MCC HD02, HD01, HD10, HD08, HD06 Datasheet

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MCC HD02, HD01, HD10, HD08, HD06 Datasheet

 

 

M C C

omponents

 

21201 Itasca Street Chatsworth

 

 

 

 

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Features

Surface Mount Package

Rating to 1000V PRV

Ideal for Printed Circuit Board

Lead tin Plated Copper

HD01

THRU

HD10

0.8 Amp Single Phase Glass Passivated Bridge Rectifier 100 to 1000 Volts

Maximum Ratings

Operating Junction Temperature: -55°C to +150°C

Storage Temperature: -55°C to +150°C

Typical Thermal Resistance 75°C/W Junction to ambient

MCC

Device

Maximum

Maximum

Maximum

Catalog

Marking

Recurrent

RMS

DC

Number

 

Peak Reverse

Voltage

Blocking

 

 

Voltage

 

Voltage

HD01

HD01

100V

70V

100V

HD02

HD02

200V

140V

200V

HD04

HD04

400V

280V

400V

HD06

HD06

600V

420V

600V

HD08

HD08

800V

560V

800V

HD10

HD10

1000V

700V

1000V

Electrical Characteristics @ 25°C Unless Otherwise Specified

Average Forward

IF(AV)

0.8 A

TA = 40°C

Current

 

 

 

Peak Forward Surge

IFSM

30A

8.3ms, half sine

Current

 

 

 

Maximum

 

1.0V

IFM = 0.4A;

Instantaneous

VF

Forward Voltage

 

 

°

 

 

 

TA = 25 C

Maximum DC

 

 

 

Reverse Current At

IR

5μA

TJ= 25°C

Rated DC Blocking

 

0.5mA

°

Voltage

 

 

TJ = 125 C

 

 

 

Typical Junction

CJ

15pF

Measured at

Capacitance

 

 

1.0MHz, VR=4.0V

*Pulse Test: Pulse Width 300μsec, Duty Cycle 1%

 

 

HDDF

 

 

D

 

 

C

 

H

 

 

 

 

 

 

 

G

 

 

I

 

 

 

 

 

 

 

A

 

 

 

F

 

 

 

 

 

 

 

 

E

 

 

 

 

B

 

 

 

 

 

DIMENSIONS

 

 

 

INCHES

 

MM

 

 

DIM

MIN

MAX

MIN

MAX

NOTE

A

.177

.193

4.50

4.90

 

B

.091

.106

2.30

2.70

 

C

---

.276

---

7.00

 

D

.142

.157

3.60

4.00

 

E

.091

.106

2.30

2.70

 

F

---

.008

---

0.20

 

G

.020

.031

0.50

0.80

 

H

.028

.043

0.70

1.10

 

I

.006

.014

0.15

0.35

 

Suggested Solder Pad

Layout

.030”MIN

.272”MAX

.023”MIN

.105”

.095”

www.mccsemi.com

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