Intel BOXD2700DC, Desktop Board D2700DC Specification
Intel® Desktop Board
D2700DC
Technical Product Specification
December 2011
Part Number: G34959-001
The Intel® Desktop Board D2700DC may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board D2700DC Specification Update.
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board D2700DC Technical Product
Specification.
This product specification applies to only the standard Intel® Desktop Board D2700DC with BIOS
identifier MUCDT10N.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
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IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT
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WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN
WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR
DEATH MAY OCCUR.
December 2011
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
intellectual property rights that relate to the presented subject matter. The furnishing of documents and
other materials and information does not provide any license, express or implied, by estoppel or otherwise,
to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
®
Desktop Boards may contain design defects or errors known as errata, which may cause the product
Intel
to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Intel, the Intel logo, and Intel Atom are trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2011, Intel Corporation. All rights reserved.
ii
Board Identification Information
Basic Desktop Board D2700DC Identification Information
AA Revision BIOS Revision Notes
G32420-503 MUCDT10N.86A.0047 1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
®
2. The Intel
Device Stepping S-Spec Numbers
CG82NM10 B0 SLGXX
NM10 Express Chipset used on this AA revision consists of the following component:
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.
iii
Intel Desktop Board D2700DC Technical Product Specification
iv
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel
Desktop Board D2700DC. It describes the standard product and available
manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board D2700DC and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the board
2 A map of the resources of the board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
®
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
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Intel Desktop Board D2700DC Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kb Kilobit (1024 bits)
kb/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mb Megabit (1,048,576 bits)
Mb/s Megabits per second
TDP Thermal Design Power
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
vi
Contents
1 Product Description
1.1 Overview ........................................................................................ 11
1.1.1 Feature Summary ................................................................ 11
1.1.2 Board Layout ....................................................................... 13
1.1.3 Block Diagram ..................................................................... 15
1.2 Online Support ................................................................................ 16
1.3 Processor ....................................................................................... 16
1.3.1 Intel® D2700 Graphics Subsystem .......................................... 17
1.4 System Memory .............................................................................. 18
1.5 Intel® NM10 Express Chipset ............................................................. 20
1.5.2 USB ................................................................................... 21
1.5.3 SATA Support ...................................................................... 21
1.6 Real-Time Clock Subsystem .............................................................. 22
1.7 Legacy I/O Controller ....................................................................... 22
1.8 LAN Subsystem ............................................................................... 23
1.8.1 LAN Subsystem Drivers ......................................................... 23
1.8.2 RJ-45 LAN Connector with Integrated LEDs .............................. 24
1.9 Audio Subsystem ............................................................................. 25
1.9.1 Audio Subsystem Software .................................................... 26
1.9.2 Audio Connectors and Headers ............................................... 26
1.10 Hardware Management Subsystem .................................................... 27
1.10.1 Hardware Monitoring............................................................. 27
1.10.2 Thermal Monitoring .............................................................. 28
1.11 Power Management ......................................................................... 29
1.11.1 ACPI ................................................................................... 29
1.11.2 Hardware Support ................................................................ 32
2 Technical Reference
2.1 Memory Map ................................................................................... 35
2.1.1 Addressable Memory ............................................................. 35
2.2 Connectors and Headers ................................................................... 38
2.2.1 Back Panel .......................................................................... 39
2.2.2 Component-side Connectors and Headers ................................ 41
2.3 BIOS Configuration Jumper Block ....................................................... 50
2.4 Mechanical Considerations ................................................................ 52
2.4.1 Form Factor ......................................................................... 52
2.5 Electrical Considerations ................................................................... 53
2.5.1 Fan Header Current Capability ................................................ 53
2.5.2 Add-in Board Considerations .................................................. 53
2.6 Thermal Considerations .................................................................... 53
2.6.1 Passive Heatsink Design in a Passive System Environment ......... 55
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Intel Desktop Board D2700DC Technical Product Specification
2.7 Power Consumption ......................................................................... 58
2.7.1 Minimum Load Configuration .................................................. 58
2.7.2 Maximum Load Configuration ................................................. 58
2.8 Reliability ....................................................................................... 59
2.9 Environmental ................................................................................ 59
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 61
3.2 BIOS Flash Memory Organization ....................................................... 62
3.3 Resource Configuration .................................................................... 62
3.3.1 PCI* Autoconfiguration .......................................................... 62
3.4 System Management BIOS (SMBIOS) ................................................. 63
3.5 Legacy USB Support ........................................................................ 64
3.6 BIOS Updates ................................................................................. 65
3.6.1 BIOS Recovery ..................................................................... 65
3.6.2 Custom Splash Screen .......................................................... 66
3.7 Boot Options ................................................................................... 66
3.7.1 Optical Drive Boot ................................................................ 66
3.7.2 Network Boot ....................................................................... 66
3.7.3 Booting Without Attached Devices........................................... 67
3.7.4 Changing the Default Boot Device During POST ........................ 67
3.8 BIOS Security Features .................................................................... 68
4 Board Status and Error Messages
4.1 BIOS Beep Codes ............................................................................ 69
4.2 Front-panel Power LED Blink Codes .................................................... 70
4.3 BIOS Error Messages ....................................................................... 70
4.4 Port 80h POST Codes ....................................................................... 71
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance ..................................................................... 77
5.1.1 Safety Standards .................................................................. 77
5.1.2 European Union Declaration of Conformity Statement ................ 78
5.1.3 Product Ecology Statements ................................................... 79
5.1.4 EMC Regulations .................................................................. 81
5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 84
5.1.6 Regulatory Compliance Marks (Board Level) ............................. 85
5.2 Battery Disposal Information ............................................................. 86
viii
Contents
Figures
1. Major Board Components.................................................................. 13
2. Block Diagram ................................................................................ 15
3. Memory Channel and SO-DIMM Configuration ...................................... 19
4. LAN Connector LED Locations ............................................................ 24
5. Back Panel Audio Connectors ............................................................ 26
6. Thermal Sensors and Fan Header ....................................................... 28
7. Location of the Standby Power Indicator LED ....................................... 34
8. Detailed System Memory Address Map ............................................... 36
9. Back Panel Connectors ..................................................................... 39
10. I/O Shield Reference Diagram ........................................................... 40
11. Component-side Connectors and Headers ........................................... 41
12. Connection Diagram for Front Panel Header ........................................ 47
13. Connection Diagram for Front Panel USB Header .................................. 49
14. Connection Diagram for Front Panel USB Header with Intel Z-USB
Solid-State Drive or Compatible Device Support ................................... 49
15. Location of the BIOS Configuration Jumper Block ................................. 50
16. Board Dimensions ........................................................................... 52
17. Localized High Temperature Zones ..................................................... 54
18. Fan Location Guide for Chassis Selection (Chassis Orientation is Not
Restricted) ..................................................................................... 57
Tables
1. Feature Summary ............................................................................ 11
2. Board Components Shown in Figure 1 ................................................ 14
3. Supported Memory Configurations1 .................................................... 19
4. LAN Connector LED States ................................................................ 24
5. Audio Jack Support .......................................................................... 25
6. Effects of Pressing the Power Switch .................................................. 29
7. Power States and Targeted System Power ........................................... 30
8. Wake-up Devices and Events ............................................................ 31
9. System Memory Map ....................................................................... 37
10. Component-side Connectors and Headers Shown in Figure 11 ................ 42
11. System Fan Header ......................................................................... 43
12. SATA Connectors ............................................................................. 43
13. Front Panel Wireless Activity LED Header ............................................ 43
14. Front Panel Audio Header for Intel HD Audio ........................................ 43
15. Front Panel Audio Header for AC ’97 Audio .......................................... 43
16. Front Panel USB Header ................................................................... 44
17. Front Panel USB Header with Intel Z-U130 USB Solid-State Drive or
Compatible Device Support ............................................................... 44
18. Power Connector ............................................................................. 46
19. Front Panel Header .......................................................................... 47
20. States for a One-Color Power LED ...................................................... 48
21. BIOS Configuration Jumper Settings ................................................... 51
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Intel Desktop Board D2700DC Technical Product Specification
22. Fan Header Current Capability ........................................................... 53
23. Thermal Considerations for Components ............................................. 55
24. Minimum Load Configuration Current and Power Results ....................... 58
25. Maximum Load Configuration Current and Power Results ....................... 59
26. Intel Desktop Board D2700DC Environmental Specifications .................. 59
27. BIOS Setup Program Menu Bar .......................................................... 62
28. BIOS Setup Program Function Keys .................................................... 62
29. Acceptable Drives/Media Types for BIOS Recovery ............................... 65
30. Boot Device Menu Options ................................................................ 67
31. Supervisor and User Password Functions ............................................. 68
32. BIOS Beep Codes ............................................................................ 69
33. Front-panel Power LED Blink Codes .................................................... 70
34. BIOS Error Messages ....................................................................... 70
35. Port 80h POST Code Ranges.............................................................. 71
36. Port 80h POST Codes ....................................................................... 72
37. Typical Port 80h POST Sequence ........................................................ 75
38. Safety Standards ............................................................................. 77
39. EMC Regulations ............................................................................. 81
40. ENERGY STAR Requirements ............................................................. 84
41. Regulatory Compliance Marks ............................................................ 85
x
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of Intel Desktop Board D2700DC.
Table 1. Feature Summary
Form Factor Mini-ITX, (6.7 inches by 6.7 inches [170 millimeters by 170 millimeters])
compatible with microATX
Processor Passively-cooled, soldered-down Dual-Core Intel® Atom™ processor with
integrated graphics and integrated memory controller
Memory
Chipset Passively cooled, Intel® NM10 Express Chipset
Audio Multi-streaming 5.1 (6-channel) audio subsystem support based on the Realtek*
Graphics Onboard Intel® graphics subsystem with support for:
Legacy I/O Control Winbond W83627DHG-P based Legacy I/O controller for hardware management
Peripheral
Interfaces
LAN Support 10/100/1000 Mb/s Ethernet LAN subsystem using an Intel® 82574L Gigabit
• Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Module (SO-
DIMM) sockets
• Support for DDR3 1066 MHz, DDR3 1333 MHz, and DDR3 1600 MHz SO-DIMMs
Note: DDR3 1333 MHz and DDR3 1600 MHz memory will run at 1066 MHz
• Support for up to 4 GB of system memory on a single SO-DIMM
ALC662 high definition audio codec
― High Definition Multimedia Interface* (HDMI*)
― DVI-D
• External graphics support provided through the Conventional PCI bus
connector
• Seven USB 2.0 ports:
― Four back panel ports
― Two ports are implemented with a dual port internal header for front panel
cabling
― One port is implemented with an internal header (brown-colored) that
supports an Intel
• Two Serial ATA (SATA) 3.0 Gb/s connectors (supporting IDE and AHCI mode)
Ethernet Controller
®
Z-U130 USB Solid-State Drive or compatible device
continued
11
Intel Desktop Board D2700DC Technical Product Specification
Table 1. Feature Summary (continued)
®
BIOS
Instantly Available
PC Technology
Expansion
Capabilities
Hardware Monitor
Subsystem
• Intel
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
• Suspend to RAM support
• Wake on PCI, PCI Express*, front panel, USB ports, and LAN
• One Conventional PCI bus connector (with riser card support for up to two PCI
• One PCI Express Full-/Half-Mini Card slot
• Hardware monitoring through the Windbond I/O controller
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• One fan header
• One fan sense input used to monitor fan activity
• Fan speed control
BIOS (resident in the SPI Flash device)
and SMBIOS
cards)
12
1.1.2 Board Layout
Figure 1 shows the location of the major components.
Product Description
Table 2 lists the components identified in Figure 1.
Figure 1. Major Board Components
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Intel Desktop Board D2700DC Technical Product Specification
Table 2. Board Components Shown in Figure 1
Item/callout
from Figure 1
A Back panel connectors
B Standby power LED
C Processor core power connector (2 x 12)
D Intel Atom processor
E SO-DIMM channel A socket, DIMM 1
F SO-DIMM channel A socket, DIMM 0
G Intel NM10 Express Chipset
H SATA connectors
I System fan header
J Front panel header
K BIOS setup configuration jumper block
L Battery
M Front panel USB 2.0 header
N Front Panel Wireless Activity LED header
O Piezo/monotonic speaker header
P PCI Express Full-/Half-Mini Card slot
Q Conventional PCI bus add-in card connector
R Front panel audio header
S Front panel USB header (supports Intel Z-U130 USB Solid-State
Descript
Drive or compatible device (brown-colored)
ion
14
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas.
Product Description
Figure 2. Block Diagram
15
Intel Desktop Board D2700DC Technical Product Specification
1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board D2700DC http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for the Intel
Desktop Board D2700DC
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
Integration information http://www.intel.com/support/go/buildit
http://ark.intel.com
025414.htm
1.3 Processor
The board has a passively-cooled, soldered-down Dual-Core Intel Atom processor with
integrated graphics and integrated memory controller.
NOTE
The board is designed to be passively cooled in a properly ventilated chassis. Chassis
venting locations are recommended above the processor heatsink area for maximum
heat dissipation effectiveness.
For information about Refer to
Power supply connectors Section 2.2.2.3, page 46
16
1.3.1 Intel® D2700 Graphics Subsystem
Product Description
1.3.1.1 Intel® Graphics Media Accelerator 3650 Graphics
®
Controller (Intel
The Intel® GMA 3650 graphics controller features the following:
• 640 MHz core frequency
• High quality texture engine
⎯ DX9.3* and OpenGL* 3.0 compliant
⎯ Hardware Pixel Shader 4.1
⎯ Vertex Shader Model 4.1
• Video
⎯ Blu-Ray 2.0
⎯ H.264 & VC1 hardware decoder
⎯ PAVP 1.1c
⎯ HDCP 1.3
• Display
⎯ Supports HDMI and DVI displays up to 1920 x 1200 at 60 Hz refresh (WUXGA)
⎯ Dual independent display support
For information about Refer to
Obtaining graphics software and utilities Section 1.2, page 16
GMA)
1.3.1.2 High Definition Multimedia Interface* (HDMI*)
The HDMI port supports standard, enhanced, or high definition video, plus multichannel digital audio on a single cable. . The maximum supported resolution is 1920 x
1200 (WUXGA). The HDMI port is compliant with the HDMI 1.3a specification
The HDMI port is enabled for POST whenever a monitor is attached
17
Intel Desktop Board D2700DC Technical Product Specification
1.4 System Memory
The board has two 204-pin DDR3 SO-DIMM sockets and supports the following
memory features:
• DDR3 SDRAM SO-DIMMs with gold-plated contacts
• Unbuffered, single-sided or double-sided DIMMs
• 4 GB maximum total system memory
• Minimum total system memory: 256 MB
• Non-ECC DIMMs
• Serial Presence Detect
• DDR3 1066 MHz, DDR3 1333 MHz, DDR3 1600 MHz SO-DIMMs
(DDR3 1333 MHz and DDR3 1600 MHz memory will run at 1066 MHz)
NOTE
Due to passively-cooled thermal constraints, system memory must have an operating
temperature rating of 85
o
C.
The board is designed to be passively cooled in a properly ventilated chassis. Chassis
venting locations are recommended above the system memory area for maximum
heat dissipation effectiveness.
NOTE
To be fully compliant with all applicable DDR3 SDRAM memory specifications, the
board should be populated with SO-DIMMs that support the Serial Presence Detect
(SPD) data structure. This allows the BIOS to read the SPD data and program the
chipset to accurately configure memory settings for optimum performance. If nonSPD memory is installed, performance and reliability may be impacted or the SODIMMs may not function under the determined frequency.
18
Product Description
Table 3 lists the supported SO-DIMM configurations.
1
Table 3. Supported Memory Configurations
Raw Card
Version
B
F
Notes:
1. System memory configurations are based on availability and are subject to change.
2. Support for one 4 GB SO-DIMM installed in slot 1. Slot 0 must be left empty.
SO-DIMM
Capacity
1 GB 1 Gb 128 M x 8 8
2 GB 2 Gb 256 M x 8 8
2 GB 1 Gb 128 M x 8 16
4 GB2 2 Gb 256 M x 8 16
DRAM Device
Technology
DRAM
Organization
# of DRAM
Devices
Figure 3 illustrates the memory channel and SO-DIMM configuration.
Figure 3. Memory Channel and SO-DIMM Configuration
19
Intel Desktop Board D2700DC Technical Product Specification
1.5 Intel® NM10 Express Chipset
The Intel NM10 Express Chipset provides interfaces to the processor and the USB,
SATA, LPC, LAN, PCI, and PCI Express interfaces. The Intel NM10 Express Chipset is a
centralized controller for the board’s I/O paths.
NOTE
The board is designed to be passively cooled in a properly ventilated chassis. Chassis
venting locations are recommended above the processor heatsink area for maximum
heat dissipation effectiveness.
For information about Refer to
The Intel NM10 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.5.1.1 Video Memory Allocation
Video memory is allocated from the total available system memory for the efficient
balancing of 2-D/3-D graphics performance and overall system performance. Dynamic
allocation of system memory to video memory is as follows:
• 256 MB total RAM results in 32 MB video RAM
• 512 MB total RAM results in 64 MB video RAM
• 1 GB total RAM results in 128 MB video RAM
• 2 GB total RAM results in 224 MB video RAM
1.5.1.2 Digital Visual Interface (DVI-D)
The DVI-D port supports only digital DVI displays. The maximum supported resolution
is 1920 x 1200 at 60 Hz refresh (WUXGA). The DVI-D port is compliant with the
DVI 1.0 specification.
20
Product Description
1.5.2 USB
The board provides up to seven USB 2.0 ports, supports UHCI and EHCI, and uses
UHCI- and EHCI-compatible drivers (four ports routed to the back panel and three
ports routed to two front panel USB 2.0 headers). One of the front panel USB headers
(brown-colored) supports an Intel Z-U130 USB Solid-State Drive or compatible device.
NOTE
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use
shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 9, page 39
The location of the front panel USB headers Figure 11, page 41
1.5.3 SATA Support
The board provides two SATA interface connectors that support one device per
connector.
The board’s SATA controller offers independent SATA ports with a theoretical
maximum transfer rate of 3.0 Gb/s on each port. One device can be installed on each
port for a maximum of two SATA devices. A point-to-point interface is used for host to
device connections, unlike PATA which supports a master/slave configuration and two
devices on each channel.
For compatibility, the underlying SATA functionality is transparent to the operating
system. The SATA controller supports IDE and AHCI configuration and can operate in
both legacy and native modes. In legacy mode, standard ATA I/O and IRQ resources
are assigned (IRQ 14 and 15). In native mode, standard Conventional PCI bus
resource steering is used. Native mode is the preferred mode for configurations using
the Windows Vista* operating system.
For information about Refer to
Obtaining AHCI driver Section 1.2, page 16
The location of the SATA connectors Figure 11, page 41
21
Intel Desktop Board D2700DC Technical Product Specification
1.6 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded
into CMOS RAM at power-on.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.
1.7 Legacy I/O Controller
The Legacy I/O Controller provides the following features:
• Serial IRQ interface compatible with serialized IRQ support for Conventional
PCI bus systems
• Intelligent power management, including a programmable wake-up event
interface
• Conventional PCI bus power management support
The BIOS Setup program provides configuration options for the Legacy I/O controller.
For information about Refer to
The location of the headers Figure 11, page 41
22
Product Description
1.8 LAN Subsystem
The LAN subsystem consists of the following:
• Intel NM10 Express Chipset
• Intel 82574L Gigabit Ethernet Controller for 10/100/1000 Mb/s Ethernet
LAN connectivity
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface that supports the Ethernet controller
• Conventional PCI bus power management
⎯ Supports ACPI technology
⎯ Supports LAN wake capabilities
1.8.1 LAN Subsystem Drivers
LAN drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN drivers Section 1.2, page 16
23
Intel Desktop Board D2700DC Technical Product Specification
1.8.2 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 4).
Figure 4. LAN Connector LED Locations
Table 4 describes the LED states when the board is powered up and the Ethernet LAN
subsystem is operating.
Table 4. LAN Connector LED States
LED LED Color LED State Condition
Off LAN link is not established.
Link/Activity (A) Green
Link Speed (B) Green/Yellow
On LAN link is established.
Blinking LAN activity is occurring.
Off 10 Mb/s data rate is selected or negotiated.
Green 100 Mb/s data rate is selected or negotiated.
Yellow 1000 Mb/s data rate is selected or negotiated.
24
Product Description
1.9 Audio Subsystem
The board supports the Intel® High Definition Audio (Intel® HD Audio) subsystem. The
audio subsystem consists of the following:
• Intel NM10 Express Chipset
• Realtek ALC662 audio codec
The audio subsystem has the following features:
• Advanced jack sense for the back panel audio jacks that enables the audio
codec to recognize the device that is connected to an audio port. The back
panel audio jacks are capable of retasking according to the user’s definition,
or can be automatically switched depending on the recognized device type.
• Front panel Intel HD Audio and AC ’97 audio support.
• 3-port analog audio out stack.
• Windows Vista Basic certification.
• A signal-to-noise (S/N) ratio of 95 dB.
Table 5 lists the supported functions of the front panel and back panel audio jacks.
Table 5. Audio Jack Support
Audio Jack
Front panel – Green Default
Front panel – Pink Default
Back panel – Blue Default
Back panel – Green (ctrl panel) Default
Back panel – Pink Default
Microphone Headphones
Line Out
(Front Spks)
Line In
(Stereo 2) Mic-In
25
Intel Desktop Board D2700DC Technical Product Specification
1.9.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.2, page 16
1.9.2 Audio Connectors and Headers
The board contains audio connectors and headers on both the back panel and the
component side of the board. The component-side audio headers include front panel
audio (a 2 x 5-pin header that provides mic in and line out signals for front panel
audio connectors).
Item Description
A Line in
B Line out
C Mic in
Figure 5. Back Panel Audio Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
For information about Refer to
The locations of the front panel audio header and S/PDIF audio header Figure 11, page 41
The signal names of the front panel audio header and S/PDIF header Section 2.2.2.1, page 43
26
Product Description
1.10 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Thermal monitoring
• Voltage monitoring
1.10.1 Hardware Monitoring
The hardware monitoring and fan control subsystem is based on the Winbond
W83627DHG-P device, which supports the following:
• System ambient temperature monitoring
• System fan speed monitoring
• Power monitoring of +12 V, +5 V, +5 Vstdby, +3.3 V, and +VCCP
• SMBus interface
27
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