Intel D53427RKE, DC53427HYE Specification

Intel® NUC Board D53427RKE

Technical Product Specification

May 2013

Order Number: G97389-001

The Intel NUC Board D53427RKE may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel NUC Board D53427RKE Specification Update.

Revision History

Revision Revision History Date

001 First release of the Intel® NUC Board D53427RKE Technical Pro d uc t

Specification

Disclaimer

This product spec ification applies to only the standard In tel® NUC Board with BIOS identifier RKPPT10H.86A.

INFORMATION IN THIS DOCUMENT IS PROVIDED I N C ONNEC TION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPER TY R IGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATI NG TO FI TNESS FOR A PARTIC U LA R PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, CO PY R IGHT OR OTHER IN TELLECTU A L PR O PERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE O F THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJUR Y OR DEATH MAY OCCUR.

All Intel computers (PC) fo r installation in homes, offices, schools, co mputer rooms, and si mila r locations. The suitability of this pr o duct for other PC or embedded no n-PC ap plications or other e nv ironments, such as medical, industrial, alarm systems, test equipment, e tc . ma y not be supported w ithout further evaluation b y Intel.

Intel Corporation may have patents o r pending patent applic a tio ns , trademarks, cop y rights, or other intellectual proper ty rights that relate to the p resented subject matte r. The furnishing of d ocuments and other materials and inf ormation does not p rovide any license , e x press or implied , by estoppel or otherwise, to any such patents, trad e marks, copyrig hts , o r other intellectual property rights.

Intel may make change s to specifications and product descr ip ti o ns at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”

or “undefined.” Intel reserves the s e for future def inition and shall have no resp onsibility whatsoever for conflicts or inco mpatibilities arising from future changes to the m .

Intel NUC Boards may contain design def e c ts o r errors kno w n a s errata, which may cause the product to deviate from p ub lis he d specifications. C ur rent characterized errata are available o n request.

Contact your local Intel sales office o r your distributor to obtain the latest sp e c ifications befor e p lac i ng y our product order.

Intel and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries . * Other names and b rands may be claimed a s the property of others. Copyright  2013, Intel Corpor ation. All rights reser v e d.

NUC Boards are e v al uate d as Information Techno l o gy Equipment (I.T.E.) fo r use in personal

May 2013

Board Identification Information

Basic Intel® NUC Board D53427RKE Identification Information

AA Revision BIOS Revision Notes

G87790-400 RKPPT10H.86A.0017 1,2 Notes:

1. The AA number is fo und on a small label on the comp o ne nt s ide of the board.

2. The Intel of the following c o m p onents:

Device Stepping S-Spec Numbers

Intel Core i5-3427U L1 SR0N7 Intel BD82QS77 C1 5A002U

QS77 PCH and Intel® Core™ i5-3427U processor used on this AA revision consists

Errata

Current characterized errata, if any, are documented in a separate Specification Update. See www.intel.com/nextunitofcomputing

for the latest documentation.

iii

Intel NUC D53427RKE Technical Product Specification

Preface

The features supported by the BIOS Setup program

This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for Intel Board D53427RKE.

Intended Audience

The TPS is intended to provide detailed, technical information about Intel NUC Board D53427RKE and its components to the vendors, system integrators, and o ther engineers and technician s who n eed this level of information. It is specifically not intended for general audiences.

What This Document Contains

Chapter Description

1 A description of the hardwar e used on Intel NUC Board D53427RKE 2 A map of the resou r ces of the Intel NUC Board

4 A description of the BIOS error messa ges , beep c odes , and POST codes 5 Regulatory compliance and battery disposal information

NUC

Typographical Conventions

This section cont ains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications o f this type.

Notes, Cautions, and Warnings

NOTE

Notes call attentio n to important information.

CAUTION

Cautions are included to help you avoid damaging hard w are or losing data.

Intel NUC D53427RKE Technical Product Specification

Other Common Notation

# Used after a signal na me to identify an active-low s ig na l (s uc h as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second KB Kilobyte (1024 bytes) Kb Kilob it (1024 bits) kb/s 1000 bits per second MB Megabyte (1,048,576 bytes) MB/s Megabytes per second Mb Megabit (1,048 ,576 bits) Mb/s Megabits per second TDP Thermal Design Powe r xxh An address or d ata v al ue ending with a lowercase h ind i c ate s a he x a d e c im al value. x.x V Volts. Voltages are DC unless otherwise specified. * This symbol is used to indicate third-party brands and names that are the p roperty of thei r

respective owners.

Contents

Revision History

Disclaimer ................................................................................................ ii

Board Identification Information .................................................................. iii

Errata ...................................................................................................... iii

Preface

Intended Audience ..................................................................................... v

What This Document Contains ..................................................................... v

Typographical Conventions ......................................................................... v

1 Product Description

1.1 Overview ......................................................................................... 11

1.1.1 Feature Summary ................................................................. 11

1.1.2 Board Layout (Top) ............................................................... 13

1.1.3 Board Layout (Bottom) .......................................................... 15

1.1.4 Block Diagram ...................................................................... 17

1.2 Online Support ................................................................................. 18

1.3 Processor ........................................................................................ 18

1.4 System Memory ............................................................................... 19

1.4.1 Memory Configurations .......................................................... 20

1.5 Intel

1.6 Graphics Subsystem ......................................................................... 23

1.7 Real-Time Clock Subsyst em ............................................................... 26

1.8 LAN Subsystem ................................................................................ 26

1.9 Hardware Management Subsystem ..................................................... 29

1.10 Power Management .......................................................................... 31

1.11 Intel

QS77 Express Chipset .............................................................. 22

1.5.1 Direct Media Interface (DMI) .................................................. 22

1.5.2 Display Interfaces ................................................................. 22

1.6.1 Integrated Graphics ............................................................... 23

1.6.2 USB ..................................................................................... 25

1.6.3 AHCI Mode ........................................................................... 25

1.8.1 Intel

82579LM Gigabit Ethernet Controller .............................. 27

1.8.2 LAN Subsystem Software ....................................................... 27

1.8.3 RJ-45 LAN Connector with Integrated LEDs .............................. 28

Hardware Monitoring ............................................................. 29

1.9.1

1.9.2 Fan Monitoring ...................................................................... 29

1.9.3 Thermal Solution ................................................................... 30

1.10.1 ACPI .................................................................................... 31

1.10.2 Hardware Support ................................................................. 33

Security and Manageability Technologies .................................... 36

1.11.1 Intel

1.11.2 Intel

vPro™ Technology ........................................................ 36

Small Busi n ess Techn ology ............................................ 39

vii

Intel NUC D53427RKE Technical Product Specification

2 Technical Reference

2.1 Memory Resources ........................................................................... 41

2.1.1 Addressable Memory ............................................................. 41

2.2 Connectors and Headers .................................................................... 42

2.2.1 Back Panel Connectors ........................................................... 43

2.2.2 Connectors and Headers (Bottom) ........................................... 44

2.3 BIOS Setup Configuration Jumper ....................................................... 52

2.4 Intel

Management Engine BIOS Extension (Intel® MEBX) Reset Header . 53

2.5 Mechanical Considerations ................................................................. 55

2.5.1 Form Factor .......................................................................... 55

2.6 Electrical Considerations .................................................................... 56

2.6.1 Power Supply Considerations .................................................. 56

2.6.2 Fan Header Current Capability ................................................ 57

2.7 Thermal Considerations ..................................................................... 57

2.8 Reliability......................................................................................... 60

2.9 Environmental .................................................................................. 60

3 Overview of BIOS Features

3.1 Introduction ..................................................................................... 61

3.2 BIOS Flash Memory Organization ........................................................ 62

3.3 System Management BIOS (SMBIOS) ................................................. 62

3.4 Legacy USB Support ......................................................................... 62

3.5 BIOS Updates .................................................................................. 63

3.5.1 Language Support ................................................................. 63

3.5.2 Custom Splash Screen ........................................................... 64

3.6 BIOS Recovery ................................................................................. 64

3.7 Boot Options .................................................................................... 65

3.7.1 Network Boot ........................................................................ 65

3.7.2 Booting Without Attached Devices ........................................... 65

3.7.3 Changing the Default Boot Device During POST ......................... 65

3.8 Hard Disk Drive Password Security Feature .......................................... 66

BIOS Security Features ..................................................................... 67

3.9

4 Error Messages and Blink Codes

4.1 Front-panel Power LED Blink Codes ..................................................... 69

4.2 BIOS Error Messages ........................................................................ 69

5 Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance ...................................................................... 71

5.1.1 Safety Standards................................................................... 71

5.1.2 European Union Declaration of Conformity Statement ................ 72

5.1.3 Product Ecology Statements ................................................... 73

5.1.4 EMC Regulations ................................................................... 74

5.1.5 ENERGY STAR* 5.2, e-Standby, and ErP Compliance ................. 76

5.1.6 Regulatory Compliance Marks (Board Level) ............................. 77

5.2 Battery Disposal Information .............................................................. 78

viii

Contents

Figures

1. Major Board Components (Top) .......................................................... 13

2. Major Board Components (Bottom) ..................................................... 15

3. Block Diagram .................................................................................. 17

4. Memory Channel and SO-DIMM Configuration ...................................... 21

5. LAN Connector LED Locations ............................................................. 28

6. Thermal Solution and Fan Header ....................................................... 30

7. Location of the Standby Power LED ..................................................... 35

8. Back Panel Connectors ...................................................................... 43

9. Connectors and Headers (Bottom) ...................................................... 44

10. Connection Diagram for Front Panel Header ......................................... 50

11. Connection Diagram for Front Panel USB 2.0 Dual-Port Header............... 51

12. Location of the BIOS Configuration Setup Jumper ................................. 52

13. Intel MEBX Reset Header ................................................................... 54

14. Board Dimensions ............................................................................. 55

15. Localized High Temperature Zones ..................................................... 58

16. Intel Visual BIOS H om e Scr een .......................................................... 61

Tables

1. Feature Summary ............................................................................. 11

2. Components Shown in Figure 1 .......................................................... 14

3. Components Shown in Figure 2 .......................................................... 16

4. Supported Memory Configurations ...................................................... 19

5. Triple Display Configuration Resolutions .............................................. 24

6. LAN Connector LED States ................................................................. 28

7. Effects of Pressing the Power Switch ................................................... 31

8. Power States and Targeted System Power ........................................... 32

9. Wake-up Devices and Events ............................................................. 33

10. Connectors and Headers Shown in Figure 10 ........................................ 45

11. PCI Express Full-/

12. Dual-Port Front Panel USB 2.0 Header ................................................. 48

13. 19 V Internal Power Supply Connector ................................................ 49

14. Front Panel Header ........................................................................... 49

15. States for a One-Color Power LED ....................................................... 50

16. BIOS Setup Configuration Jumper Settings .......................................... 53

17. Intel MEBX Reset Header Signals ........................................................ 54

18. Fan Header Current Capability ............................................................ 57

19. Thermal Considerations for Components .............................................. 59

20. Tcontrol Values for Components ......................................................... 59

21. Environmental Specifications .............................................................. 60

22. Acceptable Drives/Media Types for BIOS Recovery ................................ 64

23. Boot Device Menu Options ................................................................. 65

24. Master Key and User Hard Drive Password Functions ............................ 66

25. Supervisor and User Password Functions ............................................. 67

26. Front-panel Power LED Blink Codes ..................................................... 69

Half-Mini Card Connector .......................................... 46

Intel NUC D53427RKE Technical Product Specification

27. BIOS Error Messages ........................................................................ 69

28. Safety Standards .............................................................................. 71

29. EMC Regulations ............................................................................... 74

30. Regulatory Compliance Marks ............................................................ 77

Intel

QS77 Express Chipset consisting of the Intel® QS77 Express Platf orm

Integrated gr aphics support for processo rs with Intel® Graphics Technology:

USB 2.0 ports:

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of the board.

Table 1. Feature Summary

Form Factor

Processor

Memory

Chipset

Graphics

Audio Intel® High Definition Audio via the HDMI v1.4a and Display Port 1.1a interfaces

Peripheral Interfaces

Expansion Capabilities

Intel® Visual BIOS

4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters)

• Soldered-down Intel® Core™ i5-3427U processor with up to 17 W TDP

― Integrated gra p hic s ― Integrated memo r y controller

• Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Mod ule (SO-DIMM) sockets

• Support for DDR3 1600 MHz and DDR3 1333 MHz SO-DIMMs

• Support for 1 Gb, 2 Gb, and 4 Gb memory technology

• Support for up to 16 GB of system memory with two SO-DIMMs using 4 Gb

memory technology

• Support for non-ECC memory

• Support for 1.35 V low voltage JEDEC memory

Controller Hub (PCH )

•

― One High Definitio n Multime dia Interface* (HDMI*) back panel connec tor ― Two mini DisplayPort* back panel connectors

through the PCH

•

― Two front panel p o rts are implemented through one dual-port inte rnal

header

― Two ports are im p le m e nte d w ith vertical back panel connectors ― One port is reserved for the PCI Express * Half-Mini Card ― One port is reserved for the PCI Expres s F ull -Mini Card

• One front panel USB 3.0 port is impl e me nte d through an external co nne c to r (blue)

• One PCI Express Half-Mini Card connector

• One PCI Express Full-Mini Card connector

• Intel® Visual BIOS r e s ident in the Serial Peripheral Interface (SPI) Flash

device

• Support for Advanced Conf i g uration and Power I nte r face (ACPI), Plug and Play, and System Management BIOS (SMBIOS)

continued

Intel NUC D53427RKE Technical Product Specification

Intel® Active Management Tec hno l o gy (Intel® AMT) 8.0

Table 1. Feature Summary (continued)

LAN Support

Hardware Monitor Subsystem

Intel® Security and Manageability Technologies

Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel Ethernet Controller

Hardware monitoring subsystem, based on a Nuvoton NCT5577D embedded controller, including:

• Voltage sense to detect out of range p ower supply voltages

• Thermal sense to detect out of range thermal values

• One processor fan header

• Fan sense input used to monitor fan activity

• Simple fan speed control

•

• Intel® Virtualization (Intel® VT)

• Intel

Virtualization for D irected I/O (Inte l® VT-d)

Trusted Execution Te c hnology (Intel® TXT)

Identity Protec ti o n Te c hnology (Intel® IPT)

Anti-Theft Technology (Intel® AT)

• Trusted Platform Module (TPM)

• Intel

Small Business Techno lo gy (Intel® SBT)

82579LM Gigabit

Product Description

1.1.2 Board Layout (Top)

Figure 1 shows the location of the major components on the top-side of Intel NUC Board D53427RKE.

Figure 1. Major Board Components (Top)

Intel NUC D53427RKE Technical Product Specification

Table 2 lists the components identified in Figure 1.

Table 2. Components Shown in Figure 1

Item from Figure 1 Description

A Standby power LED B Battery C Processor fan header D Onboard power button E Power LED F Hard Disk Drive LED G Thermal solution

Product Description

1.1.3 Board Layout (Bottom)

Figure 2 shows the location of the major components on the bottom-side of Intel NUC Board D53427RKE.

Figure 2. Major Board Components (Bottom)

Intel NUC D53427RKE Technical Product Specification

Table 3. Components Shown in Figure 2

Item from Figure 2

A Back panel connectors B PCI Express Full-Mini Card connector C PCI Express Half-Mini Card connector D Front panel dual-port USB 2.0 header E Fro nt panel USB 3.0 port F BIOS setup co nf i g uration jumper G Front panel header H Intel I DDR3 SO-DIMM 2 socket J DDR3 SO-DIMM 1 socket K Internal DC power connector

Description

Management Engine BIOS Extension (Intel

MEBX) Reset header

1.1.4 Block Diagram

Figure 3 is a block diagram of the major functional areas of the board.

Product Description

Figure 3. Block Diagram

Intel NUC D53427RKE Technical Product Specification

1.2 Online Support

To find information about… Visit this World Wide Web site:

Intel NUC Board D53427RKE http://www.intel.com/products/motherboard/index.htm NUC Board Support http://www.intel.com/p/en_US/support?iid=hdr+support Available config ur a tio ns for Intel NUC

Board D53427RKE Chipset informatio n

BIOS and driver updates http://downloadcenter.intel.com Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-

Integration info r m ation http://www.intel.com/support/go/buildit

http://ark.intel.com

https://wwwssl.intel.com/content/www/us/en/chipsets/performancechipsets/chipsets.html

025414.htm

1.3 Processor

The board has a soldered-down Intel Core i5-3427 processor with Integrated Graphics Technology and integrated memory controller.

NOTE

This board has specific requirements for providing power to the processor. Refer to Section 2.5.1 on page 56 for information on power supply requirements for this board.

Product Description

Capacity

Configuration

Density

Front-side/Back-side

Devices

2048 MB

1 Gbit

128 M x8/128 M x8

2048 MB

2 Gbit

256 M x8/empty

4096 MB

2 Gbit

256 M x8/256 M x8

8192 MB

4 Gbit

512 M x8/512 M x8

1.4 System Memory

The board has two 204-pin SO-DIMM sockets and supports the following memory features:

• 1.5 V DDR3 SDRAM SO-DIMMs with gold plated contacts

• Support for 1.35 V Low Voltage DDR3 (new JEDEC specification)

• Two independent memory channels with interleaved mode support

• Unbuffered, single-sided or double-sided SO-DIMMs

• 16 GB maximum total system memory (with 4 Gb memory technology). Refer to

Section 2.1.1 on page 41 for information on the total amount of addressable memory.

• Minimum recommended total system memory: 1024 MB

• Non-ECC SO-DIMMs

• Serial Presence Detect

• DDR3 1600 MHz and DDR3 1333 MHz SDRAM SO-DIMMs

NOTE

To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with SO-DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and progr a m the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the SO-DIMMs may not function under the determined frequency.

Table 4 lists the supported SO-DIMM configurations.

Table 4. Supported Memory Configurations

SO-DIMM

1024 MB SS 1 Gbit 128 M x8/empty 8

4096 MB SS 4 Gbit 512 M x8/empty 8

Note: “DS” refers to double-sided memo ry modules (containing tw o rows of SDRAM) and “SS” refers to

single-sided memor y modules (containing o ne r ow of SDRAM).

For information about… Refer to:

Tested Memory http://support.intel.com/support/motherboards/desktop/sb

(Note)

SDRAM

SDRAM Organization

/CS-025414.htm

Number of SDRAM

Intel NUC D53427RKE Technical Product Specification

1.4.1 Memory Configurations

The processor supports the following types of memory organization:

• Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both SO-DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed SO-DIMMs are used between channels, the slowest memory timing will be used.

• Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth operation for real world applications. This mode is use d when only a single SO-DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed SO-DIMMs are used between channels, the slowest memory timing will be used.

For information about… Refer to:

Memory Config uration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-

011965.htm

Product Description

Figure 4 illustrates the memory channel and SO-DIMM configuration.

Figure 4. Memory Channel and SO-DIMM Configuration

Intel NUC D53427RKE Technical Product Specification

1.5 Intel

Intel QS77 Express Chipset with Direct Media Interface (DMI) interconnect provides interfaces to the processor and the USB, SATA, LPC, LAN, and PCI Express interfaces. The Intel QS77 Express Chipset is a centralized controller for the board’s I/O paths.

For information about Refer to

The Intel QS77 chipset Resources used by the chipset Chapter 2

QS77 Express Chipset

http://www.intel.com/products/desktop/chipsets/index.htm

1.5.1 Direct Media Interface (DMI)

Direct Media Interface (DMI) is the chip-to-chip connection between the processor and PCH. This high-speed interface integrates advanced priority-based servicing allo wing for concurrent traffic and true isochronous transfer capabilities.

1.5.2 Display Interfaces

Display is divided between the processor and the PCH. The processor houses the memory interface, display planes, and pipes while the PCH has transcoder and display interface or ports. The PCH receives the display data over Intel Interface (Intel and sends the data through the display inter face.

FDI) and transcodes the data as per the display techno logy protocol

Flexible Display

1.5.2.1 Intel

Intel FDI connects the display engine in the processor with the display interfaces on the PCH. The display data from the frame buffer is processed in the display engine of the processor and sent to the PCH over the Intel FDI where it is transcoded as per the display protocol and driven to the d isplay monitor.

Flexible Display Interconnect (Intel

FDI)

1.5.2.2 High-bandwidth Digital Content Protection (HDCP)

HDCP is the technology for protecting high definition content against unauthorized copy or unreceptive between a source (computer, digital set top boxes, etc.) a nd the sink (panels, monitor, and TVs). The PCH supports HDCP 1.4 for content protection over wired displays (HDM I).

1.6 Graphics Subsystem

The board support s graphics through Intel Graphics Technology.

1.6.1 Integrated Graphics

The board supports integra ted graphics through Intel FDI.

Product Description

1.6.1.1 Intel

The Intel HD graphics controller features the following:

• 3D Features  DirectX* 10.1 and OpenGL* 3.0 compliant  DirectX 11.0 CS4.0 only  Shader Model 4.0

• Video  High-Definition content at up to 1080p res olution  Hardware accelerated MPEG-2, VC-1/WMV and H.264/AVC Hi-Definition video

formats

 Intel HD Technology with Advanced Hardware Video Transcoding  Blu-ray* S3D via HDMI 1.4a  Dynamic Video Memory Technology (DVMT) 5.0 support  Support of up to 1.7 GB Video Memory with 4 GB and above syst em memory

configuration

High Definition (Intel® HD) Graphics

1.6.1.2 Video Memory Allocation

Intel® Dynamic Video Memory Technology (DVMT) is a method for dynamically allocating system memory for use as graphics memory to balance 2D/3D graphics and system performance. If your computer is configured to use DVMT, graphics memory is allocated based on system requirements and application demands (up to the configured maximum amount). When memory is no longer needed by an application, the dynamically allocated portion of memory is returned to the operating system for other uses.

1.6.1.3 High Definition Multimedia Interface* (HDMI*)

The HDMI por t supports standard, enhanced, or high definition video, plus multichannel digital audio on a single cable. Each port is compatible with all ATSC and DVB HDTV standards and supports eight full range channels at 24-bit/96 kHz audio of lossless audio formats such as Dolby* TrueHD or DTS* HD Master Audio. The maximum supported resolution is 1920 x 1200 (WUXGA). The HDMI port is com pliant with the HDMI 1.4a specification.

Intel NUC D53427RKE Technical Product Specification

1.6.1.3.1 Integrated Audio Provided by the HDMI Interface

The following audio technologies are supported by the HDMI 1.4a interface directly from the PCH:

• AC-3 - Dolby* Digital

• Dolby Digital Plus

• DTS-HD*

• Dolby TrueHD, DTS-HD Master Audio*, (Lossless Blu-ray Disc* Audio Format

• LPCM, 192 kHz/24-bit, 8 Channel

1.6.1.4 DisplayPort*

DisplayPort is a digital communicat ion inte rface that utilizes differentia l signaling to achieve a high bandwidth bus interface designed to support connections between PCs and monitors, projectors, and TV displays. DisplayPort is suitable for display connections between consumer electronics devices such as high definition optical disc players, set top boxes, and TV displays. The DisplayPort interface supports the 1.1a specification. There are two mini DisplayPort connectors on the back panel.

DisplayPort’s maximum supported display resolution is 2560 x 1600 @ 60 Hz refresh rate with a 16:10 aspect ra tio (WQXGA).

For information about Refer to

DisplayPort technology http://www.displayport.org

1.6.1.4.1 Integrated Audio Provided by the DisplayPort Interfaces

The mini DisplayPort interfaces supp ort LPCM 96 KHz/24-bit, 2-channel audio directly through the PCH.

NOTE

The PCH only supports one audio stream at a time over DisplayPort. Dual audio signals are not suppo rted.

1.6.1.4.2 Triple Display Configurations

For triple display configurations, at least tw o displays must be connecte d to native DisplayPort monitors. Use of DisplayPort converter s will not allow triple display outputs.

Table 5. Triple Display Configuration Resolutions

Active Display Active Display Active Display

DisplayPort

2560 x 1600 at 60 Hz

DisplayPort

1920 x 1200 at 60 Hz

HDMI*

1080P at 60 Hz

Product Description

1.6.1.5 High-bandwidth Digital Content Protection (HDCP)

HDCP is the technology for protecting high definition content against unauthorized copy or intercep tion between a source (computer, digital set top boxes, etc.) and the sink (panels, monitor, and TVs). The PCH supports HDCP 1.4 for content protection over wired displays (HDMI and DisplayPort).

1.6.2 USB

The board support s USB 2.0/3.0 ports. The port arrangement is as follows:

• USB 2.0 ports:  Two front panel ports are implemented through one dual-port internal header  Two ports are implemented with vertical back panel connectors  One port is reserved for the PCI Express Half-Mini Card  One port is reserved for the PCI Express Full-Mini Card

• One front panel USB 3.0 port is implemented through an external connector (blue)

All USB 2.0/3.0 ports are high-speed, full-speed, and low-speed capable.

NOTE

Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use a shielded cable that meets the requirements for full-speed devices.

For information about Refer to

The location of the USB c onnectors on the back panel Figure 9, page 43 The location of the front panel USB headers Figure 2, page 15

1.6.3 AHCI Mode

The board support s AHCI storage mode via the Intel QS77 Express Chipset.

NOTE

In order to use AHCI mode, AHCI must be enabled in the BIOS. Microsoft Windows 7 and Windows 8 include the necessary AHCI drivers without the need to install separate AHCI drivers during the operating system installation process, however, it is always good practice to update the AHCI drivers to the latest available by Intel.

Intel NUC D53427RKE Technical Product Specification

1.7 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an e stimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied via the power supply 5 V STBY rail.

NOTE

If the battery and AC po w er fail, date and time values will be reset and the user will be notified during the POST.

When the voltage drops b elow a certain level, the BIOS Setup program se ttings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.

1.8 LAN Subsystem

The LAN subsystem consists of the following:

• Intel 82579LM Gigabit Ethernet Controller (10/100/1000 Mb/s)

• Intel QS77 Express Chipset

• RJ-45 LAN connector w ith integrated status LEDs

Additional features of the LAN subsystem include:

• CSMA/CD protocol engine

• Jumbo frame support

• LAN connect interface between the PCH and the LAN controller

• Power management capabilities  ACPI tec hnology support  LAN wa ke capabilities

• LAN subsystem software

For information about Refer to

LAN software and d rivers http://downloadcenter.intel.com

Product Description

1.8.1 Intel

The Intel 82579LM Gigabit Ethernet Controller supports the following features:

• 10/100/1000 BASE-T IEEE 802.3 compliant

• Energy Efficient Ethernet (EEE) IEEE802.3az support (Low Power Idle (LPI) mode)

• Dual interconnect between the Integrated LAN Controller and the Physical Layer

(PHY):

 PCI Express-based interface f or active state operation (S0) state  SMBUS for host and management traffic (Sx low power state)

• Compliant to IEEE 802.3x flow control support

• 802.1p and 802.1q

• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)

• Full device driver compatibility

82579LM Gigabit Ethernet Controller

1.8.2 LAN Subsystem Software

LAN software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining LAN softw are and drivers http://downloadcenter.intel.com

Intel NUC D53427RKE Technical Product Specification

1.8.3 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).

Item Description

A Link LED (Green) B Data Rate LED (Green/Ye llow)

Figure 5. LAN Connector LED Locations

Table 6 describes the LED states w hen the board is powered up and the LAN subsystem is opera ting.

Table 6. LAN Connector LED States

LED LED Color LED State Condition

Off LAN link is not establishe d .

Link Green

Data Rate Green/Yellow

On LA N link is e s tablished. Blinking LAN activity is occurring. Off 10 Mb/s data rate is selected. Green 100 Mb/s data rate is selected. Yellow 1000 Mb/s data rate is selected.

Product Description

1.9 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including thermal and voltage monitoring.

For information about Refer to

Wired for Manage me nt (WfM) Specification www.intel.com/design/archives/wfm/

1.9.1 Hardware Monitoring

The hardware monitoring and fan control subsystem is based on a Nuvoton NCT5577D embedded controller, which supports the following:

• Processor and system ambient temperature monitoring

• Chassis fan speed monitoring

• Voltage monitoring of +12 V, +5 V, +3.3 V, Memory Vcc (V_SM), +Vccp, PCH Vcc

• SMBus interface

1.9.2 Fan Monitoring

Fan monitoring can be implemented using third-party software.

Intel NUC D53427RKE Technical Product Specification

1.9.3 Thermal Solution

Figure 6 shows the location of the t hermal solution and processor fan header.

Item Description

A Processor fan header B Thermal solution

Figure 6. Thermal Solution and Fan Header

Product Description

1.10 Power Management

Power management is implemented at several levels, including:

• Software support through Advanced Configuration and Power Interface (ACPI)

• Hardware support:  Power Input  Instantly Availa ble PC technology  LAN wake capabilities  Wake from USB  WAKE# signal wake-up support  Wake from S5  +5 V Standby Power Indicator LED

1.10.1 ACPI

ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with this board requires an operating system that provides full ACPI support. ACPI features include:

• Plug and Play (including bus and device enumeration)

• Power management control of individual devices, add-in boards (some add-in

boards may require an ACPI-aware driver), video displays, and hard disk drives

• Methods for achieving less than 15-watt s ystem operation in the power-on/standby sleeping state

• A Soft-off feature that enables the opera ting sy stem to power-off the computer

• Support for multiple wake -up events (see Table 9 on page 33)

• Support for a front panel power and sleep mode switch

Table 7 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system.

Table 7. Effects of Pressing the Power Switch

If the system is in this state…

Off (ACPI G2/G5 – Soft off)

On (ACPI G0 – wo rking state)

Sleep (ACPI G1 – slee ping state)

Note: Depending on p ower management settings in the operating sy s te m.

…and the power switch is pressed for

Less than four seconds Power-on

Less than four seconds Soft-off/Standby

More than six second s Fail safe power-off

Less than four seconds Wake-up

More than six second s Power-off

…the system enters this state

(ACPI G0 – wo rking state)

(ACPI G1 – slee ping state)

(ACPI G2/G5 – Soft off)

(ACPI G0 – wo rking state)

(ACPI G2/G5 – Soft off)

Note

Intel NUC D53427RKE Technical Product Specification

1.10.1.1 System States and Power States

Under ACPI, the operating system directs all system and device power state transitions. The opera ting sy stem puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.

Table 8 lists the power states supported by the board along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states.

Table 8. Power States and Targeted System Power

Global States Sleeping States

G0 – working state

G1 – sleeping state

G2/S5 S5 – Soft off.

G3 – mechanical off

AC power is disconnected from the computer.

Notes:

1. To tal system power is d e p e ndent on the system configuration, including add-in boards and per ipherals powered by the system chassis’ power supply.

2. D e p e ndent on the standby po w e r consumption of w ake-up devices used in the system.

S0 – working C0 – working D0 – working

S3 – Suspend to RAM. Context saved to RAM.

S4 – Suspend to disk. Context saved to disk.

Context not saved . Cold boot is required.

No power to the system.

Processor States

No power D3 – no power

No power D3 – no power for

Device States

state.

except for wake-up logic.

wake-up logic, except when provided by battery or external source.

Targeted System Power

Full power > 30 W

Power < 5 W

No power to the s y s te m . Service can be performed safely.

(Note 1)

(Note 2)

Product Description

Note 1)

(Note 1)

(Note 3)

(Notes 1 and 3)

(Note 3)

(Note 1)

(Note 3)

1.10.1.2 Wake-up Devices and Events

Table 9 lists the devices or specific events that can wake the computer from specific states.

Table 9. Wake-up Devices and Events

Devices/events that wake up the system… …from this sleep state …from this global state

Power switch S3, S4, S5 RTC alarm S3, S4, S5 LAN S3, S4, S5 USB S3 G1 WAKE# S3, S4, S5

Notes:

1. S 4 im p lie s operating system s up port only.

2. Wake from S4 and S5 is recommended by Microsoft.

3. Wak e from device/event not supported im me d i ate ly upon return fro m AC loss.

4. Wak e on LAN is only suppo r te d from sleep (S3) or hibernate (S4 ) in Wind ows 8.

(

G1, G2, G3

G1, G2

NOTE

The use of these wake-up events from an ACPI state requires an operating system that provides full ACPI support. In addition, so ftware, drivers, and peripherals must fully support ACPI wake events.

1.10.2 Hardware Support

The board provides several power management hardware features, including:

• Wake from Power Button signal

• Instantly Available PC technology

• LAN wake capabilities

• Wake from USB

• WAKE# signal wake-up support

• Wake from S5

• +5 V Standby Power I ndicator LED

NOTE

The use of Wake from USB from an ACPI state requires an operating system that provides full ACPI support.

Intel NUC D53427RKE Technical Product Specification

1.10.2.1 Power Input

When resuming from an AC power failure, the computer returns to the power state it was in before power was interrupted (on or off). The computer’s response can be set using the Last Power State feature in the BIOS Setup program’s Boot menu.

For information about Refer to

The location of the internal power connector Figure 2, page 15 The signal names of the internal power connector Table 13, page 49

1.10.2.2 Instantly Available PC Technology

Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off, and the front panel LED is amber if dual colored, or off if single colored.) When signaled by a w ake-up device or event, the system quickly returns to its last know n w ake state. Table 9 on page 33 lists the devices a nd events that can wake the computer from the S3 state.

The use of Instantly Available PC technology requires operating system suppor t a nd drivers for any installed PCI Express add-in card.

1.10.2.3 LAN Wake Capabilities

LAN wake capabilities enable remote wake-up of the computer through a network. The LAN subsystem monitor s network traffic at the Media Independent Interface. Upo n detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer.

1.10.2.4 Wake from USB

USB bus activity wakes the computer from an ACPI S3 s ta te.

NOTE

Wake from USB requires the use of a USB peripheral that supports Wake from USB.

1.10.2.5 WAKE# Signal Wake-up Support

When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI S3, S4, or S5 state.

1.10.2.6 Wake from S5

When the RTC Date and Time is set in the BIOS, the computer will automatically wake from an ACPI S5 state.

Product Description

1.10.2.7 +5 V Standby Power Indicator LED

The standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 7 shows the location of the standby power LED.

CAUTION

If AC power has been switched off and the standby power indicator is still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to d o so could damage the board and any attached devices.

Figure 7. Location of the Standby Power LED

Intel NUC D53427RKE Technical Product Specification

1.11 Intel

Security and Manageability

Technologies

Intel® Security and Manageability Technologies provides tools and resources to help small business owners and IT organizations protect and manage their assets in a business or institutional environment.

NOTE

Software with security and/or manageability capability is require d to take advantage of Intel platform security and/or management technologies.

1.11.1 Intel

Intel® vPro™ Technology is a collection of platform capabilities that support enhanced manageability, security, virtualization and power efficiency. The key platform capabilities include:

• Intel

• Trusted Platform Module (TPM)

For information about Refer to

Intel vPro Technology http://support.intel.com/support/vpro/

Active Management Technology (Intel® AMT) 8.0

Virtualization (Intel® VT)

Virtualization for Directed I/O (Intel® VT-d)

Trusted Exec ution T echnology (Intel® TXT)

Identity Protection T echnology (Intel® IPT)

Anti-Theft Technology (Intel® AT)

vPro™ Technology

1.11.1.1 Intel

When used with third-party management and security applications, Intel Active Management Technology (Intel AMT) allows business owners and IT organizations to better discover, heal, and protect their networked computing assets.

Some of the features of Intel AMT include:

• Out-of-band (OOB) system access, to discover assets even while PCs are powered off

• Remote trouble-shooting and recovery, which allows remote diagnosis and recovery of systems after OS failures

• Hardware-based agent presence c hecking that automatically detects and alerts when critical software agents have been stopped or are missing

• Proactive network defense, which uses filters to block incoming threats while isolating infected clients before the y impact the network

• Remote hardware and software asset tracking, helping to track computer assets and keep virus protection up-to-date

Active Management Technology

Product Description

• Keyboard, video and mouse (KVM) remote control, which allows redirection of a managed system’s video to a remote console which can then interact with it using the console’s own mouse and keyboard

NOTE

Intel AMT requires the computer system to have an Intel AMT-enabled chipset, network hardware and software, as well as connection with a power source, a corporate network connection, and an Intel AMT-enabled remote management console. Setup requires additional configuration of the platform.

For information about Refer to

Intel Active Manage me nt Technology http://www.intel.com/technology/platform-

technology/intel-amt/index.htm

1.11.1.2 Intel

Intel® Virtualization Techn ology (Intel® VT) is a hardware-assisted technology that, when combined with software-based virtualization solutions, provides maximum system utilization by consolidating multiple environments into a single ser ver or client.

NOTE

A processor with Intel VT does not guarantee that virtualization will work on your system. Intel VT requires a computer system with a chipset, BIOS, enabling software and/or operating system, device drivers, and applications designed for this feature.

For information about Refer to

Intel Virtualization Tec hno logy http://www.intel.com/technology/virtualization/tec

1.11.1.3 Intel

Intel® Virtualization Techn ology for Directed I/O (Intel® VT-d) allows addresses in incoming I/O device memory transactions to be remapped to different host addresses. This provides Virtual Machine Monitor (VMM) software with:

• Improved reliability and security through device isolation using hardware assisted remapping.

• Improved I /O performance and availability by direct assignment of devices.

For information about Refer to

Intel Virtualization Tec hno logy for Directed I/O

Virtualization Technology

hnology.htm

Virtualization Technology for Directed I/O

http://www.intel.com/technology/itj/2006/v10i3/2-io/4virtualization-techniques.htm

Intel NUC D53427RKE Technical Product Specification

1.11.1.4 Intel

Intel® Trusted Exec ution T echnology (Intel® TXT) is a hardware security solution that protects systems against software-based attacks by validating the behavior of key components at startup against a known good source . It requires that Intel VT be enabled and the presence of a TPM.

For information about Refer to

Intel Trusted Exe c ution Technology http://www.intel.com/content/www/us/en/architecture-

1.11.1.5 Intel

Intel® Identity Protection T echnology (Intel® IPT) provides a simple way for websites and enterprises to validate that a user is logging in from a trusted computer. This is accomplished by using the Intel Manageability Engine embedded in the chipset to generate a six-digit number that, when coupled with a user nam e and password, will generate a One-Time Password (OTP) when visiting Intel IPT-enabled websites. Intel IPT eliminates the need for the additional token or key fob required previously for two-factor authentication.

For information about Refer to

Intel Identity Protection Technology http://ipt.intel.com

Trusted Execution Technology

and-technology/trusted-execution-technology/malwarereduction-general-technology.html

Identity Protection Technology

1.11.1.6 Intel Anti-Theft Technology

Intel® Anti-Theft (Intel® AT) provides local, tamper-resistant defense that works like a poison pill that disables the computer and access to its data even if the operating system (OS) is reimaged, a new hard drive is installed, or the computer is disconnected from the network.

NOTE

No computer system can provide absolute security under all conditions. Intel AT requires the computer system to have an Intel release, software, and an Intel AT-capable Service Provider/ISV application and service subscription. The detection (triggers), response (actions), and recovery mechanisms only work after the Intel configured. Certain functionality may not be offered by some ISVs or service providers and may not be available in all countries. Intel assumes no liability for lost or stolen data and/or systems or any other damages resulting thereof.

For information about Refer to

Intel Anti-Theft http://antitheft.intel.com/welcome.aspx

AT functionality has been activated and

AT-enabled chipset, BIOS, firmware

Product Description

1.11.1.7 Trusted Platform Module (TPM)

The ST Micro ST33ZP24AR28PVSP ve rsion 1.2 revision 116 component is specifically designed to enhance platform security above-and-beyond the capabilities of today’s software by pr oviding a protected space for key operations and other security critical tasks. Using both hardware and software, the TPM protects encryption and signature keys at their most vulnerable stages—operations when the keys are being used unencrypted in plain-text form. The TPM shields unencrypted keys and platform authentication informatio n from software-based attacks.

For information about Refer to

ST Micro TPM version 1.2 http://www.st.com/web/en/home.html

1.11.2 Intel

Small Business Technology

Intel® Small Business Technology (Inte l® SBT) provides small businesses with security and productivity capabilities to help keep their PCs up-to-date, protected and running well. Intel SBT is the firmware component of Intel

Small Business Advantage (Intel®

SBA) and includes this hardware functionality:

• Local Maintenance Timer – Enables applications to “wake-up” the ho st platform when it is powered down or in a sleep state.

• Local Software Monitor – Provides a common reporting mechanism to monitor applications running on the host operating system.

For information about Refer to

Intel Small Business A d vantage http://www.intel.com/go/SBA

Intel NUC D53427RKE Technical Product Specification

2 Technical Reference

2.1 Memory Resources

2.1.1 Addressable Memory

The board utilizes 16 GB of addressable system memory. Typically the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system memory). On a system that has 16 GB of system memory installed, it is not possible to use all of the installed memory due to system ad dress space be ing allocated for other syste m critical functions. These functions include t he following:

• BIOS/SPI Flash device (128 Mb)

• Local APIC (19 MB)

• Direct Media Interface (40 MB)

• PCI Express configuration space (256 MB)

• PCH base address registers PCI Express ports (up to 256 MB)

• Memory-mapped I/O that is dynamically allocated for PCI Express add-in cards

(256 MB)

The board provides the capability to reclaim the physical memory overlapped by the memory mapped I/O logical address space. The board remaps physical memory from the top of usable DRAM bo undary to the 4 GB boundary to an equivalent sized logical address range located just above the 4 GB boundary. Figure 8 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses.

Intel NUC D53427RKE Technical Product Specification

2.2 Connectors and Headers

CAUTION

Only the following connectors and headers have overcurrent protection: back panel and front panel USB.

The other internal connectors and headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these connectors or headers to power devices external to the computer’s chassis. A fault in the load presented by the external devices could cause damage to the computer, the power cable, and the external devices themselves.

Furthermore, improper connection of USB header single wire connectors may eventually overload the overcurrent protection and cause damage to the board.

This section describes the board’s connectors and headers. The connectors and headers can be divided into these groups:

• Back panel I/O connectors

• On-board I/O connectors and headers (see page 44)

2.2.1 Back Panel Connectors

Figure 9 shows the location of the back panel conne ctors for the board.

Item Description

A LAN connector B HDMI connector C Mini DisplayPort conn ector #1 D Mini D is p la yPort connector #2 E USB 2.0 port F USB 2.0 port G 19 V DC input jack

Technical Reference

Figure 8. Back Panel Connectors

Intel NUC D53427RKE Technical Product Specification

2.2.2 Connectors and Headers (Bottom)

Figure 10 shows the lo cations of the connectors and headers on the bottom-side of the board.

Figure 9. Connectors and Headers (Bottom)

Table 10 lists the connectors and headers identified in Figure 10.

Table 10. Connectors and Headers Shown in Figure 10

Technical Reference

Item from Figure 10

A PCI Express Full-Mini Card connector B PCI Express Half-Mini Card connector C Front panel dual-port USB 2 .0 header D Front panel he ad e r E Intel MEBX Reset header F Internal DC power conne c to r

Description

Intel NUC D53427RKE Technical Product Specification

2.2.2.1 Signal Tables for the Connectors and Headers

Table 11. PCI Express Full-/Half-Mini Card Connector

Pin Signal Name Additional Signal Name

1 WAKE# 2 +3.3 V aux 3 Reserved 4 GND 5 Reserved 6 1.5 V 7 CLKREQ# 8 Reserved 9 GND 10 Reserved 11 REFCLK- 12 Reserved 13 REFCLK+ 14 Reserved 15 GND 16 Reserved 17 Reserved 18 GND 19 Reserved 20 Reserved 21 GND 22 PERST# 23 PERn0 24 +3.3 V aux 25 PERp0 26 GND 27 GND 28 +1.5 V 29 GND 30 SMB_CLK 31 PETn0 32 SMB_DATA 33 PETp0 34 GND 35 GND 36 USB_D- 37 GND 38 USB_D+

continued

Table 11. PCI Express Full-/Half-Mini Card Connector (continued)

Pin Signal Name Additional Signal Name

39 +3.3 V aux 40 GND 41 +3.3 V aux 42 LED_WWAN# 43 GND (mSATA) NC 44 LED_WLAN# 45 Reserved (Intel AMT) C-Link_CLK* 46 LED_WPAN# 47 Reserved (Intel AMT) C-Link_DAT* 48 +1.5V 49 Reserved (Intel AMT) C-Link_RST* 50 GND 51 Reserved (mSATA) mSATA SEL 52 +3.3 V aux

Technical Reference

NOTE

The mSATA signals are routed only to the PCIe full-mini card connector and not to the half-mini card connector. These signals are required to support mSATA modules.

NOTE

The Intel AMT C-Link signals are routed only to the PCIe half-mini card connector and not to the full-mini card connector. These signals are required to support Intel AMT Wake-on-LAN for wireless cards.

Intel NUC D53427RKE Technical Product Specification

Table 12. Dual-Port Front Panel USB 2.0 Header

Pin Signal Name Pin Signal Name

1 +5 V DC 2 +5 V DC 3 D− 4 D− 5 D+ 6 D+ 7 Ground 8 Ground 9 KEY (no pin) 10 No Connect

2.2.2.2 Add-in Card Connectors

The board has the following add-in card connectors:

• One PCI Express Half-Mini Card

• One PCI Express Full-Mini Card

Technical Reference

2.2.2.3 Power Supply Connectors

The board has the following power supply connectors:

• External Power Supply – the board can be powered through a 19 V DC connector on the back panel. The back panel DC connector is compatible with a 5.5 mm/OD (outer diameter) and 2.5 mm/ID (inner diameter) plug, where the inner contact is +19 (±10%) V DC and the s hell is GND. The maximum c urrent rating is 10 A.

• Internal Power Supply – the board can alternatively be powered via the internal 19 V DC 1 x 2 power connector, where pin 1 is GND and pin 2 is +19 (±10%) VDC. The internal 1 x 2 power connector is a Molex 5566-2 header which accepts a Molex 5557-02R connector from the power supply.

Table 13. 19 V Internal Power Supply Connector

Pin Signal Name

1 Ground 2 +19 V (±10%)

For information about Refer to

Power supply c o ns iderations Section 2.5.1, page 56

2.2.2.4 Front Panel Header

This section describes the functions of the front panel header. Table 14 lists the signal names of the front panel header. Figure 11 is a connection diagram for the front panel header.

Table 14. Front Panel Header

Pin Signal Name Description Pin Signal Name Description

1 HDD_POWER_LED Pull-up resistor

(750 Ω) to +5V

3 HDD_LED# [Out] Hard disk

activity LED 5 GROUND Ground 6 POWER_SWITCH# [In] Power switch 7 RESET_SWITCH# [In] Reset switch 8 GROUND Ground 9 +5V_DC Power 10 Key No pin

2 POWER_LED_MAIN [Out] Front panel LED

(main color)

4 POWER_LED_ALT [Out] Front p a ne l LED

(alt color)

Intel NUC D53427RKE Technical Product Specification

Figure 10. Connection Diagram for Front Panel Header

2.2.2.4.1 Hard Drive Activity LED Header

Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive. Proper LED function requires a SATA hard drive or optical drive connected to an onboard SATA connector.

2.2.2.4.2 Reset Switch Header

Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST.

2.2.2.4.3 Power/Sleep LED Header

Pins 2 and 4 can be c onnected to a one- or two-color LED. Table 15 shows the possible LED states.

Table 15. States for a One-Color Power LED

LED State Description

Off Power off Blinking Standby Steady Normal operatio n

NOTE

The LED behavior shown in Table 15 is default – other patterns may be set via BIOS setup.

Technical Reference

2.2.2.4.4 Power Switch Header

Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or off. (The time requirement is due to internal debounce circuitry on the board.) At least two seconds must pass bef ore the power supply will recognize another on/o ff signal.

2.2.2.5 Front Panel USB 2.0 Header

Figure 12 is a connection diagram for the front panel USB 2.0 header.

NOTE

• The +5 V DC power on the USB header is fused.

• Use only a front panel USB c onnector that conforms to the USB 2.0 specificatio n for

high-speed USB devices.

Figure 11. Connection Diagram for Front Panel

USB 2.0 Dual-Port Header

Intel NUC D53427RKE Technical Product Specification

2.3 BIOS Setup Configuration Jumper

CAUTION

Do not move a jumper with the power on. Always tur n off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged.

Figure 13 shows the location of the BIOS Setup Configuration jumper. Table 16 describes the BIOS Setup configuration jumper settings for the three modes:

normal, configure, and recovery. When the jumper is set to configure mode and the computer is powered-up, the BIOS compares the processor version and the microcode version in the BIOS and reports if the two match.

Figure 12. Location of the BIOS Configuration Setup Jumper

Table 16 lists the settings for the jumper.

Table 16. BIOS Setup Configuration Jumper Settings

Function/Mode Jumper Setting Configuration

Normal 1-2 The BIOS use s c urrent configuration information and pas s w ords

for booting.

Configure 2-3 After the POST runs , S e tup runs automatically. The maintenance

menu is displayed. Note that this Configur e mode is the only way to c le ar the

BIOS/CMOS se tting s . Press F9 (resto r e defaults) while in Configure mod e to restore the BIO S/CMOS settings to their default values.

Recovery None The BIOS attempts to recover the BIOS configuratio n. A

recovery CD or flash drive is required.

Technical Reference

2.4 Intel

(Intel

The Intel® MEBX reset header (see Figure 13) allows you to reset the Intel ME configuration to the factory defaults. Momentarily shorting pins 1 and 2 with a jumper (not supplied) will accomplish the following:

• Return all Intel ME parameters to their default values.

• Reset the Intel MEBX password to the default value (admin).

Management Engine BIOS Extension

MEBX) Reset Header

CAUTION

Always turn off the power and unplug the power cord from the computer before installing an MEBX reset jumper. The jumper must be removed before reapplying power. The system must be allowed to reach end of POST before reset is complete. Otherwise, the board could be damaged.

NOTE

After using the MEBX Reset, a “CMOS battery failure” warning will occur during the next POST. This is expected and does not indicate a component failure.

Intel NUC D53427RKE Technical Product Specification

Figure 13. Intel MEBX Reset Header

Table 17. Intel MEBX Reset Header Signals

Pin Function

1 PCH_RTCRST_PULLUP 2 Ground 3 No connec tio n

Technical Reference

2.5 Mechanical Considerations

2.5.1 Form Factor

The board is designed to fit into a custom chassis. Figure 14 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 4.0 inches by 4.0 inches [101.60 millimete rs by 101.60 millimeters].

Figure 14. Board Dimensions

Intel NUC D53427RKE Technical Product Specification

2.6 Electrical Considerations

2.6.1 Power Supply Considerations

CAUTION

The external 19 V DC jack is the primary power input connector of Intel NUC Board D53427RKE. However, the board also provides an internal 1 x 2 power connector that can be used in custom-developed systems that have a custo m i nternal power supply. The internal 1 x 2 power connector is a Molex 5566-2 header which accepts a Molex 5557-02R connector from the power supply.

There is no isolation circuitry between the external 19 V DC jack and the internal 1 x 2 power connector. It is the system integrator’s responsibility to ensure no more than one power supply unit is or can be attached to the board at any time and to ensure the external 19 V DC jack is covered if the internal 1 x 2 power connector is to be used.

Simultaneous connection of b oth external and internal power supply units could result in potential damage to the board, power supplies, or other hardware.

System power requirements will depend on actual system configurations chosen by the integrator, as well as end user expansion preferences. It is the system integrator’s responsibility to ensure an appropriate power budget for the system configuration is properly assessed based on the system-level components chosen.

Technical Reference

2.6.2 Fan Header Current Capability

Table 18 lists the current capability of the fan headers.

Table 18. Fan Header Current Capability

Fan Header Maximum Available Current

Processor fan .1 A

2.7 Thermal Considerations

CAUTION

A chassis with a maximum internal ambient temperature of 58 oC at the processor fan inlet is a requirement. Whenever possible, use of a processor heat sink that provides omni-directional airflow to maintain required airflow across the processor voltage regulator area is recommended.

CAUTION

Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board.

All responsibility for determining the adequacy of any thermal or system design remains solely with the system integrator. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance.

CAUTION

Ensure that the ambient temperature does not exceed the board’s maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.8.

CAUTION

The processor voltage regulator area (shown in Figure 15) can reach a temperature of up to 97.5 processor voltage regulator circuit. Failure to do so may result in shorter than expected product lifetime.

C in an open chassis. Ensure that proper a i rflow is mainta ined in the

Intel NUC D53427RKE Technical Product Specification

Figure 15 shows the locations of the localized high temperature zones.

Item Description

A Processor voltage regulator area B Thermal solution

Figure 15. Localized High Temperature Zones

Technical Reference

For information about

Refer to

Table 19 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board.

Table 19. Thermal Considerations for Components

Component Maximum Case Temperature

Processor For processor case temperature, see processor datasheets and

processor specification updates

Intel QS77 Express Chipset 104 oC

To ensure functionality and reliability, the component is specified for proper oper a tion when Case Temperature is maintained at or below the maximum temperature listed in Table 20. This is a requirement for sustained power dissipation equal to Thermal Design Power (TDP is s p ecified as the maximum sustainable power to be dissipated by the components). When the component is dissipating less than TDP, the case temperature should be below the Maximum Case Temperature. The surface temperature at the geometric center of the component corresponds to Case Temperature.

It is important to note that the temperature measurement in the system BIOS is a value reported by embedded thermal sensors in the components and does not directly correspond to the Maximum Case Temperature. The upper operating limit when monitoring this thermal sensor is Tcontrol.

Table 20. Tcontrol Values for Components

Component Tcontrol

Processor For processor case temperature, see processor datasheets and

processor specification updates

Intel QS77 Express Chipset 104 oC

Processor datasheets and specification updates Section 1.2, page 18 Intel® 7 Series Chipset Thermal Mechanical Specifications and

Design Guidelines

http://www.intel.com/Products/Desktop/ Chipsets/ec-QS77/QS77technicaldocuments.htm

Intel NUC D53427RKE Technical Product Specification

2.8 Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332 Issue 2, Method I, Case 3, 55 ºC ambient. The M TBF prediction is used to estimate repair rates and spare parts requirements. The MTBF for the board is 71,537 hours.

2.9 Environmental

Table 21 lists the environmental specifications for the board.

Table 21. Environmental Specifications

Parameter Specification Temperature

Non-Operating Operating Shock Unpackaged 50 g trapezoidal waveform Velocity change of 170 inches/s² Packaged Half sine 2 millisec ond Product Weight (pounds) Free Fall (inches) Velocity Change (inches/s²) <20 36 167 21-40 30 152 41-80 24 136 81-100 18 118 Vibration Unpackaged 5 Hz to 2 0 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz 20 Hz to 500 Hz: 0.02 g² Hz (flat) Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat) 40 Hz to 500 Hz: 0.015 g² Hz sloping dow n to 0.00015 g² Hz

-40 °C to +60 °C 0 °C to +50 °C

3 Overview of BIOS Features

3.1 Introduction

The board uses an Intel® Visual BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the Visual BIOS Setup program, POST, the PCI auto-configuration utility, LAN EEPROM information, and Plug and Play support.

The BIOS displays a message during POST identifying the type of BIOS and a revision code. The initial production BIOSs are identified as RKPPT10H.86A.

When the BIOS Setup configuration jumper is set to configure mode and the computer is powered-up, the BIOS compares the CPU version and the microcode version in the BIOS and reports if the two match.

The Visual BIOS Setup program can be used to view and change the B IOS settings for the computer. The BIOS Setup program is accessed by pressing the <F2> key after the Power-On Self-Test (POST) memor y test begins and befor e the operating system boot begins.

Figure 16. Intel Visual BIOS Home Screen

Intel NUC D53427RKE Technical Product Specification

NOTE

The maintenance menu is displayed only when the b oard is in configure mode. Section 2.3 on page 52 shows how to put the board in configure mode.

3.2 BIOS Flash Memory Organization

The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 128 Mb (16000 KB) flash memory device.

3.3 System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network.

The main component of SMB IOS is the Management Information Format (MI F ) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obtain the system types, capabilities, operational status, and installation dates for system components. The MIF database defines the data and provides the method for accessing this information. The BIOS enables applications such as third-party management software to use SMBIOS. The BIOS stores and reports the following SMBIOS information:

• BIOS data, such as the BIOS revision level

• Fixed-system data, such as peripherals, serial numbers, and asset tags

• Resource data, such as memory size, cache size, and processor speed

• Dynamic data, such as event detection and error logging

Non-Plug and Play operating systems re quire an additional interface for obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such operating systems. Using this support, an SMBIOS service-level application running on a non-Plug and Play operating system can obtain the SMBIOS information. Additional board informat io n can be found in the BIOS under the Additional Information header under the Main BIOS page.

3.4 Legacy USB Support

Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB . By default, Legacy USB support is set to Enabled.

Legacy USB support operates as follows:

1. When you apply power to the computer, legacy support is disabled.

2. POST begins.

3. Legacy US B support is enabled by the BI OS allowing you to use a USB keyboard to

enter and configure the BIOS Setup program and the maintenance menu.

Overview of BIOS Features

4. POST completes.

5. The ope rating system loads. While the ope rating system is loading, USB keyboards

and mice are recognized and may be used to configure the operating system. (Keyboards and mice are not recognized during this period if Legacy USB support was set to Disabled in the BIOS Setup program.)

6. After the operating system loads the USB drivers, all legacy and non-legacy USB

devices are recognized by the operating system, and Legacy USB support from the BIOS is no longer used.

7. Additional USB legacy feature options can be acce ss by using Intel

Integrator

Toolkit.

To install an operating system that supports USB, verify that Legacy USB support in the BIOS Setup program is set to Enabled and follow the operating system’s installa tion instructions.

3.5 BIOS Updates

The BIOS c an be updated using either of the following utilities, which are available on the Intel World Wide Web site:

• Intel

Both utilities verify that the updated BIOS m a tches the target system to prevent accidentally installing an incompatible BIOS.

Express BIOS Update utility, which enables automated updating while in the Windows environment. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from the file location on the Web.

Flash Memory Update Utility, which requires booting from DOS. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM.

F7 switch during POST allows a user to select where the BIOS .bio file is located and perform the update from that location/device. Similar to performing a BIOS Recovery without removing the BIOS configuration jumper.

NOTE

Review the instructions distributed with the upgrade utility before attempting a BIOS update.

For information about Refer to

BIOS update utilities http://support.intel.com/support/motherboards/desktop/sb

3.5.1 Language Support

The BIOS Setup program and help messages are supported in US English. Check the Intel web site for s upport.

/CS-022312.htm

Intel NUC D53427RKE Technical Product Specification

(Note)

3.5.2 Custom Splash Screen

During POST, an Intel® splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Intel Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen.

NOTE

If you add a custom spl a sh screen, it will sha re space with the Inte l b randed logo.

For information about

Intel Integrato r Toolkit Additional Intel® software too ls

Refer to

www.intel.com/go/itk www.intel.com/go/itk

3.6 BIOS Recovery

It is u nlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the BIOS could be damaged. Table 22 lists the drives and media types that can and cannot be used for BIOS recovery. The BIOS recovery media does not need to be made bootable.

Table 22. Acceptable Drives/Media Types for BIOS Recovery

Media Type

Hard disk drive (connected to SATA or USB) Yes CD/DVD drive (connected to S A TA or USB) Yes USB flash drive Yes USB diskette dr iv e (with a 1.4 MB diskette) No (B IOS update file is b ig ger than 1.4 MB size limit)

NOTE

Supported file systems for BIOS recovery:

• NTFS (sparse, compressed, or encrypted files are not supported)

• FAT32

• FAT16

• FAT12

• ISO 9660

For information about Refer to

BIOS recovery http://www.intel.com/support/motherboards/desktop/sb/cs-023360.htm

Can be used for BIOS recovery?

Overview of BIOS Features

3.7 Boot Options

In the BIOS Setup program, the user can choose to boot from a hard drive, optical drive, removable drive, or the network. The default setting is for the optical drive to be the first boot device, the hard drive second, removable drive third, and the network fourth.

3.7.1 Network Boot

The network can be selected as a boot device. This selection allows booting from the onboard LAN or a network add-in card with a remote boot ROM installed.

Pressing the <F12> key during POST automatically forces b ooting from the LAN. To use this key during POST, the User Access Level in the BIOS Setup program's Security menu must be set to Full.

3.7.2 Booting Without Attached Devices

For use in embedded applications, the BIOS has been designed so that after pas sing the POST, the operating system loader is invoked even if the following devices are not present:

• Video adapter

• Keyboard

• Mouse

3.7.3 Changing the Default Boot Device During POST

Pressing the <F10> key during POST causes a boot device menu to be displayed. This menu displays the list of available boot devices. Table 23 lists the boot device menu options.

Table 23. Boot Device Menu Options

Boot Device Menu Function Keys Description

<↑> or <↓> <Enter> Exits the menu, and boots f rom the selected de vice <Esc> Exits the menu and boots ac c o rding to the boot p r iority

Selects a default boot device

defined through B IOS setup

Intel NUC D53427RKE Technical Product Specification

3.8 Hard Disk Drive Password Security Feature

The Hard Disk Drive Password Security feature blocks read and write accesses to the hard disk drive until the correct password is given. Hard Disk Drive Passwords are set in BIOS SETUP and are p rompted for during BI OS POST. For convenient support of S3 resume, the system BIOS will automatically unlock drives on resume from S3.

The User hard disk drive password, when installed, will be required upon each powercycle until the Master Key or User hard disk drive password is submitted.

The Master Key hard disk drive password, when installed, will not lock th e drive. The Master Key hard disk drive password exists as an unlock override in the event that the User hard disk drive password is forgotten. Only the installation of the User hard disk drive password will cause a hard disk to be locked upon a system power-cycle.

Table 24 shows the effects of setting the Hard Disk Drive Passwords.

Table 24. Master Key and User Hard Drive Password Functions

Password Set Password During Boot

Neither None Master only None User only User only Master and User Set Master or User

During every POST, if a User hard disk drive password is set, POST execution will pause with the following prompt to force the user to enter the Master Key or User hard disk drive password:

Enter Hard Disk Drive Password:

Upon successful entry of the Master Key or User hard disk drive password, the system will continue wit h norm al POST.

If the hard disk drive pa ssword is not correctly entered, the system will go back to the above prompt. The user will have three attempts to correctly enter the hard disk drive password. After the third unsuccessful hard disk d rive password attempt, the system will halt with the message:

Hard Disk Drive Password Entry Error

A manual power cycle will be required to resume system operation.

NOTE

As implemented on D53427RKE, Hard Disk Drive Password Security is only supported on SATA port 0. The passwords are stored on the hard disk drive so if the drive is relocated to another computer that does not support Hard Disk Drive Password Security feature, the drive will not be accessible.

Overview of BIOS Features

3.9 BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions:

• The supervisor password gives unrestricted access to view and change all the Setup options in the BIOS Setup program. This is the supervisor mode.

• The user password gives restricted access to view and cha nge Setup options in the BIOS Setup program. This is the user mode.

• If only the supervisor password is set, pressing the <Enter> key at the password prompt of the BIOS Setup program allows the us er restricted ac cess to Setup.

• If both the supervisor and user passwords are set, users can enter either the supervisor password or the user password to access Setup. Users have access to Setup respective to which password is entered.

• Setting the user password restricts who can boot the computer. The password prompt will be displayed before the computer is booted. If only the superviso r password is set, the computer boots w ithout asking for a password. If both passwords are set, the user can enter either password to boot the computer.

• For enhanced security, use different passwords for the supervisor and user passwords.

• Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to 19 characters in length.

• To clear a set password, enter a blank password after entering the existing password.

Table 25 shows the effects of setting the supervisor password and user password. This table is for reference only and is not displayed on the screen.

Table 25. Supervisor and User Password Functions

Password Set

Neither Can c hang e a ll

Supervisor only

User only N/A Can change all

Supervisor and user set

Note: If no passwor d is s e t, any user can change all Setup options.

Supervisor Mode

options Can change all

options

Can change all options

(Note)

User Mode

Can change all options

Can change a limited number of options

options Can change a

limited number of options

(Note)

Setup Options

None None None

Supervisor Password Supervisor None

Enter Password Clear User Password

Supervisor Password Enter Password

Password to Enter Setup

User User

Supervisor or user

Password During Boot

Supervisor or user

Intel NUC D53427RKE Technical Product Specification

(Note)

4 Error Messages and Blink Codes

4.1 Front-panel Power LED Blink Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel power LED to blink an error message describing the problem (see Table 26).

Table 26. Front-panel Power LED Blink Codes

Type Pattern Note

BIOS update in progress Off when the update b e g ins , the n on for

0.5 seconds, then off for 0.5 seconds. The pattern repeats until the B IOS update is complete.

Video error

Memory error On-off (1.0 seco nd e ac h) three times, then

Thermal trip warning Each beep will be accompanied by the following

Note: Disabled pe r default BIOS s e tup o ption.

On-off (1.0 second ea c h) tw o tim e s , the n

2.5-second pause (o ff), entire pattern r e p e ats (blink and pause) until the sy s tem is power ed off.

2.5-second pause (o ff), entire pattern r e p e ats (blinks and pause) until the system is powered off.

blink pattern: .25 seconds on, .25 seconds off, .25 seconds on, .25 seconds off. This will result in a total of 16 blinks.

When no VGA option R O M is found.

4.2 BIOS Error Messages

Table 27 lists the error messages and provides a brief description of each.

Table 27. BIOS Error Messages

Error Message Explanation

CMOS Battery Low The battery may be losing power. Re place the battery so o n. CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have

Memory Size Decreased Memory size has decreased since the last boot. If no memory

No Boot Device A vailable System did not find a d e v i c e to boot.

been corrupted. Run Setup to reset values.

was removed, then memory may be bad.

Intel NUC D53427RKE Technical Product Specification

5 Regulatory Compliance and Battery

Disposal Information

5.1 Regulatory Compliance

This section contains the following regulatory compliance information for Intel NUC Board D53427RKE:

• Safety standards

• European Union Declaration of Conformity statement

• Product Ecology statements

• Electromagnetic Compatibility (EMC) standards

• Product certification mark ings

5.1.1 Safety Standards

Intel NUC Board D53427RKE complies with the safety standards stated in Table 28 when correctly installed in a compatible host system.

Table 28. Safety Standards

Standard Title

CSA/UL 60950-1 Information Tec hno l o gy Equipment – Safety - Part 1: General

Requirements (USA and Canada)

EN 60950-1 Info rmation Technology Eq uipment – Safety - Part 1: General

Requirements (Euro pean Union)

IEC 60950-1 Information Technology Equipment – Safety - Pa r t 1: General

Requirements (I nte r na tio na l)

Intel NUC D53427RKE Technical Product Specification

5.1.2 European Union Declaration of Conformity

Statement

We, Intel Corporation, declare under our sole responsibility that the products Intel® NUC Board D53427RKE is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC (ROHS Directive).

The product is properly CE marked demo nstrating this conformity and is for distribution within all member states of the EU with no restrictions.

This product follows the provisions of the European Directives 2004/108/EC, 2006/95/EC, and 2002/95/EC.

Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC, 2006/95/EC a 2002/95/EC.

Dansk Dette produkt er i overensstemmelse med det europæiske direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC.

Dutch Dit product is in navolging van de bepalingen van Europees Directief 2004/108/EC, 2006/95/EC & 2002/95/EC.

Eesti Antud toode vastab Euroopa direk tiivides 2004/108/EC, ja 2006/95/EC ja 2002/95/EC kehtestatud nõuetele.

Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC, 2006/95/EC & 2002/95/EC määräyksiä.

Français Ce produit est conforme aux exigences de la Directive Européenne 2004/108/EC, 2006/95/EC & 2002/95/EC.

Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie 2004/108/EC, 2006/95/EC & 2002/95/EC.

Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών 2004/108/EC, 2006/95/EC και 2002/95/EC.

Magyar E termék megfelel a 2004/108/EC, 2006/95/EC és 2002/95/EC Európai

Irányelv előírásainak. Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer

2004/108/EC, 2006/95/EC, & 2002/95/EC. Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC,

2006/95/EC & 2002/95/EC. Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC, 2006/95/EC un

2002/95/EC noteikumiem. Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC, 2006/95/EC, ir

2002/95/EC nuostatas. Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej

2004/108/EC, 2006/95/EC u 2002/95/EC. Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet

2004/108/EC, 2006/95/EC & 2002/95/EC. Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej

2004/108/EC, 206/95/EC i 2002/95/EC.

Regulatory Compliance and Battery Disposal Information

Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC, 2006/95/EC & 2002/95/EC.

Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC, 2006/95/EC & 2002/95/EC.

Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív 2004/108/EC, 2006/95/EC a 2002/95/EC.

Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC, 2006/95/EC in 2002/95/EC.

Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC.

Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC, 2006/95/EC ve 2002/95/EC yönergelerine uyar.

5.1.3 Product Ecology Statements

The following information is provided to address worldwide produc t ecology concer ns and regulations.

5.1.3.1 Disposal Considerations

This product contains the fo llowing mater ials that may be regulated upon disposal: printed wiring board assembly and lithium battery.

Intel NUC D53427RKE Technical Product Specification

5.1.4 EMC Regulations

Intel NUC Board D53427RKE complies with the EMC regulations stated in Table 29 when correctly installed in a compatible host system.

Table 29. EMC Regulations

Regulation Title

FCC 47 CFR Part 15, Subpart B

ICES-003 Interference-Causing Equipment Standard, Digital Apparatus. (Canad a ) EN55022 Limits and me thods of measurem e nt o f Radio Interf e rence Characteris tic s

EN55024 Inf ormation Technology Equipment – Immunity C ha r a c te r is ti c s Limits and

EN55022 Austr alia n C o m munic a tio ns A uthority, Standard f o r Electromagnetic

CISPR 22 Limits and methods of mea s ur e m e nt o f Radio Disturbanc e Characteristics

CISPR 24 Information Techno logy Equipment – I mmuni ty C ha r a c te r is ti c s – Limits

VCCI V-3, V-4 Voluntary Contr o l for Interfe r e nc e by Informatio n Te c hno logy Equipment.

KN-22, KN-24 Korean Com munic ati o ns C ommission – Framework Act on

CNS 13438 Bureau of Standards, Metrology, and Inspection (Taiwan)

Title 47 of the Code of Federal R e gulations, Part 15, Subp a r t B , Radio Frequency Devices. (USA)

of Information Technology Equip me nt. (European Union)

methods of measurement. (European Union)

Compatibility. (Austr ali a and N e w Z e al and )

of Information Technology Equip me nt. (International)

and Methods of Measurement. (International)

(Japan)

Telecommunications and Radio Waves Act (So uth Korea)

FCC Declaration of Conformity

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

For questions related to the EMC performance of this produc t , contact: Intel Corporation, 5200 N. E. Elam Young Parkway, Hillsboro, O R 9712 4

1-800-628-8686 This equipment has been teste d a nd found to comply with the limits for a Class B

digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

Regulatory Compliance and Battery Disposal Information

• Increase the separation between the equipment and the receiver.

• Connect the equipment to an outlet on a circuit other than the one to which the

receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications to the equipment not expressly approved by Intel Corporation could void the us er’s authority to operate the equipment.

Tested to comply with FCC sta nda rds for home o r office use.

Canadian Department of Communications Compliance Statement

This digital apparatus does not exceed the Class B limits for radio noise emissions from digital apparatus set out in the Radio Interf erence Regulations of the Canadian Department of Comm unications.

Le présent appareil numerique német pas de bruits radioélectriques dépassant les limites applicables aux appareils numériques de la classe B prescrites dans le Réglement sur le broullage radioélectrique édicté par le ministére des Communications du Canada.

Japan VCCI Statement

Japan VCCI Statement translation: This is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment (VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual.

Korea Class B Statement

Korea Class B Statement translation: This equipment is for home use, and has acquired electromagnetic conformity registration, s o it can be used not only in residential areas, but also other areas.

Intel NUC D53427RKE Technical Product Specification

5.1.5 ENERGY STAR* 5.2, e-Standby, and ErP

Compliance

The US Department of Energy and the US Environmental Protection Agency have continually revised the ENERGY STAR requirements. Intel has worked directly with these two governmental agencies in the definition of new requirements.

Intel NUC Board D53427RKE allows for a compliant system built to meet the following program requirements, including appropriate selection of an efficient power supply:

• ENERGY STAR v5.2, category B

• EPEAT*

• Korea e-Standby

• European Union Energy-related Products Directive 2013 (ErP) Lot 6

• ENERGY STAR v6.0 draft 3

NOTE

ENERGY STAR denotes a system level energy specification, defined by the US Environmental Protection Agency, that relies upon all of the system's components, including processor, chipset, power supply, HDD, graphics controller, memory, etc. to meet the specification. For more information on ENERGY STAR Computers Program requirements version 5.2, go to:

http://www.energystar.gov

For information about Refer to

ENERGY STAR req uirements and recomme nded configuratio ns http://www.intel.com/go/energystar Electronic Produc t Environmental Assessm e nt To ol (EPEAT) http://www.epeat.net/ Korea e-Standby Pr o gram http://www.kemco.or.kr/new_eng/pg02

European Union Energ y-related Products Directive 2009 (ErP) http://ec.europa.eu/enterprise/policies/s

/pg02100300.asp

ustainable-business/sustainableproduct-policy/ecodesign/index_en.htm

Regulatory Compliance and Battery Disposal Information

5.1.6 Regulatory Compliance Marks (Board Level)

Intel NUC Board D53427RKE has the regulatory compliance marks shown in Table 30.

Table 30. Regulatory Compliance Marks

Description Mark

UL joint US/Canada Rec o gnized Compone nt mark. Includes adjac e nt U L file number for I nte l NUC Boards: E210882.

FCC Declaratio n o f Conformity lo g o mark for Clas s B e quipment.

CE mark. Declaring c ompliance to the Europ e a n Union (EU) EMC directive, Low Voltage dire c tive, and RoHS dire c tiv e .

Australian Communications A uthority (ACA) and New Z e aland Radio Spectrum Management (NZ RSM) C-tick mark. Inc lud e s adjacent Intel supplier code num b e r, N-232.

Japan VCCI (Voluntary Control Counc il f or Interfer e nc e ) mark.

Korea Certificati o n ma r k. Includes an adjace nt KC C (Korean Communications Commis s ion) certification numbe r : KCC-REM-CPU-D53427RKE.

Taiwan BSMI (Bureau o f Standards, Metrolo g y and Inspections ) mark. Includes adjacent Intel company number, D33025.

Printed wiring boa r d manufacturer’s r e c o gnition mark. Consists of a unique UL recognized manuf a c tur e r’s logo, along wi th a f la mm ab il ity rating (solder side).

China RoHS/Environme nta lly Friendly Use Period Logo: This is an example of the symbol used on Intel NUC Boards and as s ociated collateral. The c olor of the mark may vary d e p e nding upon the applicatio n. The Env i r onmental Friendly Usage Pe r i o d (EFUP) for Intel NUC Boards has been determined to be 10 years.

V-0

Intel NUC D53427RKE Technical Product Specification

PRÉCAUTION

FORHOLDSREGEL

OBS!

VIKTIGT!

VARO

VORSICHT

AVVERTIMENTO

5.2 Battery Disposal Information

CAUTION

Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations.

Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des piles usagées doit respecter les réglementations locales en vigueur en matière de protection de l'environnement.

Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i overensstemmelse med gældende miljølovgivning.

Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier bør kastes i henhold til gjeldende miljølovgivning.

Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras enligt de lokala miljövårdsbestämmelserna.

Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on mahdollista. Käytetyt par i stot on hävitettävä paikallisten ympäristömääräy sten mukaisesti.

Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend.

Esiste il pericolo di un esplosione se la pila non viene sostituita in modo cor retto. Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate da l produttore. Per disfarsi delle pile usate, seguire le istruzioni del produttore.

Regulatory Compliance and Battery Disposal Information

PRECAUCIÓN

WAARSCHUWING

ATENÇÃO

AŚCIAROŽZNAŚĆ

UPOZORNÌNÍ

Προσοχή

VIGYÁZAT

Existe peligro de explosión si la pila no se c a mbia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.

Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.

Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto. As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias usadas deve ser feita de acordo com as regulamentações ambientais da região.

Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу. Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.

V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné, baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními předpisy o životním prostředí.

Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με τους κατά τόπο περιβαλλοντικούς κανονισμούς.

Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi előírásoknak megfelelően kell kiselejtezni.

Intel NUC D53427RKE Technical Product Specification

AWAS

OSTRZEŻENIE

PRECAUŢIE

ВНИМАНИЕ

UPOZORNENIE

POZOR

UYARI

OСТОРОГА

Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan.

Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony środowiska.

Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător. Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să respecte reglementările locale privind protecţia mediului.

При использовании батареи несоответствующего типа существует риск ее взрыва. Батареи должны быть утилизированы по возможности. Утилизация батарей должна проводится по правилам, соответствующим местным требованиям.

Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu. Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.

Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo. Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi

okoljevarstvenimi predpisi.

Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.

Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху. Якщо можливо, використані батареї слід утилізувати. Утилізація використаних батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.

Regulatory Compliance and Battery Disposal Information

Intel NUC D53427RKE Technical Product Specification

Intel D53427RKE, DC53427HYE Specification

Specifications and Main Features

Frequently Asked Questions

User Manual