Kontron ETX-OH User Manual

ETX-OH

Document Revision 130

www.kontron.com

» Table of Contents «
1	User Information..................................................................................	5
1.1	About This Document....................................................................................................................	5
1.2	Copyright Notice..........................................................................................................................	5
1.3	Trademarks.................................................................................................................................	5
1.4	Standards...................................................................................................................................	5
1.5	Warranty....................................................................................................................................	6
1.6	Technical Support.........................................................................................................................	6
2	Introduction........................................................................................	7
2.1	Product Description......................................................................................................................	7
2.2	ETX® Documtentation...................................................................................................................	7
2.3	ETX® Benefits..............................................................................................................................	7
3	Specification.......................................................................................	8
3.1	Modules & Accessories...................................................................................................................	8
3.2	Functional Specification................................................................................................................	9
3.3	Block Diagram............................................................................................................................	12
3.4	Electrical Specification................................................................................................................	13
3.4.1	Supply Voltage...........................................................................................................................	13
3.4.2	Power Supply Rise Time................................................................................................................	13
3.4.3	Supply Voltage Ripple..................................................................................................................	13
3.4.4	Power Consumption.....................................................................................................................	13
3.5	Environmental Specification.........................................................................................................	14
3.5.1	Temperature Specification............................................................................................................	14
3.5.2	Humidity...................................................................................................................................	14
3.6	Standards and Certifications.........................................................................................................	15
3.7	MTBF........................................................................................................................................	17
3.8	Mechanical Specification..............................................................................................................	18
3.9	Module Dimensions.....................................................................................................................	18
3.10	Thermal Management, Heatspreader and Cooling Solutions..................................................................	19
3.11	Onboard Connectors....................................................................................................................	20
3.11.1	FAN..........................................................................................................................................	20
3.11.2	SATA........................................................................................................................................	21
3.11.3	USB.........................................................................................................................................	21
3.11.4	DisplayPort................................................................................................................................	21
3.11.5	CPU Debug & CPLD.......................................................................................................................	21
4	Features and Interfaces.......................................................................	22
4.1	Onboard SSD..............................................................................................................................	22
4.2	S5 Eco Mode..............................................................................................................................	23
4.3	M.A.R.S....................................................................................................................................	24
4.4	Fast I2C....................................................................................................................................	25
4.5	EAPI, JIDA & PLD Driver................................................................................................................	26

www.kontron.com

ETX-OH /

4.6	K-Tools.....................................................................................................................................	27
4.7	K-Station 2 GUI..........................................................................................................................	27
4.8	KeAPI.......................................................................................................................................	28
4.9	Watchdog Timer..........................................................................................................................	29
4.10	C-States....................................................................................................................................	30
4.11	ACPI Suspend Modes and Resume Events..........................................................................................	31
5	System Resources...............................................................................	32
5.1	Interrupt Request (IRQ) Lines........................................................................................................	32
5.2	Memory Area.............................................................................................................................	32
5.3	I/O Address Map.........................................................................................................................	33
6	ETX® Connectors................................................................................	34
6.1	General Signal Description............................................................................................................	34
6.2	Connector X1 (PCI bus, USB, Audio)................................................................................................	35
6.2.1	Connector X1 Signal Levels...........................................................................................................	36
6.3	Connector X2 (ISA Bus)................................................................................................................	38
6.3.1	Connector X2 Signal Levels...........................................................................................................	39
6.3.2	Connector X3 (Signal Levels).........................................................................................................	41
6.4	Connector X4 Subsystems.............................................................................................................	43
6.4.1	Connector X4 (IDE 1, IDE 2, Ethernet, Miscellaneous).........................................................................	43
6.4.2	Connector X4 (Signal Levels).........................................................................................................	44
7	BIOS Operation...................................................................................	46
7.1	Determining the BIOS Version.......................................................................................................	46
7.2	BIOS Update..............................................................................................................................	46
7.3	Setup Guide...............................................................................................................................	48
7.4	POST Codes................................................................................................................................	48
7.4.1	Start AMI® Aptio Setup Utility.......................................................................................................	48
7.5	BIOS Setup................................................................................................................................	49
7.5.1	Main........................................................................................................................................	49
7.5.2	Advanced..................................................................................................................................	51
7.5.3	Chipset.....................................................................................................................................	83
7.5.4	Boot........................................................................................................................................	93
7.5.5	Security....................................................................................................................................	98
7.5.6	Save & Exit................................................................................................................................	99

4

ETX-OH / User Information

1User Information

1.1About This Document

This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.

For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of third parties are concerned.

1.2Copyright Notice

Copyright © 2003-2014 Kontron Europe GmbH

All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the express written permission of Kontron Europe GmbH.

DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.

1.3Trademarks

The following lists the trademarks of components used in this board.

»IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.

»Microsoft is a registered trademark of Microsoft Corp.

»Intel is a registered trademark of Intel Corp.

»All other products and trademarks mentioned in this manual are trademarks of their respective owners.

1.4Standards

Kontron Europe GmbH is certified to ISO 9000 standards.

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ETX-OH / User Information

1.5Warranty

For this Kontron Europe GmbH product warranty for defects in material and workmanship exists as long as the warranty period, beginning with the date of shipment, lasts. During the warranty period, Kontron Europe GmbH will decide on its discretion if defective products are to be repaired or replaced.

Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.

Warranty does not apply for defects arising/resulting from improper or inadequate maintenance or handling by the buyer, unauthorized modification or misuse, as well as the operation outside of the product´s environmental specifications and improper installation and maintenance.

Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron Europe GmbH that are caused by a faulty Kontron Europe GmbH product.

1.6Technical Support

Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are committed to make our product easy to use and will help you use our products in your systems.

Please consult our Website at http://www.kontron.com/support for the latest product documentation, utilities, drivers and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and software. In any case you can always contact your board supplier for technical support.

6

ETX-OH / Introduction

2Introduction

2.1Product Description

Kontron's ETX®-OH extends availabiltiy and reliability of the established form factor ETX®. It is a successor product for existing ETX® designs. ETX®-OH raises your investment protection for your ETX® designs.

This Computer-on-Module is populated with AMD's Fusion technology and brings new graphic performance for userfriendly interfaces or HD video onto your designs.

2.2ETX® Documtentation

This product manual serves as one of three principal references for an ETX® design. It documents the specifications and features of ETX®-CD. The other two references, which are available from the Kontron Europe GmbH Web site, include:

»The ETX® Specification defines the ETX® module form factor, pinout, and signals.

»The ETX® Design Guide serves as a general guide for baseboard design, with a focus on maximum flexibility to accommodate a wide range of ETX® modules.

Some of the information contained within this product manual applies only to certain product revisions (CE: xxx). If certain information applies to specific product revisions (CE: xxx) it will be stated. Please check the product revision of your module to see if this information is applicable.

2.3ETX® Benefits

Embedded technology extended (ETX) modules are very compact (114 x 95 mm), highly integrated computers. All ETX® modules feature a standardized form factor and a standardized connector layout that carry a specified set of signals. This standardization allows designers to create a single-system baseboard that can accept present and future ETX® modules. ETX® modules include common personal computer (PC) peripheral functions such as:

»Graphics

»Parallel, Serial, and USB ports

»Keyboard/mouse

»Ethernet

»Sound

»IDE (and SATA)

The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging. Peripheral PCI or ISA buses can be implemented directly on the baseboard rather than on mechanically unwieldy expansion cards. The ability to build a system on a single baseboard using the computer as one plug-in component simplifies packaging, eliminates cabling, and significantly reduces system-level cost. A single baseboard design can use a range of ETX® modules. This flexibility can differentiate products at various price/performance points, or to design future proof systems that have a builtin upgrade path. The modularity of an ETX® solution also ensures against obsolescence as computer technology evolves. A properly designed ETX® baseboard can work with several successive generations of ETX® modules. An ETX® baseboard design has many advantages of a custom, computer-board design but delivers better obsolescence protection, greatly reduced engineering effort, and faster time to market.

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ETX-OH / Specification

3Specification

3.1Modules & Accessories

The Computer-on-Module ETX®-OH (MBR1) based on AMD's Brazos platform is available in different variants to cover the demand of different performance, price and power:

Commercial grade modules (0°C to 60°C operating)

Product Number	Product Name	Processor	Chipset and Features
18040-0000-16-2	ETX-OH T56N	AMD G-Series T56N 2×1.65GHz	AMD A55E FCH
18040-0000-16-4	ETX-OH T56E	AMD G-Series T56E 2×1.65GHz	AMD A55E FCH
18040-0000-10-2	ETX-OH T40E	AMD G-Series T40E 2×1.0GHz	AMD A55E FCH
18040-0000-15-1	ETX-OH T52R	AMD G-Series T52R 1.5GHz	AMD A55E FCH
18040-0000-10-1	ETX-OH T40R	AMD G-Series T40R 1.0GHz	AMD A55E FCH
18040-0000-06-1	ETX-OH T16R	AMD G-Series T16R 615MHz	AMD A55E FCH

Extended temperature modules (E1, -25°C to 75°C operating)

Product Number	Product Name	Processor	Chipset and Features
18040-0000-16-2EXT	ETX-OH T56N E1	AMD G-Series T56N 2×1.65GHz	AMD A55E FCH, E1
18040-0000-16-4EXT	ETX-OH T56E E1	AMD G-Series T56E 2×1.65GHz	AMD A55E FCH, E1
18040-0000-10-2EXT	ETX-OH T40E E1	AMD G-Series T40E 2×1.0GHz	AMD A55E FCH, E1
18040-0000-10-1EXT	ETX-OH T40R E1	AMD G-Series T40R 1.0GHz	AMD A55E FCH, E1
18040-0000-06-1EXT	ETX-OH T16R E1	AMD G-Series T16R 615MHz	AMD A55E FCH, E1

Optional hardware features:

»TPM

»DP connector instead of FlatFoil

»Onboard SATA NANDrive

»Onboard miniUSB connector

Accessories

Product Number	Carrier Boards
18010-0000-00-0	ETX® Eval
18028-0000-00-0	ETX® miniBaseboard
Product Number	Memory
97015-1024-16-0	DDR3-1600 SODIMM 1GB
97015-2048-16-0	DDR3-1600 SODIMM 2GB
97015-4096-16-0	DDR3-1600 SODIMM 4GB
97015-1024-16-2	DDR3-1600 SODIMM 1GB E2
97015-2048-16-2	DDR3-1600 SODIMM 2GB E2
97015-4096-16-2	DDR3-1600 SODIMM 4GB E2
Product Number	Cooling & Mounting
18040-0000-99-0	ETX®-OH, Heatspreader, threaded
18040-0000-99-1	ETX®-OH, Heatspreader, through hole
18099-0000-99-0	ETX® Active Uni Cooler (5V FAN)
36099-0000-99-0	COMe Active Uni Cooler (12V FAN)
36099-0000-99-1	COMe Passive Uni Cooler
Product Number	Adapter & Cables
96085-0000-00-0	KAB-ADAPT-FF-DP (22pin Flatfoil to DisplayPort adapter cable)
96006-0000-00-8	ADA-DP-LVDS (DP to LVDS converter)
9-5000-0352	ADA-LVDS-DVI 18bit (LVDS to DVI converter)
9-5000-0353	ADA-LVDS-DVI 24bit (LVDS to DVI converter)
96082-0000-00-0	KAB-ADAPT-DP-DVI (DP to DVI adapter cable)
96083-0000-00-0	KAB-ADAPT-DP-VGA (DP to VGA adapter cable)
96084-0000-00-0	KAB-ADAPT-DP-HDMI (DP to HDMI adapter cable)
96079-0000-00-0	KAB-HSP 200mm (Cable adapter to connect FAN to module)
96079-0000-00-2	KAB-HSP 40mm (Cable adapter to connect FAN to module)

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ETX-OH / Specification

3.2Functional Specification

Processor

The 40nm AMD™ embedded G-Series APU Rev C0 (eOntario) with FT1 (413-BGA) Package CPU supports:

»AMD64

»AMD PowerNow!

»DMX: AMD Digital Media Xpress™ technology (SSE, SSE2, SSE3, SSE4a, MMX instructions)

»AMD-V™: AMD Virtualization™ technology

»EVP: AMD Enhanced Virus Protection

Processor	Cores	Clock	L2 Cache	Memory	GPU Core	GPU Clock (Turbo)	AMD Turbo Core	Max TDP
AMD G-Series T56N	2	1.65GHz	2x512kB	DDR3-1333	Radeon HD6320	500MHz (600MHz)	Yes	18W
AMD G-Series T56E	2	1.65GHz	2x512kB	DDR3-1333	Radeon HD6250	280MHz	No	18W
AMD G-Series T40E	2	1.00GHz	2x512kB	DDR3-1066	Radeon HD6250	280MHz	No	6.4W
AMD G-Series T52R	1	1.50GHz	512kB	DDR3-1333	Radeon HD6310	500MHz	No	18W
AMD G-Series T40R	1	1.00GHz	512kB	DDR3-1066	Radeon HD6250	280MHz	No	5.5W
AMD G-Series T16R	1	615MHz	512kB	DDR3-1066	Radeon HD6250	280MHz	No	4.5W

Memory

Sockets	1x DDR3 SO-DIMM
Memory Type	DDR3-1066/1333
Maximum Size	4GB
Technology	Single Channel

Graphics Core

The integrated Mobility Radeon HD6320/6310/6250 supports:

»UVD: Unified Video Decoder for hardware decode of high definition video

»80 Stream Processing Units (SPs)

»8 Texture Mapping Units (TMUs)

»4 Raster Operation Processors (ROPs)

Graphics Core Render Clock	HD6320/10: 500MHz (T56N, T52R), HD6250: 280MHz (T40E, T40R, T16R)
Execution Units / Pixel Pipelines	4 with 80 unified shader
Max Graphics Memory	512MB
GFX Memory Bandwidth (GB/s)	17.1
GFX Memory Technology	UMA
API (DirectX/OpenGL)	11 / 4.1 + OCL 1.1
Shader Model	5.0
Hardware accelerated Video	ATI Avivo HD: H.264, VC-1, Blu-ray
Independent/Simultaneous Displays	2

Display Interfaces

CRT max Resolution	2560x1600 / 1920x1200
TV out:	-
Digital Display:	DP++ (FFC22 or optional DP connector)

LVDS

LVDS Bits/Pixel	1x18, 2x18, 1x24, 2x24
LVDS Bits/Pixel with dithering	-
LVDS max Resolution:	1920x1200
PWM Backlight Control:	YES

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ETX-OH / Specification

Chipset & IOH

# of USB:	4x USB 1.1/2.0
USB onboard Connector:	2x miniUSB optional
Audio:	Realtek ALC886GR HDAudio
PCI Bus:	PCI Rev 2.3 (33MHz/3.3V)
ISA Bus:	PCI2ISA ITE8888
SuperI/O Controller	Winbond 83627DHG-P
COM Ports:	2x RS232
IrDA Support:	IrDA 1.0 (SIR) or ASK-IrDA (COM2)
LPT Support:	EPP, ECP, bi-dir.
Max TDP:	4.7W

Storage

Primary IDE:	JMB368 PCIe2PATA
Secondary IDE:	JMB368 PCIe2PATA
SATA onboard connector:	2x SATA 3Gb/s
SATA features:	Raid0/1, NCQ, HotPlug, eSATA
SATA RAID support:	-
onboard SSD:	2-32GB SLC or 2-64GB MLC optional
onboard CF Card:	-

Onboard devices

Audio	Realtek ALC886GR HDAudio
Trusted Platform Module	Infineon TPM 1.2 SLB9635TT optional

Ethernet

The Broadcom BCM54610 ethernet supports:

»Jumbo Frames

»Time Sync Protocol Indicator

»WOL (Wake On LAN)

»PXE (Preboot eXecution Environment)

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ETX-OH / Specification

Kontron Features

I2C/SMB support:	YES/YES
M.A.R.S. support	YES
Embedded API	PICMG EAPI / JIDA32
Custom BIOS Settings / Flash Backup	YES
Watchdog support	YES

Power Features

ACPI	ACPI 3.0
S-States	S0, S3, S4, S5
Graphic States	D0,D3
Misc Power Management	DPST 6.0

Power Consumption and Performance

Full Load Power Consumption	9 - 19.4W
Kontron Performance Index	5920 - 15443
Kontron Performance/Watt	661 - 997

Detailed Power Consumption measurements in all states and bechmarks for CPU, Graphics and Memory performance are available in Application Note KEMAP054 at EMD Customer Section.

Supported Operating Systems

The ETX®-OH supports:

»Microsoft Windows CE6

»Microsoft Windows embedded Compact 7 (WEC7)

»Microsoft Windows embedded Standard 7 (WES7)

»Microsoft Windows XP

»Microsoft Windows 7

»Linux

»VxWorks

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ETX-OH / Specification

3.3Block Diagram

DisplayPort				AMD Fusion APU
Connector
			DDI1	Embedded G-Series				DDR3-1066
DisplayPort										DDR3-SODIMM
Flatfoil				Processor (eOntario)				DDR3-1333
		DPtoLVDS		SC/DC 5-18W
2x18/24				280MHz Radeon
		Analogix	DDI0
LVDS		ANX3110		HD6250
	VGA			500MHz Radeon
				HD6310
		Primary IDE	PCIe to	PCIe
			PATA
			JMB368		4xUMI
			PCIe to
		Secondary IDE		PCIe
			PATA
			JMB368
X4	10/100 LAN		Ethernet						PCI to ISA	X2
			Contr.	MAC						ISA
									Bridge
									ITE8888
				Hudson-E1 A55E
				Fusion Controller Hub FCH						PCI
		I2C	EEPROM						USB 0-3
			(CMOS
			Setup Data)
			EC					HDA	USB 4/5
			fastI2C,				SPI
			sWD	LPC
			TPM
			Infineon				SPI
X3			SLB9655TT							X1
				Super I/O			BIOS	HDA
		LPT					Flash
				Controller		SATA		Codec
		PS/2		Winbond
		COM1/COM2		W83627DHG-P				ALC886GR
					5		1	0
				FAN	SATA SSD		SATA	SATA	miniUSB	miniUSB
				Connector			Connector	Connector	Connector	Connector
Standard		Connector	Option
component

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ETX-OH / Specification

3.4Electrical Specification

3.4.1 Supply Voltage
Following supply voltage is specified at the ETX® connector:
Supply Voltage:		5V +/- 5%
5V_Stb:		5V DC +/- 5%

3.4.2 Power Supply Rise Time

» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.

» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point following the ATX specification

3.4.3 Supply Voltage Ripple

» Maximum 100 mV peak to peak 0 – 20 MHz

3.4.4Power Consumption

The maximum Power Consumption of the different ETX®-OH modules is 9 - 19.4W (100% CPU load; 90°C CPU temperature). Further details with measurements and TDP values of the single variants can be found in our customer section. Information there is available after registration.

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ETX-OH / Specification

3.5Environmental Specification

3.5.1Temperature Specification

Kontron defines following temperature grades for Computer-on-Modules in general. Please see chapter 'Product Specification' for available temperature grades for the ETX®-OH

Temperature Specification	Operating		Non-operating	Validated Input Voltage
Commercial grade		0°C to +60°C	-30°C to +85°C	VCC:
Extended Temperature (E1)		-25°C to +75°C	-30°C to +85°C	VCC: 12V
Industrial grade by Screening (XT)		-40°C to +85°C	-40°C to +85°C	VCC: 12V
Industrial grade by Design (E2)		-40°C to +85°C	-40°C to +85°C	VCC:

Operating with Kontron heatspreader plate assembly

The operating temperature defines two requirements:

»the maximum ambient temperature with ambient being the air surrounding the module.

»the maximum measurable temperature on any spot on the heatspreader's surface

Test specification:

Temperature Grade	Validation requirements
Commercial grade	at 60°C HSP temperature the CPU @ 100% load needs to run at nominal frequency
Extended Temperature (E1)	at 75°C HSP temperature the CPU @ 75% load is allowed to start speedstepping for thermal protection
Industrial grade by Screening (XT)	at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection
Industrial grade by Design (E2)	at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection

Operating without Kontron heatspreader plate assembly

The operating temperature is the maximum measurable temperature on any spot on the module's surface.

3.5.2Humidity

» 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78)

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ETX-OH / Specification

3.6Standards and Certifications

RoHS II

The ETX®-OH is compliant to the directive 2011/65/EU on the Restriction of the use of certain Hazardous Substances (RoHS II) in electrical and electronic equipment

Component Recognition UL 60950-1

The ETX® 3.0 form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc. Representative samples of this component have been evaluated by UL and meet applicable UL requirements.

UL Listings:

»NWGQ2.E304278

»NWGQ8.E304278

WEEE Directive

WEEE Directive 2002/96/EC is not applicable for Computer-on-Modules.

Conformal Coating

Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please contact your local sales or support for further details.

15

ETX-OH / Specification

Shock & Vibration

The ETX® 3.0 form factor Computer-on-Modules successfully passed shock and vibration tests according to

»IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g)

»IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g)

EMC

Validated in Kontron reference housing for EMC the ETX®-OH follows the requirements for electromagnetic compatibility standards

» EN55022

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ETX-OH / Specification

3.7MTBF

The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test data, if the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts.

The calculation method used is “Bellcore Method 1 Case 1” in a ground benign, controlled environment (GB,GC). This particular method takes into account varying temperature and stress data and the system is assumed to have not been burned in.

Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values.

System MTBF (hours): 212866 @ 40°C

Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical operating life. The above estimates assume no fan, but a passive heat sinking arrangement Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above figures and need to be considered separately. Battery life depends on both temperature and operating conditions. When the Kontron unit has external power; the only battery drain is from leakage paths.

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ETX-OH / Specification

3.8Mechanical Specification

»95.0 mm x 114.0 mm

»Hight approx. 12mm (0.4”)

CAD drawings are available at EMD CustomerSection

3.9Module Dimensions

»Height on Top Standard: 5.50mm (SATA connector)

»Max Height on Top: 6.50mm (DisplayPort connector instead FlatFoil)

»Height on Bottom: 2mm

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ETX-OH / Specification

3.10Thermal Management, Heatspreader and Cooling Solutions

A heatspreader plate assembly is available from Kontron Europe GmbH for the ETX®-OH. The heatspreader plate on top of this assembly is NOT a heat sink. It works as a ETX® 3.0-standard thermal interface to use with a heat sink or external cooling devices.

External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worstcase conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature on any spot of the heatspreader's surface according the module specifications:

»60°C for commercial grade modules

»75°C for extended temperature grade modules (E1)

»85°C for industrial temperature grade modules (E2/XT)

The aluminum slugs and thermal pads or the heat-pipe on the underside of the heatspreader assembly implement thermal interfaces between the heatspreader plate and the major heat-generating components on the ETX®-OH. About 80 percent of the power dissipated within the module is conducted to the heatspreader plate and can be removed by the cooling solution.

You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches. The optimum cooling solution varies, depending on the ETX® 3.0 application and environmental conditions. Active or passive cooling solutions provided from Kontron Europe GmbH for the ETX®-OH are usually designed to cover the power and thermal dissipation for a commercial grade temperature range used in a housing with proper air flow.

Documentation and CAD drawings of ETX®-OH heatspreader and cooling solutions are provided at http://emdcustomersection.kontron.com.

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ETX-OH / Specification

3.11Onboard Connectors

3.11.1 FAN

With certain BIOS-settings it is possible to control the fan depending on the Active Trip Point temperature. The fan switches on/off depending on the adjusted Active Trip Point temperature. In order for this feature to function properly an ACPI compliant OS is necessary.

The onboard fan connector (J11) has following Pin assignment:

»Pin1: Tacho

»Pin2: VCC

»Pin3: GND

Electrical Characteristics

» FAN VCC = 5 V

To connect a standard FAN with 3pin connector to the module please use adaptor cable

KAB-HSP 200mm (96079-0000-00-0) or KAB-HSP 40mm (96079-0000-00-2)

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ETX-OH / Specification

3.11.2 SATA

According the latest ETX® specification 3.0 the ETX®-OH provides two onboard SATA 3Gbps Ports with standard SATA pinout

SATA PIN	Signal
1	Ground
2	Transmit+
3	Transmit-
4	Ground
5	Receive-
6	Receive+
7	Ground

3.11.3 USB

The ETX®-OH optionally supports two onboard USB 2.0 Mini-AB connectors J8 & J9. The Mini-AB USB On-The-Go (OTG) allows additional Hi-Speed USB support for external devives.

3.11.4 DisplayPort

For external high-resolution displays the ETX®-OH supports an onboard connection for DisplayPort additionally to VGA and LDVS. By default the module is equipped with the 22-pin FlatFoil solution for best compatibility to existing ETX® carrier boards without having mechanical connectivity problems. The Flatfoil-to-DisplayPort cable KAB-ADAPT-FF-DP allows connectivity of standard DisplayPort, HDMI, DVI, VGA or LVDS via the Kontron DisplayPort-to-LVDS Konverter:

Alternatively, a combination shape allows the usage of a standard DisplayPort connector (J15) instead of the 22-pin Flatfoil directly on the module.

Please contact your local sales or support for customized variants with mini USB ports or

DisplayPort

3.11.5 CPU Debug & CPLD

The CPU Debug connector J10 and the CPLD programming interface J14 are for internal use only and should not be used.

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ETX-OH / Features and Interfaces

4Features and Interfaces

4.1Onboard SSD

The ETX®-OH features an onboard Greenliant SATA NAND flash drive with capacities of 2-32GB SLC or 2-64GB MLC optional. Due to performance and longevity reasons standard variants with onboard flash use SLC type only. The following SATA NANDrives are available:

Basic features of the SATA NANDrives

»ATA/ATAPI-8 compliant Host interface with 48-bit address feature set and SMART support

»RoHS compliant NAND flash type

»SATA 1.5Gb/s Host transfer rate

»Hardware error detection, correction ECC and advanced wear leveling

»Bad block management

»TRIM support

»SMART support

»0°C to +70°C temperature range for MLC types A-M-C/B-M-C

»-40°C to +85°C temperature range for MLC types B-M-I

»-40°C to +85°C temperature range for all SLC types

Single-level Cell (SLC) NANDrive™

Flash Part No.			GLS85LS
Flash Part No.	1002P-S-I-FZJE-ND104	1004P-S-I-FZJE-ND104	1008P-S-I-FZJE-ND104	1016P-S-I-FZJE-ND104	1032P-S-I-FZJE-ND104
Product Revision	CC1	CC1	CC1	CC1	CC1
Flash Size	2GByte	4GByte	8GByte	16GByte	32GByte
Burst Read/Write Speed	35/20 MB/s	70/35 MB/s	70/50 MB/s	70/55 MB/s	120/80 MB/s
Total Bytes	2,000,388,096	4,001,292,288	8,012,390,400	16,013,942,784	32,017,047,552
Active Mode Power	450mW	560mW	750mW	590mW	855mW
Typical P/E Cycles per	100,000	100,000	60,000	60,000	60,000
block

(Data based on Datasheet S71432 Rev. 03.100 from 11-2013 and S71445 Rev. 01.400 from 11-2013)

Multi-level Cell (MLC) NANDrive™

Flash Part No.				GLS85LS
Flash Part No.	1002A-M-C-FZJE-	1004A-M-C-FZJE-	1008B-M-C-FZJE-		1016B-M-C-FZJE-	1032B-M-C-FZJE-	1064B-M-C-FZJE-
	ND103	ND103	ND103		ND103	ND103	ND103
	1002A-M-I-FZJE-	1004A-M-I-FZJE-	1008B-M-I-FZJE-		1016B-M-I-FZJE-	1032B-M-I-FZJE-	1064B-M-I-FZJE-
	ND103	ND103	ND103		ND103	ND103	ND103
Product Revision	CB2	CB2	CB2		CB2	CB2	CB2
Flash Size	2GByte	4GByte	8GByte		16GByte	32GByte	64GByte
Burst Read/Write	35/10 MB/s	35/10 MB/s	35/10 MB/s		70/20 MB/s	70/30 MB/s	110/60 MB/s
Speed
Total Bytes	1,941,553,152	3,941,941,248	8,012,390,400		16,013,942,784	32,017,047,552	64,023,257,088
Active Mode Power	360mW	360mW	360mW		440mW	565mW	820mW
Typical P/E Cycles per	5,000	5,000	5,000		5,000	5,000	5,000
block

(Data based on Datasheet S71430 Rev 02.00 from 10-2013)

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ETX-OH / Features and Interfaces

4.2S5 Eco Mode

Kontron’s new high-efficient power-off state S5 Eco enables lowest power-consumption in soft-off state – less than 1 mA compared to the regular S5 state this means a reduction by at least factor 200!

In the “normal” S5 mode the board is supplied by 5V_Stb and needs usually up to 300mA just to stay off. This mode allows to be switched on by power button, RTC event and WakeOnLan, even when it is not necessary. The new S5 Eco mode reduces the current enormous.

The S5 Eco Mode can be enabled in BIOS Setup, when the BIOS supports this feature.

Following prerequisites and consequences occur when S5 Eco Mode is enabled

»The power button must be pressed at least for 200ms to switch on.

»Wake via Power button only.

»“Power On After Power Fail”/“State after G3”: only “stay off” is possible

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ETX-OH / Features and Interfaces

4.3M.A.R.S.

The Smart Battery implementation for Kontron Computer-on-Modules called Mobile Application for Rechargeable Systems is a BIOS extension for external Smart Battery Manager or Charger. It includes support for SMBus charger/selector (e.g. Linear Technology LTC1760 Dual Smart Battery System Manager) and provides ACPI compatibility to report battery information to the Operating System.

Reserved SM-Bus addresses for Smart Battery Solutions on the carrier:

8-bit Address	7-bit Address	Device
12h	0x09	SMART_CHARGER
14h	0x0A	SMART_SELECTOR
16h	0x0B	SMART_BATTERY

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ETX-OH / Features and Interfaces

4.4Fast I2C

The ETX®-OH supports a CPLD implemented LPC to I2C bridge using the WISHBONE I2C Master Core provided from opencores.org. The I2C Interface supports transfer rates up to 40kB/s and can be configured in Setup

Specification for external I2C:

»Speed up to 400kHz

»Compatible to Philips I2C bus standard

»Multi-Master capable

»Clock stretching support and wait state generation

»Interrupt or bit-polling driven byte-by-byte data-transfers

»Arbitration lost interrupt with automatic transfer cancellation

»Start/Stop signal generation/detection

»Bus busy detection

»7bit and 10bit addressing

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ETX-OH / Features and Interfaces

4.5EAPI, JIDA & PLD Driver

K-Station 2 including the Kontron PLD / Board Driver for new generation modules with UEFI is a replacement for former JIDA16/JIDA32 BIOS implementations. It consists of hardware drivers providing access to features like Watchdog, I2C Bus or GPIO implemented in the onboard Programmable Logic Device (CPLD). The Board Driver supports the official PICMG embedded API (EAPI) and for backwards compatibility the former used Kontron JIDA32 API. The driver (Cpld.sys) and API (Eapi.dll/Jida.dll) is available for Windows and for Linux.

Usage Model

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ETX-OH / Features and Interfaces

4.6K-Tools

For easy access to the API Kontron provides Windows Shell Utilities, the so called K-Tools, for direct access to the JIDA32 interface via the Windows command line.

Available K-Station 2 Shell Tools:

»KEthernet.exe (LAN Information)

»KGenInfo.exe (Module Information)

»KHWMon.exe (Hardware Monitoring)

»KI2CBus.exe (I2C and SMBus access)

»KIOPort.exe (GPIO control)

»KStorage.exe (JIDA EEPROM access to user bytes)

»KSystemSummary.exe (System Information)

»KVGATool.exe (LVDS Backlight control)

»KWDog.exe (Watchdog control)

K-Station 2 is available on EMD Customer Section. The Installer allows following installation methods:

»Light Target Installation for JIDA32 and EAPI driver only

»Medium Target Installation for JIDA32 and EAPI with K-Tools

»Host Installation with Sources and Documentation

For silent installation use command

»msiexec /quiet /i K-Station_2xxx_xxx.msi

4.7K-Station 2 GUI

As an example utility Kontron provides the K-Station 2 GUI for 32 and 64bit Windows. K-Station 2 GUI is a JAVA based example Graphical User Interface using the K-Tools in Remote Mode. It allows easy and fast evaluation of board specific features supported by the API and PLD Driver.

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ETX-OH / Features and Interfaces

4.8KeAPI

The Kontron embedded API (KeAPI) is an extension of the PICMG EAPI mainly with additional remote functionality. It consists of hardware drivers providing access to features like Watchdog, I2C Bus or GPIO and a QT based user interface KEAPI GUI. KeAPI is part of standard BSPs for modules based on AMI APTIO (UEFI).

Please refer to EMD Customer Section for detailed documentation and downloads.

Usage of KeAPI

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ETX-OH / Features and Interfaces

4.9Watchdog Timer

You can configure the Watchdog Timer (WDT) in BIOS setup to start after a set amount of time after power-on boot. The WDT can also be controlled by the JIDA32 Library API. The application software should strobe the WDT to prevent its timeout. Upon timeout, the WDT resets and restarts the system. This provides a way to recover from program crashes or lockups.

Configuration

You can program the timeout period for the watchdog timer in two ranges:

»1-second increments from 1 to 255 seconds

»1-minute increments from 1 to 255 minutes

Contact Kontron Embedded Modules technical support for information on programming and operating the WDT.

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ETX-OH / Features and Interfaces

4.10C-States

New generation platforms include power saving features like SuperLFM, EIST (P-States) or C-States in O/S idle mode.

Activated C-States are able to dramatically decrease power consumption in idle mode by reducing the Core Voltage or switching of parts of the CPU Core, the Core Clocks or the CPU Cache.

Following C-States are defined:

C-State	Description	Function
C0	Operating	CPU fully turned on
C1	Halt State	Stops CPU main internal clocks via software
C1E	Enhanced Halt	Similar to C1, additionally reduces CPU voltage
C2	Stop Grant	Stops CPU internal and external clocks via hardware
C2E	Extended Stop Grant	Similar to C2, additionally reduces CPU voltage
C3	Deep Sleep	Stops all CPU internal and external clocks
C3E	Extended Stop Grant	Similar to C3, additionally reduces CPU voltage
C4	Deeper Sleep	Reduces CPU voltage
C4E	Enhanced Deeper Sleep	Reduces CPU voltage even more and turns off the memory cache
C6	Deep Power Down	Reduces the CPU internal voltage to any value, including 0V
C7	Deep Power Down	Similar to C6, additionally LLC (LastLevelCache) is switched off

C-States are usually enabled by default for low power consumption, but active C-States my influence performance sensitive applications or real-time systems.

»Active C6-State may influence data transfer on external Serial Ports

»Active C7-State may cause lower CPU and Graphics performance

It's recommended to disable C-States / Enhanced C-States in BIOS Setup if any problems occur.

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