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COMe-mBT10
Document Revision 110
www.kontron.com
» Table of Contents « |
|
|
1 |
User Information.................................................................................. |
5 |
1.1 |
About This Document.................................................................................................................... |
5 |
1.2 |
Copyright Notice.......................................................................................................................... |
5 |
1.3 |
Trademarks................................................................................................................................. |
5 |
1.4 |
Standards................................................................................................................................... |
5 |
1.5 |
Warranty.................................................................................................................................... |
6 |
1.6 |
Technical Support......................................................................................................................... |
6 |
2 |
Introduction........................................................................................ |
7 |
2.1 |
Product Description...................................................................................................................... |
7 |
2.2 |
Naming clarification..................................................................................................................... |
7 |
2.3 |
Understanding COM Express® Functionality....................................................................................... |
8 |
2.4 |
COM Express® Documentation......................................................................................................... |
9 |
2.5 |
COM Express® Benefits.................................................................................................................. |
9 |
3 |
Product Specification.......................................................................... |
10 |
3.1 |
Module definition....................................................................................................................... |
10 |
3.2 |
Functional Specification............................................................................................................... |
12 |
3.3 |
Block Diagram............................................................................................................................ |
16 |
3.4 |
Accessories................................................................................................................................ |
17 |
3.5 |
Electrical Specification................................................................................................................ |
18 |
3.5.1 |
Supply Voltage........................................................................................................................... |
18 |
3.5.2 |
Power Supply Rise Time................................................................................................................ |
18 |
3.5.3 |
Supply Voltage Ripple.................................................................................................................. |
18 |
3.5.4 |
Power Consumption..................................................................................................................... |
18 |
3.5.5 |
ATX Mode.................................................................................................................................. |
19 |
3.5.6 |
Single Supply Mode..................................................................................................................... |
19 |
3.6 |
Power Control............................................................................................................................ |
20 |
3.7 |
Environmental Specification......................................................................................................... |
21 |
3.7.1 |
Temperature Specification............................................................................................................ |
21 |
3.7.2 |
Humidity................................................................................................................................... |
21 |
3.8 |
Standards and Certifications......................................................................................................... |
22 |
3.9 |
MTBF........................................................................................................................................ |
24 |
3.10 |
Mechanical Specification.............................................................................................................. |
25 |
3.11 |
Module Dimensions..................................................................................................................... |
26 |
3.12 |
Onboard Fan Connector................................................................................................................ |
28 |
3.13 |
Thermal Management, Heatspreader and Cooling Solutions................................................................. |
29 |
4 |
Features and Interfaces....................................................................... |
30 |
4.1 |
Onboard eMMC Flash.................................................................................................................... |
30 |
4.2 |
Secure Digital Card...................................................................................................................... |
32 |
4.3 |
S5 Eco Mode.............................................................................................................................. |
33 |
www.kontron.com
COMe-mBT10 /
4.4 |
LPC.......................................................................................................................................... |
34 |
4.5 |
Serial Peripheral Interface (SPI).................................................................................................... |
35 |
4.6 |
SPI boot.................................................................................................................................... |
35 |
4.7 |
M.A.R.S.................................................................................................................................... |
37 |
4.8 |
UART........................................................................................................................................ |
38 |
4.9 |
Fast I2C.................................................................................................................................... |
39 |
4.10 |
Dual Staged Watchdog Timer......................................................................................................... |
40 |
4.11 |
Speedstep Technology.................................................................................................................. |
41 |
4.12 |
C-States.................................................................................................................................... |
42 |
4.13 |
Graphics Features....................................................................................................................... |
43 |
4.14 |
ACPI Suspend Modes and Resume Events.......................................................................................... |
44 |
4.15 |
USB......................................................................................................................................... |
45 |
5 |
System Resources............................................................................... |
46 |
5.1 |
Interrupt Request (IRQ) Lines........................................................................................................ |
46 |
5.2 |
Memory Area............................................................................................................................. |
46 |
5.3 |
I/O Address Map......................................................................................................................... |
47 |
5.4 |
Peripheral Component Interconnect (PCI) Devices............................................................................. |
48 |
5.5 |
LPC addresses............................................................................................................................ |
48 |
5.6 |
I2C Bus..................................................................................................................................... |
49 |
5.7 |
System Management (SM) Bus....................................................................................................... |
49 |
6 |
Pinout List......................................................................................... |
50 |
6.1 |
General Signal Description............................................................................................................ |
50 |
6.2 |
Connector X1A Row A................................................................................................................... |
51 |
6.3 |
Connector X1A Row B................................................................................................................... |
53 |
7 |
BIOS Operation................................................................................... |
55 |
7.1 |
Determining the BIOS Version....................................................................................................... |
55 |
7.2 |
BIOS Update.............................................................................................................................. |
55 |
7.3 |
POST Codes................................................................................................................................ |
56 |
7.4 |
Setup Guide............................................................................................................................... |
56 |
7.5 |
BIOS Setup................................................................................................................................ |
57 |
7.5.1 |
Main........................................................................................................................................ |
57 |
7.5.2 |
Advanced.................................................................................................................................. |
62 |
7.5.3 |
Security.................................................................................................................................... |
85 |
7.5.4 |
Boot........................................................................................................................................ |
86 |
7.5.5 |
Exit.......................................................................................................................................... |
87 |
4
COMe-mBT10 / User Information
1User Information
1.1About This Document
This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of third parties are concerned.
1.2Copyright Notice
Copyright © 2003-2014 Kontron Europe GmbH
All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the express written permission of Kontron Europe GmbH.
DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.
1.3Trademarks
The following lists the trademarks of components used in this board.
»IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.
»Microsoft is a registered trademark of Microsoft Corp.
»Intel is a registered trademark of Intel Corp.
»All other products and trademarks mentioned in this manual are trademarks of their respective owners.
1.4Standards
Kontron Europe GmbH is certified to ISO 9000 standards.
5
COMe-mBT10 / User Information
1.5Warranty
For this Kontron Europe GmbH product warranty for defects in material and workmanship exists as long as the warranty period, beginning with the date of shipment, lasts. During the warranty period, Kontron Europe GmbH will decide on its discretion if defective products are to be repaired or replaced.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.
Warranty does not apply for defects arising/resulting from improper or inadequate maintenance or handling by the buyer, unauthorized modification or misuse, as well as the operation outside of the product´s environmental specifications and improper installation and maintenance.
Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron Europe GmbH that are caused by a faulty Kontron Europe GmbH product.
1.6Technical Support
Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are committed to make our product easy to use and will help you use our products in your systems.
Please consult our Website at http://www.kontron.com/support for the latest product documentation, utilities, drivers and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and software. In any case you can always contact your board supplier for technical support.
6
COMe-mBT10 / Introduction
2Introduction
2.1Product Description
At the SPS/IPC/Drives show, Kontron unveiled the new credit card sized Computer-on-Modules based on the world’s leading form factor standard COM Express®. The performance range of the new COM Express® mini modules is highly scalable and covers the entire embedded range of Intel® Atom™ Processor E3800 and Intel® Celeron® Processor N2900 and J1900 Product Families, formerly codenamed ‘Bay Trail’. The most impressive feature of the new Kontron COMe-mBT10 Computer-on-Module family is the three times higher graphics performance compared to previous Intel® Atom™ processors coupled with unbeatable TDP (thermal design power) values. And although all the Intel® Atom™ processor E3800 based modules are designed for the extended temperature range from -40 to +85°C, they offer an extensive set of features, including PCIe extension options, new security functions, and optional ECC memory . The rich, powerful and flexible x86 featureset in combination with the low-power credit card-sized footprint make the new COM Express® mini Computer-on-Modules a perfect fit for an extremely wide range of new, graphic-rich multi-touch applications.
Users in all markets will benefit from double the performance, significantly improved performance-per-watt ratios and the long-term availability which the rugged new x86 modules offer. The range of applications includes everything from slim but graphics-rich and open, programmable industrial tablets and handheld PCs to in-vehicle systems and stationary HMIs and controllers. Targeted industries are POS/POI, infotainment, digital signage, gaming, and medical technology as well as industrial automation, and machine and plant engineering. With the availability of the new COM Express® mini Computer-on-Modules, developers can directly make use of the extensive x86 ecosystem and the world’s leading COM Express® form factor standard.
The new Kontron COMe-mBT10 COM Express® mini Computer-on-Module family (55 mm x 84 mm) with Type 10 pin-out is equipped with Intel® Atom™ processor E3800 or Intel® Celeron® processors. Several module variants are included in the range, offering wide scalability from low-power single-core Intel® Atom™ (1.46 GHz / 5 W TDP) processor performance for energy-sensitive applications through to genuine quad-core Intel® Atom™ (4x 1.91 GHz/ 10 W TDP) and Intel® Celeron® (4x 2.42 GHz / 10 W TDP ) processor performance in high-end applications ). The new Intel® Gen 7 HD graphics integrated on the SoC offer up to three times more graphical power, including DirectX 11, OpenGL 3.1, and OpenCL 1.1 support for two independent displays with 1x DP++ (DP/HDMI/DVI) up to 2560×1600@60Hz and 1x Single Channel LVDS 18/24bit with DPtoLVDS up to 1920×1200 (optional eDP). New video HD technology additionally enables brilliant video reproduction and stereoscopic 3D viewing for an immersive user experience. The modules come with options for data memory: two SATA II 300 Mbps interfaces or versions with additional eMMC memory (up to 64 GB) . In addition to having two serial ports, they include a Super Fast USB 3.0 interface, up to eight USB 2.0, Gigabit Ethernet, plus three Gen 2 PCI-Express x1 lanes for customer specific expansions.
2.2Naming clarification
COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer, packaged as a super component.
»COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm)
»COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm)
»COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm)
The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard (COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and the pin-out type (#) followed by the CPU Name.
7
COMe-mBT10 / Introduction
2.3Understanding COM Express® Functionality
All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the following maximum amount of interfaces according to the PICMG module Pin-out type:
Feature |
Pin-Out Type 1 |
Pin-Out Type 10 |
Pin-Out Type 2 |
Pin-Out Type 6 |
HD Audio |
1x |
1x |
1x |
1x |
Gbit Ethernet |
1x |
1x |
1x |
1x |
Serial ATA |
4x |
4x |
4x |
4x |
Parallel ATA |
- |
- |
1x |
- |
PCI |
- |
- |
1x |
- |
PCI Express x1 |
6x |
6x |
6x |
8x |
PCI Express x16 (PEG) |
- |
- |
1x |
1x |
USB Client |
1x |
1x |
- |
- |
USB 2.0 |
8x |
8x |
8x |
8x |
USB 3.0 |
- |
2x |
- |
4x |
VGA |
1x |
- |
1x |
1x |
LVDS |
Dual Channel |
Single Channel |
Dual Channel |
Dual Channel |
DP++ (SDVO/DP/HDMI/DVI) |
1x optional |
1x |
3x shared with PEG |
3x |
LPC |
1x |
1x |
1x |
1x |
External SMB |
1x |
1x |
1x |
1x |
External I2C |
1x |
1x |
1x |
1x |
GPIO |
8x |
8x |
8x |
8x |
SDIO shared w/GPIO |
1x optional |
1x optional |
- |
1x optional |
UART (2-wire COM) |
- |
2x |
- |
2x |
FAN PWM out |
- |
1x |
- |
1x |
|
|
|
|
|
8
COMe-mBT10 / Introduction
2.4COM Express® Documentation
This product manual serves as one of three principal references for a COM Express® design. It documents the specifications and features of COMe-mBT10. Additional references are available at your Kontron Support or at PICMG®:
»The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document is available at the PICMG® website by filling out the order form.
»The COM Express® Design Guide by PICMG® serves as a general guide for baseboard design, with a focus on maximum flexibility to accommodate a wide range of COM Express® modules.
Some of the information contained within this product manual applies only to certain product revisions (CE: xxx). If certain information applies to specific product revisions (CE: xxx) it will be stated. Please check the product revision of your module to see if this information is applicable.
2.5COM Express® Benefits
COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a standardized form factor and a standardized connector layout which carry a specified set of signals. Each COM is based on the COM Express® specification. This standardization allows designers to create a single-system baseboard that can accept present and future COM Express® modules.
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.
A single baseboard design can use a range of COM Express® modules with different sizes and pin-outs. This flexibility can differentiate products at various price/performance points, or when designing future proof systems that have a built-in upgrade path. The modularity of a COM Express® solution also ensures against obsolescence when computer technology evolves. A properly designed COM Express® baseboard can work with several successive generations of COM Express® modules.
A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally, delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.
9
COMe-mBT10 / Product Specification
3Product Specification
3.1Module definition
The COM Express® mini sized Computer-on-Module COMe-mBT10 (MVV1) follows pin-out Type 10 and is compatible to PICMG specification COM.0 Rev 2.1. The COMe-mBT10, based on Intel's Bay Trail platform, is available in different variants to cover the demand of different performance, price and power:
Industrial temperature grade modules (E2: -40°C to +85°C operating)
Part Number |
Product Name |
|
Processor |
Memory |
ECC |
eMMC |
Ethernet |
SDIO |
USB 2.0 |
34006-4016-19-4 |
COMe-mBTi10 E3845 4E/16GB |
BayTrail-I Intel® Atom E3845 |
4GB |
Yes |
16GB MLC |
Intel® i210IT |
shared w/GPIO |
8x |
|
34006-2000-19-4 |
COMe-mBTi10 E3845 2GB |
BayTrail-I Intel® Atom E3845 |
2GB |
- |
- |
Intel® i210IT |
shared w/GPIO |
8x |
|
34006-2000-17-2 |
COMe-mBTi10 E3827 2GB |
BayTrail-I Intel® Atom E3827 |
2GB |
- |
- |
Intel® i210IT |
shared w/GPIO |
8x |
|
34006-1040-17-2 |
COMe-mBTi10 E3827 1E/4S |
BayTrail-I Intel® Atom E3827 |
1GB |
Yes |
4GB SLC |
Intel® i210IT |
shared w/GPIO |
8x |
|
34006-2000-15-2 |
COMe-mBTi10 E3826 2GB |
BayTrail-I Intel® Atom E3826 |
2GB |
- |
- |
Intel® i210IT |
shared w/GPIO |
8x |
|
34006-2000-13-2 |
COMe-mBTi10 E3825 2GB |
BayTrail-I Intel® Atom E3825 |
2GB |
- |
- |
Intel® i210IT |
shared w/GPIO |
8x |
|
34006-1020-15-1 |
COMe-mBTi10 E3815 |
1E/2S |
BayTrail-I Intel® Atom E3815 |
1GB |
Yes |
2GB SLC |
Intel® i210IT |
shared w/GPIO |
8x |
34006-1000-15-1 |
COMe-mBTi10 E3815 |
1GB |
BayTrail-I Intel® Atom E3815 |
1GB |
- |
- |
Intel® i210IT |
shared w/GPIO |
8x |
|
|
|
|
|
|
|
|
|
|
Commercial temperature grade modules (0°C to +60°C operating)
Part Number |
Product Name |
|
Processor |
Memory |
ECC |
eMMC |
Ethernet |
SDIO |
USB 2.0 |
34007-4000-20-4 |
COMe-mBTc10 J1900 4GB |
BayTrail-D Intel® Celeron J1900 |
4GB |
- |
- |
Intel® i211AT |
- |
4x |
|
34007-2000-18-4 |
COMe-mBTc10 N2930 2GB |
BayTrail-M Intel® Celeron N2930 |
2GB |
- |
- |
Intel® i211AT |
- |
4x |
|
34007-2000-16-2 |
COMe-mBTc10 N2807 2GB |
BayTrail-M Intel® Celeron N2807 |
2GB |
- |
- |
Intel® i211AT |
- |
4x |
|
34007-1020-15-1 |
COMe-mBTc10 E3815 |
1GB/2S |
BayTrail-I Intel® Atom E3815 |
1GB |
- |
2GB SLC |
Intel® i211AT |
- |
4x |
34007-1000-15-1 |
COMe-mBTc10 E3815 |
1GB |
BayTrail-I Intel® Atom E3815 |
1GB |
- |
- |
Intel® i211AT |
- |
4x |
|
|
|
|
|
|
|
|
|
|
Memory configurations: (3400x-MMFF-xx-x)
»MM = 10: 1024MB DDR3L Memory (8x1Gbit / 128Mx8)
»MM = 20: 2048MB DDR3L Memory (8x2Gbit / 256Mx8)
»MM = 40: 4096MB DDR3L Memory (8x4Gbit / 512Mx8)
»MM = 80: 8192MB DDR3L Memory (8x8Gbit / 1024Mx8)
Onboard Flash configurations, available on E3800 variants only (3400x-MMFF-xx-x)
»FF = 00: without eMMC Flash
»FF = 20: 2GB onboard eMMC Flash
»FF = 40: 4GB onboard eMMC Flash
»FF = 80: 8GB onboard eMMC Flash
»FF = 16: 16GB onboard eMMC Flash
»FF = 32: 32GB onboard eMMC Flash
»FF = 64: 64GB onboard eMMC Flash
10
COMe-mBT10 / Product Specification
Optional hardware features for E3800 Series CPU
»TPM
»ECC memory
»eMMC Flash
»eDP on COMe
»General Purpose SPI instead of Boot SPI
Optional hardware features for Celeron Series CPU
»TPM
»eDP on COMe
»USB Hub for USB #4-7 support on COMe
»General Purpose SPI instead of Boot SPI
Optional BIOS/Software features:
» TXE Firmware with Encryption support (AES, PAVP …)
Optional hardware and BIOS features are available project based only for variants not listed above. Please contact your local sales for customized articles.
11
COMe-mBT10 / Product Specification
3.2Functional Specification
Processor
The 32nm Intel® Atom™ E3800 / Celeron® (BayTrail-I/M/D) CPU family supports:
»Intel® 64
»Enhanced Intel SpeedStep® Technology
»Thermal Monitoring Technologies
»Execute Disable Bit
»Virtualization Technology VT-x
»2 Display Pipes for dual independent displays
CPU specifications
Intel® |
Atom™ |
Atom™ |
Atom™ |
Atom™ |
Atom™ |
Atom™ |
Celeron® |
Celeron® |
Celeron® |
- |
E3845 |
E3827 |
E3826 |
E3825 |
E3815 |
E3805 |
J1900 |
N2930 |
N2807 |
Stepping |
D0 |
D0 |
D0 |
D0 |
D0 |
D0 |
C0 |
C0 |
C0 |
# of Cores |
4 |
2 |
2 |
2 |
1 |
2 |
4 |
4 |
2 |
# of Threads |
4 |
2 |
2 |
2 |
1 |
2 |
4 |
4 |
2 |
CPU Nominal frequency |
1.91GHz |
1.75GHz |
1.46GHz |
1.33GHz |
1.46GHz |
1.33GHz |
2.00GHz |
1.83GHz |
1.58GHz |
CPU Burst frequency |
- |
- |
- |
- |
- |
- |
2.42GHz |
2.16GHz |
2.16GHz |
LFM/LPM Frequency |
533MHz |
533MHz |
533MHz |
533MHz |
533MHz |
533MHz |
1333MHz |
500MHz |
533MHz |
Tjunction |
110°C |
110°C |
110°C |
110°C |
110°C |
110°C |
105°C |
105°C |
105°C |
Thermal Design Power (TDP) |
10W |
8W |
7W |
6W |
5W |
3W |
10W |
7.5W |
4.3W |
SDP |
- |
- |
- |
- |
- |
- |
- |
4.5W |
2.5W |
C-States |
C1/C1E/C6 |
C1/C1E/C6 |
C1/C1E/C6 |
C1/C1E/C6 |
C1/C1E/C6 |
C1/C1E/C6 |
C1/C1E/C6 |
C1/C1E/C6/C |
C1/C1E/C6/C |
|
|
|
|
|
|
|
|
7 |
7 |
Smart Cache |
2x1MB |
2x512kB |
2x512kB |
2x512kB |
512kB |
512kB |
2x1MB |
2x1MB |
2x512kB |
Memory Type |
DDR3L-1333 |
DDR3L-1333 |
DDR3L-1066 |
DDR3L-1066 |
DDR3L-1066 |
DDR3L-1066 |
DDR3L-1333 |
DDR3L-1333 |
DDR3L-1333 |
Max Memory Size on Module |
8GB |
8GB |
8GB |
8GB |
8GB |
8GB |
8GB |
8GB |
8GB |
ECC Memory(optional) |
Yes |
Yes |
Yes |
Yes |
Yes |
Yes |
No |
No |
No |
Graphics Model |
Intel HD® |
Intel HD® |
Intel HD® |
Intel HD® |
Intel HD® |
- |
Intel HD® |
Intel HD® |
Intel HD® |
GFX Base Frequency |
542MHz |
542MHz |
533MHz |
533MHz |
400MHz |
- |
688MHz |
313MHz |
313MHz |
GFX Max Dynamic Frequ. |
792MHz |
792MHz |
667MHz |
- |
- |
- |
854MHz |
854MHz |
750MHz |
GFX Technology |
GT1 4EU |
GT1 4EU |
GT1 4EU |
GT1 4EU |
GT1 4EU |
- |
GT1 4EU |
GT1 4EU |
GT1 4EU |
SDIO |
Yes |
Yes |
Yes |
Yes |
Yes |
Yes |
No |
No |
No |
eMMC |
Yes |
Yes |
Yes |
Yes |
Yes |
Yes |
No |
No |
No |
AES-NI (optional) |
Yes |
Yes |
Yes |
Yes |
Yes |
Yes |
No |
No |
No |
Memory
Sockets |
memory down |
Memory Type |
DDR3L-1066/1333 |
Maximum Size |
1 - 8GB (ECC optional) |
Technology |
Single Channel (64bit) |
|
|
12
COMe-mBT10 / Product Specification
Graphics Core
The integrated Intel® HD Graphics (Gen 7) supports:
Graphics Core Render Clock |
Intel® HD Graphics (Gen 7) |
|
311-542MHz Clock |
|
667-854MHz Turbo |
Execution Units / Pixel Pipelines |
4 |
Max Graphics Memory |
2048MB |
GFX Memory Bandwidth (GB/s) |
up to 21.3 |
GFX Memory Technology |
DVMT |
API (DirectX/OpenGL) |
11 / 3.0 + OCL 1.1 |
Shader Model |
3.0 |
Hardware accelerated Video |
H.264 / MPEG1,2,4 / VC1 / WMV9 / Blu-ray |
Independent/Simultaneous Displays |
2 |
Display Port |
DP 1.1a / eDP 1.3 |
HDCP support |
HDCP / PAVP 2 (optional) |
|
|
Monitor output
CRT max Resolution |
- |
TV out: |
- |
|
|
LVDS
LVDS Bits/Pixel |
1x18 / 1x24 (PTN3460 DP2LVDS) |
LVDS Bits/Pixel with dithering |
- |
LVDS max Resolution: |
1366x768 |
PWM Backlight Control: |
YES |
Supported Panel Data: |
EDID/DID |
|
|
Display Interfaces
Discrete Graphics |
- |
Digital Display Interface DDI1 |
DP++ |
Digital Display Interface DDI2 |
- |
Digital Display Interface DDI3 |
- |
Maximum Resolution on DDI |
2560x1600@60Hz |
|
|
Storage
onboard SSD |
2-64GB eMMC (w/E3800 CPU only) |
SD Card support |
1x SDIO 3.0 shared with GPIO (w/E3800 CPU only) |
IDE Interface |
- |
Serial-ATA |
2x SATA 3Gb/s |
SATA AHCI |
AHCI with NCQ, HotPlug, Staggered Spinup, |
SATA RAID |
- |
|
|
Connectivity
USB |
up to 8x USB 2.0 |
USB 3.0 |
1x USB 3.0 |
USB Client |
- |
PCI |
- |
PCI External Masters |
- |
PCI Express |
3x PCIe x1 Gen2 |
Max PCI Express |
4x PCIe x1 without LAN |
PCI Express x2/x4 configuration |
YES |
Ethernet |
10/100/1000 Mbit |
Ethernet controller |
Intel® i210IT / i211AT |
|
|
13
COMe-mBT10 / Product Specification
Feature OS Support Matrix
- |
Windows 8 |
Windows 7 |
|
WEC |
Tizen |
Fedora/Yocto |
Android |
|||||
- |
E3800 |
Celeron |
E3800 |
Celeron |
E3800 |
|
Celeron |
E3800 |
E3800 |
Celeron |
E3800 |
Celeron |
eMMC Storage |
X |
X |
- |
- |
X |
|
- |
X |
X |
- |
- |
- |
eMMC Boot |
X |
X |
- |
- |
X |
|
- |
X |
X |
- |
X |
X |
SD Storage |
X |
X |
X |
- |
X |
|
- |
X |
X |
- |
X |
X |
SD Boot |
- |
- |
X |
- |
X |
|
- |
X |
X |
- |
X |
X |
MIPI-CSI |
- |
- |
- |
- |
- |
|
- |
- |
X |
- |
- |
- |
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PCI Express Configuration
By default, the COMe-mBT10 supports x1 PCIexpress lane configuration only (Configuration 0). Following x2/x4 configurations are available via Management Engine Softstrap Options with a customized Flash Descriptor.
PCIe |
Port #0 |
Port #1 |
Port #2 |
Port #3 |
Default |
x1 |
x1 |
x1 |
LAN |
Configuration 1 |
|
x2 |
x1 |
LAN |
Configuration 2 |
x1 |
x1 |
x1 |
x1 |
Configuration 3 |
|
x2 |
x1 |
x1 |
Configuration 4 |
|
x2 |
|
x2 |
Configuration 5 |
|
|
x4 |
|
Configuration 1 - 5 are available with customized BIOS versions only
Ethernet
The Intel® i210IT / i211AT ethernet supports:
» Jumbo Frames
» Time Sync Protocol Indicator
» WOL (Wake On LAN)
» PXE (Preboot eXecution Environment)
Misc Interfaces and Features
Supported BIOS Size/Type |
8MB SPI |
Audio |
HD Audio |
Onboard Hardware Monitor |
Nuvoton NCT7802Y |
Trusted Platform Module |
Atmel AT97SC3204 optional |
Miscellaneous |
2x UART / PWM FAN |
|
|
Kontron Features
External I2C Bus |
Fast I2C, MultiMaster capable |
M.A.R.S. support |
YES |
Embedded API |
KEAPI3 |
Custom BIOS Settings / Flash Backup |
YES |
Watchdog support |
Dual Staged |
|
|
14
COMe-mBT10 / Product Specification
Additional features
» All solid capacitors (POSCAP). No tantalum capacitors used. » Optimized RTC Battery monitoring to secure highest longevity » Real fast I2C with transfer rates up to 40kB/s.
» Discharge logic on all onboard voltages for highest reliability
Power Features
Singly Supply Support |
YES |
Supply Voltage |
4.75 - 20V |
ACPI |
ACPI 3.0 |
S-States |
S0, S3, S4, S5 |
S5 Eco Mode |
YES |
Misc Power Management |
DPST 4.0, iFFS |
|
|
Power Consumption and Performance
Full Load Power Consumption |
5.6 - 12.1W |
Kontron Performance Index |
9020 - 25917 |
Kontron Performance/Watt |
1599 - 2935 |
|
|
Detailed Power Consumption measurements in all states and bechmarks for CPU, Graphics and Memory performance are available in Application Note KEMAP054 at EMD Customer Section.
15
COMe-mBT10 / Product Specification
3.3Block Diagram
|
|
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Gen7 |
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DDR3L-1066/1333 memory down |
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eDP2LVDS |
eDP |
iGFX |
|
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|
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ECC |
|
|
PTN3460 |
|
|
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Intel® Atom™ E3800-Series |
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|||
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USB 3.0 |
|
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SPD |
||||
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Host |
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USB 2.0 |
|
Intel® Celeron® |
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||
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J1900/N29xx/N28xx |
|
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SMB |
|||
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Host |
|
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|
||||
LVDS |
USB Hub |
|
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PCIe#3 |
|
eDP |
|
USB HSIC |
|
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||||
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SMSC USB4604 |
|
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DP++ |
|
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GP |
eMMC |
|
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||
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SPI |
|
|
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USB #0 |
|
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HWM |
|
|
|
|
eMMC |
GBLan |
|
|
|
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|
|
2-32GB SLC |
Intel® i210IT |
||
|
|
|
|
NCT7802 |
|
|
|
|
|||
|
(USB 3.0) |
|
|
|
|
|
|
|
4-64GB MLC |
Intel® i211AT |
|
|
|
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|
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SD |
|
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|||
|
USB #0-3 |
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|
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FAN1 |
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SMB |
UART |
|
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||
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|||
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(USB 2.0) |
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PCIe #0-2 |
||
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GPIO |
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||
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||
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Ctrl |
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PCIe #3 |
|
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|
Mgmt |
|
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|
|
|
HDA |
SPI |
|
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|
|
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PWM |
|
EEPROM |
GPIO/SD |
|
SATA0 |
SPI |
|
|
|
|
|
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Switch |
|
BIOS Flash |
|
||||
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|
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FAN2 |
|
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SATA1 |
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USB #4-7 |
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S5eco |
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GB LAN |
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(USB 2.0) |
|
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I2C |
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||
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LPC2I2C |
LPC2GPIO |
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||
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|||
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Watchdog |
UART |
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Embedded Controller |
GPIO |
|
TPM |
|
||
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(CPLD EPM1270) |
|
or |
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|
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Power sequencing |
|
SDCard |
|
HWM |
|
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I2C |
LID |
PwrCtrl |
SER0 |
LPC |
|
VBAT 5VSB |
VCC |
|
|
|
|
|
Sleep |
SysMgmt |
SER1 |
|
|
||
COM Express® connector AB – Pin-out Type 10
|
|
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Standard |
|
Connector |
|
Option |
|
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component |
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||
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16
COMe-mBT10 / Product Specification
3.4Accessories
Product specific accessories
Product Number |
Heatspreader and Cooling Solutions |
Comment |
34006-0000-99-0 |
HSP COMe-mBT10 thread (11mm) |
For all CPUs and temperature grades |
34006-0000-99-1 |
HSP COMe-mBT10 through (11mm) |
For all CPUs and temperature grades |
34006-0000-99-2 |
HSP COMe-mBT10 slim thread (6.5mm) |
For all CPUs and temperature grades |
34006-0000-99-3 |
HSP COMe-mBT10 slim through (6.5mm) |
For all CPUs and temperature grades |
|
|
|
General accessories
Part Number |
COMe pin-out Type 10 compatible accessories |
Project Code |
Comment |
34104-0000-00-0 |
COM Express® Reference Carrier-i Type 10 |
ADAP |
nITX Carrier with 8mm COMe connector |
34101-0000-00-1 |
COM Express® Eval Carrier Type 10 |
ADAN |
ATX Eval Carrier with 8mm COMe connector |
|
|
|
To be used in combination with ADA-Type10-Mezzanine only |
34101-0000-00-2 |
COM Express® Eval Carrier Type 10 Gen2 |
ADAN |
ATX Eval Carrier with 8mm COMe connector |
96007-0000-00-8 |
ADA-Type10-Mezzanine |
AMVV |
COMe basic sized stand-alone carrier or Adapter Card for Eval Carrier |
|
|
|
Gen1 |
96006-0000-00-1 |
COMe POST T10 |
NFCB |
POST Code / Debug Card |
38019-0000-00-1 |
ADA-COMe-Height-single |
EERC |
Height Adapter |
34104-0000-00-S |
COMe Ref. Starterkit T10 |
ADAP |
Starterkit with COMe Reference Carrier T10 |
Part Number |
Mounting |
Comment |
34017-0000-00-0 |
COMe mMount Kit 5/8mm 1set |
Mounting Kit for 1 module including screws for 5mm & 8mm connectors |
Part Number |
Cooling Solutions |
Comment |
34099-0000-99-0 |
COMe mini Active Uni Cooler |
for CPUs up to 10W TDP, to be mounted on HSP |
34099-0000-99-1 |
COMe mini Passive Uni Cooler |
for CPUs up to 5W TDP, to be mounted on HSP |
34099-0000-99-2 |
COMe mini Passive Uni Cooler Slim |
for CPUs with 3-5W TDP, to be mounted on HSP |
|
|
|
17
COMe-mBT10 / Product Specification
3.5Electrical Specification
3.5.1 |
Supply Voltage |
|
Following supply voltage is specified at the COM Express® connector: |
||
|
|
|
VCC: |
|
4.75 - 20V |
Standby: |
|
5V DC +/- 5% |
RTC: |
|
2.5V - 3.47V |
- 5V Standby voltage is not mandatory for operation.
- Extended Temperature (E1) variants are validated for 12V supply only
3.5.2 Power Supply Rise Time
» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.
» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point following the ATX specification
3.5.3 Supply Voltage Ripple
» Maximum 100 mV peak to peak 0 – 20 MHz
3.5.4Power Consumption
The maximum Power Consumption of the different COMe-mBT10 variants is 5.6 - 12.1W (100% CPU load on all cores; 90°C CPU temperature). Further information with detailed measurements are available in Application Note KEMAP054 available on EMD Customer Section. Information there is available after registration.
18
COMe-mBT10 / Product Specification
3.5.5ATX Mode
By connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal which is generated by SUS_S3# via inversion. VCC can be 4.75 - 20V in ATX Mode. On Computer-on-Modules supporting a wide range input down to 4.75V the input voltage shall always be higher than 5V Standby (VCC > 5VSB).
State |
PWRBTN# |
PWR_OK |
V5_StdBy |
PS_ON# |
VCC |
G3 |
x |
x |
0V |
x |
0V |
S5 |
high |
low |
5V |
high |
0V |
S5 → S0 |
PWRBTN Event |
low → high |
5V |
high → low |
0 V→ VCC |
S0 |
high |
high |
5V |
low |
VCC |
|
|
|
|
|
|
3.5.6Single Supply Mode
In single supply mode (or automatic power on after power loss) without 5V Standby the module will start automatically when VCC power is connected and Power Good input is open or at high level (internal PU to 3.3V). PS_ON# is not used in this mode and VCC can be 4.75 - 20V.
To power on the module from S5 state press the power button or reconnect VCC. Suspend/Standby States are not supported in Single Supply Mode.
State |
PWRBTN# |
PWR_OK |
V5_StdBy |
VCC |
G3 |
x |
x |
x |
0 |
G3 → S0 |
high |
open / high |
x |
connecting VCC |
S5 |
high |
open / high |
x |
VCC |
S5 → S0 |
PWRBTN Event |
open / high |
x |
reconnecting VCC |
|
|
|
|
|
Signals marked with “x” are not important for the specific power state. There is no difference if connected or open.
All ground pins have to be tied to the ground plane of the carrier board.
19
COMe-mBT10 / Product Specification
3.6Power Control
Power Supply
The COMe-mBT10 supports a power input from 4.75 - 20V. The supply voltage is applied through the VCC pins (VCC) of the module connector.
Power Button (PWRBTN#)
The power button (Pin B12) is available through the module connector described in the pinout list. To start the module via Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, typical 400ms) at low level (Power Button Event).
Pressing the power button for at least 4seconds will turn off power to the module (Power Button Override).
Power Good (PWR_OK)
The COMe-mBT10 provides an external input for a power-good signal (Pin B24). The implementation of this subsystem complies with the COM Express® Specification. PWR_OK is internally pulled up to 3.3V and must be high level to power on the module.
Reset Button (SYS_RESET#)
The reset button (Pin B49) is available through the module connector described in the pinout list. The module will stay in reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.
Modules with Intel® Chipset and active Management Engine do not allow to hold the module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will reboot the module automatically
SM-Bus Alert (SMB_ALERT#)
With an external battery manager present and SMB_ALERT# (Pin B15) connected the module always powers on even if BIOS switch “After Power Fail” is set to “Stay Off”.
20
COMe-mBT10 / Product Specification
3.7Environmental Specification
3.7.1Temperature Specification
Kontron defines following temperature grades for Computer-on-Modules in general. Please see chapter 'Product Specification' for available temperature grades for the COMe-mBT10
Temperature Specification |
Operating |
Non-operating |
Validated Input Voltage |
Commercial grade |
0°C to +60°C |
-30°C to +85°C |
VCC: 4.75 - 20V |
Extended Temperature (E1) |
-25°C to +75°C |
-30°C to +85°C |
VCC: 12V |
Industrial grade by Screening (XT) |
-40°C to +85°C |
-40°C to +85°C |
VCC: 12V |
Industrial grade by Design (E2) |
-40°C to +85°C |
-40°C to +85°C |
VCC: 4.75 - 20V |
|
|
|
|
Operating with Kontron heatspreader plate assembly
The operating temperature defines two requirements:
»the maximum ambient temperature with ambient being the air surrounding the module.
»the maximum measurable temperature on any spot on the heatspreader's surface
Test specification:
Temperature Grade |
Validation requirements |
Commercial grade |
at 60°C HSP temperature the CPU @ 100% load needs to run at nominal frequency |
Extended Temperature (E1) |
at 75°C HSP temperature the CPU @ 75% load is allowed to start speedstepping for thermal protection |
Industrial grade by Screening (XT) |
at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection |
Industrial grade by Design (E2) |
at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection |
Operating without Kontron heatspreader plate assembly
The operating temperature is the maximum measurable temperature on any spot on the module's surface.
3.7.2Humidity
» 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78)
21
COMe-mBT10 / Product Specification
3.8Standards and Certifications
RoHS II
The COMe-mBT10 is compliant to the directive 2011/65/EU on the Restriction of the use of certain Hazardous Substances (RoHS II) in electrical and electronic equipment
Component Recognition UL 60950-1
The COM Express® mini form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc. Representative samples of this component have been evaluated by UL and meet applicable UL requirements.
UL Listings:
»NWGQ2.E304278
»NWGQ8.E304278
WEEE Directive
WEEE Directive 2002/96/EC is not applicable for Computer-on-Modules.
Conformal Coating
Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please contact your local sales or support for further details.
22
COMe-mBT10 / Product Specification
Shock & Vibration
The COM Express® mini form factor Computer-on-Modules successfully passed shock and vibration tests according to
»IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g)
»IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g)
EMC
Validated in Kontron reference housing for EMC the COMe-mBT10 follows the requirements for electromagnetic compatibility standards
» EN55022
23
COMe-mBT10 / Product Specification
3.9MTBF
The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test data, if the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts.
The calculation method used is “Telcordia Issue 2 Method 1 Case 3” in a ground benign, controlled environment (GB,GC). This particular method takes into account varying temperature and stress data and the system is assumed to have not been burned in.
Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values.
System MTBF (hours): |
489824h @ 40°C (w/o PCB) |
Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical operating life. The above estimates assume no fan, but a passive heat sinking arrangement Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above figures and need to be considered separately. Battery life depends on both temperature and operating conditions. When the Kontron unit has external power; the only battery drain is from leakage paths.
24
COMe-mBT10 / Product Specification
3.10Mechanical Specification
Module Dimension
»55mm x 84mm (±0.2mm)
»Height approx. 3.5mm (withouth printed circuit board)
CAD drawings are available at EMD CustomerSection
Height
The COM Express® specification defines a module height of 13mm from bottom to heatspreader top:
Kontron provides standard HSP for the specified height of 13mm and slim-line Heatspreader for a reduced height of 8.5mm for mini sized Computer-on-Modules. Universal Cooling solutions to be mounted on the HSP are 14.3mm (34099- 0000-00-0/1) or 8mm (34099-0000-00-2) in height. This allows combinations of a total module height of 8.5mm or 13mm with the Heatspreader and between 16.5mm and 27.3mm with a cooling solution.
25
COMe-mBT10 / Product Specification
3.11Module Dimensions
All dimensions in mm
26
COMe-mBT10 / Product Specification
3.12Onboard Fan Connector
Specification
»Part number (Molex) J3: 53261-0371
»Mates with: 51021-0300
»Crimp terminals: 50079-8100
Pin assignment
» Pin1: Tacho, Pin2: VCC, Pin3: GND
Electrical characteristic
Module Input Voltage |
4.75 |
- 13V |
>13 |
FAN Output Voltage |
4.75 |
- 13V |
13V |
Max. FAN Output Current |
350mA |
150mA |
|
|
|
|
|
27
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