HP EliteBook 850 User manual

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QuickSpecs

HP EliteBook 850 G8 Notebook PC

Overview

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HP EliteBook 850 G8 Notebook PC

Left

Ambient Lights Sensor (Optional)

Glass Clickpad

Internal Microphones (2)

Smartcard Reader (Optional)

Webcam LED (Optional)

Audio Combo Jack

Camera Shutter

10.

SuperSpeed USB Type-A 5Gbps signaling rate

HD and IR Camera (Optional)

Nano Security Lock Slot (Lock sold separately)

IR Camera LEDs (Optional)

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HP EliteBook 850 G8 Notebook PC

Overview

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Right

Power Connector

Thunderbolt™ 4 with USB4 Type-C® 40Gbps signaling rate (USB Power Delivery, DisplayPort™ 1.4)

USB 3.1 Gen 1 Port

SIM Card Slot (Optional)

HDMI Port 2.0b (Cable not included)

Touch Fingerprint Sensor (Select models)

Thunderbolt™ 4 with USB4 Type-C® 40Gbps signaling rate (USB Power Delivery, DisplayPort™ 1.4)

1. SuperSpeed USB 20Gbps is not available with Thunderbolt™ 4.

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HP EliteBook 850 G8 Notebook PC

Overview

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AT A GLANCE

• Premium ultraslim design with precision-crafted machined aluminum (CNC) chassis for a premium look and feel

• 11th Generation Intel® Core™ i5, i7 Processors up to four-core

• Preinstalled with Windows 10 versions or FreeDOS

• Designed to support all HP docking options including the HP Universal Dock G5

• Featuring redesigned quiet HP Keyboard with the HP Programmable key and backlit options

• Innovative world-facing third mic improves inbound ambient noise cancellation while 360 degree mic pick-up allows

everyone to clearly hear and be heard

• Optional ultrabright displays with ambient light sensor

• Choice of displays:

39.6 cm (15.6") diagonal FHD IPS Anti-Glare LED-backlit, 250 nits, 45% NTSC

39.6 cm (15.6") diagonal FHD IPS Anti-Glare LED-backlit non-touch 400 nits, 72% NTSC

39.6cm (15.6") diagonal UHD IPS Anti-Glare LED-backlit non-touch, 400 nits, 72% NTSC

39.6cm (15.6") diagonal FHD IPS Anti-Glare On-Cell LED-backlit touch, 250 nits, 45% NTSC

39.6cm (15.6") diagonal FHD IPS Anti-Glare LED-backlit non-touch, 1000 nits, 100% sRGB with HP Sure View Reflect

• Enterprise grade security with HP Sure Sense, HP Sure Start Gen6, HP Privacy Camera, HP Sure View Reflect, HP Sure Run

Gen4, HP Sure Recover Gen4 with Embedded Reimaging, HP Sure Click, SmartCard Reader and Touch Fingerprint reader

• Connectivity with optional CAT20 5G/ WWAN, and Thunderbolt™ Docking (Dock sold separately)

• Supports fast charging (50% in 30 minutes) with no impact on battery recharge cycles

• Choice of solid state drives up to 2 TB and DDR4 memory up to 64 GB

• Undergoes MIL-STD 810H tests

• Choose from MX 450 N18S-G5 or Intel® Iris® Xᵉ Graphics

1. MIL-STD 810H is not intended to demonstrate fitness of U.S. Department of Defense contract requirements or for military use. Test results are not a guarantee of future performance under these test conditions. Accidental damage requires an optional HP Accidental Damage Protection Care Pack.

NOTE: See important legal disclosures for all listed specs in their respective features sections.

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Technical Specifications

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PRODUCT NAME

HP EliteBook 850 G8 Notebook PC

OPERATING SYSTEM

Preinstalled

Windows 10 Pro 64 – HP recommends Windows 10 Pro for business

Windows 10 Pro 64 (National Academic License)

1,2

Windows 10 Home 64

Windows 10 Home Single Language 64

Windows 10 Pro (Windows 10 Enterprise available with a Volume Licensing Agreement)

Windows 10 Enterprise 64 (Web Support) 1 FreeDOS

1. Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows 10 is automatically updated, which is always enabled. ISP fees may apply and additional requirements may apply over time for updates. See http://www.windows.com/.

2. Some devices for academic use will automatically be updated to Windows 10 Pro Education with the Windows 10 Anniversary Update. Features vary; see https://aka.ms/ProEducation for Windows 10 Pro Education feature information.

PROCESSORS

Intel® Core™ i7-1165G7 (Up to 4.7 GHz with Intel® Turbo Boost Technology, 12 MB L3 cache, 4 cores)

3,4,5,6

Intel® Core™ i7-1185G7 (Up to 4.8 GHz with Intel® Turbo Boost Technology, 12 MB L3 cache, 4 cores), supports Intel® vPro® Technology

3,4,5,6

Intel® Core™ i5-1135G7 (Up to 4.2 GHz with Intel® Turbo Boost Technology, 8 MB L3 cache, 4 cores)

3,4,5,6

Intel® Core™ i5-1145G7 (Up to 4.4 GHz with Intel® Turbo Boost Technology, 8 MB L3 cache, 4 cores), supports Intel® vPro® Technology

3,4,5,6

Processor Family 11th Generation Intel® Core™ i7 processor (i7-1165G7)

11th Generation Intel® Core™ i7 processor (i7-1185G7)6 11th Generation Intel® Core™ i5 processor (i5-1135G7)

11th Generation Intel® Core™ i5 processor (i5-1145G7)6

3. Multicore is designed to improve performance of certain software products. Not all customers or software applications will necessarily benefit from use of this technology. Performance and clock frequency will vary depending on application workload and your hardware and software configurations. Intel’s numbering, branding and/or naming is not a measurement of higher performance.

4. Processor speed denotes maximum performance mode; processors will run at lower speeds in battery optimization mode.

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Technical Specifications

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5. Intel® Turbo Boost performance varies depending on hardware, software and overall system configuration. See

http://www.intel.com/technology/turboboost for more information.

6. In accordance with Microsoft’s support policy, HP does not support the Windows 8 or Windows 7 operating system on products configured with Intel and AMD 7th generation and forward processors or provide any Windows 8 or Windows 7 drivers on http://www.support.hp.com.

GRAPHICS

Integrated

Intel® Iris® Xᵉ Graphics

Discrete

NVIDIA® GeForce® MX450 (2 GB GDDR6 video memory)55

Supports

HD decode, DX12, HDMI 2.0b, HDCP 2.38

7. Intel® Iris® Xe Graphics capabilities require system to be configured with Intel® Core™ i5 or i7 processors and dual channel memory. Intel® Iris® Xe Graphics with Intel® Core™ i5 or 7 processors and single channel memory will only function as UHD graphics.

8. HDMI cable sold separately.

55. Integrated graphics depends on processor. NVIDIA® Optimus™ technology requires an Intel processor, plus an NVIDIA® GeForce® discrete graphics configuration and is available on Windows 10 Pro OS. With NVIDIA® Optimus™ technology, full

enablement of all discrete graphics video and display features may not be supported on all systems (e.g. OpenGL applications will run on the integrated GPU or the APU as the case may be).

DISPLAY

Non-Touch

39.6 cm (15.6") diagonal FHD Bent, anti-glare UWVA eDP, 250 nits, 45% NTSC (1920x1080)

9,10

39.6 cm (15.6") diagonal FHD Bent, anti-glare UWVA eDP, 250 nits, 45% NTSC for HD camera (1920x1080)

9,10

39.6 cm (15.6") diagonal FHD Bent, anti-glare UWVA eDP, 250 nits, 45% NTSC for HD + IR camera (1920x1080)

9,10

39.6 cm (15.6") diagonal FHD Bent, anti-glare UWVA eDP, 250 nits, 45% NTSC for WWAN (1920x1080)

9,10

39.6 cm (15.6") diagonal FHD Bent, anti-glare UWVA eDP, 250 nits, 45% NTSC for HD camera for WWAN (1920x1080)

9,10

39.6 cm (15.6") diagonal FHD Bent, anti-glare UWVA eDP, 250 nits, 45% NTSC for HD + IR camera for WWAN (1920x1080)

9,10

39.6 cm (15.6") diagonal FHD Bent, anti-glare UWVA eDP+PSR, 400 nits, 100% SRGB, Low Power Ambient Light Sensor for HD+IR Camera (1920x1080)

9,10

39.6 cm (15.6") diagonal FHD Bent, anti-glare UWVA eDP+PSR, 400 nits, 100% SRGB, Low Power Ambient Light Sensor for HD+IR Camera for WWAN (1920x1080)

9,10

39.6 cm (15.6") diagonal UHD Bent, anti-glare UWVA eDP+PSR 400 nits, 100% SRGB, Low Power Ambient Light Sensor for HD+IR Camera (1920x1080)

9,10

39.6 cm (15.6") diagonal UHD Bent, anti-glare UWVA eDP+PSR 400 nits, 100% SRGB, Low Power Ambient Light Sensor for

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Technical Specifications

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HD+IR Camera for WWAN (1920x1080)

9,10

39.6 cm (15.6") diagonal FHD Bent, anti-glare UWVA eDP+PSR, 1000 nits, 100% sRGB with HP Sure View Reflect integrated privacy screen, Ambient Light Sensor for HD camera (1920x1080)

9,10,11,12

39.6 cm (15.6") diagonal FHD Bent, anti-glare UWVA eDP+PSR, 1000 nits, 100% sRGB with HP Sure View Reflect integrated privacy screen, Ambient Light Sensor for HD + IR camera (1920x1080)

9,10,11,12

39.6 cm (15.6") diagonal FHD Bent, anti-glare UWVA eDP+PSR, 1000 nits, 100% sRGB with HP Sure View Reflect integrated privacy screen, Ambient Light Sensor for HD camera for WWAN (1920x1080)

9,10,11,12

39.6 cm (15.6") diagonal FHD Bent, anti-glare UWVA eDP+PSR, 1000 nits, 100% sRGB with HP Sure View Reflect integrated privacy screen, Ambient Light Sensor for HD + IR camera for WWAN (1920x1080)

9,10,11,12

Touch

39.6 cm (15.6") diagonal FHD Bent, anti-glare UWVA eDP, 250 nits, 45% NTSC for HD+IR camera Touch on Panel (1920x1080)

9,10,11,12

39.6 cm (15.6") diagonal FHD Bent, anti-glare UWVA eDP, 250 nits, 45% NTSC for HD+IR camera for WWAN Touch on Panel (1920x1080)

9,10,11,12

HDMI 2.013

Support resolution up to 4K @60 Hz

9. FHD/HD content required to view FHD/HD images.

10. Resolutions are dependent upon monitor capability, and resolution and color depth settings.

11. Actual brightness will be lower with touchscreen or Sure View.

12. HP Sure View integrated privacy screen is an optional feature that must be configured at purchase and is designed to function in landscape orientation.

13. HDMI cable sold separately.

Docking station model (Sold separately)

Total number of supported displays (incl. the notebook) display)

Max resolutions supported for DP 1.4 hosts with DSC

Dock Connectors

Technical limitations / additional information For more details refer to HP Dock QuickSpecs

http://h20195.www2.hp.com/v2/GetDocume nt.aspx?docname=c04168358

All information below applies to platforms running DP 1.4 with DSC

HP Thunderbolt Dock G2

Max number of displays = 4

Dual 8K@ 60Hz in high res mode

2xDP, 1xVGA, 1xTB, 1xUSB-C alt-mode

Max displays = 4 with max resolution of 5K@ 30Hz running Thunderbolt host Max resolution possible is dual 8K displays @ 60Hz running Thunderbolt host or running a non-Thunderbolt host in High Resolution mode The highest resolution for dual displays running a non-Thunderbolt host in Multifunction mode is one 5K dual cable (using both DP ports) + one 4K on USB-C DP port

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HP USB-C Dock G5

Dual 5K@ 30Hz + 1 4K UHD (multifunction mode)

1xHDMI, 2xDP

Three maximum displays supported are two 5K@ 30 Hz on DP ports plus one 4K UHD@ 30 Hz on HDMI in Multi-function mode Highest resolution with dual displays is two 8K@ 60Hz host in High Resolution mode The highest resolution for running a nonThunderbolt host in Multi-function mode is a single 5K dual cable (using both DP ports) + one 4K on HDMI port

HP USB-C/A Universal Dock G2

Triple 4K UHD@ 60Hz

1xHDMI, 2xDP In High Resolution, mode the max available is

one display. This dock’s best use case is triple

display. The best resolution for dual display is two 4K UHD@ 60Hz Highest triple displays resolution available is three 4KUHD @60Hz using both DP and 1 HDMI port. Best single display is with High Resolution mode using HDMI port.

HP USB-C Travel Dock G2

Single 4K@ 30 Hz 4960 x 2160 (via HDMI) or 1920 x 1200@ 60Hz via VGA

1xHDMI, 1xVGA

Single external display using either HDMI or VGA

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Technical Specifications

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STORAGE AND DRIVES

Primary M.2 Storage

128 GB PCIe® Gen3x2 NVMe™ M.2 SSD TLC

256 GB PCIe® Gen3x4 NVMe™ M.2 SSD TLC

512 GB PCIe® Gen3x4 NVMe™ M.2 SSD TLC 14 1 TB PCIe® Gen3x4 NVMe™ M.2 SSD TLC14 2 TB PCIe® Gen3x4 NVMe™ M.2 SSD TLC

256 GB PCIe® NVMe™ Value M.2 SSD14 512 GB PCIe® NVMe™ Value M.2 SSD

512 GB PCIe®Gen 3x4 NVMe™ M.2 SED TLC OPAL2

256 GB PCIe® Gen3x4 NVMe™ M.2 SED TLC OPAL2

512 Intel® PCIe® NVMe™ QLC M.2 SSD with 32 GB Intel® Optane™ memory H10

14,15

14. For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows

10) is reserved for system recovery software.

15. Intel® Optane™ H10 memory system acceleration does not replace or increase the DRAM in your system. Requires 8th Gen or higher Intel® Core™ processor, BIOS version with Intel® Optane™ supported, Windows 10 64-bit, and an Intel® Rapid Storage Technology (Intel® RST) driver.

MEMORY

Maximum Memory 64 GB DDR4-3200 SDRAM

Memory

64 GB DDR4-3200 SDRAM (2 x 32 GB)16 32 GB DDR4-3200 SDRAM (2 x 16 GB)

16 GB DDR4-3200 SDRAM (2 x 8 GB)

16 GB DDR4-3200 SDRAM (1 x 16 GB)

8 GB DDR4-3200 SDRAM (1 x 8 GB)

8 GB DDR4-3200 SDRAM (2 x 4 GB)

4 GB DDR4-3200 SDRAM (1 x 4 GB)

Memory Slots

2 SODIMM DDR4 SODIMMS, system runs at 3200 Supports Dual Channel Memory

16. Due to the non-industry standard nature of some third-party memory modules, we recommend HP branded memory to ensure compatibility. If you mix memory speeds, the system will perform at the lower memory speed.

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Technical Specifications

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NETWORKING/COMMUNICATIONS

WLAN

Intel®Dual Band Wi-Fi® 6 AX201 802.11a/b/g/n/ac/ax (2x2) WLAN and Bluetooth® 5 Combo, non-vPro®17 Intel® Dual Band Wi-Fi® 6 AX201 802.11a/b/g/n/ac/ax (2x2) WLAN and Bluetooth® 5 Combo, vPro®

17,18

WWAN

Intel® XMM™ 7360 LTE-Advanced Cat 9 19 Qualcomm® Snapdragon™ X55 5G Cat 20

Near Field Communications (NFC) Module 22 HP Module with NXP NFC Controller NPC300 12C NCI

Miracast

Native Miracast Support21

17. Wireless access point and internet service required and sold separately. Availability of public wireless access points limited. Wi-Fi 6 is backwards compatible with prior 802.11 specs. The specifications for Wi-Fi 6 (802.11ax) are draft and are not final. If the final specifications differ from the draft specifications, it may affect the ability of the notebook to communicate with other 802.11ax devices.

18. For full Intel® vPro™ functionality, Windows, a vPro supported processor, vPro enabled chipset, vPro enabled WLAN card and discrete TPM 2.0 are required. See https://www.intel.com/content/www/us/en/architecture-and-technology/vpro/vpro-

platform-general.html

19. WWAN module is an optional feature, requires factory configuration and requires separately purchased service contract. Check with service provider for coverage and availability in your area. Connection speeds will vary due to location, environment, network conditions, and other factors. LTE not available on all products, in all regions.

20. 5G module is an optional feature that must be configured at purchase. AT&T and T-Mobile networks supported in the U.S. Module designed for 5G networks as carriers deploy Evolved-Universal Terrestrial Radio Access New Radio Dual Connectivity (ENDC) with both 100Mhz of 5G NR and LTE channel bandwidth, using 256QAM 4x4 as defined by 3GPP, requires activation and separately purchased service contract. Check with service provider for coverage and availability in your area. Connection, upload and download speeds will vary due to network, location, environment, network conditions, and other factors. 5G not available on all products, in all regions. Backwards compatible to 4G LTE and 3G HSPA technologies. 5G module planned to be available in select countries, where carrier supported.

21. Miracast is a wireless technology your PC can use to project your screen to TVs, projectors, and streaming.

22. Sold separately or as an optional feature.

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Technical Specifications

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AUDIO/MULTIMEDIA

Audio

Audio by Bang & Olufsen 2 Integrated stereo speakers Integrated microphone (3-Mic Array) World- Facing microphone

Speaker Power

2W/4ohm Per speaker

Camera 720p HD camera

9,22

720p HD+IR camera

9,22

Sensors

Ambient light sensor Hall Sensor HP Tamper Lock 53

9. FHD/HD content required to view FHD/HD images.

22. Sold separately or as an optional feature.

53. HP Tamper Lock must be enabled by the customer or your administrator.

KEYBOARDS/POINTING DEVICES/BUTTONS & FUNCTION KEYS

Keyboard

HP Premium Keyboard – spill-resistant, backlit keyboard23

Pointing Device

Clickpad with multi-touch gesture support, taps enabled as default Microsoft Precision Touchpad Default Gestures Support

Function Keys

F1 - Display Switching F2 - Blank or Privacy (with LED) F3 - Brightness Down F4 - Brightness Up F5 - Audio Mute F6 - Volume Down F7 - Volume Up F8 - Mic Mute F9 - Blank or Backlit Toggle F10 - Insert F11 - Airplane Mode

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Technical Specifications

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F12 - HP Programmable Key Print Screen Power Button (with LED)

Hidden Function Keys

Fn+R - Break Fn+S - Sys Rq Fn+C - Scroll Lock

23. Keyboards are made from up to 65% post-consumer recycled plastic.

SOFTWARE AND SECURITY

Preinstalled Software

BIOS

HP BIOSphere Gen624 HP Drive Lock & Automatic Drive Lock BIOS Update via Network HP Secure Erase25 Absolute Persistence Module26 HP LAN-Wireless Protection

Software

HP Connection Optimizer27 HP Hotkey Support myHP HP Support Assistant28 HP QuickDrop HP Noise Cancellation Software Touchpoint Customizer for Commercial HP Notifications HP Privacy Settings HP Wireless Button Driver HP Power Manager Tile App29 HP PC Hardware Diagnostics Windows Buy Microsoft Office (Sold separately) Microsoft Defender

HP Smart Support 56

Manageability Features

HP Driver Packs (download)30

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HP Manageability Integration Kit Gen4 (download)

HP System Software Manager (SSM) (download) HP Client Catalog (download) HP Client Management Script Library (download) HP Image Assistant (download)

Client Security Software

HP Client Security Manager Gen7

Security Management

Setup password (via BIOS) HP Fingerprint Sensor34 Support for chassis padlocks and cable lock devices HP Wolf Pro Security Edition 54 HP Sure Click

HP Sure Sense 49 HP Sure Start Gen6

HP Sure Run Gen4

HP Sure Admin

HP Sure Recover Gen4

TPM 2.0 Embedded Security Chip (Common Criteria EAL4+ Certified) (FIPS 140-2 Level 2 Certified)

Is the BIOS on this notebook ISO/IEC 19678:2015 (formerly NIST 800-147) compliant?: Yes UEFI version: 2.7 Class: Class 3

24. HP BIOSphere Gen6 is available on select HP Pro and Elite PCs. Features may vary depending on the platform and configurations.

25. HP Secure Erase for the methods outlined in the National Institute of Standards and Technology Special Publication 800-88 "Clear" sanitation method. HP Secure Erase does not support platforms with Intel® Optane™.

26. Absolute firmware module is shipped turned off and can only be activated with the purchase a license subscription and full activation of the software agent. License subscriptions can be purchased for terms ranging multiple years. Service is limited, check with Absolute for availability outside the U.S. Certain conditions apply. For full details visit:

https://www.absolute.com/about/legal/agreements/absolute/

27. HP Connection Optimizer requires Windows 10.

28.HP Support Assistant requires Windows and Internet access.

29. Some features require optional subscription to Tile Premium. Tile application for Windows 10 available for download from the Windows Store. Mobile phone app available for download from App Store and Google Play. Requires iOS 11 and greater or Android 6.0 and greater see https://support.thetileapp.com/hc/en-us/articles/200424778 for more information. HP Tile will function as long as the PC has battery power.

30. HP Driver Packs not preinstalled, however available for download at http://www.hp.com/go/clientmanagement.

31. HP Manageability Integration Kit can be downloaded from http://www8.hp.com/us/en/ads/clientmanagement/

overview.html.

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32. HP Client Security Manager Gen7 requires Windows and is available on the select HP Elite and Pro PCs.

33. Windows Defender Opt in and internet connection required for updates.

34. HP Fingerprint sensor is an optional feature that must be configured at purchase.

35. HP Sure Click requires Windows 10 Pro or Enterprise. See https://bit.ly/2PrLT6A_SureClick for complete details

36. HP Sure Start Gen6 is available on select HP PCs.

37. HP Sure Run Gen4 is available on select Windows 10 based HP Pro, Elite and Workstation PCs with select Intel® or AMD processors.

38. HP Sure Recover Gen4 is available on select HP PCs and requires an open network connection. You must back up important files, data, photos, videos, etc. before using HP Sure Recover to avoid loss of data

39. Firmware TPM is version 2.0.

49. HP Sure Sense is available on select HP PCs and is not available with Windows10 Home.

50. HP Sure Admin requires Windows 10, HP BIOS, HP Manageability Integration Kit from

http://www.hp.com/go/clientmanagement and HP Sure Admin Local Access Authenticator smartphone app from the Android

or Apple store.

54. HP Wolf Pro Security Edition (including HP Sure Click Pro and HP Sure Sense Pro) is available preloaded on select SKUs and, depending on the HP product purchased, includes a paid 1-year or 3-year license. The HP Wolf Pro Security Edition software is licensed under the license terms of the HP Wolf Security Software - End-User license Agreement (EULA) that can be found at: https://support.hp.com/us-en/document/ish_3875769-3873014-16 as that EULA is modified by the following: “7. Term. Unless otherwise terminated earlier pursuant to the terms contained in this EULA, the license for the HP Wolf Pro Security Edition (HP Sure Sense Pro and HP Sure Click Pro) is effective upon activation and will continue for either a twelve (12) month or thirty-six (36) month license term (“Initial Term”). At the end of the Initial Term you may either (a) purchase a renewal license for the HP Wolf Pro Security Edition from HP.com, HP Sales or an HP Channel Partner, or (b) continue using the standard versions of HP Sure Click and HP Sure Sense at no additional cost with no future software updates or HP Support.

56. HP Smart Support is available to commercial customers through your HP Service Representative and HP Factory Configuration Services; or it can be downloaded at: http://www.hp.com/smart-support. HP Smart Support automatically collects the telemetry necessary upon initial boot of the product to deliver device-level configuration data and health insights.

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SMART CARD READER

Smart Card Reader (Optional)

Smart card standard

PC/SC 2.0 for Windows smart card standard

Dimensions (L x W x H)

0.41x 0.08 x 0.32 in (10.5 x 2 x 8.2 mm)

Smart Card support

ISO 7816 Class A and AB smart cards

Smart Card Interface

Smart Card Interface with T = 0 and T = 1 support Support I2C memory card, SLE4418, SLE4428, SLE4432, SLE4442, SLE4436, SLE5536, SLE6636, AT88SC1608, AT45D041 card and AT45DB041 card via external EEPROM

Model number

Alcor AU9560

FIPS 201 Compliant

Yes

POWER

Power Supply

HP Smart 65 W External AC power adapter

HP Smart 65 W USB Type-C® adapter

HP Smart 65 W EM External AC power adapter

HP Smart 45 W External AC power adapter

HP Smart 45 W External AC power adapter, 2-prong (Japan only)

Power Cord

2-wire plug - 1.0m 3-wire plug - 1.0m

Primary Battery

HP Long Life 3-cell, 56 Wh Polymer

41,51

Supports HP Fast Charge (Up to 50% in 30 minutes)42

Battery Life

Up to 14 hours and 45 minutes

Battery Weight

0.47 lb

0.215 kg

40. Availability may vary by country.

41. Battery is internal and not replaceable by customer. Serviceable by warranty.

42. Supports HP Fast Charge with 65W AC Adapter. Recharges the battery up to 50% within 30 minutes when the system is off or in standby mode. Power adapter with a minimum capacity of 65 watts is required. After charging has reached 50% capacity, charging will return to normal. Charging time may vary +/-10% due to System tolerance.

43. Windows 10 MM18 battery life will vary depending on various factors including product model, configuration, loaded applications, features, use, wireless functionality, and power management settings. The maximum capacity of the battery will naturally decrease with time and usage. See www.bapco.com for additional details.

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51. Actual battery Watt-hours (Wh) will vary from design capacity. Battery capacity will naturally decrease with shelf life, time, usage, environment, temperature, system configuration, loaded apps, features, power management settings and other factors.

WEIGHTS & DIMENSIONS

Product Weight Non-Touch

Starting at 3.73 lb (1.69 kg)44

Touch Starting at 3.84 lb (1.74 kg)44

Product Dimensions (W x D x H)

14.1 x 9.2 x 0.75 in

35.9 x 23.38 x 1.92 cm

44. Weight will vary by configuration.

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PORTS/SLOTS

Ports

2 Thunderbolt™ 4 with USB4 Type-C® 40Gbps signaling rate (USB Power Delivery, DisplayPort™ 1.4)

2 SuperSpeed USB Type-A 5Gbps signaling rate (1 Charging) 1 HDMI 2.0b

1 Headphone/microphone combo 1 4.5 mm AC power 1 nano SIM card slot45 1 Smartcard reader (Optional) 1 Nano Security Lock Slot (Lock sold separately)

8. HDMI cable sold separately. All units have a SIM card slot and icon but units that do not support WWAN are shipped with a non-removable SIM slot plug.

45. All units have a SIM card slot and icon but units that do not support WWAN are shipped with a non-removable SIM slot plug.

52. SuperSpeed USB 20Gbps is not available with Thunderbolt™ 4.

SERVICE AND SUPPORT

1-year or 3-year limited warranty and 90 day software limited warranty options depending on country. Batteries have a default one-year limited warranty except for HP Long Life batteries which will follow the one or three year warranty of the platform. Refer to http://www.hp.com/support/batterywarranty/ for additional battery information. Onsite service and extended coverage is also available. HP Care Pack Services are optional extended service contracts that go beyond the standard limited warranties. To choose the right level of service for your HP product, use the HP Care Pack Services Lookup Tool at: http://www.hp.com/go/cpc.

46. HP Care Packs are sold separately. Service levels and response times for HP Care Packs may vary depending on your geographic location. Service starts on date of hardware purchase. Restrictions and limitations apply. For details, visit

http://www.hp.com/go/cpc. HP services are governed by the applicable HP terms and conditions of service provided or

indicated to Customer at the time of purchase. Customer may have additional statutory rights according to applicable local laws, and such rights are not in any way affected by the HP terms and conditions of service or the HP Limited Warranty provided with your HP Product.

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SYSTEM UNIT

Nominal Operating Voltage

19.5V

Average Operating Power

2.67W

Integrated graphics

Yes

Discrete Graphics

15.3W

Max Operating Power

Discrete < 65W UMA < 45W

Temperature

Operating

32° to 95° F (0° to 35° C)

Non-operating

41° to 95° F (5° to 35° C) (writing optical)

Relative Humidity

Operating

10% to 90%, non-condensing

Non-operating

5% to 95%, 101.6° F (38.7° C) maximum wet bulb temperature

Shock

Operating

40 G, 2 ms, half-sine

Non-operating

200 G, 2 ms, half-sine

Random Vibration

Operating

0.75 grms

Non-operating

1.50 grms

Altitude (unpressurized)

Operating

-50 to 10,000 ft (-15.24 to 3,048 m)

Non-operating

-50 to 40,000 ft (-15.24 to 12,192 m)

Planned Industry Standard Certifications

Yes

CSA

Yes

FCC Compliance

Yes

ENERGY STAR®

Select models

EPEAT®

EPEAT 2019 Gold in United States 48

ICES

Yes

Australia /

Yes

NZ A-Tick Compliance

Yes

CCC

Yes

Japan VCCI Compliance

Yes

BSMI

Yes

CE Marking Compliance

Yes

BNCI or BELUS

Yes

CIT

Yes

GOST

Yes

Saudi Arabian Compliance (ICCP) Yes

SABS

Yes

47. Configurations of the HP EliteBook 850 G8 Notebook PC that are ENERGY STAR® certified are identified as HP EliteBook 850 G8 Notebook PC ENERGY STAR on HP websites and on http://www.energystar.gov.

QuickSpecs

HP EliteBook 850 G8 Notebook PC

Technical Specifications

c06969195 — DA16797 — Worldwide — Version 14 — June 22, 2021

Page 18

48. Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. Status varies by country. Visit

http://www.epeat.net for more information.

DISPLAYS

1. Actual brightness will be lower with touchscreen or Sure View.

Note: All specifications represent the typical specifications provided by HP's component manufacturers; actual performance may vary either higher or lower.

Panel LCD 15.6 inch FHD (1920x1080) Anti-Glare WLED UWVA 45percent cg 250nits eDP

1.2 w/o PSR bent NWBZ

Outline Dimensions (W x H x D)

350.96 x 205.54 mm (max)

Active Area

344.16 x 193.59 mm (typ.)

Weight

370 g (max)

Diagonal Size

15.6 inch

Thickness

3.0 mm/ 5.0 mm (w/PCB) (max)

Interface

eDP 1.2 (2 lane)

Surface Treatment

Anti-Glare

Touch Enabled

Contrast Ratio

600:1 (typ.)

Refresh Rate

60 Hz

Brightness

250 nits

Pixel Resolution

1920 x 1080 (FHD)

Format

RGB Stripe

Backlight

LED

Color Gamut Coverage

NTSC 45%

Color Depth

6 bits (Hi FRC supportive w/ condition to enable)

Viewing Angle

UWVA 85/85/85/85

Panel LCD 15.6 inch FHD (1920x1080) Anti-Glare WLED UWVA 45percent cg 250nits eDP

1.2 w/o PSR bent Touch on Panel NWBZ

Outline Dimensions (W x H x D)

350.96 x 205.74 mm (max)

Active Area

344.16 x 193.59 mm

Weight

380 g (max)

Diagonal Size

15.6 inch

Thickness

3.2mm/ 5.2mm (PCB) (max)

Interface

eDP 1.2

Surface Treatment

Anti-Glare On-cell

Touch Enabled

Yes

Contrast Ratio

600:1

Refresh Rate

60 Hz

Brightness

250 nits 1

Pixel Resolution

1920 x 1080 (FHD)

Format

RGB Stripe

Backlight

LED

QuickSpecs

HP EliteBook 850 G8 Notebook PC

Technical Specifications

c06969195 — DA16797 — Worldwide — Version 14 — June 22, 2021

Page 19

Color Gamut Coverage

NTSC 45%

Color Depth

6 bits

Viewing Angle

UWVA 85/85/85/85

Panel LCD 15.6 inch FHD (1920x1080) Anti-Glare WLED UWVA sRGB 100percent cg 400nits eDP 1.4+PSR2 bent LP NWBZ

Outline Dimensions (W x H x D)

349.52 x 205.42 mm (max)

Active Area

344.22 x 193.62 mm

Weight

325g (max)

Diagonal Size

15.6 inch

Thickness

2.6mm / 4.6mm (PCB) (max)

Interface

eDP 1.4

Surface Treatment

Anti-Glare

Touch Enabled

Contrast Ratio

1200:1

Refresh Rate

60 Hz

Brightness

400 nits

Pixel Resolution

1920 x 1080 (FHD)

Format

RGB Stripe

Backlight

LED

Color Gamut Coverage

sRGB 100% only for UHD LP

Color Depth

8 bits

Viewing Angle

UWVA 85/85/85/85

Panel LCD 15.6 inch UHD (3840x2160) Anti-Glare WLED UWVA sRGB 100percent cg 400nits eDP 1.4+PSR2 bent LP NB2Y

Outline Dimensions (W x H x D)

349.52 x 205.42 mm (max)

Active Area

344.22 x 193.62 mm

Weight

320 g (max)

Diagonal Size

15.6 inch

Thickness

2.6mm / 4.6mm (PCB) (max)

Interface

eDP 1.4

Surface Treatment

Anti-Glare

Touch Enabled

Contrast Ratio

1200:1

Refresh Rate

60 Hz

Brightness

400 nits

Pixel Resolution

3840 x 2160 (UHD)

Format

RGB Stripe

Backlight

LED

Color Gamut Coverage

sRGB 100% only for UHD LP

Color Depth

8 bits

Viewing Angle

UWVA 85/85/85/85

QuickSpecs

HP EliteBook 850 G8 Notebook PC

Technical Specifications

c06969195 — DA16797 — Worldwide — Version 14 — June 22, 2021

Page 20

Panel LCD 15.6-in FHD (1920x1080) Anti-Glare WLED UWVA 100% sRGB 1000nits eDP

1.4+PSR HP Sure View Reflect NB2Y bent

Outline Dimensions (W x H x D)

349.52 x 205.39 max.

Active Area

344.16 x 193.59

Weight

370g max

Diagonal Size

15.6 inch

Thickness

2.6mm / 4.5mm max. (PCB)

Interface

eDP

Surface Treatment

Anti-Glare (AG)

Touch Enabled

Contrast Ratio

1500:1

Refresh Rate

60 Hz

Brightness

1000 nits1

Pixel Resolution

1920 x 1080 (FHD)

Format

RGB

Backlight

LED

Color Gamut Coverage

100% sRGB

Color Depth

8 bits

Viewing Angle

UWVA 85/85/85/85

QuickSpecs

HP EliteBook 850 G8 Notebook PC

Technical Specifications

c06969195 — DA16797 — Worldwide — Version 14 — June 22, 2021

Page 21

STORAGE

For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows 10) is reserved for system recovery software.

SSD 128GB 2280 PCIe-3x2 Three Layer Cell

Form Factor

M.2 2280

Capacity

128 GB

NAND Type

TLC

Height

0.09 in (2.3 mm)

Width

0.87 in (22 mm)

Weight

0.02 lb (10 g)

Interface

PCIe NVMe Gen3X2

Maximum Sequential Read

Up to 1400 ~ 2100 MB/s

Maximum Sequential Write

Up to 800 ~ 1200 MB/s

Logical Blocks

250,069,680

Operating Temperature

32° to 158°F (0° to 70°C) [ambient temp]

Features

ATA Security (Option); TRIM; L1.2

SSD 1TB 2280 PCIe-3x4 NVMe Three Layer Cell singlesided

Form Factor

M.2 2280

Capacity

1 TB

NAND Type

TLC

Height

0.09 in (2.3 mm)

Width

0.87 in (22 mm)

Weight

0.02 lb (10 g)

Interface

PCIe NVMe Gen3X2

Maximum Sequential Read

Up to 3100 ~ 3500 MB/s

Maximum Sequential Write

Up to 2700 ~ 3037 MB/s

Logical Blocks

2,000,409,264

Operating Temperature

32° to 158°F (0° to 70°C) [ambient temp]

Features

ATA Security; TRIM; L1.2

QuickSpecs

HP EliteBook 850 G8 Notebook PC

Technical Specifications

c06969195 — DA16797 — Worldwide — Version 14 — June 22, 2021

Page 22

SSD 256GB 2280 M2 PCIe-3x4 SS NVMe TLC

Form Factor

M.2 2280

Capacity

256 GB

NAND Type

TLC

Height

0.09 in (2.3 mm)

Width

0.87 in (22 mm)

Weight

0.02 lb (10 g)

Interface

PCIe NVMe Gen3X4

Maximum Sequential Read

Up to 2800 ~ 3500 MB/s

Maximum Sequential Write

Up to 1600 ~ 2200 MB/s

Logical Blocks

500,118,192

Operating Temperature

32° to 158°F (0° to 70°C) [ambient temp]

Features

ATA Security; TRIM; L1.2

SSD 256GB 2280 PCIe NVMe Value

Form Factor

M.2 2280

Capacity

256 GB

NAND Type

Value

Height

0.09 in (2.3 mm)

Width

0.87 in (22 mm)

Weight

0.02 lb (10 g)

Interface

PCIe NVMe Gen3X2

Maximum Sequential Read

Up to 2100 ~ 2400 MB/s

Maximum Sequential Write

Up to 950 ~ 1400 MB/s

Logical Blocks

500,118,192

Operating Temperature

32° to 158°F (0° to 70°C) [ambient temp]

Features

ATA Security (Option); TRIM; L1.2

QuickSpecs

HP EliteBook 850 G8 Notebook PC

Technical Specifications

c06969195 — DA16797 — Worldwide — Version 14 — June 22, 2021

Page 23

SSD 256GB 2280 PCIe-3x4 NVMe Self Encrypted OPAL2 Three Layer Cell

Form Factor

M.2 2280

Capacity

256 GB

NAND Type

TLC

Height

0.09 in (2.3 mm)

Width

0.87 in (22 mm)

Weight

0.02 lb (10 g)

Interface

PCIe NVMe Gen3X4

Maximum Sequential Read

Up to 2800 ~ 3500 MB/s

Maximum Sequential Write

Up to 1663 ~ 2200 MB/s

Logical Blocks

500,118,192

Operating Temperature

32° to 158°F (0° to 70°C) [ambient temp]

Features

ATA Security (Option); TCG Opal 2.0; TRIM; L1.2

SSD 2TB 2280 PCIe-3x4 NVMe Three Layer Cell single-sided

Form Factor

M.2 2280

Capacity

2 TB

NAND Type

TLC

Height

0.09 in (2.3 mm)

Width

0.87 in (22 mm)

Weight

0.02 lb (10 g)

Interface

PCIe NVMe Gen3X4

Maximum Sequential Read

Up to 3100 ~ 3500 MB/s

Maximum Sequential Write

Up to 2800 ~ 3000 MB/s

Logical Blocks

3,907,029,168

Operating Temperature

32° to 158°F (0° to 70°C) [ambient temp]

Features

ATA Security; TRIM; L1.2

QuickSpecs

HP EliteBook 850 G8 Notebook PC

Technical Specifications

c06969195 — DA16797 — Worldwide — Version 14 — June 22, 2021

Page 24

SSD 512GB 2280 M2 PCIe-3x4 SS NVMe TLC

Form Factor

M.2 2280

Capacity

512 GB

NAND Type

TLC

Height

0.09 in (2.3 mm)

Width

0.87 in (22 mm)

Weight

0.02 lb (10 g)

Interface

PCIe NVMe Gen3X4

Maximum Sequential Read

Up to 3100 ~ 3500 MB/s

Maximum Sequential Write

Up to 2400 ~ 2956 MB/s

Logical Blocks

1,000,215,215

Operating Temperature

32° to 158°F (0° to 70°C) [ambient temp]

Features

ATA Security; TRIM; L1.2

SSD 512GB 2280 PCIe NVMe Value

Form Factor

M.2 2280

Capacity

512 GB

NAND Type

Value

Height

0.09 in (2.3 mm)

Width

0.87 in (22 mm)

Weight

0.02 lb (10 g)

Interface

PCIe NVMe Gen3X2

Maximum Sequential Read

Up to 1500 ~ 2400 MB/s

Maximum Sequential Write

Up to 1000 ~ 1750 MB/s

Logical Blocks

1,000,215,215

Operating Temperature

32° to 158°F (0° to 70°C) [ambient temp]

Features

ATA Security (Option); TRIM; L1.2

QuickSpecs

HP EliteBook 850 G8 Notebook PC

Technical Specifications

c06969195 — DA16797 — Worldwide — Version 14 — June 22, 2021

Page 25

SSD 512GB 2280 PCIe-3x2x2 NVMe+SSD 32GB 3D Xpoint

Form Factor

M.2 2280

Capacity

512 GB

NAND Type

QLC+3D XPoint

Height

0.09 in (2.3 mm)

Width

0.87 in (22 mm)

Weight

0.02 lb (10 g)

Interface

PCIe NVMe Gen3X2X2

Maximum Sequential Read

Up to 2400 MB/s

Maximum Sequential Write

Up to 1300 MB/s

Logical Blocks

1,000,215,215

Operating Temperature

32° to 158°F (0° to 70°C) [ambient temp]

Features

ATA Security; TRIM; L1.2

SSD 512GB 2280 PCIe-3x4 NVMe Self Encrypted OPAL2 Three Layer Cell

Form Factor

M.2 2280

Capacity

512 GB

NAND Type

TLC

Height

0.09 in (2.3 mm)

Width

0.87 in (22 mm)

Weight

0.02 lb (10 g)

Interface

PCIe NVMe Gen3X4

Maximum Sequential Read

Up to 3100 ~ 3500 MB/s

Maximum Sequential Write

Up to 2400 ~ 2956 MB/s

Logical Blocks

1,000,215,215

Operating Temperature

32° to 158°F (0° to 70°C) [ambient temp]

Features

ATA Security (Option); TCG Opal 2.0; TRIM; L1.2

QuickSpecs

HP EliteBook 850 G8 Notebook PC

Technical Specifications

c06969195 — DA16797 — Worldwide — Version 14 — June 22, 2021

Page 26

NETWORKING

Intel® Wi-Fi® 61 AX201 and Bluetooth® 5.0

802.11ax (2x2) supporting gigabitdata rate5 , vPro®

Wireless LAN Standards

IEEE 802.11a IEEE 802.11b IEEE 802.11g IEEE 802.11n IEEE 802.11ac IEEE 802.11ax IEEE 802.11d IEEE 802.11e IEEE 802.11h IEEE 802.11i IEEE 802.11k IEEE 802.11r IEEE 802.11v

Interoperability

Features Wi-Fi 6 technology

Frequency Band

•802.11b/g/n/ax

2.402 – 2.482 GHz

•802.11a/n/ac/ax

4.9 – 4.95 GHz (Japan)

5.15 – 5.25 GHz

5.25 – 5.35 GHz

5.47 – 5.725 GHz

5.825 – 5.850 GHz

Data Rates

•802.11b: 1, 2, 5.5, 11 Mbps

•802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps

•802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps

•802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)

•802.11ac: MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, 80MHz &

160MHz)

•802.11ax: MCS0 ~ MCS11, (1SS and 2SS) (20MHz, 40MHz, 80MHz &

160MHz)

Modulation

Direct Sequence Spread Spectrum OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024QAM

Security

•IEEE compliant 64 / 128 bit WEP encryption for a/b/g mode only

•AES-CCMP: 128 bit in hardware

•802.1x authentication

•WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.

•WPA2 certification

•WPA3 certification

•IEEE 802.11i

•WAPI

Network Architecture Models

Ad-hoc (Peer to Peer) Infrastructure (Access Point Required)

Roaming

IEEE 802.11 compliant roaming between access points

Output Power2

• 802.11b: +18.5dBm minimum

• 802.11g: +17.5dBm minimum

QuickSpecs

HP EliteBook 850 G8 Notebook PC

Technical Specifications

c06969195 — DA16797 — Worldwide — Version 14 — June 22, 2021

Page 27

• 802.11a: +18.5dBm minimum

• 802.11n HT20(2.4GHz): +15.5dBm minimum

• 802.11n HT40(2.4GHz): +14.5dBm minimum

• 802.11n HT20(5GHz): +15.5dBm minimum

• 802.11n HT40(5GHz): +14.5dBm minimum

• 802.11ac VHT80(5GHz): +11.5dBm minimum

• 802.11ac VHT160(5GHz): +11.5dBm minimum

• 802.11ax HT40(2.4GHz): +10dBm minimum

• 802.11ax VHT160(5GHz): +10dBm minimum

Power Consumption

•Transmit mode: 2.0 W

•Receive mode: 1.6 W

•Idle mode (PSP) 180 mW (WLAN Associated)

•Idle mode: 50 mW (WLAN unassociated)

•Connected Standby/Modern Standby: 10mW

•Radio disabled: 8 mW

Power Management

ACPI and PCI Express compliant power management

802.11 compliant power saving mode

Receiver Sensitivity4

•802.11b, 1Mbps: -93.5dBm maximum

•802.11b, 11Mbps: -84dBm maximum

• 802.11a/g, 6Mbps: -86dBm maximum

• 802.11a/g, 54Mbps: -72dBm maximum

• 802.11n, MCS07: -67dBm maximum

• 802.11n, MCS15: -64dBm maximum

• 802.11ac, MCS0: -84dBm maximum

• 802.11ac, MCS9: -59dBm maximum

•802.11ax, MCS11(HT40): -59dBm maximum

•802.11ax, MCS11(VHT160): -58.5dBm maximum

Antenna type

High efficiency antenna with spatial diversity, mounted in the display enclosure Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO communications and Bluetooth communications

Form Factor

PCI-Express M.2 MiniCard with CNVi Interface

Dimensions

1. Type 2230: 2.3 x 22.0 x 30.0 mm

2. Type 1216: 1.67 x 12.0 x 16.0 mm

Weight

1. Type 2230: 2.8 g

2. Type 126: 1.3 g

Operating Voltage

3.3v +/- 9%

Temperature

Operating Non-operating

14° to 158° F (–10° to 70° C) –40° to 176° F (–40° to 80° C)

Humidity

Operating Non-operating

10% to 90% (non-condensing) 5% to 95% (non-condensing)

Altitude

Operating Non-operating

0 to 10,000 ft (3,048 m) 0 to 50,000 ft (15,240 m)

LED Activity

LED Amber – Radio OFF LED White – Radio ON

QuickSpecs

HP EliteBook 850 G8 Notebook PC

Technical Specifications

c06969195 — DA16797 — Worldwide — Version 14 — June 22, 2021

Page 28

HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0/5.1 Wireless Technology

Bluetooth Specification

4.0/4.1/4.2/5.0/5.1 Compliant

Frequency Band

2402 to 2480 MHz

Number of Available Channels

Legacy: 0~79 (1 MHz/CH) BLE: 0~39 (2 MHz/CH)

Signaling Data Rate

Legacy: 3 Mbps signaling data rate1 2.17 Mbps BLE: 1 Mbps signaling data rate1 0.2 Mbps

1. Actual throughput may vary.

Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels

Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)

Transmit Power

The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of + 9.5 dBm for BR and EDR.

Power Consumption

Peak (Tx) 330 mW Peak (Rx) 230 mW Selective Suspend 17 mW

Bluetooth Software Supported Link Topology

Microsoft Windows Bluetooth Software

Power Management

Microsoft Windows ACPI, and USB Bus Support

Certifications

FCC (47 CFR) Part 15C, Section 15.247 & 15.249

Power Management Certifications

ETS 300 328, ETS 300 826 Low Voltage Directive IEC950 UL, CSA, and CE Mark

Bluetooth Profiles Supported

BT4.1-ESR 5/6/7 Compliance LE Link Layer Ping LE Dual Mode LE Link Layer LE Low Duty Cycle Directed Advertising LE L2CAP Connection Oriented Channels Train Nudging & Interlaced Scan BT4.2 ESR08 Compliance LE Secure Connection- Basic/Full LE Privacy 1.2 –Link Layer Privacy LE Privacy 1.2 –Extended Scanner Filter Policies LE Data Packet Length Extension FAX Profile (FAX) Basic Imaging Profile (BIP)2 Headset Profile (HSP) Hands Free Profile (HFP) Advanced Audio Distribution Profile (A2DP)

Security & Manageability

Intel® vPro® support with appropriate Intel® chipset components

QuickSpecs

HP EliteBook 850 G8 Notebook PC

Technical Specifications

c06969195 — DA16797 — Worldwide — Version 14 — June 22, 2021

Page 29

1. Wireless access point and internet service required and sold separately. Availability of public wireless access points limited. Wi-Fi 6 is backwards compatible with prior 802.11 specs. The specifications for Wi-Fi 6 (802.11ax) are draft and are not final. If the final specifications differ from the draft specifications, it may affect the ability of the notebook to communicate with other 802.11ax devices. Only available in countries where 802.11ax is supported.

2. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.

3. Check latest software/driver release for updates on supported security features.

4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for 802.11a/g (OFDM modulation).

5. Wi-Fi 5 or 6 is designed to support gigabit data rate when transferring files between two devices connected to the same router. Requires a wireless router, sold separately, that supports 80MHz and higher channels.

Intel® Wi-Fi ® 61 AX201 and Bluetooth® 5.0

802.11ax (2x2), supporting gigabit data rate5 non-vPro®

Wireless LAN Standards

IEEE 802.11a IEEE 802.11b IEEE 802.11g IEEE 802.11n IEEE 802.11ac IEEE 802.11ax IEEE 802.11d IEEE 802.11e IEEE 802.11h IEEE 802.11i IEEE 802.11k IEEE 802.11r IEEE 802.11v

Interoperability

Features Wi-Fi 6 technology

Frequency Band

•802.11b/g/n/ax

2.402 – 2.482 GHz

•802.11a/n/ac/ax

4.9 – 4.95 GHz (Japan)

5.15 – 5.25 GHz

5.25 – 5.35 GHz

5.47 – 5.725 GHz

5.825 – 5.850 GHz

Data Rates

•802.11b: 1, 2, 5.5, 11 Mbps

•802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps

•802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps

•802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)

•802.11ac: MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, 80MHz &

160MHz)

• 802.11ax: MCS0 ~ MCS11, (1SS and 2SS) (20MHz, 40MHz, 80MHz &

160MHz)

Modulation

Direct Sequence Spread Spectrum OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024QAM

QuickSpecs

HP EliteBook 850 G8 Notebook PC

Technical Specifications

c06969195 — DA16797 — Worldwide — Version 14 — June 22, 2021

Page 30

Security

•IEEE compliant 64 / 128 bit WEP encryption for a/b/g mode only

•AES-CCMP: 128 bit in hardware

•802.1x authentication

•WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.

•WPA2 certification

•WPA3 certification

•IEEE 802.11i

•WAPI

Network Architecture Models

Ad-hoc (Peer to Peer) Infrastructure (Access Point Required)

Roaming

IEEE 802.11 compliant roaming between access points

Output Power2

• 802.11b: +18.5dBm minimum

• 802.11g: +17.5dBm minimum

• 802.11a: +18.5dBm minimum

• 802.11n HT20(2.4GHz): +15.5dBm minimum

• 802.11n HT40(2.4GHz): +14.5dBm minimum

• 802.11n HT20(5GHz): +15.5dBm minimum

• 802.11n HT40(5GHz): +14.5dBm minimum

• 802.11ac VHT80(5GHz): +11.5dBm minimum

• 802.11ac VHT160(5GHz): +11.5dBm minimum

• 802.11ax HT40(2.4GHz): +10dBm minimum

• 802.11ax VHT160(5GHz): +10dBm minimum

Power Consumption

•Transmit mode 2.0 W

•Receive mode 1.6 W

•Idle mode (PSP) 180 mW (WLAN Associated)

•Idle mode 50 mW (WLAN unassociated)

•Connected Standby 10mW

•Radio disabled 8 mW

Power Management

ACPI and PCI Express compliant power management

802.11 compliant power saving mode

Receiver Sensitivity4

•802.11b, 1Mbps: -93.5dBm maximum

•802.11b, 11Mbps: -84dBm maximum

• 802.11a/g, 6Mbps: -86dBm maximum

• 802.11a/g, 54Mbps: -72dBm maximum

• 802.11n, MCS07: -67dBm maximum

• 802.11n, MCS15: -64dBm maximum

• 802.11ac, MCS0: -84dBm maximum

• 802.11ac, MCS9: -59dBm maximum

•802.11ax, MCS11(HT40): -59dBm maximum

•802.11ax, MCS11(VHT160): -58.5dBm maximum

Antenna type

High efficiency antenna with spatial diversity, mounted in the display enclosure Two embedded dual band 2.4/5 GHz antennas are provided to the card to

QuickSpecs

HP EliteBook 850 G8 Notebook PC

Technical Specifications

c06969195 — DA16797 — Worldwide — Version 14 — June 22, 2021

Page 31

support WLAN MIMO communications and Bluetooth communications

Form Factor

PCI-Express M.2 MiniCard with CNVi Interface

Dimensions

1. Type 2230: 2.3 x 22.0 x 30.0 mm

2. Type 1216: 1.67 x 12.0 x 16.0 mm

Weight

1. Type 2230: 2.8 g

2. Type 126: 1.3 g

Operating Voltage

3.3v +/- 9%

Temperature

Operating Non-operating

14° to 158° F (–10° to 70° C) –40° to 176° F (–40° to 80° C)

Humidity

Operating Non-operating

10% to 90% (non-condensing) 5% to 95% (non-condensing)

Altitude

Operating Non-operating

0 to 10,000 ft (3,048 m) 0 to 50,000 ft (15,240 m)

LED Activity

LED Amber – Radio OFF LED Off – Radio ON

HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0/5.1 Wireless Technology

Bluetooth Specification

4.0/4.1/4.2/5.0/5.1 Compliant

Frequency Band

2402 to 2480 MHz

Number of Available Channels

Legacy: 0~79 (1 MHz/CH) BLE: 0~39 (2 MHz/CH)

Signaling Data Rate

Legacy: 3 Mbps signaling data rate1 2.17 Mbps BLE: 1 Mbps signaling data rate1 0.2 Mbps

1. Actual throughput may vary.

Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels

Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)

Transmit Power

The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of + 9.5 dBm for BR and EDR.

Power Consumption

Peak (Tx) 330 mW Peak (Rx) 230 mW Selective Suspend 17 mW

Bluetooth Software Supported Link Topology

Microsoft Windows Bluetooth Software

Power Management

Microsoft Windows ACPI, and USB Bus Support

Certifications

FCC (47 CFR) Part 15C, Section 15.247 & 15.249

Power Management Certifications

ETS 300 328, ETS 300 826 Low Voltage Directive IEC950 UL, CSA, and CE Mark

Bluetooth Software Supported

BT4.1-ESR 5/6/7 Compliance LE Link Layer Ping LE Dual Mode

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LE Link Layer LE Low Duty Cycle Directed Advertising LE L2CAP Connection Oriented Channels Train Nudging & Interlaced Scan BT4.2 ESR08 Compliance LE Secure Connection- Basic/Full LE Privacy 1.2 –Link Layer Privacy LE Privacy 1.2 –Extended Scanner Filter Policies LE Data Packet Length Extension FAX Profile (FAX) Basic Imaging Profile (BIP)2 Headset Profile (HSP) Hands Free Profile (HFP) Advanced Audio Distribution Profile (A2DP)

3. Check latest software/driver release for updates on supported security features.

4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for 802.11a/g (OFDM modulation).

Qualcomm® Snapdragon™ X55 5G Cat 20 1

Technology/ Operating bands

WCDMA/HSDPA/HSUPA/HSPA+ operating bands: Band 1: 1920 to 1980 MHz (UL), 2110 to 2170 MHz (DL) Band 2: 1850 to 1910 MHz (UL), 1930 to 1990 MHz (DL) Band 4: 1710 to 1755 MHz (UL), 2110 to 2155 MHz (DL) Band 5: 824 to 849 MHz (UL), 869 to 894 MHz (DL) Band 6: 830 to 840 MHz (UL), 875 to 885 MHz (DL) Band 8: 880 to 915 MHz (UL), 925 to 960 MHz (DL) Band 9: 1750 to 1785 MHz(UL), 1845to 1880 MHz (DL) Band 19: 830 to 845 MHz (UL), 875 to 890 MHz (DL) LTE FDD/TDD operating bands: Band 1: 1920 to 1980 MHz (UL), 2110 to 2170 MHz (DL) Band 2: 1850 to 1910 MHz (UL), 1930 to 1990 MHz (DL) Band 3: 1710 to 1785 MHz (UL), 1805 to 1880 MHz (DL) Band 4: 1710 to 1755 MHz (UL), 2110 to 2155 MHz (DL)

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Band 5: 824 to 849 MHz (UL), 869 to 894 MHz (DL) Band 7: 2500 to 2570 MHz (UL), 2620 to 2690 MHz (DL) Band 8: 880 to 915 MHz (UL), 925 to 960 MHz (DL) Band 12: 699 to 716 MHz (UL), 729 to 746 MHz (DL) Band 13: 777 to 787 MHz (UL), 746 to 756 MHz (DL) Band 14: 788 to 798 MHz (UL), 758 to 768 MHz (DL) Band 17: 704 to 716 MHz (UL), 734 to 746 MHz (DL) Band 18: 815 to 830 MHz (UL), 860 to 875 MHz (DL) Band 19: 830 to 845 MHz (UL), 875 to 890 MHz (DL) Band 20: 832 to 862 MHz (UL), 791 to 821 MHz (DL) Band 25: 1850 to 1915 MHz (UL), 1930 to 1995 MHz (DL) Band 26: 814 to 849 MHz (UL), 859 to 894 MHz (DL) Band 28: 703 to 748 MHz (UL), 758 to 803 MHz (DL) Band 29: 717 to 728 MHz (DL) Band 30: 2305 to 2315 MHz (UL) 2350 to 2360 MHz (DL) Band 32: 1452 to 1496 MHz (DL) Band 34: 2010 to 2025 MHz (UL/DL) Band 38: 2570 to 2620 MHz (UL/DL) Band 39: 1880 to 1920 MHz (UL/DL) Band 40: 2300 to 2400 MHz (UL/DL) Band 41: 2496 to 2690 MHz (UL/DL) Band 42: 3400 to 3600 MHZ (UL/DL) Band 46: 5150 to 5925 MHZ (DL) Band 48: 3550 to 3700 MHZ (UL/DL) Band 66: 1710 to 1800 MHz (UL), 2110 to 2200 MHz (DL) Band 71: 663 to 698 MHz (UL), 617 to 652 MHz (DL) 5GNR Sub 6GHZ n1: 1920 to 1980 MHz (UL), 2110 to 2170 MHz (DL) n2: 1850 to 1910 MHz (UL), 1930 to 1990 MHz (DL) n3: 1710 to 1785 MHz (UL), 1805 to 1880 MHz (DL) n5: 824 to 849 MHz (UL), 869 to 894 MHz (DL) n7: 2500 to 2570 MHz (UL), 2620 to 2690 MHz (DL) n8: 880 to 915 MHz (UL), 925 to 960 MHz (DL) n12: 699 to 716 MHz (UL), 729 to 746 MHz (DL) n20: 832 to 862 MHz (UL), 791 to 821 MHz (DL) n28: 703 to 748 MHz (UL), 758 to 803 MHz (DL) n41: 2496 to 2690 MHz (UL/DL) n66: 1710 to 1800 MHz (UL), 2110 to 2200 MHz (DL) n71: 663 to 698 MHz (UL), 617 to 652 MHz (DL) n77: 3300 to 4200 MHz (UL/DL) n78: 3300 to 3800 MHz (UL/DL) n79: 4400 to 5000 MHz (UL/DL)

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Wireless protocol standards

5GNR Air Interface l 3GPP Rel15 5G NR sub-6 LTE Rel14 20 layers and 2 Gbps downlink (DL) throughput – 4 × 4 MIMO across 5x CA 200 Mbps uplink (UL) throughput – 40 MHz ULCA and 256 QAM WCDMA R99, 3GPP Release 5, 6, 7 and 8 UMTS Specification

GPS

Standalone, A-GPS (MS-A, MS-B)

GPS bands

GPS: L1 (1575.42MHz); L5 (1176MHz) GLONASS: L1 (1602MHz) BeidouB1(1561.098MHz) Galileo E1 (1575.42); E5a (1176MHz)

Maximum data rates

5G sub 6G : 3.8 Gbps LTE: ue-CategoryDL 20, (DL : 2 Gbps ) ue-CategoryUL 13 , (UL: 150Mbps) DC-HSPA+: 42 Mbps (Download), 5.76 Mbps (Upload) HSPA+: 21Mbps (Download), 5.76 Mbps (Upload)

Maximum output power

LTE: 23 dBm in all band except B41 LTE B41 HPUE = 26dBm HSPA+: 23.5 dBm

Maximum power consumption

5G Sub 6 : 2500 mA LTE: 1,300 mA (peak); 1100 mA (average) HSPA+: 1,100 mA (peak); 800 mA (average)

Form Factor

M.2, 3042-S3 Key B

Weight

8 g

Dimensions (Length x Width x Thickness)

42 mm × 30 mm × 2.6 mm

1. 5G module is an optional feature that must be configured at purchase. AT&T and T-Mobile networks supported in the U.S. Module designed for 5G networks as carriers deploy Evolved-Universal Terrestrial Radio Access New Radio Dual Connectivity (ENDC) with both 100Mhz of 5G NR and LTE channel bandwidth, using 256QAM 4x4 as defined by 3GPP, requires activation and separately purchased service contract. Check with service provider for coverage and availability in your area. Connection, upload and download speeds will vary due to network, location, environment, network conditions, and other factors. 5G not available on all products, in all regions. Backwards compatible to 4G LTE and 3G HSPA technologies. 5G module planned to be available in select countries, where carrier supported.

Intel® XMM™ 7360 LTEAdvanced

Technology/Operating bands

FDD LTE: LTE: 2100 (Band 1), 1900 (Band 2), 1800 (Band 3) , 1700 (Band 4), 850 (Band 5), 2600 (Band 7), 900 (Band 8) , 1400 (Band 11), 700 (Band

12), 700 (Band 13) 700 (Band 17) , 850 (Band 18) , 850 (Band 19), 800 (Band 20), 1450 (Band

21) , 850 (Band 26) 700 (Band 28) MHz, 700 (Band 29) , 2300 (Band 30) , 2100 (Band 66) MHz TDD LTE: 2600 (Band 38) , 1900 (Band 39) , 2300 (Band 40) , 2500 (Band 41) MHz

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HP EliteBook 850 G8 Notebook PC

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HSPA+: 2100 (Band 1), 1900 (Band 2), 1700 (Band 4), 850 (Band 5), 900 (Band 8) MHz

Wireless protocol standards

3GPP Release 11 LTE Specification CAT.9, MAX 60MHz aggregation BW WCDMA R99, 3GPP Release 5, 6, 7 and 8 UMTS Specification

GPS

Standalone, A-GPS (MS-B and LTO)

GPS bands

GPS 1575.42 MHz ± 1.023 MHz, GLONASS 1596-1607MHz, Beidou

1561.098 ± 2.046 MHz

Maximum data rates

LTE: 450 Mbps (DL 3CA), 50 Mbps (Upload) DC-HSPA+: 42 Mbps (Download), 5.76 Mbps (Upload) HSPA+: 21Mbps (Download), 5.76 Mbps (Upload)

Maximum output power

LTE: 23 dBm HSPA+: 23.5 dBm

Maximum power consumption

LTE: 1,200 mA (peak); 900 mA (average) HSPA+: 1,100 mA (peak); 800 mA (average)

Form Factor

M.2, 3042-S3 Key B

Weight

6 g

Dimensions (Length x Width x Thickness)

42 x 30 x 2.3 mm

1. WWAN module is an optional feature, requires factory configuration and requires separately purchased service contract. Check with service provider for coverage and availability in your area. Connection speeds will vary due to location, environment, network conditions, and other factors. LTE not available on all products, in all regions.

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NXP NPC300 Near Field Communication Module

Dimensions (L x W x H)

Module 17 mm by 10 mm by 2.0 mm

Chipset

NPC300

System interface

I2C

NFC RF standards

ISO/IEC 14443 A ISO/IEC 14443 B ISO/IEC 15693 ISO/IEC 18092 ECMA-340 NFCIP-1 Target and Initiator ECMA-320 NFCIP-2

NFC Forum Support

Tag Type 1, Type 2, Type3 and Type 4, NFCIP-1 and NFCIP-2

Reader (PCD-VCD) Mode1

ISO/IEC 14443 A ISO/IEC 14443 B ISO/IEC 15693 MIFARE 1K MIFARE 4K MIFARE DESFire FeliCa Jewel and Topaz cards

Card Emulation (PICCVICC) Mode1

ISO/IEC 14443 A ISO/IEC 14443 B and B’ MIFARE FeliCa

Frequency

13.56 MHz

NFC Modes Supported

Reader/Writer, Peer-to-Peer

Raw RF Data Rates

106, 212, 424, 848 kbps

Operating temperature

-25°C to 80°C

Storage temperature

-25°C to 125°C

Humidity

10-90% operating 5-95% non-operating

Supply Operating voltage

2.7 to 5.5 Volts

I/O Voltage

1.8V or 3.3V

Power Consumption (Booster enable, VBAT=

3.3V, VCC_BOOST = 5V) Mode

Power Consumption, Typical2

Polling

710.93 mW

Detected Test Tag Type 1

152.09 mW

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Detected Test Tag Type 2

341.26 mW

Detected Test Tag Type 3

383.76 mW

Detected Test Tag Type 4

312.26 mW

Antenna

Antenna connector, 0.3mm pitch, 7 connector FPC. Antenna matching is external to module.

1. With application or UICC support

2. Actual Power Consumption is dependent on NFC antenna and matching circuit and on the particular polling sequence and period configured.

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POWER

AC Adapter 45 Watt Smart nPFC Standard Barrel 4.5mm Right Angle 1.8m

Dimensions

95x45x26.8mm

Weight

unit: 200g +/- 10g

Input

Input Efficiency

87.74 % at 115 Vac and 88.4 % at 230Vac

Input frequency range

47 ~ 63 Hz

Input AC current

Max. 1.4 A at 90 Vac

Output

Output power

45W

DC output

19.5V

Hold-up time

5ms at 115 Vac input

Output current limit

<8.0A

Connector

4.5mm Barrel Type

Environmental Design

Operating temperature

32oF to 95oF (0oto 35oC)

Non-operating (storage) temperature

-4oF to 185oF (-20oto 85oC)

Non-operating (storage) temperature

Altitude

0 to 16,400 ft (0 to 5000m)

Humidity

20% to 95%

Storage Humidity

10% to 95%

EMI and Safety Certifications

Eg: *CE Mark - full compliance with LVD and EMC directives * Worldwide safety standards - IEC60950, EN60950, UL60950, Class1, SELV; Agency approvals - C-UL-US, NORDICS, DENAN, EN55022 Class B, FCC Class B, CISPR22 Class B, CCC, NOM-1 NYCE. * MTBF - over 200,000 hours at 25°C ambient condition.

AC Adapter 45 Watt Smart nPFC Standard Barrel 4.5mm Right Angle 1.8m 2prong

Dimensions

95x45x26.8mm

Weight

unit: 200g +/- 10g

Input

Input Efficiency

87.74 % at 115 Vac and 88.4 % at 230Vac

Input frequency range

47 ~ 63 Hz

Input AC current

Max. 1.4 A at 90 Vac

Output

Output power

45W

DC output

19.5V

Hold-up time

5ms at 115 Vac input

Output current limit

<8.0A

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HP EliteBook 850 G8 Notebook PC

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Connector

4.5mm Barrel Type

Environmental Design

Operating temperature

32oF to 95oF (0oto 35oC)

Non-operating (storage) temperature

-4oF to 185oF (-20oto 85oC)

Non-operating (storage) temperature

Altitude

0 to 16,400 ft (0 to 5000m)

Humidity

20% to 95%

Storage Humidity

10% to 95%

EMI and Safety Certifications

AC Adapter 65 Watt nPFC Slim USB type C Straight 1.8m

Dimensions

88x53.5x21mm

Weight

unit: 220g +/- 10g

Input

Input Efficiency

81.5% min at 115 Vac/ 230Vac @ 5V/3A

86.7% min at 115 Vac/ 230Vac @ 9V/3A 88% min at 115 Vac/ 230Vac @ 12V/5A 89% min at 115 Vac/ 230Vac @ 15V/4.33A 89% min at 115 Vac/ 230Vac @ 20V/3.25A

Input frequency range

47 ~ 63 Hz

Input AC current

1.6 A at 90 VAC and maximum load

Output

Output power

65W

DC output

5V/9V/12V/15V/20V

Hold-up time

5ms at 115 Vac input

Output current limit

<8.0A

Connector

USB Type C

Environmental Design

Operating temperature

32oFto 95oF (0oto 35oC)

Non-operating (storage) temperature

-4oFto 185oF (-20oto 85oC)

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Non-operating (storage) temperature

Altitude

0 to 16,400 ft (0 to 5000m)

Humidity

5% to 95%

Storage Humidity

5% to 95%

EMI and Safety Certifications

AC Adapter 65 Watt nPFC Standard USB type C Straight 1.8m

Dimensions

90.0x51x28.5mm

Weight

unit: 250g +/- 10g

Input

Input Efficiency

81.5% min at 115 Vac/ 230Vac @ 5V/3A

86.7% min at 115 Vac/ 230Vac @ 9V/3A 88% min at 115 Vac/ 230Vac @ 12V/5A 89% min at 115 Vac/ 230Vac @ 15V/4.33A 89% min at 115 Vac/ 230Vac @ 20V/3.25A

Input frequency range

47 ~ 63 Hz

Input AC current

1.6 A at 90 VAC and maximum load

Output

Output power

65W

DC output

5V/9V/12V/15V/20V

Hold-up time

5ms at 115 Vac input

Output current limit

8.0A Max.

Connector

USB TYPE C

Environmental Design

Operating temperature

32°F to 95°F (0°to 35°C)

Non-operating (storage) temperature

-4°F to 185°F (-20°to 85°C)

Non-operating (storage) temperature

Altitude

0 to 16,400 ft (0 to 5000m)

Humidity

20% to 95%

Storage Humidity

10% to 95%

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HP EliteBook 850 G8 Notebook PC

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EMI and Safety Certifications

- CE Mark - full compliance with LVD and EMC directives

- Worldwide safety standards -IEC60950, EN60950, UL60950, UL62368, Class1, SELV; Agency approvals - C-UL-US, NORDICS, DENAN, EN55022 Class B, FCC Class B, CISPR22 Class B, CCC, NOM-1 NYCE.

- MTBF - over 200,000 hours at 25°C ambient condition.

AC Adapter 65 Watt Smart nPFC EM Barrel

4.5mm New EM

Dimensions

102x55x30mm

Weight

unit: 250g +/- 10g

Input

Input Efficiency

88.0 % at 115 Vac and 89.0 % at 230Vac

Input frequency range

47 ~ 63 Hz

Input AC current

Max. 1.7 A at 90 Vac

Output

Output power

65W

DC output

19.5V

Hold-up time

5ms at 115 Vac input

Output current limit

<11.0A

Connector

4.5mm Barrel Type

Environmental Design

Operating temperature

32oF to 95oF (0oto 35oC)

Non-operating (storage) temperature

-4oF to 185oF (-20oto 85oC)

Non-operating (storage) temperature

Altitude

0 to 16,400 ft (0 to 5000m)

Humidity

20% to 95%

Storage Humidity

10% to 95%

EMI and Safety Certifications

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HP EliteBook 850 G8 Notebook PC

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AC Adapter 65 Watt Smart nPFC Standard Barrel 4.5mm Right Angle 1.8m

Dimensions

90x51x28.5mm

Weight

unit: 230g +/- 10g

Input

Input Efficiency

88.0 % at 115 Vac and 89.0 % at 230Vac

Input frequency range

47 ~ 63 Hz

Input AC current

Max. 1.7 A at 90 Vac

Output

Output power

65W

DC output

19.5V

Hold-up time

5ms at 115 Vac input

Output current limit

<11.0A

Connector

4.5mm Barrel Type

Environmental Design

Operating temperature

32oF to 95oF (0oto 35oC)

Non-operating (storage) temperature

-4oF to 185oF (-20oto 85oC)

Non-operating (storage) temperature

Altitude

0 to 16,400 ft (0 to 5000m)

Humidity

20% to 95%

Storage Humidity

10% to 95%

EMI and Safety Certifications

Battery CC 3 Cell 56 Wh Long Life -PL Fast Charge

Dimensions (H x W x L)

7.0 x 66.5 x 276.3 (0.275 x 2.618 x 10.877 inch)

Weight

0.215 kg (0.47 lb)

Cells/Type

3cell Lithium-Ion Polymer cell / 615383

Energy

Voltage

11.55V

Amp-hour capacity

4.85Ah

Watt-hour capacity1

56 Wh

Temperature

32˚ to 113˚ F (0˚ to 45˚ C)

Operating (Charging)

32˚ to 122˚ F (0˚ to 50˚ C)

Operating (Discharging)

14˚ to 140˚ F (-10˚ to 60˚ C)

Fuel Gauge LED

N/A

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HP EliteBook 850 G8 Notebook PC

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Warranty

Depends on system offering

Optional Travel Battery Available

1. Actual battery Watt-hours (Wh) will vary from design capacity. Battery capacity will naturally decrease with shelf life, time, usage, environment, temperature, system configuration, loaded apps, features, power management settings and other factors.

Fingerprint Reader

Model Synaptics Validity VFS7552 touch sensor

Mobile Voltage Operation

3.0V to 3.6V

Operating Temperature 14° – 167°F (-10°-75°C)

Current Consumption Image 36mA peak

Low Latency Wait For Finger 950 uA

Capture Rate 30 cm/sec

ESD Resistance IEC 61000-4-2 4B (+15KV)

Detection Matrix 200*1 (Plus another secondary line) / 508 dpi / 10mm sensor area

FRR (False Reject Rate) / FAR (False Acceptance Rate) FRR ~ 1% @ 1:50K FAR

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ENVIRONMENTAL DATA

Eco-Label Certifications & declarations

This product has received or is in the process of being certified to the following approvals and may be labeled with one or more of these marks:

• IT ECO declaration

• US ENERGY STAR®

• US Federal Energy Management Program (FEMP)

• EPEAT Gold registered in the United States. See http://www.epeat.net for registration

status in your country.

• TCO Certified

• China Energy Conservation Program (CECP)

• China State Environmental Protection Administration (SEPA)

• Taiwan Green Mark

• Korea Eco-label

• Japan PC Green label*

Sustainable Impact Specifications

• Ocean-bound plastic in Speaker Box

• 35% post-consumer recycled plastic

• External Power Supply 90% Efficiency

• Low halogen

• Outside Box and corrugated cushions are 100% sustainably sourced and recyclable

• Molded Paper Pulp Cushion inside box is 100% sustainably sourced and recyclable

• Bulk packaging available

System Configuration

The configuration used for the Energy Consumption and Declared Noise Emissions data for the Notebook model is based on a “Typically Configured Notebook”.

Energy Consumption (in accordance with US ENERGY STAR® test method)

115VAC, 60Hz

230VAC, 50Hz

100VAC, 50Hz

Normal Operation (Sort idle)

7.69 W

7.52 W

7.69 W

Normal Operation (Long idle)

1.53 W

1.38 W

1.37 W

Sleep

1.53 W

1.38 W

1.37 W

Off

0.38 W

0.41 W

0.3 W

NOTE: Energy efficiency data listed is for an ENERGY STAR® compliant product if offered within the model family. HP computers marked with the ENERGY STAR® Logo are compliant with the applicable U.S. Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model family does not offer ENERGY STAR® compliant configurations, then energy efficiency data listed is for a typically configured PC featuring a hard disk drive, a high efficiency power supply, and a Microsoft Windows® operating system.

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Heat Dissipation*

115VAC, 60Hz

230VAC, 50Hz

100VAC, 50Hz

Normal Operation (Short idle)

24.1 BTU/hr

23.6 BTU/hr

24.1 BTU/hr

Normal Operation (Long idle)

4.8 BTU/hr

4.3 BTU/hr

Sleep

4.8 BTU/hr

4.3 BTU/hr

Off

1.2 BTU/hr

1.3 BTU/hr

1 BTU/hr

*NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour.

Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296)

Sound Power

WAd

, bels)

Sound Pressure

pAm

, decibels)

Typically Configured – Idle

2.5

23.6

Fixed Disk – Random writes

3.5

27.5

Optical Drive – Sequential reads

4.1

31.8

Longevity and Upgrading

This product can be upgraded, possibly extending its useful life by several years. Upgradeable features and/or components contained in the spare parts are available throughout the warranty period and or for up to “5” years after the end of production.

Additional Information

• This product is in compliance with the Restrictions of Hazardous Substances (RoHS)

directive - 2011/65/EC.

• This HP product is designed to comply with the Waste Electrical and Electronic Equipment

(WEEE) Directive – 2002/96/EC.

• This product is in compliance with California Proposition 65 (State of California; Safe

Drinking Water and Toxic Enforcement Act of 1986).

• This product is in compliance with the IEEE 1680 (EPEAT) standard at the Gold level, see

http://www.epeat.net

• Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and

ISO1043.

Packaging Materials

External:

PAPER/Corrugated

345 g

Internal:

PLASTIC/Polypropylene-PP

4 g

PLASTIC/Polyethylene low density

15 g

PAPER/Molded pulp

189 g

The plastic packaging material contains at least 0% recycled content.

The corrugated paper packaging materials contains at least 59.1% recycled content.

RoHS Compliance

HP Inc. complies fully with materials regulations. We were among the first companies to extend the restrictions in the European Union (EU) Restriction of Hazardous Substances (RoHS) Directive to our

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products worldwide through the HP GSE. HP has contributed to the development of related legislation in Europe, as well as China, India, and Vietnam. We believe the RoHS directive and similar laws play an important role in promoting industry-wide elimination of substances of concern. We have supported the inclusion of additional substances— including PVC, BFRs, and certain phthalates—in future RoHS legislation that pertains to electrical and electronics products. We met our voluntary objective to achieve worldwide compliance with the new EU RoHS requirements for virtually all relevant products by July 2013, and we will continue to extend the scope of the commitment to include further restricted substances as regulations continue to evolve. To obtain a copy of the HP RoHS Compliance Statement, see HP RoHS position statement.

Material Usage

This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for the Environment at

http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/gen_specifications.html):

• Asbestos

• Certain Azo Colorants

• Certain Brominated Flame Retardants – may not be used as flame retardants in plastics

• Cadmium

• Chlorinated Hydrocarbons

• Chlorinated Paraffins

• Bis(2-Ethylhexyl) phthalate (DEHP)

• Benzyl butyl phthalate (BBP)

• Dibutyl phthalate (DBP)

• Diisobutyl phthalate (DIBP)

• Formaldehyde

• Halogenated Diphenyl Methanes

• Lead carbonates and sulfates

• Lead and Lead compounds

• Mercuric Oxide Batteries

• Nickel – finishes must not be used on the external surface designed to be frequently

handled or carried by the user.

• Ozone Depleting Substances

• Polybrominated Biphenyls (PBBs)

• Polybrominated Biphenyl Ethers (PBBEs)

• Polybrominated Biphenyl Oxides (PBBOs)

• Polychlorinated Biphenyl (PCB)

• Polychlorinated Terphenyls (PCT)

• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has

been voluntarily removed from most applications.

• Radioactive Substances

• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

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HP EliteBook 850 G8 Notebook PC

Technical Specifications

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Packaging Usage

HP follows these guidelines to decrease the environmental impact of product packaging:

• Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in

packaging materials.

• Eliminate the use of ozone-depleting substances (ODS) in packaging materials.

• Design packaging materials for ease of disassembly.

• Maximize the use of post-consumer recycled content materials in packaging materials.

• Use readily recyclable packaging materials such as paper and corrugated materials.

• Reduce size and weight of packages to improve transportation fuel efficiency.

• Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.

End-of-life Management and Recycling

HP offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner.

The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the HP web site at: http://www.hp.com/go/recyclers. These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who integrate and re-sell HP equipment.

HP, Inc. Corporate Environmental Information

For more information about HP’s commitment to the environment:

Global Citizenship Report

http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html

Eco-label certifications

http://www8.hp.com/us/en/hp-information/environment/ecolabels.html

ISO 14001 certificates:

http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=c04755842

and

http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf

footnotes

• Percentage of ocean-bound plastic contained in each component varies by product

• Recycled plastic content percentage is based on the definition set in the IEEE 1680.1-2018

standard.

• External power supplies, WWAN modules, power cords, cables and peripherals excluded.

• 100% outer box packaging and corrugated cushions made from sustainably sourced

certified and recycled fibers.

• Fiber cushions made from 100% recycled wood fiber and organic materials.

QuickSpecs

HP EliteBook 850 G8 Notebook PC

Technical Specifications

c06969195 — DA16797 — Worldwide — Version 14 — June 22, 2021

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COUNTRY OF ORIGIN

China

QuickSpecs

HP EliteBook 850 G8 Notebook PC

Options and Accessories (sold separately and availability may vary by country)

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HP EliteBook 850 G8 Notebook PC

Summary of Changes

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Date of change:

Version History:

Description of change:

December 11, 2021

V1 to V2

Updated

Ports, Battery Life

January 27, 2021

V2 to V3

Updated

USB ports to new industry standards.

February 4, 2021

V3 to V4

Added

Processors, WPA3 certification

February 8, 2021

V4 to V5

Updated

Smart Card Reader

February 10, 2021

V5 to V6

Updated

Environmental Data

February 17, 2021

V6 to V7

Update

Processor section

March 9, 2021

V7 to V8

Update

Audio and Multimedia section

April 16, 2021

V8 to V9

Update

Graphics Disclaimer/Options and Accessories

April 23, 2021

V9 to V10

Added

BIOS information in Software section

April 27, 2021

V10 to V11

Update

Graphics section/TPM 2.0 update

May 6, 2021

V11 to V12

Removed

Processors base frequency/Added HP Smart Support

May 27, 2021

V12 to V13

Update

HP Pro Security Edition to HP Wolf Pro Security Edition

June 22, 2021

V13 to V14

Removed

HP Thunderbolt Dock 230W G2 and HP WorkWell from Software section/Added Environmental Data

Copyright © 2021 HP Development Company, L.P. The only warranties for HP products are set forth in the express limited warranty statements accompanying such products. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

Intel, Core and Intel vPro are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and

other countries. DisplayPort™ and the DisplayPort™ logo are trademarks owned by the Video Electronics Standards Association

(VESA®) in the United States and other countries. USB Type-C® and USB-C® are trademarks of USB Implementers Forum. ENERGY STAR is a registered trademark of the U.S. Environmental Protection Agency. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries.

HP EliteBook 850 User manual

Specifications and Main Features

Frequently Asked Questions

User Manual

QuickSpecs

HP EliteBook 850 G8 Notebook PC