Hewlett Packard X4X19AT Product Data Sheet

QuickSpecs

HP t630 Thin Client

Overview

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Page 1

HP t630 Thin Client

FRONT

BACK

1.

Power button (with integrated power indicator)

1.

RJ45 network interface connector

2.

Flash memory activity indicator

2.

PS/2 ports for keyboard and mouse

3.

(2) Hi-Speed USB 2.0 ports

3.

Serial port

4.

(2) SuperSpeed USB 3.0 ports

4.

(2) DisplayPort™ 1.2 video outputs

5.

3.5 mm headset port

5.

(2) Hi-Speed USB 2.0 ports

6.

System stand

6.

3.5 mm audio line-out/line-in port

7.

Optional I/O Port (can be configured as: VGA output, 2nd
serial port, external antenna or Fiber NIC interface)

8.

+19V DC power input

INTERNAL

9.

Retractable power cord retention hook

(1) SuperSpeed USB 3.0 port secured inside chassis

10.

Rear I/O cover removal latch

11.

Cable lock slot

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AT A GLANCE

 AMD GX-420GI SOC; 2.0 - 2.2 GHz quad-core with a Radeon R6E based graphics core
 DDR4 dual-channel SDRAM system memory; up to 1,866 MT/s transfer rate; two SODIMM slots; up to 32 GB supported

1

 (2) DisplayPort™ 1.2 video outputs supporting up to Ultra High Definition (UHD)/4K (3840 x 2160) resolutions
 Solid-state flash memory storage; M.2 form factor modules; support for up to 2 modules for maximum local storage

capacity and data management

 Active thermal management technology monitors component operating temperatures, throttles SOC operation if

appropriate, and prevents unit thermal shutdown

 Gigabit Ethernet (GbE) network connection supported via an integrated Realtek GbE NIC module
 Optional Allied Telesis Fiber Optic NICs; Fast Ethernet (100 Mb/s) or Gigabit (1,000 Mb/s)
 Optional Wi-Fi/Bluetooth® adapters including antennas integrated internally in the chassis

NOTE: Fiber optic and Wi-Fi NIC options cannot be supported together2

 (2) SuperSpeed USB 3.0 and (2) Hi-Speed USB 2.0 on front, (2) Hi-Speed USB 2.0 on rear and (1) SuperSpeed USB 3.0 inside

the chassis.

 Legacy ports include PS/2 keyboard and mouse, up to (2) serial ports and up to (1) VGA video output
 Integrated PC speaker for basic audio playback; 3.5 mm headset audio port on front and 3.5 mm audio port on rear that can

be configured as line in or line out supporting headphones, external speaker systems, or microphone

 TCG certified Trusted Platform Module (TPM) chipset; version 1.2 with HP ThinPro/Smart Zero Core and Windows Embedded

Standard 7E models, version 2.0 with Windows 10 IoT Enterprise models; other security features include a system BIOS
designed to address NIST SP 800-147 guidelines, cable lock slot, and power cord retention clip to prevent accidental
disconnects; (1) internal SuperSpeed USB 3.0 port for securing USB flash drives inside the chassis

 ENERGY STAR® certified and EPEAT® Gold registered in the United States (except for some models configured with Fiber

Optic NIC networking options). See http://www.epeat.net for registration status in other countries

 Post-consumer recycled plastics content greater than 25% total unit plastics (by weight)
 Low halogen

3

material content

 All models TAA compliant (in North America & EMEA); TAA models available in APJ by request

1

If configured with a Windows Embedded 32-bit operating system, memory above 3.2 GB may not be available due to operating system

limitations

2

Wireless access point and Internet access is required; availability of public wireless access points is limited

3

This product is low halogen except for power cords, cables and peripherals, as well as the optional Fiber Optic NIC module; service parts

obtained aftermarket may not be low halogen

Warranty

HP Customer Support: limited three-year hardware limited warranty in most regions; HP Care Packs are extended service contracts
that go beyond your standard limited warranties; for more details visit http://www.hp.com/go/cpc

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OPERATING SYSTEMS

HP Smart Zero Core
HP ThinPro
Windows Embedded Standard 7E
Windows 10 IoT Enterprise

PROCESSOR

Model

CPU Frequency

Max/Base

Cores

GPU CUs

TDP

L2 Cache

GPU

Memory

AMD GX-420GI

2.2/2.0 GHz

4 6 16.1 W

2 MB

626 MHz

DDR4

GRAPHICS

Number of displays supported:

2

Video outputs:

(2) DisplayPort™ 1.2 (standard)
(1) VGA (optional)

NOTE: adding the optional VGA output does not increase the number of displays supported.

Maximum screen resolution:

Supports 2 displays at 3840 x 2160 @ 60 Hz via the standard DisplayPort™ outputs
Supports 1 display at1920 x 1200 @ 60 Hz via the optional VGA output

NOTES:

 The system should be configured with dual channel memory (two SODIMMs) for optimal display

resolution performance

 Dual channel memory (two SODIMMs) is required to achieve maximum resolution on dual UHD

displays

MEMORY

Type:

DDR4 dual channel SDRAM

Data Transfer Rate:

Up to 1,866 MT/s

Peak Transfer Rate:

14,933 MB/s

Number of Slots

2 x SODIMM

Capacities:

4, 8, 16 and 32 GB

NOTE: WES 7E is a 32-bit operating system and only recognizes up to 3.2GB RAM

Reserved for Graphics:

256 MB, 512 MB (default) or 1 GB

NOTE: The system’s Graphics Processing Unit (GPU) uses part of the total system memory. System memory dedicated to graphics performance is
not available for use by other programs

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BIOS

UEFI Specification Revision

2.3.1

Trusted Platform Module (TPM)

Meets requirements for Common Criteria, an independent third-party certification of
trustworthiness

Meets requirements for FIPS 140-2, a standard for cryptographic integrity

TPM 1.2

HP ThinPro/Smart Zero Core and Windows Embedded Standard 7E models

TPM 2.0

Windows 10 IoT Enterprise and No OS models

Security features

System BIOS designed to address NIST SP 800-147 guidelines

Other BIOS details

See t630 Thin Client Troubleshooting Guide

STORAGE

Type:

NAND flash memory; non-volatile

Number of Sockets:

(2) M.2 designated as primary and secondary

Capacities:

Primary storage options:

 No OS, Smart Zero & ThinPro = 8, 16, 32, 64 and 128 GB
 WES 7E-32bit = 16, 32, 64 and 128 GB
 Win 10 IoT-64 bit = 32, 64 and 128 GB

NOTE: The primary socket supports M.2 flash up to size 2280 modules; the secondary socket
accommodates up to size 2242 modules. The highest capacity offered in the secondary slot is 64 GB.

Secondary storage options:

 All configurations = 8, 16, 32 & 64 GB
 WES 7E-32bit restrictions for factory = The secondary drive must be equal to or

greater than the capacity of the primary drive.

NOTE: Secondary SSD capacity restrictions are for factory only. Therefore, customer may change
secondary storage to any capacity desired after received from factory.

Solid-state flash-based memory modules are the primary operating system storage media for thin clients supporting highly
virtualized operating environments. Thin clients display a hosted session from a data center through standard IP networks which
minimizes the required size of local flash-based storage. In a traditional thin client environment, data and application files are
stored securely in the remote data center and not on the local storage device.

The HP t630 Thin Client uses three types of flash memory: MLC (2-bits per cell), Ultra MLC (2-bits per cell, but only 1 is utilized) and
TLC (3-bits per cell). Because the classic thin client use cases seldom require writing to flash memory storage, a relatively low
capacity MLC flash memory module is typically used to provide the best cost and performance. However, when the use case calls
for writing to the local flash memory storage module careful consideration should be given to the selection of the proper storage
module. A larger capacity and/or the use of Ultra MLC technology could be required to adequately support the usage being planned
or expected from the thin client.

Flash Memory Specification

MLC (Multi-level Cell)

UMLC (Ultra MLC)

TLC (Triple-level Cell)

Bits per cell 2 2 (only 1 is used)

3

Terabytes Written (TBW) *

5 TBW* – 8GB
10 TBW* – 16GB
20 TBW* – 32GB

50 TBW* – 16GB

100 TBW* – 32GB

70 TBW* - 128GB

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* Terabytes Written (TBW) calculated based on JESD-219 SSD Client workload

Input/Output

USB Interfaces:

(2) Hi-Speed USB 2.0 (front access)
(2) Hi-Speed USB 2.0 (rear access)
(2) SuperSpeed USB 3.0 (front access)
(1) SuperSpeed USB 3.0 (inside chassis)

Video Outputs:

(2) DisplayPort™ 1.2 digital outputs (standard)
(1) VGA analog output (optional)

NOTE: the optional VGA output does not increase the number of displays supported.

I/O Interfaces:

(2) PS/2 keyboard/mouse ports
(1) RJ45 network interface connector
(1) Serial port (standard): can be configured to produce 5V of power
(1) 2nd Serial port (optional)

Audio

(1) 3.5 mm headset port (front)
(1) 3.5 mm audio combo line-out/ line-in port (rear)

NOTE: a single position at the back of the system is utilized for one of four optional outputs. One of the
following can be configured to any system:

 Optional VGA video output
 Optional 2

nd

serial port

 Optional Fiber Optic NIC interface
 Optional external Wi-Fi antenna

AUDIO/VIDEO

Audio Subsystem

 Internal amplified speaker system for basic audio playback
 3.5 mm headset socket (front access)
 3.5 mm combo line-out/ line-in socket (rear access)

Audio CODECs

 MP3
 AAC Stereo
 HE AAC
 Includes hardware acceleration support

Video CODECs

 MPEG-4 part 2 (DivX, Xvid)
 MPEG-4 part 10 (H.264, AVC)
 WMV 7/8/9 VC-1 & ASF Demuxer
 Includes hardware acceleration support

HARDWARE SECURITY

 Security lock slot (cable lock sold separately)
 Power cord retention clip
 Internal SuperSpeed USB 3.0 port
 Trusted Platform Module (version 1.2 or 2.0 depending upon the model’s configured operating system)

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NETWORKING

Hardware Networking:

 Realtek Gigabit Ethernet
 Wake on LAN (WOL)
 PXE
 TCP/IP with DNS and DHCP
 Secure Socket Tunneling Protocol (SSTP); supported with Windows OS

Wi-Fi Networking*

 Intel® Dual Band Wireless-AC 3168 Wi-Fi/Bluetooth® combo adapter

 Intel® Dual Band Wireless-AC 8260 Wi-Fi/Bluetooth® combo adapter

*Wireless access point and internet access required. Availability of public wireless access points limited.

FIBER OPTIC NETWORKING

Adapter Option:

Allied Telesis AT-27M2/SC Fiber Fast Ethernet Network Interface

Form Factor:

M.2

Connector:

SC; compliant with IEC 61754-4

Features:

 IEEE 802.1p priority encoding/tagging (QoS, CoS)
 IEEE 802.1q VLAN tagging
 IEEE 802.3x flow control
 Buffer/FIFO: 2K transmit and 2K receive
 Loopback mode
 Descriptor-Based Buffer Management
 Wake-on-LAN from S3 (Sleep) and S4 (Hibernate) not supported
 Link Detection and PHY interface power; the PHY interface, Link detection and Link LED

should be enabled by default at power-up

Performance:

 >= 85 Mbit/s receive, <= 30% CPU utilization
 >= 85 Mbit/s transmit, <= 30% CPU utilization
 >= 170 Mbit/s total bi-directional, <= 30% C:U utilization

The minimum transfer size at 100 Mbit/s is 1 Gbps

External Interface:

Complies with IEEE 802.3 1000BASE-X operation

Power:

 Uses less than 1775 mW of power at full performance
 Supports all PCI Express bus states L0, L0s, L1 and L2

Non-volatile Storage:

The MAC address is unique for each system; assigned from the board assembly manufacturer’s

IEEE registered allocation.

The PCI subsystem ID is unique to HP and unique to each design to allow Windows Update to
be finely controlled.

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Adapter Option:

Allied Telesis AT-29M2/SC or AT-29M2/LC Fiber Gigabit Network Interface

Form Factor:

M.2

Connector:

SC; compliant with IEC 61754-4

Features:

 IEEE 802.1p priority encoding/tagging (QoS, CoS)
 IEEE 802.1Q VLAN tagging
 IEEE 802.3x flow control
 Buffer/FIFO: 22K transmit and 40K receive
 Loopback mode
 Descriptor-Based Buffer Management
 Wake-on-LAN from S3 (Sleep) and S4 (Hibernate) not supported
 Link Detection and PHY interface power; the PHY interface, Link detection and Link LED

should be enabled by default at power-up

Performance:

 >= 800 Mbit/s receive, <= 30% CPU utilization
 >= 800 Mbit/s transmit, <= 30% CPU utilization
 >= 1500 Mbit/s total bi-directional, <= 30% C:U utilization

The minimum transfer size at 1000 Mbit/s is 1500 Gbps

External Interface:

Complies with IEEE 802.3 1000BASE-X operation

Power:

 Uses less than 2100 mW of power at full performance
 Supports all PCI Express bus states L0, L0s, L1 and L2

Non-volatile Storage:

The MAC address is unique for each system; assigned from the board assembly
manufacturer’s IEEE registered allocation.

The PCI subsystem ID is unique to HP and unique to each design to allow Windows Update to
be finely controlled.

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SOFTWARE SUPPORT

Host Environment

Protocol

HP

Microsoft Windows Embedded

ThinPro

Smart Zero Core

WES 7E

WIN 10 IoT

Microsoft Remote
Desktop Services

Remote FX (RFX), RDP

Citrix®

ICA, HDX

VMware® Horizon

RDP, PCoIP

Protocol Clients

HP

Microsoft Windows Embedded

ThinPro

Smart Zero Core

WES 7E

WIN10 IoT

Citrix® Receiver

Microsoft Remote Desktop Client

N/A

VMware™ Horizon View™ Client

HP Remote Graphics Software (RGS)

via add-on

HP TeemTalk Terminal Emulator

via add-on

via add-on

Free RDP N/A

N/A

Browser Support

HP

Microsoft Windows Embedded

ThinPro

Smart Zero Core

WES 7E

WIN10 IoT

Mozilla Firefox

36

N/A

N/A

Internet Explorer

N/A

11

11

Security

HP

Microsoft Windows Embedded

ThinPro

Smart Zero Core

WES 7E

WIN10 IoT

Smart Card

Log-on Manager

Read only Operating System

802.1x

Operating System Write Filter

N/A

EWF, FBWF

UWF

Microsoft Firewall

N/A

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Management Tools

HP

Microsoft Windows Embedded

ThinPro

Smart Zero Core

WES 7E

WIN10 IoT

HP Device Manager

HP ThinUpdate

N/A

HP Easy Tools

via add-on

N/A

HP Smart Zero Client Services

N/A

N/A

Microsoft SCCM/EDM agent

N/A

Additional Components
HP

Microsoft Windows Embedded

ThinPro

Smart Zero Core

WES 7E

WIN10 IoT

HP Velocity

HP Easy Shell

N/A

HP Universal Print Driver

N/A

Windows Media Player

N/A

12

12

Microsoft Direct Access

N/A

N/A

Microsoft BranchCache

N/A

N/A

Microsoft AppLocker

N/A

N/A

Microsoft Sideloading

N/A

N/A

NOTE: Other add-on software available (see: http://www.hp.com/support for latest list of available add-ons). Software performance and

support may vary depending on customer environment and backend.

Audio/Video CODECs

HP

Microsoft Windows Embedded

ThinPro

Smart Zero Core

WES 7E

WIN 10 IoT

MP3

WMA stereo

AAC stereo & HE AAC

N/A

N/A

Microsoft AC3 encoder

N/A

MPEG-1 N/A

N/A

MPEG-4 part 2 (DivX, Xvid, H.263)

MPEG-4 part 10 (H.264, AVC)

WMV 7/8/9/ VC-1 & ASF Demuxer

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TEXT AND GRAPHICS TERMINAL EMULATIONS

(provided by HP TeemTalk 7 in HP ThinPro & WES 7 operating systems)

Emulation

Terminal ID

HP 700-92/96

70092, 70094, 70096, 2392A, 2622A

IBM3151

Mod11, Mod31

IBM3270

3278-2 (24x80), 3278-3 (32x80), 3278-4 (43x80), 3278-5 (27x132), 3278-2-E (24x80), 3278­3-E (32x80), 3278-4-E (43x80), 3278-5-E (27x132), 3279-2 (24x80), 3279-3 (32x80), 3279-4
(43x80), 3279-5 (27x132), 3287-1

IBM5250

5291-1, 5292-2, 5251-11, 3179-2, 3196-A1, 3180-2, 3477-FC (27x132), 3477-FG (24x80),
3486-BA, 3487-HA, 3487-HC, 3812-1

VT52, VT100, VT100+, VT500 (7- or
8-bit)

VT100, VT101, VT102, VT125, VT131, VT132, M2200, VT220, VT240, VT320, VT340, VT420,
VT510, VT520, VT525

VT HP220,
VT UTF8

VT100, VT101, VT102, VT125, VT220, VT240, VT320, VT340, VT420, VT131, VT132, M2200,
VT510, VT520, VT525

NOTE: Wireless features, performance and support may vary depending on environmental variables such placement, settings and firmware of
your access points. Please contact your wireless vendor for support of your wireless environment

WEIGHTS & DIMENSIONS

W x D x H:
(vertical orientation)

With stand: 12 x 22 x 25.1 cm; 4.72 x 8.66 x 9.88 in
Without stand: 4.2 x 22 x 24 cm; 1.65 x 8.66 x 9.45 in

Volume:

2.21liters; 74.73 fl oz

System Weight
(unit with stand)

With stand =1.52kg; 3.35 lb
Without stand = 1.45 kg; 3.20 lb

Shipping Weight

4.1kg; 9.04 lb

NOTE: All measurements are approximate; the addition of optional modules will increase the weight

EXTERNAL POWER SUPPLY

65W external power adapter
Worldwide auto-sensing 100-240 VAC, 50-60 Hz
Energy-saving automatic power-down
Surge-tolerant

External power adapters are sourced from a number of suppliers in order to ensure adequate supply and availability is maintained.
The actual dimensions (cm) of the power brick will vary by supplier.

Chicony
Delta
LiteOn

12.6(L) x 5.0(W) x 3.0(H) cm

10.8(L) x 4.6(W) x 2.95(H) cm

11.35(L) x 5.5(W) x 3.0(H) cm

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REGULATORY COMPLIANCE

Ergonomics:

Approved

Safety:

UL 1950, CSA 950; TÜV-GS (EN60 950); approved

RF Interference:

FCC Class B; CE Mark; EN55022B; VCCI

ENVIRONMENTAL

Operating Temperature Range:

Standard
50° to 104° F (10° to 40° C)

Using Quick Release with a flat panel monitor
50° to 95° F (10° to 35° C)

t630 with Fiber NIC:

50° to 95° F (10° to 35° C)

Non-operating Temperature
Range:

-22° to 140° F (-30° to 60° C)

Humidity:

Condensing: 20% to 80%
Non-condensing: 10% to 90%

NOTE: Specifications are at sea level with altitude derating of 1° C/300m (1.8° F/1000ft) to a maximum of 3 Km (10,000 ft), with no direct,
sustained sunlight. Upper limit may be limited by the type and number of options installed.

Basic Configuration (does not include a fiber optic NIC):

Energy Consumption:

(in accordance with US ENERGY STAR® test method)

115VAC, 60Hz

230VAC, 50Hz

100VAC, 60Hz

Normal Operation:

(short idle)

12.4

13.2

12.4

Normal Operation:

(long idle)

10.9

11.5

11.2

Sleep

1.18

1.24

1.17

Off

0.2

0.25

0.2

Heat Dissipation

115VAC, 60Hz

230VAC, 50Hz

100VAC, 60Hz

Normal Operation:

(short idle)

42 BTU/hr

45 BTU/hr

42 BTU/hr

Normal Operation:

(long idle)

37 BTU/hr

39 BTU/hr

38 BTU/hr

Sleep

4 BTU/hr

4 BTU/hr

4 BTU/hr

Off

0.7 BTU/hr

0.9 BTU/hr

0.7 BTU/hr

System configuration includes: Thin Pro - 64bit, 128 GB primary storage. 32 GB secondary storage, 32 GB of system memory, USB keyboard &
USB mouse

Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour.

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Optional Configuration (includes a fiber optic NIC):

Energy Consumption:

(in accordance with US ENERGY STAR® test method)

115VAC, 60Hz

230VAC, 50Hz

100VAC, 60Hz

Normal Operation:

(short idle)

10.5

13.2

12.4

Normal Operation:

(long idle)

10.9

11.5

11.2

Sleep

1.18

1.24

1.17

Off

0.2

0.25

0.2

Heat Dissipation

115VAC, 60Hz

230VAC, 50Hz

100VAC, 60Hz

Normal Operation:

(short idle)

36 BTU/hr

45 BTU/hr

42 BTU/hr

Normal Operation:

(long idle)

37 BTU/hr

39 BTU/hr

38 BTU/hr

Sleep

4 BTU/hr

4 BTU/hr

4 BTU/hr

Off

0.7 BTU/hr

0.9 BTU/hr

0.7 BTU/hr

System configuration includes: WES 7E-32bit, 100 Mbps SC Fiber NIC, 128 GB primary storage. 32 GB secondary storage, 32 GB of system
memory, USB keyboard & USB mouse

Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour.

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Summary of Changes

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Date of change:

Version History:

Type of change

Description of change:

From v1 to v2

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© 2016 HP Development Company, L.P. The information contained herein is subject to change without notice. The only
warranties for HP products and services are set forth in the express limited warranty statements accompanying such products
and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or
editorial errors or omissions contained herein. DisplayPort™ and the DisplayPort™ logo are trademarks owned by the Video
Electronics Standards Association (VESA®) in the United States and other countries. Microsoft and Windows are either registered
trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. Intel and the Intel Inside logo
are trademarks of Intel Corporation in the U.S. and other countries. ENERGY STAR is a registered mark owned by the U.S.
government. Linux® is the registered trademark of Linus Torvalds in the U.S. and other countries. AMD and Radeon are
trademarks of Advanced Micro Devices, Inc. Bluetooth is a trademark owned by its proprietor and used by HP Inc. under license.
Citrix and XenDesktop are trademarks of Citrix Systems, Inc. and/or one more of its subsidiaries, and may be registered in the
United States Patent and Trademark Office and in other countries. VMware is a registered trademark or trademark of VMware,
Inc. in the United States and/or other jurisdictions.