MCC GS2B, GS2M, GS2K, GS2J, GS2G Datasheet

M C C

omponents 21201 Itasca Street Chatsworth

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Features

•Extremely Low Thermal Resistance

•For Surface Mount Application

•Higher Temp Soldering: 250oC for 10 Seconds At Terminals

•Available on Tape and Reel

Maximum Ratings

•Operating Temperature: -55oC to +150oC

•Storage Temperature: -55oC to +150oC

				Maximum
	MCC	Device		Reccurrent		Maximum			Maximum
	Catalog			Peak		RMS			DC Blocking
		Marking
	Number			Reverse		Voltage			Voltage
				Voltage
	GS2A	GS2A		50V		35V			50V
	GS2B	GS2B		100V		70V			100V
	GS2D	GS2D		200V		140V			200V
	GS2G	GS2G		400V		280V			400V
	GS2J	GS2J		600V		420V			600V
	GS2K	GS2K		800V		560V			800V
	GS2M	GS2M		1000V		700V			1000V
	Electrical Characteristics @ 25oC Unless Otherwise Specified
	Average Forward			IF(AV)		2.0A			TJ=75	o	C
	Current
	Peak Forward Surge			IFSM		50A			8.3ms half
	Current								sine
	Maximum			VF		1.10V			IFM=2.0A
	Instantaneous Forward
									TA=25	o	C
	Voltage
	Maximum DC Reverse					10.0uA			TJ=25o C
	Current At Rated DC			IR
	Blocking Voltage
	Typical Junction							Measured at
				C j		20pF			1.0MHz,
	Capacitance
									V R=4.0V

Pulse test: Pulse width 300 usec, duty cycle 2%.

GS2A

THRU

GS2M

2.0 Amp

Silicon Rectifier 50 to 1000 Volts

DO-214AC

(SMAJ) (High Profile)

H

Cathode Band

J

		A	C
	E	D	B
F
G
		DIMENSIONS

	INCHES		MM
DIM	MIN	MAX	MIN	MAX	NOTE
A	.078	.116	1.98	2.95
B	.067	.089	1.70	2.25
C	.002	.008	.05	.20
D	---	.02	---	.51
E	.035	.055	.89	1.40
F	.065	.096	1.65	2.45
G	.205	.224	5.21	5.69
H	.160	.180	4.06	4.57
J	.100	.112	2.57	2.84

SUGGESTED SOLDER

PAD LAYOUT

0.090”

0.085”

0.070”

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