MCC HDBS105G, HDBS104G, HDBS103G, HDBS102G, HDBS101G Datasheet

M C C

omponents 21201 Itasca Street Chatsworth

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Features

∙High Forward Surge Capability

∙Ideal for printed circuit boards

∙High Temperature Soldering: 250oC for 10 seconds

∙Reliable low cost construction utilizing molded plastic technique

Maximum Ratings

∙Operating Temperature: -55°C to +150°C

∙Storage Temperature: -55°C to +150°C

∙For Capacitive Load, Derate Current by 20%

	Maximum
	Recurrent	Maximum	Maximum DC
MCC	Peak Reverse	RMS	Blocking
Part Number	Voltage	Voltage	Voltage
HDBS101G	50V	35V	50V
HDBS102G	100V	70V	100V
HDBS103G	200V	140V	200V
HDBS104G	400V	280V	400V
HDBS105G	600V	420V	600V
HDBS106G	800V	560V	800V
HDBS107G	1000V	700V	1000V

Electrical Characteristics @ 25°C Unless Otherwise Specified

	Average Forward	IF(AV)	1.0 A	TC = 40°C
	Current
	Peak Forward Surge	IFSM	50A	8.3ms, half sine
	Current			TJ=150oC
	Maximum
	Instantaneous
	Forward Voltage	VF
	HDBS101G-103G		1.0V	IFM = 1.0A;
	HDBS104G		1.3V	TC = 25°C
	HDBS105G-107G		1.7V
	Maximum DC
	Reverse Current At	IR	5.0μA	TC = 25°C
	Rated DC Blocking		500uA	TC = 125°C
	Voltage
	Maximum Reverse
	Recovery Time	Trr
	HDBS101G-104G		50ns	IF=0.5A, IR=1.0A,
	HDBS105G-107G		75ns	Irr=0.25A

HDBS101G

THRU

HDBS107G

1.0 AMP. Glass

Passivated Bridge

High Efficient Rectifier

50 to 1000 Volts

																SDB-1
			B						-			+																	D
																																												C
																K
																																Notch in Case
		G												A
																													E
														H
																				DIMENSIONS
											INCHES																					MM
	DIM								MIN							MAX												MIN						MAX								NOTE
		A			.320										.335												8.13						8.50
		B			.245										.255												6.20						6.50
		C			.040										.060												1.02						1.52
		D			.386										.404												9.80						10.3
		E			.120										.130												3.05						3.30
		G			.003										.013												0.076						0.33
		H			.195										.205												5.00						5.20
		K			.040										.047												1.02						1.20									TYP

Suggested Solder Pad

Layout

.047”

.344”

.060”

.205”

www.mccsemi.com

Version: 3

2003/01/30