MCC MMBD1503, MMBD1501, MMBD1504A, MMBD1503A, MMBD1501A Datasheet

M C C

omponents 21201 Itasca Street Chatsworth

! "# $% ! "#

Features

•Low Leakage

•Surface Mount Package Ideally Suited for Automatic Insertion

•150oC Junction Temperature

•High Conductance

Mechanical Data

•Case: SOT-23, Molded Plastic

•Terminals: Solderable per MIL-STD-202, Method 208

•Polarity: See Diagram

•Weight: 0.008 grams ( approx.)

Maximum Ratings @ 25oC Unless Otherwise Specified

	Characteristic	Symbol	Value	Unit
	Working Inverse Voltage	VIV	180	V
	DC Forward Current	IF	600	mA
	Average Rectified Current	Io	200	mA
	Recurrent Peak Forward Current	if	700	mA
	Peak Forward Surge Current @ t=1.0s	if(surge)	1.0	A
	@t=1.0ms		2.0
	Power Dissipation	Pd	350	mW
	Thermal Resistance	R	357	o C/W
	Operation & Storage Temp. Range	Tj, TSTG	-55 to +150	oC

Note: 1) These ratings are based on a max. junction temperature of 150 degrees C 2) These are steady state limits. T he factory should be consulted on applications

involving pulsed or low duty cycle operation

Electrical Characteristics @ 25oC Unless Otherwise Specified

	Charateristic	Symbol	Min	Max	Unit	Test Cond.
	Breakdown Voltage	BV	200		V	IR=5.0uA
			620	750	mV	I F=1.0mA
			720	850	mV	IF =10mA
	Forward Voltage Drop	VF	800	950	mV	IF =50mA
			0.83	1.1	V	IF =100mA
			0.87	1.3	V	IF =200mA
			0.9	1.5	V	IF =300mA
				1.0	nA	VR=125V
	Reverse Current	IR	-----	3.0	uA	VR =125V T A=150oC
				10	nA	VR=180V
				5.0	uA	VR =180V T A=150oC
	Junction Capacitance	Cj	-----	4	pF	VR =0V, f=1.0MHz

MMBD1501(A)

THRU

MMBD1505(A)

High Conductance

Low Leakage Diode

		350mW
		SOT-23
	A
		D
		C	B
F	E
G		H	J
	K
		DIMENSIONS
	INCHES		MM
DIM	MIN	MAX	MIN	MAX	NOTE
A	.110	.120	2.80	3.04
B	.083	.098	2.10	2.64
C	.047	.055	1.20	1.40
D	.035	.041	.89	1.03
E	.070	.081	1.78	2.05
F	.018	.024	.45	.60
G	.0005	.0039	.013	.100
H	.035	.044	.89	1.12
J	.003	.007	.085	.180
K	.015	.020	.37	.51

Suggested Solder

Pad Layout

.031

.800

.035

.900

.079	inches
2.000	mm

.037

.950

.037

.950

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