Document No. U17717EJ3V0UD00 (3rd edition)
Date Published March 2007 N CP(K)
Printed in Japan
2005
[MEMO]
2
User’s Manual U17717EJ3V0UD
NOTES FOR CMOS DEVICES
1
VOLTAGE APPLICATION WAVEFORM AT INPUT PIN
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the
IL
CMOS device stays in the area between V
malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed,
and also in the transition period when the input level passes through the area between V
V
IH
(MIN).
HANDLING OF UNUSED INPUT PINS
2
Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is
possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS
devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed
high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to V
via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must
be judged separately for each device and according to related specifications governing the device.
3
PRECAUTION AGAINST ESD
A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as
much as possible, and quickly dissipate it when it has occurred. Environmental control must be
adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that
easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static
container, static shielding bag or conductive material. All test and measurement tools including work
benches and floors should be grounded. The operator should be grounded using a wrist strap.
Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for
PW boards with mounted semiconductor devices.
(MAX) and VIH (MIN) due to noise, etc., the device may
IL
(MAX) and
DD
or GND
4
STATUS BEFORE INITIALIZATION
Power-on does not necessarily define the initial status of a MOS device. Immediately after the power
source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does
not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the
reset signal is received. A reset operation must be executed immediately after power-on for devices
with reset functions.
5
POWER ON/OFF SEQUENCE
In the case of a device that uses different power supplies for the internal operation and external
interface, as a rule, switch on the external power supply after switching on the internal power supply.
When switching the power supply off, as a rule, switch off the external power supply and then the
internal power supply. Use of the reverse power on/off sequences may result in the application of an
overvoltage to the internal elements of the device, causing malfunction and degradation of internal
elements due to the passage of an abnormal current.
The correct power on/off sequence must be judged separately for each device and according to related
specifications governing the device.
6
INPUT OF SIGNAL DURING POWER OFF STATE
Do not input signals or an I/O pull-up power supply while the device is not powered. The current
injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and
the abnormal current that passes in the device at this time may cause degradation of internal elements.
Input of signals during the power off state must be judged separately for each device and according to
related specifications governing the device.
User’s Manual U17717EJ3V0UD
3
IECUBE is a registered trademark of NEC Electronics Corporation in Japan and Germany.
MINICUBE is a registered trademark of NEC Electronics Corporation in Japan and Germany or a
trademark in the United States of America.
Applilet is a registered trademark of NEC Electronics in Japan, Germany, Hong Kong, China, the Republic of
Korea, the United Kingdom, and the United States of America.
Windows and Windows NT are either registered trademarks or trademarks of Microsoft Corporation in
the United States and/or other countries.
PC/AT is a trademark of International Business Machines Corporation.
SPARCstation is a trademark of SPARC International, Inc.
Solaris and SunOS are trademarks of Sun Microsystems, Inc.
TRON is an abbreviation of The Real-Time Operating system Nucleus.
ITRON is an abbreviation of Industrial TRON.
4
User’s Manual U17717EJ3V0UD
•
The information in this document is current as of August, 2006. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not
all products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without the prior
•
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
•
NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
•
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
•
While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.
NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
•
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8 E 02 . 11-1
User’s Manual U17717EJ3V0UD
5
PREFACE
Readers This manual is intended for users who wish to understand the functions of the
V850ES/HJ2 and design application systems using the V850ES/HJ2.
PurposeThis manual is intended to give users an understanding of the hardware functions of
the V850ES/HJ2 shown in the Organization below.
OrganizationThis manual is divided into two parts: Hardware (this manual) and Architecture
(V850ES Architecture User’s Manual).
Hardware Architecture
• Pin functions • Data types
• CPU function • Register set
• On-chip peripheral functions • Instruction format and instruction set
• Flash memory programming • Interrupts and exceptions
• Electrical specifications • Pipeline operation
How to Read This ManualIt is assumed that the readers of this manual have general knowledge in the fields of
electrical engineering, logic circuits, and microcontrollers.
To understand the overall functions of the V850ES/HJ2
→ Read this manual according to the CONTENTS.
To find the details of a register where the name is known
→ Use APPENDIX B REGISTER INDEX.
To understand the details of an instruction function
→ Refer to the V850ES Architecture User’s Manual available separately.
To know the electrical specifications of the V850ES/HJ2
→ See CHAPTER 27 ELECTRICAL SPECIFICATIONS.
The “yyy bit of the xxx register” is described as the “xxx.yyy bit” in this manual. Note
with caution that if “xxx.yyy” is described as is in a program, however, the
compiler/assembler cannot recognize it correctly.
The mark <R> shows major revised points. The revised points can be easily
searched by copying an “<R>” in the PDF file and specifying it in the “Find what:” field.
6
User’s Manual U17717EJ3V0UD
Conventions Data significance: Higher digits on the left and lower digits on the right
Active low representation: xxx (overscore over pin or signal name)
Memory map address: Higher addresses on the top and lower addresses on
the bottom
Note: Footnote for item marked with Note in the text
Caution: Information requiring particular attention
Remark: Supplementary information
Numeric representation: Binary ... xxxx or xxxxB
Decimal ... xxxx
Hexadecimal ... xxxxH
Prefix indicating power of 2
(address space, memory
capacity): K (kilo): 2
M (mega): 2
G (giga): 2
10
= 1,024
20
= 1,0242
30
= 1,0243
User’s Manual U17717EJ3V0UD
7
Related Documents The related documents indicated in this publication may include preliminary versions.
However, preliminary versions are not marked as such.
Documents related to V850ES/HJ2
Document Name Document No.
V850ES Architecture User’s Manual U15943E
V850ES/HJ2 Hardware User’s Manual This manual
Documents related to development tools (user’s manuals)
Document Name Document No.
QB-V850MINI On-Chip Debug Emulator U17638E
QB-MINI2 On-Chip Debug Emulator with Flash Programming Function To be prepared
3.4.4 Areas .........................................................................................................................................64
3.4.5 Recommended use of address space ....................................................................................... 68
4.2 Basic Configuration of Ports .................................................................................................89
4.3 Port Functions .........................................................................................................................91
4.3.1 Operation of port function ..........................................................................................................91
4.3.2 Notes on setting port pins ..........................................................................................................92
4.3.3 Port 0 ......................................................................................................................................... 93
4.3.4 Port 1 ......................................................................................................................................... 97
4.3.5 Port 3 ....................................................................................................................................... 100
4.3.6 Port 4 ....................................................................................................................................... 106
User’s Manual U17717EJ3V0UD
9
4.3.7 Port 5 .......................................................................................................................................109
4.3.8 Port 6 .......................................................................................................................................115
4.3.9 Port 7 .......................................................................................................................................122
4.3.10 Port 8 ....................................................................................................................................... 124
4.3.11 Port 9 ....................................................................................................................................... 127
4.3.12 Port 12 ..................................................................................................................................... 137
4.3.13 Port CD....................................................................................................................................139
4.3.14 Port CM ...................................................................................................................................141
4.3.15 Port CS .................................................................................................................................... 144
4.3.16 Port CT ....................................................................................................................................147
4.3.17 Port DL ....................................................................................................................................150
4.3.18 Port pins that function alternately as on-chip debug function...................................................153
4.3.19 Register settings to use port pins as alternate-function pins....................................................154
4.4 Block Diagrams of Port........................................................................................................ 161
16.3.7 ID flag ......................................................................................................................................611
16.4.3 EP flag ..................................................................................................................................... 614
The CPU uses five-stage pipeline control to enable single-clock execution of address calculations, arithmetic
logic operations, data transfers, and almost all other instruction processing.
Other dedicated on-chip hardware, such as a multiplier (16 bits × 16 bits → 32 bits) and a barrel shifter (32
bits) contribute to faster complex processing.
(2) Bus control unit (BCU)
The BCU starts a required external bus cycle based on the physical address obtained by the CPU. When an
instruction is fetched from external memory space and the CPU does not send a bus cycle start request, the
BCU generates a prefetch address and prefetches the instruction code. The prefetched instruction code is
stored in an instruction queue.
(3) ROM
This is a 512 KB/376 KB/256 KB/128 KB flash memory mapped to addresses 0000000H to
007FFFFH/0000000H to 005DFFFH/0000000H to 003FFFFH/0000000H to 001FFFFH. It can be accessed
from the CPU in one clock during instruction fetch.
(4) RAM
This is a 20 KB/12 KB RAM mapped to addresses 3FFA000H to 3FFEFFFH/3FFC000H to 3FFEFFFH. It can
be accessed from the CPU in one clock during data access.
(5) Interrupt controller (INTC)
This controller handles hardware interrupt requests (NMI, INTP0 to INTP14) from on-chip peripheral hardware
and external hardware. Eight levels of interrupt priorities can be specified for these interrupt requests, and
multiple servicing control can be performed.
(6) Clock generator (CG)
A main clock oscillator that generates the main clock oscillation frequency (f
generates the subclock oscillation frequency (f
XT) are available. As the main clock frequency (fXX), fX is used as
X) and a subclock oscillator that
is in the clock-through mode and is multiplied by four in the PLL mode.
The CPU clock frequency (f
CPU) can be selected from seven types: fXX, fXX/2, fXX/4, fXX/8, fXX/16, fXX/32, and fXT.
(7) Internal oscillator
An internal oscillator is provided on chip. The oscillation frequency is 200 kHz (TYP.). An internal oscillator
supplies the clock for watchdog timer 2 and timer M.
(8) Timer/counter
Four-channel 16-bit timer/event counter P (TMP), three-channel 16-bit timer/event counter Q (TMQ), and one-
channel 16-bit interval timer M (TMM) are provided on chip.
(9) Watch timer
This timer counts the reference time period (0.5 s) for counting the clock (the 32.768 kHz from the subclock or
the 32.768 kHz f
BRG from prescaler 3). The watch timer can also be used as an interval timer for the main
clock.
User’s Manual U17717EJ3V0UD
25
(10) Watchdog timer 2
A watchdog timer is provided on chip to detect inadvertent program loops, system abnormalities, etc.
Either the internal oscillation clock or the main clock can be selected as the source clock.
Watchdog timer 2 generates a non-maskable interrupt request signal (INTWDT2) or a system reset signal
(WDT2RES) after an overflow occurs.
(11) Serial interface
The V850ES/HJ2 includes three kinds of serial interfaces: asynchronous serial interface A (UARTA) and 3-
wire variable-length serial interface B (CSIB).
In the case of UARTA, data is transferred via the TXDAn and RXDAn pins.
(n = 0 to 3:
μ
PD70F3711, 70F3712, n = 0 to 2: μPD70F3709, 70F3710)
In the case of CSIB, data is transferred via the SOB0 to SOB3 pins, SIB0 to SIB3 pins, and SCKB0 to
SCKB3 pins.
(12) A/D converter
This 10-bit A/D converter includes 24 analog input pins. Conversion is performed using the successive
approximation method.
(13) DMA controller
A 4-channel DMA controller is provided on chip. This controller transfers data between the internal RAM and
on-chip peripheral I/O devices in response to interrupt requests sent by on-chip peripheral I/O.
(14) Key interrupt function
A key interrupt request signal (INTKR) can be generated by inputting a falling edge to key input pins (8
channels).
(15) DCU (debug control unit)
An on-chip debug function that uses the JTAG (Joint Test Action Group) communication specifications is
provided. Switching between the normal port function and on-chip debugging function is done with the
control pin input level and the on-chip debug mode register (OCDM).
(16) Ports
The general-purpose port functions and control pin functions are provided. For details, see CHAPTER 4
PORT FUNCTIONS.
CHAPTER 1 INTRODUCTION
26
User’s Manual U17717EJ3V0UD
CHAPTER 2 PIN FUNCTIONS
This section explains the names and functions of the pins of the V850ES/HJ2.
2.1 Pin Function List
Three I/O buffer power supplies, AV
supplies and the pins is shown below.
Power Supply Corresponding Pin
AVREF0Port 7, port 12
BVDDPort CD, port CM, port CS, port CT, port DL
EVDDPort 0, port 1, port 3, port 4, port 5, port 6, port 8, port 9, RESET
(1) Port pins
REF0, BVDD, and EVDD, are available. The relationship between the power
Table 2-1. Pin I/O Buffer Power Supplies
Table 2-2. List of Pins (Port Pins) (1/4)
Pin Name Pin No. I/O Function Alternate Function
P00 6 TIP31/TOP31
P01 7 TIP30/TOP30
P02 17 NMI
P03 18 INTP0/ADTRG
P04 19 INTP1
P05 20 INTP2/D RST
P06 21
P10 3 INTP9
P11 4
P30 25 TXDA0
P31 26 RXDA0/INTP7
P32 27 ASCKA0/TIP00/TOP00/TOP01
P33 28 TIP01/TOP01
P34 29 TIP10/TOP10
P35 30 TIP11/TOP11
P36 31
P37 32
P38 35 TXDA2
P39 36
P40 22 SIB0
P41 23 SOB0
P42 24
Port 0
I/O
7-bit I/O port
Input/output can be specified in 1-bit units.
Port 1
I/O
2-bit I/O port
Input/output can be specified in 1-bit units.
Port 3
I/O
10-bit I/O port
Input/output can be specified in 1-bit units.
Port 4
I/O
3-bit I/O port
Input/output can be specified in 1-bit units.
INTP3
INTP10
−
−
RXDA2/INTP8
SCKB0
User’s Manual U17717EJ3V0UD
27
CHAPTER 2 PIN FUNCTIONS
Table 2-2. List of Pins (Port Pins) (2/4)
Pin Name Pin No. I/O Function Alternate Function
Port 5
P50 37 KR0/TIQ01/TOQ01
P51 38 KR1/TIQ02/TOQ02
P52 39 KR2/TIQ03/TOQ03/DDI
P53 40 KR3/TIQ00/TOQ00/DDO
P54 41 KR4/DCK
P55 42
P60 43 INTP11
P61 44 INTP12
P62 45 INTP13
P63 46 –
P64 47 –
P65 48 –
P66 49 –
P67 50 –
P68 51 –
P69 52 –
P610 53 TIQ20/TOQ20
P611 54 TIQ21/TOQ21
P612 55 TIQ22/TOQ22
P613 56 TIQ23/TOQ23
P614 57 –
P615 58
P70 144 ANI0
P71 143 ANI1
P72 142 ANI2
P73 141 ANI3
P74 140 ANI4
P75 139 ANI5
P76 138 ANI6
P77 137 ANI7
P78 136 ANI8
P79 135 ANI9
P710 134 ANI10
P711 133 ANI11
P712 132 ANI12
P713 131 ANI13
P714 130 ANI14
P715 129
I/O
6-bit I/O port
Input/output can be specified in 1-bit units.
Port 6
I/O
16-bit I/O port
Input/output can be specified in 1-bit units.
Port 7
I/O
16-bit I/O port
Input/output can be specified in 1-bit units.
KR5/DMS
–
ANI15
28
User’s Manual U17717EJ3V0UD
CHAPTER 2 PIN FUNCTIONS
Table 2-2. List of Pins (Port Pins) (3/4)
Pin Name Pin No. I/O Function Alternate Function
TXDA3
Note
/INTP14
Note
Port 8
P80 59 RXDA3
P81 60
I/O
2-bit I/O port
Input/output can be specified in 1-bit units.
P90 61 KR6/TXDA1
P91 62 KR7/RXDA1
P92 63 TIQ11/TOQ11
Port 9
I/O
16-bit I/O port
Input/output can be specified in 1-bit units.
P93 64 TIQ12/TOQ12
P94 65 TIQ13/TOQ13
P95 66 TIQ10/TOQ10
P96 67 TIP21/TOP21
P97 68 SIB1/TIP20/TOP20
P98 69 SOB1
P99 70 SCKB1
P910 71 SIB2
P911 72 SOB2
P912 73 SCKB2
P913 74 INTP4/PCL
P914 75 INTP5
P915 76
Port 12
P120 128 ANI16
P121 127 ANI17
P122 126 ANI18
I/O
8-bit I/O port
Input/output can be specified in 1-bit units.
INTP6
P123 125 ANI19
P124 124 ANI20
P125 123 ANI21
P126 122 ANI22
P127 121
PCD0 77 –
PCD1 78 –
PCD2 79 –
Port CD
I/O
4-bit I/O port
Input/output can be specified in 1-bit units.
PCD3 80
PCM0 85 WAIT
PCM1 86 CLKOUT
PCM2 87 HLDAK
Port CM
I/O
6-bit I/O port
Input/output can be specified in 1-bit units.
ANI23
–
PCM3 88 HLDRQ
PCM4 89 –
PCM5 90
–
Note
μ
PD70F3711, 70F3712 only
User’s Manual U17717EJ3V0UD
29
CHAPTER 2 PIN FUNCTIONS
Table 2-2. List of Pins (Port Pins) (4/4)
Pin Name Pin No. I/O Function Alternate Function
Port CS
PCS0 81 CS0
PCS1 82 CS1
PCS2 83 CS2
PCS3 84 CS3
PCS4 91 –
PCS5 92 –
PCS6 93 –
PCS7 94
PCT0 95 WR0
PCT1 96 WR1
PCT2 97 –
PCT3 98 –
PCT4 99 RD
PCT5 100 –
PCT6 101 ASTB
PCT7 102
PDL0 105 AD0
PDL1 106 AD1
PDL2 107 AD2
PDL3 108 AD3
PDL4 109 AD4
PDL5 110 AD5/FLMD1
PDL6 111 AD6
PDL7 112 AD7
PDL8 113 AD8
PDL9 114 AD9
PDL10 115 AD10
PDL11 116 AD11
PDL12 117 AD12
PDL13 118 AD13
PDL14 119 AD14
PDL15 120
I/O
8-bit I/O port
Input/output can be specified in 1-bit units.
Port CT
I/O
8-bit I/O port
Input/output can be specified in 1-bit units.
Port DL
I/O
16-bit I/O port
Input/output can be specified in 1-bit units.
–
–
AD15
30
User’s Manual U17717EJ3V0UD
Loading...
+ 786 hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.