MCC ER2D, ER2G, ER2J, ER2M, ER2K Datasheet

M C C

omponents 21201 Itasca Street Chatsworth

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Features

∙For Surface Mount Applications

∙Extremely Low Thermal Resistance

∙Easy Pick And Place

∙High Temp Soldering: 250°C for 10 Seconds At Terminals

∙Superfast Recovery Times For High Efficiency

Maximum Ratings

∙Operating Temperature: -50°C to +150°C

∙Storage Temperature: -50°C to +150°C

∙Maximum Thermal Resistance; 20°C/W Junction To Lead

MCC		Device		Maximum	Maximum		Maximum
Catalog		Marking		Recurrent	RMS		DC
Number				Peak Reverse	Voltage		Blocking
				Voltage			Voltage
ER2A		ER2A		50V	35V		50V
ER2B		ER2B		100V	70V		100V
ER2C		ER2C		150V	105V		150V
ER2D		ER2D		200V	140V		200V
ER2G		ER2G		400V	280V		400V
ER2J		ER2J		600V	420V		600V
ER2K		ER2K		800V	560V		800V
ER2M		ER2M		1000V	700V		1000V

Electrical Characteristics @ 25°C Unless Otherwise Specified

	Average Forward	IF(AV)	2.0A	TJ = 75°C
	Current
	Peak Forward Surge	IFSM	50A	8.3ms, half sine
	Current
	Maximum
	Instantaneous
	Forward Voltage
	ER2A-D	VF	.975V	IFM = 2.0A;
	ER2G-K		1.35V	TJ = 25°C*
	ER2M		1.60V
	Maximum DC
	Reverse Current At	IR	5μA	TJ = 25°C
	Rated DC Blocking		μ	°
	Voltage		150 A	TJ = 100 C
	Maximum Reverse
	Recovery Time
	ER2A-D	Trr	50ns	IF=0.5A, IR=1.0A,
	ER2G-K		60ns	Irr=0.25A
	ER2M		100ns
	Typical Junction	CJ	25pF	Measured at
	Capacitance			1.0MHz, VR=4.0V

*Pulse test: Pulse width 200 μsec, Duty cycle 2%

ER2A

THRU

ER2M

2 Amp Super Fast

Recovery

Silicon Rectifier

50 to 1000 Volts

DO-214AA

(SMBJ) (Round Lead)

H

Cathode Band

J

																		A											C
											E								D						B
					F
					G
															DIMENSIONS
					INCHES														MM
	DIM					MIN						MAX						MIN					MAX			NOTE
	A			.078							.116						1.98				2.95
	B			.075							.089						1.90				2.25
	C			.002							.008						.05				.20
	D			-----							.02						-----				.51
	E			.035							.055						.90				1.40
	F			.065							.091						1.65				2.32
	G			.205							.224						5.21				5.69
	H			.160							.180						4.06				4.57
	J			.130							.155						3.30				3.94

SUGGESTED SOLDER

PAD LAYOUT

0.090"

0.085”

0.070”

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