Intel mPGA604 User Manual

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mPGA604 Socket

Mechanical Design Guide

March 2005

Document Number: 254239-002

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INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The mPGA604 socket may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents, which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548- 4725, or by visiting Intel's Web Site.

Intel is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other countries.

Copyright © 2003-2005, Intel Corporation. All rights reserved.

* Other brands and names may be claimed as the property of others.

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Contents

1

Introduction .......................................................................................................................

7

 

1.1

Objective ................................................................................................................

7

 

1.2

Purpose..................................................................................................................

7

 

1.3

Scope .....................................................................................................................

7

2

Assembled Component and Package Description........................................................

9

3

Mechanical Requirements..............................................................................................

11

 

3.1

Attachment...........................................................................................................

11

 

3.2

Materials...............................................................................................................

11

 

 

3.2.1

Socket Housing.......................................................................................

11

 

 

3.2.2

Color........................................................................................................

11

 

3.3

Cutouts for Package Removal .............................................................................

11

 

3.4

Socket Standoffs Height ......................................................................................

11

 

3.5

Markings...............................................................................................................

12

 

 

3.5.1

Name.......................................................................................................

12

 

 

3.5.2 Lock (Closed) and Unlock (Open) Markings...........................................

12

 

 

3.5.3

Lot Traceability........................................................................................

12

 

3.6

Socket Size ..........................................................................................................

12

 

3.7

Socket/Package Translation During Actuation ....................................................

13

 

3.8

Orientation in Packaging, Shipping and Handling ...............................................

13

 

3.9

Contact Characteristics........................................................................................

13

 

 

3.9.1

Number of contacts.................................................................................

13

 

 

3.9.2

Base Material ..........................................................................................

13

 

 

3.9.3

Contact Area Plating ...............................................................................

13

 

 

3.9.4 Solder Ball Attachment Area Plating.......................................................

13

 

 

3.9.5

Solder Ball Characteristics......................................................................

13

 

 

3.9.6

Lubricants................................................................................................

13

 

3.10

Material and Recycling Requirements .................................................................

13

 

3.11

Lever Actuation Requirements.............................................................................

14

 

3.12

Socket Engagement/Disengagement Force ........................................................

14

 

3.13

Visual Aids ...........................................................................................................

14

 

3.14

Socket BGA Co-Planarity.....................................................................................

14

 

3.15

Solder Ball True Position .....................................................................................

14

 

3.16

Critical-to-Function Dimensions...........................................................................

14

4

Electrical Requirements .................................................................................................

17

 

4.1

Electrical Resistance............................................................................................

18

 

4.2

Determination of Maximum Electrical Resistance ...............................................

22

 

4.3

Inductance............................................................................................................

23

 

 

4.3.1 Design Procedure for Inductance Measurements ..................................

24

 

 

4.3.2 Correlation of Measurement and Model Data Inductance ......................

25

 

4.4

Pin-to-Pin Capacitance ........................................................................................

25

 

4.5

Dielectric Withstand Voltage ................................................................................

25

 

4.6

Insulation Resistance...........................................................................................

25

 

4.7

Contact Current Rating ........................................................................................

25

5

Environmental Requirements ........................................................................................

27

 

5.1

Mixed Flowing Gas ..............................................................................................

28

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5.2

Solvent Resistance ..............................................................................................

28

 

5.3

Durability ..............................................................................................................

28

6

Validation Testing Requirements ..................................................................................

29

 

6.1

Applicable Documents .........................................................................................

29

 

6.2

Testing Facility .....................................................................................................

29

 

6.3

Funding ................................................................................................................

29

 

6.4

Socket Design Verification ...................................................................................

29

 

6.5

Reporting..............................................................................................................

29

 

6.6

Process Changes.................................................................................................

29

 

6.7

Quality Assurance Requirements ........................................................................

30

 

6.8

Socket Test Plan..................................................................................................

30

 

 

6.8.1 Submission of an mPGA604 Socket for Validation Testing....................

30

 

6.9

Mechanical Samples............................................................................................

30

 

6.10

Socket Validation Notification ..............................................................................

30

 

6.11

Production Lot Definition......................................................................................

30

 

6.12

Socket Validation .................................................................................................

30

7

Safety Requirements ......................................................................................................

31

8

Documentation Requirements.......................................................................................

33

9

Mechanical Drawings .....................................................................................................

35

Figures

 

 

 

 

 

 

 

 

 

 

 

4-1

Methodology for Measuring Total Electrical Resistance......................................

18

 

4-2

Methodology for Measuring Electrical Resistance of the Jumper........................

18

 

4-3

Electrical Resistance Fixtures Superimposed .....................................................

19

 

4-4

Inductance Measurement Fixture Cross-Section.................................................

23

 

4-5

Inductance and Capacitance Fixture ...................................................................

23

 

5-1

Flow Chart of Knowledge-Based Reliability Evaluation Methodology .................

27

 

9-1

mPGA604 Socket Drawing (Sheet 1 of 4) ...........................................................

35

 

9-2

mPGA604 Socket Drawing (Sheet 2 of 4) ...........................................................

36

 

9-3

mPGA604 Socket Drawing (Sheet 3 of 4) ...........................................................

37

 

9-4

mPGA604 Socket Drawing (Sheet 4 of 4) ...........................................................

38

 

9-5

603-Pin Interposer Assembly Drawing (Sheet 1 of 6)..........................................

39

 

9-6

603-Pin Interposer Assembly Drawing (Sheet 2 of 6)..........................................

40

 

9-7

603-Pin Interposer Assembly Drawing (Sheet 3 of 6)..........................................

41

 

9-8

603-Pin Interposer Assembly Drawing OLGA Keepout (Sheet 4 of 6)................

42

 

9-9

603-Pin Interposer Assembly Drawing FCBGA2 Keepout (Sheet 5 of 6)............

43

 

9-10

603-Pin Interposer Assembly Drawing (Sheet 6 of 6)..........................................

44

Tables

 

 

 

 

 

 

 

 

 

 

 

3-1

Package Critical-To-Function (CTF) Dimensions ................................................

15

 

4-1

Electrical Requirements for Sockets....................................................................

17

 

4-2

Definitions (Sheet 1 of 2) .....................................................................................

17

 

4-3

Resistance Test Fixture Netlist (Sheet 1 of 2) .....................................................

21

 

4-4

Net list for FSETV4 Rev 1 Edge Fingers .............................................................

26

 

5-1

Use Conditions Environment ...............................................................................

27

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Revision History

Revision

 

Description

Date

Number

 

 

 

 

 

 

 

 

001

Initial release of the document.

October 2003

 

 

 

 

002

Updated for 2005 Intel® Xeon™ products.

March 2005

Note: Not all revisions may be published.

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Re-Validation Notice to Socket Vendors

Any significant change to the socket will require submission of a detailed explanation of the change at least 60 days prior to the planned implementation. Intel will review the modification and establish the necessary re-validation procedure that the socket must pass. Any testing that is required MUST be completed before the change is implemented.

Typical examples of significant changes include, but are not limited to, the following: plastic material changes including base material or color; contact changes including base material, plating material or thickness; and design modifications.

For details on validation testing requirements, see Section 6.

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1 Introduction

1.1Objective

This document defines a surface mount, Zero Insertion Force (ZIF) socket intended for workstation and server platforms based on Intel microprocessors. The socket provides I/O, power and ground contacts. The socket contains 604 contacts arrayed about a cavity in the center of the socket with solder balls/surface mount features for surface mounting with the motherboard. The mPGA604 Socket contacts have 1.27mm pitch with regular pin array, to mate with a 604-pin processor package. A 604-pin package will be mated with a 603 solder ball socket. The dummy pin is a key that allows either the 603-pin processor package or the 604-pin processor package to be used in the same socket.

1.2Purpose

To define functional, quality, reliability, and material (that is, visual, dimensional and physical) requirements and design guidelines of the mPGA604 Socket in order to provide low cost, low risk, robust, high volume manufacturable (HVM) socket solution available from multiple sources.

1.3Scope

This design guideline applies to all 604-pin ZIF sockets purchased to the requirements of this design guideline.

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2Assembled Component and Package Description

The mPGA604 socket dimensions and characteristics must be compatible with that of the processor package and related assembly components. Processors using flip-chip pin grid array (FCmPGA4) package technology are targeted to be used with the mPGA604 socket.

The assembled component may consist of a cooling solution (heatsink, fan, and retention mechanism), and processor package. The processor Thermal/Mechanical Design Guidelines document provides information for designing components compliant with the Intel reference design.

Relevant processor FC-mPGA4 package and pin-out information is given in the processor Electrical, Mechanical and Thermal Specifications document.

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3 Mechanical Requirements

3.1Attachment

A retention system needs to isolate any load in excess of 222.41 N, compressive, from the socket during the shock and vibration conditions outlined in Section 5. The socket must pass the mechanical shock and vibration requirements listed in Section 5 with the associated heatsink and retention mechanism attached. Socket can only be attached by the 603 contacts to the motherboard. No external (i.e. screw, extra solder, adhesive....) methods to attach the socket are acceptable.

3.2Materials

3.2.1Socket Housing

Thermoplastic or equivalent, UL 94V-0 flame rating, temperature rating and design capable of withstanding a temperature of 240°C for 40sec (minimum) typical of a reflow profile for solder material used on the socket. The material must have a thermal coefficient of expansion in the XY plane capable of passing reliability tests rated for an expected high operating temperature, mounted on FR4type motherboard material.

3.2.2Color

The color of the socket can be optimized to provide the contrast needed for OEM’s pick and place vision systems. The base and cover of the socket may be different colors as long as they meet the above requirement.

3.3Cutouts for Package Removal

Recessed cutouts are required in the side of the socket to provide better access to the package substrate, and facilitate the manual removal of inserted package (see Section 9).

3.4Socket Standoffs Height

Socket stand off height, cover lead in and cover lead in depth must not interfere with package pin shoulder at worst-case conditions. The processor (not the pin shoulder) must sit flush on the socket standoffs and the pin field cannot contact the standoffs (see Section 9).

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3.5Markings

All markings required in this section must be able to withstand a temperature of 240 ºC for 40 seconds (minimum) typical of a reflow profile for solder material used on the socket, as well as any environmental test procedure outlined in Section 5.

3.5.1Name

mPGA604 (Font type is Helvetica Bold – minimum 6 point).

This mark shall be molded or Laser Marked into the processor side of the socket housing.

Manufacturer’s insignia (font size at supplier’s discretion).

This mark will be molded or laser marked into the socket housing. Both marks must be visible when first seated in the motherboard. Any request for variation from this marking requires a written description (detailing size and location) to be provided to Intel for approval.

3.5.2Lock (Closed) and Unlock (Open) Markings

The universal symbols for ‘Lock’ and ‘Unlock’ are to be marked on the socket in the appropriate positions. Clear indicator marks must be located on the actuation mechanism that identifies the lock (closed) and unlock (open) positions of the cover as well as the actuation direction. These marks should still be visible after a package is inserted into the socket.

3.5.3Lot Traceability

Each socket will be marked with a lot identification code that will allow traceability of all components, date of manufacture (year and week), and assembly location. The mark must be placed on a surface that is visible when mounted on a printed circuit board. In addition, this identification code must be marked on the exterior of the box in which the units ship.

3.6Socket Size

The socket size must meet the dimensions as shown in Section 9, allowing full insertion of the pins in the socket, without interference between the socket and the pin field. The mPGA604 Socket and actuation area must fit within the keep-in zone defined in Section 9.

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Mechanical Requirements

3.7Socket/Package Translation During Actuation

The socket shall be built so that the post-actuated package pin field displacement will not exceed 1.27 mm. Movement will be along the Y direction. No Z-axis travel (lift out) of the package is allowed during actuation.

3.8Orientation in Packaging, Shipping and Handling

Packaging media needs to support high volume manufacturing.

3.9Contact Characteristics

3.9.1Number of contacts

Total number of contacts: 603.

Total number of contact holes: 604.

3.9.2Base Material

High strength copper alloy.

3.9.3Contact Area Plating

0.762 µm (min) gold plating over 1.27 µm (min) nickel underplate in critical contact areas (area on socket contacts where processor pins will mate) is required. No contamination by solder in the contact area is allowed during solder reflow.

3.9.4Solder Ball Attachment Area Plating

3.81 µm (min) Tin/Lead (typically 85+-5Sn/Pb balance).

3.9.5Solder Ball Characteristics

Tin/Lead (63/37 + 0.5% Sn).

3.9.6Lubricants

For the final assembled product, no lubricant is permitted on the socket contacts. If lubricants are used elsewhere within the socket assembly, these lubricants must not be able to migrate to the socket contacts.

3.10Material and Recycling Requirements

Cadmium shall not be used in the painting or plating of the socket.

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CFCs and HFCs shall not be used in manufacturing the socket. It is recommended that any plastic component exceeding 25g must be recyclable as per the European Blue Angel recycling design guidelines.

3.11Lever Actuation Requirements

Lever closed direction—right.

Actuation direction called out in Section 9.

135º lever travel max.

Pivot point in the center of the actuation area on the top of the socket. Section 9.

3.12Socket Engagement/Disengagement Force

The force on the actuation lever arm must not exceed 44N to engage or disengage the package into the mPGA604 socket. Movement of the cover is limited to the plane parallel to the motherboard. The processor package must not be utilized in the actuation of the socket. Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table R2-7 (Maximum Grip Forces).

3.13Visual Aids

The socket top will have markings identifying Pin 1. This marking will be represented by a clearly visible triangular symbol (see Section 9).

3.14Socket BGA Co-Planarity

The co-planarity (profile) requirement for all solder balls on the underside of the socket is located in Section 9.

3.15Solder Ball True Position

The solder ball pattern has a true position requirement with respect to Datum A, B, and C (see Section 9).

3.16Critical-to-Function Dimensions

The mPGA604 socket shall accept a 604-pin processor pin field. All dimensions are metric. Asymmetric features are designed to properly align the socket to the motherboard and prevent the socket from being assembled incorrectly to the motherboard.

Critical-to-function (CTF) dimensions are identified in Table 3-1. The CTF values are detailed on the mPGA604 socket drawing in Section 9 and take precedence over all values presented in this document. Dimensional requirements identified in the drawing and in Table 3-1 must be met. These dimensions will be verified as part of the validation process. Also, supplier will provide and

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