JVC KD-AR960, KD-LH910 Service Manual

SERVICE MANUAL
CD/SD RECEIVER
MA14220052
KD-AR960,KD-LH910
Area suffix
J --------------- Northern America
KD-AR960 KD-LH910
ARSENAL rogo
LINE IN
٤
٤
 
TABLE OF CONTENTS
2 SPECIFIC SERVICE INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
4 ADJUSTMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-22
5 TROUBLESHOOTING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-26
COPYRIGHT © 2005 Victor Company of Japan, Limited
No.MA142
2005/2
SPECIFICATION
AUDIO AMPLIFIER SECTION
Power Output 20 W RMS × 4 Channels at 4 and Signal to Noise Ratio 80 dBA (reference: 1 W into 4 Ω) Load Impedance 4 (4 to 8 allowance)
Equalizer Control Range Low ±12 dB (60 Hz, 80 Hz, 100 Hz, 120 Hz)
Mid ±12 dB (Fix)
High ±12 dB (8 kHz, 10 kHz, 12 kHz, 15 kHz)
Frequency Response 40 Hz to 20 000 Hz
Line-In Level/Impedance KD-AR960 1.5 V/20 k load Line-Out Level/Impedance KD-AR960 5.0 V/20 k load (full scale)
KD-LH910 4.0 V/20 k load (full scale) Output Impedance 1 k Subwoofer-Out Level/Impedance 2.0 V/20 k load (full scale)
Other Terminals CD changer, LINE IN (for KD-AR960)
TUNER SECTION
Frequency Range FM 87.5 MHz to 107.9 MHz (with channel interval set to 200 kHz)
87.5 MHz to 108.0 MHz (with channel interval set to 50 kHz)
AM 530 kHz to 1 710 kHz (with channel interval set to 10 kHz)
531 kHz to 1 602 kHz (with channel interval set to 9 kHz)
FM Tuner Usable Sensitivity 11.3 dBf (1.0 µV/75 Ω)
50 dB Quieting Sensitivity 16.3 dBf (1.8 µV/75 Ω)
Alternate Channel Selectivity (400 kHz) 65 dB
Frequency Response 40 Hz to 15 000 Hz
Stereo Separation 35 dB
Capture Ratio 1.5 dB
AM Tuner Sensitivity 20 µV
Selectivity 35 dB
CD/SD PLAYER SECTION
Type Compact disc player
Signal Detection System Non-contact optical pickup (semiconductor laser)
Number of Channels 2 channels (stereo)
Frequency Response 5 Hz to 20 000 Hz
Dynamic Range 96 dB
Signal-to-Noise Ratio 98 dB
Wow and Flutter Less than measurable limit
MP3 (MPEG1/2 Audio Layer 3) Max. Bit Rate: 320 kbps
WMA (Windows Media Audio) Max. Bit Rate: 192 kbps
Playable SD Card Format Fat 12/16
Storage Up to 512 MB
Playable Audio Format for SD Card MP3/WMA
GENERAL
Power Requirement Operating Voltage DC 14.4 V (11 V to 16 V allowance)
Grounding System Negative ground
Allowable Operating Temperature 0°C to +40°C (32°F to 104°F) Dimensions (W × H × D) Installation Size (approx.) 182 mm × 52 mm × 159 mm (7-3/16" × 2-1/16" × 6-5/16")
Panel Size (approx.) 188 mm × 58 mm × 12 mm (7-7/16" × 2-5/16" × 1/2")
Mass (approx.) 1.7 kg (3.8 lbs) (excluding accessories)
[< or =] 1% THD+N
Design and specifications are subject to change without notice.
1-2 (No.MA142)

1.1 Safety Precautions

SECTION 1
PRECAUTIONS
!
!
Burrs formed during molding may be left over on some parts of the chassis. Therefore, pay attention to such burrs in the case of preforming repair of this system.
Please use enough caution not to see the beam directly or touch it in case of an adjustment or operation check.
(No.MA142)1-3

1.2 Preventing static electricity

Electrostatic discharge (ESD), which occurs when static electricity stored in the body, fabric, etc. is discharged, can destroy the laser diode in the traverse unit (optical pickup). Take care to prevent this when performing repairs.
1.2.1 Grounding to prevent damage by static electricity
Static electricity in the work area can destroy the optical pickup (laser diode) in devices such as CD players. Be careful to use proper grounding in the area where repairs are being performed.
(1) Ground the workbench
Ground the workbench by laying conductive material (such as a conductive sheet) or an iron plate over it before placing the traverse unit (optical pickup) on it.
(2) Ground yourself
Use an anti-static wrist strap to release any static electricity built up in your body.
(caption) Anti-static wrist strap
1M
Conductive material (conductive sheet) or iron plate
(3) Handling the optical pickup
• In order to maintain quality during transport and before installation, both sides of the laser diode on the replacement optical pickup are shorted. After replacement, return the shorted parts to their original condition. (Refer to the text.)
• Do not use a tester to check the condition of the laser diode in the optical pickup. The tester's internal power source can easily destroy the laser diode.

1.3 Handling the traverse unit (optical pickup)

(1) Do not subject the traverse unit (optical pickup) to strong shocks, as it is a sensitive, complex unit. (2) Cut off the shorted part of the flexible cable using nippers, etc. after replacing the optical pickup. For specific details, refer to the
replacement procedure in the text. Remove the anti-static pin when replacing the traverse unit. Be careful not to take too long a
time when attaching it to the connector. (3) Handle the flexible cable carefully as it may break when subjected to strong force. (4) It is not possible to adjust the semi-fixed resistor that adjusts the laser power. Do not turn it.

1.4 Attention when traverse unit is decomposed

*Please refer to "Disassembly method" in the text for the CD pickup unit.
• Apply solder to the short land before the flexible wire is disconnected from the connector on the CD pickup unit. (If the flexible wire is disconnected without applying solder, the CD pickup may be destroyed by static electricity.)
• In the assembly, be sure to remove solder from the short land after connecting the flexible wire.
CD mechanism assembly
Flexible wire
1-4 (No.MA142)
SECTION 2
SPECIFIC SERVICE INSTRUCTIONS
This service manual does not describe SPECIFIC SERVICE INSTRUCTIONS.
(No.MA142)1-5
SECTION 3
DISASSEMBLY

3.1 Main body section

3.1.1 Removing the front panel assembly
(See Fig.1)
(1) Push the detach button in the lower right part of the front
panel assembly.
(2) Take out the front panel assembly.
3.1.2 Removing the heat sink
(See Fig.2)
(1) From the left side of the main body, remove the two screws
A and two screws B attaching the heat sink.
(2) Take out the heat sink.
Front panel assembly
Detach button
Fig.1
AAB
Heat sink
Fig.2
1-6 (No.MA142)
3.1.3 Removing the top chassis assembly (See Figs.3 to 6)
• Prior to performing the following procedures, remove the heat
sink.
Reference:
Remove the front panel assembly as required. (1) From the bottom side of the main body, remove the two
screws C attaching the top chassis assembly to the bottom chassis assembly. (See Fig.3)
(2) From the both and back sides of the main body, remove the
four screws D attaching the top chassis assembly to the bottom chassis assembly. (See Figs.4 to 6)
(3) From the left side of the main body, remove the screw E at-
taching the top chassis assembly. (See Fig.5)
(4) Lift the top chassis assembly in the direction of the arrow,
and disconnect the connector CN501 nism assembly from the connector CN702 board. (See Figs.5 and 6)
(5) Take out the top chassis assembly from the bottom chassis
assembly.
on the CD mecha-
on the main
Bottom chassis assembly
C
C
Top chassis assembly
Fig.3
Top chassis assembly
Bottom chassis assembly
Top chassis assembly
Main board
Bottom chassis assembly
D
Fig.4
CD mechanism assembly
CN702
E
Fig.5
Top chassis assembly
D
CN501
D
D
Bottom chassis assembly
Rear bracket
Fig.6
(No.MA142)1-7
3.1.4 Removing the front chassis (See Figs.7 and 8)
• Prior to performing the following procedure, remove the front
panel assembly, heat sink and top chassis assembly. (1) From the both sides of the top chassis assembly, remove
the two screws F attaching the front chassis. (See Figs.7 and 8)
(2) Take out the front chassis forward.
3.1.5 Removing the CD mechanism assembly (See Fig.9)
• Prior to performing the following procedures, remove the front
panel assembly, heat sink and top chassis assembly.
Reference:
Remove the front chassis as required. (1) From the inside of the top chassis assembly, remove the
three screws G attaching the CD mechanism assembly.
Reference:
When attaching the screw G, attach it with the mecha heat sink.
(2) Remove the mecha heat sink from the CD mechanism as-
sembly, and take out the CD mechanism assembly from the top chassis.
Reference:
When attaching the mecha heat sink, pass the craws of it through the slots a of CD mechanism assembly.
Top chassis assembly
F
Front chassis
Top chassis
Slots a
Front chassis
Fig.7
Top chassis assembly
Fig.8
Mecha heat sink
G
F
1-8 (No.MA142)
G GCD mechanism assembly
Fig.9
3.1.6 Removing the main board
(See Figs.10 and 11)
• Prior to performing the following procedures, remove the front
panel assembly, heat sink and top chassis assembly. (1) From the back side of the bottom chassis assembly, re-
move the two screws H attaching the rear bracket to the bottom chassis assembly. (See Fig.10)
(2) From the top side of the bottom chassis assembly, remove
the two screws J attaching the main board to the bottom chassis assembly. (See Fig.11)
(3) Release the stopper of the connector CN701
board in an upward direction, disconnect the card wire from the connector CN701
(4) Disconnect the wire from the connector of the front door
mechanism assembly. (See Fig.11)
(5) Disconnect the wire from the connector CN951
board. (See Fig.11)
Reference:
After connecting the wires, fix the wires with the wire clamp.
(6) Take out the main board with the rear bracket from the bot-
tom chassis assembly.
. (See Fig.11)
on the main
on the main
H
Front door mechanism assembly
Connector
Card wire
Bottom chassis assembly
Fig.10
Bottom chassis assembly
CN701
Stopper
Rear bracket
J
J
Main board
CN951
Fig.11
Wire clamps
(No.MA142)1-9
3.1.7 Removing the rear bracket (See Fig.12)
• Prior to performing the following procedures, remove the front
panel assembly, heat sink, top chassis assembly and main board. (1) From the back side of the main board, remove the wires
from the rear bracket in the direction of the arrow.
(2) Remove the screw K, three screws L and screw M attach-
ing the rear bracket to the main board.
Reference:
After attaching the rear bracket to the main board, pass the wires through the wire holder and insert them into the slots of the rear bracket.
(3) Take out the rear bracket from the main board.
Wire
Wire (KD-AR960)
Rear bracket
M
Main board
Wire holder
Slots
Rear bracket
3.1.8 Removing the front door mechanism assembly (See Fig.13)
• Prior to performing the following procedures, remove the front
panel assembly, heat sink, top chassis assembly and main board. (1) From the top side of the bottom chassis assembly, remove
the screw N attaching the FPC guide to the bottom chassis.
(2) Remove the five screws P attaching the front door mecha-
nism assembly to the bottom chassis.
Reference:
When attaching the screws N and P, apply a locking agent them.
(3) Take out the front door mechanism assembly from the bot-
tom chassis.
Bottom chassis
P
L K
Front door mechanism assembly
FPC guide
L
Fig.12
P
N
1-10 (No.MA142)
Fig.13
Loading...
+ 22 hidden pages