INTEL D815BN User Manual

Intel® Desktop Board D815BN

Technical Product Specification

September 2000

Order Number A29192–001

The Intel® Desktop Board D815BN may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board D815BN Specification Update.

Revision History

Revision Revision History Date

-001 First release of the Intel® Desktop Board D815BN Technical Product Specification

This product specification applies to only standard D815BN boards with BIOS identifier BN81510A.86A.

Changes to this specification will be published in the Intel Desktop Board D815BN Specification Update before being incorporated into a revision of this document.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERM S AND CONDITIONS OF SALE F OR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANT I ES RELATING TO FITN ESS FOR A PARTICULAR PURPOSE, MERCHANT ABILITY, OR INFRI NGE M ENT OF ANY PATENT, COP YRIGHT, OR OTHER INTELLE CT UA L PROPERTY RIGHT.

Intel Corporation may have patents or pending patent applications , trademarks, copyright s, or other intellectual propert y rights that relate to t he pres ented subject matter. The f urni shing of documents and other materi al s and information does not provide any license, express or implied, by estoppel or otherwise, to any suc h patents, trademarks, copyrights, or other intellectual property rights.

Intel products are not int ended f or use in medical, life saving, or life sustaini ng appl i c ations or for any other applicati on i n which the failure of the Intel product could create a situation where personal injury or death may occur.

Intel may make changes t o specifications, produc t descriptions, and plans at any time, without noti ce. The Intel

deviate from published spec i fications. Current charac terized errata are available on request. Contact your local Int el sales office or your distributor to obtain the latest specifications before placing your product order. Copies of documents whic h have an ordering number and are referenc ed in this docum ent, or other Intel lit erature, may be

obtained from:

†

Desktop Board D815BN may cont ain design defects or errors known as errata whic h may cause t he product to

Intel Corporation P.O. Box 5937 Denver, CO 80217-9808

or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708-296-9333.

Third party brands and names are the property of their respective owners.

September 2000

Preface

This Technical Product Specification (TPS) specifies the board layout, components, connectors,

power and environmental requirements, and the BIOS for the Intel describes the standard product and available manufacturing options.

Intended Audience

The TPS is intended to provide detailed, technical information about the D815BN board and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

Chapter Description

1 A description of the hardware used on the D815BN board 2 A map of board resources 3 The features supported by the BIOS Setup program 4 The contents of the BIOS Setup program’s menus and submenus

5 A description of the BIOS error messages, beep codes, power-on self-test (POST)

codes, and diagnostic LEDs

Desktop Board D815BN. It

Typographical Conventions

This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

✏

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

WARNING

Warnings indicate conditions, which if not observed, can cause personal injury.

iii

Intel Desktop Board D815BN Technical Product Specification

Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#) (NxnX) When used in the description of a component, N indicates component type, xn are the relative

coordinates of its location on the D815BN board, and X is the instance of the particular part at that general location. For example, J6A3 is a connector, located at 6A. It is the first

connector in the 6A area. GB Gigabyte (1,073,741,824 bytes) KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) kbits/sec 1000 bits per second MB Megabyte (1,048,576 bytes) MB/sec Megabytes per second Mbit Megabit (1,048,576 bits) Mbit/sec Megabits per second xxh An address or data value ending with a lowercase h indicates a hexadecimal value. x.x V Volts. Voltages are DC unless otherwise specified.

†

This symbol is used to indicate third-party brands and names that are the property of their

respective owners.

1 Product Description

1.1 Overview....................................................................................................................12

1.1.1 Feature Summary ........................................................................................12

1.1.2 Manufacturing Options.................................................................................13

1.1.3 D815BN Board Layout .................................................................................14

1.1.4 Block Diagram..............................................................................................15

1.2 Online Support ...........................................................................................................16

1.3 Design Specifications .................................................................................................16

1.4 Processor...................................................................................................................19

1.5 System Memory .........................................................................................................20

1.6 Intel

1.7 I/O Controller..............................................................................................................25

1.8 Graphics Subsystem ..................................................................................................27

1.9 Audio Subsystem (Optional).......................................................................................31

1.10 LAN Subsystem (Optional).........................................................................................33

1.11 Hardware Management Subsystem............................................................................35

1.12 Power Management ...................................................................................................36

815 Chipset.......................................................................................................22

1.6.1 Intel

1.6.2 Intel

1.6.3 Intel

82815 Graphics and Memory Controller Hub (GMCH)........................23

82801AA I/O Controller Hub (ICH)......................................................23

82802AB 4 Mbit Firmware Hub (FWH)...............................................25

1.7.1 Serial Port....................................................................................................26

1.7.2 Parallel Port..................................................................................................26

1.7.3 Diskette Drive Controller ..............................................................................26

1.7.4 Keyboard and Mouse Interface ....................................................................26

1.8.1 Integrated Graphics Controller.....................................................................27

1.8.2 Digital Video Output (DVO) Connector.........................................................30

1.8.3 AGP Universal Connector ............................................................................30

1.1.1 AD1885 Audio Codec...................................................................................31

1.1.2 Audio Connectors.........................................................................................32

1.10.1 Intel

82559 PCI LAN Controller ..................................................................33

1.10.2 LAN Subsystem Software ............................................................................34

1.10.3 RJ-45 LAN Connector LEDs.........................................................................34

1.11.1 Hardware Monitor Component (Optional).....................................................35

1.11.2 Chassis Intrusion Detect Connector.............................................................35

1.11.3 Fan Control and Monitoring..........................................................................35

1.12.1 Software Support.........................................................................................36

1.12.2 Hardware Support........................................................................................39

2 Technical Reference

2.1 Introduction.................................................................................................................45

2.2 Memory Map..............................................................................................................45

2.3 I/O Map ......................................................................................................................46

2.4 DMA Channels...........................................................................................................48

Intel Desktop Board D815BN Technical Product Specification

2.5 PCI Configuration Space Map....................................................................................48

2.6 Interrupts....................................................................................................................49

2.7 PCI Interrupt Routing Map ..........................................................................................49

2.8 Connectors.................................................................................................................51

2.8.1 Back Panel Connectors................................................................................52

2.8.2 Audio, Video, Power, and Hardware Control Connectors.............................56

2.8.3 Add-in Board and Peripheral Interface Connectors......................................60

2.8.4 External I/O Connectors...............................................................................65

2.9 Jumper Block..............................................................................................................69

2.10 Mechanical Considerations.........................................................................................71

2.10.1 Form Factor .................................................................................................71

2.10.2 I/O Shield.....................................................................................................72

2.11 Electrical Considerations............................................................................................73

2.11.1 Power Consumption.....................................................................................73

2.11.2 Add-in Board Considerations........................................................................73

2.11.3 Standby Current Requirements....................................................................74

2.11.4 Fan Connector Current Capability................................................................75

2.11.5 Power Supply Considerations ......................................................................76

2.12 Thermal Considerations..............................................................................................77

2.13 Reliability....................................................................................................................78

2.14 Environmental ............................................................................................................79

2.15 Regulatory Compliance..............................................................................................80

2.15.1 Safety Regulations.......................................................................................80

2.15.2 EMC Regulations .........................................................................................80

2.15.3 Certification Markings...................................................................................81

3 Overview of BIOS Features

3.1 Introduction.................................................................................................................83

3.2 BIOS Flash Memory Organization..............................................................................84

3.3 Resource Configuration ..............................................................................................84

3.3.1 PCI Autoconfiguration..................................................................................84

3.3.2 PCI IDE Support...........................................................................................84

3.4 System Management BIOS (SMBIOS).......................................................................85

3.5 USB Legacy Support..................................................................................................85

3.6 BIOS Updates ............................................................................................................86

3.6.1 Language Support........................................................................................86

3.6.2 Custom Splash Screen.................................................................................86

3.7 Recovering BIOS Data...............................................................................................87

3.8 Boot Options...............................................................................................................87

3.8.1 CD-ROM and Network Boot.........................................................................87

3.8.2 Booting Without Attached Devices...............................................................88

3.9 Fast Booting Systems with I nt el

3.9.1 Peripheral Selection and Configuration........................................................88

3.9.2 BIOS Settings...............................................................................................88

3.9.3 Operating System ........................................................................................89

3.10 BIOS Security Features..............................................................................................90

Rapid BIOS Boot....................................................88

4 BIOS Setup Program

4.1 Introduction.................................................................................................................91

4.2 Maintenance Menu.....................................................................................................92

4.2.1 Extended Configuration Submenu................................................................93

4.3 Main Menu..................................................................................................................94

4.4 Advanced Menu..........................................................................................................95

4.4.1 PCI Configuration Submenu.........................................................................96

4.4.2 Boot Configuration Submenu.......................................................................97

4.4.3 Peripheral Configuration Submenu...............................................................98

4.4.4 IDE Configuration Submenu.......................................................................100

4.4.5 Diskette Configuration Submenu................................................................ 103

4.4.6 Event Log Configuration Submenu.............................................................104

4.4.7 Video Configuration Submenu....................................................................105

4.5 Security Menu..........................................................................................................106

4.6 Power Menu.............................................................................................................107

4.7 Boot Menu................................................................................................................108

4.7.1 IDE Drive Configuration Submenu..............................................................109

4.8 Exit Menu.................................................................................................................110

Contents

5 Error Messages and Beep Codes

5.1 BIOS Error Messages...............................................................................................111

5.2 Port 80h POST Codes ..............................................................................................113

5.3 Bus Initialization Checkpoints...................................................................................117

5.4 Speaker....................................................................................................................118

5.5 BIOS Beep Codes....................................................................................................118

5.6 Diagnostic LEDs.......................................................................................................120

Figures

1. D815BN Board Components......................................................................................14

2. Block Diagram............................................................................................................15

3. Intel 815 Chipset Block Diagram.................................................................................22

4. Block Diagram of Audio Subsystem............................................................................31

5. Location of Standby Power LED.................................................................................42

6. Back Panel Connectors..............................................................................................52

7. Audio, Video, Hardware Control, and Fan Connectors ...............................................56

8. Add-in Board and Peripheral Interface Connectors.....................................................60

9. External I/O Connectors.............................................................................................65

10. Location of the Jumper Block.....................................................................................69

11. D815BN Board Dimensions........................................................................................71

12. I/O Shield Dimensions................................................................................................72

13. Localized High Temperature Zones............................................................................77

14. Diagnostic LEDs.......................................................................................................120

vii

Intel Desktop Board D815BN Technical Product Specification

Tables

1. Feature Summary.......................................................................................................12

2. Manufacturing Options ...............................................................................................13

3. Specifications.............................................................................................................16

4. Supported Processors................................................................................................19

5. Supported Memory Configurations.............................................................................21

6. Supported Graphics Refresh Frequencies..................................................................28

7. LAN Connector LED States........................................................................................34

8. Effects of Pressing the Power Switch.........................................................................37

9. Power States and Targeted System Power................................................................38

10. Wake Up Devices and Events....................................................................................39

11. Fan Connector Descriptions.......................................................................................40

12. System Memory Map..................................................................................................45

13. I/O Map 46

14. DMA Channels...........................................................................................................48

15. PCI Configuration Space Map....................................................................................48

16. Interrupts....................................................................................................................49

17. PCI Interrupt Routing Map ..........................................................................................50

18. PS/2 Mouse/Keyboard Connectors.............................................................................53

19. LAN Connector...........................................................................................................53

20. USB Connectors.........................................................................................................53

21. VGA Port Connector...................................................................................................54

22. Parallel Port Connector...............................................................................................54

23. Serial Port Connector.................................................................................................54

24. Audio Line Out Connector ..........................................................................................55

25. Audio Line In Connector.............................................................................................55

26. Mic In Connector ........................................................................................................55

27. Telephony Connector, ATAPI-style (J2C1)................................................................57

28. Auxiliary Line In Connector, ATAPI-style (J1C1)........................................................57

29. CD-ROM Connector, ATAPI (J2C2)...........................................................................57

30. CD-ROM Connector, Legacy-style 2-mm (J2C3)........................................................57

31. Digital Video Out Connector (J3E1)............................................................................58

32. Processor Fan Connector (J3K1) ...............................................................................58

33. Power Connector (J8H1)............................................................................................58

34. Chassis Intrusion Connector (J6A1)...........................................................................59

35. Chassis Fan Connector (J8A1)...................................................................................59

36. PCI Bus Connectors (J4A1, J4B1, J4C1) ...................................................................61

37. AGP Universal Connector (J5D1)...............................................................................62

38. Diskette Drive Connector (J7J1).................................................................................63

39. PCI IDE Connectors (J8E2, Primary and J8E1, Secondary).......................................64

40. SCSI Hard Drive Activity LED Connector (J7A1)........................................................66

41. Front Panel USB Connector (J8B1)............................................................................66

42. Front Panel Connector (J9C1)....................................................................................67

43. States for a Single-colored Power LED.......................................................................67

44. States for a Dual-colored Power LED.........................................................................68

45. Auxiliary Front Panel Power LED Connector (J8C1)...................................................68

46. BIOS Setup Configuration Jumper Settings (J6A3) ....................................................70

viii

Contents

47. Power Usage For Board with Audio and Onboard LAN..............................................73

48. Standby Current Requirements..................................................................................74

49. Thermal Considerations for Components...................................................................78

50. D815BN Board Environmental Specifications.............................................................79

51. Safety Regulations .....................................................................................................80

52. EMC Regulations........................................................................................................80

53. Supervisor and User Password Functions..................................................................90

54. BIOS Setup Program Menu Bar .................................................................................91

55. BIOS Setup Program Function Keys..........................................................................92

56. Maintenance Menu.....................................................................................................92

57. Extended Configuration Submenu..............................................................................93

58. Main Menu..................................................................................................................94

59. Advanced Menu..........................................................................................................95

60. PCI Configuration Submenu.......................................................................................96

61. Boot Configuration Submenu......................................................................................97

62. Peripheral Configuration Submenu.............................................................................98

63. IDE Configuration Submenu.....................................................................................100

64. Primary/Secondary IDE Master/Slave Submenus.....................................................101

65. Diskette Configuration Submenu..............................................................................103

66. Event Log Configuration Submenu...........................................................................104

67. Video Configuration Submenu..................................................................................105

68. Security Menu..........................................................................................................106

69. Power Menu.............................................................................................................107

70. Boot Menu................................................................................................................108

71. IDE Drive Configuration Submenu............................................................................109

72. Exit Menu................................................................................................................. 110

73. BIOS Error Messages...............................................................................................111

74. Uncompressed INIT Code Checkpoints....................................................................113

75. Boot Block Recovery Code Checkpoints..................................................................113

76. Runtime Code Uncompressed in F000 Shadow RAM..............................................114

77. Bus Initialization Checkpoints...................................................................................117

78. Upper Nibble High Byte Functions............................................................................117

79. Lower Nibble High Byte Functions............................................................................118

80. Beep Codes..............................................................................................................119

81. Diagnostic LED Codes..............................................................................................121

Intel Desktop Board D815BN Technical Product Specification

1 Product Description

What This Chapter Contains

1.1 Overview....................................................................................................................12

1.2 Online Support ...........................................................................................................16

1.3 Design Specifications .................................................................................................16

1.4 Processor...................................................................................................................19

1.5 System Memory .........................................................................................................20

1.6 Intel

1.7 I/O Controller..............................................................................................................25

1.8 Graphics Subsystem ..................................................................................................27

1.9 Audio Subsystem (Optional).......................................................................................31

1.10 LAN Subsystem (Optional).........................................................................................33

1.11 Hardware Management Subsystem............................................................................35

1.12 Power Management ...................................................................................................36

815 Chipset.......................................................................................................22

Intel Desktop Board D815BN Technical Product Specification

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the D815BN board’s major features.

Table 1. Feature Summary

Form Factor Processor

Memory

Chipset

I/O Control Video

Peripheral Interfaces

Expansion Capabilities

BIOS

Diagnostic LEDs Instantly Available

microATX (9.6 inches by 8.5 inches) Support for either an Intel

(FC-PGA) package or an Intel® Celeron™ processor in an FC-PGA package or a PPGA package

• Three 168-pin SDRAM Dual Inline Memory Module (DIMM) sockets

• Support for up to 512 MB system memory

• Single- or double-sided DIMMs supported

Intel® 815 chipset, consisting of:

• Intel

SMSC LPC47M142 I/O LPC bus controller

• Intel

• AGP universal connector supporting 1X, 2X, and 4X AGP cards or a Graphics

• Digital Video Output (DVO) connector

• Four Universal Serial Bus (USB) ports

• One serial port

• One parallel port

• Two IDE interfaces with Ultra DMA, ATA-33/66 support

• One diskette drive interface

• PS/2

• Three PCI bus add-in card connectors (SMBus routed to PCI bus connector 2)

• One GPA/AGP universal connector

• Intel/AMI BIOS (resident in the Intel 82802AB 4 Mbit FWH)

• Intel

• Support for Advanced Configuration and Power Interface (ACPI), Advanced

Four dual-color LEDs on the back panel

• Support for

• Suspend to RAM support

• Wake on PS/2 keyboard

82815 Graphics and Memory Controller Hub (GMCH)

82801AA I/O Controller Hub (ICH)

82802AB 4 Mbit Firmware Hub (FWH)

82815 integrated graphics support

Performance Accelerator (GPA)

†

keyboard and mouse ports

Rapid BIOS boot

Power Management (APM), Plug and Play, and SMBIOS

PCI Local Bus Specification Revision 2.2

Pentium® III processor in a Flip Chip Pin Grid Array

For information about Refer to

The board’s compliance level with ACPI, APM, Plug and Play, and SMBIOS. Section 1.3, page 16 The

PCI Local Bus Specification Revision 2.2

Section 1.3, page 16

1.1.2 Manufacturing Options

Table 2 describes the D815BN board’s manufacturing options.

Table 2. Manufacturing Options

Audio

LAN Hardware Monitor

Audio Codec ’97 (AC ’97) compatible audio subsystem, consisting on the following:

• Intel 82801AA ICH (AC link output)

• Analog Devices AD1885 analog codec

Intel

82559 LAN controller

Voltage and temperature sensing to detect out of range values

Product Description

Intel Desktop Board D815BN Technical Product Specification

1.1.3 D815BN Board Layout

Figure 1 shows the location of the major components on the D815BN board.

I J

PQ O KN

A AD1885 analog codec (optional) L IDE connectors B Intel 82559 LAN controller (optional) M Front panel power LED connector C DVO connector N Auxiliary Front panel connector D Hardware monitor (optional) O Intel 82802AB 4 Mbit Firmware Hub (FWH) E Back panel connectors P Front panel USB connector F Intel 82815 Graphics and Memory Controller

Hub (GMCH) G Processor socket R Intel 82801AA I/O Controller Hub (ICH) H DIMM sockets S AGP universal connector I Diskette drive connector T Speaker JSMSC LPC47M142 I/O controller U PCI bus add-in card connectors K Power connector

OM10735

Q Battery

Figure 1. D815BN Board Components

1.1.4 Block Diagram

Figure 2 is a block diagram of the major functional areas of the D815BN board.

Primary/

Secondary IDE

ATA-33/66

Product Description

Diagnostic

LEDs

Processor Socket

SDRAM Bus

DIMM Banks

(3)

DVO

Connector

AGP

Universal

Connector

System Bus

82815

Graphics and

Memory Controller

Hub (GMCH)

Digital video

output

AGP/Display Cache

Interface

Hardware

Monitor

(Optional)

815 Chipset

AHA

Bus

SMBus

82801AA

I/O Controller Hub

(ICH)

USB

LPC I/O

Controller

LPC

Bus

USB Port 0

USB

82802AB

Firmware Hub

(FWH)

Diskette Drive

Connector

Serial Port A

Parallel Port PS/2 Mouse

PS/2 Keyboard

USB Ports 1, 2, and 3

PCI Slot 1

PCI Slot 2

PCI Slot 3

PCI Bus

Optional

Figure 2. Block Diagram

AC Link

82559 LAN

Controller

AD1885

Analog

Codec

LAN

Connector

OM10729

Intel Desktop Board D815BN Technical Product Specification

1.2 Online Support

Find information about the Intel® D815BN board under “Product Info” or “Customer Support” at

these World Wide Web sites:

http://www.intel.com/design/motherbd http://support.intel.com/support/motherboards/desktop

Find “Processor Data Sheets” or information about “Proper Date Access in Systems with Intel Motherboards” at these World Wide Web sites:

http://www.intel.com/design/litcentr http://support.intel.com/support/year2000

Find information about the ICH addressing in the 82801AA datasheet at this World Wide Web site:

http://developer.intel.com/design/chipsets/datashts/

1.3 Design Specifications

Table 3 lists the specifications applicable to the D815BN board.

Table 3. Specifications

Reference Name

AC ‘97

ACPI

AGP

AMI BIOS

APM

ATA-3

Specification Title

Audio Codec ‘97

Advanced Configuration and Power Interface Specification

Accelerated Graphics Port Interface Specification

American Megatrends BIOS Specification

Advanced Power Management BIOS Interface Specification

Information Technology AT Attachment-3 Interface, X3T10/2008D

Version, Revision Date, and Ownership

Version 2.1, May 1998, Intel Corporation.

Version 1.0b, February 8, 1999, Intel Corporation, Microsoft Corporation, and Toshiba Corporation.

Version 2.0, May 4, 1998, Intel Corporation.

AMIBIOS 99, 1999 American Megatrends, Inc.

Version 1.2, February 1996, Intel Corporation, Microsoft Corporation.

Version 6, October 1995, ASC X3T10 Technical Committee.

The information is

available from…

http://developer.intel.com/ial/ scalableplatforms/audio/ index.htm

http://www.teleport.com/~acpi/

Accelerated Graphics Implementers Forum at: http://www.agpforum.org/

http://www.amibios.com (Select AMIBIOS, then Desktops)

http://www.microsoft.com/ hwdev/busbios/amp_12.htm

ATA Anonymous FTP Site: ftp://www.dt.wdc.com/ata/ ata-3/

continued

Table 3. Specifications (continued)

Reference Name

ATAPI

ATX

BIS

EPP

El Torito

GPA (formerly AIMM)

LPC

microATX

Plug and Play

Specification Title

Information Technology AT Attachment with Packet Interface Extensions T13/1153D

ATX Specification

Boot Integrity Services Application Programming Interface

Enhanced Parallel Port IEEE std 1284.1-1997

Bootable CD-ROM Format Specification

AGP Inline Memory Module

Low Pin Count Interface Specification

microATX Motherboard Interface Specification

SFX Power Supply Design Guide

PCI Local Bus Specification

PCI Bus Power Management Interface Specification

Plug and Play BIOS Specification

Version, Revision Date and Ownership

Version 18, August 19, 1998, Contact: T13 Chair, Seagate Technology.

Version 2.01, February 1997, Intel Corporation.

Version 1.0, December 28, 1998, Intel Corporation.

Version 1.7, 1997, Institute of Electrical and Electronic Engineers.

Version 1.0, January 25, 1995, Phoenix Technologies Ltd., and IBM Corporation.

Version 1.0, April 2000, Intel Corporation

Version 1.0, September 29, 1997, Intel Corporation.

Version 1.0, December 1997, Intel Corporation.

Version 1.1, February 1998, Intel Corporation.

Version 2.2, December 18, 1998, PCI Special Interest Group.

Version 1.1, December 18, 1998, PCI Special Interest Group.

Version 1.0a, May 5, 1994, Compaq Computer Corp., Phoenix Technologies Ltd., and Intel Corporation.

Product Description

The information is

available from…

T13 Anonymous FTP Site: ftp://fission.dt.wdc.com/ x3t13/project/ d1153r18.pdf

http://developer.intel.com/ design/motherbd/atx.htm

http://developer.intel.com/ ial/wfm/wfmspecs.htm

http://standards.ieee.org/ reading/ieee/std_public/ description/busarch/

1284.1-1997_desc.html http://www.ptltd.com/

products/specs-cdrom.pdf

http://developer.intel.com/ technology/memory/ aimm/index.htm

Intel document order number 298177-004

http://www.intel.com/ design/chipsets/industry/ lpc.htm

http://www.teleport.com/ ~ffsupprt/spec/ microatxspecs.htm

ftp://download.intel.com/ support/motherboards/ microatx/SFX_PS.PDF

http://www.pcisig.com/PCI

http://www.pcisig.com/

http://www.microsoft.com/ hwdev/respec/ pnpspecs.htm

continued

Intel Desktop Board D815BN Technical Product Specification

Table 3. Specifications (continued)

Reference Name

PXE

SDRAM

SMBIOS

UHCI

USB

WfM

Specification Title

Preboot Execution Environment Specification

PC SDRAM Unbuffered DIMM Specification

PC SDRAM Specification

PC SDRAM DIMM Serial Presence Detect (SPD) Specification

System Management BIOS Reference Specification

Universal Host Controller Interface Design Guide

Universal Serial Bus Specification

Wired for Management Baseline

Version, Revision Date and Ownership

Version 2.1, September 1999, Intel Corporation (with contributions from SystemSoft Corporation).

Revision 1.0, February 1998, Intel Corporation.

Revision 1.7, November 1999, Intel Corporation.

Revision 1.2B, November 1999 Intel Corporation.

Version 2.3.1, March 16, 1999 American Megatrends Inc., Award Software International Inc., Compaq Computer Corporation, Dell Computer Corporation, Hewlett-Packard Company, Intel Corporation, International Business Machines Corporation, Phoenix Technologies Limited, and SystemSoft Corporation.

Version 1.1, March 1996, Intel Corporation.

Version 1.1, September 23, 1998, Compaq Computer Corporation, Intel Corporation, Microsoft Corporation, and NEC.

Version 2.0, December 18, 1998, Intel Corporation.

The information is

available from…

http://developer.intel.com/ ial/WfM/wfmspecs.htm

http://developer.intel.com/ technology/memory/ pcsdram/spec/index.htm

http://developer.intel.com/ ial/WfM/wfm20/design/ smbios

http://developer.intel.com/ design/USB/UHCI11D.htm

http://www.usb.org/ developers

http://developer.intel.com/ ial/WfM/wfmspecs.htm

Product Description

1.4 Processor

CAUTION

The D815BN board supports processors that have a 19.4 A maximum current draw with a 1.65 to

2.0 V core voltage. Using a processor not in compliance with the above guidelines can damage

the processor, the D815BN board, and the power supply. See the processor’s data sheet for voltage and current usage requirements.

The D815BN board supports a single Pentium III or Celeron processor. The system bus speed is automatically selected. The D815BN board supports the processors listed in Table 4.

Table 4. Supported Processors

Type Designation System Bus Frequency L2 Cache Size

an FC-PGA package

Celeron processor in an FC-PGA package

Celeron processor in a PPGA package

533EB, 600EB, 667, 733, 800B, 866, 933, and 1.0

500E, 550E, 600E, 650, 700, 750, 800, and 850

533A, 566, 600, 633, 667, and 700

500 and 533 66 MHz 128 KB

133 MHz 256 KBPentium III processor in

100 MHz 256 KB

66 MHz 128 KB

All supported onboard memory can be cached, up to the cachability limit of the processor. See the

processor’s data sheet for cachability limits.

For information about Refer to

Processor support Section 1.2, page 16 Processor data sheets Section 1.2, page 16

Intel Desktop Board D815BN Technical Product Specification

1.5 System Memory

The D815BN board has three DIMM sockets and supports the following memory features:

• 3.3 V (only) 168-pin SDRAM DIMMs with gold-plated contacts

• Unbuffered single- or double-sided DIMMs

• Maximum system memory: 512 MB; minimum system memory: 32 MB

• 133 MHz SDRAM or 100 MHz SDRAM

• Serial Presence Detect (SPD) and non-SPD memory

• Non-ECC and ECC DIMMs (ECC DIMMs will operate in non-ECC mode only.)

• Suspend to RAM

Table 5 lists the supported DIMM configurations. In the second column of Table 5:

• “DS” refers to double-sided memory modules (containing two rows of SDRAM)

• “SS” refers to single-sided memory modules (containing one row of SDRAM)

When installing memory, note the following:

• Non-SPD DIMMs will always revert to a 100 MHz SDRAM bus with 3-3-3 timing.

• Mixing non-SPD DIMMs with SPD DIMMs will always revert to a 100 MHz SDRAM bus

with 3-3-3 timing.

• The BIOS will not initialize installed memory above 512 MB. At boot, the BIOS displays a

message indicating that any installed memory above 512 MB has not been initialized.

• Mixed memory speed configurations (133 and 100 MHz) will default to 100 MHz.

• 133 MHz SDRAM operation requires a 133 MHz system bus frequency processor.

• The board should be populated with no more than four rows of 133 MHz SDRAM (two

double-sided or one double-sided plus two single-sided DIMMs).

• 100 MHz SDRAM may be populated with six rows of SDRAM (three double-sided DIMMs).

✏ NOTE

If more than four rows of 133 MHz SDRAM are populated, the BIOS will initialize installed memory up to 512 MB at 100 MHz.

Product Description

Table 5. Supported Memory Configurations

DIMM Capacity

Number of Sides

SDRAM Density

32 MB DS 16 Mbit 2 M X 8 2 M X 8 16 32 MB SS 64 Mbit 4 M X 16 Empty 4 48 MB DS 64/16 Mbit 4 M X 16 2 M X 8 12 64 MB DS 64 Mbit 4 M X 16 4 M X 16 8 64 MB SS 64 Mbit 8 M X 8 Empty 8 64 MB SS 128 Mbit 8 M X 16 Empty 4 96 MB DS 64 Mbit 8 M X 8 4 M x 16 12 96 MB DS 128/64 Mbit 8 M X 16 4 M x 16 8 128 MB DS 64 Mbit 8 M X 8 8 M X 8 16 128 MB DS 128 Mbit 8 M X 16 8 M X 16 8 128 MB SS 128 Mbit 16 M X 8 Empty 8 128 MB SS 256 Mbit 16 M X 16 Empty 4 192 MB DS 128 Mbit 16 M X 8 8 M x 16 12 192 MB DS 128/64 Mbit 16 M X 8 8 M x 8 16 256 MB DS 128 Mbit 16 M X 8 16 M X 8 16 256 MB DS 256 Mbit 16 M X 16 16 M X 16 8 256 MB SS 256 Mbit 32 M X 8 Empty 8 512 MB DS 256 Mbit 32 M X 8 32 M X 8 16

Notes: 1 If the number of SDRAM devices is great er t han nine, the DIMM will be double sided. 2 Front side population/back si de popul ation indicated for SDRAM dens i t y and SDRAM organization.

SDRAM Organization

Front-side Back-side

Number of SDRAM Devices

(Note 1)

(Notes 1 and 2)

(Note 1)

(Notes 1 and 2)

(Notes 1 and 2) (Notes 1 and 2) (Notes 1 and 2)

(Notes 1 and 2)

CAUTION

To be fully compliant with all applicable Intel® SDRAM memory specifications, the motherboard should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. If your memory modules do not support SPD, you will see a notification to this effect on the screen at power up. The BIOS will attempt to configure the memory controller for normal operation. However, DIMMs may not function under the determined frequency.

For information about Refer to The PC Serial Presence Detect Specification Section 1.3, page 16

Intel Desktop Board D815BN Technical Product Specification

1.6 Intel® 815 Chipset

The Intel 815 chipset consists of the following devices:

• 82815 Graphics and Memory Controller Hub (GMCH) with Accelerated Hub Architecture

(AHA) bus

• 82801AA I/O Controller Hub (ICH) with AHA bus

• 82802AB Firmware Hub (FWH)

The GMCH is a centralized controller for the system bus, the memory bus, the AGP bus, and the

Accelerated Hub Architecture interface. The ICH is a centralized controller for the board’s I/O paths. The FWH provides the nonvolatile storage of the BIOS as well as hardware-dependent security features. The chipset provides the interfaces shown in Figure 3.

ATA-33/66

System Bus

SDRAM Bus

USB

815 Chipset

82815

Graphics and

Memory Controller

Hub (GMCH)

Digital video

output

Interface

AHA

Bus

AGP

82801AA

I/O Controller Hub

(ICH)

82802AB

Firmware Hub

(FWH)

LPC Bus

AC LinkPCI BusSMBus

OM10733

Figure 3. Intel 815 Chipset Block Diagram

For information about Refer to The Intel 815 chipset http://developer.intel.com The resources used by the chipset Chapter 2 The chipset’s compliance with AC ’97, ACPI, and APM Section 1.3, page 16

Product Description

1.6.1 Intel® 82815 Graphics and Memory Controller Hub (GMCH)

The GMCH provides the following:

• An integrated synchronous DRAM memory controller with autodetection of SDRAM

• An interface for a single AGP device or a Graphics Performance Accelerator (GPA) card

• An interface for a digital video output (DVO) connector for a flat panel digital CRT or

TV out

• Support for ACPI Rev 1.0 and APM Rev 1.2 compliant power management

1.6.2 Intel® 82801AA I/O Controller Hub (ICH)

The ICH provides the following:

• 33 MHz PCI bus interface with support for three PCI Local Bus Specification

Rev. 2.2-compliant slots

• Support for up to four PCI master devices

• One Advanced Graphics Port

• Low Pin Count (LPC) interface that supports an LPC-compatible I/O controller

• Support for two master/DMA devices

• Integrated IDE controller that supports Ultra DMA (33 MB/sec) and ATA-66 mode

(66 MB/sec)

• Universal Serial Bus interface with one USB controller providing two ports in a UHCI

implementation

• Power management logic for ACPI Rev 1.0b compliance

• System Management Bus (SMBus clock and data lines also routed to PCI bus connector 2)

• Real-Time Clock with 256-byte battery-backed CMOS RAM

• AC’97 digital link for Audio and telephony codecs, including:  AC’97 2.1 compliance  Logic for PCM in, PCM out, mic input, modem in, and modem out  Separate PCI functions for audio and modem

1.6.2.1 IDE Interfaces

The ICH’s IDE controller has two independent bus-mastering IDE interfaces that can be independently enabled. The IDE interfaces support the following modes:

• Programmed I/O (PIO): CPU controls data transfer.

• 8237-style DMA: DMA offloads the CPU, supporting transfer rates of up to 16 MB/sec.

• Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates

of up to 33 MB/sec.

• Ultra ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to ATA-33 and is device driver compatible. ATA-66 uses faster timings and requires a specialized cable to reduce reflections, noise, and inductive coupling.

The IDE interfaces also support ATAPI devices (such as CD-ROM drives) and ATA devices using the transfer modes listed in Table 64 on page 101.

Intel Desktop Board D815BN Technical Product Specification

The BIOS supports logical block addressing (LBA) and extended cylinder head sector (ECHS) translation modes. The drive reports the transfer rate and translation mode to the BIOS.

The D815BN board supports laser servo (LS-120) diskette technology through its IDE interfaces.

The LS-120 drive can be configured as a boot device by setting the BIOS Setup program’s Boot menu to one of the following:

• ARMD-FDD (ATAPI removable media device – floppy disk drive)

• ARMD-HDD (ATAPI removable media device – hard disk drive)

For information about Refer to

The location of the IDE connectors Figure 8, page 60 The signal names of the IDE connectors Table 39, page 64

BIOS Setup program’s Boot menu Table 70, page 108

1.6.2.2 USB

The D815BN board has four USB ports. The ICH includes a USB controller and the LPC47M142 features a USB hub and drives three USB ports. One USB peripheral can be connected to each port. For more than four USB devices, an external hub can be connected to any of the ports. Two of the USB ports are implemented with stacked back panel connectors; the other two are accessible via the front panel USB connector at location J8B1. The D815BN board fully supports UHCI and uses UHCI-compatible software drivers.

NOTE

✏

Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device or a low-speed USB device is attached to the cable. Use shielded cable that meets the requirements for full-speed devices.

For information about Refer to

The location of the USB connectors on the back panel Figure 6, page 52 The signal names of the back panel USB connectors Table 20, page 53 The location of the front panel USB connector Figure 9, page 65 The signal names of the front panel USB connector Table 41, page 66 The USB specification and UHCI Section 1.3, page 16

1.6.2.3 Real-Time Clock, CMOS SRAM, and Battery

The real-time clock provides a time-of-day clock and a multicentury calendar with alarm features. The real-time clock supports 256 bytes of battery-backed CMOS SRAM in two banks that are reserved for BIOS use.

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.

The time, date, and CMOS values can be specified in the BIOS Setup program. The CMOS values can be returned to their defaults by using the BIOS Setup program.

Product Description

✏ NOTES

If the battery and AC power fail, the last saved defaults, custom or standard, will be loaded into CMOS RAM at power-on.

The recommended method of accessing the date in systems with D815BN boards is indirectly from the Real-Time Clock (RTC) via the BIOS. The BIOS on D815BN boards contains a century checking and maintenance feature. This feature checks the two least significant digits of the year stored in the RTC during each BIOS request (INT 1Ah) to read the date and, if less than 80 (i.e., 1980 is the first year supported by the PC), updates the century byte to 20. This feature enables operating systems and applications using the BIOS date/time services to reliably manipulate the year as a four-digit value.

For information about Refer to

Proper date access in systems with D815BN boards Section 1.2, page 16

1.6.3 Intel® 82802AB 4 Mbit Firmware Hub (FWH)

The FWH provides the following:

• System BIOS

• System security and manageability logic that enables protection for storing and updating of

platform information

1.7 I/O Controller

The SMSC LPC47M142 I/O controller provides the following features:

• Low pin count (LPC) interface

• 3.3 V operation

• One serial port

• One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port

(EPP) support

• One USB hub supporting three USB ports

• Serial IRQ interface compatible with serialized IRQ support for PCI systems

• PS/2-style mouse and keyboard interfaces

• Interface for one 1.2 MB, 1.44 MB, or 2.88 MB diskette drive

• Intelligent power management, including a programmable wake up event interface

• PCI power management support

• Fan control:  Two fan tachometer inputs  Two fan control outputs

The BIOS Setup program provides configuration options for the I/O controller.

For information about Refer to

SMSC LPC47M142 I/O controller http://www.smsc.com

Intel Desktop Board D815BN Technical Product Specification

1.7.1 Serial Port

The D815BN board has one serial port, which is located on the back panel. The serial port’s NS16C550-compatible UART supports data transfers at speeds up to 115.2 kbits/sec with BIOS support. The serial port can be assigned as COM1 (3F8h), COM2 (2F8h), COM3 (3E8h), or COM4 (2E8h).

For information about Refer to

The location of the serial port connector Figure 6, page 52 The signal names of the serial port connector Table 23, page 54

1.7.2 Parallel Port

The connector for the multimode bidirectional parallel port is a 25-pin D-sub connector located on the back panel. In the BIOS Setup program, the parallel port can be configured for the following:

†

• Output only (PC AT

• Bi-directional (PS/2 compatible)

• EPP

• ECP

-compatible mode)

For information about Refer to

The location of the parallel port connector Figure 6, page 52 The signal names of the parallel port connector Table 22, page 54

1.7.3 Diskette Drive Controller

The I/O controller supports one diskette drive that is compatible with the 82077 diskette drive controller and supports both PC-AT and PS/2 modes.

For information about Refer to

The location of the diskette drive connector Figure 8, page 60 The signal names of the diskette drive connector Table 38, page 63 The supported diskette drive capacities and sizes Table 65, page 103

1.7.4 Keyboard and Mouse Interface

PS/2 keyboard and mouse connectors are located on the back panel. The +5 V lines to these

†

connectors are protected with a PolySwitch connection after an overcurrent condition is removed.

NOTE

✏

The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top PS/2 connector. Power to the computer should be turned off before a keyboard or mouse is connected or disconnected.

circuit that, like a self-healing fuse, reestablishes the

Product Description

The keyboard controller contains the AMI keyboard and mouse controller code, provides the keyboard and mouse control functions, and supports password protection for power-on/reset. A power-on/reset password can be specified in the BIOS Setup program.

For information about Refer to

The location of the keyboard and mouse connectors Figure 6, page 52 The signal names of the keyboard and mouse connectors Table 18, page 53

1.8 Graphics Subsystem

The 815 chipset supports three graphics options: using the integrated GMCH graphics controller, using an add-in AGP adapter, or using an add-in PCI adapter.

When using the GMCH graphics controller, a Graphics Performance Accelerator (GPA) card can be installed (in the AGP connector) for enhanced 2D and 3D graphics performance. The GPA card has a 32-bit 133 MHz SDRAM display cache; which is controlled by the GMCH graphics memory controller.

When an add-in AGP adapter is installed, the GMCH graphics controller is disabled.

For information about Refer to

GPA card support Section 1.8.3.1, page 30

1.8.1 Integrated Graphics Controller

The GMCH features the following:

• Integrated graphics controller  3D hyper-pipelined architecture  Full 2D hardware acceleration  Motion video acceleration

• 3D graphics visual and texturing enhancement

• Display  Integrated 24-bit 230 MHz RAMDAC  Compliant with Display Data Channel Standard, Version 3.0, Level 2B protocol

• Video  Hardware motion compensation for software MPEG2 decode  Software DVD at 30 fps

• Integrated graphics memory controller

Intel Desktop Board D815BN Technical Product Specification

Table 6 lists the refresh frequencies supported by the graphics subsystem.

Table 6. Supported Graphics Refresh Frequencies

Available Refresh

Resolution Color Palette

320 x 200

320 x 240

352 x 480

352 x 576

400 x 300

512 x 384

640 x 400

640 x 480

640 x 480 16 M colors 60, 70, 72, 75, 85 KDO 800 x 600

1024 x 768

256 colors 70 64 K colors 70 D3 16 M colors 70 D

256 colors 70 64 K colors 70 D3 16 M colors 70 D 256 colors 60, 70, 72, 75, 85 KDO 64 K colors 60, 75, 85 KD3O 64 K colors 70, 72 KDO

256 colors 60, 70, 72, 75, 85 KDO 64 K colors 60, 70, 72, 75, 85 KD3O 16 M colors 60, 70, 72, 75, 85 KDO 256 colors 60, 70, 75, 85 KDO 64 K colors 60, 70, 75 KD3O 64 K colors 85 KD3 16 M colors 60, 70, 75, 85 KD

Frequencies (Hz) Notes

continued

Table 6. Supported Graphics Refresh Frequencies (continued)

Available Refresh

Resolution Color Palette

1152 x 864

256 colors 60, 70, 72, 75 KDO 256 colors 85 KD 64 K colors 60, 70 KD3O 64 K colors 72, 75, 85 KD3 16 M colors 60 KDO 16 M colors 75, 85 KD

1280 x 768

256 colors 60 (reduced blanking) KDOF 64 K colors 60 (reduced blanking) KD3F 16 M colors 60 (reduced blanking) KDF

1280 x 1024

256 colors 60 KDO 256 colors 70, 72, 75, 85 KD 64 K colors 60, 70, 72, 75, 85 KD3 16 M colors 60, 70, 75, 85 KD

1600 x 1200

Notes: K = Desktop

D = DirectDraw 3 = Direct3D† and OpenGL O = Overlay F = Digital Display Device only. A mode will be support ed on bot h analog CRTs and digital display devices (the KD3O flags above apply to both types of displays ), unless indicated otherwis e.

256 colors

†

Frequencies (Hz) Notes

60, 70, 72, 75 KD

Product Description

For information about Refer to

Obtaining graphics software and utilities Section 1.2, page 16

Intel Desktop Board D815BN Technical Product Specification

1.8.2 Digital Video Output (DVO) Connector

The board routes the Intel 82815 GMCH DVO port to an onboard 40-pin DVO connector. When a Digital Visual Interface (DVI) or TV out card is installed in a back panel slot and cabled to the DVO connector, the system supports DVI-compliant digital displays or TV out functionality. Use of the DVO connector requires use of the onboard GMCH graphics controller.

For information about Refer to

The location of the DVO connector Figure 7, page 56 The signal names of the DVO connector Table 31, page 58

1.8.3 AGP Universal Connector

The AGP universal connector supports either:

• A GPA card with 133 MHz SDRAM display cache

• An AGP add-in card with 3.3 V or 1.5 V I/O

NOTE

✏

The cable connectors inserted in the ATAPI connectors may interfere with the installation of some AGP cards. This is due to the location of the ATAPI connectors and depends on the AGP card layout. Interference does not occur when using the legacy-style 2-mm CD ROM connector.

For information about Refer to

The location of the AGP universal connector Figure 8, page 60 The signal names of the AGP universal connector Table 37, page 62

1.8.3.1 Graphics Performance Accelerator (GPA) Card Support

The BIOS detects if a GPA card is present in the AGP connector and initializes up to 4 MB of display cache on the card. The GMCH graphics memory controller accesses the display cache over a single channel 32-bit SDRAM interface.

✏ NOTE

In earlier documentation, the GPA card was referred to as the Add-In Memory Module (AIMM).

1.8.3.2 AGP Add-in Card Support

AGP is a high-performance interface for graphics-intensive applications, such as 3D applications. While based on the PCI Local Bus Specification, Rev. 2.1, AGP is independent of the PCI bus and is intended for exclusive use with graphical display devices. AGP overcomes certain limitations of the PCI bus related to handling large amounts of graphics data with the following features:

• Pipelined memory read and write operations that hide memory access latency

• Demultiplexing of address and data on the bus for nearly 100 percent efficiency

For information about Refer to

Obtaining the

Accelerated Graphics Port Interface Specification

Section 1.3, page 16

1.9 Audio Subsystem (Optional)

The board includes an Audio Codec ’97 (AC ’97) compatible SoundMAX† audio subsystem consisting of these devices:

• Intel 82801AA I/O Controller Hub (ICH)

• Analog Devices AD1885 analog codec

Figure 4 is a block diagram of the audio subsystem.

CD-ROM

82801AA

I/O Controller Hub

(ICH)

Figure 4. Block Diagram of Audio Subsystem

AC ’97 Link

Analog Devices

AD1885

Analog Codec

Line In

Audio In

Mic In

Modem Audio

Line Out

Telephony

OM10600

Product Description

Features of the audio subsystem include:

• Power management support for APM 1.2 and ACPI 1.0 (driver dependant)

• 3D stereo enhancement

1.9.1 AD1885 Audio Codec

The AD1885 is a fully AC ’97 compliant codec. The codec’s features include:

• PC 99 compliant:  80 dB FSA dynamic range (S/N ratio)  Playback sample rates up to 48 kHz  Frequency response: 20 Hz to 20 kHz

• 64 voice synthesizer

• Software compatible with Windows

• Full-duplex operation at asynchronous hardware record/playback sample rates

†

98 Gold and SE, Windows 2000, and Windows NT† 4.0

Intel Desktop Board D815BN Technical Product Specification

1.9.2 Audio Connectors

The audio connectors include the following:

• Legacy-style 2-mm CD-ROM

• ATAPI CD-ROM

• ATAPI-style connectors:  Telephony  Auxiliary line in

• Back panel audio connectors:  Line out  Line in  Mic in

For information about Refer to

The back panel audio connectors Section 2.8.1, page 52

CAUTION

The pins on both the legacy-style 2-mm and the ATAPI CD-ROM connectors are wired to the same inputs on the audio mixer. Do not attach CD-ROM drives to both connectors. Otherwise, the board could be damaged.

NOTE

✏

1.9.2.1 Legacy-style 2-mm CD-ROM Audio Connector

A 1 x 4-pin legacy-style 2-mm connector connects an internal CD-ROM drive to the audio mixer.

For information about Refer to

The location of the legacy-style 2-mm connector Figure 7, page 56 The signal names of the legacy-style 2-mm connector Table 30, page 57

1.9.2.2 ATAPI CD-ROM Audio Connector

A 1 x 4-pin ATAPI-style connector connects an internal ATAPI CD-ROM drive to the audio mixer.

For information about Refer to

The location of the ATAPI CD-ROM connector Figure 7, page 56 The signal names of the ATAPI CD-ROM connector Table 29, page 57

Product Description

1.9.2.3 Telephony Connector

A 1 x 4-pin ATAPI-style connector connects the monoaural audio signals of an internal telephony device to the audio subsystem. A monaural audio-in and audio-out signal interface is necessary for telephony applications such as speakerphones, fax/modems, and answering machines.

For information about Refer to

The location of the telephony connector Figure 7, page 56 The signal names of the telephony connector Table 27, page 57

1.9.2.4 Auxiliary Line In Connector

A 1 x 4-pin ATAPI-style connector connects the left and right channel signals of an internal audio device to the audio subsystem.

For information about Refer to

The location of the auxiliary line in connector Figure 7, page 56 The signal names of the auxiliary line in connector Table 28, page 57

1.10 LAN Subsystem (Optional)

The Intel 82559 Fast Ethernet Wired for Management (WfM) PCI LAN subsystem provides both 10Base-T and 100Base-TX connectivity. Features include:

• 32-bit, 33 MHz direct bus mastering on the PCI bus

• 10Base-T and 100Base-TX capability using a single RJ-45 connector with connection and

activity status LEDs

• IEEE 802.3u Auto-Negotiation for the fastest available connection

• Jumperless configuration; the LAN subsystem is completely software-configurable

For information about Refer to

The WfM specification Table 3, page 16

1.10.1 Intel® 82559 PCI LAN Controller

The Intel 82559 PCI LAN controller’s features include:

• CSMA/CD Protocol Engine

• PCI bus interface

• DMA engine for movement of commands, status, and network data across the PCI bus

• Integrated physical layer interface, including:  Complete functionality necessary for the 10Base-T and 100Base-TX network interfaces;

when in 10 Mbit/sec mode, the interface drives the cable directly

 A complete set of Media Independent Interface (MII) management registers for control

and status reporting

Intel Desktop Board D815BN Technical Product Specification

 IEEE 802.3u Auto-Negotiation for automatically establishing the best operating mode

when connected to other 10Base-T or 100Base-TX devices, whether half- or full-duplex capable

 Integrated power management features, including support for wake on network event

(from an ACPI S3 state using the PCI bus PME# signal)

For information about Refer to

The LAN subsystem’s PCI specification compl iance Section 1.3, page 16

1.10.2 LAN Subsystem Software

The Intel 82559 Fast Ethernet WfM PCI LAN software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining LAN software and drivers Section 1.2, page 16

1.10.3 RJ-45 LAN Connector LEDs

Two LEDs are built into the RJ-45 LAN connector. Table 7 describes the LED states when the board is powered up and the LAN subsystem is operating.

Table 7. LAN Connector LED States

LED Color LED State Condition

Off 10 Mbit/sec data rate is selected.Green On 100 Mbit/sec date rate is selected.

Yellow

Off LAN link is not established. On (steady state) LAN link is established. On (brighter and pulsing) The computer is communicating with another computer on

the LAN.

Product Description

1.11 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following:

• Hardware monitor (optional)

• Chassis intrusion detect connector

• Fan monitoring and control (using the SMSC LPC47M142 I/O controller)

For information about Refer to

The WfM specification Section 1.3, page 16 Fan control functions of the SMSC LPC47M142 I/O controller Section 1.11.3, page 35

1.11.1 Hardware Monitor Component (Optional)

The hardware monitor component provides low-cost instrumentation capabilities. The features of the component include:

• Internal ambient temperature sensing

• Remote thermal diode sensing for direct monitoring of processor temperature (if supported in

the processor)

• Power supply monitoring (+12 V, +5 V, +3.3 V, +2.5 V, 3.3 VSB, VCCP) to detect levels above or below acceptable values

• SMBus interface

1.11.2 Chassis Intrusion Detect Connector

The board supports a chassis security feature that detects if the chassis cover is removed and sounds an alarm through the onboard speaker. For the chassis intrusion circuit to function, the

chassis’ power supply must be connected to AC power. The security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion detect connector. The mechanical switch is closed for normal computer operation.

For information about Refer to

The location of the chassis intrusion detect connector Figure 7, page 56 The signal names of the chassis intrusion detect connector Table 34, page 59

1.11.3 Fan Control and Monitoring

The SMSC LPC47M142 I/O controller provides two fan control output and two fan tachometer inputs. Monitoring and control can be implemented using third-party software.

For information about Refer to

The functions of the fan connectors Section 1.12.2.2, page 40 The location of the fan connectors Figure 7, page 56 The signal names of the fan connectors Section 2.8.2, page 56

Intel Desktop Board D815BN Technical Product Specification

1.12 Power Management

Power management is implemented at several levels, including:

• Software support:  Advanced Power Management (APM)  Advanced Configuration and Power Interface (ACPI)

• Hardware support:  Power connector  Fan connectors  Wake on LAN  Instantly Available technology  Wake on Ring  Resume on Ring  Wake on Keyboard  Wake on PME#

†

technology

1.12.1 Software Support

The software support for power management includes:

• APM

• ACPI

If the D815BN board is used with an ACPI-aware operating system, the BIOS can provide ACPI support. Otherwise, it defaults to APM support.

1.12.1.1 APM

APM makes it possible for the computer to enter an energy-saving standby mode. The standby mode can be initiated in the following ways:

• Time-out period specified in the BIOS Setup program

• From the operating system, such as the Standby menu item in Windows 98

In standby mode, the D815BN board can reduce power consumption by spinning down hard drives, and reducing power to, or turning off of, VESA management mode can be enabled or disabled in the BIOS Setup program.

While in standby mode, the system retains the ability to respond to external interrupts and service requests, such as incoming faxes or network messages. Any keyboard or mouse activity brings the system out of standby mode and immediately restores power to the monitor.

The BIOS enables APM by default but the operating system must support an APM driver for the power management features to work. For example, Windows 98 supports the power management features upon detecting that APM is enabled in the BIOS.

†

DPMS-compliant monitors. Power

For information about Refer to

Enabling or disabling power management in the BIOS Setup program Section 4.6, page 106

The D815BN board’s compliance level with APM Section 1.3, page 16

Product Description

1.12.1.2 ACPI

ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with the D815BN board requires an operating system that provides full ACPI support. ACPI features include:

• Plug and Play (including bus and device enumeration) and APM support normally contained in the BIOS

• Power management control of individual devices, add-in boards (some add-in boards may require an ACPI-aware driver), video displays, and hard disk drives

• Methods for achieving less than 30-watt system operation in the power-on/standby sleeping state

• A Soft-off feature that enables the operating system to power-off the computer

• Support for multiple wake up events (see Table 10 on page 39)

• Support for a front panel power and sleep mode switch. Table 8 lists the system states based

on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system.

Table 8. Effects of Pressing the Power Switch

…and the power switch is

If the system is in this state…

Off (ACPI G2/G5 – Soft off) Less than four seconds Power-on

On (ACPI G0 – working state) Less than four seconds Soft-off/Standby

On (ACPI G0 – working state) More than four seconds Fail safe power-off

Sleep (ACPI G1 – sleeping state)

pressed for …the system enters this state

(ACPI G0 – working state)

(ACPI G1 – sleeping state)

(ACPI G2/G5 – Soft off)

Less than four seconds Wake up

(ACPI G0 – working state)

More than four seconds Power-off

(ACPI G2/G5 – Soft off)

For information about Refer to

The D815BN board’s compliance level with ACPI Section 1.3, page 16

Intel Desktop Board D815BN Technical Product Specification

1.12.1.2.1 System States and Power States

Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.

Table 9 lists the power states supported by the D815BN board along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states.

Table 9. Power States and Targeted System Power

Targeted System

Global States Sleeping States CPU States Device States

G0 – working state

G1 – sleeping state

G2/G5 S5 – Soft off.

G3 – mechanical off

AC power is disconnected from the computer.

Notes: 1. Total system power is dependent on the system configuration, including add-in boards and peripherals

2. Dependent on the standby power cons um ption of wake-up devices used in the system.

S0 – working C0 – working D0 – working state Full power > 30 W

S1 – CPU stopped C1 – stop grant D1, D2, D3 – device

specification specific.

S3 – Suspend to RAM. Context saved to RAM.

Context not saved. Cold boot is required.

No power to the system.

No power D3 – no power

except for wake up logic.

No power D3 – no power

except for wake up logic.

No power D3 – no power for

wake up logic, except when provided by battery or external source.

Power

5 W < power < 30 W

Power < 5 W

No power to the system so that service can be performed.

(Note 1)

(Note 2)

Product Description

1.12.1.2.2 Wake Up Devices and Events

Table 10 lists the devices or specific events that can wake the computer from specific states.

Table 10. Wake Up Devices and Events

These devices/events can wake up the computer… …from this state

Power switch S1, S3, S5 RTC alarm S1, S3, S5 Onboard LAN S1, S3, S5 (Note) PME# S1, S3, S5 (Note) Modem (back panel serial port) S1, S3 PS/2 keyboard, USB keyboard, or USB mouse S1, S3

Note: For LAN and PME#, S5 is di sabled by default in the BIOS Setup program. In BIOS Set up, setting the

On ACPI S5 option to Power On will enable a wake-up event from LAN in the S5 state.

NOTE

✏

The use of these wake up events from an ACPI state requires an operating system that provides full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake events.

1.12.1.2.3 Plug and Play

In addition to power management, ACPI provides controls and information so that the operating system can facilitate Plug and Play device enumeration and configuration. ACPI is used only to enumerate and configure D815BN board devices that do not have other hardware standards for enumeration and configuration.

1.12.2 Hardware Support

CAUTION

If the Wake on LAN and Instantly Available technology features are used, ensure that the power supply provides adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. Refer to Section 2.11.3 on page 74 for additional information.

The board provides several hardware features that support power management, including:

• Power connector

• Fan connectors

• Wake on LAN technology

• Instantly Available technology

• Wake on Ring

• Resume on Ring

• Wake from PS/2 keyboard

• PME# wakeup support

Intel Desktop Board D815BN Technical Product Specification

Wake on LAN technology and Instantly Available technology require power from the +5 V standby line. The sections discussing these features describe the incremental standby power requirements for each.

Resume on Ring enables telephony devices to access the computer when it is in a power-managed state. The method used depends on the type of telephony device (external or internal) and the power management mode being used (APM or ACPI).

NOTE

✏

The use of Resume on Ring technology from an ACPI state requires an operating system that provides full ACPI support.

1.12.2.1 Power Connector

When used with an ATX-compliant power supply that supports remote power on/off, the D815BN board can turn off the system power through software control. To enable soft-off control in software, advanced power management must be enabled in the BIOS Setup program and in the operating system. When the system BIOS receives the correct APM command from the operating system, the BIOS turns off power to the computer.

With soft-off enabled, if power to the computer is interrupted by a power outage or a disconnected power cord, when power resumes, the computer returns to the power state it was in before power

was interrupted (on or off). The computer’s response can be set using the After Power Failure feature in the BIOS Setup program’s Boot menu.

For information about Refer to

The location of the power connector Figure 7, page 56 The signal names of the power connector Table 33, page 58

The BIOS Setup program’s Boot menu Table 70, page 108 The ATX specification Section 1.3, page 16

1.12.2.2 Fan Connectors

The D815BN board has two fan connectors. The functions of these connectors are described in Table 11.

Table 11. Fan Connector Descriptions

Connector Function

System fan (fa n 1) Provides +12 V DC for a system or chassis fan. The fan voltage can be switched

on or off, depending on the power management state of the computer. A tachometer feedback connection is also provided.

Processor fan (fan 2) Provides +12 V DC for a processor fan or active fan heatsink. The fan voltage can

be switched on or off, depending on the power management state of the computer. A tachometer feedback connection is also provided.

For information about Refer to

The location of the fan connectors Figure 7, page 56 The signal names of the fan connectors Section 2.8.2, page 56

Product Description

1.12.2.3 Wake on LAN Technology CAUTION

For Wake on LAN technology, the 5-V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Wake on LAN technology can damage the power supply. Refer to Section 2.11.3 on page 74 for additional information.

Wake on LAN technology enables remote wakeup of the computer through a network. The LAN subsystem PCI bus network adapter monitors network traffic at the Media Independent Interface.

†

Upon detecting a Magic Packet the computer. Depending on the LAN implementation, the D815BN board supports Wake on LAN technology in the following ways:

• Through the PCI bus PME# signal for PCI 2.2 compliant LAN designs

• Through the onboard LAN subsystem when enabled in Setup (ACPI only)

Network adapters that are PCI 2.2 compliant assert the wakeup signal through the PCI bus signal PME# (pin A19 on the PCI bus connectors).

frame, the LAN subsystem asserts a wakeup signal that powers up

1.12.2.4 Instantly Available Technology CAUTION

For Instantly Available technology, the 5-V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available technology can damage the power supply. Refer to Section 2.11.3 on page 74 for additional information.

Instantly Available technology enables the D815BN board to enter the ACPI S3 (Suspend-toRAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off, the fans are off, and the front panel LED is amber if dual-color, or off if singlecolor.) When signaled by a wake-up device or event, the system quickly returns to its last known wake state. Table 10 on page 39 lists the devices and events that can wake the computer from the S3 state.

The D815BN board supports the PCI Bus Power Management Interface Specification. For information on the versions of this specification, see Section 1.3. Add-in boards that also support this specification can participate in power management and can be used to wake the computer.

The use of Instantly Available technology requires operating system support and PCI 2.2 compliant add-in cards and drivers.

Intel Desktop Board D815BN Technical Product Specification

The standby power LED shows that power is still present at the DIMM and PCI bus connectors, even when the computer appears to be off. Figure 5 shows the location of the standby power indicator LED.

DS7D1

Figure 5. Location of Standby Power LED

1.12.2.5 Wake on Ring

The operation of Wake on Ring can be summarized as follows:

• Powers up the computer from the APM soft-off mode.

• Requires two calls to access the computer:

 First call restores the computer.  Second call enables access (when supporting software is installed).

• Detects incoming call differently for external as opposed to internal modems:

 For external modems, D815BN board hardware monitors the ring indicator (RI) input of

the serial port.

 For internal modems, the D815BN board is awakened using the PME# signal.

OM10736

1.12.2.6 Resume on Ring

The operation of Resume on Ring can be summarized as follows:

• Resumes operation from either the APM sleep mode or the ACPI S1 state

• Requires only one call to access the computer

• Detects incoming call similarly for external and internal modems

• Requires modem interrupt be unmasked for correct operation

1.12.2.7 Wake from PS/2 Keyboard and Mouse

PS/2 keyboard and mouse activity wakes the computer from an ACPI S1 or S3 state.

1.12.2.8 PME# Wakeup Support

When the PME# signal on the PCI bus is asserted, the computer wakes from an ACPI S1 or S3 state.

Product Description

Intel Desktop Board D815BN Technical Product Specification