Intel DBS1200V3RPS User Manual

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Intel® Xeon ® Processor E3-1200 Product Family and LGA 1155 Socket

Thermal/Mechanical Specifications and Design Guidelines

April 2011

Document Number: 324973-001

Notice: This document contains information on products in the design phase of development. The information here is subject to change without notice. Do not finalize a design with this information.

NFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The processor, chipset and LGA1155 socket may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Requires a system with Intel® Turbo Boost Technology capability. Consult your PC manufacturer. Performance varies depending on hardware, software and system configuration. For more information, visit http://www.intel.com/technology/turboboost

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-548-4725 or by visiting Intel's website at http://www.intel.com.

Intel, Xeon and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

*Other names and brands may be claimed as the property of others. Copyright © 2011, Intel Corporation. All Rights Reserved.

2

Thermal/Mechanical Specifications and Design Guidelines

Contents

1

Introduction

..............................................................................................................

9

 

1.1

References .......................................................................................................

10

 

1.2

Definition ............................................................................................of Terms

10

2

Package Mechanical ..........................................................& Storage Specifications

13

 

2.1

Package .......................................................................Mechanical Specifications

13

 

 

2.1.1 ....................................................................

Package Mechanical Drawing

14

 

 

2.1.2 ......................................................Processor Component Keep-Out Zones

14

 

 

2.1.3 ................................................................

Package Loading Specifications

15

 

 

2.1.4 ....................................................................

Package Handling Guidelines

15

 

 

2.1.5 ...............................................................

Package Insertion Specifications

15

 

 

2.1.6 ....................................................................

Processor Mass Specification

15

 

 

2.1.7 .................................................................................

Processor Materials

16

 

 

2.1.8 .................................................................................

Processor Markings

16

 

 

2.1.9 .....................................................................

Processor Land Coordinates

17

 

2.2

Processor .........................................................................Storage Specifications

18

3

LGA1155 Socket ......................................................................................................

19

 

3.1

Board Layout ....................................................................................................

20

 

 

3.1.1 ................................Suggested Silkscreen Marking for Socket Identification

22

 

3.2

Attachment ................................................................................to Motherboard

22

 

3.3

Socket ...........................................................................................Components

23

 

 

3.3.1 ..............................................................................

Socket Body Housing

23

 

 

3.3.2 ...........................................................................................

Solder Balls

23

 

 

3.3.3 ...............................................................................................

Contacts

23

 

 

3.3.4 ...............................................................................Pick and Place Cover

23

 

3.4

Package ...........................................................................Installation / Removal

24

 

 

3.4.1 ..............................................Socket Standoffs and Package Seating Plane

25

 

3.5

Durability .........................................................................................................

25

 

3.6

Markings ..........................................................................................................

25

 

3.7

Component ...............................................................................Insertion Forces

26

 

3.8

Socket ......................................................................................................Size

26

4

Independent ...................................................................Loading Mechanism (ILM)

27

 

4.1

Design .................................................................................................Concept

27

 

 

4.1.1 ................................................................ILM Assembly Design Overview

27

 

 

4.1.2 ...............................................................ILM Back Plate Design Overview

28

 

 

4.1.3 .........................................Shoulder Screw and Fasteners Design Overview

29

 

4.2

Assembly .......................................................................of ILM to a Motherboard

30

 

4.3

ILM Interchangeability .......................................................................................

32

 

4.4

Markings ..........................................................................................................

32

 

4.5

ILM Cover ........................................................................................................

33

5

LGA1155 Socket ..and ILM Electrical, Mechanical and Environmental Specifications

37

 

5.1

Component ...............................................................................................Mass

37

 

5.2

Package/Socket ..........................................................................Stackup Height

37

 

5.3

Loading ........................................................................................Specifications

38

 

5.4

Electrical ......................................................................................Requirements

38

 

5.5

Environmental ..............................................................................Requirements

39

6

Thermal Specifications ............................................................................................

41

 

6.1

Thermal .......................................................................................Specifications

41

 

 

6.1.1 ................................Intel® Xeon® Processor E3-1280 (95W)Thermal Profile

43

 

 

6.1.2 ...............................Intel® Xeon® Processor E3-1200 (80W) Thermal Profile

44

 

 

6.1.3 .............................

Intel ® Xeon ® Processor E3 - 1260L (45W) Thermal Profile

46

Thermal/Mechanical Specifications and Design Guideline

3

 

 

 

6.1.4

..............................Intel® Xeon® Processor E3-1220L (20W) Thermal Profile

47

 

 

 

6.1.5

Intel® Xeon® Processor E3-1200 (95W) with Integrated

 

 

 

 

 

Graphics Thermal Profile..........................................................................

48

 

 

 

6.1.6

Processor Specification for Operation Where Digital Thermal

 

 

 

 

 

Sensor Exceeds TCONTROL ......................................................................

49

 

 

 

6.1.7

Thermal Metrology..................................................................................

54

 

 

6.2

Processor Thermal Features ................................................................................

54

 

 

 

6.2.1

Processor Temperature............................................................................

54

 

 

 

6.2.2

Adaptive Thermal Monitor ........................................................................

54

 

 

 

6.2.3

THERMTRIP# Signal ................................................................................

58

 

 

6.3

Intel® Turbo Boost Technology ............................................................................

58

 

 

 

6.3.1

Intel® Turbo Boost Technology Frequency..................................................

58

 

 

 

6.3.2

Intel® Turbo Boost Technology Graphics Frequency.....................................

59

 

 

6.4

Thermal Considerations ......................................................................................

59

 

 

 

6.4.1

Intel® Turbo Boost Technology Power Control and Reporting ........................

60

 

 

 

6.4.2

Package Power Control ............................................................................

61

 

 

 

6.4.3

Power Plane Control ................................................................................

61

 

 

 

6.4.4

Turbo Time Parameter.............................................................................

61

7

 

PECI Interface .........................................................................................................

63

 

 

7.1

Platform Environment Control Interface (PECI) ......................................................

63

 

 

 

7.1.1

Introduction...........................................................................................

63

8

 

Sensor Based Thermal Specification Design Guidance ..............................................

65

 

 

8.1

Sensor Based Specification Overview (DTS 1.0) .....................................................

65

 

 

8.2

Sensor Based Thermal Specification .....................................................................

67

 

 

 

8.2.1

TTV Thermal Profile.................................................................................

67

 

 

 

8.2.2

Specification When DTS value is Greater than TCONTROL.............................

68

 

 

8.3

Thermal Solution Design Process .........................................................................

68

 

 

 

8.3.1

Boundary Condition Definition ..................................................................

68

 

 

 

8.3.2

Thermal Design and Modelling ..................................................................

69

 

 

 

8.3.3

Thermal Solution Validation......................................................................

69

 

 

8.4

Fan Speed Control (FSC) Design Process...............................................................

69

 

 

 

8.4.1

DTS 1.1 A New Fan Speed Control Algorithm without TAMBIENT Data ............

71

 

 

8.5

System Validation..............................................................................................

73

9

 

1U Thermal Solution ................................................................................................

75

 

 

9.1

Performance Targets ..........................................................................................

75

 

 

9.2

1U Collaboration Heatsink ...................................................................................

75

 

 

 

9.2.1

Heatsink Performance .............................................................................

75

 

 

 

9.2.2

Thermal Solution ....................................................................................

78

 

 

 

9.2.3

Assembly...............................................................................................

79

 

 

9.3

1U Reference Heatsink .......................................................................................

80

 

 

 

9.3.1

Heatsink Performance .............................................................................

80

 

 

 

9.3.2

Thermal Solution ....................................................................................

80

 

 

 

9.3.3

Assembly...............................................................................................

81

 

 

9.4

Geometric Envelope for 1U Thermal Mechanical Design ...........................................

81

 

 

9.5

Thermal Interface Material ..................................................................................

81

 

 

9.6

Heat Pipe Thermal Consideration .........................................................................

81

10

Active Tower Thermal Solution ................................................................................

83

 

 

10.1

Introduction......................................................................................................

83

 

 

10.2

Mechanical Specifications....................................................................................

84

 

 

 

10.2.1

Cooling Solution Dimensions ....................................................................

84

 

 

 

10.2.2

Retention Mechanism and Heatsink Attach Clip Assembly .............................

85

 

 

10.3

Electrical Requirements ......................................................................................

85

 

 

 

10.3.1

Active Tower Heatsink Power Supply .........................................................

85

 

 

10.4

Cooling Requirements ........................................................................................

87

4

Thermal/Mechanical Specifications and Design Guideline

11

............................................Thermal Solution Quality and Reliability Requirements

 

89

 

11.1

Reference Heatsink Thermal Verification...............................................................

89

 

11.2

Mechanical Environmental Testing .......................................................................

89

 

 

11.2.1

Recommended Test Sequence..................................................................

90

 

 

11.2.2

Post-Test Pass Criteria ............................................................................

90

 

 

11.2.3

Recommended BIOS/Processor/Memory Test Procedures .............................

90

 

11.3

Material and Recycling Requirements ...................................................................

91

A

Component Suppliers...............................................................................................

93

B

Mechanical Drawings...............................................................................................

95

C

Socket Mechanical Drawings .................................................................................

115

D

Package Mechanical Drawings ...............................................................................

121

Figures

2-1 Processor Package Assembly Sketch ....................................................................

13

2-2

Package View ...................................................................................................

14

2-3

Processor Top-Side Markings ..............................................................................

16

2-4 Processor Package Lands Coordinates ..................................................................

17

3-1 LGA1155 Socket with Pick and Place Cover ...........................................................

19

3-2 LGA1155 Socket Contact Numbering (Top View of Socket)......................................

20

3-3 LGA1155 Socket Land Pattern (Top View of Board) ................................................

21

3-4

Suggested Board Marking...................................................................................

22

3-5

Attachment to Motherboard ................................................................................

22

3-6 Pick and Place Cover..........................................................................................

24

3-7 Package Installation / Removal Features...............................................................

25

4-1 ILM Assembly with Installed Processor .................................................................

28

4-2

Back Plate ........................................................................................................

29

4-3

Shoulder Screw.................................................................................................

30

4-4

ILM Assembly ...................................................................................................

31

4-5 Pin1 and ILM Lever............................................................................................

32

4-6

ILM Cover ........................................................................................................

34

4-7 ILM Cover and PnP Cover Interference .................................................................

35

5-1 Flow Chart of Knowledge-Based Reliability Evaluation Methodology ..........................

40

6-1 Thermal Test Vehicle Thermal Profile for Intel® Xeon® Processor E3-1280 (95W) .......

43

6-2 Thermal Test Vehicle Thermal Profile for Intel® Xeon® Processor E3-1200 (80W) .......

44

6-3 Thermal Test Vehicle Thermal Profile for Intel® Xeon® Processor E3-1260L (45W) .....

46

6-4 Thermal Test Vehicle Thermal Profile for Intel® Xeon® Processor E3-1220L (20W)

.... 47

6-5 Thermal Test Vehicle Thermal Profile for

 

 

Intel® Xeon® Processor E3-1200 (95W) with Integrated Graphics ............................

48

6-6 TTV Case Temperature (TCASE) Measurement Location ..........................................

54

6-7 Frequency and Voltage Ordering..........................................................................

56

6-8

Package Power Control.......................................................................................

61

8-1 Comparison of Case Temperature vs. Sensor Based Specification.............................

66

8-2

Intel® Xeon® Processor E3-1280 (95W) TTV Thermal Profile .................................

67

8-3 DTS 1.1 Definition Points....................................................................................

72

9-1 1U Collaboration Heatsink Performance Curves......................................................

76

9-2 1U Collaboration Heatsink Performance Curves......................................................

77

9-3 1U Collaboration Heatsink Assembly ....................................................................

79

9-4 1U Reference Heatsink Performance Curves ..........................................................

80

9-5 KOZ 3-D Model (Top) in 1U Server ......................................................................

81

9-6 TTV Die Size and Orientation ..............................................................................

82

Thermal/Mechanical Specifications and Design Guideline

5

 

10-1

.............................................................Mechanical Representation of the Solution

83

10-2

Physical Space Requirements for the Solution (side view)........................................

84

10-3

Physical Space Requirements for the Solution (top view).........................................

85

 

10-4 Fan Power Cable Connector Description ...............................................................

86

10-5

Baseboard Power Header Placement Relative to Processor Socket.............................

86

10-6

Active Tower Heatsink Airspace Keepout Requirements (side view)...........................

87

 

B-1

Socket / Heatsink / ILM Keepout Zone Primary Side for 1U (Top) .............................

96

 

B-2

Socket / Heatsink / ILM Keepout Zone Secondary Side for 1U (Bottom) ....................

97

 

B-3

Socket / Processor / ILM Keepout Zone Primary Side for 1U (Top) ............................

98

 

B-4

Socket / Processor / ILM Keepout Zone Secondary Side for 1U (Bottom) ...................

99

 

B-5

1U

Collaboration Heatsink Assembly...................................................................

100

 

B-6

1U

Collaboration Heatsink .................................................................................

101

 

B-7

1U

Reference Heatsink Assembly .......................................................................

102

 

B-8

1U

Reference Heatsink .....................................................................................

103

 

B-9

1U

Heatsink Screw...........................................................................................

104

 

B-10

Heatsink Compression Spring ............................................................................

105

 

B-11

Heatsink Load Cup ...........................................................................................

106

 

B-12

Heatsink Retaining Ring....................................................................................

107

 

B-13

Heatsink Backplate Assembly ............................................................................

108

 

B-14

Heatsink Backplate ..........................................................................................

109

 

B-15

Heatsink Backplate Insulator .............................................................................

110

 

B-16

Heatsink Backplate Stud ...................................................................................

111

 

B-17

Thermocouple Attach Drawing ...........................................................................

112

 

B-18

1U

ILM Shoulder Screw ....................................................................................

113

 

B-19

1U

ILM Standard 6-32 Thread Fastener...............................................................

114

 

C-1

Socket Mechanical Drawing (Sheet 1 of 4)...........................................................

116

 

C-2

Socket Mechanical Drawing (Sheet 2 of 4)...........................................................

117

 

C-3

Socket Mechanical Drawing (Sheet 3 of 4)...........................................................

118

 

C-4

Socket Mechanical Drawing (Sheet 4 of 4)...........................................................

119

 

D-1

Processor Package Drawing (Sheet 1 of 2) ..........................................................

122

 

D-2

Processor Package Drawing (Sheet 2of 2) ...........................................................

123

6

Thermal/Mechanical Specifications and Design Guideline

Tables

1-1

Reference Documents ........................................................................................

10

1-2

Terms and Descriptions......................................................................................

10

2-1

Processor Loading Specifications .........................................................................

15

2-2

Package Handling Guidelines...............................................................................

15

2-3

Processor Materials............................................................................................

16

2-4

Storage Conditions ............................................................................................

18

5-1

Socket Component Mass ....................................................................................

37

5-2

1155-land Package and LGA1155 Socket Stackup Height ........................................

37

5-3

Socket & ILM Mechanical Specifications ................................................................

38

5-4

Electrical Requirements for LGA1155 Socket .........................................................

39

6-1

Processor Thermal Specifications .........................................................................

42

6-2

Thermal Test Vehicle Thermal Profile for Intel® Xeon® Processor E3-1280 (95W) .......

43

6-3

Thermal Test Vehicle Thermal Profile for Intel® Xeon® Processor E3-1200 (80W) .......

45

6-4

Thermal Test Vehicle Thermal Profile for Intel® Xeon® Processor E3-1260L (45W) .....

46

6-5

Thermal Test Vehicle Thermal Profile for Intel® Xeon® Processor E3-1220L (20W)

.... 47

6-6

Thermal Test Vehicle Thermal Profile for

 

 

Intel® Xeon® Processor E3-1200 (95W) with Integrated Graphics ............................

48

6-7

Thermal Solution Performance above TCONTROL for the

 

 

Intel® Xeon® Processor E3-1280 (95W) ...............................................................

49

6-8

Thermal Solution Performance above TCONTROL for the

 

 

Intel® Xeon® Processor E3-1200 (80W) ..............................................................

50

6-9

Thermal Solution Performance above TCONTROL for the

 

 

Intel® Xeon® Processor E3-1260L (45W) ..............................................................

51

6-10

Thermal Solution Performance above TCONTROL for the

 

 

Intel® Xeon® Processor E3-1220L (20W) .............................................................

52

6-11

Thermal Solution Performance above TCONTROL for the

 

 

Intel® Xeon® Processor E3-1200 (95W) with Integrated Graphics ............................

53

8-1

DTS 1.1 Thermal Solution Performance above TCONTROL..........................................

72

9-1

Boundary Conditions and Performance Targets ......................................................

75

9-2

Comparison between TTV Thermal Profile and Thermal Solution Performance

 

 

for Intel® Xeon® Processor E3-1280 (95W) .........................................................

77

10-1

Fan Power and Signal Specifications.....................................................................

86

11-1

Use Conditions (Board Level) ..............................................................................

89

A-1

Collaboration Heatsink Enabled Components-1U Server ..........................................

93

A-2

Reference Heatsink - Workstation........................................................................

93

A-3

Reference Heatsink ComponentsWorkstation.......................................................

93

A-4

LGA1155 Socket and ILM Components .................................................................

93

A-5

Supplier Contact Information ..............................................................................

94

B-1

Mechanical Drawing List .....................................................................................

95

C-1

Mechanical Drawing List ...................................................................................

115

D-1

Mechanical Drawing List ...................................................................................

121

Thermal/Mechanical Specifications and Design Guideline

7

Revision History

Document Number

Description

Date

 

 

 

324973-001

• Initial release of the document.

April 2011

 

 

 

§

8

Thermal/Mechanical Specifications and Design Guideline

Introduction

1 Introduction

This document is intended to provide guidelines for design of thermal and mechanical solution. Meanwhile thermal and mechanical specifications for the processor and associated socket are included.

The components described in this document include:

The thermal and mechanical specifications for the following Intel® server/ workstation processors:

Intel® Xeon® processor E3-1200 product family

The LGA1155 socket and the Independent Loading Mechanism (ILM) and back plate.

The collaboration/reference design thermal solution (heatsink) for the processors and associated retention hardware.

The Intel® Xeon® Processor E3-1200 product family has the different thermal specifications. When required for clarity this document will use:

Intel® Xeon® processor E3-1280 (95W)

Intel® Xeon® processor E3-1200 (80W)

Intel® Xeon® processor E3-1200 series (95W) with integrated graphics

Intel® Xeon® processor E3-1260L (45W)

Intel® Xeon® processor E3-1220L (20W)

Note: When the information is applicable to all products the this document will use “processor” or “processors” to simplify the document.

Thermal/Mechanical Specifications and Design Guidelines

9

Introduction

1.1References

Material and concepts available in the following documents may be beneficial when reading this document.

Table 1-1. Reference Documents

Document

Location

Notes

 

 

 

Intel® Xeon® Processor E3-1200 Family Data Sheet Volume One

http://

 

 

www.intel.com/

 

 

Assets/PDF/

 

 

datasheet/

 

 

324970.pdf

 

 

 

 

Intel® Xeon® Processor E3-1200 Family Datasheet Volume Two

http://

 

 

www.intel.com/

 

 

Assets/PDF/

 

 

datasheet/

 

 

324971.pdf

 

 

 

 

Intel® Xeon® Processor E3-1200 Family Specification Update

http://

 

 

www.intel.com/

 

 

Assets/PDF/

 

 

specupdate/

 

 

324972.pdf

 

 

 

 

4-Wire Pulse Width Modulation (PWM) Controlled Fans

Available at http://

 

 

www.formfactors.org/

 

 

 

 

1.2Definition of Terms

Table 1-2.

Terms and Descriptions (Sheet 1 of 2)

 

 

 

Term

 

Description

 

 

 

Bypass

 

Bypass is the area between a passive heatsink and any object that can act to form a duct. For this

 

 

example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest

 

 

surface.

 

 

 

CTE

 

Coefficient of Thermal Expansion. The relative rate a material expands during a thermal event.

 

 

 

DTS

 

Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation temperature.

 

 

 

FSC

 

Fan Speed Control

 

 

 

IHS

 

Integrated Heat Spreader: a component of the processor package used to enhance the thermal

 

 

performance of the package. Component thermal solutions interface with the processor at the IHS surface.

 

 

 

ILM

 

Independent Loading Mechanism provides the force needed to seat the 1155-LGA land package onto the

 

 

socket contacts.

 

 

 

PCH

 

Platform Controller Hub. The PCH is connected to the processor via the Direct Media Interface (DMI) and

 

 

Intel® Flexible Display Interface (Intel® FDI).

LGA1155 socket

 

The processor mates with the system board through this surface mount, 1155-land socket.

 

 

 

PECI

 

The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication

 

 

channel between Intel processor and chipset components to external monitoring devices.

 

 

 

ΨCA

 

Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution performance

 

 

using total package power. Defined as (TCASE – TLA) / Total Package Power. The heat source should always

 

 

be specified for Ψ measurements.

 

 

 

ΨCS

 

Case-to-sink thermal characterization parameter. A measure of thermal interface material performance

 

 

using total package power. Defined as (TCASE – TS) / Total Package Power.

ΨSA

 

Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using

 

 

total package power. Defined as (TS – TLA) / Total Package Power.

TCASE or TC

 

The case temperature of the processor, measured at the geometric center of the topside of the TTV IHS.

10

 

Thermal/Mechanical Specifications and Design Guidelines

Introduction

Table 1-2.

Terms and Descriptions (Sheet 2 of 2)

 

 

 

Term

 

Description

 

 

 

TCASE_MAX

 

The maximum case temperature as specified in a component specification.

TCC

 

Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by using clock

 

 

modulation and/or operating frequency and input voltage adjustment when the die temperature is very

 

 

near its operating limits.

 

 

 

TCONTROL

 

Tcontrol is a static value that is below the TCC activation temperature and used as a trigger point for fan

 

 

speed control. When DTS > Tcontrol, the processor must comply to the TTV thermal profile.

 

 

 

TDP

 

Thermal Design Power: Thermal solution should be designed to dissipate this target power level. TDP is not

 

 

the maximum power that the processor can dissipate.

 

 

 

Thermal Monitor

 

A power reduction feature designed to decrease temperature after the processor has reached its maximum

 

 

operating temperature.

 

 

 

Thermal Profile

 

Line that defines case temperature specification of the TTV at a given power level.

 

 

 

TIM

 

Thermal Interface Material: The thermally conductive compound between the heatsink and the processor

 

 

case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor

 

 

case to the heatsink.

 

 

 

TTV

 

Thermal Test Vehicle. A mechanically equivalent package that contains a resistive heater in the die to

 

 

evaluate thermal solutions.

 

 

 

TLA

 

The measured ambient temperature locally surrounding the processor. The ambient temperature should be

 

 

measured just upstream of a passive heatsink or at the fan inlet for an active heatsink.

 

 

 

TSA

 

The system ambient air temperature external to a system chassis. This temperature is usually measured

 

 

at the chassis air inlets.

 

 

 

 

§

Thermal/Mechanical Specifications and Design Guidelines

11

Introduction

12

Thermal/Mechanical Specifications and Design Guidelines

Package Mechanical & Storage Specifications

2Package Mechanical & Storage Specifications

2.1Package Mechanical Specifications

The processor is packaged in a Flip-Chip Land Grid Array package that interfaces with the motherboard via the LGA1155 socket. The package consists of a processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package substrate and core and serves as the mating surface for processor thermal solutions, such as a heatsink. Figure 2-1 shows a sketch of the processor package components and how they are assembled together. Refer to Chapter 3 and Chapter 4 for complete details on the LGA1155 socket.

The package components shown in Figure 2-1 include the following:

1.Integrated Heat Spreader (IHS)

2.Thermal Interface Material (TIM)

3.Processor core (die)

4.Package substrate

5.Capacitors

Figure 2-1. Processor Package Assembly Sketch

Core (die)

TIM

IHS

 

Substrate

Capacitors

LGA1155 Socket

System Board

Note:

1.Socket and motherboard are included for reference and are not part of processor package.

2.For clarity the ILM not shown.

Thermal/Mechanical Specifications and Design Guidelines

13

Package Mechanical & Storage Specifications

2.1.1Package Mechanical Drawing

Figure 2-2 shows the basic package layout and dimensions. The detailed package mechanical drawings are in Appendix D. The drawings include dimensions necessary to design a thermal solution for the processor. These dimensions include:

1.Package reference with tolerances (total height, length, width, and so on)

2.IHS parallelism and tilt

3.Land dimensions

4.Top-side and back-side component keep-out dimensions

5.Reference datums

6.All drawing dimensions are in mm.

Figure 2-2. Package View

37.5

37.5

2.1.2Processor Component Keep-Out Zones

The processor may contain components on the substrate that define component keepout zone requirements. A thermal and mechanical solution design must not intrude into the required keep-out zones. Decoupling capacitors are typically mounted to either the topside or land-side of the package substrate. See Figure B-3 and Figure B-4 for keepout zones. The location and quantity of package capacitors may change due to manufacturing efficiencies but will remain within the component keep-in. This keep-in zone includes solder paste and is a post reflow maximum height for the components.

14

Thermal/Mechanical Specifications and Design Guidelines

Package Mechanical & Storage Specifications

2.1.3Package Loading Specifications

Table 2-1 provides dynamic and static load specifications for the processor package. These mechanical maximum load limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Also, any mechanical system or component testing should not exceed the maximum limits. The processor package substrate should not be used as a mechanical reference or load-bearing surface for thermal and mechanical solution.

.

Table 2-1. Processor Loading Specifications

Parameter

Minimum

Maximum

Notes

 

 

 

 

Static Compressive Load

-

600 N [135 lbf]

1, 2, 3

 

 

 

 

Dynamic Compressive Load

-

712 N [160 lbf]

1, 3, 4

 

 

 

 

Notes:

1.These specifications apply to uniform compressive loading in a direction normal to the processor IHS.

2.This is the maximum static force that can be applied by the heatsink and retention solution to maintain the heatsink and processor interface.

3.These specifications are based on limited testing for design characterization. Loading limits are for the package only and do not include the limits of the processor socket.

4.Dynamic loading is defined as an 50g shock load, 2X Dynamic Acceleration Factor with a 500g maximum thermal solution.

2.1.4Package Handling Guidelines

Table 2-2 includes a list of guidelines on package handling in terms of recommended maximum loading on the processor IHS relative to a fixed substrate. These package handling loads may be experienced during heatsink removal.

Table 2-2. Package Handling Guidelines

Parameter

Maximum Recommended

Notes

 

 

 

Shear

311 N [70 lbf]

1, 4

 

 

 

Tensile

111 N [25 lbf]

2, 4

 

 

 

Torque

3.95 N-m [35 lbf-in]

3, 4

 

 

 

Notes:

1.A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.

2.A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.

3.A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top surface.

4.These guidelines are based on limited testing for design characterization.

2.1.5Package Insertion Specifications

The processor can be inserted into and removed from an LGA1155 socket 15 times. The socket should meet the LGA1155 socket requirements detailed in Chapter 5.

2.1.6Processor Mass Specification

The typical mass of the processor is 21.5 g (0.76 oz). This mass [weight] includes all the components that are included in the package.

Thermal/Mechanical Specifications and Design Guidelines

15

Package Mechanical & Storage Specifications

2.1.7Processor Materials

Table 2-3 lists some of the package components and associated materials.

Table 2-3. Processor Materials

Component

Material

 

 

Integrated Heat Spreader (IHS)

Nickel Plated Copper

 

 

Substrate

Fiber Reinforced Resin

 

 

Substrate Lands

Gold Plated Copper

 

 

2.1.8Processor Markings

Figure 2-3 shows the topside markings on the processor. This diagram is to aid in the identification of the processor.

Figure 2-3. Processor Top-Side Markings

GRP1LINE1

GRP1LINE2

GRP1LINE3

GRP1LINE4

GRP1LINE5

S/N

Sample (QDF):

GRP1LINE1: i{M}{C}YY GRP1LINE2: INTEL CONFIDENTIAL GRP1LINE3: QDF ES SPEED GRP1LINE4: COUNTRY OF ORIGIN GRP1LINE5: {FPO} {e4}

Production (SSPEC):

GRP1LINE1: i{M}{C}YY GRP1LINE2: BRAND PROC# GRP1LINE3: SSPEC SPEED GRP1LINE4: COUNTRY OF ORIGIN GRP1LINE5: {FPO} {e4}

16

Thermal/Mechanical Specifications and Design Guidelines

Package Mechanical & Storage Specifications

2.1.9Processor Land Coordinates

Figure 2-4 shows the bottom view of the processor package.

.

Figure 2-4. Processor Package Lands Coordinates

AY

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AW

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AV

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AU

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AR

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AP

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AN

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AM

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AL

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AK

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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AH

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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J

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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A

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

3

5

7

9

11

13

15

17

19

21

23

25

27

29

31

33

35

37

39

2

4

 

6

8

10

12

14

16

18

20

22

24

26

28

30

32

34

36

38

40

Thermal/Mechanical Specifications and Design Guidelines

17

Package Mechanical & Storage Specifications

2.2Processor Storage Specifications

Table 2-4 includes a list of the specifications for device storage in terms of maximum and minimum temperatures and relative humidity. These conditions should not be exceeded in storage or transportation.

.

Table 2-4. Storage Conditions

Parameter

Description

Min

Max

Notes

 

 

 

 

 

TABSOLUTE STORAGE

The non-operating device storage temperature.

-55 °C

125 °C

1, 2, 3

 

Damage (latent or otherwise) may occur when

 

subjected to for any length of time.

 

 

 

 

 

 

 

 

TSUSTAINED STORAGE

The ambient storage temperature limit (in

-5 °C

40 °C

4, 5

 

shipping media) for a sustained period of time.

 

 

 

 

 

 

 

 

 

RHSUSTAINED STORAGE

The maximum device storage relative humidity

60% @ 24 °C

5, 6

 

for a sustained period of time.

 

 

 

 

 

 

 

 

 

TIMESUSTAINED STORAGE

A prolonged or extended period of time; typically

0

6

6

 

associated with customer shelf life.

Months

Months

 

 

 

 

 

 

 

Notes:

1.Refers to a component device that is not assembled in a board or socket that is not to be electrically connected to a voltage reference or I/O signals.

2.Specified temperatures are based on data collected. Exceptions for surface mount reflow are specified in by applicable JEDEC standard Non-adherence may affect processor reliability.

3.TABSOLUTE STORAGE applies to the unassembled component only and does not apply to the shipping media, moisture barrier bags or desiccant.

4.Intel branded board products are certified to meet the following temperature and humidity limits that are given as an example only (Non-Operating Temperature Limit: -40 °C to 70 °C, Humidity: 50% to 90%, non-condensing with a maximum wet bulb of 28 °C). Post board attach storage temperature limits are not specified for non-Intel branded boards.

5.The JEDEC, J-JSTD-020 moisture level rating and associated handling practices apply to all moisture sensitive devices removed from the moisture barrier bag.

6.Nominal temperature and humidity conditions and durations are given and tested within the constraints imposed by TSUSTAINED STORAGE and customer shelf life in applicable intel box and bags.

§

18

Thermal/Mechanical Specifications and Design Guidelines

LGA1155 Socket

3 LGA1155 Socket

This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the processors. The socket provides I/O, power and ground contacts. The socket contains 1155 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard.

The contacts are arranged in two opposing L-shaped patterns within the grid array. The grid array is 40 x 40 with 24 x 16 grid depopulation in the center of the array and selective depopulation elsewhere.

The socket must be compatible with the package (processor) and the Independent Loading Mechanism (ILM). The ILM design includes a back plate which is integral to having a uniform load on the socket solder joints. Socket loading specifications are listed in Chapter 5.

Figure 3-1. LGA1155 Socket with Pick and Place Cover

Thermal/Mechanical Specifications and Design Guidelines

19

LGA1155 Socket

Figure 3-2. LGA1155 Socket Contact Numbering (Top View of Socket)

30

28 29

26 27

24

25

22 23

20 21

18 19

16

17

14 15

12 13

10 11

8

9

7

6

4

5

2 3

1

A

C

E G

J

L

N

R

U

W AA AC AE AG AJ AL AN AR AU AW

B

D

F

H K

M

P

T

V

Y AB AD AF AH AK AM AP AT AV AY

39 4038

37 36

3533 34

31 3230

29

27 28

25 26

24

23 22

21 20

19 18

17 16

15 14

13 12

11

3.1Board Layout

The land pattern for the LGA1155 socket is 36 mils X 36 mils (X by Y) within each of the two L-shaped sections. Note that there is no round-off (conversion) error between socket pitch (0.9144 mm) and board pitch (36 mil) as these values are equivalent. The two L-sections are offset by 0.9144 mm (36 mil) in the x direction and 3.114 mm (122.6 mil) in the y direction, see Figure 3-3. This was to achieve a common package land to PCB land offset which ensures a single PCB layout for socket designs from the multiple vendors.

20

Thermal/Mechanical Specifications and Design Guidelines

LGA1155 Socket

Figure 3-3. LGA1155 Socket Land Pattern (Top View of Board)

30

28 29

27

26

24 25

23

22

21

20

18 19

17

16

14 15

12 13

10 11

9

8

6 7

5

4

23

1

A C E G J L N R U B D F H K M P T V

36mil (0.9144 mm)

W

AA AC AE AG AJ

AL AN AR AU AW

 

Y

AB AD AF AH AK

AM AP AT AV AY

 

 

 

39

40

 

 

38

 

 

37

36

 

 

35

 

 

34

 

 

33

32

 

 

31

30

 

 

29

28

 

 

27

26

 

 

25

24

 

 

23

 

 

22

 

 

21

20

 

 

19

18

 

 

17

16

 

 

15

 

 

14

 

 

13

12

 

 

11

 

 

 

122.6 mil (3.1144mm)

A

C E

G

J

L

N R

U

W

AA AC AE AG AJ AL AN AR AU AW

B

D

F

H

K M

P

T

V

Y AB AD AF AH AK AM AP AT AV AY

Thermal/Mechanical Specifications and Design Guidelines

21

LGA1155 Socket

3.1.1Suggested Silkscreen Marking for Socket Identification

Intel is recommending that customers mark the socket name approximately where shown in Figure 3-4.

Figure 3-4. Suggested Board Marking

3.2Attachment to Motherboard

The socket is attached to the motherboard by 1155 solder balls. There are no additional external methods (that is, screw, extra solder, adhesive, and so on) to attach the socket.

As indicated in Figure 3-1, the Independent Loading Mechanism (ILM) is not present during the attach (reflow) process.

Figure 3-5. Attachment to Motherboard

Load plate

Frame

Load Lever

 

Shoulder

Screw

Back Plate

22

Thermal/Mechanical Specifications and Design Guidelines

LGA1155 Socket

3.3Socket Components

The socket has two main components, the socket body and Pick and Place (PnP) cover, and is delivered as a single integral assembly. Refer to Appendix C for detailed drawings.

3.3.1Socket Body Housing

The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating capable of withstanding 260 °C for 40 seconds which is compatible with typical reflow/rework profiles. The socket coefficient of thermal expansion (in the XY plane), and creep properties, must be such that the integrity of the socket is maintained for the conditions listed in Chapter 5.

The color of the housing will be dark as compared to the solder balls to provide the contrast needed for pick and place vision systems.

3.3.2Solder Balls

A total of 1155 solder balls corresponding to the contacts are on the bottom of the socket for surface mounting with the motherboard. The socket solder ball has the following characteristics:

Lead free SAC (SnAgCu) 305 solder alloy with a silver (Ag) content between 3% and 4% and a melting temperature of approximately 217 °C. The alloy is compatible with immersion silver (ImAg) and Organic Solderability Protectant (OSP) motherboard surface finishes and a SAC alloy solder paste.

Solder ball diameter 0.6 mm ± 0.02 mm, before attaching to the socket lead.

The co-planarity (profile) and true position requirements are defined in Appendix C.

3.3.3Contacts

Base material for the contacts is high strength copper alloy.

For the area on socket contacts where processor lands will mate, there is a 0.381 μm [15 μinches] minimum gold plating over 1.27 μm [50 μinches] minimum nickel underplate.

No contamination by solder in the contact area is allowed during solder reflow.

3.3.4Pick and Place Cover

The cover provides a planar surface for vacuum pick up used to place components in the Surface Mount Technology (SMT) manufacturing line. The cover remains on the socket during reflow to help prevent contamination during reflow. The cover can withstand 260 °C for 40 seconds (typical reflow/rework profile) and the conditions listed in Chapter 5 without degrading.

As indicated in Figure 3-6, the cover remains on the socket during ILM installation, and should remain on whenever possible to help prevent damage to the socket contacts.

Thermal/Mechanical Specifications and Design Guidelines

23

LGA1155 Socket

Cover retention must be sufficient to support the socket weight during lifting, translation, and placement (board manufacturing), and during board and system shipping and handling. PnP Cover should only be removed with tools, to prevent the cover from falling into the contacts.

The socket vendors have a common interface on the socket body where the PnP cover attaches to the socket body. This should allow the PnP covers to be compatible between socket suppliers.

As indicated in Figure 3-6, a Pin 1 indicator on the cover provides a visual reference for proper orientation with the socket.

Figure 3-6. Pick and Place Cover

Pin 1

Pick & Place

ILM Installation

3.4Package Installation / Removal

As indicated in Figure 3-7, access is provided to facilitate manual installation and removal of the package.

To assist in package orientation and alignment with the socket:

The package Pin1 triangle and the socket Pin1 chamfer provide visual reference for proper orientation.

The package substrate has orientation notches along two opposing edges of the package, offset from the centerline. The socket has two corresponding orientation posts to physically prevent mis-orientation of the package. These orientation features also provide initial rough alignment of package to socket.

The socket has alignment walls at the four corners to provide final alignment of the package.

24

Thermal/Mechanical Specifications and Design Guidelines

LGA1155 Socket

.

Figure 3-7. Package Installation / Removal Features

Package

Orientation

Pin 1

Notch

Indicator

(2 Places)

 

Finger/Tool

 

Access

Alignment

(2 Places)

Post

Pin 1

(2 Places)

Chamfer

3.4.1Socket Standoffs and Package Seating Plane

Standoffs on the bottom of the socket base establish the minimum socket height after solder reflow and are specified in Appendix C.

Similarly, a seating plane on the topside of the socket establishes the minimum package height. See Section 5.2 for the calculated IHS height above the motherboard.

3.5Durability

The socket must withstand 20 cycles of processor insertion and removal. The max chain contact resistance from Table 5-4 must be met when mated in the 1st and 20th cycles.

The socket Pick and Place cover must withstand 15 cycles of insertion and removal.

3.6Markings

There are three markings on the socket:

LGA1155: Font type is Helvetica Bold - minimum 6 point (2.125 mm). This mark will also appear on the pick and place cap.

Manufacturer's insignia (font size at supplier's discretion).

Lot identification code (allows traceability of manufacturing date and location).

Thermal/Mechanical Specifications and Design Guidelines

25

LGA1155 Socket

All markings must withstand 260 °C for 40 seconds (typical reflow/rework profile) without degrading, and must be visible after the socket is mounted on the motherboard.

LGA1155 and the manufacturer's insignia are molded or laser marked on the side wall.

3.7Component Insertion Forces

Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/ Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force to insert the package into the socket.

3.8Socket Size

Socket information needed for motherboard design is given in Appendix C.

This information should be used in conjunction with the reference motherboard keepout drawings provided in Appendix B to ensure compatibility with the reference thermal mechanical components.

§

26

Thermal/Mechanical Specifications and Design Guidelines

Independent Loading Mechanism (ILM)

4Independent Loading Mechanism (ILM)

The ILM has two critical functions: deliver the force to seat the processor onto the socket contacts and distribute the resulting compressive load evenly through the socket solder joints.

The mechanical design of the ILM is integral to the overall functionality of the LGA1155 socket. Intel performs detailed studies on integration of processor package, socket and ILM as a system. These studies directly impact the design of the ILM. The Intel reference ILM will be “build to print” from Intel controlled drawings. Intel recommends using the Intel Reference ILM. Custom non-Intel ILM designs do not benefit from Intel's detailed studies and may not incorporate critical design parameters.

Note: There is a single ILM design for the LGA1155 socket and LGA1156 socket.

4.1Design Concept

The ILM consists of two assemblies that will be procured as a set from the enabled vendors. These two components are ILM assembly and back plate. To secure the two assemblies, two types of fasteners are required a pair (2) of standard 6-32 thread screws and a custom 6-32 thread shoulder screw. The reference design incorporates a T-20 Torx head fastener. The Torx head fastener was chosen to ensure end users do not inadvertently remove the ILM assembly and for consistency with the LGA1366 socket ILM. The Torx head fastener is also less susceptible to driver slippage. Once assembled the ILM is not required to be removed to install / remove the motherboard from a chassis.

4.1.1ILM Assembly Design Overview

The ILM assembly consists of 4 major pieces: ILM cover, load lever, load plate and the hinge frame assembly.

All of the pieces in the ILM assembly except the hinge frame and the screws used to attach the back plate are fabricated from stainless steel. The hinge frame is plated. The frame provides the hinge locations for the load lever and load plate. An insulator is preapplied to the bottom surface of the hinge frame.

The ILM assembly design ensures that once assembled to the back plate the only features touching the board are the shoulder screw and the insulated hinge frame assembly. The nominal gap of the load plate to the board is ~1 mm.

When closed the load plate applies two point loads onto the IHS at the “dimpled” features shown in Figure 4-1. The reaction force from closing the load plate is transmitted to the hinge frame assembly and through the fasteners to the back plate. Some of the load is passed through the socket body to the board inducing a slight compression on the solder joints.

A pin 1 indicator will be marked on the ILM assembly.

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Independent Loading Mechanism (ILM)

Figure 4-1. ILM Assembly with Installed Processor

Hinge /

 

Frame

 

Assy

Fasteners

Load

Load Lever

Plate

Pin 1 Indicator

Shoulder Screw

4.1.2ILM Back Plate Design Overview

The back plate is a flat steel back plate with pierced and extruded features for ILM attach. A clearance hole is located at the center of the plate to allow access to test points and backside capacitors if required. An insulator is pre-applied. A notch is placed in one corner to assist in orienting the back plate during assembly.

Note: The Server ILM back plate is different from the Desktop design. Since Server secondary-side clearance of 3.0 mm [0.118 inch] is generally available for leads and backside components, so Server ILM back plate is designed with 1.8 mm thickness and 2.2 mm entire height including punch protrusion length.

Caution: Intel does NOT recommend using the server back plate for high-volume desktop applications at this time as the server back plate test conditions cover a limited envelope. Back plates and screws are similar in appearance. To prevent mixing, different levels of differentiation between server and desktop back plate and screws have been implemented.

For ILM back plate, three levels of differentiation have been implemented:

Unique part numbers, please refer to part numbers listed in Appendix A.

Desktop ILM back plate to use black lettering for marking versus server ILM back plate to use yellow lettering for marking.

Desktop ILM back plate using marking “115XDBP” versus server ILM back plate using marking “115XSBP”.

Note: When reworking a BGA component or the socket that the heatsink, battery, ILM and ILM Back Plate are removed prior to rework. The ILM back plate should also be removed when reworking through hole mounted components in a mini-wave or solder pot). The maximum temperature for the pre-applied insulator on the ILM is approximately 106 °C.

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Independent Loading Mechanism (ILM)

Figure 4-2. Back Plate

Assembly

Die Cut

Orientation

Insulator

Feature

 

Pierced & Extruded

Thread Features

4.1.3Shoulder Screw and Fasteners Design Overview

The shoulder screw is fabricated from carbonized steel rod. The shoulder height and diameter are integral to the mechanical performance of the ILM. The diameter provides alignment of the load plate. The height of the shoulder ensures the proper loading of the IHS to seat the processor on the socket contacts. The design assumes the shoulder screw has a minimum yield strength of 235 MPa.

A dimensioned drawing of the shoulder screw is available for local sourcing of this component. Please refer to Figure B-18 for the custom 6-32 thread shoulder screw drawing.

The standard fasteners can be sourced locally. The design assumes this fastener has a minimum yield strength of 235 MPa. Please refer to Figure B-19 for the standard 6-32 thread fasteners drawing.

The screws for Server ILM are different from Desktop design. The length of Server ILM screws are shorter than the Desktop screw length to satisfy Server secondary-side clearance limitation. Server ILM back plate to use black nickel plated screws, whereas desktop ILM back plate to use clear plated screws. Unique part numbers, please refer to Appendix A.

Note: The reference design incorporates a T-20 Torx head fastener. The Torx head fastener was chosen to ensure end users do not inadvertently remove the ILM assembly and for consistency with the LGA1366 socket ILM.

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Independent Loading Mechanism (ILM)

Figure 4-3. Shoulder Screw

Cap

6-32 thread

Shoulder

4.2Assembly of ILM to a Motherboard

The ILM design allows a bottoms up assembly of the components to the board. See Figure 4-4 for step by step assembly sequence.

1.Place the back plate in a fixture. The motherboard is aligned with the fixture.

2.Install the shoulder screw in the single hole near Pin 1 of the socket. Torque to a minimum and recommended 8 inch-pounds, but not to exceed 10 inch-pounds.

3.Align and place the ILM assembly over the socket.

4.Install two (2) 6-32 fasteners. Torque to a minimum and recommended 8 inchpounds, but not to exceed 10 inch-pounds.

The thread length of the shoulder screw accommodates a nominal board thicknesses of 0.062”.

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Independent Loading Mechanism (ILM)

.

Figure 4-4. ILM Assembly

Step 1

Step 2

Step 3

Step 4

Note: Here ILM assembly shown in figure is without ILM cover preinstalled.

As indicated in Figure 4-5, the shoulder screw, socket protrusion and ILM key features prevent 180 degree rotation of ILM cover assembly with respect to socket. The result is a specific Pin 1 orientation with respect to ILM lever.

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Independent Loading Mechanism (ILM)

Figure 4-5. Pin1 and ILM Lever

Alignment

Features

Pin 1

Shoulder

Screw Load plate not shown for

clarity

Load

Lever

4.3ILM Interchangeability

ILM assembly and ILM back plate built from the Intel controlled drawings are intended to be interchangeable. Interchangeability is defined as an ILM from Vendor A will demonstrate acceptable manufacturability and reliability with a socket body from Vendor A, B or C. ILM assembly and ILM back plate from all vendors are also interchangeable.

The ILM are an integral part of the socket validation testing. ILMs from each vendor will be matrix tested with the socket bodies from each of the current vendors. The tests would include: manufacturability, bake and thermal cycling.

See Appendix A for vendor part numbers that were tested.

Note: ILMs that are not compliant to the Intel controlled ILM drawings can not be assured to be interchangeable.

4.4Markings

There are four markings on the ILM:

115XLM: Font type is Helvetica Bold - minimum 6 point (2.125 mm).

Manufacturer's insignia (font size at supplier's discretion).

Lot identification code (allows traceability of manufacturing date and location).

Pin 1 indicator on the load plate.

All markings must be visible after the ILM is assembled on the motherboard.

115XLM and the manufacturer's insignia can be ink stamped or laser marked on the side wall.

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Independent Loading Mechanism (ILM)

4.5ILM Cover

Intel has developed an ILM Cover that will snap onto the ILM for the LGA115x socket family. The ILM cover is intended to reduce the potential for socket contact damage from operator and customer fingers being close to the socket contacts to remove or install the pick and place cap. The ILM Cover concept is shown in Figure 4-6.

The ILM Cover is intended to be used in place of the pick and place cover once the ILM is assembled to the motherboard. The ILM will be offered with the ILM Cover pre assembled as well as offered as a discrete component.

ILM Cover features:

Pre-assembled by the ILM vendors to the ILM load plate. It will also be offered as a discrete component.

The ILM cover will pop off if a processor is installed in the socket, and the ILM Cover and ILM are from the same manufacturer.

ILM Cover can be installed while the ILM is open.

Maintain compatibility between validated ILM vendors for LGA115x socket, with the exception noted below1.

The ILM cover for the LGA115x socket will have a flammability rating of V-2 per UL 60950-1.

Note: The ILM Cover pop off feature is not supported if the ILM Covers are interchanged on different vendor’s ILMs.

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Independent Loading Mechanism (ILM)

Figure 4-6. ILM Cover

Step 1: PnP Cover installed

 

during ILM assembly

Step 2: Remove PnP Cover

Step 3: Close ILM

As indicated in Figure 4-6, the pick and place cover should remain installed during ILM assembly to the motherboard. After assembly, the pick and place cover is removed, and the ILM mechanism (with the ILM cover installed) closed to protect the contacts. The ILM Cover is designed to pop off if the pick and place cover is accidentally left in place and the ILM closed with the ILM Cover installed. This is shown in Figure 4-7.

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Independent Loading Mechanism (ILM)

Figure 4-7. ILM Cover and PnP Cover Interference

As indicated in Figure 4-7, the pick and place cover cannot remain in place and used in conjunction with the ILM Cover. The ILM Cover is designed to interfere and pop off if the pick and place cover is unintentionally left in place. The ILM cover will also interfere and pop off if the ILM is closed with a processor in place in the socket.

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Thermal/Mechanical Specifications and Design Guidelines

LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications

5LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications

This chapter describes the electrical, mechanical and environmental specifications for the LGA1155 socket and the Independent Loading Mechanism.

5.1

Component Mass

 

Table 5-1. Socket Component Mass

 

 

 

 

 

Component

Mass

 

 

 

 

Socket Body, Contacts and PnP Cover

10 g

 

 

 

 

ILM Cover

29 g

 

 

 

 

ILM Back Plate

38 g

 

 

 

5.2 Package/Socket Stackup Height

Table 5-2 provides the stackup height of a processor in the 1155-land LGA package and LGA1155 socket with the ILM closed and the processor fully seated in the socket.

Table 5-2. 1155-land Package and LGA1155 Socket Stackup Height

Component

Stackup Height

Note

 

 

 

Integrated Stackup Height (mm)

7.781 ± 0.335 mm

2

From Top of Board to Top of IHS

 

 

 

 

 

Socket Nominal Seating Plane Height

3.4 ± 0.2 mm

1

 

 

 

Package Nominal Thickness (lands to top of IHS)

4.381 ± 0.269 mm

1

 

 

 

Notes:

1.This data is provided for information only, and should be derived from: (a) the height of the socket seating plane above the motherboard after reflow, given in Appendix C, (b) the height of the package, from the package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that are given in the corresponding processor data sheet.

2.The integrated stackup height value is a RSS calculation based on current and planned processors that will use the ILM design.

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LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications

5.3Loading Specifications

The socket will be tested against the conditions listed in Chapter 11 with heatsink and the ILM attached, under the loading conditions outlined in this section.

Table 5-3 provides load specifications for the LGA1155 socket with the ILM installed. The maximum limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Exceeding these limits during test may result in component failure. The socket body should not be used as a mechanical reference or load-bearing surface for thermal solutions.

Table 5-3. Socket & ILM Mechanical Specifications

Parameter

Min

Max

Notes

 

 

 

 

ILM static compressive load on processor IHS

311 N [70 lbf]

600 N [135 lbf]

3, 4, 7, 8

 

 

 

 

Heatsink static compressive load

0 N [0 lbf]

222 N [50 lbf]

1, 2, 3

 

 

 

 

Total static compressive Load

311 N [70 lbf]

822 N [185 lbf]

3, 4, 7, 8

(ILM plus Heatsink)

 

 

 

 

 

 

 

Dynamic Compressive Load

N/A

712 N [160 lbf]

1, 3, 5, 6

(with heatsink installed)

 

 

 

 

 

 

 

Pick & Place cover insertion force

N/A

10.2 N [2.3 lbf]

-

 

 

 

 

Pick & Place cover removal force

2.2N [0.5 lbf]

7.56 N [1.7 lbf]

9

 

 

 

 

Load lever actuation force

N/A

20.9 N [4.7 lbf] in the

-

 

 

vertical direction

 

 

 

10.2 N [2.3 lbf] in the

 

 

 

lateral direction.

 

 

 

 

 

Maximum heatsink mass

N/A

500g

10

 

 

 

 

Notes:

1.These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface.

2.This is the minimum and maximum static force that can be applied by the heatsink and it’s retention solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated to these limits.

3.Loading limits are for the LGA1155 socket.

4.This minimum limit defines the static compressive force required to electrically seat the processor onto the socket contacts. The minimum load is a beginning of life load.

5.Dynamic loading is defined as a load a 4.3 m/s [170 in/s] minimum velocity change average load superimposed on the static load requirement.

6.Test condition used a heatsink mass of 500 gm [1.102 lb.] with 50 g acceleration (table input) and an assumed 2X Dynamic Acceleration Factor (DAF). The dynamic portion of this specification in the product application can have flexibility in specific values. The ultimate product of mass times acceleration plus static heatsink load should not exceed this limit.

7.The maximum BOL value and must not be exceeded at any point in the product life.

8.The minimum value is a beginning of life loading requirement based on load degradation over time.

9.The maximum removal force is the flick up removal upwards thumb force (measured at 45o), not applicable to SMT operation for system assembly. Only the minimum removal force is applicable to vertical removal in SMT operation for system assembly.

10.The maximum heatsink mass includes the heatsink, screws, springs, rings and cups. This mass limit is evaluated using the heatsink attach to the PCB.

5.4Electrical Requirements

LGA1155 socket electrical requirements are measured from the socket-seating plane of the processor to the component side of the socket PCB to which it is attached. All specifications are maximum values (unless otherwise stated) for a single socket contact, but includes effects of adjacent contacts where indicated.

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