Intel DCCP847DYE, DCP847SKE Specification

Intel® Next Unit of Computing Board DCP847SKE

Technical Product Specification

January 2013

Order Number: G81548-002

The Intel Next Unit of Computing Board DCP847SKE may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Next Unit of Computing Board DCP847SKE Specification Update.

Revision History

Revision Revision History Date

001 First release of the Intel® Next Unit of Computing Board DCP847SKE

Technical Product Specification

002 Specification clarification January 2013

This product specification applies to only the standard Intel® Next Unit of Computing Board with BIOS identifier GKPPT10H.86A.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

All Intel use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by Intel.

Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

Intel Next Unit of Computing Boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.

Intel and Intel Celeron are trademarks of Intel Corporation in the U.S. and/or other countries.

* Other names and brands may be claimed as the property of others.

Next Unit of Computing Boards are evaluated as Information Technology Equipment (I.T.E.) for

January 2013

Board Identification Information

AA Revision

BIOS Revision

Notes

Device

Stepping

S-Spec Numbers

Basic Intel® Next Unit of Computing Board DCP847SKE Identification Information

G79416-101 GKPPT10H.86A.0026 1,2

G79416-104 GKPPT10H.86A.0036 1,2

Notes:

1. The AA number is found on a small label on the component side of the board.

2. The Intel of the following components:

Intel Celeron 847 Q0 SR08N

Intel BD82QS77 C1 SLI8B

QS77 PCH and Intel® Celeron® processor 847 used on this AA revision consists

Specification Changes or Clarifications

Table 1 indicates the Specification Changes or Specification Clarifications that apply to the Intel

Desktop Board DCP847SKE.

Table 1. Specification Changes or Clarifications

Date Type of Change Description of Changes or Clarifications

January 2013 Spec Clarification Deleted the note in Section 3.8 on page 60 regarding removing

power before setting or clearing the hard disk drive password.

Errata

Current characterized errata, if any, are documented in a separate Specification Update. See http://developer.intel.com/products/desktop/motherboard/index.htm for the latest documentation.

iii

Intel Desktop Board DCP847SKE Technical Product Specification

Preface

A description of the hardware used on Intel Next Unit of Computing Board 2

A map of the resources of the Intel Next Unit of Computing Board

The features supported by the BIOS Setup program

A description of the BIOS error messages, beep codes, and POST codes

Regulatory compliance and battery disposal information

This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for Intel of Computing Board DCP847SKE.

Intended Audience

The TPS is intended to provide detailed, technical information about Intel Next Unit of Computing Board DCP847SKE and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

Chapter Description

DCP847SKE

Next Unit

Typographical Conventions

This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board DCP847SKE Technical Product Specification

Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#)

GB Gigabyte (1,073,741,824 bytes)

GB/s Gigabytes per second

Gb/s Gigabits per second

KB Kilobyte (1024 bytes)

Kb Kilobit (1024 bits)

kb/s 1000 bits per second

MB Megabyte (1,048,576 bytes)

MB/s Megabytes per second

Mb Megabit (1,048,576 bits)

Mb/s Megabits per second

TDP Thermal Design Power

xxh An address or data value ending with a lowercase h indicates a hexadecimal value.

x.x V Volts. Voltages are DC unless otherwise specified.

* This symbol is used to indicate third-party brands and names that are the property of their

respective owners.

Contents

Revision History

Board Identification Information .................................................................. iii

Errata ...................................................................................................... iii

Preface

Intended Audience ..................................................................................... v

What This Document Contains ..................................................................... v

Typographical Conventions ......................................................................... v

1 Product Description

1.1 Overview ......................................................................................... 11

1.1.1 Feature Summary ................................................................. 11

1.1.2 Board Layout (Top) ............................................................... 13

1.1.3 Board Layout (Bottom) .......................................................... 15

1.1.4 Block Diagram ...................................................................... 17

1.2 Online Support ................................................................................. 18

1.3 Processor ........................................................................................ 18

1.4 System Memory ............................................................................... 19

1.4.1 Memory Configurations .......................................................... 20

1.5 Intel

1.6 Graphics Subsystem ......................................................................... 22

1.7 SATA Interface ................................................................................. 24

1.8 Real-Time Clock Subsystem ............................................................... 25

1.9 LAN Subsystem ................................................................................ 25

1.10 Hardware Management Subsystem ..................................................... 28

1.11 Power Management .......................................................................... 30

QS77 Express Chipset .............................................................. 22

1.5.1 Direct Media Interface (DMI) .................................................. 22

1.5.2 Display Interfaces ................................................................. 22

1.6.1 Integrated Graphics ............................................................... 22

1.6.2 USB ..................................................................................... 24

1.7.1 AHCI Mode ........................................................................... 24

1.9.1 Intel

82579V Gigabit Ethernet Controller ................................ 26

1.9.2 LAN Subsystem Software ....................................................... 26

1.9.3 RJ-45 LAN Connector with Integrated LEDs .............................. 27

1.10.1 Hardware Monitoring ............................................................. 28

1.10.2 Fan Monitoring ...................................................................... 28

1.10.3 Thermal Solution ................................................................... 29

1.11.1 ACPI .................................................................................... 30

1.11.2 Hardware Support ................................................................. 32

vii

Intel Desktop Board DCP847SKE Technical Product Specification

2 Technical Reference

2.1 Memory Resources ........................................................................... 35

2.1.1 Addressable Memory ............................................................. 35

2.1.2 Memory Map ......................................................................... 37

2.2 Connectors and Headers .................................................................... 37

2.2.1 Back Panel Connectors ........................................................... 38

2.2.2 Connectors and Headers (Bottom) ........................................... 39

2.3 BIOS Setup Configuration Jumper ....................................................... 46

2.4 Mechanical Considerations ................................................................. 48

2.4.1 Form Factor .......................................................................... 48

2.5 Electrical Considerations .................................................................... 49

2.5.1 Power Supply Considerations .................................................. 49

2.5.2 Fan Header Current Capability ................................................ 50

2.6 Thermal Considerations ..................................................................... 50

2.7 Reliability......................................................................................... 53

2.8 Environmental .................................................................................. 53

3 Overview of BIOS Features

3.1 Introduction ..................................................................................... 55

3.2 BIOS Flash Memory Organization ........................................................ 56

3.3 System Management BIOS (SMBIOS) ................................................. 56

3.4 Legacy USB Support ......................................................................... 56

3.5 BIOS Updates .................................................................................. 57

3.5.1 Language Support ................................................................. 57

3.5.2 Custom Splash Screen ........................................................... 58

3.6 BIOS Recovery ................................................................................. 58

3.7 Boot Options .................................................................................... 59

3.7.1 Network Boot ........................................................................ 59

3.7.2 Booting Without Attached Devices ........................................... 59

3.7.3 Changing the Default Boot Device During POST ......................... 59

3.8 Hard Disk Drive Password Security Feature .......................................... 60

3.9 BIOS Security Features ..................................................................... 61

4 Error Messages and Blink Codes

4.1 Front-panel Power LED Blink Codes ..................................................... 63

4.2 BIOS Error Messages ........................................................................ 63

4.3 Port 80h POST Codes ........................................................................ 64

5 Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance ...................................................................... 71

5.1.1 Safety Standards................................................................... 71

5.1.2 European Union Declaration of Conformity Statement ................ 72

5.1.3 Product Ecology Statements ................................................... 73

5.1.4 EMC Regulations ................................................................... 75

viii

Contents

5.1.5 ENERGY STAR* 5.2, e-Standby, and ErP Compliance ................. 78

5.1.6 Regulatory Compliance Marks (Board Level) ............................. 79

5.2 Battery Disposal Information .............................................................. 80

Figures

1. Major Board Components (Top) .......................................................... 13

2. Major Board Components (Bottom) ..................................................... 15

3. Block Diagram .................................................................................. 17

4. Memory Channel and SO-DIMM Configuration ...................................... 21

5. LAN Connector LED Locations ............................................................. 27

6. Thermal Solution and Fan Header ....................................................... 29

7. Location of the Standby Power LED ..................................................... 34

8. Detailed System Memory Address Map ................................................ 36

9. Back Panel Connectors ...................................................................... 38

10. Connectors and Headers (Bottom) ...................................................... 39

11. Connection Diagram for Front Panel Header ......................................... 44

12. Connection Diagram for Front Panel USB 2.0 Dual-Port Header............... 45

13. Location of the BIOS Configuration Setup Jumper ................................. 46

14. Board Dimensions ............................................................................. 48

15. Localized High Temperature Zones ..................................................... 51

Tables

1. Feature Summary ............................................................................. 11

2. Components Shown in Figure 1 .......................................................... 14

3. Components Shown in Figure 2 .......................................................... 16

4. Supported Memory Configurations ...................................................... 19

5. LAN Connector LED States ................................................................. 27

6. Effects of Pressing the Power Switch ................................................... 30

7. Power States and Targeted System Power ........................................... 31

8. Wake-up Devices and Events ............................................................. 32

9. System Memory Map ........................................................................ 37

10. Connectors and Headers Shown in Figure 10 ........................................ 40

11. PCI Express Full-Mini Card Connector .................................................. 41

12. Dual-Port Front Panel USB 2.0 Header ................................................. 42

13. 19 V Internal Power Supply Connector ................................................ 43

14. Front Panel Header ........................................................................... 43

15. States for a One-Color Power LED ....................................................... 44

16. BIOS Setup Configuration Jumper Settings .......................................... 47

17. Fan Header Current Capability ............................................................ 50

18. Thermal Considerations for Components .............................................. 52

19. Tcontrol Values for Components

20. Environmental Specifications .............................................................. 53

21. AccepDrives/Media Types for BIOS Recovery ....................................... 58

22. Boot Device Menu Options ................................................................. 59

......................................................... 5

Intel Desktop Board DCP847SKE Technical Product Specification

23. Master Key and User Hard Drive Password Functions ............................ 60

24. Supervisor and User Password Functions ............................................. 61

25. Front-panel Power LED Blink Codes ..................................................... 63

26. BIOS Error Messages ........................................................................ 63

27. Port 80h POST Code Ranges .............................................................. 64

28. Port 80h POST Codes ........................................................................ 65

29. Typical Port 80h POST Sequence ........................................................ 69

30. Safety Standards .............................................................................. 71

31. EMC Regulations ............................................................................... 75

32. Regulatory Compliance Marks ............................................................ 79

4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters)

• Soldered-down Intel® Celeron® processor 847 with up to 17 W TDP

• Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Module

Intel

QS77 Express Chipset consisting of the Intel® QS77 Express Platform

• Integrated graphics support for processors with Intel® Graphics Technology:

• USB 2.0 ports:

• One PCI Express Half-Mini Card connector

• Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 2 summarizes the major features of the board.

Table 2. Feature Summary

Form Factor

Processor

― Integrated graphics ― Integrated memory controller

Memory

Chipset

Graphics

Audio Intel® High Definition Audio via the HDMI v1.4a interfaces

Peripheral Interfaces

Expansion Capabilities

BIOS

(SO-DIMM) sockets

• Support for DDR3 1333 MHz and DDR3 1066 MHz SO-DIMMs

• Support for 1 Gb, 2 Gb, and 4 Gb memory technology

• Support for up to 16 GB of system memory with two SO-DIMMs using 4 Gb

memory technology

• Support for non-ECC memory

• Support for 1.35 V low voltage JEDEC memory

Controller Hub (PCH)

― Two High Definition Multimedia Interface* (HDMI*) back panel connectors

― Three front panel ports (via one dual-port internal header and one front

panel connector)

― Two ports are implemented with vertical back panel connectors ― One port is reserved for the PCI Express* Half-Mini Card ― One port is reserved for the PCI Express Full-Mini Card

• SATA port:

― One internal mSATA port (PCI Express Full-Mini Card) for SSD support

• One PCI Express Full-Mini Card connector

• Support for Advanced Configuration and Power Interface (ACPI), Plug and

Play, and System Management BIOS (SMBIOS)

continued

Intel Desktop Board DCP847SKE Technical Product Specification

Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel

82579V Gigabit

Table 2. Feature Summary (continued)

LAN Support

Hardware Monitor Subsystem

Ethernet Controller

Hardware monitoring subsystem, based on a Nuvoton NPCE791C embedded controller, including:

• Voltage sense to detect out of range power supply voltages

• Thermal sense to detect out of range thermal values

• One processor fan header

• Fan sense input used to monitor fan activity

• Simple fan speed control

Product Description

1.1.2 Board Layout (Top)

Figure 1 shows the location of the major components on the top-side of Intel Next Unit of Computing Board DCP847SKE.

Figure 1. Major Board Components (Top)

Intel Desktop Board DCP847SKE Technical Product Specification

Table 3 lists the components identified in Figure 1.

Table 3. Components Shown in Figure 1

Item from Figure 1 Description

A Battery

B Standby power LED

C Processor fan header

D Onboard power button

E Power LED

F Hard Disk Drive LED

G Thermal solution

Product Description

1.1.3 Board Layout (Bottom)

Figure 2 shows the location of the major components on the bottom-side of Intel Next Unit of Computing Board DCP847SKE.

Figure 2. Major Board Components (Bottom)

Intel Desktop Board DCP847SKE Technical Product Specification

Table 4. Components Shown in Figure 2

Item from Figure 2

A Back panel connectors

B PCI Express Full-Mini Card connector

C PCI Express Half-Mini Card connector

D Front panel dual-port USB 2.0 header

E BIOS setup configuration jumper

F Front panel USB 2.0 connector

G Front panel header

H DDR3 SO-DIMM 2 socket

I DDR3 SO-DIMM 1 socket

J Internal DC power connector

Description

1.1.4 Block Diagram

Figure 3 is a block diagram of the major functional areas of the board.

Product Description

Figure 3. Block Diagram

Intel Desktop Board DCP847SKE Technical Product Specification

To find information about…

Visit this World Wide Web site:

1.2 Online Support

Intel Next Unit of Computing Board DCP847SKE

Next Unit of Computing Board Support http://www.intel.com/p/en_US/support?iid=hdr+support

Available configurations for Intel Next Unit of Computing Board DCP847SKE

Chipset information http://www.intel.com/products/desktop/chipsets/index.htm

BIOS and driver updates http://downloadcenter.intel.com

Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-

Integration information http://www.intel.com/support/go/buildit

http://www.intel.com/products/motherboard/index.htm

http://ark.intel.com

025414.htm

1.3 Processor

The board has a soldered-down Intel Celeron processor 847 with Integrated Graphics Technology and integrated memory controller.

NOTE

This board has specific requirements for providing power to the processor. Refer to Section 2.5.1 on page 49 for information on power supply requirements for this board.

Product Description

Version

Capacity

Technology

Organization

Devices

1.4 System Memory

The board has two 204-pin SO-DIMM sockets and supports the following memory features:

• 1.5 V DDR3 SDRAM SO-DIMMs with gold plated contacts

• Support for 1.35 V Low Voltage DDR3 (new JEDEC specification)

• Two independent memory channels with interleaved mode support

• Unbuffered, single-sided or double-sided SO-DIMMs

• 16 GB maximum total system memory (with 4 Gb memory technology). Refer to

Section 2.1.1 on page 35 for information on the total amount of addressable memory.

• Minimum recommended total system memory: 1024 MB

• Non-ECC SO-DIMMs

• Serial Presence Detect

• XMP profile support for voltage detection

• DDR3 1333 MHz and DDR3 1066 MHz SDRAM SO-DIMMs

NOTE

To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with SO-DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the SO-DIMMs may not function under the determined frequency.

Table 5 lists the supported SO-DIMM configurations.

Table 5. Supported Memory Configurations

Raw Card

Note: System memory configurations are based on availability and are subject to change.

SO-DIMM

1 GB 1 Gb 64 M x 16 8

2 GB 2 Gb 128 M x 16 8

1 GB 1 Gb 128 M x 8 8

2 GB 2 Gb 256 M x 8 8

512 MB 1 Gb 64 M x 16 4

1 GB 2 Gb 128 M x 16 4

2 GB 1 Gb 128 M x 8 16

4 GB 2 Gb 256 M x 8 16

8 GB 4 Gb 512 M x 8 16

DRAM Device

DRAM

# of DRAM

Intel Desktop Board DCP847SKE Technical Product Specification

For information about…

Refer to:

Tested Memory http://support.intel.com/support/motherboards/desktop/sb

/CS-025414.htm

1.4.1 Memory Configurations

The processor supports the following types of memory organization:

• Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both SO-DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed SO-DIMMs are used between channels, the slowest memory timing will be used.

• Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth operation for real world applications. This mode is used when only a single SO-DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed SO-DIMMs are used between channels, the slowest memory timing will be used.

For information about… Refer to:

Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-

011965.htm

Product Description

Figure 4 illustrates the memory channel and SO-DIMM configuration.

Figure 4. Memory Channel and SO-DIMM Configuration

Intel Desktop Board DCP847SKE Technical Product Specification

1.5 Intel® QS77 Express Chipset

Intel QS77 Express Chipset with Direct Media Interface (DMI) interconnect provides interfaces to the processor and the USB, SATA, LPC, LAN, and PCI Express interfaces. The Intel QS77 Express Chipset is a centralized controller for the board’s I/O paths.

For information about Refer to

The Intel QS77 chipset http://www.intel.com/products/desktop/chipsets/index.htm

Resources used by the chipset Chapter 2

1.5.1 Direct Media Interface (DMI)

Direct Media Interface (DMI) is the chip-to-chip connection between the processor and PCH. This high-speed interface integrates advanced priority-based servicing allowing for concurrent traffic and true isochronous transfer capabilities.

1.5.2 Display Interfaces

Display is divided between the processor and the PCH. The processor houses the memory interface, display planes, and pipes while the PCH has transcoder and display interface or ports. The PCH receives the display data over Intel Interface (Intel and sends the data through the display interface.

1.5.2.1 Intel

Intel FDI connects the display engine in the processor with the display interfaces on the PCH. The display data from the frame buffer is processed in the display engine of the processor and sent to the PCH over the Intel FDI where it is transcoded as per the display protocol and driven to the display monitor.

FDI) and transcodes the data as per the display technology protocol

Flexible Display Interconnect (Intel

Flexible Display

FDI)

1.5.2.2 High-bandwidth Digital Content Protection (HDCP)

HDCP is the technology for protecting high definition content against unauthorized copy or unreceptive between a source (computer, digital set top boxes, etc.) and the sink (panels, monitor, and TVs). The PCH supports HDCP 1.4 for content protection over wired displays (HDMI).

1.6 Graphics Subsystem

The board supports graphics through Intel Graphics Technology.

1.6.1 Integrated Graphics

The board supports integrated graphics through Intel FDI.

1.6.1.1 Intel® High Definition (Intel® HD) Graphics

The Intel HD graphics controller features the following:

• 3D Features  DirectX* 10.1 and OpenGL* 3.0 compliant  DirectX 11.0 CS4.0 only  Shader Model 4.0

• Video  High-Definition content at up to 1080p resolution  Hardware accelerated MPEG-2, VC-1/WMV and H.264/AVC Hi-Definition video

formats

 Intel HD Technology with Advanced Hardware Video Transcoding  Blu-ray* S3D via HDMI 1.4a  Dynamic Video Memory Technology (DVMT) 5.0 support  Support of up to 1.7 GB Video Memory with 4 GB and above system memory

configuration

1.6.1.2 Video Memory Allocation

Product Description

Intel® Dynamic Video Memory Technology (DVMT) is a method for dynamically allocating system memory for use as graphics memory to balance 2D/3D graphics and system performance. If your computer is configured to use DVMT, graphics memory is allocated based on system requirements and application demands (up to the configured maximum amount). When memory is no longer needed by an application, the dynamically allocated portion of memory is returned to the operating system for other uses.

1.6.1.3 High Definition Multimedia Interface* (HDMI*)

The two HDMI ports support standard, enhanced, or high definition video, plus multichannel digital audio on a single cable. Each port is compatible with all ATSC and DVB HDTV standards and supports eight full range channels at 24-bit/96 kHz audio of lossless audio formats such as Dolby* TrueHD or DTS* HD Master Audio. The maximum supported resolution is 1920 x 1200 (WUXGA). The HDMI port is compliant with the HDMI 1.4a specification.

1.6.1.3.1 Integrated Audio Provided by the HDMI Interfaces

The following audio technologies are supported by the HDMI 1.4a interfaces directly from the PCH:

• AC-3 - Dolby* Digital

• Dolby Digital Plus

• DTS-HD*

• LPCM, 192 kHz/24-bit, 8 Channel

NOTE

The PCH only supports one audio stream at a time over HDMI. Dual audio signals are not supported.

Intel Desktop Board DCP847SKE Technical Product Specification

For information about

Refer to

1.6.2 USB

The board supports seven USB 2.0 ports. The port arrangement is as follows:

• Three front panel ports (via one dual-port internal header and one front panel connector)

• Two ports are implemented with vertical back panel connectors

• One port is reserved for the PCI Express Half-Mini Card

• One port is reserved for the PCI Express Full-Mini Card

All seven USB 2.0 ports are high-speed, full-speed, and low-speed capable.

NOTE

Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use a shielded cable that meets the requirements for full-speed devices.

The location of the USB connectors on the back panel Figure 9, page 38

The location of the front panel USB headers Figure 2, page 15

1.7 SATA Interface

The board provides one internal mSATA port (PCI Express Full-Mini Card connector) for SSD support.

The PCH provides independent SATA ports with a theoretical maximum transfer rate of 6 Gb/s. A point-to-point interface is used for host to device connections.

The underlying SATA functionality is transparent to the operating system. The SATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using Windows operating systems.

1.7.1 AHCI Mode

The board supports AHCI storage mode via the Intel QS77 Express Chipset.

NOTE

In order to use AHCI mode, AHCI must be enabled in the BIOS. Also, during Microsoft Windows XP installation, F6 must be pressed to install the AHCI drivers. See your Microsoft Windows XP documentation for more information about installing drivers during installation. Microsoft Windows 7 includes the necessary AHCI drivers without the need to install separate AHCI drivers during the operating system installation process, however, it is always good practice to update the AHCI drivers to the latest available by Intel.

Product Description

For information about

Refer to

1.8 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied via the power supply 5 V STBY rail.

NOTE

If the battery and AC power fail, date and time values will be reset and the user will be notified during the POST.

When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.

1.9 LAN Subsystem

The LAN subsystem consists of the following:

• Intel 82579V Gigabit Ethernet Controller (10/100/1000 Mb/s)

• Intel QS77 Express Chipset

• RJ-45 LAN connector with integrated status LEDs

Additional features of the LAN subsystem include:

• CSMA/CD protocol engine

• Jumbo frame support

• LAN connect interface between the PCH and the LAN controller

• Power management capabilities  ACPI technology support  LAN wake capabilities

• LAN subsystem software

LAN software and drivers http://downloadcenter.intel.com

Intel Desktop Board DCP847SKE Technical Product Specification

For information about

Refer to

1.9.1 Intel® 82579V Gigabit Ethernet Controller

The Intel 82579V Gigabit Ethernet Controller supports the following features:

• 10/100/1000 BASE-T IEEE 802.3 compliant

• Energy Efficient Ethernet (EEE) IEEE802.3az support (Low Power Idle (LPI) mode)

• Dual interconnect between the Integrated LAN Controller and the Physical Layer

(PHY):

 PCI Express-based interface for active state operation (S0) state  SMBUS for host and management traffic (Sx low power state)

• Compliant to IEEE 802.3x flow control support

• 802.1p and 802.1q

• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)

• Full device driver compatibility

1.9.2 LAN Subsystem Software

LAN software and drivers are available from Intel’s World Wide Web site.

Obtaining LAN software and drivers http://downloadcenter.intel.com

+ 58 hidden pages

Intel DCCP847DYE, DCP847SKE Specification

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