Intel 6700PXH User Manual

Intel® 6700PXH 64-bit PCI Hub

Thermal/Mechanical Design Guidelines

August 2004

Document Number: 302817-003

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2 Intel

6700PXH 64-bit PCI Hub chipset component may contain design defects or errors known as errata, which may cause the product to deviate

6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

Contents

1 Introduction.....................................................................................................................7

1.1 Definition of Terms...............................................................................................7

1.2 Reference Documents .........................................................................................8

2 Packaging Technology...................................................................................................9

2.1 Package Mechanical Requirements ...................................................................10

3 Thermal Specifications.................................................................................................11

3.1 Thermal Design Power (TDP) ............................................................................11

3.2 Die Case Temperature Specifications................................................................11

4 Thermal Simulation ......................................................................................................13

5 Thermal Metrology........................................................................................................15

5.1 Die Case Temperature Measurements...............................................................15

5.1.1 Zero Degree Angle Attach Methodology................................................15

6 Reference Thermal Solution ........................................................................................17

6.1 Operating Environment ......................................................................................17

6.2 Heatsink Performance........................................................................................17

6.3 Mechanical Design Envelope.............................................................................18

6.4 Board-Level Components Keepout Dimensions .................................................18

6.5 Torsional Clip Heatsink Thermal Solution Assembly ..........................................18

6.5.1 Heatsink Orientation..............................................................................20

6.5.2 Extruded Heatsink Profiles ....................................................................20

6.5.3 Mechanical Interface Material................................................................20

6.5.4 Thermal Interface Material.....................................................................21

6.5.5 Heatsink Clip .........................................................................................21

6.5.6 Clip Retention Anchors..........................................................................22

6.6 Reliability Guidelines..........................................................................................22

A Thermal Solution Component Suppliers.....................................................................23

A.1 Torsional Clip Heatsink Thermal Solution...........................................................23

B Mechanical Drawings ...................................................................................................25

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6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines 3

Figures

Tables

2-1. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Top View) .............................9

2-2. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Side View).............................9

2-3. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Bottom View) ......................10

5-1. Zero Degree Angle Attach Heatsink Modifications ...................................................16

5-2. Zero Degree Angle Attach Methodology (Top View) ................................................16

6-1. Reference Heatsink Measured Thermal Performance Versus Approach Velocity ....17

6-2. Torsional Clip Heatsink Volumetric Envelope for the Intel® 6700PXH 64-bit PCI Hub

Chipset Component ...........................................................................................18

6-3. Torsional Clip Heatsink Board Component Keepout ................................................19

6-4. Retention Mechanism Component Keepout Zones ..................................................19

6-5. Torsional Clip Heatsink Assembly............................................................................20

6-6 Heatsink Rails to PXH Package Footprint .................................................................20

6-7. Torsional Clip Heatsink Extrusion Profile .................................................................21

B-1. Torsional Clip Heatsink Assembly Drawing .............................................................26

B-2. Torsional Clip Heatsink Drawing..............................................................................27

B-3.Torsional Clip Drawing .............................................................................................28

3-1. Intel® 6700PXH 64-bit PCI Hub Thermal Specifications ...........................................11

6-1. Chomerics* T710 TIM Performance as a Function of Attach Pressure.....................21

6-2. Reliability Guidelines ...............................................................................................22

B-1. Mechanical Drawing List..........................................................................................25

4 Intel

6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

Revision History

Revision

Number

-001

-002

-003

Description Date

Initial release Jul 2004

Added “reference thermal solution rails to PXH package” footprint drawing in Section 6.5

Removed inaccurate text in three graphics

Aug 2004

Sep 2004

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6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines 5

Introduction

6 Intel

6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

1 Introduction

As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heatsinks.

The goals of this document are to:

• Outline the thermal and Mechanical operating limits and specifications for the Intel

6700PXH 64-bit PCI Hub component.

• Describe a reference thermal solution that meets the specification of Intel

PCI Hub component.

Properly designed thermal solution provides adequate cooling to maintain the PXH component die temperatures at or below thermal specifications. This is accomplished by providing a low localambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the PXH component die temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.

6700PXH 64-bit

The simplest and most cost effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.

This document addresses thermal design and specifications for the Intel components only. For thermal design information on other chipset components, refer to the respective component datasheet.

Unless otherwise specified, the term “PXH” refers to the Intel

1.1 Definition of Terms

BGA Ball grid array. A package type, defined by a resin-fiber substrate, onto which a die is

mounted, bonded and encapsulated in molding compound. The primary electrical interface is an array of solder balls attached to the substrate opposite the die and molding compound.

BLT Bond line thickness. Final settled thickness of the thermal interface material after

installation of heatsink.

MCH Memory controller hub. The chipset component that contains the processor interface, the

memory interface, and the hub interface.

PXH Intel

6700PXH 64-bit PCI Hub. The chipset component that performs PCI bridging functions between the PCI Express* interface and the PCI Bus. It contains two PCI bus interfaces that can be independently configured to operate in PCI (33 or 66 MHz) or PCI-X mode 1 (66, 100, or 133 MHz), for either 32 or 64 bit PCI devices.

6700PXH 64-bit PCI Hub

6700PXH 64-bit PCI Hub.

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6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines 7

Introduction

case_max

Maximum die temperature allowed. This temperature is measured at the geometric center of the top of the package die.

Minimum die temperature allowed. This temperature is measured at the geometric center

case_min

of the top of the package die.

TDP Thermal design power. Thermal solutions should be designed to dissipate this target

power level. TDP is not the maximum power that the chipset can dissipate.

1.2 Reference Documents

The reader of this specification should also be familiar with material and concepts presented in the following documents:

• Intel® 82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R

(ICH5R) Datasheet

• Intel® 82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R

(ICH5R) Thermal Design Guide

• Intel®6700PXH 64-bit PCI Hub (PXH) Thermal/Mechanical Design Guide

• Intel® 6700PXH 64-bit PCI Hub (PXH) Datasheet

• Intel® 6700PXH 64-bit PCI Hub (PXH) Specification Update

• Intel® 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide

• Intel® 6300ESB I/O Controller Hub Datasheet

• Intel® 6300ESB I/O Controller Hub (ICH) Specification Update

• BGA/OLGA Assembly Development Guide

• Various system thermal design suggestions (http://www.formfactors.org)

Note: Unless otherwise specified, these documents are available through your Intel field sales

representative. Some documents may not be available at this time.

8 Intel

6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

2 Packaging Technology

The Intel® 6700PXH 64-bit PCI Hub component uses a 31 mm x 31 mm, 8-layer FC-BGA package (see Figure 2-1Figure 2-1Figure 2-1, Figure 2-2Figure 2-2Figure 2-2, and Figure 2-3Figure 2-3Figure 2-3).

Figure 2-1. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Top View)

Die

Keepout

Area

21.00 mm17.00 mm

31.00 mm

0.547 in.

Handling

Exclusion

Area

0.247 in .

0.200 in.

0.291 in.

0.491 in.

PXH

Die

17.00 mm

21.00 mm

31.00 mm

Figure 2-2. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Side View)

2.445 ± 0.102 mm

Substrate

2.010 ± 0.099 mm

0.435 ± 0.025 mm See Note 3

Notes:

1.Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach).

2.All dimensions and tolerances conform to ANSI Y14.5M-1994.

3.BGA has a pre-SMT height of 0.5 mm and post-SMT height of 0.41-0.46 mm.

4.Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped) orientation after reflow.

0.84 ± 0.05 mm

Decoup

Cap

Die

Seating Plane

0.7 mm Max

0.20

See note 4.

0.20

See Note 1

–C–

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6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines 9

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