HP Desktop Pro A G2 MT Disassembly Instructions Manual
EL-MF877-00
Template Revision C
Page 1
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP Desktop Pro A G2 MT
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU
directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking
code on the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button
style batteries
1
Li-Ion batteries. Include all Li-Ion batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, RTC coin
cell, etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[ ] screws
[X] snaps
[ ] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
PSU
1
External electrical cables and cords
DC Cable for External Power Supply
1
Gas Discharge Lamps
1.0 Items Requiring Selective Treatment
EL-MF877-00
Template Revision C
Page 2
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Item Description
Notes
Quantity
of items
included
in product
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Hexagon Screw Driver
T-15
Electric Iron
QUICK 310
Crisscross Screw Driver
PH1
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Remove access panel (Step1-2)
2. Disconnect ODD/ HDD power cable and ODD/ HDD SATA cable from ODD (Step3~Step4)
3. Remove ODD/ HDD from chassis (Step5~Step9)
4. Remove all cables and heat sink from MB (Step10~Step14)
5. Remove the Memory/ CPU/ WLAN/Battery from MB (Step15~Step19)
6. Remove MB from chassis (Step20-21)
7. Remove antenna from chassis(Step22)
8. PSU from chassis (Step23~Step25)
9. Separate PSU and remove the Electrolytic Capacitors (Step 26~Step30)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision C
Page 3
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step1 Use T-15 screwdriver to Loose thumb screw and remove
access panel.
Step2 Remove front bezel from chassis
Step3 Disconnect ODD power cable and
ODD SATA cable from ODD.
Step4 Disconnect HDD power cable and
HDD SATA cable from HDD.
Step5 Use T-15 screwdriver to Loose screw
Step6 Press the ODD’s latch on ODD cage
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