HIT 2SK3070-S, 2SK3070-L Datasheet

2SK3070(L),2SK3070(S)
Silicon N Channel MOS FET High Speed Power Switching
ADE-208-684G (Z)
8th. Edition
February 1999
Features
R
DS(on)
= 4.5 m typ.
Low drive current
4 V gate drive device can be driven from 5 V source
Outline
1. Gate
2. Drain
3. Source
4. Drain
1
2
3
4
1
2
3
4
LDPAK
G
D
S
Datasheet Title
2
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V
DSS
40 V
Gate to source voltage V
GSS
±20 V
Drain current I
D
75 A
Drain peak current I
D(pulse)
Note
1
300 A
Body-drain diode reverse drain current I
DR
75 A
Avalanche current IAP
Note
3
50 A
Avalanche energy EAR
Note
3
333 mJ
Channel dissipation Pch
Note
2
100 W Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Note: 1. PW 10 µs, duty cycle 1%
2. Value at Tc = 25°C
3. Value at Tch = 25°C, Rg 50
Datasheet Title
3
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V
(BR)DSS
40——V I
D
= 10 mA, VGS = 0
Gate to source leak current I
GSS
——±0.1 µAVGS = ±20 V, VDS = 0
Zero gate voltege drain current I
DSS
——10µAVDS = 40 V, VGS = 0
Gate to source cutoff voltage V
GS(off)
1.0 2.5 V ID = 1 mA, VDS = 10 V
Note
1
Static drain to source on state R
DS(on)
4.5 5.8 m ID = 40 A, VGS = 10 V
Note
1
resistance 6.5 10 m ID = 40 A, VGS = 4 V
Note
1
Forward transfer admittance |yfs|5080—S I
D
= 40 A, VDS = 10 V
Note
1
Input capacitance Ciss 6800 pF VDS = 10 V Output capacitance Coss 1300 pF VGS = 0 Reverse transfer capacitance Crss 380 pF f = 1 MHz Total gate charge Qg 130 nc VDD = 25 V Gate to source charge Qgs 25 nc VGS = 10 V Gate to drain charge Qgd 30 nc ID = 75 A Turn-on delay time t
d(on)
60 ns VGS = 10 V, ID = 40 A
Rise time t
r
300 ns RL = 0.75
Turn-off delay time t
d(off)
550 ns
Fall time t
f
400 ns
Body–drain diode forward voltage V
DF
1.05 V IF = 75 A, VGS = 0
Body–drain diode reverse recovery time
t
rr
90 ns IF = 75 A, VGS = 0
diF/ dt = 50 A/ µs
Note: 1. Pulse test
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