Intel MFSYS25V2, MFSYS35, Compute Module MFS5000SI Specification

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Intel® Compute Module MFS5000SI

Technical Product Specification

Intel order number: E15154-007

Revision 1.4

June 2009

Enterprise Platforms and Services Division

Revision History Intel® Compute Module MFS5000SI TPS

Revision History

Date Revision

Number

July 2007 0.95 Initial release.

August 2007 0.96 Updated

September 2007 1.0 Updated

February 2008 1.1 Updated

November 2008 1.2 Updated

May 2009 1.3 Updated

June 2009 1.4 Updated supported memory configurations

Modifications

Disclaimers

Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel cause the product to deviate from published specifications. Current characterized errata are available on request.

Intel Corporation server baseboards support peripheral components and contain a number of highdensity VLSI and power delivery components that need adequate airflow to cool. Intel’s own chassis are designed and tested to meet the intended thermal requirements of these components when the fully integrated system is used together. It is the responsibility of the system integrator that chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of air flow required for their specific application and environmental conditions. Intel Corporation can not be held responsible if components fail or the compute module does not operate correctly when used outside any of their published operating or non-operating limits.

Intel, Pentium, Itanium, and Xeon are trademarks or registered trademarks of Intel Corporation.

*Other brands and names may be claimed as the property of others.

Compute Module MFS5000SI may contain design defects or errors known as errata which may

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Intel® Compute Module MFS5000SI TPS Table of Contents

Table of Contents

1. Introduction.............................................................................................................................1

1.1 Chapter Outline........................................................................................................ 1

1.2 Intel® Compute Module Use Disclaimer................................................................... 1

2. Product Overview....................................................................................................................2

2.1 Intel® Compute Module MFS5000SI Feature Set .................................................... 2

2.2 Compute Module Layout.......................................................................................... 3

2.2.1 Connector and Component Locations ..................................................................... 3

2.2.2 External I/O Connector Locations............................................................................ 4

2.2.3 Compute Module Mechanical Drawings .................................................................. 5

3. Functional Architecture ...........................................................................................................6

3.1 Intel® 5000P Memory Controller Hub (MCH) ........................................................... 7

3.1.1 System Bus Interface............................................................................................... 7

3.1.2 Processor Support ...................................................................................................7

3.1.3 Memory Subsystem ................................................................................................. 8

3.2 Intel® 6321ESB I/O Controller Hub ........................................................................ 16

3.2.1 PCI Subsystem ......................................................................................................16

3.2.2 Serial ATA Support ................................................................................................17

3.2.3 Parallel ATA (PATA) Support ................................................................................ 17

3.2.4 USB 2.0 Support.................................................................................................... 18

3.3 Video Support ........................................................................................................18

3.4 Network Interface Controller (NIC) ........................................................................ 19

3.4.1 Intel® I/O Acceleration Technology ........................................................................ 19

3.4.2 MAC Address Definition......................................................................................... 19

3.5 Super I/O ...............................................................................................................19

4. Connector / Header Locations and Pin-outs............................................................................21

4.1 Board Connector Information................................................................................. 21

4.2 Power Connectors ................................................................................................. 21

4.3 I/O Connector Pin-out Definition ............................................................................22

4.3.1 VGA Connector...................................................................................................... 22

4.3.2 I/O Mezzanine Card Connector ............................................................................. 22

4.3.3 Midplane Signal Connector.................................................................................... 23

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4.3.4 Serial Port Connector ............................................................................................24

4.3.5 USB 2.0 Connectors ..............................................................................................25

5. Jumper Block Settings ............................................................................................................26

5.1 Recovery Jumper Blocks ....................................................................................... 26

5.1.1 CMOS Clear and Password Reset Usage Procedure ...........................................27

5.1.2 BMC Force Update Procedure .............................................................................. 27

5.1.3 System Status LED – BMC Initialization................................................................ 28

6. Product Regulatory Requirements .........................................................................................29

6.1 Product Regulatory Requirements......................................................................... 29

6.2 Product Regulatory Compliance and Safety Markings ..........................................29

6.3 Product Environmental/Ecology Requirements .....................................................29

6.4 Product Environmental/Ecology Markings ............................................................. 29

Appendix A: Integration and Usage Tips .......................................................................................30

Appendix B: BMC Sensor Tables....................................................................................................31

Appendix C: POST Error Messages and Handling ...........................................................................37

Appendix D: Supported Intel

Modular Server System....................................................................40

Glossary.......................................................................................................................................41

Reference Documents..................................................................................................................44

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Intel® Compute Module MFS5000SI TPS List of Figures

List of Figures

Figure 1. Component and Connector Location Diagram ..............................................................3

Figure 2. Intel

Figure 3. Intel

Figure 4. Compute Module Functional Block Diagram .................................................................6

Figure 5. CEK Processor Mounting ..............................................................................................8

Figure 6. Memory Layout ..............................................................................................................9

Figure 7. Recommended Minimum Two-DIMM Memory Configuration ......................................12

Figure 8. Recommended Four-DIMM Configuration................................................................... 13

Figure 9. Single Branch Mode Sparing DIMM Configuration ...................................................... 14

Figure 10. Recovery Jumper Blocks ...........................................................................................26

Figure 11. Intel

Compute Module MFS5000SI Front Panel Layout............................................... 4

Compute Module MFS5000SI – Hole and Component Positions ........................5

Modular Server System MFSYS25 ..................................................................40

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List of Tables Intel® Compute Module MFS5000SI TPS

List of Tables

Table 1. I

C Addresses for Memory Module SMB ........................................................................9

Table 2. Maximum 8-DIMM System Memory Configuration – x8 Single Rank ........................... 10

Table 3. Maximum 8-DIMM System Memory Configuration – x4 Dual Rank.............................. 10

Table 4. PCI Bus Segment Characteristics................................................................................. 16

Table 5. Video Modes .................................................................................................................18

Table 6. Serial Header Pin-out.................................................................................................... 20

Table 7. Board Connector Matrix ................................................................................................21

Table 8. Power Connector Pin-out (J1A1) .................................................................................. 21

Table 9. VGA Connector Pin-out (J6A1)..................................................................................... 22

Table 10. 120-pin I/O Mezzanine Card Connector Pin-out .........................................................22

Table 11. 96-pin Midplane Signal Connector Pin-out .................................................................23

Table 12. Internal 9-pin Serial ‘A’ Header Pin-out (J1B1) ...........................................................25

Table 13. External USB Connector Pin-out ................................................................................25

Table 14. Recovery Jumpers ......................................................................................................27

Table 15. BMC Sensors.............................................................................................................. 32

Table 16. Analog Sensor Thresholds.......................................................................................... 36

Table 17. POST Error Messages and Handling.......................................................................... 37

Table 18. POST Error Beep Codes ............................................................................................39

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Intel® Compute Module MFS5000SI TPS 0BIntroduction

1. Introduction

This Technical Product Specification (TPS) provides board-specific information detailing the features, functionality, and high-level architecture of the Intel

Series Chipsets Server Board Family Datasheet should also be referenced for more in-depth detail of

various board subsystems, including chipset, BIOS, System Management, and System Management software.

Compute Module MFS5000SI. The Intel® 5000

1.1 Chapter Outline

This document is divided into the following chapters:

 Chapter 1 – Introduction  Chapter 2 – Product Overview  Chapter 3 – Functional Architecture  Chapter 4 – Connector / Header Locations and Pin-outs  Chapter 5 – Jumper Block Settings  Chapter 6 – Product Regulatory Requirements  Appendix A – Integration and Usage Tips  Appendix B – BMC Sensor Tables  Appendix C – Post Error Messages and Handling  Appendix D – Supported Intel

1.2 Intel

Compute Module Use Disclaimer

Modular Server System

Intel® Modular Server components require adequate airflow to cool. Intel ensures through its own chassis development and testing that when these components are used together, the fully integrated system will meet the intended thermal requirements. It is the responsibility of the system integrator who chooses not to use Intel-developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of airflow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible if components fail or the system does not operate correctly when used outside any of their published operating or non-operating limits.

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1BProduct Overview Intel® Compute Module MFS5000SI TPS

2. Product Overview

The Intel® Compute Module MFS5000SI is a monolithic printed circuit board with features that were designed to support the high-density compute module market.

2.1 Intel

Processors 771-pin LGA sockets supporting one or two Dual-Core or Quad-Core Intel® Xeon®

Memory 8 keyed DIMM slots supporting fully buffered DIMM technology (FBDIMM) memory.

Chipset Intel® 5000 Chipset family, which includes the following components:

On-board Connectors/Headers

On-board Video ATI* ES1000 video controller with 16MB DDR SDRAM

On-board Hard Drive Controller

LAN Two integrated 10/100/1000 Ethernet ports and two optional 10/100/1000 Ethernet

Compute Module MFS5000SI Feature Set

Feature Description

processors 5000 sequence, with system bus speeds of 1066 MHz or 1333 MHz

240-pin DDR2-677 FBDIMMs must be used.

 Intel

External connections:

 Two USB 2.0 ports

 Video connector

Internal connectors/headers:

 One DH-10 Serial A debug header

 One Intel

LSI* 1064e SAS controller

ports, provided by the Dual Gigabit NIC mezzanine module

5000P Memory Controller Hub

6321ESB I/O Controller Hub

I/O Mezzanine Connector supporting Dual Gigabit NIC Intel® I/O

Expansion Module (Optional)

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2.2 Compute Module Layout

2.2.1 Connector and Component Locations

The following figure shows the board layout of the Intel® Compute Module MFS5000SI. Each connector and major component is identified by a number or letter. A description of each identified item is provided below the figure.

Description Description

A Midplane Power Connector B Midplane Signal Connector

C POST Code Diagnostic LEDs D SAS Controller

E FBDIMM Slots F Intel® 5000P Memory Controller Hub (MCH)

G CPU #1 Socket H Voltage Regulator Heatsink

I Power/Fault LEDs J Power Button

K Activity and ID LEDs L Video Connector

M USB1 and USB2 Connectors N CPU #2 Socket

O Intel® 6321ESB I/O Controller Hub P CMOS Battery

Q I/O Mezzanine Card Connector

Figure 1. Component and Connector Location Diagram

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2.2.2 External I/O Connector Locations

The following drawing shows the layout of the external I/O components for the Intel® Compute Module MFS5000SI.

A USB ports 1 and 2 E Hard Drive Activity LED

B Video F ID LED

C I/O ports 1 and 2 G Power button

D NIC ports 1 and 2 H Power and Fault LEDs

Figure 2. Intel® Compute Module MFS5000SI Front Panel Layout

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2.2.3 Compute Module Mechanical Drawings

Figure 3. Intel

Compute Module MFS5000SI – Hole and Component Positions

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2BFunctional Architecture Intel® Compute Module MFS5000SI TPS

3. Functional Architecture

The architecture and design of the Intel® Compute Module MFS5000SI is based on the Intel® 5000 Chipset Family. The chipset is designed for systems based on the Dual-Core and Quad-Core Intel

processor 5000 sequence with system bus speeds of 667 MHz, 1066 MHz, and 1333 MHz. The

Xeon chipset is made up of two main components: the Memory Controller Hub (MCH) for the host bridge and the Intel

6321ESB I/O controller hub for the I/O subsystem. This chapter provides a high-level

description of the functionality associated with each chipset component and the architectural blocks that make up the server board. For more in-depth detail of the functionality for each

components and each of the functional architecture blocks, see the Intel

of the chipset

5000 Series Chipsets Server

Board Family Datasheet.

Figure 4. Compute Module Functional Block Diagram

Note: The previous diagram uses the Intel

5000P MCH as a general reference designator for MCH

components supported on this server board.

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Intel® Compute Module MFS5000SI TPS 2BFunctional Architecture

3.1 Intel

5000P Memory Controller Hub (MCH)

This section describes the general functionality of the memory controller hub as it is implemented on this server board.

The MCH is a single 1432-pin FCBGA package, which includes the following core platform functions:

System Bus Interface for the processor subsystem

Memory Controller

PCI Express* Ports, including the Enterprise South Bridge Interface (ESI)

FBD Thermal Management

SMBus Interface

Additional information about MCH functionality can be obtained from the Intel Server Board Family Datasheet and the Intel

5000P Memory Controller Hub External Design

5000 Series Chipsets

Specification.

3.1.1 System Bus Interface

The MCH is configured for symmetric multi-processing across two independent front-side bus interfaces that connect to the Dual-Core and Quad-Core Intel bus on the MCH uses a 64-bit wide 1066 or 1333 MHz data bus. The 1333-MHz data bus is capable of transferring data at up to 10.66 GB/s. The MCH supports a 36-bit wide address bus, capable of addressing up to 64 GB of memory. The MCH is the priority agent for both front-side bus interfaces, and is optimized for one processor on each bus.

Xeon® processors 5000 sequence. Each front-side

3.1.2 Processor Support

The Intel® Compute Module MFS5000SI supports one or two Dual-Core Intel® Xeon® processors 5100 sequence or Quad-Core Intel 1066 MHz and 1333 MHz. Previous generations of the Intel

Compute Module MFS5000SI. To see a list of the latest processors that have been validated on

Intel this product, refer to

http://support.intel.com/support/motherboards/server/MFS5000SI/ and select

the Supported Processors List.

3.1.2.1 Processor Population Rules

When two processors are installed, both must be of identical revision, core voltage, and bus/core speed. Mixed processor steppings is supported in N and N-1 configurations only. When only one processor is installed, it must be in the socket labeled CPU1. The other socket must be empty.

The board is designed to provide up to 115 A of current per processor. Processors with higher current requirements are not supported.

When using a single processor configuration, a terminator is not required in the second processor socket.

Xeon® processors 5300 and 5400 sequence with system bus speeds of

Xeon® processor are not supported in the

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3.1.2.2 Common Enabling Kit (CEK) Design Support

The compute module complies with Intel’s Common Enabling Kit (CEK) processor mounting and heatsink retention solution. The compute module ships with a CEK spring snapped onto the underside of the server board, beneath each processor socket. The heatsink attaches to the CEK, over the top of the processor and the thermal interface material (TIM). For the stacking order of the chassis, CEK spring, server board, TIM, and heatsink, see the following figure.

The CEK spring is removable, allowing for the use of non-Intel heatsink retention solutions.

Note: The processor heatsink and CEK spring shown in the following diagram are for reference purposes

only. The actual processor heatsink and CEK solutions compatible with this generation server board may be of a different design.

Heatsink assembly

Thermal interface material (TIM)

Server board

CEK spring

Chassis

Figure 5. CEK Processor Mounting

3.1.3 Memory Subsystem

The MCH masters four fully buffered DIMM (FBD) memory channels. FBD memory utilizes a narrow highspeed frame-oriented interface referred to as a channel. The four FBD channels are organized into two branches of two channels per branch. Each branch is supported by a separate memory controller. The two channels on each branch operate in lock step to increase FBD bandwidth. On the server board, the four channels are routed to eight DIMM slots and are capable of supporting registered DDR2-533 and DDR2-667 FBDIMM memory (stacked or unstacked). Peak theoretical memory data bandwidth is 6.4 GB/s with DDR2-533 and 8.0 GB/s with DDR2-667.

On the Intel consists of channels A and B, and Branch 1 consists of channels C and D. FBD memory channels are organized into two branches for RAID 1 (mirroring) support.

Compute Module MFS5000SI, a pair of channels becomes a branch where Branch 0

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Channel B

Channel A

Channel C

Channel D

MCH

DIMM A1

DIMM A2

DIMM B1

DIMM B2

DIMM C1

DIMM C2

DIMM D1

Branch 0

DIMM D2

Branch 1

Figure 6. Memory Layout

To boot the system, the system BIOS on the server board uses a dedicated I

C bus to retrieve DIMM information needed to program the MCH memory registers. The following table provides the I addresses for each DIMM slot.

TP02299

Table 1. I

C Addresses for Memory Module SMB

Device Address

DIMM A1 0xA0

DIMM A2 0xA2

DIMM B1 0xA0

DIMM B2 0xA2

DIMM C1 0xA0

DIMM C2 0xA2

DIMM D1 0xA0

DIMM D2 0xA2

3.1.3.1 Memory RASUM Features

The MCH supports several memory RASUM (Reliability, Availability, Serviceability, Usability, and Manageability) features. These features include the Intel

x4 Single Device Data Correction (Intel® x4 SDDC) for memory error detection and correction, Memory Scrubbing, Retry on Correctable Errors, Memory Built In Self Test, DIMM Sparing, and Memory Mirroring. For more information regarding these

features, see the Intel

5000 Series Chipsets Server Board Family Datasheet.

DIMM Sparing and Memory Mirroring features will be made available post production launch with a BIOS update.

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3.1.3.2 Supported and Nonsupported Memory Configurations

The server board design supports up to eight DDR2-533 or DDR2-667 Fully Buffered DIMMs (FBD memory). Use of identical DIMMs with this server board is recommended. The following tables show the maximum memory configurations supported using the specified memory technology.

Table 2. Maximum 8-DIMM System Memory Configuration – x8 Single Rank

DRAM Technology x8 Single

Rank

256 Mb 1 GB 2 GB

512 Mb 2 GB 4 GB 1024 Mb 4 GB 8 GB 2048 Mb 8 GB 16 GB

Maximum Capacity

Mirrored Mode

Table 3. Maximum 8-DIMM System Memory Configuration – x4 Dual Rank

DRAM Technology x4 Dual

Rank

256 Mb 4 GB 8 GB 512 Mb 8 GB 16 GB

1024 Mb 16 GB 32 GB 2048 Mb 16 GB 32 GB

Maximum Capacity Mirrored

Mode

The following configurations are not validated or supported with the Intel

DDR2 DIMMs that are not fully buffered are NOT supported on this server board.

DDR2-533 memory is not planned to be validated on this product.

Mixing memory type, size, speed, and/or rank is not validated and is not supported.

Mixing memory vendors is not validated and is not supported.

Non-ECC memory is not validated and is not supported in a server environment

Maximum Capacity

Non-Mirrored Mode

Maximum Capacity

Non-Mirrored Mode

Compute Module MFS5000SI:

For a complete list of supported memory for the Intel Memory List published in the Intel

Server Configurator Tool.

Compute Module MFS5000SI, refer to the Tested

3.1.3.3 DIMM Population Rules and Supported DIMM Configurations

DIMM population rules depend on the operating mode of the memory controller, which is determined by the number of DIMMs installed. DIMMs must be populated in pairs. DIMM pairs are populated in the following DIMM slot order: A1 and B1, C1 and D1, A2 and B2, C2 and D2. DIMMs within a given pair must be identical with respect to size, speed, and organization.

Intel supported DIMM configurations for this server board are shown in the following table.

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Supported and Validated configuration : Slot is populated

Supported but not validated configuration : Slot is populated

Slot is not populated

Mirroring: Y = Yes and indicates that configuration supports Memory Mirroring. Sparing: Y(x) = Yes and indicates that configuration supports Memory Sparing.

Where x = 0: Sparing supported on Branch0 only

1: Sparing supported on Branch1 only 0,1: Sparing supported on both branches

Branch 0 Branch 1

Mirroring

Channel A Channel B Channel C Channel D

DIMM_A1 DIMM_A2 DIMM_B1 DIMM B2 DIMM C1 DIMM C2 DIMM D1 DIMM D2

Y (0)

Y Y (0, 1)

Possible

Sparing

Possible

Notes:

 Single channel mode is only tested and supported with a 512-MB x8 FBDIMM installed in DIMM

slot A1.

 The supported memory configurations must meet population rules defined above.

 For best performance, the number of DIMMs installed should be balanced across both memory

branches. For example, a four-DIMM configuration will perform better than a two-DIMM configuration and should be installed in DIMM slots A1, B1, C1, and D1. An eight-DIMM configuration will perform better then a six-DIMM configuration.

 Although mixed DIMM capacities (size, type, timing and/or rank) between channels is supported

by the memory controller, mixed DIMMs configurations are not validated or supported with the

Compute Module MFS5000SI. Refer to section 3.1.3.2 for supported and nonsupported

Intel DIMM configuration information.

3.1.3.3.1 Minimum Non-Mirrored Mode Configuration

The server board is capable of supporting a minimum of one DIMM installed. However, for system performance reasons, Intel’s recommendation is that at least 2 DIMMs be installed.

The following diagram shows the recommended minimum DIMM memory configuration. Populated DIMM

slots are shown in Grey.

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Channel B

Channel A

Channel C

Channel D

MCH

DIMM A1

DIMM A2

DIMM B1

DIMM B2

DIMM C1

DIMM C2

DIMM D1

Branch 0

DIMM D2

Branch 1

TP02300

Figure 7. Recommended Minimum Two-DIMM Memory Configuration

Note: The server board supports single DIMM mode operation. Intel only validates and supports this

configuration with a single 512MB x8 FBDIMM installed in DIMM slot A1.

3.1.3.4 Non-mirrored Mode Memory Upgrades

The minimum memory upgrade increment is two DIMMs per branch. The DIMMs must cover the same slot position on both channels. DIMM pairs must be identical with respect to size, speed, and organization.

When adding two DIMMs to the configuration shown in Figure 7, the DIMMs should be populated in

DIMM slots C1 and D1 as shown in the following diagram. Populated DIMM slots are shown in Grey.

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Channel B

Channel A

Channel C

Channel D

MCH

DIMM A1

DIMM A2

DIMM B1

DIMM B2

DIMM C1

DIMM C2

DIMM D1

Branch 0

DIMM D2

Branch 1

TP02301

Figure 8. Recommended Four-DIMM Configuration

Functionally, DIMM slots A2 and B2 could also have been populated instead of DIMM slots C1 and D1. However, your system will not achieve equivalent performance. Figure 8 shows the supported DIMM configuration that is recommended because it allows both memory branches from the MCH to operate independently and simultaneously. FBD bandwidth is doubled when both branches operate in parallel.

3.1.3.4.1 Mirrored Mode Memory Configuration

When operating in the mirrored mode, both branches operate in lock step. In mirrored mode, branch 1 contains a replicate copy of the data in branch 0. The minimum DIMM configuration to support memory mirroring is four DIMMs, populated as shown in Figure 8. All four DIMMs must be identical with respect to size, speed, and organization.

To upgrade a four-DIMM mirrored memory configuration, four additional DIMMs must be added to the system. All four DIMMs in the second set must be identical to the first.

3.1.3.4.2 DIMM Sparing Mode Memory Configuration

The MCH provides DIMM sparing capabilities. Sparing is a RAS feature that involves configuring a DIMM to be placed in reserve so it can be used to replace a DIMM that fails. DIMM sparing occurs within a given bank of memory and is not supported across branches.

Two Memory Sparing configurations are supported:

 Single Branch Mode Sparing  Dual Branch Mode Sparing

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3.1.3.4.2.1 Single Branch Mode Sparing

Slot 2

Slot 1

DIMM_A2

DIMM_A1

Channel A Cha nnel B Channel C Channel D

DIMM_B2

DIMM_B1

DIMM_C2

DIMM_C1

DIMM_D2

DIMM_D1

Bran ch 0 Bran ch 1

Intel® 5000P/5000X Memory Control l er H u b

Figure 9. Single Branch Mode Sparing DIMM Configuration

 DIMM_A1 and DIMM_B1 must be identical in organization, size and speed.  DIMM_A2 and DIMM_B2 must be identical in organization, size and speed.  DIMM_A1 and DIMM_A2 should be identical in organization, size and speed. See note below.  DIMM_B1 and DIMM_B2 should be identical in organization, size and speed. See note below.  Sparing should be enabled in the BIOS setup.  The BIOS will configure Rank Sparing Mode.  The larger of the pairs {DIMM_A1, DIMM_B1} and {DIMM_A2, DIMM_B2} will be selected as the

spare pair unit.

Note: Use of identical memory is recommended with the Intel

Compute Module MFS5000SI. Mixing memory type, size, speed, rank and/or vendors is not validated and is not supported with this product. Refer to section 3.1.3.2 for supported and nonsupported memory features and configuration information.

3.1.3.4.2.2 Dual Branch Mode Sparing

Dual branch mode sparing requires that all eight DIMM slots be populated and compliant with the following population rules.

 DIMM_A1 and DIMM_B1 must be identical in organization, size and speed.  DIMM_A2 and DIMM_B2 must be identical in organization, size and speed.  DIMM_C1 and DIMM_D1 must be identical in organization, size and speed.  DIMM_C2 and DIMM_D2 must be identical in organization, size and speed.  DIMM_A1 and DIMM_A2 should be identical in organization, size and speed. See note below.  DIMM_B1 and DIMM_B2 should be identical in organization, size and speed. See note below.  DIMM_C1 and DIMM_C2 should be identical in organization, size and speed. See note below.  DIMM_D1 and DIMM_D2 should be identical in organization, size and speed. See note below.  Sparing should be enabled in BIOS setup.  BIOS will configure Rank Sparing Mode.  The larger of the pairs {DIMM_A1, DIMM_B1} and {DIMM_A2, DIMM_B2} and {DIMM_C1,

DIMM_D1} and {DIMM_C2, DIMM_D2} will be selected as the spare pair units.

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Note: Use of identical memory is recommended with the Intel

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3.2 Intel

6321ESB I/O Controller Hub

The Intel® 6321ESB I/O Controller Hub is a multi-function device that provides four distinct functions: an IO Controller, a PCI-X Bridge, a Gb Ethernet Controller, and an Integrated Baseboard Management Controller (BMC). Each function within the Intel

6321ESB I/O Controller Hub has its own set of

configuration registers. Once configured, each appears to the system as a distinct hardware controller.

A primary role of the Intel devices and features. The server board uses the following Intel

6321ESB I/O Controller Hub is to provide the gateway to all PC-compatible I/O

6321ESB I/O Controller Hub features:

 Dual GbE MAC  Integrated Baseboard Management Controller (BMC)  Universal Serial Bus 2.0 (USB) interface  LPC bus interface  PC-compatible timer/counter and DMA controllers  APIC and 8259 interrupt controller  Power management  System RTC  General purpose I/O

This section describes the function of most of the listed features as they pertain to this server board. For

more detailed information, see the Intel

Enterprise South Bridge-2 External Design Specification.

Intel

5000 Series Chipsets Server Board Family Datasheet or the

3.2.1 PCI Subsystem

The primary I/O buses for the server board are PCI and PCI Express*. The PCI buses comply with the

PCI Local Bus Specification, Revision 2.3. The following table lists the characteristics of the PCI bus

segments. Details about each bus segment follow the table.

Table 4. PCI Bus Segment Characteristics

PCI Bus Segment Voltage Width Speed Type On-board Device Support

PCI32

6321ESB I/O

Intel Controller Hub

PE1

6321ESB I/O

Intel Controller Hub PCI Express* Port2

PE2

6321ESB I/O

Intel Controller Hub PCI Express* Port3

PE4, PE5

BNB PCI Express* Ports 4,5

3.3V 32 bit 33 MHz PCI Used internally for video controller

3.3V x4 10 Gb/S

3.3V x8 20 Gb/S

PCI Express*

This interface is not used in the Intel® Compute Module MFS5000SI design.

Used internally for LSI* 1064e SAS controller

I/O Mezzanine slot

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PCI Bus Segment Voltage Width Speed Type On-board Device Support

PE6, PE7

BNB PCI Express* Ports 6,7

3.3V x8 20 Gb/S

PCI Express*

This interface is not used in the Intel® Compute Module MFS5000SI design.

3.2.1.1 PCI32: 32-bit, 33-MHz PCI Bus Segment

All 32-bit, 33-MHz PCI I/O is directed through the Intel® 6321ESB I/O Controller Hub. The 32-bit, 33-MHz PCI segment created by the Intel

6321ESB I/O Controller Hub is known as the PCI32 segment. The

PCI32 segment supports the following embedded device:

 2D Graphics Accelerator: ATI* ES1000 Video Controller

3.2.1.2 PXA: 64-bit, 133MHz PCI-X Bus Segment

One 64-bit PCI-X bus segment is directed through the Intel® 6321ESB I/O Controller Hub. PCI-X segment PXA is not used in the Intel

Compute Module MFS5000SI design.

3.2.1.3 PE1: One x4 PCI Express* Bus Segment

One x4 PCI Express* bus segment is directed through the Intel® 6321ESB I/O Controller Hub. PCI Express* segment PE1 is not used in the Intel

Compute Module MFS5000SI design.

3.2.1.4 PE2: One x4 PCI Express* Bus Segment

One x4 PCI Express* bus segment is directed through the Intel® 6321ESB I/O Controller Hub. PCI Express* segment PE2 supports the LSI* 1064e SAS controller.

3.2.1.5 PE4, PE5: Two x4 PCI Express* Bus Segments

Two x4 PCI Express* bus segments are directed through the MCH. PCI Express* segments PE4 and PE5 support the optional I/O mezzanine card.

3.2.1.6 PE6, PE7: Two x4 PCI Express* Bus Segments

Two x4 PCI Express* bus segments are directed through the MCH. PCI Express* segments PE6 and PE7 are not used in the Intel

Compute Module MFS5000SI design.

3.2.2 Serial ATA Support

The Intel® 6321ESB I/O Controller Hub has an integrated Serial ATA (SATA) controller that supports independent DMA operation on six ports and supports data transfer rates of up to 3.0 Gb/s. These ports are not used in the Intel

Compute Module MFS5000SI design.

3.2.3 Parallel ATA (PATA) Support

The integrated IDE controller of the Intel® 6321ESB I/O Controller Hub provides one IDE channel. The PATA interface is not used in the Intel

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3.2.4 USB 2.0 Support

The USB controller functionality integrated into the Intel® 6321ESB I/O Controller Hub provides the server board with the interface for up to eight USB 2.0 ports. Two external connectors are located on the front edge of the server board. These two ports are the only ports of the Intel

6321ESB I/O Controller Hub

that are used in the compute module design.

3.3 Video Support

The server board provides an ATI* ES1000 PCI graphics accelerator, along with 16 MB of video DDR SDRAM and supports circuitry for an embedded SVGA video subsystem. The ATI* ES1000 chip contains an SVGA video controller, clock generator, 2D engine, and RAMDAC in a 359-pin BGA. One 4Mx16x4 bank DDR SDRAM chip provides 16 MB of video memory.

The SVGA subsystem supports a variety of modes, up to 1024 x 768 resolution in 8 / 16 / 32 bpp modes under 2D. It also supports both CRT and LCD monitors up to a 100-Hz vertical refresh rate.

Video is accessed using a standard 15-pin VGA connector found on the front edge of the server board. Hot plugging the video while the system is still running is supported.

On-board video can be disabled using the BIOS Setup utility.

3.3.1.1 Video Modes

The ATI* ES1000 chip supports all standard IBM* VGA modes. The following table shows the 2D modes supported for both CRT and LCD.

Table 5. Video Modes

2D Video Mode Support 2D Mode Refresh Rate (Hz)

8 bpp 16 bpp 32 bpp

640x480 60, 72, 75, 85, 90,

100

800x600 60, 70, 72, 75, 85, Supported Supported Supported

1024x768 60, 70, 72, 75,85 Supported Supported Supported

1152x864 60,70,75,80,85 Supported Supported Supported

1280x1024 60 Supported Supported Supported

Supported Supported Supported

3.3.1.2 Video Memory Interface

The memory controller subsystem of the ATI* ES1000 arbitrates requests from the direct memory interface, the VGA graphics controller, the drawing co-processor, the display controller, the video scalar, and the hardware cursor. Requests are serviced in a manner that ensures display integrity and maximum CPU/co-processor drawing performance.

The server board supports a 16 MB (4Meg x 16-bit x 4 banks) DDR SDRAM device for video memory.

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3.4 Network Interface Controller (NIC)

Network interface support is provided from the built-in Dual GbE MAC features of the Intel® 6321ESB I/O Controller Hub. These interfaces are routed over the midplane board to the Ethernet switch module in the rear of the system. These interfaces are used in SERDES mode and do not require a Physical Layer Transceiver (PHY). These ports provide the server board with support for dual LAN ports designed for 10/100/1000 Mbps operation.

Each Network Interface Controller (NIC) drives a single LED located on the front edge of the board. The link/activity LED indicates network connection when on, and Transmit/Receive activity when blinking.

3.4.1 Intel

Intel® I/O Acceleration Technology (I/OAT) moves network data more efficiently through Dual-Core and Quad-Core Intel responsiveness across diverse operating systems and virtualized environments. Intel network application responsiveness by unleashing the power of Dual-Core and Quad-Core Intel processors 5000 sequence through more efficient network data movement and reduced system overhead. Intel multi-port network adapters with Intel consolidation and virtualization through stateless network acceleration that seamlessly scales across multiple ports and virtual machines. Intel

I/O Acceleration Technology

Xeon® processors 5000 sequence-based servers for improved application

I/OAT provide high-performance I/O for server

I/OAT provides safe and flexible network acceleration through

I/OAT improves

Xeon®

tight integration into popular operating systems and virtual machine monitors, avoiding the support risks of third-party network stacks and preserving existing network requirements, such as teaming and failover.

3.4.2 MAC Address Definition

Each Intel® Compute Module MFS5000SI has four MAC addresses assigned to it at the Intel factory. During the manufacturing process, each server board will have a white MAC address sticker placed on the board. The sticker will display the MAC address in both barcode and alpha numeric formats. The printed MAC address is assigned to NIC 1 on the server board. NIC 2 is assigned the NIC 1 MAC address + 1.

Two additional MAC addresses are assigned to the Integrated Baseboard Management Controller (BMC) embedded in the Intel BMC’s embedded network stack to enable IPMI remote management over LAN. BMC LAN Channel 1 is assigned the NIC1 MAC address + 2, and BMC LAN Channel 2 is assigned the NIC1 MAC address + 3.

6321ESB I/O Controller Hub. These MAC addresses are used by the Integrated

3.5 Super I/O

Legacy I/O support is provided by using a National Semiconductor* PC87427 Super I/O device. This chip contains all of the necessary circuitry to support the following functions:

 GPIOs  One serial port (internal and used for debug only)  Wake-up control

3.5.1.1 Serial Ports

The server board provides one serial port through an internal DH-10 serial header (J1B1) to be used for debug purposes only. The serial interface follows the standard RS-232 pin-out as defined in the following table.

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Table 6. Serial Header Pin-out

Pin Signal Name Serial Port Header Pin-out

1 DCD

2 DSR

3 RX

4 RTS

5 TX

6 CTS

7 DTR

8 RI

9 GND

3.5.1.2 Floppy Disk Controller

The server board does not support a floppy disk controller (FDC) interface. However, the system BIOS does recognize USB floppy devices.

3.5.1.3 Keyboard and Mouse Support

Keyboard and mouse support is provided locally by the two USB ports located on the front panel of the board. The compute module also provides remote keyboard and mouse support.

3.5.1.4 Wake-up Control

The super I/O contains functionality that allows various events to power on and power off the system.

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4. Connector / Header Locations and Pin-outs

4.1 Board Connector Information

The following section provides detailed information regarding all connectors, headers and jumpers on the server board. Table 7 lists all connector types available on the board and the corresponding reference designators printed on the silkscreen.

Table 7. Board Connector Matrix

Connector Quantity Reference Designators

Power Connector 1 J1A1

Midplane Signal Connector 1 J3A1

CPU 2 J7G1, J5G1

Main Memory 8 J7B1,J7B2,J7B3,J8B2,J8B3,J8B4,J9B2,

J9B3

I/O Mezzanine 1 J2B1

Battery 1 XBT1F1

USB 2 J4K1,J4K2

Serial Port A 1 J1B1

Video connector 1 J6K1

System Recovery Setting Jumpers

1 J4A1, J7A1, J1F2

4.2 Power Connectors

The power connection is obtained using a 2x2 FCI Airmax* power connector. The following table defines the power connector pin-out.

Table 8. Power Connector Pin-out (J1A1)

Position Signal

1 +12Vdc

2 GND

3 GND

4 +12Vdc

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4.3 I/O Connector Pin-out Definition

4.3.1 VGA Connector

The following table details the pin-out definition of the VGA connector (J6K1).

Table 9. VGA Connector Pin-out (J6A1)

Pin Signal Name Description

1 V_IO_R_CONN Red (analog color signal R)

2 V_IO_G_CONN Green (analog color signal G)

3 V_IO_B_CONN Blue (analog color signal B)

4 TP_VID_CONN_B4 No connection

5 GND Ground

6 GND Ground

7 GND Ground

8 GND Ground

9 TP_VID_CONN_B9 No connection

10 GND Ground

11 TP_VID_CONN_B11 No connection

12 V_IO_DDCDAT DDCDAT

13 V_IO_HSYNC_CONN HSYNC (horizontal sync)

14 V_IO_VSYNC_CONN VSYNC (vertical sync)

15 V_IO_DDCCLK DDCCLK

4.3.2 I/O Mezzanine Card Connector

The server board provides an internal 120-pin Airmax* connector (J2B1) to accommodate high-speed I/O expansion modules, which expands the I/O capabilities of the server board. The currently available I/O mezzanine card for this server is the Intel Ethernet card based on the Intel

82571EB. The following table details the pin-out of the Intel® I/O

expansion module connector.

Table 10. 120-pin I/O Mezzanine Card Connector Pin-out

Pin Signal Name Pin Signal Name Pin Signal Name

A1 PE4_MCH_RXP_C0 E1 PE5_MCH_RXN_C0 I1 GND

A2 GND E2 PE5_MCH_TXP_C0 I2 Reset_N

A3 PE4_MCH_RXP_C1 E3 PE5_MCH_RXN_C1 I3 GND

A4 GND E4 PE5_MCH_TXP_C1 I4 P1_ACT_LED_N

A5 PE4_MCH_RXP_C2 E5 PE5_MCH_RXN_C2 I5 GND

A6 GND E6 PE5_MCH_TXP_C2 I6 P3V3

A7 PE4_MCH_RXP_C3 E7 PE5_MCH_RXN_C3 I7 GND

A8 GND E8 PE5_MCH_TXP_C3 I8 P3V3

A9 CLK_100M_PCIE_P E9 spare I9 GND

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A10 GND E10 SMB_SCL I10 P12V

B1 PE4_MCH_RXN_C0 F1 GND J1 XE_P2_D_RXN

B2 PE4_MCH_TXP_C0 F2 PE5_MCH_TXN_C0 J2 GND

B3 PE4_MCH_RXN_C1 F3 GND J3 XE_P2_C_RXN

B4 PE4_MCH_TXP_C1 F4 PE5_MCH_TXN_C1 J4 GND

B5 PE4_MCH_RXN_C2 F5 GND J5 XE_P2_B_RXN

B6 PE4_MCH_TXP_C2 F6 PE5_MCH_TXN_C2 J6 GND

B7 PE4_MCH_RXN_C3 F7 GND J7 XE_P2_A_RXN

B8 PE4_MCH_TXP_C3 F8 PE5_MCH_TXN_C3 J8 GND

B9 CLK_100M_PCIE_N F9 GND J9 P12V

B10 WAKE_N F10 SMB_SDA J10 GND

C1 GND G1 Card_ID_0 K1 XE_P2_D_RXP

C2 PE4_MCH_TXN_C0 G2 GND K2 XE_P2_D_TXN

C3 GND G3 P5V K3 XE_P2_C_RXP

C4 PE4_MCH_TXN_C1 G4 GND K4 XE_P2_C_TXN

C5 GND G5 P2_LINK_LED_N K5 XE_P2_B_RXP

C6 PE4_MCH_TXN_C2 G6 GND K6 XE_P2_B_TXN

C7 GND G7 P3V3 K7 XE_P2_A_RXP

C8 PE4_MCH_TXN_C3 G8 GND K8 XE_P2_A_TXN

C9 GND G9 P3VAUX K9 P12V

C10 spare G10 GND K10 P12V

D1 PE5_MCH_RXP_C0 H1 Card_ID_1 L1 GND

D2 GND H2 Card_ID_2 L2 XE_P2_D_TXP

D3 PE5_MCH_RXP_C1 H3 P5V L3 GND

D4 GND H4 P1_LINK_LED_N L4 XE_P2_C_TXP

D5 PE5_MCH_RXP_C2 H5 P2_ACT_LED_N L5 GND

D6 GND H6 P3V3 L6 XE_P2_B_TXP

D7 PE5_MCH_RXP_C3 H7 P3V3 L7 GND

D8 GND H8 P3V3 L8 XE_P2_A_TXP

D9 spare H9 P3VAUX L9 GND

D10 GND H10 P12V L10 P12V

4.3.3 Midplane Signal Connector

The server board connects to the midplane through a 96-pin Airmax* connector (J3A1) (power is J1A1) to connect the various I/O, management, and control signals of the system.

Table 11. 96-pin Midplane Signal Connector Pin-out

Pin Signal Name Pin Signal Name Pin Signal Name

A1 XE_P1_A_RXP E1 XE_P2_D_RXN I1 GND

A2 GND E2 XE_P2_D_TXP I2 SAS_P1_TXN

A3 XE_P1_B_RXP E3 SMB_SDA_B I3 GND

A4 GND E4 FM_BL_X_SP I4 XE_P2_C_TXN

A5 XE_P1_C_RXP E5 XE_P2_B_RXN I5 GND

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A6 GND E6 XE_P2_B_TXP I6 SAS_P2_TXN

A7 XE_P1_D_RXP E7 XE_P2_A_RXN I7 GND

A8 GND E8 XE_P2_A_TXP I8 Fm_bl_slot_id5

B1 XE_P1_A_RXN F1 GND J1 SMB_SCL_A

B2 XE_P1_A_TXP F2 XE_P2_D_TXN J2 GND

B3 XE_P1_B_RXN F3 GND J3 FM_BL_SLOT_ID2

B4 XE_P1_B_TXP F4 12V (BL_PWR_ON) J4 GND

B5 XE_P1_C_RXN F5 GND J5 reserved

B6 XE_P1_C_TXP F6 XE_P2_B_TXN J6 GND

B7 XE_P1_D_RXN F7 GND J7 reserved

B8 XE_P1_D_TXP F8 XE_P2_A_TXN J8 GND

C1 GND G1 SAS_P1_RXP K1 SMB_SDA_A

C2 XE_P1_A_TXN G2 GND K2 FM_BL_SLOT_ID0

C3 GND G3 XE_P2_C_RXP K3 FM_BL_SLOT_ID3

C4 XE_P1_B_TXN G4 GND K4 FM_BL_SLOT_ID4

C5 GND G5 SAS_P2_RXP K5 reserved

C6 XE_P1_C_TXN G6 GND K6 reserved

C7 GND G7 spare K7 reserved

C8 XE_P1_D_TXN G8 GND K8 reserved

D1 XE_P2_D_RXP H1 SAS_P1_RXN L1 GND

D2 GND H2 SAS_P1_TXP L2 FM_BL_SLOT_ID1

D3 SMB_SCL_B H3 XE_P2_C_RXN L3 GND

D4 GND H4 XE_P2_C_TXP L4 FM_BL_PRES_N

D5 XE_P2_B_RXP H5 SAS_P2_RXN L5 GND

D6 GND H6 SAS_P2_TXP L6 reserved

D7 XE_P2_A_RXP H7 spare L7 GND

D8 GND H8 spare L8 reserved

4.3.4 Serial Port Connector

The server board provides one internal 9-pin Serial ‘A’ port header (J1B1). The following table defines the pin-out. See

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Table 6 for the pin-out of the serial header.

Table 12. Internal 9-pin Serial ‘A’ Header Pin-out (J1B1)

Pin Signal Name Description

1 SPA_DCD DCD (carrier detect)

2 SPA_DSR DSR (data set ready)

3 SPA_SI RXD (receive data) N_L

4 SPA_RTS RTS (request to send)

5 SPA_SOUT_N TXD (transmit data)

6 SPA_CT CTS (clear to send) S

7 SPA_DTR DTR (data terminal ready)

8 SPA_RI RI (ring Indicate)

9 GND Ground

4.3.5 USB 2.0 Connectors

The following table details the pin-out of the external USB connectors (J4K1, J4K2) found on the front edge of the server board.

Table 13. External USB Connector Pin-out

Pin Signal Name Description

1 USB_OC#_FB_1 USB_PWR

2 USB_P#N_FB_2 DATAL0 (Differential data line paired with DATAH0)

3 USB_P#P_FB_2 DATAH0 (Differential data line paired with DATAL0)

4 GND Ground

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5. Jumper Block Settings

The server board has several 3-pin jumper blocks that can be used to configure, protect, or recover specific features of the server board. Pin 1 on each jumper block is denoted by an “*” or “▼”.

5.1 Recovery Jumper Blocks

BIOS Bank Select

Default BOOT FROM

EMERGENCY BIOS IMAGE

J3A3

PASSWORD CLR

Default

CLEAR PASSWORD

J4A1

BMC Force Update

Default

Enabled

Disabled

J7A1

CMOS CLR

DefaultCLEAR

CMOS

J1F2

AF002220

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Figure 10. Recovery Jumper Blocks

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Table 14. Recovery Jumpers

Jumper Name Pins What happens at system reset …

1-2 BMC Firmware Force Update Mode – Enabled J7A1: BMC Force

Update

J4A1: Password Clear

J1F2: CMOS Clear

J3A3: BIOS Bank Select

2-3 BMC Firmware Force Update Mode – Disabled (Default) 1-2 These pins should have a jumper in place for normal system operation. (Default)

2-3 If these pins are jumpered, the administrator and user passwords are cleared

immediately. These pins should not be jumpered for normal operation. 1-2 These pins should have a jumper in place for normal system operation. (Default) 2-3 If these pins are jumpered, the CMOS settings are cleared immediately. These pins

should not be jumpered for normal operation

1-2 If these pins are jumpered, the BIOS is forced to boot from the lower bank. These pins

should not be jumpered for normal operation. 2-3 These pins should have a jumper in place for normal system operation. (Default)

5.1.1 CMOS Clear and Password Reset Usage Procedure

The CMOS Clear (J1F2) and Password Reset (J4A1) recovery features are designed such that the desired operation can be achieved with minimal system down time. The usage procedure for these two features has changed from previous generation Intel new usage model.

server boards. The following procedure outlines the

1. Power down compute module (do not remove AC power).

2. Remove compute module from modular server chassis.

3. Open compute module.

4. Move jumper from Default operating position (pins 1-2) to Reset/Clear position (pins 2-3).

5. Wait 5 seconds.

6. Move jumper back to default position (pins 1-2).

7. Close the compute module.

8. Reinstall compute module in modular server chassis.

9. Power up the compute module.

Password and/or CMOS is now cleared and can be reset by going into the BIOS setup.

Note: Removing AC power before performing the CMOS Clear operation will cause the system to

automatically power up and immediately power down after the reset procedure has been completed and AC power is re-applied. Should this occur, remove the AC power cord again, wait 30 seconds, and reinstall the AC power cord. Power up the system and proceed to the <F2> BIOS Setup utility to reset desired settings.

5.1.2 BMC Force Update Procedure

When performing a standard BMC firmware update procedure, the update utility places the BMC into an update mode, allowing the firmware to load safely onto the flash device. In the unlikely event that the BMC firmware update process fails due to the BMC not being in the proper update state, the server board provides a BMC Force Update jumper (J7A1) which will force the BMC into the proper update state. The following procedure should be followed in the event the standard BMC firmware update process fails.

1. Power down and remove AC power

2. Remove compute module from modular server chassis

3. Open compute module

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4. Move jumper from Default operating position (pins 2-3) to “Enabled” position (pins 1-2)

5. Close the compute module

6. Reconnect AC power and power up the compute module

7. Perform standard BMC firmware update procedure through the Intel® Modular Server Control software

8. Power down and remove AC power

9. Remove compute module from the server system

10. Move jumper from “Enabled” position (pins 1-2) to “Disabled” position (pins 2-3)

11. Close the server system

12. Reinstall the compute module into the modular server chassis

13. Reconnect AC power and power up the compute module

Note: Normal BMC functionality (for example, KVM, monitoring, and remote media) is disabled with the

force BMC update jumper set to the “Enabled” position. The server should never be run with the BMC force update jumper set in this position and should only be used when the standard firmware update process fails. This jumper should remain in the default – disabled position when the server is running normally.

5.1.3 System Status LED – BMC Initialization

When the AC power is first applied to the system and 5V-STBY is present, the Integrated BMC controller on the server board requires 15-20 seconds to initialize. During this time, the system status LED blinks, alternating between amber and green, and the power button functionality of the control panel is disabled, preventing the server from powering up. Once BMC initialization has completed, the status LED stops blinking and power button functionality is restored. The power button can then be used to turn on the server.

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6. Product Regulatory Requirements

6.1 Product Regulatory Requirements

The Intel® Compute Module MFS5000SI is evaluated as part of the Intel® Modular Server System MFSYS25/MFSYS35, which requires meeting all applicable system component regulatory requirements. Refer to the

Intel

Modular Server System MFSYS25/MFSYS35 Technical Product Specification for a complete listing of all

system and component regulatory requirements.

6.2 Product Regulatory Compliance and Safety Markings

No markings are required on the Intel® Compute Module MFS5000SI server board itself as it is evaluated as part of the Intel

Modular Server System MFSYS25/MFSYS35.

6.3 Product Environmental/Ecology Requirements

The Intel® Compute Module MFS5000SI is evaluated as part of the Intel® Modular Server System MFSYS25/MFSYS35, which requires meeting all applicable system component environmental and ecology requirements. For a complete listing of all system and component environment and ecology

requirements and markings, refer to the Intel Product Specification.

Modular Server System MFSYS25/MFSYS35 Technical

6.4 Product Environmental/Ecology Markings

The following Product Ecology markings are required on the Intel® Compute Module MFS5000SI server board:

Requirement

China Restriction of Hazardous Substance Environmental Friendly Use Period Mark

Country

China

Marking

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Appendix A: Integration and Usage Tips Intel® Compute Module MFS5000SI TPS

Appendix A: Integration and Usage Tips

 When two processors are installed, both must be of identical revision, core voltage, and bus/core

speed. Mixed processor steppings is supported. However, the stepping of one processor cannot be greater than one stepping back of the other.

 Processors must be installed in order. CPU 1 is located near the edge of the server board and

must be populated to operate the board.

 Only Fully Buffered DIMMs (FBD) are supported on this server board.  Mixing memory type, size, speed, rank and/or memory vendors is not validated and is not

supported on this server board.

 Non-ECC memory is not validated and is not supported in a server environment

 For a list of supported memory for this server board, see the Intel

Tested Memory List in the Intel

 For a list of Intel supported operating systems, add-in cards, and peripherals for this server

board, see the Intel

Compute Module MFS5000SI Tested Hardware and Operating System List.

Server Configurator Tool.

 Only Dual-Core processors 5100 sequence or Quad-Core Intel

sequence, with system bus speeds of 1066/1333 MHz are supported on this server board. Previous generation Intel

Xeon® processors are not supported.

 For best performance, the number of DIMMs installed should be balanced across both memory

branches. For example, a four-DIMM configuration will perform better than a two-DIMM configuration and should be installed in DIMM Slots A1, B1, C1, and D1. An eight-DIMM configuration will perform better than a six-DIMM configuration.

 Normal Integrated BMC functionality (for example, KVM, monitoring, and remote media) is

disabled with the force BMC update jumper set to the “enabled” position (pins 1-2). The server should never be run with the BMC force update jumper set in this position and should only be used when the standard firmware update process fails. This jumper should remain in the default (disabled) position (pins 2-3) when the compute module is running normally.

 When performing the BIOS update procedure, the BIOS select jumper must be set to its default

position (pins 2-3).

Compute Module MFS5000SI

Xeon® processors 5300 or 5400

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Intel® Compute Module MFS5000SI TPS Appendix B: Sensor Tables

Appendix B: BMC Sensor Tables

Table 15 lists the sensor identification numbers and information regarding the sensor type, name,

supported thresholds, and a brief description of the sensor purpose. See the Intelligent Platform Management Interface Specification, Version 2.0, for sensor and event / reading-type table information.

Sensor Type

The Sensor Type references the values enumerated in the Sensor Type Codes table in the IPMI Specification. It provides the context in which to interpret the sensor, for example, the physical entity or

characteristic that is represented by this sensor.

Event / Reading Type

The Event / Reading Type references values from the Event / Reading Type Code Ranges and Generic Event / Reading Type Codes tables in the IPMI Specification. Note that digital sensors are specific type of

discrete sensors, which have only two states.

Event Offset Triggers

This column defines what event offsets the sensor generates.

For Threshold (analog reading) type sensors, the BMC can generate events for the following thresholds:

 Upper Critical  Upper Non-critical  Lower Non-critical  Lower Critical

The abbreviation [U, L] is used to indicate that both Upper and Lower thresholds are supported. A few sensors support only a subset of the standard four threshold triggers. Note that even if a sensor does support all thresholds, the SDRs may not contain values for some thresholds. Consult Table 16 for information on the thresholds that are defined in the SDRs.

For Digital and Discrete type sensor event triggers, the supported event generating offsets are listed. The

offsets can be found in the Generic Event / Reading Type Codes or Sensor Type Codes tables in the IPMI Specification, depending on whether the sensor event / reading type is a generic or sensor-specific

response.

All sensors generate both assertions and deassertions of the defined event triggers. The assertions and deassertions may or may not generate events into the System Event Log (SEL), depending on the sensor SDR settings.

Fault LED

This column indicates whether an assertion of an event lights the front panel fault LED. The Integrated BMC aggregates all fault sources (including outside sources such as the BIOS) such that the LED will be lit as long as any source indicates that a fault state exists. The Integrated BMC extinguishes the fault LED when all sources indicate no faults are present.

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Appendix B: Sensor Tables Intel® Compute Module MFS5000SI TPS

Sensor Rearm

The rearm is a request for the event status for a sensor to be rechecked and updated upon a transition between good and bad states. Rearming the sensors can be done manually or automatically. The following abbreviations are used in the column:

 ‘A’: Auto rearm  ‘M’: Manual rearm

Readable

Some sensors are used simply to generate events into the System Event Log. The Watchdog timer sensor is one example. These sensors operate by asserting and then immediately de-asserting an event. Typically the SDRs for such sensors are defined such that only the assertion causes an event message to be deposited in the SEL. Reading such a sensor produces no useful information and is marked as ‘No’ in this column. Note that some sensors may

response to the IPMI Get Sensor Reading command. These sensors are represented by type 3 SDR

records.

Standby

Some sensors operate on standby power. These sensors may be accessed and / or generate events when the compute module payload power is off, but standby power is present.

actually be unreadable in that they return an error code in

Name #

Power Unit Status

Watchdog 03h

System ACPI Power State

01h

0Ch

Sensor

Type

Power Unit 09h

Watchdog 2 23h

System ACPI Power

Event /

Reading

Type

Sensor Specific 6Fh

Table 15. BMC Sensors

Event Offset Triggers

0: Power down None

1: Power cycle None

4: A/C lost (DC input lost) None

5: Soft power control failure (did not turn on or off)

6: Power unit failure (power good dropout)

0: Timer expired None

1: Hard reset None

2: Power down None

3: Power cycle None

8: Timer interrupt

0: S0 / G0

1: S1

Status

LED

Fault

None

Read? Rearm Standby

Yes A Yes

No A Yes

Yes A Yes

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Intel® Compute Module MFS5000SI TPS Appendix B: Sensor Tables

Name #

BB Vtt 10h Voltage

BB +1.5V AUX

BB +1.5V 12h Voltage

11h Voltage

Sensor

Type

State 22h

Event /

Reading

Type

Thresh. 01h

Event Offset Triggers

3: S3 None

4: S4 None

5: S5 / G2 None

7: G3 mechanical off None

B: Legacy ON state None

C: Legacy OFF state

[U,L] Non-critical

[U,L] Critical

[U,L] Non-critical

[U,L] Critical Fault

[U,L] Non-critical

[U,L] Critical

Status

LED

None

Fault

Read? Rearm Standby

Yes A No

Yes A

BB +1.8V 13h Voltage

BB +3.3V 14h Voltage

BB +3.3V STB

BB +1.5V ESB

BB +5V 17h Voltage

BB +12V AUX

BB 0.9V 19h Voltage

BB Vbat (SIO)

15h Voltage

16h Voltage

18h Voltage

1Ah Voltage

Thresh. 01h

Digital Discrete 05h

[U,L] Non-critical

[U,L] Critical

[U,L] Non-critical

[U,L] Critical

[U,L] Non-critical

[U,L] Critical

[U,L] Non-critical

[U,L] Critical

[U,L] Non-critical

[U,L] Critical

[U,L] Non-critical

[U,L] Critical

[U,L] Non-critical

[U,L] Critical

1: Limit exceeded Fault Yes A Yes

Fault

Yes A No

Fault

Yes A No

Fault

Yes A Yes

Fault

Yes A Yes

Fault

Yes A No

Fault

Yes A No

Fault

Yes A No

Fault

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Appendix B: Sensor Tables Intel® Compute Module MFS5000SI TPS

Name #

Hot Swap 20h

KVM Session

SOL Session

SMI Timeout

Memory Error

Critical Int. 42h

21h

22h

40h

41h

Sensor

Type

Hot Swap

2Ch

OEM

C0h

OEM

C0h

SMI Timeout F3h

Memory 0Ch

Critical Interrupt 13h

Event /

Reading

Type

Sensor Specific 6Fh

OEM

70h

OEM

73h

Digital Discrete 03h

Sensor Specific 6Fh

Event Offset Triggers

1: Inactive

2: Activation Required

3: Activation In Progress

4: Active

5: Deactivation Required

6: Deactivation in Progress

0: Pending

1: Established

2: Ended Normally

3: Ticket Expiration

4: Lost Heartbeat

5: Forcibly Terminated

6: Unknown Ticket

0: SOL Session Inactive

1: SOL Session Active

1: State asserted Fault No A No

1: Uncorrectable ECC Fault No A No

8: Bus uncorrectable Error Fault No A No

Status

LED

None

Read? Rearm Standby

Yes A Yes

DIMM 1-8 Temp

DIMM Max Temp

Processor 1,2 Status

Processor 1 Core 1,2,3,4 Thermal Margin (PECI)

Processor 2 Core 1,2,3,4 Thermal Margin (PECI)

Revision 1.4

50h57h

5Fh

90h, 91h

92h – 95h

96h – 99h

Temp

01h

Temp.

01h

Processor 07h

Temp. 01h

Thresh.

01h

Thresh.

01h

Sensor Specific 6Fh

Thresh. 01h

None None Yes A No

0: IERR

1: Thermal trip

7: Presence

Upper Non-critical

Upper Critical Fault

Upper Non-critical

Upper Critical Fault

Fault

None

Fault

Yes M Yes

Yes A No

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Intel® Compute Module MFS5000SI TPS Appendix B: Sensor Tables

Name #

Processor 1,2 Thermal Ctrl %

Processor 1,2 VRD Hot

Proc Max Thermal Margin

Processor 1,2 Vcc Out-ofRange

CPU Population Error

Mezzanine Card Present

Attention State

Drive Backplane Present

Drive 1,2 1

Slot ID C5h OEM

Process Progress

Note 1: SDRs for these sensors are loaded only into the compute module SKU that supports these drives. Reading

these sensors in a SKU that does not support drives will return unknown data.

9Ah, 9Bh

9Ch, 9Dh

9Fh

A0h, A1h

B0h

C0h

C1h

C2h

C3h, C4h

FEh

Sensor

Type

Temp. 01h

Temp

01h

Voltage

Processor 07h

Slot/Conne ctor 21h

OEM D0h

Drive Slot 0Dh

D1h

OEM D2h

Event /

Reading

Type

Thresh. 01h

Digital Discrete 05h

Thresh.

01h

Digital Discrete 05h

Digital Discrete 03h

Sensor Specific 6Fh

OEM D0h

Digital Discrete 08h

Sensor Specific 6Fh

Thresh. 01h

OEM D2h

Event Offset Triggers

Upper Critical Fault Yes A No

1: Limit exceeded Fault Yes M No

None None Yes A No

1: Limit exceeded Fault Yes A No

0: State De-asserted

1: State Asserted

2: Device installed None Yes A No

0: ID LED Lit None

1: Fault State Active

0: Device Absent None

1: Device Present None

0: Present None Yes A No

None None Yes A Yes

7: Process Started None

8: Process Finished OK None

9: Process Finished Fail

Status

LED

None

Fault

None

Read? Rearm Standby

Yes A Yes

Yes A No

Yes A Yes

Sensor SDR Information

This section describes the information that is entered into the SDRs.

The SDRs for all sensors will be set to generate events for both assertions and de-assertions of all supported sensor offsets as listed in Table 15.

Analog Sensor Thresholds

Table 16 shows the thresholds set into the SDR records for the BMC’s analog sensors.

These values are preliminary at the time of this writing.

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Appendix B: Sensor Tables Intel® Compute Module MFS5000SI TPS

Table 16. Analog Sensor Thresholds

Name # Sensor Type Lower Critical

BB Vtt 10h Voltage 1.90V

BB +1.5V AUX 11h Voltage 1.33V

BB +1.5V 12h Voltage 1.33V

BB +1.8V 13h Voltage 1.67V

BB +3.3V 14h Voltage 2.97V

BB +3.3V STB 15h Voltage 2.97V

BB +1.5V ESB 16h Voltage 1.33V

BB +5V 17h Voltage 4.5V

BB +12V AUX 18h Voltage 10.66V

BB 0.9V 19h Voltage 0.78V

DIMM 1-8 Temperature

Processor 1 Core 1,2,3,4 Thermal Margin (PECI)

Processor 2 Core 1,2,3,4 Thermal Margin (PECI)

Processor 1,2 Thermal Ctrl %

50h – 57h

92h – 93h

94h – 95h

9Ah, 9Bh

Temperature

N/A N/A 100ºC 105ºC

N/A N/A N/A N/A

N/A N/A N/A

Lower Non-

Critical

N/A N/A

Upper Non-

Critical

Upper Critical

1.5V

1.65V

1.94V

3.62V

1.65V

5.5V

13.26V

1.02V

50%

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Intel® Compute Module MFS5000SI TPS Appendix C: POST Error Messages and Handling

Appendix C: POST Error Messages and Handling

Whenever possible, the BIOS will output the current boot progress codes on the video screen. Progress codes are 32-bit quantities plus optional data. The 32-bit numbers include class, subclass, and operation information. The class and subclass fields point to the type of hardware that is being initialized. The operation field represents the specific initialization activity. Based on the data bit availability to display progress codes, a progress code can be customized to fit the data width. The higher the data bit, the higher the granularity of information that can be sent on the progress port. The progress codes may be reported by the system BIOS or option ROMs.

The Response section in the following table is divided into two types:

 Minor: The message is displayed on the screen or in the Error Manager screen. The system will

continue booting with a degraded state. The user may want to replace the erroneous unit. The setup POST error Pause setting does not have any effect with this error.

 Major: The message is displayed in the Error Manager screen, and an error is logged to the SEL.

The setup POST error Pause setting determines whether the system pauses to the Error Manager for this type of error, where the user can take immediate corrective action or choose to continue booting.

 Fatal: The message is displayed in the Error Manager screen, an error is logged to the SEL, and

the system cannot boot unless the error is resolved. The user needs to replace the faulty part and restart the system. The setup POST error Pause setting does not have any effect with this error.

Table 17. POST Error Messages and Handling

Error Code Error Message Response

004C Keyboard / interface error Major

0012 CMOS date / time not set Major

0048 Password check failed Fatal

0141 PCI resource conflict Major

0146 Insufficient memory to shadow PCI ROM Major

0192 L3 cache size mismatch Fatal

0194 CPUID, processor family are different Fatal

0195 Front side bus mismatch Major

0197 Processor speeds mismatched Major

5220 Configuration cleared by jumper Minor

5221 Passwords cleared by jumper Major

8110 Processor 01 internal error (IERR) on last boot Major

8111 Processor 02 internal error (IERR) on last boot Major

8120 Processor 01 thermal trip error on last boot Major

8121 Processor 02 thermal trip error on last boot Major

8130 Processor 01 disabled Major

8131 Processor 02 disabled Major

8160 Processor 01 unable to apply BIOS update Major

8161 Processor 02 unable to apply BIOS update Major

8190 Watchdog timer failed on last boot Major

8198 Operating system boot watchdog timer expired on last boot Major

8300 Baseboard management controller failed self-test Major

Revision 1.4

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Appendix C: POST Error Messages and Handling Intel® Compute Module MFS5000SI TPS

Error Code Error Message Response

8305 Hot swap controller failed Major

84F2 Baseboard management controller failed to respond Major

84F3 Baseboard management controller in update mode Major

84F4 Sensor data record empty Major

84FF System event log full Minor

8500

8510

8520 DIMM_A1 failed Self Test (BIST). Major

8521 DIMM_A2 failed Self Test (BIST). Major

8522 DIMM_A3 failed Self Test (BIST). Major

8523 DIMM_A4 failed Self Test (BIST). Major

8524 DIMM_B1 failed Self Test (BIST). Major

8525 DIMM_B2 failed Self Test (BIST). Major

8526 DIMM_B3 failed Self Test (BIST). Major

8527 DIMM_B4 failed Self Test (BIST). Major

8528 DIMM_C1 failed Self Test (BIST). Major

8529 DIMM_C2 failed Self Test (BIST). Major

852A DIMM_C3 failed Self Test (BIST). Major

852B DIMM_C4 failed Self Test (BIST). Major

852C DIMM_D1 failed Self Test (BIST). Major

852D DIMM_D2 failed Self Test (BIST). Major

852E DIMM_D3 failed Self Test (BIST). Major

852F DIMM_D4 failed Self Test (BIST). Major

8580 DIMM_A1 Correctable ECC error encountered. Minor/Major after 10 events

8581 DIMM_A2 Correctable ECC error encountered. Minor/Major after 10 events

8582 DIMM_A3 Correctable ECC error encountered. Minor/Major after 10 events

8583 DIMM_A4 Correctable ECC error encountered. Minor/Major after 10 events

8584 DIMM_B1 Correctable ECC error encountered. Minor/Major after 10 events

8585 DIMM_B2 Correctable ECC error encountered. Minor/Major after 10 events

8586 DIMM_B3 Correctable ECC error encountered. Minor/Major after 10 events

8587 DIMM_B4 Correctable ECC error encountered. Minor/Major after 10 events

8588 DIMM_C1 Correctable ECC error encountered. Minor/Major after 10 events

8589 DIMM_C2 Correctable ECC error encountered. Minor/Major after 10 events

858A DIMM_C3 Correctable ECC error encountered. Minor/Major after 10 events

858B DIMM_C4 Correctable ECC error encountered. Minor/Major after 10 events

858C DIMM_D1 Correctable ECC error encountered. Minor/Major after 10 events

858D DIMM_D2 Correctable ECC error encountered. Minor/Major after 10 events

858E DIMM_D3 Correctable ECC error encountered. Minor/Major after 10 events

858F DIMM_D4 Correctable ECC error encountered. Minor/Major after 10 events

8601

8602 WatchDog timer expired (secondary BIOS may be bad!). Minor

8603 Secondary BIOS checksum fail. Minor

Memory Component could not be configured in the selected RAS mode.

System supports a maximum of 16 GB of main memory. Additional memory will not be counted. (This error is S5000V specific.)

Override jumper is set to force boot from lower alternate BIOS bank of flash ROM.

Major

Minor

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Intel® Compute Module MFS5000SI TPS Appendix C: POST Error Messages and Handling

Error Code Error Message Response

92A3 Serial port component was not detected. Major

92A9 Serial port component encountered a resource conflict error. Major

0xA000 TPM device not detected. Minor

0xA001 TPM device missing or not responding. Minor

0xA002 TPM device failure Minor

0xA003 TPM device failed self test. Minor

POST Error Pause Option

In case of POST error(s) that are listed as “Major”, the BIOS enters the Error Manager and waits for the user to press an appropriate key before booting the operating system or entering the BIOS Setup.

The user can override this option by setting “POST Error Pause” to “disabled” in the BIOS Setup Main menu page. If the “POST Error Pause” option is set to “disabled”, the system boots the operating system without user-intervention. The default value is set to “disabled”.

POST Error Beep Codes

The following table lists the POST error beep codes. Prior to system video initialization, the BIOS uses these beep codes to inform users of error conditions. The beep code is followed by a user visible code on POST Progress LEDs.

Table 18. POST Error Beep Codes

Beeps Error Message POST Progress Code

(PPC)

3 Memory error No PPC System halted because a fatal error related to the memory

was detected.

6 BIOS recovery No PPC The system has detected a corrupted BIOS in the flash

part, and is recovering the last good BIOS.

Description

Revision 1.4

Intel order number: E15154-007

Appendix D: Supported Intel® Server Chassis Intel® Compute Module MFS5000SI TPS

Appendix D: Supported Intel® Modular Server System

The Intel® Compute Module MFS5000SI is supported in the following chassis:

 Intel

This section provides a high-level descriptive overview of each chassis. For more details, refer to the

Intel

Modular Server System MFSYS25/MFSYS35 Technical Product Specification (TPS).

Modular Server System MFSYS25

Modular Server System MFSYS35

A Shared hard drive storage bay

B I/O cooling fans

C Empty compute module bay

D Compute module cooling fans

E Compute module midplane connectors

Figure 11. Intel® Modular Server System MFSYS25

Revision 1.4

Intel order number: E15154-007

Intel® Compute Module MFS5000SI TPS Glossary

Glossary

This appendix contains important terms used in the preceding chapters. For ease of use, numeric entries are listed first (for example, “82460GX”) followed by alpha entries (for example, “AGP 4x”). Acronyms are followed by non-acronyms.

Term Definition

ACPI Advanced Configuration and Power Interface

AP Application Processor

APIC Advanced Programmable Interrupt Control

ASIC Application Specific Integrated Circuit

ASMI Advanced Server Management Interface

BIOS Basic Input/Output System

BIST Built-In Self Test

BMC Baseboard Management Controller

Bridge Circuitry connecting one computer bus to another, allowing an agent on one to access the other

BSP Bootstrap Processor

byte 8-bit quantity.

CBC Chassis Bridge Controller (A microcontroller connected to one or more other CBCs, together they

bridge the IPMB buses of multiple chassis.

CEK Common Enabling Kit

CHAP Challenge Handshake Authentication Protocol

CMOS In terms of this specification, this describes the PC-AT compatible region of battery-backed 128 bytes

of memory, which normally resides on the server board.

DPC Direct Platform Control

EEPROM Electrically Erasable Programmable Read-Only Memory

EHCI Enhanced Host Controller Interface

EMP Emergency Management Port

EPS External Product Specification

ESB2 Enterprise South Bridge 2

FBD Fully Buffered DIMM

FMB Flexible Mother Board

FRB Fault Resilient Booting

FRU Field Replaceable Unit

FSB Front-Side Bus

GB 1024MB

GPIO General Purpose I/O

GTL Gunning Transceiver Logic

HSC Hot-Swap Controller

Hz Hertz (1 cycle/second)

I2C Inter-Integrated Circuit Bus

IA Intel® Architecture

IBF Input Buffer

ICH I/O Controller Hub

ICMB Intelligent Chassis Management Bus

IERR Internal Error

Revision 1.4

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Glossary Intel® Compute Module MFS5000SI TPS

Term Definition

IFB I/O and Firmware Bridge

INTR Interrupt

IP Internet Protocol

IPMB Intelligent Platform Management Bus

IPMI Intelligent Platform Management Interface

IR Infrared

ITP In-Target Probe

KB 1024 bytes

KCS Keyboard Controller Style

LAN Local Area Network

LCD Liquid Crystal Display

LED Light Emitting Diode

LPC Low Pin Count

LUN Logical Unit Number

MAC Media Access Control

MB 1024KB

MCH Memory Controller Hub

MD2 Message Digest 2 – Hashing Algorithm

MD5 Message Digest 5 – Hashing Algorithm – Higher Security

ms milliseconds

MTTR Memory Type Range Register

Mux Multiplexor

NIC Network Interface Controller

NMI Nonmaskable Interrupt

OBF Output Buffer

OEM Original Equipment Manufacturer

Ohm Unit of electrical resistance

PEF Platform Event Filtering

PEP Platform Event Paging

PIA Platform Information Area (This feature configures the firmware for the platform hardware)

PLD Programmable Logic Device

PMI Platform Management Interrupt

POST Power-On Self Test

PSMI Power Supply Management Interface

PWM Pulse-Width Modulation

RAM Random Access Memory

RASUM Reliability, Availability, Serviceability, Usability, and Manageability

RISC Reduced Instruction Set Computing

ROM Read Only Memory

RTC Real-Time Clock (Component of ICH peripheral chip on the server board)

SDR Sensor Data Record

SECC Single Edge Connector Cartridge

SEEPROM Serial Electrically Erasable Programmable Read-Only Memory

SEL System Event Log

Revision 1.4

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Intel® Compute Module MFS5000SI TPS Glossary

Term Definition

SIO Server Input/Output

SMBus System Management Bus

SMI Server Management Interrupt (SMI is the highest priority non-maskable interrupt)

SMM Server Management Mode

SMS Server Management Software

SNMP Simple Network Management Protocol

TBD To Be Determined

TIM Thermal Interface Material

UART Universal Asynchronous Receiver/Transmitter

UDP User Datagram Protocol

UHCI Universal Host Controller Interface

UTC Universal time coordinate

VID Voltage Identification

VRD Voltage Regulator Down

Word 16-bit quantity

ZIF Zero Insertion Force

Revision 1.4

Intel order number: E15154-007

Reference Documents Intel® Compute Module MFS5000SI TPS

Reference Documents

See the following documents for additional information:

 Intel  Intel  Intel  Intel

5000 Series Chipsets Server Board Family Datasheet

5000P Memory Controller Hub External Design Specification

Enterprise South Bridge 2 (ESB2) External Design Specification

Modular Server System MFSYS25/MFSYS35 Technical Product Specification

Revision 1.4

Intel order number: E15154-007

Intel MFSYS25V2, MFSYS35, Compute Module MFS5000SI Specification

Specifications and Main Features

Frequently Asked Questions

User Manual