Intel 5000 User Manual

Intel® 5000 Series Chipset Memory Controller Hub(MCH)

Thermal/Mechanical Design Guide

May 2006

Document Number: 313067-001

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL TERMS AND CONDITIONS OF SALE FOR SU CH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.

Intel may make changes to specifications, product descriptions, and plans at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel

reserves these for future definition and shall have no responsibility whatsoever for con f licts or incompatibilities arising from future changes to them.

The Intel® 5000 Series chipset Memory Controller Hub may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available upon request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained

by calling 1-800-548-4725, or by visiting Intel’s website at http://www.intel.com Intel and The Dual-Core Intel® Xeon® processor 5000 Sequence, the Intel® 6700PXH 64-bit PCI Hub, the Intel®

E7500/E7501/E7505 chipset registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

2 Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide

and the Intel® 631xESB/632xESB I/O Controller Hub and the Intel logo are a trademarks or

PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S

Contents

1Introduction..............................................................................................................7

1.1 Design Flow........................................................................................................7

1.2 Definition of Terms..............................................................................................8

1.3 Reference Documents......................... ........................... ... ........................... ........9

2 Packaging Technology.............................................................................................11

2.1 Package Mechanical Requirements................................................ .......................12

3 Thermal Specifications ............................................................................................13

3.1 Thermal Design Power (TDP) ..............................................................................13

3.2 Case Temperature.................................... .. ... ........................... .. .......................13

4 Thermal Simulation ................................................................................................. 15

5 Thermal Metrology ..................................................................................................17

5.1 MCH Case Temperature Measurement..................................................................17

5.1.1 Supporting Test Equipment......................................................................17

5.1.2 Thermal Calibration and Controls..............................................................18

5.1.3 IHS Groove ...........................................................................................18

5.1.4 Thermocouple Conditioning and Preparation...............................................19

5.1.5 Thermocouple Attachment to the IHS........................................................20

5.1.6 Curing Process.......................................................................................23

5.1.7 Thermocouple Wire Management..............................................................24

5.1.8 Power Simulation Software......................................................................25

6 Reference Thermal Solution.....................................................................................27

6.1 Operating Environment.......................................... .. .. .. ......................................27

6.2 Heatsink Performance........................................................................................27

6.3 Mechanical Design Envelope ...............................................................................28

6.4 Board-Level Components Keepout Dimensions ........................... .. .. .. .....................28

6.5 Tall Torsional Clip Heatsink Thermal Solution Assembly ..........................................29

6.5.1 Heatsink Orientation...............................................................................30

6.5.2 Extruded Heatsink Profiles.......................................................................31

6.5.3 Mechanical Interface Material...................................................................31

6.5.4 Thermal Interface Material.......................................................................31

6.5.5 Heatsink Clip .........................................................................................31

6.5.6 Clip Retention Anchors............................................................................32

6.6 Reliability Guidelines.......................................................................................... 32

7 Reference Thermal Solution 2..................................................................................35

7.1 Operating Environment.......................................... .. .. .. ......................................35

7.2 Heatsink Performance........................................................................................35

7.3 Mechanical Design Envelope ...............................................................................36

7.4 Board-Level Components Keepout Dimensions ........................... .. .. .. .....................36

7.5 Short Torsional Clip Heatsink Thermal Solution Assembly........................................37

7.5.1 Heatsink Orientation...............................................................................38

7.5.2 Extruded Heatsink Profiles.......................................................................39

7.5.3 Mechanical Interface Material...................................................................39

7.5.4 Thermal Interface Material.......................................................................39

7.5.5 Clip Retention Anchors............................................................................39

7.6 Reliability Guidelines.......................................................................................... 39

Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide 3

A Thermal Solution Component Suppliers....................................................................41

A.1 Tall Torsional Clip Heatsink Thermal Solution.........................................................41

A.2 Short Torsional Clip Heatsink Thermal Solution......................................................42

B Mechanical Drawings ...............................................................................................43

Figures

1-1 Thermal Design Process................................................................... .................... 8

2-1 MCH Package Dimensions (Top View)...................................................................11

2-2 MCH Package Dimensions (Side View) ..................................................................11

2-3 MCH Package Dimensions (Bottom View)..............................................................12

5-1 IHS Groove Dimensions......................................................................................19

5-2 Orientation of Thermocouple Groove Relative to Package Pin...................................19

5-3 Bending the Tip of the Thermocouple....................................................................20

5-4 Securing Thermocouple Wires with Kanton* Tape Prior to Attach..............................21

5-5 Thermocouple Bead Placement............................................................................21

5-6 Position Bead on the Groove Step........................................................................22

5-7 Using 3D Micromanipulator to Secure Bead Location...............................................22

5-8 Measuring Resistance between Thermocouple and IHS............................................22

5-9 Applying the Adhesive on the Thermocouple Bead..................................................23

5-10 Thermocouple Wire Management Groove ..............................................................24

5-11 Removing Excess Adhesive from the IHS ..............................................................24

5-12 Filling the Groove with Adhesive ..........................................................................24

6-1 Tall Torsional Clip Heatsink Measured Thermal

Performance Versus Approach Velocity .................................................................27

6-2 Tall Torsional Clip Heatsink Volumetric Envelope for the Chipset MCH .......................28

6-3 Tall Torsional Clip Heatsink Board Component Keepout...........................................29

6-4 Retention Mechanism Component Keepout Zones...................................................30

6-5 Tall Torsional Clip Heatsink Assembly ...................................................................30

6-6 Tall Torsional Clip Heatsink Extrusion Profile..........................................................32

7-1 Short Torsional Clip Heatsink Measured

Thermal Performance Versus Approach Velocity.....................................................35

7-2 Short Torsional Clip Heatsink Volumetric Envelope for the Chipset MCH.....................36

7-3 Short Torsional Clip Heatsink Board Component Keepout ........................................37

7-4 Retention Mechanism Component Keepout Zones...................................................38

7-5 Short Torsional Clip Heatsink Assembly.................................................................38

7-6 Torsional Clip Heatsink Extrusion Profile................................................................39

B-1 Tall Torsional Clip Heatsink Assembly Drawing.......................................................44

B-2 Tall Torsional Clip Heatsink Drawing (Sheet 1 of 2).................................................45

B-3 Tall Torsional Clip Heatsink Drawing (Sheet 2 of 2).................................................46

B-4 Tall Torsional Clip Heatsink Clip Drawing...............................................................47

B-5 Short Torsional Clip Heatsink Assembly Drawing ....................................................48

B-6 Short Torsional Clip Heatsink Drawing(Sheet 1 of 2)......................................... .. ....49

B-7 Short Torsional Clip Heatsink Drawing(Sheet 2 of 2)......................................... .. ....50

B-8 Short Torsional Clip Heatsink Clip Drawing............................................................51

4 Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide

Tables

3-1 Intel® 5000P Chipset MCH Thermal Specifications........ ......................................... 13

3-2 Intel® 5000V Chipset MCH Thermal Specifications................................................. 13

3-3 Intel® 5000X Chipset MCH Thermal Specifications................................................. 14

5-1 Thermocouple Attach Support Equipment.............................................................17

6-1 Honeywell PCM45 F TIM Performance as a Function of Attach Pressure .....................31

6-2 Reliability Guidelines.......................................................................................... 32

B-1 Mechanical Drawing List .....................................................................................43

Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide 5

Revision Table

Revision

Number

-001 Initial release of the document. May 2006

Description Date

§§

6 Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide

Introduction

1 Introduction

As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heatsinks.

The goals of this document are to:

• Outline the thermal and mechanical operating limits and specifications for the

• Describe reference thermal solutions that meet the specification of the

Properly designed thermal solutions provide adequate cooling to maintain the Intel 5000 Series chipset MCH die temperatures at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the Intel 5000 Series chipset MCH die temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.

5000 Series chipset memory controller hub (MCH).

Intel

Intel 5000 Series chipset MCH.

The simplest and most cost effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.

This document addresses thermal design and specifications for the Intel 5000 Series chipset MCH components only. For thermal design information on other chipset components, refer to the respective component datasheet. For the PXH, refer to the Intel the Intel I/O Controller Hub Thermal/Mechanical Design Guidelines.

Note: Unless otherwise specified, the term “MCH” refers to the Intel 5000 Series chipset MCH.

6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines. For

631xESB/632xESB I/O Controller Hub, refer to the Intel® 631xESB/632xESB

1.1 Design Flow

To develop a reliable, cost-effective thermal solution, several tools have been provided to the system designer. Figure 1-1 illustrates the design process implicit to this document and the tools appropriate for each step.

Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide 7

Figure 1-1. Thermal Design Process

1.2 Definition of Terms

BGA Ball grid array. A package type, defined by a resin-fiber

substrate, onto which a die is mounted, bonded and encapsulated in molding compound. The primary electrical interface is an array of solder balls attached to the substrate opposite the die and molding compound.

BLT Bond line thickness. Final settled thickness of the thermal

interface material after installation of heatsink.

Intel

631xESB/632xESB I/O Controller Hub

The chipset component that integrates an Ultra ATA 100 controller, six Serial ATA host controller ports, one EHCI host controller, and four UHCI host controllers supporting eight external USB 2.0 ports, LPC interface controller, flash BIOS interface controller, PCI interface controller, Azalia / AC’97 digital controller, integrated LAN controller, an ASF controller and a ESI for communication with the MCH. The Intel 631xESB/ 632xESB I/O Controller Hub component provides the data buffering and interface arbitration required to ensure that system interfaces operate efficiently and provide the bandwidth necessary to enable the system to obtain peak performance.

MCH Memory controller hub. The chipset component that contains

PXH Intel

PXH-V Intel

case_max

the processor interface, the memory interface, the PCI Express* interface and the ESI interface.

6700PXH 64-bit PCI Hub. The chipset component that performs PCI bridging functions between the PCI Express interface and the PCI Bus. It contains two PCI bus interfaces that can be independently configured to operate in PCI (33 or 66 MHz) or PCI-X* mode 1 (66, 100 or 133 MHz), for either 32 or 64 bit PCI devices.

6702PXH 64-bit PCI Hub. The chipset component that performs PCI bridging functions between the PCI Express interface and the PCI Bus. It contains one PCI bus interface that can be configured to operate in PCI (33 or 66MHz) or PCI-X mode 1 (66, 100 or 133 MHz).

Maximum IHS temperature allowed. This temperature is measured at the geometric center of the top of IHS.

Introduction

8 Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide

Introduction

case_min

Minimum IHS temperature allowed. This temperature is measured at the geometric center of the top of IHS.

TDP Thermal design power. Thermal solutions should be designed to

dissipate this target power level. TDP is not the maximum power that the chipset can dissipate.

1.3 Reference Documents

The reader of this specification should also be familiar with material and concepts presented in the following documents:

•Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guide

•Intel® 6700PXH 64-bit PCI Hub Datasheet

•Intel

•Intel® 5000P/5000V/5000Z Chipset Memory Controller Hub (MCH) Datasheet

•Intel® 5000X Chipset Memory Controller Hub (MCH) Datasheet

• Dual-Core Intel® Xeon® Processor 5000 Series Datasheet

• Dual-Core Intel

• BGA/OLGA Assembly Development Guide

• Various system thermal design suggestions (http://www.formfactors.org)

631xESB/632xESB I/O Controller Hub Thermal/Mechanical Design

Guidelines

Xeon® Processor 5000 Series Thermal/Mechanical Design

Guidelines

Note: Unless otherwise specified, these documents are available through your Intel field sales

representative. Some documents may not be available at this time.

§§

Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide 9

Introduction

10 Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide

Packaging Technology

2 Packaging Technology

Intel 5000 Series chipset consist of three individual components: the Memory Controller Hub (MCH), the Intel

6700PXH 64-bit PCI Hub (PXH) and the Intel® 631xESB/632xESB I/O Controller Hub. Intel 5000 Series chipset MCH components use a 42.5 mm, 10-layer flip chip ball grid array (FC-BGA) package (see Figure 2-1, , and

Figure 2-2). For information on the PXH package, refer to the Intel

PCI Hub Thermal/Mechanical Design Guidelines. For information on the Intel 631xESB/632xESB I/O Controller Hub package, refer to the Intel I/O Controller Hub Thermal/Mechanical Design Guidelines.

Figure 2-1. MCH Package Dimensions (Top View)

Handling

Exclusion

Area

38.5 mm,

MCH

IHS

6700PXH 64-bit

631xESB/632xESB

42.5 mm.38.5 mm.

Figure 2-2. MCH Package Dimensions (Side View)

4.23 ± 0.146 mm

3.79 ± 0.144 mm

Notes:

1. Primary datum -C- and seating plan are def ine d by t he spherical crowns of the solder balls (shown before motherboard attach)

2. All dimensions and tolerances conform to ANS I Y 14.5M-1994

3. BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm

4. Shown before motherboard atta ch; FCBGA has a convex (dome shaped) orientation bef or e reflow and is expected to have a slightly concave (bowl shaped) orientation after reflow

2.44 ± 0.071 mm

0.435 ± 0.025 mm See note 3

42.5 mm.

IHS

Seating Plane

Substrate

0.20

See note 1.

See note 4.

0.20 –C–

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 11

Figure 2-3. MCH Package Dimensions (Bottom View)

20.202

37X 1.092

37X

1.092

11 252321191715139753127293733 3531

20.202

42.5 +

0.05

0. 2

C A

Packaging Technology

2822 26242018161412108642 36343230 38

42.5 + 0.05

- A

Notes:

1. All dimensions are in millimeters.

2. All dimensions and tolerances conform to ANSI Y14.5M-1994.

2.1 Package Mechanical Requirements

The Intel 5000 Series chipset MCH package has an integrated heat spreader (IHS) that is capable of sustaining a maximum static normal load of 15 lbf. These mechanical load limits must not be exceeded during heatsink installation, mechanical stress testing, standard shipping conditions and/or any other use condition.

Note:

1. The heatsink attach solutions must not include continuous stress to the chipset package with the exception of a uniform load to maintain the heatsink-to-package thermal interface.

2. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface.

3. These specifications are based on limited testing for design characterization. Loading limits are for the package only.

12 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide

Thermal Specifications

3 Thermal Specifications

3.1 Thermal Design Power (TDP)

Analysis indicates that real applications are unlikely to cause the MCH component to consume maximum power dissipation for sustained time periods. Therefore, in order to arrive at a more realistic power level for thermal design purposes, Intel characterizes power consumption based on known platform benchmark applications. The resulting power consumption is referred to as the Thermal Design Power (TDP). TDP is the target power level to which the thermal solutions should be designed. TDP is not the maximum power that the chipset can dissipate.

For TDP specifications, see Table 3-1 for the Intel the Intel

5000V chipset MCH, and Table 3-3 for the Intel® 5000X chipset MCH. FCBGA packages have poor heat transfer capability into the board and have minimal thermal capability without thermal solution. Intel recommends that system designers plan for a heatsink when using Intel 5000 Series chipset.

3.2 Case Temperature

5000P chipset MCH, Table 3-2 for

To ensure proper operation and reliability of the Intel 5000 Series chipset MCH, the case temperatures must be at or between the maximum/minimum operating temperature ranges as specified in Table 3-1 through Table 3-3. System and/or component level thermal solutions are required to maintain these temperature specifications. Refer to Chapter 5, “Thermal Metrology” for guidelines on accurately measuring package case temperatures.

Table 3-1. Intel® 5000P Chipset MCH Thermal Specifications

Parameter Value Notes

case_max

case_min

TDP

with 1 active memory channel

TDP

with 2 active memory channel

TDP

with 4 active memory channel

105°C

5°C

24.7 W

26.4 W

30.0 W

Note: These specifications are based on preliminary silicon characterization, however, they

may be updated as further data becomes available.

Table 3-2. Intel® 5000V Chip set MCH Thermal Specifications

Parameter Value Notes

case_max

case_min

TDP

with 1 active memory channel

TDP

with 2 active memory channel

105°C

5°C

23.4 W

25.1 W

Note: These specifications are based on preliminary silicon characterization; however, they

may be updated as further data becomes available.

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 13

Table 3-3. Intel® 5000X Chipset MCH Thermal Specifications

Parameter Value Notes

case_max

case_min

TDP

with 1 active memory channel

TDP

with 2 active memory channel

TDP

with 4 active memory channel

105°C

5°C

27.3 W

29.0 W

32.4 W

Thermal Specifications

Note: These specifications are based on preliminary silicon characterization, however, they

may be updated as further data becomes available.

14 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide

Thermal Simulation

4 Thermal Simulation

Intel provides thermal simulation models of the Intel 5000 Series chipset MCH and associated user’s guides to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated, system-level environment. The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool FLOTHERM* (version 5.1 or higher) by Flomerics, Inc. Contact your Intel field sales representative to order the thermal models and user’s guides.

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide 15

Thermal Simulation

16 Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide

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