JVC KDAR-8500, KDSHX-850 Service manual
SERVICE MANUAL
CD / SD RECEIVER
MA19120056
KD-AR8500,KD-SHX850
Area suffix
J ------------- Northern America
SOURCE
DISP
BACK
BAND
MENU
PICT
SOURCE
DISP
BACK
BAND
MENU
PICT
KD-AR8500 J KD-SHX850 J
ARSENAL rogo
Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)
TABLE OF CONTENTS
1 PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
2 SPECIFIC SERVICE INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
3 DISASSEMBLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7
4 ADJUSTMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-22
5 TROUBLESHOOTING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-29
COPYRIGHT © 2005 Victor Company of Japan, Limited
No.MA191
2005/6
SPECIFICATION
AUDIO AMPLIFIER SECTION
Power Output 35 W RMS × 4 Channels at 4 Ω and [< or =] 1% THD+N
Signal-to-Noise Ratio 85 dBA (reference: 1 W into 4 Ω)
Load Impedance 4 Ω (4 Ω to 8 Ω allowance)
Equalizer Control Range Frequencies : Graphic EQ
Frequencies : Parametric EQ 3 bands (Band 1/2/3)20 Hz, 25 Hz, 31.5 Hz, 40 Hz, 50 Hz, 63 Hz, 80 Hz,
Level ±10 dB
Frequency Response 40 Hz to 20 000 Hz
Line-In Level/Impedance LINE IN 1.5 V/20 kΩ load
Line-Out Level/Impedance LINE OUT 5.0 V/20 kΩ load (full scale)
Output Impedance 1 kΩ
Power Supply Unit DC/DC converter
Other Terminals SUBWOOFER OUT, Changer control, Steering wheel remote input
Frequency Range FM 87.5 MHz to 107.9 MHz (with channel interval set to 200 kHz)
AM 530 kHz to 1 710 kHz (with channel interval set to 10 kHz)
FM Tuner Usable Sensitivity 11.3 dBf (1.0 µV/75 Ω)
50 dB Quieting Sensitivity 16.3 dBf (1.8 µV/75 Ω)
Alternate Channel Selectivity (400 kHz) 65 dB
Frequency Response 40 Hz to 15 000 Hz
Stereo Separation 35 dB
Capture Ratio 1.5 dB
AM Tuner Sensitivity 20 µV
Selectivity 65 dB
CD/SD PLAYER SECTION
Type Compact disc player
Signal Detection System Non-contact optical pickup (semiconductor laser)
Number of Channels 2 channels (stereo)
Frequency Response 5 Hz to 20 000 Hz
Dynamic Range 98 dB
Signal-to-Noise Ratio 102 dB
Wow and Flutter Less than measurable limit
MP3 (MPEG Audio Layer 3) Max. Bit Rate 320 kbps
WMA (Windows Media Audio) Max. Bit Rate 192 kbps
Playable SD Card Format FAT 12/16
Storage Up to 512 MB
Playable Audio Format for SD Card MP3/WMA
Power Requirement Operating Voltage DC 14.4 V (11 V to 16 V allowance)
Grounding System Negative ground
Allowable Operating Temperature 0°C to +40°C (32°F to 104°F)
Dimensions (W × H × D) Installation Size (approx.) 182 mm × 52 mm × 159 mm (7-3/16" × 2-1/16" × 6-5/16")
Panel Size (approx.) 188 mm × 58 mm × 13 mm (7-7/16" × 2-5/16" × 9/16")
Mass (approx.) 1.7 kg (3.8 lbs) (excluding accessories)
63 Hz, 125 Hz, 250 Hz, 500 Hz, 1 kHz, 2 kHz, 4 kHz, 8 kHz, 12.5 kHz (9 bands)
100 Hz,125 Hz, 160 Hz, 200 Hz, 250 Hz, 315 Hz, 400 Hz, 500 Hz,
630 Hz,800 Hz, 1 kHz, 1.2 kHz, 1.6 kHz, 2 kHz, 2.5 kHz, 3.2 kHz,
4 kHz,5 kHz, 6.3 kHz, 8 kHz, 10 kHz, 12.5 kHz, 16 kHz, 20 kHz
(31 frequencies)
TUNER SECTION
87.5 MHz to 108.0 MHz (with channel interval set to 50 kHz)
531 kHz to 1 602 kHz (with channel interval set to 9 kHz)
GENERAL
• Design and specifications are subject to change without notice.
• Microsoft and Windows Media are either registered trademarks or trademarks of Microsoft Corporation in the United States and/
or other countries.
• SD logo is a trademark.
1-2 (No.MA191)
1.1 Safety Precautions
SECTION 1
PRECAUTIONS
!
!
Burrs formed during molding may be left over on some parts of the chassis. Therefore,
pay attention to such burrs in the case of preforming repair of this system.
Please use enough caution not to see the beam directly or touch it in case of an
adjustment or operation check.
(No.MA191)1-3
1.2 Preventing static electricity
Electrostatic discharge (ESD), which occurs when static electricity stored in the body, fabric, etc. is discharged, can destroy the laser
diode in the traverse unit (optical pickup). Take care to prevent this when performing repairs.
1.2.1 Grounding to prevent damage by static electricity
Static electricity in the work area can destroy the optical pickup (laser diode) in devices such as CD players.
Be careful to use proper grounding in the area where repairs are being performed.
(1) Ground the workbench
Ground the workbench by laying conductive material (such as a conductive sheet) or an iron plate over it before placing the
traverse unit (optical pickup) on it.
(2) Ground yourself
Use an anti-static wrist strap to release any static electricity built up in your body.
(caption)
Anti-static wrist strap
1M
Conductive material
(conductive sheet) or iron plate
(3) Handling the optical pickup
• In order to maintain quality during transport and before installation, both sides of the laser diode on the replacement optical
pickup are shorted. After replacement, return the shorted parts to their original condition.
(Refer to the text.)
• Do not use a tester to check the condition of the laser diode in the optical pickup. The tester's internal power source can easily
destroy the laser diode.
1.3 Handling the traverse unit (optical pickup)
(1) Do not subject the traverse unit (optical pickup) to strong shocks, as it is a sensitive, complex unit.
(2) Cut off the shorted part of the flexible cable using nippers, etc. after replacing the optical pickup. For specific details, refer to the
replacement procedure in the text. Remove the anti-static pin when replacing the traverse unit. Be careful not to take too long a
time when attaching it to the connector.
(3) Handle the flexible cable carefully as it may break when subjected to strong force.
(4) It is not possible to adjust the semi-fixed resistor that adjusts the laser power. Do not turn it.
1.4 Attention when traverse unit is decomposed
*Please refer to "Disassembly method" in the text for the CD pickup unit.
• Apply solder to the short land before the flexible wire is disconnected from the connector on the CD pickup unit.
(If the flexible wire is disconnected without applying solder, the CD pickup may be destroyed by static electricity.)
• In the assembly, be sure to remove solder from the short land after connecting the flexible wire.
Short sections
Flexible wire
1-4 (No.MA191)
CN601
Mechanism control board
1.5 Important for laser products
!
1.CLASS 1 LASER PRODUCT
2.DANGER : Invisible laser radiation when open and inter
lock failed or defeated. Avoid direct exposure to beam.
3.CAUTION : There are no serviceable parts inside the
Laser Unit. Do not disassemble the Laser Unit. Replace
the complete Laser Unit if it malfunctions.
4.CAUTION : The CD,MD and DVD player uses invisible
laser radiation and is equipped with safety switches which
prevent emission of radiation when the drawer is open and
the safety interlocks have failed or are defeated. It is
dangerous to defeat the safety switches.
5.CAUTION : If safety switches malfunction, the laser is able
to function.
6.CAUTION : Use of controls, adjustments or performance of
procedures other than those specified here in may result in
hazardous radiation exposure.
Please use enough caution not to
see the beam directly or touch it
in case of an adjustment or operation
check.
REPRODUCTION AND POSITION OF LABELS
WARNING LABEL
CAUTION : Visible and Invisible
CLASS 1
LASER PRODUCT
laser radiation when open and
interlock failed or defeated.
AVOID DIRECT EXPOSURE TO
BEAM. (e)
ADVARSEL : Synlig og usynlig
laserstråling når maskinen er
åben eller interlocken fejeler.
Undgå direkte eksponering til
stråling. (d)
VARNING : Synlig och
osynling laserstrålning när
den öppnas och spärren är
urkopplad. Betrakta ej
strålen. (s)
VARO : Avattaessa ja suojalukitus
ohitettuna tai viallisena olet alttiina
näkyvälle ja näkymättömälle
lasersäteilylle. Vältä säteen
kohdistumista suoraan itseesi. (f)
(No.MA191)1-5
SECTION 2
SPECIFIC SERVICE INSTRUCTIONS
This service manual does not describe DISASSEMBLY.
1-6 (No.MA191)
SECTION 3
DISASSEMBLY
3.1 Main body section
3.1.1 Removing the front panel assembly
(See Fig.1)
(1) Push the detach button in the lower right part of the front
panel assembly.
(2) Remove the front panel assembly.
3.1.2 Removing the heat sink
(See Fig.2)
Reference:
Remove the front panel assembly as required.
(1) From the left side of the main body, remove the two screws
A and three screws B attaching the heat sink.
(2) Remove the heat sink from the main body.
Front panel assembly
Detach button
Fig.1
AAB
Heat sink
Fig.2
(No.MA191)1-7
3.1.3 Removing the top chassis assembly
(See Figs.3 to 6)
• Prior to performing the following procedures, remove the heat
sink.
Reference:
Remove the front panel assembly as required.
(1) From the bottom side of the main body, remove the two
screws C attaching the top chassis assembly to the bottom
chassis assembly. (See Fig.3)
(2) From the both and rear sides of the main body, remove the
five screws D attaching the top chassis assembly to the
bottom chassis assembly. (See Figs.4 to 6)
(3) Lift the top chassis assembly in the direction of the arrow,
disconnect the connector CN503
trol board from the connector CN721 on the main board.
(See Figs.4 to 6)
(4) Take out the top chassis assembly from the bottom chassis
assembly.
on the mechanism con-
C
Top chassis assembly
CN503
Bottom chassis assembly
C
Top chassis assembly
Fig.3
Mechanism control board
Bottom chassis assembly
Top chassis assembly
Main board
Main board
Mechanism control board
Bottom chassis assembly
CN721
Fig.4
Fig.5
D
CN503
CN721
Top chassis assembly
DD
D
D
1-8 (No.MA191)
Bottom chassis assembly
Rear bracket
Fig.6
3.1.4 Removing the front chassis assembly
(See Figs.7 and 8)
• Prior to performing the following procedure, remove the front
panel assembly, heat sink and top chassis assembly.
(1) From the both sides of the top chassis assembly, remove
the two screws E attaching the front chassis assembly.
(2) Remove the front chassis assembly from the top chassis
assembly.
3.1.5 Removing the CD mechanism assembly
(See Fig.9)
• Prior to performing the following procedures, remove the front
panel assembly, heat sink and top chassis assembly.
Reference:
Remove the front chassis assembly as required.
(1) From the inside of the top chassis assembly, remove the
three screws F attaching the CD mechanism assembly.
(2) Release the mecha heat sink from the slots a on the mech-
anism control board and remove the mecha heat sink from
the main body.
(3) Take out the CD mechanism assembly from the top chas-
sis.
Top chassis assembly
E
Front chassis assembly
Mecha heat sink
Top chassis
E
Front chassis assembly
Fig.7
Top chassis assembly
Fig.8
Mechanism control board
F
a
F F
CD mechanism assembly
Fig.9
(No.MA191)1-9
3.1.6 Removing the main board
(See Figs.10 and 11)
• Prior to performing the following procedures, remove the front
panel assembly, heat sink and top chassis assembly.
(1) From the rear side of the bottom chassis assembly, remove
the two screws G attaching the rear bracket to the bottom
chassis assembly. (See Fig.10)
(2) From the top side of the bottom chassis assembly, remove
the two screws H attaching the main board to the bottom
chassis assembly. (See Fig.11)
(3) Release the stopper of the connector CN701
board in an upward direction, disconnect the card wire from
the connector CN701
(4) Disconnect the wire from the connector of the front door
mechanism assembly. (See Fig.11)
(5) Disconnect the wire from the connector CN911
board. (See Fig.11)
Reference:
After connecting the wires, fix the wires with the wire
holders.
(6) Take out the main board from the bottom chassis assem-
bly.
. (See Fig.11)
on the main
on the main
Rear bracket
G
Front door mechanism assembly
Connector
Wire holders
Bottom chassis assembly
Fig.10
Card wire
CN701
Stopper
Bottom chassis assembly
H
3.1.7 Removing the rear bracket
(See Fig.12)
• Prior to performing the following procedures, remove the front
panel assembly, heat sink, top chassis assembly and main
board.
(1) Remove the two screws J and three screws K attaching the
wires to the rear bracket.
(2) Remove two screws M attaching the wire bracket to the
rear bracket.
(3) From the rear side of the main board, remove the wires
from the rear bracket in the direction of the arrow.
Reference:
After attaching the rear bracket to the main board, pass the
wires through the wire bracket and insert them into the slots of
the rear bracket.
H
M
JK
CN911 Main board
Fig.11
Wire bracket
Wire
Rear bracket
Fig.12
1-10 (No.MA191)
3.1.8 Removing the front door mechanism assembly
(See Fig.13)
• Prior to performing the following procedures, remove the front
panel assembly, heat sink, top chassis assembly and main
board.
(1) From the top side of the bottom chassis assembly, remove
the screw N attaching the FPC guide to the bottom chassis.
(2) Remove the five screws P attaching the front door mecha-
nism assembly to the bottom chassis.
Reference:
When attaching the screws N and P, apply a locking
agent them.
(3) Take out the front door mechanism assembly from the bot-
tom chassis.
Front door mechanism assembly
Bottom chassis
3.1.9 Removing the switch board
(See Figs.14 to 16)
• Prior to performing the following procedures, remove the front
panel assembly.
(1) From the rear side of the front panel assembly, remove the
six screws Q attaching the rear cover to the front panel assembly. (See Fig.14)
(2) Release the two joints b of the front panel assembly and re-
move the rear cover. (See Fig.15.)
(3) Take out the switch board from the front panel assembly.
(See Fig.16)
Note:
When removing the rear cover assembly and switch board, be
careful not to lose the spring.
P
FPC guide
Rear cover assembly
Q
P
N
Fig.13
Q
Q
Fig.14
Rear cover assembly
Joints b
Front panel assembly
Spring
Joints b
Fig.15
Switch board
Fig.16
(No.MA191)1-11
Loading...