PRODUCT INFORMATION
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13429.11 1997-06-26
1320nm
1A439
High-Performance LED
Datacom
The diode chip is isolated from the case.
TO-46 Package With Lens
All dimensions in mm
This device is designed for FDDI and
ATM 155 Mbps applications and
offers an excellent price/performance
ratio for cost-effective solutions. Its
double-lens optical system results in
optimum coupling of power into the
fiber.
Thermal Characteristics
Fiber:
62.5/125mm
Graded
Index
NA=0.275
Optical and Electrical Characteristics
(Case Temperature -25 to +70°C)
Absolute Maximum Ratings
Note 1: Average power at 10 MHz//50% duty cycle. Measured at the exit of 100 meters of fiber.
Note 2: Meets the FDDIANSI X3T9.5 specification.
PARAMETER SYMBOL LIMIT
Storage Temperature T
stg
-55 to +1258C
Operating Temperature (derating: Fig.4) T
op
-55 to +1258C
Electrical Power Dissipation(derating: Fig.4) P
tot
160 mW
Continuous Forward Current (f<10 kHz) I
F
80 mA
Peak Forward Current (duty cycle<50%, f>1 MHz) I
FRM
130 mA
Reverse Voltage V
R
0.5V
Soldering Temperature (2mm from thecase for10sec) T
sld
2608C
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
Thermal Resistance- Infinite Heat Sink R
thjc
150 8C/W
Thermal Resistance- No Heat Sink R
thja
400 8C/W
Temperature Coefficient- Optical Power dP/dT
j
-0.75 %/8C
Temperature Coefficient-Wavelength dl/dT
j
0.45 nm/8C
PARAMETER SYMBOL MIN. TYP. MAX. UNIT TEST CONDITION
Fiber-Coupled Power P
fiber
-18.5 dBm I
Peak
=60mA
(Fig.1,2,&3) (Table1) (Note 1)
Rise and Fall Time tr,t
f
2.5 ns IF=60mA
(10-90%, no bias) (Note 2)
Bandwidth f
c
125 MHz IF=60mA
(3dBel)
Center Wavelength l
c
1320 nm IF=60mA
(Note 2)
Spectral Width(FWHM) Dl 135 nm IF=60mA
(Note 2)
Forward Voltage (Fig.5) V
F
1.3 1.65 V IF=60mA
Reverse Current I
R
100 mA VR=1V
Capacitance C 200 pF VR=0V, f=1MHz