting
below.
It is not possible to verify if there is a short circuit in control and address lines of MCU (UPP8M) and memory
(flash) because BGA package is used in RM-340/341.
This error can only happen at power up where several self-tests are run. If any of these test cases fails the
display will show the message: "Contact Service".
They are individual test cases, so the below lineup of error hunting's has no chronological order. Use common
sense and experience to decide which test case to start error hunting at.
Figure 13 Troubleshooting when the "Contact Service" message is seen
The phone does not register to the networks, or the phone cannot make a call
Context
If the phone doesn't register to the network, the fault can be in either BB or RF. Only few signals can be tested
since several signals are 'buried' in one or more of the inner layers of the PWB.
First, check that SIM LOCK is not causing the error by using a Test-SIM card and connect the phone to a tester.
The hardware of the SIM interface from UEMCLite (D2200) to the SIM connector (X2700) can be tested without
a SIM card. When the power is switched on the phone first check for a 1.8V SIM card and then a 3V SIM card.
The phone will try this four times, where after it will display ”Insert SIM card”.
The error ”SIM card rejected” means that the ATR message received from SIM card is corrupted, e.g. data
signal levels are wrong. The first data is always ATR and it is sent from card to phone.
For reference a picture with normal SIM power-up is shown below.
Figure 17 Signal diagram
User interface
Blank display
Context
The display does not show any information at all. If there is only main or sub display blank, the problem
mostly exists in individual display. Replace related display first. For main and sub display blank, refer to
troubleshooting flow below.
Most RF semiconductors are static discharge sensitive
Two types of measurements are used in the following. It will be specified if the measurement type is "RF" or
"LF".
• RF measurements are done with a Spectrum Analyzer and a high-frequency 500 ohm passive probe, for
example HP54006A. (Note that when measuring with the 500ohm probe the signal will be around 20dB
attenuated. The values in the following will have these 20dB subtracted and represent the real value seen
on the spectrum analyzer). Note that the testing have some losses which must be taken into consideration
when calibrating the test system.
• LF (Low frequency) and DC measurements should be done with a 10:1 probe and an oscilloscope. The probe
used in the following is 10Mohm/8pF passive probe. If using another probe then bear in mind that the
voltages displayed may be slightly different. Always make sure the measurement set-up is calibrated when
measuring RF parameters on the antenna pad. Remember to include the loss in the module repair jig when
realigning the phone.
So ESD protection must be applied during repair (ground straps and ESD soldering irons). Mjoelner and Bifrost
are moisture sensitive so parts must be pre-baked prior to soldering. Apart from key-components described
in this document there are a lot of discrete components (resistors, inductors and capacitors) for which
troubleshooting is done by checking if soldering of the component is done properly and checking if the
component is missing from PWB. Capacitors can be checked for short-circuiting and resistors for value by
means of an ohmmeter, but be aware in-circuit measurements should be evaluated carefully. In the following
both the name EGSM and GSM850 will be used for the lower band and both PCN and GSM1900 will be used
for the upper band.
RF key components
Figure 29 RF key components on PWB
N7600PMB3258 RF IC
N7700FEM (PA and antenna switch)
Z7602EGSM 850/900 RX SAW filter
Z7600DCS 1800/PCS1900 RX SAW filter