Information in this document is provided in connection with Intel® products. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel‘s
Terms and Conditions of Sale for such products, Intel® assumes no liability whatsoever, and Intel® disclaims any
express or implied warranty, relating to sale and/or use of Intel® products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. Intel® products are not intended for use in medical, life saving, or life sustaining applications. Intel® may make
changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked ―reserved‖ or
―undefined‖. Intel® reserves these for future definition and shall have no responsibility whatsoever for conflicts or
incompatibilities arising from future changes to them.
Information provided in this document may be incomplete (as denoted by TBD). Revised information will be
published in a later release of this document and when the related product is made available.
The Intel® Server Board S1200BT may contain design defects or errors known as errata which may cause the
product to deviate from published specifications. Current characterized errata are available on request.
Intel Corporation server boards contain a number of high-density VLSI and power delivery components that need
adequate airflow to cool. Intel‘s own chassis are designed and tested to meet the intended thermal requirements of
these components when the fully integrated system is used together. It is the responsibility of the system integrator
that chooses not to use Intel® developed server building blocks to consult vendor datasheets and operating
parameters to determine the amount of airflow required for their specific application and environmental conditions.
Intel Corporation cannot be held responsible if components fail or the server board does not operate correctly when
used outside any of their published operating or non-operating limits.
Intel, Pentium, Itanium, and Xeon are trademarks or registered trademarks of Intel Corporation.
*Other brands and names may be claimed as the property of others.
Table 57. POST Progress Code LED Example ....................................................................... 129
Table 58. POST Progress Codes ............................................................................................ 129
Table 59. POST Error Codes and Messages .......................................................................... 133
Table 60. POST Error Beep Codes ......................................................................................... 135
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Intel® Server Board S1200BT TPS Introduction
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1. Introduction
This Technical Product Specification (TPS) provides board specific information detailing the
features, functionality, and high-level architecture of the Intel® Server Board S1200BT.
In addition, you can obtain design-level information for specific subsystems by ordering the
External Product Specifications (EPS) or External Design Specifications (EDS) for a given
subsystem. EPS and EDS documents are not publicly available and must be ordered through
your local Intel® representative.
1.1 Chapter Outline
This document is divided into the following chapters:
Chapter 1 – Introduction
Chapter 2 – Server Board Overview
Chapter 3 – Functional Architecture
Chapter 4 – Platform Management
Chapter 5 – Server Management Capability
Chapter 6 – BIOS User Interface
Chapter 7 – Connector/Header Locations and Pin-outs
Chapter 8 – Jumpers Blocks
Chapter 9 – Intel
Chapter 10 – Design and Environmental Specifications
Appendix A – Integration and Usage Tips
Appendix B – Integrated BMC Sensor Tables
Appendix C – POST Code Diagnostic LED Decoder
Appendix D – POST Code Errors
Appendix E – Supported Intel
Glossary
Reference Documents
®
Light-Guided Diagnostics
®
Server Chassis
1.2 Server Board Use Disclaimer
Intel Corporation server boards contain a number of high-density VLSI and power delivery
components that need adequate airflow to cool. Intel® ensures through its own chassis
development and testing that when Intel® server building blocks are used together, the fully
integrated system meets the intended thermal requirements of these components. It is the
responsibility of the system integrator who chooses not to use Intel® developed server building
blocks to consult vendor datasheets and operating parameters to determine the amount of
airflow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible if components fail or the server board does not operate correctly
when used outside any of their published operating or non-operating limits.
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Overview Intel® Server Board S1200BT TPS
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Feature
Description of S1200BTL
Description of S1200BTS
Processor
Support for one Intel® Xeon® Processor E31200 Series or Intel® Core™ Processor i32100 Series in FC-LGA 1155 socket package.
2.5 GT/s point-to-point DMI interface
to PCH
LGA 1155 pin socket
Support for one Intel® Xeon® Processor E31200 Series or Intel® Core™ Processor i32100 Series in FC-LGA 1155 socket package.
2.5 GT/s point-to -point DMI interface
to PCH
LGA 1155 pin socket
Memory
Two memory channels with support for
1066/1333 MHz ECC Unbuffered (UDIMM)
DDR3.
Up to 2 UDIMMs per channel
32 GB max with x8 ECC UDIMM (2
Gb DRAM)
Two memory channels with support for
1066/1333 MHz ECC Unbuffered (UDIMM)
DDR3.
Up to 2 UDIMMs per channel 32 GB
max with x8 ECC UDIMM (2 Gb
DRAM)
Chipset
Support for Intel® C204 Platform Controller Hub
(PCH) chipset
ServerEngines* LLC Pilot III BMC controller
(Integrated BMC)
Support for Intel® C202 Platform Controller
Hub (PCH) chipset
I/O
External connections:
DB-15 video connectors
DB-9 serial Port A connector
Four ports on two USB/LAN combo
connectors at rear of board
Internal connections:
Two USB 2x5 pin headers, each
supporting two USB 2.0 ports
One 2x5 Serial Port B headers
Two 6Gb/s SATA ports and four
3Gb/s SATA ports
One SAS mezzanine slot for optional
SAS module
External connections:
DB-15 video connectors
DB-9 serial Port A connector
Four ports on two USB/LAN combo
connectors at rear of board
Internal connections:
Two USB 2x5 pin headers, each
supporting two USB 2.0 ports
One 2x5 Serial Port B headers
Six 3Gb/s SATA ports
2. Overview
The Intel® Server Board S1200BT is a monolithic printed circuit board (PCB) with features
designed to support entry-level severs. It has two board SKUs, namely S1200BTL
and S1200BTS.
2.1 Intel® Server Board S1200BT Feature Set
Table 1. Intel® Server Board S1200BT Feature Set
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Feature
Description of S1200BTL
Description of S1200BTS
Add-in PCI Card,
PCI Express* Card
Slot1: One 5V PCI 32 bit/33 MHz
connector
Slot3: One PCI Express* Gen2 x8 (x4
throughput) connector
Slot4: One PCI Express* Gen2 x8 (x4
throughput) connector
Slot5: One PCI Express* Gen2 x8 (x4
throughput) connector
Slot6: One PCI Express* Gen2 x16
(x8 throughput) connector
Slot4: One 5V PCI 32 bit/33 MHz
connector
Slot5: One PCI Express* Gen2 x8
(x4 throughput) connector
Slot6: One PCI Express* Gen2 x8
(x8 throughput) connector
Slot7: One PCI Express* Gen2 x16
(x8 throughput) connector
System Fan
Support
Five 4-pin fan headers supporting four system
fans and one processor
Four 4-pin fan headers supporting four
system fans and one processor
Video
Onboard ServerEngines* LLC Pilot III BMC
Controller
External 32MB (or above) DDR3
800MHz memory
Silicon Motion SM712GX04LF02-BA
Onboard Hard
Drive
Support for six Serial ATA II hard drives
through six onboard SATA II connectors with
SW RAID 0, 1, 5, and 10
Up to four SAS hard drives through optional
Intel® SAS Entry RAID Module card
Two 6Gb/s SATA ports and four 3Gb/s SATA
ports
Support for six Serial ATA II hard drives
through six onboard SATA II connectors with
SW RAID 0, 1, 5 and 10.
Six 3Gb/s SATA ports
RAID Support
Intel® Embedded Server RAID
Technology II through onboard SATA
connectors provides SATA RAID 0, 1,
and 10 and optional RAID 5 support
provided by the Intel® RAID Activation
Key AXXRAKSW5
Intel® Rapid Storage RAID through
onboard SATA connectors provides
SATA RAID 0, 1, 5, and 10
One optional internal SAS module
connector which supports
AXXRMS2AF040, AXXRMS2LL040,
and AXX4SASMOD
Intel® Embedded Server RAID
Technology II through onboard
SATA connectors provides SATA
RAID 0, 1, and 10 and optional RAID
5 support provided by the Intel®
RAID Activation Key AXXRAKSW5.
Intel® Rapid Storage RAID through
onboard SATA connectors provides
SATA RAID 0, 1, 5, and 10.
LAN
One Gigabit Ethernet device 82574L connect
to PCI-E x1 interfaces on the PCH
One Gigabit Ethernet PHY 82579 connected to
PCH through PCI-E x1 interface
One Gigabit Ethernet device 82574L connect
to PCI-E x1 interfaces on the PCH
One Gigabit Ethernet PHY 82579 connected
to PCH through PCI-E x1 interface
Server
Management
Onboard LLC Pilot III Controller (iBMC)
Integrated Baseboard Management
Controller (Integrated BMC), IPMI 2.0
compliant
Integrated 2D video controller on PCI-
E x1
Optional Intel® Remote Management Module 4
(RMM4) Lite only or Intel® Remote
Management Module 4 (RMM4)
—
Security
TPM module connector
TPM module connector
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2.2 Server Board Layout
Figure 1. Intel® Server Board S1200BTL Picture
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5
Figure 2. Intel® Server Board S1200BTS Picture
2.2.1 Server Board Connector and Component Layout
The following figure shows the board layout of the server board. Each connector and major
component is identified by a number or letter, and Table 2 provides the description.
2.2.2 Intel® Server Board S1200BTL Mechanical Drawings
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Figure 5. Intel® Server Board S1200BTL – Hole and Component Positions
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Figure 6. Intel® Server Board S1200BTL – Major Connector Pin Location (1 of 2)
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Figure 7. Intel® Server Board S1200BTL – Major Connector Pin Location (2 of 2)
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Figure 8. Intel® Server Board S1200BTL – Primary Side Keepout Zone
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Figure 9. Intel® Server Board S1200BTL – Secondary Side Keepout Zone
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A
Serial Port A
C
NIC Port 1 (1 Gb) and Dual USB Port
Connector
B
Video
D
NIC port 2 (1 Gb) and Dual USB Port
Connector
2.2.3 Server Board Rear I/O Layout
The following figure shows the layout of the rear I/O components for the server board.
Figure 10. Intel® Server Board S1200BT Rear I/O Layout
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15
PCIe Gen2 x4
x4 DMI Gen2
4
12
FLASHFLASH
LPC
Notes:
Dual GbE
RMII
SATA 3G
FLASHFLASH
BMC Boot
Flash
Intel® C204
Ch ACh B
DDR3 (Channel B)
PCIe Gen2 x8
XDP
PCIe Gen1 x1
PCIe Gen2 x4
SPI
GLCI
USB 2.0
Slot 6
(PCIe Gen1 x1 in physical)
optional
on-board
4 Unbuffered
DIMMs
GbE
GbE
USB
1.1
USB
2.0
22
DDR3 (Channel A)
Lewisville
GbE
PHY
USB
RGMII
(x16 connector)
SERIAL 2
RMM4 Dedicated
NIC Module
2
2
SATA 6G
Mezzanine Module
GbE
Hartwell
2
USB
TPM
BIOS Flash
PCIe Gen1 x1
DDR3
PCIe Gen2 x4
PCIe Gen2 x4
Slot 5
Knoxvill
SocketH2
Intel® Xeon®
Processor
E3-1200
Slot 4
(x8 connector)
(x8 connector)
Slot 3
PCI 32/33
(x8 connector)
Slot 1
Intel® Server Board S1200BTL Block Diagram
ATX - 12" x 9.6"
PCI
Internal USB
Header x2
I/O Module
Rear I/O USB
Ports x2
Type-A
Header
Zoar
SERIAL 1VIDEO
Rear I/O
VGA Port
Rear I/O
COM Port
Internal
Header
SATA-III
0
1
4
5
2
3
SATA-II
BMC
1. Video integrated into BMC.
A1 A0 B1 B0
SPI
SPI
RMM4 LITE
Module
3. Functional Architecture
The architecture and design of the Intel® Server Board S1200BT is based on the Intel
®
C202
Chipset. The chipset is designed for systems based on the Intel® Xeon® processor in the FCLGA 1155 socket package.
The Intel® Server Board S1200BTL uses Intel® C204 Chipset and the Intel® Server Board
S1200BTS uses Intel® C202 Chipset.
The Intel® Xeon® Processor E3-1200 Series are made up of multi-core processors based on the
32nm processor technology. The Intel® Core™ Processor i3-2100 is made up of dual-core
processors based on the 32nm processor technology.
This chapter provides a high-level description of the functionality associated with each chipset
component and the architectural blocks that make up the server board.
Revision 1.0
Figure 11. Intel® Server Board S1200BTL Functional Block Diagram
Intel order number G13326-003
Functional Architecture Intel® Server Board S1200BT TPS
16
PCIe Gen2 x4
x4 DMI Gen2
12
FLASHFLASH
LPC
Dual GbE
Cougarpoint
Ch ACh B
DDR3 (Channel B)
PCIe Gen2 x8
XDP
PCIe Gen1 x1
SPI
GLCI
USB 2.0
Slot 7
(PCIe Gen1 x1 in physical)
TPM
Header
4 Unbuffered
DIMMs
GbE
GbE
22
DDR3 (Channel A)
Lewisville
GbE
PHY
USB
(x16 connector)
6
SATA 3G
GbE
Hartwell
2
USB
TPM
MEM
VTT
MEM VRD 12.0
BIOS Flash
Misc
VRs
PCIe Gen2 x8
Slot 6
Knoxvill
SocketH2
Intel® Xeon®
Processor
E3-1200
(x8 connector)
Slot 5
(x8 connector)
Slot 4
Intel® Server Board S1200BTS Block
Diagram
ATX – 9.6" x 9.6"
PCI
Internal USB
Header x2
Rear I/O USB
Ports x2
Type-A
Header
SERIAL 1
VIDEO
Rear I/O
VGA Port
Rear I/O
COM Port
SATA-II
0
1
4
5
2
3
A1 A0 B1 B0
VTT
VPLL
VSA
VRD 12.0
VCORE
SERIAL 2
Internal
Header
SM712
PCI 32/33
SIO
W83627DHGP
Figure 12. Intel® Server Board S1200BTS Functional Block Diagram
3.1 Processor Sub-System
The Intel® Server Board S1200BT supports the following processor:
Intel
Intel
The Intel® Xeon® Processor E3-1200 Series are made up of multi-core processors based on the
32 nm processor technology. Intel® Core™ Processor i3-2100 Series are made up of dual-core
processors based on the 32nm processor technology.
3.1.1 Intel® Xeon® Processor E3-1200 Series
The Intel® Xeon® Processor E3-1200 Series highly integrated solution variant is composed of
quad processor cores.
FC-LGA 1155 socket package with 2.5 GT/s.
Up to 95 W Thermal Design Power (TDP); processors with higher TDP are
not supported.
®
Xeon® Processor E3-1200 Series.
®
Core™ Processor i3-2100 Series
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The server board does not support previous generations of the Intel® Xeon® processors. The
list of supported processors may be found at http://serverconfigurator.intel.com.
Note: The workstation processor is not supported in this platform.
3.1.2 Intel® Core™ Processor i3-2100 Series
The Intel® Core™ Processor i3-2100 Series highly integrated solution variant is composed of
Duo cores.
FC-LGA 1155 socket package with 2.5 GT/s.
Up to 65 W Thermal Design Power (TDP); processors with higher TDP are
not supported.
The server board does not support previous generations of the Intel® Core™ Processor
i3 Series.
The list of supported processors may be found at http://serverconfigurator.intel.com.
3.1.3 Intel® Turbo Boost Technology
Intel® Turbo Boost Technology is featured on certain processors in the Intel® Xeon® Processor
E3-1200 Series. Intel® Turbo Boost Technology opportunistically and automatically allows the
processor to run faster than the marked frequency if the processor is operating below power,
temperature, and current limits. This results in increased performance for both multi-threaded
and single-threaded workloads.
Intel® Turbo Boost Technology operation:
Turbo Boost operates under Operating System control – It is only entered when the
operating system requests the highest (P0) performance state.
Turbo Boost operation can be enabled or disabled in BIOS Setup.
Turbo Boost converts any available power and thermal headroom into a higher
frequency on active cores. At nominal marked processor frequency, many applications
consume less than the rated processor power draw.
Turbo Boost availability is independent of the number of active cores.
Maximum Turbo Boost frequency depends on the number of active cores and varies by
processor configuration.
The amount of time the system spends in Turbo Boost operation depends on workload,
operating environment, and platform design.
If the processor supports the Intel® Turbo Boost Technology feature, the BIOS Setup provides
an option to enable or disable this feature. The default state is enabled.
3.2 Memory Subsystem
The Intel® Xeon® Processor E3-1200 series or Intel® Core™ Processor i3-2100 has an
Integrated Memory Controller (IMC) in its package. Each processor produces up to two DDR3
channels of memory. Each DDR3 channel in the IMC supports up to two UDIMM slots. The
DDR3 UDIMM frequency can be 1066/1333 MHz. Only ECC memory is supported on
this platform.
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Functional Architecture Intel® Server Board S1200BT TPS
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The memory channels are named as ―Channel A‖ and ―Channel B‖.
The memory slots are named as ―Slot1‖ and ―Slot2‖ on each channel. Slot1will be the
farthest from the processor socket.
DIMMs are named to reflect the channel and slot in which they are installed:
o Channel A, Slot1 is ―DIMM_A1‖.
o Channel A, Slot2 is ―DIMM_A2‖.
o Channel B, Slot1 is ―DIMM_B1‖.
o Channel B, Slot2 is ―DIMM_B2‖.
3.2.1 Memory Supported
The Intel® Server Board S1200BT family supports various DDR3 DIMM modules of different
types and sizes and speeds.
In this section, the statements of support are subject to qualification in two ways:
For S1200 Server Boards with an SNB-DT processor, the Server Board and the BIOS
may support:
DIMMs composed of Dynamic Random Access Memory (DRAM) chips using 1 Gb, 2
Gb, or 4 Gb technology
DIMMs using x8 DRAM technology only
DIMMs organized as Single Rank (SR) or Dual Rank (DR)
DIMM sizes of 1 GB, 2 GB, 4 GB, or 8 GB
DIMM speeds of 1066 or 1333 MT/s (megatransfers/second)
Only Unregistered (Unbuffered) DIMMs (UDIMMs) are supported
Only Error Correction Code (ECC) enabled DIMMs are supported
UDIMMs may or may not have thermal sensors
Note: UDIMMs must be ECC, and may or may not have thermal sensors.
S1200BT BIOS has the following limitations:
No support for LV DIMMs
No support for RDIMMs
All channels in a system will run at the fastest common frequency
Mixing ECC and non-ECC UDIMMs anywhere on the platform is not supported
Static Closed Loop Thermal Throttling (CLTT) supported via BMC (requires ECC DIMMs
with thermal sensor)
3.2.2 Post Error Codes
The range {0xE0 - 0xEF} of POST codes is used for memory errors in early POST. In late
POST, this same range of POST code values is used for reporting other system errors.
0xE8 - No Usable Memory Error: If no usable memory is available, the BIOS emits a
beep code and displays POST Diagnostic LED code 0xE8 and halts the system.
Revision 1.0
Intel order number G13326-003
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