MCC GS1K, GS1J, GS1A, GS1D, GS1B Datasheet

M C C

omponents 21201 Itasca Street Chatsworth

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Features

∙For Surface Mount Applications

∙Extremely Low Thermal Resistance

∙Easy Pick And Place

∙High Temp Soldering: 250°C for 10 Seconds At Terminals

Maximum Ratings

∙Operating Temperature: -55°C to +150°C

∙Storage Temperature: -55°C to +150°C

∙Maximum Thermal Resistance; 15 °C/W Junction To Lead

MCC	Device	Maximum	Maximum	Maximum
Catalog	Marking	Recurrent	RMS	DC
Number		Peak Reverse	Voltage	Blocking
		Voltage		Voltage
GS1A	GS1A	50V	35V	50V
GS1B	GS1B	100V	70V	100V
GS1D	GS1D	200V	140V	200V
GS1G	GS1G	400V	280V	400V
GS1J	GS1J	600V	420V	600V
GS1K	GS1K	800V	560V	800V
GS1M	GS1M	1000V	700V	1000V

Electrical Characteristics @ 25°C Unless Otherwise Specified

Average Forward	IF(AV)	1.0A	TJ = 75°C
current
Peak Forward Surge	IFSM	30A	8.3ms, half sine,
Current
Maximum		1.1V	IFM = 1.0A;
Instantaneous	VF		TJ = 25°C*
Forward Voltage
Maximum DC
Reverse Current At	IR	10μA	TJ = 25°C
Rated DC Blocking		μ	°
Voltage		50 A	TJ = 125 C
Typical Junction	CJ	15pF	Measured at
Capacitance			1.0MHz, VR=4.0V

*Pulse test: Pulse width 300 μsec, Duty cycle 2%

GS1A

THRU

GS1M

1 Amp

Silicon Rectifier 50 to 1000 Volts

DO-214AC

(SMAJ) (High Profile)

H

Cathode Band

J

																		A											C
											E								D						B
					F
					G
															DIMENSIONS
					INCHES														MM
	DIM					MIN						MAX						MIN						MAX		NOTE
	A			.078							.116						1.98				2.95
	B			.067							.089						1.70				2.25
	C			.002							.008						.05				.20
	D			---							.02						---				.51
	E			.035							.055						.89				1.40
	F			.065							.096						1.65				2.45
	G			.205							.224						5.21				5.69
	H			.160							.180						4.06				4.57
	J			.100							.112						2.57				2.84

SUGGESTED SOLDER

PAD LAYOUT

0.090”

0.085”

0.070”

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