Intel 5100 Series Instruction Manual
Dual-Core Intel® Xeon® Processor 5100 Series
Thermal/Mechanical Design Guidelines
June 2006
Reference Number: 313357-001
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®
The Dual-Core Intel
product to deviate from published specifications. Current characterized errata are available upon request.
Xeon® Processor 5100 Series may contain design defects or errors known as errata, which may cause the
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Copyright © 2006, Intel Corporation. All rights reserved.
2 Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide
Contents
1Introduction..............................................................................................................7
1.1 Objective ...........................................................................................................7
1.2 Scope................................................................................................................7
1.3 References.........................................................................................................7
1.4 Definition of Terms..............................................................................................8
2 Thermal/Mechanical Reference Design.................................................................... 11
2.1 Mechanical Requirements...................................................................................11
2.1.1 Processor Mechanical Parameters .............................................................11
2.1.2 Dual-Core Intel Xeon Processor 5100 Series Processor Package.................... 11
2.1.3 Dual-Core Intel Xeon Processor 5100 Series Considerations ......................... 14
2.2 Processor Thermal Parameters and Features.........................................................15
2.2.1 Thermal Control Circuit and TDP...............................................................15
2.2.2 Digital Thermal Sensor............................................................................16
2.2.3 Platform Environmental Control Interface (PECI) ........................................16
2.2.4 Multiple Core Special Considerations.........................................................17
2.2.5 Thermal Profile ......................................................................................20
2.2.6 TCONTROL Definition..............................................................................22
2.2.7 Thermal Profile Concepts for the
2.2.8 Performance Targets...............................................................................25
2.3 Characterizing Cooling Solution Performance Requirements.....................................29
2.3.1 Fan Speed Control..................................................................................29
2.3.2 Processor Thermal Characterization Parameter Relationships........................31
2.3.3 Chassis Thermal Design Considerations.....................................................33
2.4 Thermal/Mechanical Reference Design Considerations ............................................33
2.4.1 Heatsink Solutions..................................................................................33
2.4.2 Thermal Interface Material.......................................................................34
2.4.3 Summary..............................................................................................35
2.4.4 Assembly Overview of the Intel Reference Thermal Mechanical Design........... 35
2.4.5 Thermal Solution Performance Characteristics............................................ 37
2.4.6 Thermal Profile Adherence.......................................................................39
2.4.7 Components Overview ............................................................................43
2.4.8 Boxed Active Thermal Solution for the
A Mechanical Drawings............................................................................................... 51
B Heatsink Clip Load Methodology..............................................................................73
B.1 Overview ......................................................................................................... 73
B.2 Test Preparation................................................................................................ 73
B.2.1 Heatsink Preparation ..............................................................................73
B.2.2 Typical Test Equipment...........................................................................76
B.2.3 Test Procedure Examples ........................................................................ 76
B.2.4 Time-Zero, Room Temperatu r e Prel oad Measu rem ent ..................... .. .......... 76
B.2.5 Preload Degradation under Bake Conditions .......................... .. .. ... .. .. .. ........ 77
C Safety Requirements ...............................................................................................79
D Quality and Reliability Requirements.......................................................................81
D.1 Intel Verification Criteria for the Reference Designs................................................81
D.1.1 Reference Heatsink Thermal Verification....................................................81
D.1.2 Environmental Reliability Testing..............................................................81
D.1.3 Material and Recycling Requirements.......................................... .. .. .. .. ...... 83
E Enabled Suppliers Information ................................................................................85
Dual-Core Intel Xeon Processor 5100 Series......................... ......................23
Dual-Core Intel Xeon Processor 5100 Series ....................................... .. .. .. . 46
Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide 3
E.1 Supplier Information.............................................. ............................................85
E.1.1 Intel Enabled Suppliers...................................... .. ....................................85
E.1.2 Additional Enabled Suppliers .......................... .. .. .. ....................................86
Figures
2-1 Dual-Core Intel® Xeon® Processor 5100 Series Mechanical Drawing........................13
2-2 DTS Domain for Dual-Core Intel Xeon Processor 5100 Series...................................17
2-3 Fan Speed Control for Dual-Core Intel Xeon Processor 5100 Series...........................18
2-4 Processor Core Geometric Center Locations...........................................................20
2-5 Thermal Profile Diagram .................. .................................................... ... ............21
2-6 TCONTROL Value and Digital Thermal Sensor Value Interaction................................22
2-7 TCONTROL and Thermal Profile Interaction............................................................23
2-8 Dual Thermal Profile Diagram..............................................................................24
2-9 Thermal Profile for the Dual-Core Intel Xeon Processor 5148 ...................................25
2-10 Thermal Profile for the
Dual-Core Intel® Xeon® Processor 5110/5120/5130/5140/5150 .............................26
2-11 Thermal Profiles A and B for the Dual-Core Intel® Xeon® Processor 5160.................27
2-12 TCONTROL and Fan Speed Control .......................................................................30
2-13 Processor Thermal Characterization Parameter Relationships ...................................32
2-14 Exploded View of CEK Thermal Solution Components..............................................36
2-15 2U+ CEK Heatsink Thermal Performance...............................................................38
2-16 1U CEK Heatsink Thermal Performance.................................................................39
2-17 1U CEK Thermal Adherence to
Dual-Core Intel Xeon Processor 5148 Thermal Profile..............................................40
2-18 1U CEK Thermal Adherence to Dual-Core Intel® Xeon® Processor
5110/5120/5130/5140/5150 Thermal Profile................ .........................................41
2-19 2U+CEK Thermal Adherence to Dual-Core
Intel Xeon Processor 5160 Thermal Profile A..........................................................42
2-20 1U CEK Thermal Adherence to
Dual-Core Intel Xeon Processor 5160 Thermal Profile B...........................................43
2-21 Isometric View of the 2U+ CEK Heatsink...............................................................43
2-22 Isometric View of the 1U CEK Heatsink.................................................................44
2-23 CEK Spring Isometric View..................................................................................46
2-24 Isometric View of CEK Spring Attachment to the Base Board ...................................46
2-25 Boxed Active CEK Heatsink Solutions with PWM/DTS Control
(Representation Only)47
2-26 Fan Cable Connection (Active CEK) ......................................................................48
A-1 2U CEK Heatsink (Sheet 1 of 4)...........................................................................52
A-2 2U CEK Heatsink (Sheet 2 of 4)...........................................................................53
A-3 2U CEK Heatsink (Sheet 3 of 4)...........................................................................54
A-4 2U CEK Heatsink (Sheet 4 of 4)...........................................................................55
A-5 CEK Spring (Sheet 1 of 3)...................................................................................56
A-6 CEK Spring (Sheet 2 of 3)...................................................................................57
A-7 CEK Spring (Sheet 3 of 3)...................................................................................58
A-8 Baseboard Keepout Footprint Definition and
Height Restrictions for Enabling Components (Sheet 1 of 6) ................................ .. ..59
A-9 Baseboard Keepout Footprint Definition and
Height Restrictions for Enabling Components (Sheet 2 of 6) ................................ .. ..60
A-10 Baseboard Keepout Footprint Definition and
Height Restrictions for Enabling Components (Sheet 3 of 6) ................................ .. ..61
A-11 Baseboard Keepout Footprint Definition and
Height Restrictions for Enabling Components (Sheet 4 of 6) ................................ .. ..62
4 Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide
A-12 Baseboard Keepout Footprint Definition and
Height Restrictions for Enabling Components (Sheet 5 of 6)....................................63
A-13 Baseboard Keepout Footprint Definition and
Height Restrictions for Enabling Components (Sheet 6 of 6)....................................64
A-14 1U CEK He atsink (She e t 1 of 4)................ .. .. ..................................................... ..65
A-15 1U CEK He atsink (She e t 2 of 4)................ .. .. ..................................................... ..66
A-16 1U CEK He atsink (She e t 3 of 4)................ .. .. ..................................................... ..67
A-17 1U CEK He atsink (She e t 4of 4)........... .. ..................................................... .......... 68
A-18 Active CEK Thermal Solution Volumetric (Sheet 1 of 3)...........................................69
A-19 Active CEK Thermal Solution Volumetric (Sheet 2 of 3)...........................................70
A-20 Active CEK Thermal Solution Volumetric (Sheet 3 of 3)...........................................71
B-1 Load Cell Installation in Machined Heatsink Base Pocket -- Bottom View ...................74
B-2 Load Cell Installation in Machined Heatsink Base Pocket -- Side View .......................75
B-3 Preload Test Configuration........................................ .. .. .. ....................................75
Tables
1-1 Reference Documents...................................... .................................................. ..7
1-2 Terms and Descriptions........................................................................................8
2-1 Processor Mechanical Parameters Table................................................................11
2-2 Input and Output Conditions for the
Dual-Core Intel Xeon Processor 5100 Series Thermal Management Features.............. 19
2-3 Processor Core Geometric Center Dimensions .......................................................20
2-4 Intel Reference Heatsink Performance Targets for the
Dual-Core Intel® Xeon® Processor 5148 .............................................................27
2-5 Intel Reference Heatsink Performance Targets for the
Dual-Core Intel Xeon Processor 5110/5120/5130/5140/5150 .................................. 28
2-6 Intel Reference Heatsink Performance Targets for the
Dual-Core Intel Xeon Processor 5160...................................................................29
2-7 Fan Speed Control, TCONTROL and DTS Relationship .............................................30
2-8 CEK Heatsink Thermal Mechanical Characteristics ..................................................44
2-9 Recommended Thermal Grease Dispense Weight................................ .. ... .. .. .. ........ 45
2-10 Fan Specifications (Boxed 4-wire PWM/DTS Heatsink Solution)................................ 48
2-11 Fan Cable Connector Pin Out (Active CEK) ............................................................48
A-1 Mechanical Drawing List.....................................................................................51
B-1 Typical Test Equipment......................................................................................76
D-1 Use Conditions Environment ...............................................................................82
E-1 Suppliers for the Dual-Core Intel Xeon Processor 5100 Series
Intel Reference Solution.....................................................................................85
E-2 Suppliers of Alternative Thermal Solutions for the
Dual-Core Intel Xeon Processor 5100 Series.................................... .. .. ..................86
Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide 5
Revision History
Revision
Number
001 • Initial release of the document.
Description Date
June 2006
§
6 Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide
Introduction
1 Introduction
1.1 Objective
This document describes the reference thermal solution and design parameters
required for Dual-Core Intel® Xeon
document to comprehend and demonstrate the processor cooling solution features and
requirements. Furthermore, this document provides an understanding of the processor
thermal characteristics, and discusses guidelines for meeting the thermal requirements
imposed on the entire life of the processor. The thermal/mechanical solutions described
in this document are intended to aid component and system designers in the
development and evaluation of processor compatible thermal/mechanical solutions.
1.2 Scope
The thermal/mechanical solutions described in this document pertain only to a
solution(s) intended for use with the Dual-Core Intel Xeon Processor 5100 Series in
1U/Volumetric constrained, 2U, 2U+ and workstation form factors systems. This
document contains the mechanical and thermal requirements of the processor cooling
solution. In case of conflict, the data in the Dual-Core Intel
Series Datasheet supersedes any data in this document. Additional information is
provided as a reference in the appendices.
1.3 References
Material and concepts available in the following documents may be beneficial when
reading this document.
Table 1-1. Reference Documents
®
Processor 5100 Series. It is also the intent of this
®
Xeon® Processor 5100
Document Comment
European Blue Angel Recycling Standards http://www.blauer-engel.de
®
Intel
Xeon® Processor Family Thermal Test Vehicle User's Guide See Note following table
®
Intel
Xeon® Processor Thermal Design Guidelines http://developer.intel.com/
LGA771 Socket Mechanical Design Guide See Note following table
PECI Feature Set Overview See Note following table
Platform Environment Control Interface (PECI) Specification See Note following table
T
Reduction Guidelines for Rack Servers and Workstations See Note following table
RISE
Dual-Core Intel
Dual-Core Intel
Mechanical Models (in IGES and ProE* format)
Dual-Core Intel
Thermal Models (in Flotherm* and Icepak*)
Dual-Core Intel
ProE* and IGES model)
Dual-Core Intel
Flotherm* and Icepak*)
Thin Electronics Bay Specification (A Server System Infrastructure [SS I]
Specification for Rack Optimized Servers)
Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide 7
®
Xeon® Processor 5100 Series Datasheet See Note following table
®
Xeon® Processor 5100 Series Enabled Components
®
Xeon® Processor 5100 Series Enabled Components
®
Xeon® Processor 5100 Series Mechanical Models (in
®
Xeon® Processor 5100 Series Thermal Models (in
Available electronically
Available electronically
Available electronically
Available electronically
www.ssiforum.com
Introduction
Note: Contact your Intel field sales representative for the latest revision and order number of this docume nt.
1.4 Definition of Terms
Table 1-2. Terms and Descriptions (Sheet 1 of 2)
Term Description
Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct. For this
Digital Thermal
Sensor
FMB Flexible Motherboard Guideline: an estimate of the maximum value of a processor specification over
FSC Fan Speed Control
IHS Integrated Heat Spreader: a component of the processor package used to enhance the thermal
LGA771 Socket The Dual-Core Intel
P
MAX
PECI A proprietary one-wire bus interface that provides a communication channel between Intel processor and
Ψ
CA
Ψ
CS
Ψ
SA
T
CASE
T
CASE_MAX
TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by using clock
T
CONTROL
T
OFFSET
TDP Thermal Design Power: Ther mal solution should be desi gned to dissipate this target power level. TDP is not
Thermal Monitor A feature on the processor that can keep the processor’s die temperature within factory specifications
Thermal Profile Line that defines case temperature specification of a processor at a given power level.
TIM Therma l Inte rface Material: The thermally conductive compound between the heatsink and the processor
example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest
surface.
Digital Thermal Sensor replaces the T
PROCHOT# sensor to indicate the on-die temperature. The temperature value represents the number of
in previous products and uses the same sensor as the
DIODE
degrees below the TCC activation temperature.
certain time periods. System designers should meet the FMB values to ensure their systems are
compatible with future processor releases.
performance of the package. Component thermal solutio ns interface with the processor at the IHS surface.
®
771 Land socket. See the LGA771 Socket Mechanical Design Guide for details regarding this socket.
Xeon® Processor 5100 Series interface to the baseboard through this surface mount,
The maximum power dissipated by a semiconductor component.
chipset components to external thermal monitoring devices, for use in fan speed control. PECI
communicates readings from the processor’s Digital Thermal Sensor. PECI replaces the thermal diode
available in previous processors.
Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution performance
using total package power. Defined as (T
specified for Ψ measurements.
– TLA) / Total Package Power. Heat source should always be
CASE
Case-to-sink thermal characterization parameter. A measure of thermal interface material performance
using total package power. Defined as (T
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using
total package power. Defined as (T
– TLA) / Total Package Power.
S
– TS) / Total Package Power.
CASE
The case temperature of the processor, measured at the geometric center of the topside of the IHS.
The maximum case temperature as specified in a component specification.
modulation and/or operating frequency and input voltage adjustment when the die temperature is very
near its operating limits.
A processor unique value for us e in fan speed control mechanisms. T
based on a temperature reading from the processor’ s Digital Thermal Sensor. T
a trigger point for fan speed control implementation. T
An offset value from the TCC activation temperature value specified in the processor EMTS or data sheet
and T
obtained by reading the IA_32_TEMPERATURE_TARGET MSR. This is a static and a unique value. Refer to
CONTROL
= -T
. This value is programmed into each processor during manufacturing and can be
OFFSET
CONTROL
= -T
OFFSET
is a temperature specification
CONTROL
.
can be described as
CONTROL
the RS - Conroe and Woodcrest Processor Family BIOS Writer’s Guide (BWG) for further details.
the maximum power that the processor can dissipate.
under normal operating conditions, and with a thermal solution that satis fies the processor thermal profile
specification.
case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor
case to the heatsink.
8 Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide
Introduction
Table 1-2. Terms and Descriptions (Sheet 2 of 2)
T
LA
T
SA
U A unit of measure used to define server rack spacing heigh t . 1U is equal to 1.75 in, 2U equals 3.50 in, e tc.
The measured ambient temperature locally surrounding the processor. The ambient temperature should be
measured just upstream of a passive heatsink or at the fan inlet for an active heatsink.
The system ambient air temperature external to a system chassis. This t emperature is usually measured at
the chassis air inlets.
§
Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide 9
Introduction
10 Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide
Thermal/Mechanical Reference Design
2 Thermal/Mechanical Reference
Design
This chapter describes the thermal/mechanical reference design for Dual-Core Intel
Xeon Processor 5100 Series. Dual-Core Intel Xeon Processor 5100 Series are the
performance processors with a front side bus speed of 1333 MHz, Some lower speed
Dual-Core Intel Xeon Processor 5100 Series SKU’s are available which support a 1066
MHz Front Side Bus (FSB). The processor is targeted for the full range of form factors
(2U, 2U+ and 1U/volumetrically constrained).
2.1 Mechanical Requirements
The mechanical performance of the processor cooling solution must satisfy the
requirements described in this section.
2.1.1 Processor Mechanical Parameters
Table 2-1. Processor Mechanical Parameters Table
Parameter Minimum Maximum Unit Notes
Volumetric Requirements
and Keepouts
Static Compressive Load 3
Static Board Deflection 3
Dynamic Compressive Load 3
Transient Bend 3
Shear Load 70
311
Tensile Load 25
Torsion Load 35
Notes:
1. Refer to drawings in Appendix A.
2. In the case of a discrepancy, the most recent Dual-Core Intel® Xeon® Processor 5100 Series Datasheet
and LGA771 Socket Mechanical Design Guide supersede targets listed in Table 2-1 above.
3. These socket limits are defined in the LGA771 Socket Mechanical Design Guide.
4. These package handling limits are defined in the Dual-Core Intel® Xeon® Processor 5100 Series
Datasheet.
5. Shear load that can be applied to the package IHS.
6. Tensile load that can be applied to the package IHS.
7. Torque that can be applied to the package IHS.
111
3.95
lbf
N
lbf
N
in*lbf
N*m
1
2,4,5
2,4,6
2,4,7
2.1.2 Dual-Core Intel Xeon Processor 5100 Series Processor Package
The Dual-Core Intel Xeon Processor 5100 Series are packaged using the flip-chip land
grid array (FC-LGA6) package technology. Please refer to the Dual-Core Intel
®
Xeon®
Processor 5100 Series Datasheet for detailed mechanical specifications. The Dual-Core
Intel Xeon Processor 5100 Series mechanical drawing, Figure 2-1, provides the
mechanical information for Dual-Core Intel Xeon Processor 5100 Series. The stackup
Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide 11
Thermal/Mechanical Reference Design
height of the processor in the socket is shown in Appendix A. The drawing is
superseded with the drawing in the processor Datasheet, should there be any conflicts.
Integrated package/socket stackup height information is provided in the LGA771
Socket Mechanical Design Guide.
12 Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide
Thermal/Mechanical Reference Design
Figure 2-1. Dual-Core Intel® Xeon® Processor 5100 Series Mechanical Drawing
Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide 13
Thermal/Mechanical Reference Design
The package includes an integrated heat spreader (IHS). The IHS transfers the nonuniform heat from the die to the top of the IHS, out of which the heat flux is more
uniform and spreads over a larger surface area (not the entire IHS area). This allows
more efficient heat transfer out of the package to an attached cooling device. The IHS
is designed to be the interface for contacting a heatsink. Details can be found in the
Dual-Core Intel
®
Xeon® Processor 5100 Series Datasheet.
The processor connects to the baseboard through a 771-land surface mount socket. A
description of the socket can be found in the LGA771 Socket Mechanical Design Guide.
The processor package and socket have mechanical load limits that are specified in the
Dual-Core Intel
®
Xeon® Processor 5100 Series Datasheet and the LGA771 Socket
Mechanical Design Guide. These load limits should not be exceeded during heatsink
installation, removal, mechanical stress testing, or standard shipping conditions. For
example, when a compressive static load is necessary to ensure thermal performance
of the Thermal Interface Material (TIM) between the heatsink base and the IHS, it
should not exceed the corresponding specification given in the LGA771 Socket
Mechanical Design Guide.
The heatsink mass can also add additional dynamic compressive load to the package
during a mechanical shock event. Amplification factors due to the impact force during
shock must be taken into account in dynamic load calculations. The total combination
of dynamic and static compressive load should not then exceed the processor/socket
compressive dynamic load specified in the LGA771 Socket Mechanical Design Guide
during a vertical shock. It is not recommended to use any portion of the processor
substrate as a mechanical reference or load-bearing surface in either static or dynamic
compressive load conditions.
2.1.3 Dual-Core Intel Xeon Processor 5100 Series Considerations
An attachment mechanism must be designed to support the heatsink since there are no
features on the LGA771 socket to directly attach a heatsink. In addition to holding the
heatsink in place on top of the IHS, this mechanism plays a significant role in the
robustness of the system in which it is implemented, in particular:
• Ensuring thermal performance of the TIM applied between the IHS and the
heatsink. TIMs, especially ones based on phase change materials, are very
sensitive to applied pressure: the higher the pressure, the better the initial
performance. TIMs such as thermal greases are not as sensitive to applied
pressure. Refer to Section 2.4.2 and Section 2.4.7.2 for information on tradeoffs
made with TIM selection. Designs should consider possible decrease in applied
pressure over time due to potential structural relaxation in enabled components.
• Ensuring system electrical, thermal, and structural integrity under shock and
vibration events. The mechanical requirements of the attach mechanism depend on
the weight of the heatsink and the level of shock and vibration that the system
must support. The overall structural design of the baseboard and system must be
considered when designing the heatsink attach mechanism. Their design should
provide a means for protecting LGA771 socket solder joints as well as preventing
package pullout from the socket.
Note: The load applied by the attachment mechanism must comply with the package and
socket specifications, along with the dynamic load added by the mechanical shock and
vibration requirements, as identified in Section 2.1.1.
14 Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide
Thermal/Mechanical Reference Design
A potential mechanical solution for heavy heatsinks is the direct attachment of the
heatsink to the chassis pan. In this case, the strength of the chassis pan can be utilized
rather than solely relying on the baseboard strength. In addition to the general
guidelines given above, contact with the baseboard surfaces should be minimized
during installation in order to avoid any damage to the baseboard.
The Intel reference design for Dual-Core Intel Xeon Processor 5100 Series is using such
a heatsink attachment scheme. Refer to Section 2.4 for further information regarding
the Intel reference mechanical solution.
2.2 Processor Thermal Parameters and Features
2.2.1 Thermal Control Circuit and TDP
The operating thermal limits of the processor are defined by the Thermal Profile. The
intent of the Thermal Profile specification is to support acoustic noise reduction through
fan speed control and ensure the long-term reliability of the processor. This
specification requires that the temperature at the center of the processor IHS, known
as (T
T
CASE
(See the Intel
Temperature definition and measurement methods).
) remains within a certain temperature specification. Compliance with the
CASE
specification is required to achieve optimal operation and long-term reliability
®
Xeon® Processor Family Thermal Test Vehicle User's Guide for Case
To ease the burden on thermal solutions, the Thermal Monitor feature and associated
logic have been integrated into the silicon of the processor. One feature of the Thermal
Monitor is the Thermal Control Circuit (TCC). When active, the TCC lowers the
processor temperature by reducing power consumption. This is accomplished through a
combination of Thermal Monitor and Thermal Monitor 2(TM2).Thermal Monitor
modulates the duty cycle of the internal processor clocks, resulting in a lower effective
frequency , wh en active, the T CC turns the processor clocks off and then back on with a
predetermined duty cycle. Thermal Monitor 2 adjusts both the processor operating
frequency (via the bus multiplier) and input voltage (via the VID signals). Please refer
to applicable processor Datasheet for further details on TM and TM2.
PROCHOT# is designed to assert at or a few degrees higher than maximum T
CASE
(as
specified by the thermal profile) when dissipating TDP power , and cannot be inter preted
as an indication of processor case temperature. This temperature delta accounts for
processor package, lifetime, and manufacturing variations and attempts to ensure the
Thermal Control Circuit is not activated below maximum T
when dissipating TDP
CASE
power. There is no defined or fixed correlation between the PROCHOT# assertion
temperature and the case temperature. However, with the introduction of the Digital
Thermal Sensor (DTS) on the Dual-Core Intel
®
Xeon® Processor 5100 Series, the DTS
reports a relative temperature delta below the PROCHOT# assertion temperature (see
Section 2.2.2 for more details on the Digital Thermal Sensor). Thermal solutions must
be designed to the processor specifications (that is, Thermal Profile) and cannot be
adjusted based on experimental measurements of T
, PROCHOT#, or Digital
CASE
Thermal Sensor on random processor samples.
By taking advantage of the Thermal Monitor features, system designers may reduce
thermal solution cost by designing to the Thermal Design Power (TDP) instead of
maximum power. TDP should be used for processor thermal solution design targets.
TDP is not the maximum power that the processor can dissipate. TDP is based on
measurements of processor power consumption while running various high power
applications. This data set is used to determine those applications that are interesting
from a power perspective. These applications are then evaluated in a controlled
thermal environment to determine their sensitivity to activation of the thermal control
Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide 15
circuit. This data set is then used to derive the TDP targets published in the processor
Datasheet. The Thermal Monitor can protect the processor in rare workload excursions
above TDP. Therefore, thermal solutions should be designed to dissipate this target
power level. The thermal management logic and thermal monitor features are
discussed in extensive detail in the Dual-Core Intel
Datasheet.
In addition, on-die thermal management features called THERMTRIP# and FORCEPR#
are available on the Dual-Core Intel Xeon Processor 5100 Series. They provide a
thermal management approach to support the continued increases in processor
frequency and performance. Please see the Dual-Core Intel
Series Datasheet for guidance on these thermal management features.
2.2.2 Digital Thermal Sensor
The Dual-Core Intel Xeon Processor 5100 Series introduce a new on-die temperature
sensor known as the Digital Thermal Sensor (DTS) that replaces the Tdiode in previous
products.
The DTS uses the same sensor utilized for TCC activation. Each individual processor is
calibrated so that TCC activation occurs at a DTS value of 0°C. The temperature
reported by the DTS is the number of degrees below the TCC activation temperature
(i.e below 0°C), and is always negative. For example, -10 reported by DTS means 10°C
away from the TCC activ ation. No value above the TCC activation temperature (that is,
above 0°C) will be reported, DTS will simply report 0.
Thermal/Mechanical Reference Design
®
Xeon® Processor 5100 Series
®
Xeon® Processor 5100
The DTS utilizes a thermal sensor that is optimally located when compared with
thermal diodes available with legacy processors. This is achieved as a result of a
smaller foot print and decreased sensitivity to noise.
The DTS also facilitates the use of multiple thermal sensors within the processor
without the burden of increasing the number of thermal sensor signal pins on the
processor package. With the legacy thermal diode, each thermal sensor required
dedicated signal pins. Operation of multiple DTS will be discussed more detail in
Section 2.2.4.
The DTS benefits will be realized in more accurate fan speed control and TCC
activation. The DTS application in fan speed control will be discussed more detail in
Section 2.3.1.
2.2.3 Platform Environmental Control Interface (PECI)
The PECI interface is designed specifically to convey system management information
from the processor (initially , only thermal data fr om the Digital Thermal Sensor). It is a
proprietary single wire bus between the processor and the chipset or other health
monitoring device. Data from the Digital Thermal Sensors are processed and stored in
a processor register (MSR) which is queried through the Platform Environment Control
Interface (PECI). The PECI specification provides a specific command set to discover,
enumerate devices, and read the temperature. For an overview of the PECI interface,
please refer to PECI Feature Set Overview. For more detail information on PECI, please
refer to Platform Environment Control Interface (PECI) Specification and Dual-Core
®
Xeon® Processor 5100 Series Datasheet.
Intel
16 Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide
Thermal/Mechanical Reference Design
2.2.4 Multiple Core Special Considerations
2.2.4.1 Multiple Digital Thermal Sensor Operation
When Intel designers integrate multiple Digital Thermal Sensors onto a processor to
monitor multiple temperature regions, such as multiple cores, the only temperature of
concern to the external cooling system is the single hottest value for the entire
processor.
To simplify the process of determining the hottest location, the PECI interface to the
Digital Thermal Sensors introduces the concept of domain. Figure 2-2 provides an
illustration of the DTS domain for Dual-Core Intel Xeon Processor 51 00 Series. The
Dual-Core Intel Xeon Processor 5100 Series contains two cores, both cores are in one
domain with one Digital Thermal Sensor per core. Some multiple core processors have
a single domain, other processors will have multiple domains. Each domain receives all
temperature sensor values on the processor within that domain, and provides the
current hottest value for that domain when polled by an external PECI device such as a
thermal management system. The BIOS will be responsible for detecting the
proper processor type and providing the number of domains to the thermal
management system.
Figure 2-2. DTS Domain for Dual-Core Intel Xeon Processor 5100 Series
Fan Speed Controller
Fan Speed Controller
Fan Speed Controller
PECI Host
PECI Host
PECI Host
Socket 0
Socket 0
Domain=0
Domain=0
Core_1
Core_1
DTS_1
DTS_1
Tcontrol for
Tcontrol for
Processor 0
Processor 0
2.2.4.2 Thermal Monitor for Multiple Core Products
The thermal management for multiple core products have only one T
processor. If the DTS temperature from any domain within the processor is greater
than or equal to T
temperature as specified by the thermal profile. See Section 2.2.6 for information on
T
CONTROL
.
CONTROL
Core_2
Core_2
DTS_2
DTS_2
, the processor case temperature must remain at or below the
Core_1
Core_1
DTS_1
DTS_1
Socket 1
Socket 1
Domain=0
Domain=0
Core_2
Core_2
DTS_2
DTS_2
Tcontrol for
Tcontrol for
Processor 1
Processor 1
CONTROL
value per
Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide 17
Thermal/Mechanical Reference Design
2.2.4.3 Fan Speed Control for Dual-Core Intel Xeon Processor 5100 Series
There is only one pin (Pin G5) on each LGA771 socket that accesses the single domain
of the Dual-Core Intel Xeon Processor 5100 Series. Through this pin, the single domain
receives all temperature sensor values and provides the current hottest value to an
external PECI device such as a thermal management system. Figure 2-3 provides an
illustration of the fan speed signals for the multiple core Dual-Core Intel
Processor 5100 Series.
Figure 2-3. Fan Speed Control for Dual-Core Intel Xeon Processor 5100 Series
Dig ital te mp M S R Core 1
Dig ital te mp M S R Core 1
Temperature
Temperature
Temperature
FSC
FSC
FSC
FSC
Temperature
Averaging
Averaging
Averaging
Averaging
PECI
PECI
PECI
PECI
LPF
LPF
LPF
LPF
MAX
MAX
MAX
MAX
®
Core 1
Core 1
Core 1
Core 1
DTS Logic
DTS Logic
DTS Logic
DTS Logic
Xeon®
Temperature
Temperature
Temperature
Temperature
Averaging
Averaging
Averaging
Averaging
Digital temp MSR Core 2
Digital temp MSR Core 2
LPF
LPF
LPF
LPF
The processor MSR supports temperature threshold interrupts and provides
instantaneous data. To reduce the sample rate requirements on PECI and improve
thermal data stability vs. time, the processor Digital Thermal Sensor and PECI interface
implement an averaging algorithm. For more information on the Processor Thermal
Data Sample Rate and Filtering, please refer to Dual-Core Intel
5100 Series Datasheet.
2.2.4.4 PROCHOT#, THERMTRIP#, and FORCEPR#
The PROCHOT# and THERMTRIP# outp uts will be shared by all cores on a processor.
The first core to reach TCC activation will assert PROCHOT#. A single FORCEPR# input
will be shared by each core. Table 2-2 provides an overview of input and output
conditions for the Dual-Core Intel Xeon Processor 5100 Series thermal management
features.
Core 2
Core 2
Core 2
Core 2
DTS Logic
DTS Logic
DTS Logic
DTS Logic
®
Xeon® Processor
18 Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide
Thermal/Mechanical Reference Design
Table 2-2. Input and Output Conditions for the Dual-Core Intel Xeon Processor 5100
Series Thermal Management Features
Item Processor Input Processor Output
TM/TM2 DTSCore X > TCC Activation Temperature All Cores TCC Activation
PROCHOT# DTSCore
THERMTRIP# DTSCore
FORCEPR# FORCEPR# Asserted All Cores TCC Activation
Notes:
1. X=1,2, represents any one of the core1and core2 in Dual-Core Intel Xeon Processor 5100 Series.
2. For more information on PROCHOT#, THERMTRIP#, and FORCEPR# see the Dual-Core Intel® Xeon®
Processor 5100 Series Datasheet.
Temperature
X > TCC Activation Temperature PROCHOT# Asserted
X > THERMTRIP # Assertion
THERMTRIP# Asserted,
all cores shut down
2.2.4.5 Heatpipe Orientation for Multiple Core Processors
Thermal management of multiple core processors can be achieved without the use of
heatpipe heatsinks, as demonstrated by the Intel Reference Thermal Solution discussed
in Section 2.4.
To assist customers interested in designing heatpipe heatsinks, processor core
locations have been provided. In some cases, this may influence the designer’s
selection of heatpipe orientation. For this purpose, the core geometric center locations,
as illustrated in Figure 2-4, are provided in Table 2-3. Dimensions originate from the
vertical edge of the IHS nearest to the pin 1 fiducial as shown in Figure 2-4.
Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide 19
Figure 2-4. Processor Core Geometric Center Locations
Thermal/Mechanical Reference Design
Y2
Y1
X2
Table 2-3. Processor Core Geometric Center Dimensions
Feature X Dimension Y Dimension
Core 1 19.53 mm 12.68 mm
Core 2 19.53 mm 16.82 mm
2.2.5 Thermal Profile
The thermal profile is a linear line that defines the relationship between a processor’s
case temperature and its power consumption as shown in Figure 2-5. The equation of
the thermal profile is defined as:
X1
Y
X
Equation 2-1.y = ax + b
Where:
y =Processor case temperature, T
20 Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide
CASE
(°C)
Thermal/Mechanical Reference Design
x =Processor power consumption (W)
a =Case-to-ambient thermal resistance, ψCA (°C/W)
b =Processor local ambient temperature, TLA (°C)
Figure 2-5. Thermal Profile Diagram
T
MAX
MAX
T
CASE
CASE
T
MAX@
T
MAX@
CASE
CASE
P
P
_PROFILE_MIN
_PROFILE_MIN
T
T
CASE
CASE
Thermal Profile
Thermal Profile
TDP
P
P
_PROFILE_MIN
_PROFILE_MIN
Power
Power
TDP
The higher end point of the Thermal Profile represents the processor’s TDP and the
associated maximum case temperature (T
CASE_MAX
Thermal Profile represents the power value (P
temperature (T
T
CONTROL
(see Section 2.2.6). The slope of the Thermal Profile line represents the case-
CASE_MAX
@ P
_PROFILE_MIN
) for the lowest possible theoretical value of
). The lower end point of the
_PROFILE_MIN
) and the associated case
to-ambient resistance of the thermal solution with the y-intercept being the local
processor ambient temperature. The slope of the Thermal Profile is constant between
P
_PROFILE_MIN
and TDP, which indicates that all frequencies of a processor defined by
the Thermal Profile will require the same heatsink case-to-ambient resistance.
In order to satisfy the Thermal Profile specification, a thermal solution must be at or
below the Thermal Profile line for the given processor when its DTS temperature is
greater than T
CONTROL
(refer to Section 2.2.6). The Thermal Profile allows the
customers to make a trade-off between the thermal solution case-to-ambient
resistance and the processor local ambient temperature that best suits their platform
implementation (refer to Section 2.3.3). There can be multiple combinations of thermal
solution case-to-ambient resistance and processor local ambient temperature that can
meet a given Thermal Profile. If the case-to-ambient resistance and the local ambient
temperature are known for a specific thermal solution, the Thermal Profile of that
solution can easily be plotted against the Thermal Profile specification. As explained
above, the case-to-ambient resistance represents the slope of the line and the
processor local ambient temperature represents the y-axis intercept. Hence the T
values of a specific solution can be calculated at the TDP and P
_PROFILE_MIN
power
CASE
levels. Once these points are determined, they can be joined by a line, which
represents the Thermal Profile of the specific solution. If that line stays at or below the
Thermal Profile specification, then that particular solution is deemed as a compliant
solution.
Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide 21
Thermal/Mechanical Reference Design
2.2.6 T
T
processor T
the Digital Thermal Sensor are relative and no longer absolute, the T
now defined as a relative value to the TCC activation set point (that is, 0°C). Figure 2-6
depicts the interaction between the T
Figure 2-6. T
CONTROL
CONTROL
CONTROL
Digital Thermal Sen sorTemperature
Digital Thermal Sen sorTemperature
Tcontrol = -5
Tcontrol = -5
Definition
can be described as a trigger point for fan speed control implementation. The
CONTROL
Value and Digital Thermal Sensor Value Interaction
value is now a DTS value. Because the temperatures provided by
CONTROL
0
0
0
-10
-10
-10
-20
-20
-20
-30
-30
-30
-40
-40
-40
CONTROL
value and Digital Thermal Sensor value.
Temperature
Temperature
valu e is
The value for T
individually. For the Dual-Core Intel Xeon Processor 5100 Series, the T
obtained by reading a processor model specific register (MSR). NOTE: There is no
T
control device only needs to read the T
from the PECI interface. The equation for calculating T
Equation 2-2.T
Where:
Figure 2-7 depicts the interaction between the Thermal Profile and T
Time
Time
CONTROL
CONTROL_BASE
CONTROL
T
OFFSET
manufacturing that can be obtained by reading the IA32_TEMPERATURE_TARGET
MSR. This is a static and a unique value. Refer to the RS - Conroe and Woodcrest
Processor Family BIOS Writer’s Guide for further details.
value to sum as previously required on legacy processors. The fan speed
= -T
OFFSET
= A DTS-based value programmed into each processor during
is calibrated in manufacturing and configured for each processor
CONTROL
MSR and compare this to the DTS value
OFFSET
CONTROL
is:
CONTROL
value is
.
22 Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide
Thermal/Mechanical Reference Design
Figure 2-7. T
CONTROL
T
T
CASE
CASE
T
@DT S=
T
@DT S=
CASE
CASE
T
T
CONTROL
CONTROL
T
MAX@
T
MAX@
CASE
CASE
P
P
_PROFILE_MIN
_PROFILE_MIN
and Thermal Profile Interaction
MAX
MAX
②
②
①
①
CASE
CASE
T
T
P
P
_PROFILE_MIN
_PROFILE_MIN
Power
Power
Thermal Profile
Thermal Profile
TDP
TDP
Since T
CONTROL
temperature must be determined to plot the T
Profile graph. Location 1 on the Thermal Profile represents a T
to P
_PROFILE_MIN
corresponding to DTS = T
is based on a processor DTS temperature value, an equivalent T
@ T
CASE
CONTROL
. Location 2 on the Thermal Profile represents a T
CONTROL
. If the DTS temperature is less than T
point on the Thermal
value corresponding
CASE
CASE
valu e
CONTROL
the case temperature is permitted to exceed the Thermal Profile, but the DTS
temperature must remain at or below T
must be able to keep the processor’s T
Thermal Profile between the T
CASE_MAX
CONTROL
CASE
@P
. The thermal solution for the processor
at or below the T
_PROFILE_MIN
and T
values defined by the
CASE
CASE_MAX
points at the
corresponding power levels.
Refer to Section 2.3.1 for the implementation of the T
CONTROL
value in support of fan
speed control (FSC) design to achieve better acoustic performance.
2.2.7 Thermal Profile Concepts for the Dual-Core Intel Xeon Processor 5100 Series
2.2.7.1 Dual Thermal Profile Concept for the Dual-Core Intel Xeon
Processor 5160
The Dual-Core Intel Xeon Processor 5160 are designed to go into various form factors,
including the volumetrically constrained 1U and custom blade form factors. Due to
certain limitations of such form factors (that is, airflow, thermal solution height), it is
very challenging to meet the thermal requirements of the processor. To mitigate these
form factor constraints, Intel has developed a dual Thermal Profile specification, shown
in Figure 2-8.
CASE
, then
Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide 23
Figure 2-8. Dual Thermal Profile Diagram
T
MAX B
T
MAX B
CASE
CASE
T
MAX A
T
MAX A
CASE
CASE
T
MAX@
T
MAX@
CASE
CASE
P
P
_PROFILE_MIN
_PROFILE_MIN
CASE
CASE
T
T
Thermal Profile B
Thermal Profile B
Thermal/Mechanical Reference Design
Thermal P r o file A
Thermal P r o file A
P
P
P
_PROFILE_MIN_B
_PROFILE_MIN_B
P
_PROFILE_MIN_A
_PROFILE_MIN_A
Power
Power
TDP
TDP
The Thermal Profile A is based on Intel’s 2U+ air cooling solution. Designing to Thermal
Profile A ensures that no measurable performance loss due to Thermal Control Circuit
(TCC) activation is observed in the processor. It is expected that TCC would only be
activated for very brief periods of time when running a worst-case real world
application in a worst-case thermal condition. These brief instances of TCC activation
are not expected to impact the performance of the processor. A worst case real world
application is defined as a commercially available, useful application which dissipates a
power equal to, or above, the TDP for a thermally relevant timeframe. One example of
a worst-case thermal condition is when a processor local ambient temperature is at or
above 42.3°C for Dual-Core Intel Xeon Processor 5160 Thermal Profile A.
Thermal Profile B supports volumetrically constrained platforms (that is, 1U, blades,
and so forth), and is based on Intel’s 1U air cooling solution. Because of the reduced
capability represented by such thermal solutions, designing to Thermal Profile B results
in an increased probability of TCC activation and an associated measurable
performance loss. Measurable performance loss is defined to be any degradation in the
processor’s performance greater than 1.5%. The 1.5% number is chosen as the
baseline since the run-to-run variation in a given performance benchmark is typically
between 1 - 2%.
Although designing to Thermal Profile B results in increased T
temperatures
CASE
compared to Thermal Profile A at a given power level, both of these Thermal Profiles
ensure that Intel’s long-term processor reliability requirements are satisfied. In other
words, designing to Thermal Profile B does not impose any additional risk to Intel’s
long-term reliability requirements. Thermal solutions that exceed Thermal Profile B
specification are considered incompliant and will adversely affect the long-term
reliability of the processor.
24 Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide
Thermal/Mechanical Reference Design
Refer to the Dual-Core Intel® Xeon® Processor 5100 Series Datasheet or Section 2.2.8
for the Thermal Profile A and Thermal Profile B specifications. Section 2.4 of this
document also provides details on the 2U+ and 1U Intel reference thermal solutions
that are designed to meet the Dual-Core Intel Xeon Processor 5160
and Thermal Profile B respectively.
2.2.8 Performance Targets
The Thermal Profile specifications for these processors are published in the Dual-Core
Intel® Xeon® Processor 5100 Series Datasheet. These Thermal Profile specifications
are shown as a reference in the subsequent discussions.
Figure 2-9. Thermal Profile for the Dual-Core Intel Xeon Processor 5148
59
59
57
57
55
55
53
53
TCASE_MAX@TDP
TCASE_MAX@TDP
Y = 0.450*x +40.0
Y = 0.450*x +40.0
Thermal Profile A
51
51
Temperature [C]
Temperature [C]
49
49
47
47
45
45
20 22 24 26 28 30 32 34 36 38 40
20 22 24 26 28 30 32 34 36 38 40
Note: The thermal specifications shown in this graph are for reference only. Refer to the
Dual-Core Intel
®
Xeon® Processor 5100 Series Datasheet for the Thermal Profile
Power [W]
Power [W]
specifications. In case of conflict, the data information in the datasheet supersedes any
data in this figure.
Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide 25
Thermal/Mechanical Reference Design
Figure 2-10. Thermal Profile for the Dual-Core Intel® Xeon® Processor 5110/5120/5130/
5140/5150
70
70
TCASE_MAX@TDP
65
65
60
60
55
55
Temperature [C]
Temperature [C]
50
50
45
45
20 25 30 35 40 45 50 55 60 65
20 25 30 35 40 45 50 55 60 65
TCASE_MAX@TDP
Power [W]
Power [W]
Y = 0.385*x +40.0
Y = 0.385*x +40.0
Note: The thermal specifications shown in this graph are for reference only. Refer to the
Dual-Core Intel
®
Xeon® Processor 5100 Series Datasheet for the Thermal Profile
specifications. In case of conflict, the data information in the datasheet supersedes any
data in this figure.
26 Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide
Thermal/Mechanical Reference Design
Figure 2-11. Thermal Profiles A and B for the Dual-Core Intel® Xeon® Processor 5160
TCASE_MAX_B@TDP is a thermal solution design point. In actuality, units will
TCASE_MAX_B@TDP is a thermal solution design point. In actuality, units will
not significantly exceed TCASE_MAX_A due to TCC activation.
not significantly exceed TCASE_MAX_A due to TCC activation.
70
70
TCASE_MAX_B@TDP
65
65
60
60
55
55
Temperature [C]
Temperature [C]
50
50
TCASE_MAX_B@TDP
TCASE_MAX_A@TDP
TCASE_MAX_A@TDP
Thermal Profile B
Thermal Profile B
Y = 0.282*x +42.4
Y = 0.282*x +42.4
Thermal Profile A
Thermal Profile A
Y = 0.231*x +41.5
Y = 0.231*x +41.5
45
45
40
40
10 15 20 25 30 35 40 45 50 55 60 65 70 75 80
10 15 20 25 30 35 40 45 50 55 60 65 70 75 80
Power [W]
Power [W]
Note: The thermal specifications shown in this graph are for reference only. Refer to the Dual-
Core Intel
®
Xeon® Processor 5100 Series Datasheet for the Thermal Profile
specifications. In case of conflict, the data information in the datasheet supersedes any
data in this figure.
Table 2-4, Table 2-5 and Table 2-6 describe thermal performance target for the Dual-
Core Intel Xeon Processor 5100 Series cooling solution enabled by Intel.
Table 2-4. Intel Reference Heatsink Performance Targets for the Dual-Core Intel®
Xeon® Processor 5148
Parameter Maximum Unit Notes
Altitude Sea-level m Heatsink designed at 0 meters
T
LA
TDP 40 W
T
CASE_MAX
T
CASE_MAX
@ P_profile_min 50 ° C P_profile_min = 22.2 W.
Airflow 15
Pressure Drop 0.331
ψ
CA
40 ° C
58 ° C
CFM
3
25.5
82.4
0.299 ° C/W Mean + 3σ
/ hr
m
Inches of H
Pa
Airflow through the heatsink fins
O
2
Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide 27
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