HP StorageWorks XP10000 Disk Array Site Prep Manual

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HP StorageWorks XP10000 Disk Array Site Prep Guide
This guide describes how to prepare your site for the HP StorageWorks XP10000 Disk Array.
Par t number: AE102-96004 second edition: (December 2005)
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Legal and notice information
Condential computer software. Valid license from HP required for possession, use or copying. Consistent with FAR 12.211 and 12.212, Commercial Computer Software, Computer Software Documentation, and Technical Data for Commercial Items are licensed to the U.S. Government under vendor’s standard commercial license.
The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.
Intel, Itanium, Pentium, Intel Inside, and the Intel Inside logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other c ountries.
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UNIX is a registered trademark of The Open Group.
Printed in the US
HP StorageWorks XP10000 Disk Array Site Prep Guide
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Contents
Preface ......................... 6
Aboutthisguide................................ 6
Intendedaudience............................... 6
DiskArrays.................................. 6
RelatedDocumentation............................. 6
Documentconventionsandsymbols ....................... 7
Rackstability ................................. 8
HPtechnicalsupport.............................. 8
Subscriptionservice .............................. 8
OtherHPwebsites .............................. 9
1Siteprepteamandtasks................ 11
Thesiteprepteam.............................. 12
HPrepresentativeresponsibilities...................... 12
Customerresponsibilities ......................... 12
Sitepreptasks ............................... 13
Siteprepchecklist ............................ 14
Sitepreptimeallowances......................... 16
2Siterequirements ................... 17
Disk array physical specications ....................... 18
Dimensionsandweights ......................... 20
Componentweights ........................... 21
Calculating the weight of your disk array conguration ............ 23
Weightcalculationexample........................ 24
Deliveryspacerequirements.......................... 25
Generalcomputerroomrequirements...................... 26
Preventingelectrostaticdischarge ..................... 27
Safetyrequirements ............................. 28
Firesafety ............................... 28
Equipmentservicinghazards ....................... 28
Electricalhazards ............................ 28
Spaceplanningrequirements ......................... 29
Thespaceplanningprocess........................ 29
Raised oorrequirements........................... 30
Estimating required oorloadrating .................... 31
Floorcovering.............................. 31
HP StorageWorks XP10000 Disk Array Site Prep Guide
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Floorclearanceandcutoutdimensions ................... 32
Primaryrackdimensionsandcablecutoutlocation............ 32
Calculatingclearances........................ 33
Primary and second rack clearance dimensions and cutouts . . . . . . . . 37
Environmentalrequirements.......................... 40
Altitude ................................ 40
Airconditioning............................. 40
Temperature specications ........................ 41
Humidity specications.......................... 42
Mechanical vibration specications..................... 43
Shock specications ........................... 43
Heat dissipation, power consumption, and air flow .............. 44
Acoustics................................ 46
Dustandpollutioncontrol......................... 47
Metallicparticulatecontamination ..................... 47
Datacommrequirements ........................... 48
Electricalrequirements ............................ 49
Linevoltage............................... 49
Branchcircuitbreakers.......................... 49
Single-phasebranchcircuitbreakers .................. 49
Frequency ............................... 49
Safetyanddedicatedground ....................... 49
Groundingrequirements ......................... 50
ACconnections ............................. 50
Powerlinetransients ........................... 51
Protection against sources of electrical interference . . . . . . . . . . . . . . 51
Uninterruptiblepowersupply(UPS)....................... 52
3Electricalspecifications................. 53
AClinevoltagerequirements ......................... 53
ACinputs................................ 54
NorthAmericanACpowercabling....................... 56
Branchcircuitrequirements ........................ 56
EuropeanACpowercabling ......................... 57
Europeanbranchcircuitrequirements.................... 57
ConnectingtheEuropeanpower-supplycables................ 58
4Deliveryandunpacking ................ 59
Checkingforshippingshortageanddamage .................. 60
Unpackingtheequipment........................... 60
Requiredpersonnel ........................... 60
Requiredtools.............................. 60
Packaging congurations......................... 61
Unpackingprocess............................ 61
Safetyprecautions.......................... 62
Removingpackagingmaterials .................... 63
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Glossary........................ 67
Index ......................... 75
HP StorageWorks XP10000 Disk Array Site Prep Guide
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Preface
About this guide
This guide provides information about preparing your site for installation of the XP10000 Disk Array.
Intended audience
This guide is intended for system administrators with knowledge of the host hardware, the operating sy
stem, and RAID technology.
Disk Arrays
Unless otherwise noted, the term disk array refers to the XP10000 D isk Array.
Related Documentation
HP provides the
se related documents:
HP StorageWorks XP10000 Disk Array Owner’s Guide
HP StorageWorks Remote Web Console XP User Guide
HP StorageWor
ks Command View XP Advanced Edition User Guide
HP StorageWorks Disk Array XP Operating System Conguration Guide
To locate these documents, to learn more about HP software products, or to obtain software updates, visit the HP web site: h
ttp://h18006.www1.hp.com/storage/
xparrays.h
tml.
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Preface
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Document conventions and symbols
Convention
Element
Blue text
Cross-reference l
inks and email addresses
Bold
Keys that are pre
ssed
Text typed into a GUI element, such as a box
GUI elements that are clicked or selected, such as
menu and list it
ems, buttons, tabs, and check boxes
Literal values typed exactly as shown
Italics
Text emphasis and book titles
Blue, underlined:
w
ww.hp.com
Web site addresses
Monospace fo
nt
File and directory names
System outp
ut
Code
Commands, their arguments, and argument values
Monospace, italic font
Code variables
Command v
ariables
Monospace, bold font
Emphasized monospace text
WARNING!
Indicates that failure to follow directions could result in bodily harm or death.
CAUTION:
Indicates that failure to follow directions could result in damage to equipment or data.
NOTE:
Provides additional information.
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Rack stability
Rack stability protects personnel and equipment.
WARNING!
To reduce the r
isk of personal injury or damage to equipment:
Extend leveling jacks to the oor.
Ensure that the full weight of the rack rests on the leveling jacks.
Install sta
bilizing feet on the rack.
In multiple-rack installations, fasten racks together securely.
Extend only one rack component at a time. Racks can become unstable if more
than one co
mponent is extended.
HP technical support
Telephone numbers for worldwide technical support are listed on the HP support web site: h
ttp://www.hp.com/support/.
Collect the following information before calling:
Technical support registration number (if applicable)
Product serial numbers
Product model names and numbers
Error messages
Operating system type and revision level
Detailed questions
For continuous quality improvement, calls may be recorded or monitored.
Subscription serv ice
HP strongly recommends that customers register online using the Subscriber’s choice web site: h
ttp://ww w.hp.com/go/e-updates.
Subscribing to this service provides you with e-mail updates on the latest product enhancements, newest driver versions, and rmware documentation updates as well as instant access to numerous other product resources.
After subscribing, locate your products by selecting Business suppor t and then Storage under Product Category.
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Preface
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Other HP web sites
For additional information, see the following HP web sites:
•w
ww.hp.com
•www.hp.com/go/storage
•www.hp.com/service_locator
•www.docs.hp
.com
HP StorageWorks XP10000 Disk Array Site Prep Guide
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10
Preface
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1 Site prep team and tasks
The objective of a site preparation is to prepare your site for the successful and timely installation of the HP XP10000 disk array. Proper site preparation is vital for the reliability of the disk array.
Site prep involves a careful balance of equipment design criteria, site environmental variables, your business needs, and your budget constraints.
In addition to this guide, other site prep resources may be available to you. The HP service organization is committed to making sure you receive maximum benetfromyour disk array. HP representatives will guide and assist you throughout the site prep process.
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Thesiteprepteam
The site prep team plans, schedules, and completes all tasks necessary to prepare your site for succ
essful disk array installation.
The site prep team consists of HP representatives and you, the customer.
HP representative responsibilities
The HP team includes various HP representatives who have the training, knowledge, experience, tools, and parts required to install and maintain XP disk arrays. This team:
Helps you to determine and implement the site requirements for your specific
site and array conguration
Coordinates all HP resources to ensure successful delivery and installation of
the disk array
Your HP SR is your primary point of contact with HP during the site preparation process.
Customer responsibilities
As part of
thesiteprepteam,yourresponsibilitiesincludeplanningandpreparing
asuitab
le environment for the disk array, and scheduling equipment delivery and installation. However, HP representatives are available to help you throughout the site prep process. Your internal site team may include personnel specializing in your site comput
er room, such as your storage administrator and your site electrician.
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Site prep team and tasks
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Site prep tasks
Contact your HP SR for assistance at any time during the site prep process.
1. If you have not printed a copy of this guide, HP recommends that you print at least
Chapter 2 and the “Site prep checklist”. Working from printed copies makes it easier to use the tools provided and provides hard copy documents that you can keep for you
rrecords.
2. Carefully review Chapter 2 to understand the site requirements for the disk array.
If you plan to connect additional external storage to the XP10000, be sure to take the requirements of that storage into account. See the documentation for the external
system.
3. Use the information, instructions, and tools in Chapter 2 to determine site
requirements for the specic disk array components you ordered.
4. On the si
te prep checklist, answer ea ch item “Yes” or “No” as it relates to your site. The checklist includes references to the pages in this guide where you can nd more information on each item.
5. Checklist items that require a “Yes” answer are marked with asterisks (*). If you
answe
r “No” for any of these items, your site does not meet site requirements for the disk array. Using the information in Chapter 2, correct the site environment so that you can answer “Yes” for each of these items.
6. When your site meets all site requirements, contact your HP SR to coordinate
del
ivery of the disk array equipment.
7. If you choose to unpack the equipment cartons without HP supervision, follow the
instructions in Chapter 3.
8. Co
ntact the HP SR to schedule disk array installation and conguration.
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Site prep check
list
Checklist ite
ms that require a “Yes” answer a re marked with asterisks (*). The customer summary information is included for the benet of HP representatives, who will help you complete the checklist.
Customer summary
Customer:
Date:
Address:
Contact:
Phone:
HP summary
HP SR:
Phone:
HP representative:
Phone:
Safety Yes No Reference
Is there a re protection system in the computer room?
Fire safety
Isthecomputerroomfreeofany equipment servicing hazards (for example, electrical or data cables that obstruct access)?
Equipment servicing hazards
Is the exi
sting oor plan documented?
The space planning process
Has a new oor plan been developed to include the new array?
The space planning process
Does the new oor plan include adequate space for airow and servicing needs?
Floor clearance and cutout dimensions
Does th
enewoor plan include the
cleara
nce required for the oor’s load
ratin
g?
Floor clearance and cutout dimensions
Is the computer room structurally complete (walls, floor, air conditioning system, and so on)?
General computer room requirementsAir conditioning
Is the raised oor adequate for the equipment load?
Raised oor requirements
Is antistatic ooringormatsinstalled?
Pre
venting electrostatic discharge
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Site prep team and tasks
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Are there cutouts or channels for cable routing?
Floor clearance and cutout dimensions
Is there a dedicat
ed analog telephone
line for “phone home” conguration?
Data comm requirem
ents
Is a telephone line available for HP representative use?
Data comm requirements
Is a private LAN available?
Data comm requirements
Can t he temperature be maintained between 16× and 32× C?
Temperature spe
cications
Can temperature changes be held to less than 10× C per hour?
Temperature specications
Can the humidity level be maintained between 20% and 80%?
Humidity specifications
Is the compu
ter room protected
against dus
t, pollution, and metallic
particula
te contamination?
Dust and pol
lution controlMetallic
particulat
e contamination
Does the computer room support other environmental considerations (such as vibration and acoustics)?
Mechanical vibration specicationsAcoustics
Are sufcient AC outlets, on different lines, available for the equipment?
Electrical requirements
Does the
input voltage correspond to
the equipment specications?
Electri
cal requirements
Are the input circuit breakers adequate for equipment loads?
Electrical requirements
Does the input frequency correspond to equipment specications?
Electrical requirements
Is an appropriate uninterruptible power supply (UPS) strategy in place?
Uninterruptible power supply (UPS)
If lightning arresters are recommended, are they installed?
Protection against sources of electrical interference
Have all sources of electrical interference been corrected?
Protection against sources of electrical interference
Doe
s the customer site have
ac
cess control (for example, do HP
re
presentatives need an escort)?
N/A
Does the computer room have access control (for example, do HP representatives need a security code)?
N/A
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Are all oors, stairs, elevators, stairwalkers, lifts, ramps, or ladders needed to move the equipment adequate to support its weight and size?
Dimensions and weights
Will the equipment tthroughall doors and corrid
ors and in lifts?
Dimensions and w
eights
Doesthebuildinghavealoading dock? Maximum access height is _____m.
Dimensions and weights
Additional equipment N/A
For any additi
onal equipment
required (fo
r example, connectors,
receptacles
,cables,andany
equipment n
ot supplied by HP), is the
equipment o
nsiteandreadyforuse?
N/A
Site prep time allowances
The following site prep tasks may require several weeks:
Acquiring required power connectors
Arranging for an electrician
Adding or modifying air conditioning systems
Making building alterations
Placing an order for data comm equipment
The time between placing an equipment order and actual delivery can vary. Contact your HP representative to determine the best estimated delivery dates.
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Site prep team and tasks
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2Siterequirements
Your site must meet the following requirements before HP can deliver and install the disk array:
General computer room requirements
Safety requirements
Raised oor requirements
Environmental requirements
Data comm requirements
Electrical requirements
Protection aga inst sources of electrical interference
Uninterruptible power supply (UPS)
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Disk array physical specications
Use the information in this section to determine the total dimensions and weight for your specicarrayconfiguration. You will need these values to complete other procedures in this chapter.
The followin
g gure shows the disk array equipment racks.
Primary rack
In the basic conguration, the disk array consists of one primary 19-inch rack containing the following:
One disk con
troller with control panel and SVP blade PC
One 60-disk chassis, consisting of two 30-drive HDU boxes
Mix board with disk adapters and host ports
Power supp
lies, power distribution units (PDUs), backup batteries, power cords,
and cabling
Primary rack expansion
You can exp
and the primary rack as follows:
Add one 60-disk chassis containing two 30-drive HDU boxes to the top space of
the primary rack. This provides a total of 120 drives.
Second rack
After exp
anding the primary rack, you can add a second 19-inch rack with additional
disk uni
ts as follows:
Addone60-diskchassistothesecondrackforatotalof180drives
Add a second 60-disk chassis to the second rack for a total of 240 drives
Disk arr
ay basic storage includes disk chassis R0 in the primary rack. Add more disk
chassi
s in the order shown in the gure: R1, R2, R3.
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HP StorageWorks XP10000 Disk Array Site Prep Guide
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Dimensions and
weights
Use the packaged values when determining delivery space and loading requirements and unpackaged values during space and oor load planning. In the USA and Canada, most shipments use a special carrier process in which frames are shipped without pallets, ramps, or cartons. In these cases, the packaged weight is the unpackaged weight plus
23 kg (50 lb).
Rack specication
Unpackaged rack Packaged rack
Width 610 mm, 24.0 inches 950 mm, 37.4 inches
Depth 925 mm, 36.4 inches 1110 mm, 43.7 inches
Height 1920 mm, 75.6 inches 2030 mm, 79.9 inches
Weight, p
rimary rack, basic
335.5 kg,
740 lbs
448.5 kg,
989 lbs
Weight, primary rack, maximum
577 kg, 1272 lbs 690 kg, 1521 lbs
Weight second rack, maximum
47 3 kg, 1043 lbs 586 kg, 1292 lbs
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Component weig
hts
The following
table provides approximate weights of additional disk array components.
The number of d
isk drives is the m a in factor accounting for total weight of the disk
array. Actua
lweightofthearrayracksistheminimumrackweightplustheweightofall
additional components.
Product
Description
kg lb
AE006A
HP XP12000/100 00 16-port 2-Gb FC CHIP
5.0 11.0
AE007A
HP XP12000/10000 32-Port 2-Gb FC CHIP
5.8 12.8
AE008A
HP XP12000/
10000 FC SFP LW Transceiver
0.02
0.04
AE010A
XP12000/10000 32-port 4 Gbps FC SW CHIP pair
5.9 13
AE013A
HP XP12000/10000 8-Port FICON SW CHIP
5.7
12.6
AE014A
HP XP12000/
10000 8-Port FICON LW CHIP
5.7
12.6
AE015A
XP12000/10000 16-port 1–2 Gbps FICON SW CHIP pair
5.9 13
AE016A
XP12000/10000 16-port 1–2 Gbps FICON LW C HIP pair
5.9 13
AE017A
HP XP12000
/10000 16-Port EXSA CHIP
5.4
11.9
AE018A
HP X P12000/10000 8-Port 1-Gb NAS SW CHIP
6.5
14.3
AE025A
HP XP12000/10 000 4-GB Cache Memory
0.2
0.44
AE030A
HP XP1200
0/10000 1-GB Shared Memory
0.06 0.13
AE102A
HP XP10000 19" primary rack, disk controller, base disk chassis for up to 60 HDDs, power supplies, base batteries for up to 12GB cache and up to 3GB Shared M emory
335.5
740
AE104B
HP XP10000 Disk Chassis
80.4
177
AE105B HP XP10
000 16-Port FC SW CHIP 8-Port ACP
5.0 11.0
AE110B
HP XP10000 Battery 8.0 17.6
AE115B
HP XP10000 Second Rack Disk Array Frame ­DKU
261
575
AE120A
HP XP
10000 73GB 15k rpm Array Group
4.4
9.7
AE120AS
HP XP10000 73GB 15k rpm Spare Disk
1.1
2.4
HP StorageWorks XP10000 Disk Array Site Prep Guide
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Product
Description
kg lb
AE121A
HP XP10000 146GB 10k rpm Array Group
4
8.8
AE121AS
HP XP10000 146GB 10k rpm Spare Dis k
1
2.2
AE122A
HP XP10000 146GB 15k rpm Array Group
4
8.8
AE122AS
HP XP10000 146GB 15k rpm Spare Dis k
1
2.2
AE123B
HP XP10000 300GB
10k rpm Array Group
4
8.8
AE123BS
HP XP10000 300GB 10k rpm Spare Disk
1
2.2
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Calculating the weight of your disk array conguration
The total weight of your array conguration includes the controller, the disk chassis, plus the total of all disk drives in each cabinet and any optional components. Your site must have adequate oor strength to suppor t the total weight of the array, from the delivery area to the co
mputer room.
Fill in the following weight calculation worksheet to calculate the total weight of your unpackaged array conguration, in your preferred units (kg or lb). Following the worksheet is a completed example worksheet.
Use the calc
ulated total weight to estimate the required oor load rating for the computer
room as explained later in this chapter.
Part Number
Descriptio
n
Weight
Quantity
Total weigh
t
Total weight of your conguration
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Weight calcula
tion example
Part Number
Description
Weight
Quan-
tity
Total
weight
AE102A
HP XP10000 19" Primary Rack, disk controller, base disk chassis for up to 60 HDDs, power supplies, base batteries for up to 12GB cache and up to 3GB Shared Memory
740 x
1=
740 .0
AE007A
HP XP12000/10000 32-Port 2-Gb FC CHIP
12.8 x
1=
12.8
AE025A
HP XP12000/10000 4-GB Cache Memory
0.44 x
1=
0.4
AE030A
HP X P12 000/10000 1-GB Shared Memory
0.13 x 3 =
0.4
AE104B
HP XP10 000 Disk Chassis (holds up to 60 drives)
177.0 x
1=
177.0
AE105B HP XP100
00 16Port FC SW CHIP
8-Port
ACP
11.0 x
1=
11.0
AE110B
HP XP10000 Battery 17.6 x
1=
17.6
AE123B
HP XP10000 300GB 10k rpm Array Group
8.8 x 28 =
246.4
AE123BS
HP XP1
0000 300GB 10k rpm Spare
Disk
2.2 x 8 = 17 .6
Total unpackaged weight of your conguration (rounded)
1223.2
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Delivery space requirements
The delivery area must provide enough space and oor strength to support the packaged equipment cartons for the disk array. Refer to the packaged dimensions and weights under the heading “Dimensions and weights.”
CAUTION:
Make sure tha
t your doorways and hallways provide enough clearance to move the
equipment s
afely from the delivery area to the computer room. Permanent obstructions such as pillars or narrow doorways can cause equipment damage. If necessary, plan for the removal of walls or doors.
CAUTION:
Make sure all oors, stairs, and elev ators you use when moving the disk arr ay to the computer room can support the weight and size of the equipment. Failure to do so could damage the equipment or your site.
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General computer room requirements
The goal of a computer room is to maintain an ideal environment for computer equipment, including XP disk arrays.
Make sure your computer room adheres to all national and local building codes for a data center/computer room environment.
HP recommend
s that you follow these general guidelines:
Locate the computer room away from exterior walls of the building to avoid the
heat gain from windows and exterior wall surfaces.
When exterior windows are unavoidable, use windows that are double or tripled
glazed and
shaded to prevent direct sunlight from entering the computer room.
Maintainthecomputerroomatapositivepressurerelativetothesurrounding
spaces to reduce introduction of contaminants.
Install a vapor barrier around the entire computer room envelope
(oors/
walls/ceiling) to help keep moisture out of the room. This is especially
import
ant if your computer room is located underground.
Caulk and vapor-seal all pipes and cables that penetrate the computer room
envelope.
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Preventing ele
ctrostatic discharge
Electrostatic discharge (ESD) can cause component damage, especially during servicing operations.
Static charge
s occur when objects are separated or rubbed together. The voltage level
of a static ch
arge is determined by the following factors:
Types of materials
Relative humidity — low humidity tends to increase ESD voltage.
Rate of chan
ge — a sta ndard air conditioner cools the air and lowers humidity.
The faster
the air is cooled and dried, the greater the likelihood of ESD.
Separation — refers to the static discharge that can be generated when two
objects are separated. For example, printer paper is often stored in cool dry conditions. If opened and used immediately, the act of removing the paper from its box generates static.
Follow these precautions to minimize possible ESD-induced failures in your co mputer room:
Install c onductive ooring(conductiveadhesivemustbeusedwhenlayingtiles).
Useconductivewaxifwaxedoors are installed.
Ensure
that all equipment and ooring are properly grounded and are at the
same ground potential.
Useconductivetablesandchairs.
Store
spare electric parts in antistatic containers.
Use proper cooling equipment to reduce the risk of ESD by maintaining
recommended humidity level and airow rates.
Leave boxes of paper open in the computer room for several hours before use to
all
ow static to discharge gradually over time.
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Safety requirements
When making decisions concerning site safety, your rst concern should be the safety of your personnel and then the safety of your equipment.
Fundamental safeguards for disk arrays should include a site well away from any sources of potential damage.
If you have any qu estions on site safety, consult your HP representative, your insurance carrier, an
d local building inspectors for safety recommendations.
Fire safety
Consult your insurance carrier and local re department for re safety suggestions. They can analyze your existing re control systems and advise you on any required changes. If you are building a new site or making structural changes to an existing site, consult your local b uild ing cod es for re prevention and protection guidelines.
Equipment servicing hazards
Your staff and HP service personnel require safe access to the disk array. Running electrical and data communication cables underneath your computer room’s raised oor is the b
est way to ensure that they do not create a safety hazard.
Electrical hazards
The disk array equipment racks contain dangerous voltages. To prevent injury or death from electric shock, refer all electrical installation and service to qualied personnel.
28 Site requirements
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Space planning requirements
Space planning involves making sure that your computer room:
Is large enou
gh to hold the new array and other equipment and furniture
Provides clearance around the array for service access and to ensure proper
weight distribution on the computer room’s oor
Includes cor
rectly positioned oor cutouts for the array’s power and data c ables
The space planning process
1. Document your computer room’s existing oor plan, including locations of these
items:
a. Im movable objects, such as structural support columns
b. Walls
c. All equipment, furniture, cabinets, racks, data comm equipment, and systems
d. Floor cutouts
e. Electrical outlets
f. Interconnecting cables and power cords, including lengths
g. Floor vents
2. Developanewoor plan that includes the locations of all of the above items
plus the disk array and any new items added to support it. Include exibility to accommodate additional equipment as your requirements increase.
3. Implem ent the new oor plan, leaving empty space where the array will be
installed. If the new oor plan requires construction changes, consult with local contractors and your HP representatives.
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Raised oor requirements
The computer room oor must be able to support the total weight of the equipment as well as localized weight at each caster or foot of the equipment cabinets. A common method of preparing an adequate oor for a computer room is to construct a raised ooroverthebuildingoor. A raised oor:
Allows weight to be spread evenly across the oor
Provides a
nunder-floor area for running interconnecting cables conveniently
and unobtrusively
Allows optimum distribution of conditioned air
WARNING!
If metal is used in the construction of the raised oor, ensure that there is a common ground co
nnection between the raised oor and main oor to avoid possible build
up of dif
ferent voltage potentials. Failure to comply can result in serious injury to
personnel and damage to equipment.
Requirements for raised oors:
Raised oor access ramps must not exceed a 10 degree slope.
Use a raised oorsystem(254to305mm,10to12inches)forthemost
favorable room air distribution system.
Gridpanelsmustbeatleast450x450mm(17.72x17.72in).
The oor must have a load rating between 300 and 500 kg per square meter
(553 to 921.7 lb per square yard, or 61.4 to 102.4 lb per square foot). The maximum oor loading at any point is 500 kg (1102.3 lb) .
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Estimating required oor load rating
To estimate the load rating you need for your oor, consider the total weight of all of these items:
Thediskarray;seetheprecedingComponent weights
Other equipm
ent
Furniture such as desks, chairs, and storage cabinets
Computer room personnel
Moving equi
pment such as forklifts, dollies, and similar items
The lower t
he oor load rating, the more clearance is required around the array to
distribut
e the equipment weight correctly. If your computer room is too small to allow
for minim
um required clearance around the array, you may need to increase the oor load rating. For more on required clearance, see Floor clearance and cutout dimensions later in this chapter.
Floor covering
HP recommends the use of a tiled raised oor.
CAUTION:
HP strongly discourages the use of carpeting, including antistatic varieties, within 6.0 m (20 ft.) of the disk array. Over time, carpeting may shed dust that can cause problems with the disk array.
CAUTION:
If your computer room has carpeting, place static discharge mats so that personnel must walk across them before touching any part of the array. Failure to comply with this precaution can result in equipment damage through static discharge.
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Floor clearanc
e and cutout dimensions
Figures on the following pages show the clearance dimensions, locations of oor cutouts, and other dimensions for the primary and second racks.
Primary rack dimensions and c able cutout location
The following gure shows rack dimensions, clearances, and the cable cutout location. The cutout may be off-center as long as it is within the area shown and corresponds to the opening in the bottom of the cabinet to allow cables to pass through. See the following pages for additional notes.
32 Site requirements
Page 33
Calculating cl
earances
The total oor c
learance required for the disk array includes:
The actual space required by the equipment.
Service clearance — the oor space required to access the disk array. Never
use this space
for storage.
Additional space required to properly distribute the equipment weight on your
computer room’s raised oor. The amount of additional space required depends on your oor load rating.
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34
Site requirements
Page 35
Calculate primary rack clearance dimensions as follows:
Clearance “a” is the space between the service clearance at the left side of
the array (100 mm minimum for installing the kickplate) and any other object, such as a desk or wall.
Clearance “b” is the space between the service clearance at the right side of the
array (100 mm for the kickplate) and any other object.
Clearance “c” is the space between the service clearance at the front of the
array and any other object.
Usethevalueof“c”andyouroor load rating to determine the values for a
and b according to the following steps.
1. Determine how much space you can assign to clearance “c”. For maintenance
purposes, try to make “c” larger (1000 mm) rather than smaller (0 cm). The smaller “c” is, the larger “a” and “b” must b e.
2. In the following oor loading table, ndthecolumnfor“c”thatmostclosely
matches your value. If your “c” value is in between two table values, use the larger table value. Then, nd the row for your oor load rating. Where the column and row intersect is the a+b value.
3. To determine clearance “a” and clearance “b”, divide the a+b value between
“a” and “b”. They do not need to be equal. For example, if the a +b value from the table is 600 mm, then “a” can be 400 mm and “b” can be 200, or both “a” and “b” can be 300.
4. Calculate clearances by lling in and adding the table columns below:
Left (add down)
Right (add down)
Front (add down)
Back (add down)
Clearance values
a _________
b _________
c _________
Not applicable
Plus minimum service clearance
100 mm (3.94 in)
100 mm (3.94 in)
1000 mm (39.4 in)
1000 mm (39.4 in)
Equal
stotal
clea
rance
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Primary rack cl
earance notes and oor loading
The following n
otes apply to preceding primary rack dimensional gures.
Note *1: Cleara
nce (a+b) depends on the oor load rating and clearance “c”. Required
clearances fo
rvariousoor load ratings are shown below.
Required clearance (a + b) mm
Clearance (c) mm
Floorload
rating
(kg/mm2)
c = 0 c = 200 c = 400 c = 600 c = 1000
500 200 100 0.00 0.00 0.00
450
300 200 100 100 0.00
400 400
300 300 200 100
350 600 500
400 400
200
300 1000 800 700 600 500
Provide100mmofclearanceonbothsidesofthediskarraywhenthekickplatesareto be attache
d after the disk array is installed. When disk arrays of the same type are to
be installed adjacent to each other, clearance between the arrays may be 100 mm.
Additional notes on primary rack oor loading and clearances:
Decide actual clearances in consultation with the construction specialist
responsible for installation. They may vary depending on the size and layout of the system and building conditions.
When multiple disk arrays are arranged in a row, base your clearance values on
the requirements of the largest disk array.
Generally, clearances (“c”) should be as large as allowable.
36 Site requirements
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Primary and sec
ond rack clearance dimensions and cutouts
The following
gures show oor clearance dimensions when two racks are installed.
See also the ta
ble and text following the gures for notes and details. Clearances
for two racks
are calculated and recorded in the preceding table in the same way as
asinglerack.
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38 Site requirements
Page 39
Primary and sec
ond rack clearance notes and oor loading
The following e
xplanatory notes apply to the preceding oor clearance drawings for the
primary and second rack.
*1: Clearance (a+b) depends on the oor load rating and clearance “c”. Required clearances for various oor load ratings are shown below.
*2: Clearance between racks must be at least 10 mm. If the kickplate is installed after rack placeme
nt, allow 100 mm.
Required clearance ( a + b) mm
Clearance (c) mm
Floorload
rating
(kg/mm2)
c = 0 c = 200 c = 400 c = 600 c = 1000
500 100 0.00 0.00 0.00 0.00
450
300 200 0.00 0.00 0.00
400
600
400
300 200 0.00
3501000800600500200
300 1600 1300 1100 900 600
Addition
al primary and second rack oor loading and clearance notes:
Decide actual clearances in consultation with the construction specialist
responsi
ble for installation. They may vary depending on the size and layout of
the system and building conditions.
When multiple disk arrays are arranged in a row, b ase your clearance values on
the requirements of the largest disk array.
Genera
lly, clearances (“c”) should be as large as allowable.
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Environmental requirements
The environmental specications for operating your dis k array must be satised before installation.
Altitude
The maximum altitude for disk array operation is 3,000 meters. For nonoperational or storage situations, the maximum altitude is 4,000 m eters.
Air conditioning
Use separate computer room air conditioning duct work. If it is not separate from the rest of the building, it might be difcult to control cooling and air pressure levels. Duct work seals are important for maintaining a balanced air conditioning system and high static air pressure. Adequate cooling capacity means little if humidity levels increase when the ducts are exposed to warm air, producing condensation. Condensation on any disk
hardware can damage the components.
Any ques
tions regarding the adequacy of airow construction should be referred to and
evalua
ted by a qualied structural engineer.
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Site requirements
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Temperature specications
Temperature range type Range
Recommended operating temperature range 21 to 24 degrees C
70 to 75 degrees F
Operating tem
perature
16 to 32 degree
sC
61 to 89 degree
sF
Nonoperating temperature range
–10 to +43 degrees C 14 to 109 degrees F
Shipping and storage temperature (product packed in factory packing)
–25 to +60 degrees C –13to+140degreesF
Temperatur
e shock immunity (maximum rate
of temperat
ure change)
10 degrees C
per hour
18 degrees F
per hour
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Humidity specications
Maintain proper humidity levels. High humidity levels cause galvanic actions to occur between some dissimilar metals. This eventually causes a high resistance between connections, leading to equipment failure.
Low humidity contributes to undesirably high levels of electrostatic charges. This increases th
e electrostatic discharge (ESD) voltage potential. ESD can cause component
damage during servicing operations.
Low humidity levels are often the result of the facility heating system a nd occur during the cold season. Most heating systems provide air with a low humidity level, unless the system has a built-in humidier.
You shou ld
not see any condensation in or around the disk array under any conditions.
There is no procedure for recovery from moisture condensation.
Humidity r
ange type
Nonconden
sing relative humid it y (RH)
Operating humidity range at 22 d e grees C (71 degrees F)
20%to80%
Nonoperating humidity range
8% to 90%
Shipping and storage humidity range (produ
ct packed in factory packing)
5% to 95%
Operating maximum wet bulb temperature 26 degrees C
79 degrees F
Nonoperating maximum wet bulb temperature
27 degrees C 81 degrees F
Shipping and storage maximum wet bulb temperature
29 degrees C 84 degrees F
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Site requirements
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Mechanical vibration specications
Continuous vi
bration can cause a slow degradation of mechanical parts and, when severe, can cause data errors in disk drives. Mechanical connections such as printed circuit assembly (PCA) conductors, cable connectors, and processor backplane wiring can also be affected by vibrations. Vibration specications apply to all three axes. For vibration te
sting methods, see ASTM D999-91 Standard Methods for Vibration Testing
of Shipping
Containers.
Condition
Specication
Operating 0.25 mm, 5–10 Hz
0.05 G, 10–300 Hz
Nonoperating
2.5 mm, 5–10 Hz
0.5 G, 10–70 Hz
0.05 mm, 70–99 Hz
1.0 G, 99–300 Hz
Shipping and storage (product packed in factory packing)
0.5G,15minutes(atfourmostsevere resonances between 5–200 Hz)
Shock specications
The following tables lists shock specications. For horizontal shock testing methods, see ASTM D5277-92 Standard Test Methods for Performing Programmed Horizontal
Impacts Using an Inclined Impact Tester. For vertical shock testing methods, see ASTM D6055-96 Standard Test Methods for Mechanical H andling of Unitized Loads and Large Shipping Cases and Crates.
Condition
Specication
Operat
ing
None
Nonoperating
8G,15ms
Shipping and storage (product packed in factory packing)
Horizontal: Incline impact: 1.22 m/s Vertical: Rotational edge: 0.1 m
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Heat dissipation, power consumption, and air flow
The following table describes the heat dissipation and power consumption of the XP10000 when loaded with the maximum number of disk drives.
Parameter
Primary Rack Second Rack Full array
Power consumption (kVA)
4.
9
3.2 8.1
Heat dissipation (kW)
4.6
3.0 7.6
BTUs per hour
15710 10246 25955
Kcal per ho
ur
39
59 2582 6541
Thetablebelowshowstheairow requirements for the frames and disk chassis.
Product
No.
Description
Air ow
(cubic meters
per minute)
AE102A
HP X P1 0000 Disk Control Frame - DKC 15
AE104B
HP XP100
00 Disk Chassis
8
AE115B HP XP10000 Disk Array Frame 8
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Site requirements
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The following table presents the power requirements and heat dissipation of individual components.
Product
No.
Description
Heat output
(kW)
Power
consumption
(kVA)
AE102A
HP XP10000 Disk Control Frame - DKC 0.738 0.761
AE105B
HP XP10000 16Port FC SW CHIP 8-Port ACP 0.370 0.381
AE006A
HP XP12000 /1000
0 16-port 2-Gb FC
CHIP
0.287 0.296
AE007A
HP XP120 00/10000 32-Port 2-Gb FC CHIP
0.382
0.394
AE010A
HP XP120 00/10000 32-Port 4-Gb FC CHIP
0.382
0.394
AE013A
HP XP12000/10
000 8-Port FICON
SW CHIP
0.346
0.356
AE014A
HP XP12000/10000 8-Port FICON LW CHIP
0.346
0.356
AE015A
HP XP12000/10000 1 6-Port FICON SW CHIP
0.35 0.361
AE016A
HP XP12000/
10000 16-Port FICON
LW CHIP
0.35 0.361
AE017A
HP XP12000/10000 16-Port EXSA CHIP
0.313 0.323
AE018A
HP XP12000/10 000 8-Port 1-Gb NAS SW CHIP
0.446 0.46
AE025A
HP XP12000
/10000 4-GB Cache
Memory
0.014 0.014
AE030A
HP XP12000/10000 1-GB Shared Memory
0.011 0.012
AE110B HP XP10000 Battery 0.044 0.045
AE104B
HP XP10000 Disk Chassis
0.100 0.103
AE115B HP XP10000 Disk Array Frame 0.100 0.103
AE120A
HP XP10000 73GB 15k rpm Array Group
0.088 0.096
AE121
A
HP XP10
000 146GB 10k rpm Array
Group
0.092 0.1
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Product
No.
Description
Heat output
(kW)
Power
consumption
(kVA)
AE122A
HP XP10000 146GB 15k rpm Array Group
0.092 0.1
AE123B
HP XP10000 300GB 10k rpm Array Group
0.092 0.1
AE120AS
HP XP10000 73GB 1
5k rpm Spare
Disk
0.022
0.024
AE121AS
HP XP10000 146GB 10k rpm Spare Disk
0.023 0.025
AE122AS
HP XP10000 146GB 15k rpm Spare Disk
0.023 0.025
AE123BS
HP XP10000 300GB 10k rpm Spare Disk
0.023 0.025
Acoustics
The acoustic emission specication for the disk array is:
65 dB (A) so
und pressure, operator position (1 meter from the oor and surface
of the cabinet)
You can reduce the ambient noise level caused by equipment and air conditioning blowers i
n your computer room by:
Installing a dropped ceiling covered in commercial-grade, re-resistant,
acoustic-rated, berglass ceiling tile
Covering the walls in sound-deadening material
Instal
ling foam rubber removable partitions
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Site requirements
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Dust and pollut
ion control
Airborne contaminants and particles of a certain size and hardness can damage the disk array. Some of the most common contaminants are dust, smoke, ash, eraser debris, food crumbs, a
nd salty air.
Mechanical lters on the disk array protect it by trapping large dust particles. Smaller particles can pass through some lters, and can eventually cause problems in mechanical parts. Prevent sm all dust particles from entering the computer room by maintaining its air conditioning system at a high static air p ressure level.
Your HP representative can help you determine if you need to be concerned about airborne c
ontaminants.
Metallic particulate contamination
Metallic particulates can be especially harmful a round electronic equipment. This type of contamination may enter the data center environment from a variety of sources, including but not limited to raised oor tiles, worn air conditioning parts, heating ducts, rotor brushes in vacuum cleaners, or printer component wear. Because metallic particulates conduct electricity, they have an increased potential for creating short circuits in electronic equipment.
Over time, very ne whiskers of pure metal can form on electroplated zinc, cadmium, or tin surfaces. If these whiskers are disturbed, they m ay break off and become airborne, possibly causing failures or operational interruptions. For over 50 years, the electronics industry has been aware of the relatively rare but possible threat posed by metallic particulate contamination. During recent years, a growing concern has developed in computer rooms where these conductive contaminants are formed on the bottom of some raised oor tiles.
Although this problem is relatively rare, it may be an issue within your computer room. Since metallic contamination can cause permanent or intermittent failures on your electronic equipment, HP strongly recommends that your site be evaluated for m etallic particulate contamination before installation of electronic equipment.
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Data comm requirements
Route data comm cables away from areas of high static electrical elds created by power transformers and heavy foot trafc. Use shielded data comm cables that meet approved industry standards to reduce the effects of external elds.
For the XP disk
array, you need:
Item
Description
A dedicated analog phone line
Needed for the HP StorageWorks Continuous Track XP “phone home” feature, if you plan to use it. An HP representative will congure Continuous Track XP during installation. For more information on Continuous Track XP, see the HP StorageWorks XP10000 Disk Array Owner’s Guide.
A twisted pair (Cat 5) cableAn available LAN drop on your Intranet
Needed to connect the XP10000 to an available Ethernet port on your p ublic LAN. To ensure network security, consult with an HP representative and your network administrator before selecting the appropriate location of your LAN drop.
Apublicvoicephoneline near the disk array
Needed to allow your staff and HP representatives to communicateinsideandoutsideyoursite.
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Site requirements
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Electrical requirements
Line voltage
Linevoltage(AC)atthewallpoweroutletisafunctionofthelocalpowerutilityandyour building power distribution network. Voltages outside of the operating range of the disk array can cause intermittent system errors or a complete system shutdown. If required, an HP representative and your electrician can determine the current line voltage and make recommendations. See "
Chapter 3 Electrical specications" for specicACline
voltage requirements.
Avoid the use of a line voltage conditioner.
Make sure that a power distribution unit (if used) provides the c orrect voltage to support your entire system.
Branch circuit breakers
See "Chapter 3 Electrical specications" for specic branch circuit requirements for your pow
er situation.
Single-phase branch circuit breakers
The power cords supplied are specied for connection to a single-phase, 20-amp circuit.
Frequency
Usuall
y, AC line frequency is determined by your local power providers. In some cases, electrical power is supplied by generators. Shifts in AC line frequency can cause system errors. An HP representative can monitor the frequency of the input AC line power and make recommendations, if necessary. The disk array requires that the line frequency be withi
n 0.5 Hz of the rated line frequency (50 Hz or 60 Hz). See "
Chapter 3 Electrical
specications" for more information.
Safety and dedicated ground
The primary reason for grounding electrical systems is safety. The safety ground is required by the National Electric Code (USA) and most other local, regional, and national codes. In addition to safety ground, HP requires that a dedicated (earth reference) ground be installed as a common reference point for all system components. Consult with an HP representative and your electrician to ensure that your electrical system meets all lo cal and national safety codes.
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Grounding requirements
Your site’s electrical subsystem must meet all of the following co nditions:
Grounding as presc
ribed by your local country codes.
An insulated grounding conductor that is identical in size and insulation material
and thickness to the ungrounded branch-circuit supply conductors. It should be green, with or without yellow stripes, and is to be installed as a part of the branch circuit t
hat supplies the unit or system. This means the ground conductor must be run in the same conduit, armored cable, or other cable bundle as the phase wires.
The grounding c
onductor should be grounded to earth at the service equipment
or other accep
table building earth ground such as the building frames (in case of a high-rise
steel-frame structure).
IT-congured grounding systems are not certied for use with the disk array as
these grounding systems may not h ave solidly conductor-connected grounded power systems and/or they may have resistive imp e dance inserted in ground and/or neutral lines. The disk array requires a solidly conductor-connected ground and
may require a separate neutral in the case of WYE or STAR
connectio
ns. For HP disk arrays, TN grounding systems are preferred.
AC connections
The disk array primary rack has four sepa rate connections to 200 VAC, single-phase, 20-amp power.
The second rack has two connections to AC power in the minimum conguration (four recommended) and four connections to AC power in the maximum conguration. Power requirements are 200 VAC, single-phase, 20-Amps.
When receptacles are used to connect disk array components to AC power, they must include a dedicated ground connection that is insulated from the receptacle. It is important that the receptacle box be g rounded with an additional ground connection that is separate from the dedicated ground. The additional ground can be hard conduit.
Specic AC power cords and plugs are available to suit the power requirements and receptacles in your location. You can specify the cords and plugs you need when you order the HP XP10000 disk array. You are responsible for having the correct plugs and receptacles installed by an electrician in compliance with local electrical requirements and practices.
50 Site requirements
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CAUTION:
When installing the receptacles, the electrician must ensure that each receptacle has its own neutral (if required) and ground. Using the same neutral/ground for more than one circuit causes voltage loss and heat problems and can create a re hazard. A shared neutral conductor that fails open-circuit can cause overvoltage damage to equipment.
See "Chapter 3 Ele ctrical specications" for specic power requirements as well as plug and receptacle pa rt numbers and ordering information.
Power line transients
Heavy electrical loads from nearby machinery or e quipment (for example, elevators or electric welders) can cause intermittent system problems with sophisticated electronic equipment, even if that equipment is on a separate circuit breaker. When faced with these conditions, provide a separate, completely independent power panel with an isolated ground an d circuit breaker coming directly from the main building power source or secondary power source.
If necessary, an HP representative can measure your power line noise level and ma ke appropriate recommendations concerning the use of line treatment devices.
Protection against sources of electrical interference
Protect the disk array from sources of electrical interference:
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Potential source
Description
Wall outlets
Convenience power outlets for building maintenance equipment (such as vacuum cleaners and oor buffers) must be wired from circuit breakers on a power panel separate from the computer system panel. The ground wires from these outlets must be connected to the normal building distribution panel and not to the system ground.If a separate power source and separate ground are not provided, operation of janitorial equipment can induce electrical noise and cause abnormal operation of the computer system. Your electrician can verify whether maintenance outlets are on separate panels.
Lightning In geographical areas subject to lightning storms, it may by advisable
to install l
ightning protection for both personnel and computer systems. The principles of lightning protection and personnel safety areoutlinedindetailinthelightningprotectioncodecontainedinthe National Fire Protection Association (NFPA) Handbook.
Electromagnetic interference
The disk array is specically d esigned to reduce its susceptibility to radiated and conducted interference. Electromagnetic interference can cause a variety of system problems. An HP representative can advise you about the most common causes of electromagnetic interference.
Uninterruptible power supply (UPS)
Most disk array units are installed in data centers where a UPS strategy is already in place. However, if you are making your rst large disk array purchase, you may need a separate UPS solution.
CAUTION:
If you are planning or already have a site-wide UPS, HP recommends against using a product UPS powered by a site-wide UPS for the XP10000.
Make sure your UPS satises the power requirements listed u n der Heat dissipation
and power consumption in this chapter and also under AC line voltage requirements
in Chapter 3.
52 Site requirements
Page 53
3Electricalspecifications
The detailed electrical specications in this chapter are provided to help your site electrician perform any necessary electrical work related to site prep.
AC line voltage r
equirements
The AC power requ
irements are essentially the same for both the primary and the second racks. Each rack operates on 200 VAC nominal, 20 amps, 50 or 60 Hz, single-phase power. An independent branch circuit and circuit breaker is required for each AC input power cord.
The following
table lists specic power requirements.
Parameter
200
VAC
208
VAC
220
VAC
230
VAC
240
VAC
Minimum operating voltage (VAC)
184
191 202 212 221
Maximum operating voltage (VAC)
212 220 233
244 254
Rated line current per power cord
16A 16A 16A 16A 16A
Number of power cords
44444
Recommended circuit breakers
20A 20A 20A 20A 20A
Number of c
ircuit breakers
44444
Important notes:
208 VAC is
60 Hz only. Rated line current per power cord is the maximum allowable current under worst case conditions. This value applies to each individual power cord and is specied in RMS amperes. For the second rack, four power cords and circuit breaker
s are strongly recommended even though a minimum conguration containing
only one
expansion disk chassis requires only 2 power cords and 2 circuit breakers. If a second expansion disk chassis is added to the second rack, four power cords and four circuit breakers are required.
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AC inputs
The disk array
primary rack has four separate connections to 200 VAC, single-phase,
20-amp power
. The AC power inputs to the primary rack are distributed to four power distribution units (PDUs) as shown in the following gure. This provides fault tolerant operation of the disk array. Each pair of AC inputs (00/10 and 01/11) must be capable of supporting the entire current demand for the cabinet. Each PDU is tted with an IEC320-C20 inlet that ts the supplied input power cord, and four IEC320-C13 outlets th
at connect to the hardware inside the rack by means of supplied cables.
CAUTION:
The four PDU outputs shown in the gures a re for internal power connections to the disk array only. Do not connect any other equipment to these outlets. Usin g the outlets for any equipment other than the disk array may compromise disk array reliability or availability .
Thesecondrackshowninthefollowinggure has four connections to AC power. Power requirements are 200 VAC, single-phase, 20-Amps.
54
Electrical specications
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HP offers the following AC power cables and connectors, which you can order individually (four each are required per primary or second rack):
E7805A HP 4.5 m power cord w/NEMA L6-30P plug
E7806A HP
4.5 m power cord with stripped ends
E7808A HP 2 40 V power cord w/ IEC 309 plug, 4.5 m
E7809A HP 240 V power cord w/ CEE7/7, 4.5 m
E7810A H
P power cord for China
E7811A HP power cord for Israel
E7804A HP power cord, 4.5 m, C19/C20 Plug (jumper for UPS)
E7798A
cord w/IEC 320-C20 connector and 2.5 m jumper for UPS
You can supply your own power cables as long as they meet a 20 amp rating, tthe IEC320-C20 PDU inlets, and me et lo cal codes.
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NorthAmericanACpowercabling
The XP10000 racks each require 20-amp, single-phase 200 VAC power supplied by four power cords with p lugs, four receptacles, and four main disconnect devices (circuit breakers). If the second rack contains only one disk chassis, only two power cords and breakers ar
e required, but four are required if you plan to add another disk chassis.
The XP10000 comes from the HP factory with the AC power cords and plugs you have ordered. Plug types rated for 30 Amps are specied under the heading, AC inputs earlier in this chapter. The opposite end of the power cord connects to the XP10000 power distribution unit input, which is a type IEC320 C20 connector.
Connect ea
ch AC power cable to a separate receptacle on a separate circuit breaker, and connect each pair of power cords (the left pair and the right pair) to separate distribution panels to ensure power fault tolerance.
CAUTION:
Do not apply power until instructed to do so by HP. An HP representative should be present
whenever the disk array is being connected to a new power source.
Branch circuit requirements
To protect the disk array, your building must be wired correctly. Each supply ( “hot”) conductor must be protected by a short-circuit protective device and by an overcurrent protective device. The table listed under AC line voltage requirements provides specications for the overcurrent protective devices required for single-phase operation.
All protective devices must comply with national standards of the country where the units are to be installed. If a protective device interrupts any supply conductor, it must also interrupt all other supply conductors.
56
Electrical specications
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European AC power cabling
The XP10000 racks each require 20-amp, single-phase 200 VAC power supplied by four power cords with plugs, four receptacles, and four main disconnect devices (circuit breakers). If the second rack contains only one disk chassis, only two power cords and breaker
s are required, but four are recommended if you plan to add another disk
chassis later.
The XP10000 comes from the H P factory with the AC power cables and plugs or stripped ends you have ordered. Plug types are specied under the heading, AC inputs. The opposite end of the power cord connects to the XP10000 power distribution unit (PDU) inp
ut, which is a type IEC 320-C20 connector.
European branch circuit requirements
To protect the disk array, your building must be wired correctly. Each supply (“hot”) conductor must be protected by a short-circuit protective device and by an overcurrent protective device. The table listed under AC line voltage requirements provides specications for the overcurrent protective devices required for single-phase operation. All protective devices must comply with national standards of the country where the units are to be installed. If a protective device interrupts any supply conductor, it must also interrupt all other supply conductors.
Overcurrent protection is also required for the neutral conductor.
Your electrician should know the appropriate code requirements for your location/site and wire power distribution to the XP10000 accordingly.
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Connecting the
European power-supply cables
Connect each AC power cable to a separate receptacle on a separate circuit breaker, and connect each pair of power cords (the left pair and the right pair) to separate distribution panels to ensure power fault tolerance. Sing l e-phase power cable wiring is showninthegure below.
CAUTION:
Do not apply
power until instructed to do so by HP. An HP representative should be
present whenever the disk array is being connected to a new power source.
CAUTION:
Be sure to connect the power cords to the distribution panel as shown in the gure. Improper wiring of the neutral conductor may cause damage to the disk array. To reduce the risk of a wrong connection, use a plug and socket that are approved for this disk array. It is your electrician’s responsibility to select and install the proper plugs and receptacles.
WARNING!
High leakage current can occur between the power supply and the unit. To avoid electrical shock, be sure to make the protecti ve earth connection before the supply connections.
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Electrical specications
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4 Delivery and un packin g
The disk array equipment is shipped directly from HP. If the disk array is part of a system order, HP coordinates shipment from all HP locations so that all of the equipment arrives at your site at approximately the same time.
When your equipment ships, HP p rovides you with carrier information and an expected delivery date. Factors beyond HP’s control can cause delivery delays. If you have not received your equipm ent within two weeks of its shipment from HP, contact your HP SR, who will trace your order and expedite delivery.
CAUTION:
Before delivery, make sure your site meets the requirements explained under the heading, “Delivery space requirements”.
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Checking for shipping shortage and damage
Upon delivery of each equipment shipment:
1. Check the carrier’s bill of lading to ensure that the items listed match the item s
delivered. Notify the carrier immediately if there are any discrepancies or missing items.
2. Inspect all shipping containers for signs of damage, such as dents, scratches, cuts,
or water ma rks.
3. If you see an
y damage to the containers:
a. Note on the bill of lading that there is apparent damage, subject to inspection.
b. Arrange for the carrier’s representative and an HP representative to be present
when the item in question is unpacked.
c. Contact y
our HP representative, who will make sure any damaged components
are repl
aced, regardless of the circumstances and without waiting for any
claim settlements.
Unpacking the equipment
HP representatives will supervise the unpacking and moving of the disk array equipment. It is your responsibility to provide the people, tools, and equipment necessary to perform these tasks.
Requi
red personnel
HP re
commends that three physically able personnel be available to assist with off-loading the disk array equipment from the pallet. Personnel must be knowledgeable and experienced with the safe handling of large, heavy, and sensitive computer equipment.
Required tools
Claw hammer (if full packaging with wooden crate)
Ratchet wrench or box-open end wrench sizes 11mm (7/16") and 19mm (3/4"),
or adjustable end wrench
6mm hex wrench
Scissors or box knife to cut polyester banding
Safety glasses
Short stepladder (helpful, but not required)
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Packaging congurations
XP disk array cabinets are shipped in one of three standard packaging congurations:
Environmental pack — consists of stretch wrap over corner protectors. No
special tools
or procedures are required to unpack shipments in this form. This packaging is used for most shipments within the USA and Canada that are direct from the factory to the customer. HP uses special carriers with a de dicated eet of trucks and specially trained personnel.
Full packag
ing — consists of a pallet, wooden loading ramp, inner packaging,
and outer corrugated carton assembly.
Full packaging with wooden crate — consists of full packaging encased in a
wooden cra
te.
Unpacking process
If you need to unpack the equipment without HP supervision, follow the instructions in this section.
1. Following the steps “Removing packaging materials”, unpack the equipment cartons
outside of the computer room to avoid debris and possible contamination of the computer room environment.
2. For software CDs, cables, and other installation hardware, leave the sealed cartons
or packages intact. HP representatives will unpack them when they install and congure the disk array.
3. As you unpack the cartons, match the delivered items to the packing list (invoice) for
each carton. Contact your HP SR imm e diately if any items are missing or are not the ones you ordered.
4. Move all equipment to the computer room before the installation date.
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Safety precautions
CAUTION:
Be very careful when handling the equipment. Do not drop the equipment from a height of more than 0.5 cm (0.2 in). Floor unevenness must be less than 1 cm (0.4 i n).
WARNING!
The equipme nt frames are very heavy. To avoid injury, use appropriate lifting tools and have three people unpack and move the equipment.
CAUTION:
Anymovementoftheequipmentbyforkliftshouldbedonepriortounpacking. The cartonassemblyprovidesthemostsecuresupportoftheequipmentduringmovement. Transporting the equipment by forklift after the packaging carton has been removed is not advisable.
CAUTION:
Equipment racks are top heavy
and contain very sensitive electronic and mechanical components. Whenmovingonframecasters,therollingsurfacemustbeableto support the equipment weight and must be free of surface conditions that could cause shock or vibration to the cabinet contents. Avoid pushing the racks from behind because they may tip over. Instead, pull the racks from the front to roll them. Be careful when pulling the rack that it doesn’t tip toward you or fall on you, causing injury.
WARNING!
When using sharp objects or cutting tools, make sure that no part of your body lies in the path of the blade bit or point.
CAUTION:
When disk array equipment is not located in a data center or computer room, it mustbestoredinacontrolledareathatmeetsenvironmentalrequirements(see “Environmental requirements”).
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Removing packa
ging materials
The primary rac
k is labeled DKC AE102A. If you ordered a two-rack system, unpack the primary rack rst because it c onta ins the wooden ramp you will use to unload both equipment racks.
1. If shipped in a
wooden crate:
a. Using an 11mm (7/16") ratchet or wrench, remove the six lag screws at the
base of the crate.
b. Using the claw end of a claw hammer , remove the crate clamps.
WARNING!
Crate clamps are under tension. Wear safety glasses and hold onto the clamp with your free hand during removal.
c. Remove the crate panels.
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2. Cut and remove the polyester bands.
3. Remove the nails attaching the carton to the pallet.
4. Remove the plastic carton fasteners (p-fasteners).
5. Remove the carton.
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6. Remove the accessory boxes, ramp, and corner pads.
7. Using a 6mm hex and 19mm wrench, remove the adapter plates that anchor the
cabinet to the pallet.
8. Remove the poly bag covering the cabinet.
9. Following the instructions provided on the wooden ramp, attach t he ramp to the
pallet and roll the cabinet onto the oor.
10. Visually check the unit for any damage.
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Glossary
ACP Array control processor. On some XP models, such as the
XP12000, the ACP handles the passing of data between the cacheandthephysicaldrives. OnotherXPmodels,suchas the XP10000, this function is handled by the disk adapter on the MIX board.
AL Arbitrated loop.
AL-PA Arbitrated loop physical address.
allocation The ratio of allocated storage capacity versus total capacity as
a percentage. “Allocated storage” refers to those LDEVs that have paths assigned to them. The allocated storage capacity is the sum of the storage of these LDEVs. Total capacity refers to the sum of the capacity of all LDEVs on the disk array.
array group A group of 4 or 8 physical hard disk drives (HDDs) installed in
an XP disk array and assigned a common RAID level. RAID1 array groups consist of 4 (2D+2D) or 8 HDDs (4D+4D). RAID5 array groups include a parity disk but also consist of 4 (3D+1P) or 8 HDDs (7D+1P). All R AID6 array groups are made up of 8 HDDs (6D+2P).
ASE Application System Engineer.
BC TheHPStorageWorksBusinessCopyXPsoftwareprogram,
which enables you to maintain up to nine internal copies of logical volumes on the disk array.
C-Track The HP StorageWorks Continuous Track XP software program,
which detects internal hardware component problems on a disk array and automatically reports them to the HP STC.
CA TheHPStorageWorksContinuousAccessXPprogram,which
enables you to replicate data stored on a local disk array to a remote disk array.
cache Very high speed m emory that is used to speed I/O transaction
time. All reads and writes to the XP array family are sent to the cache. The data is buffered there until the transfer to/from physical disks (with slower data throughput) is complete.
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The benet of cache memory is that it speeds I/O throughput to the application. The larger the cache size, the greater the amount of data buffering that c an occur and the greater throughput to the applications. XP arrays support a range of cache m emory. In the event of power loss, battery power holds up the contents of cache for up to 36 hours.
CE Customer engineer.
channel adapter (CHA)
The channel adapter (CHA) provides the interface between the disk array and the external host system. Occasionally this term is used synonymously with the term channel host interface processor (CHIP).
channel host in­terface processor (CHIP)
Synonymous with the term channel adapter (CH A) .
channel processor (CHP)
The processors located on the channel adapter (CHA). Synonymous with CHIP .
command device A volume on the disk array that accepts Continuous Access
or Business Copy control operations which are then executed by the disk array .
control unit To organize the storage space attached to the D KC, you can
group similarly congured logical devices (LDEVs) with unique control unit images (CUs). CUs are numbered sequentially. The disk array supports a certain number of CUs, depending on the disk array model. Each CU can m
anage multiple LDEVs.
Therefore, to uniquely identif
y a particular LDEV requires both
the CU number and the LDEV number.
CU Control unit.
CVS Custom volume size. CVS devices (OPEN-x CVS) are custom
volumes congured using array management software to be smaller than normal xed-size OPEN system volumes. Synonymous with volume size customization (VSC).
disk adapter (DKA)
Synonymous with the term ACP.
disk unit (DKU) The array hardware that houses the disk array physical disks.
disk controller (DKC)
The array hardware that houses the channel adapters and service processor (SVP).
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disk recovery and restore unit (DRR)
The unit responsible for data recovery and restoration in the event of a cache failure.
disk group The physical disk locations associated with a parity group.
disk type The manufacturing label burned into the physical disk controller
rmware. In most cases, the disk type is identical to the disk model number.
emulation modes The logical devices (LDEVs) associated with each
RAID group are assigned an emulation mode that makes them operate like OPEN system disk drives. The emu lation mode determines the size of an LDEV.
OPEN-3: 2.46 GB OPEN-8: 7.38 GB OPEN-9: 7.42 GB OPEN-E: 13.56 GB OPEN-K: Not available on this array OPEN-L: 36 GB OPEN-M: Not available on this array OPEN-V: User-defined custom size
EPO Emergency power off.
ESCON Enterprise System Connection (the IBM trademark for optical
channels).
expanded LUN A LUN is normally associated with only a single LDEV. The
LUSE feature allows a LUN to b e associated with 1 to 36 LDEVs. Essentially,
LUSE makes it possible for applications to access a single large pool of storage. The LUSE feature is available when the HP StorageWorks LUN Conguration Manager product is installed.
ExSA Extended serial adapter.
failover Disconnecting a failed unit or path and replacing it with an
alternative unit or path in order to continue functioning.
FC Fibre Channel.
FC-AL Fibre Channel arbitrated loop.
FCP Fibre Channel Protocol.
fence level A level for selecting rejection of a write I/O request from the
host according to the condition of mirroring consistency.
FICON IBM mainframe Fiber Optic Connection.
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GB Gigabytes.
GLM Gigabyte link module.
HA High availability.
HBA Host bus adapter. A built-in function or a card installed in a
PC or other host compute
r to enable connection of the host to
the SAN.
host mode Each port can be conguredforaparticularhosttype. These
modes are represented as two-digit hexadecimal numbers. For example, host mode 08 represents an HP-UX host.
hot standby Using two or more ser vers as a standby in case of a primary
server failure.
HP Hewlett-Packard Development Company.
I/O Input/output (applies to an operation or device).
LAN Local area network.
LD, LDEV Logical device. An LDEV is created when a RAID group is
carved into pieces according t
otheselectedhostemulation
mode (that is, OPEN-3, OPEN-
8, OPEN-9). The number of resulting LDEVs depends on the selected emulation mode. The term LDEV is often used synonymously with the term volume.
LED Light emitting diode.
local disk A disk in the host.
LU Logical unit.
LUN Logical unit number. A LUN results from mapping a SCSI
logical unit number, port ID, and LDEV ID to a RA I D group. The size of the LUN is determined by the emulation mode of the LDEV, and the number of LDEVs associated with the LUN. For example, a LUN associated with two OPEN-3 LDEVs has a size of 4,693 MB.
LUSE Logical unit size expansion. See also Expanded LUN.
m Meters.
MB Megabytes.
MCU Main control unit.
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MIX A circuit board in the disk control unit that includes disk
adapters and channel adapters for interfacing disk drives and the host to cache memory.
mirroring consis­tency
The consistency (usability) of data in a volume (for example, S-VOL).
mm Millimeters.
MR Magnetoresistive.
ms, msec Milliseconds.
mutual hot standby system
Two servers that are poised to cover for each other if nec essary.
NAS Network attached storage.
node Logically speaking, an environment where instances can b e
executed. Physically,aprocessor,whichisanelementofa cluster system.
NVS Nonvolatile storage.
OFC Open Fibre Control.
OLM Optical link module.
OS Operating system.
PA Physical address.
parity group A parity group is a disk conguration in which multiple disks
work together to provide redundancy. Synonymous with “array group.”
partition Dividing a specicphysicaldiskintotwoormoreareasasif
there are two or more physical disks.
path Paths are created by associating a port, a target, and a LUN
ID with one or more LDEVs.
PCI Power control interface or peripheral component interconnect.
port A physical connection that allows data to pass between a
host and the disk array. The number of ports on an XP disk array depends on the number of suppor ted I/O slots and the number of ports available per I/O adapter. The XP family of disk arrays supports Fibre Channel (FC) ports as well as other port types. Ports are named by port group and port letter, such as CL1-A. CL1 is the group, and A is the port letter.
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P-P Point-to-point.
primary rack The XP10000 rack that contains the basic disk array
components, including the controller and one disk chassis. The primary rack can contain a second optional disk chassis.
PS Power supply.
RS Russellstoll®, a brand of electrical plugs and receptacles
manufactured by Thomas & Betts Corporation.
RAID Redundant array of independent disks.
RAID group See “array group.”
RAID level A RAID Level is one of the ways that disk drives are grouped
together to improve performance, data availability/reliability or both. RAID levels are dened from RAID0 to RAID6. HP StorageWorks Disk Arrays in the XP product family support RAID1, RAID5 and RAID6. Not all of these RAID levels are supported by all XP family members. Consult the owner’s guide or your HP representative for the details of which RAI D levels are supported by your specicXPdiskarray.
RAM Random access memory.
RM HP StorageWorks RAID Manager XP, a command line interface
for managing XP arrays.
R-SIM Remote service information message.
R/W, r/w Read/write.
script le A le containing a shell script.
SCSI Small computer system interface.
second rack The optional second XP10000 disk array rack that contains up
to two additional optional d isk chassis (up to 120 drives).
shell script A command sequence executed by a UNIX shell.
sidele An area of cache used to store the data sequence number,
record location, record length, and queued control information.
SIM Service i nformation message.
SMI-S Storage Management Initiative Specication.
SMS System managed storage.
SNMP Simple Net work Management Protocol.
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SSID Storage subsystem identication.
STC HP Storage Technology Center.
SVP Service processor, which is the PC built into the disk controller.
The SVP provides a direct interface into the disk array. SVP use is reserved for HP support representatives only.
TB Terabyte.
TCP/IP Transmission control protocol/Internet protocol
TID Target ID.
VSC Volume size customization. Synonymous with CVS.
VOLID Volume ID.
volume Synonymous with LDEV.
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Index
A
AC
plugs,55
power,54 acoustics,46 additional components,21 air conditioning,40
and metallic particulate
contamination,47
dust control,47 air pressure,26,40,47 airborne contaminants,47 altitude,40 antistatic
carpeting,31
containers,27
oor wax,27
ooring,27
furniture,27 audience,6
B
basic conguration,18 branch circuit requirements,56,57 breakers,49,53 building codes,26,28,49
C
cables,29,55
as safety hazards,28
Cat 5,48
oor cutouts for,32
in oor plans,29
mechanical vibration,43
power,53
raised oors,30
routing,48
sealing,26
shielded,48
unpacking,61 circuit breakers,49,53 clearances,32 components, additional,21 computer room
air pressure,26
data comm requirements,48
electrical requirements,49
environmental requirements,40
general requirements,26
vapor barrier,26
windows,26 conductive
ooring,27
furniture,27
wax,27 conventions, document, cords,55
power,53 current,53 customer, site prep responsibilities of,
12
D
damage, shipping,60 data comm requirements,48
See also cables,48 delivery
equipment,59
space requirements,25 dimensions,20 disk array
acoustic specications,46
basic conguration,18
delivery of,59
dimensions,20
electrical specications,53
heat dissipation,44
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humidity specications,42 power connections,50,54 power consu mption,44 primary rack,18 second rack,18 unpacking,60
vibration specications,43 disk chassis,18 disk controller,18 document,6 document conventions, documentation, HP web site,6 dust control,47
E
earth ground,49,58 electrical requirements,49 electromagnetic interference,52 environmental requirements,40 equipment servicing hazards,28 ESD,27,42
F
re safety,28oor
clearances,32
conductive,27
covering,31
cutouts,29,32
earth grounding,27
grid panels,30
grounding,27,30
tiles, and metallic particulate
contamination,47
waxed,27 oor plan,29 frequency,49 furniture, conductive,27
G
grid panels, oor,30 grounding,49,50,58
H
hazards, servicing,28 heat dissipation,44 help
obtaining,8 help, obtaining, 12, 13 HP
storage web site,9
Subscriber’s choice web site,8
technical support,8 HP representatives
airborne contaminants,47
and electrical requirements,49
building construction,29
Continuous Track XP,48
electrical requirements,49
electromagnetic interference,52
equipment delivery,16,60
equipment unpacking,60
network security,48
power connections,56,58
power line transients,51
site prep checklist,14
site prep team, 11, 12
site safety,28 HP SR, 12, 13, 59, 61 humidity,40,42
and ESD,27
L
LAN connection,48 lightning,52 line current,53 line voltage,49
M
mechanical vibration specications,43 metallic particulate contamination,47 moisture,26
N
noise level,46
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O
operating voltages,53
P
particulate contamination, metallic,47 phone home,48 phone line,48 physical specications,18 plugs
AC,55 pollution control,47 power
AC connections,54
cables,55
consumption,44
cords,53,55
UPS,52 power cords
oor cutouts for,32 power line transients,51 primary rack,18
R
rack stability
warning,8 racks,19
described,18 raised oor,29,30
See also oor,30 receptacles,50 related documentation,6 representatives, of HP. See HP representatives,12
S
safety,28,28 sales representative. See HP SR,61 second rack,18 service clearance,29 servicing hazards,28 shipping damage,60 single phase cabli ng
Europe,57
North America,56
site prep
checklist,14 customer responsibilities,12 objectives,11 resources,11 tasks,13 team,12
time allowances,16 sound pressure,46 space
delivery,25
planning,29 specications,18
acoustic,46
heat,44
humidity,42
power,44
vibration,43 SR. See HP SR,61 static
discharge mats,31
preventing,27 Subscriber’s choice, H P ,8 symbols in text,7
T
technical support
HP,8 text symbols,7 transients, power,51
U
uninterruptible power supply (UPS),52 unpacking equipment,60 UPS,52
V
vapor barrier,26 vibration specications,43 voltages,53
W
warning
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rack stability,8 wax, conductive,27 waxed oors,27 web sites,6
HP documentation,9
HP storage,9
HP Subscriber’s choice,8
weights, 20, 21
calculating,23 wet bulb temperature,42 windows, in the computer room,26
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