Hewlett Packard X4X19AT Product Data Sheet

QuickSpecs

HP t630 Thin Client

Overview

c04984422 — DA – 15562 Worldwide — Version 1 —August 15, 2016

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HP t630 Thin Client

FRONT

BACK

Power button (with integrated power indicator)

RJ45 network interface connector

Flash memory activity indicator

PS/2 ports for keyboard and mouse

(2) Hi-Speed USB 2.0 ports

Serial port

(2) SuperSpeed USB 3.0 ports

(2) DisplayPort™ 1.2 video outputs

3.5 mm headset port

(2) Hi-Speed USB 2.0 ports

System stand

3.5 mm audio line-out/line-in port

Optional I/O Port (can be configured as: VGA output, 2nd serial port, external antenna or Fiber NIC interface)

+19V DC power input

INTERNAL

Retractable power cord retention hook

(1) SuperSpeed USB 3.0 port secured inside chassis

10.

Rear I/O cover removal latch

11.

Cable lock slot

QuickSpecs

HP t630 Thin Client

Overview

c04984422 — DA – 15562 Worldwide — Version 1 —August 15, 2016

Page 2

AT A GLANCE

 AMD GX-420GI SOC; 2.0 - 2.2 GHz quad-core with a Radeon R6E based graphics core  DDR4 dual-channel SDRAM system memory; up to 1,866 MT/s transfer rate; two SODIMM slots; up to 32 GB supported

 (2) DisplayPort™ 1.2 video outputs supporting up to Ultra High Definition (UHD)/4K (3840 x 2160) resolutions  Solid-state flash memory storage; M.2 form factor modules; support for up to 2 modules for maximum local storage

capacity and data management

 Active thermal management technology monitors component operating temperatures, throttles SOC operation if

appropriate, and prevents unit thermal shutdown

 Gigabit Ethernet (GbE) network connection supported via an integrated Realtek GbE NIC module  Optional Allied Telesis Fiber Optic NICs; Fast Ethernet (100 Mb/s) or Gigabit (1,000 Mb/s)  Optional Wi-Fi/Bluetooth® adapters including antennas integrated internally in the chassis

NOTE: Fiber optic and Wi-Fi NIC options cannot be supported together2

 (2) SuperSpeed USB 3.0 and (2) Hi-Speed USB 2.0 on front, (2) Hi-Speed USB 2.0 on rear and (1) SuperSpeed USB 3.0 inside

the chassis.

 Legacy ports include PS/2 keyboard and mouse, up to (2) serial ports and up to (1) VGA video output  Integrated PC speaker for basic audio playback; 3.5 mm headset audio port on front and 3.5 mm audio port on rear that can

be configured as line in or line out supporting headphones, external speaker systems, or microphone

 TCG certified Trusted Platform Module (TPM) chipset; version 1.2 with HP ThinPro/Smart Zero Core and Windows Embedded

Standard 7E models, version 2.0 with Windows 10 IoT Enterprise models; other security features include a system BIOS designed to address NIST SP 800-147 guidelines, cable lock slot, and power cord retention clip to prevent accidental disconnects; (1) internal SuperSpeed USB 3.0 port for securing USB flash drives inside the chassis

 ENERGY STAR® certified and EPEAT® Gold registered in the United States (except for some models configured with Fiber

Optic NIC networking options). See http://www.epeat.net for registration status in other countries

 Post-consumer recycled plastics content greater than 25% total unit plastics (by weight)  Low halogen

material content

 All models TAA compliant (in North America & EMEA); TAA models available in APJ by request

If configured with a Windows Embedded 32-bit operating system, memory above 3.2 GB may not be available due to operating system

limitations

Wireless access point and Internet access is required; availability of public wireless access points is limited

This product is low halogen except for power cords, cables and peripherals, as well as the optional Fiber Optic NIC module; service parts

obtained aftermarket may not be low halogen

Warranty

HP Customer Support: limited three-year hardware limited warranty in most regions; HP Care Packs are extended service contracts that go beyond your standard limited warranties; for more details visit http://www.hp.com/go/cpc

QuickSpecs

HP t630 Thin Client

Technical Specifications

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OPERATING SYSTEMS

HP Smart Zero Core HP ThinPro Windows Embedded Standard 7E Windows 10 IoT Enterprise

PROCESSOR

Model

CPU Frequency

Max/Base

Cores

GPU CUs

TDP

L2 Cache

GPU

Memory

AMD GX-420GI

2.2/2.0 GHz

4 6 16.1 W

2 MB

626 MHz

DDR4

GRAPHICS

Number of displays supported:

Video outputs:

(2) DisplayPort™ 1.2 (standard) (1) VGA (optional)

NOTE: adding the optional VGA output does not increase the number of displays supported.

Maximum screen resolution:

Supports 2 displays at 3840 x 2160 @ 60 Hz via the standard DisplayPort™ outputs Supports 1 display at1920 x 1200 @ 60 Hz via the optional VGA output

NOTES:

 The system should be configured with dual channel memory (two SODIMMs) for optimal display

resolution performance

 Dual channel memory (two SODIMMs) is required to achieve maximum resolution on dual UHD

displays

MEMORY

Type:

DDR4 dual channel SDRAM

Data Transfer Rate:

Up to 1,866 MT/s

Peak Transfer Rate:

14,933 MB/s

Number of Slots

2 x SODIMM

Capacities:

4, 8, 16 and 32 GB

NOTE: WES 7E is a 32-bit operating system and only recognizes up to 3.2GB RAM

Reserved for Graphics:

256 MB, 512 MB (default) or 1 GB

NOTE: The system’s Graphics Processing Unit (GPU) uses part of the total system memory. System memory dedicated to graphics performance is not available for use by other programs

QuickSpecs

HP t630 Thin Client

Technical Specifications

c04984422 — DA – 15562 Worldwide — Version 1 —August 15, 2016

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BIOS

UEFI Specification Revision

2.3.1

Trusted Platform Module (TPM)

Meets requirements for Common Criteria, an independent third-party certification of trustworthiness

Meets requirements for FIPS 140-2, a standard for cryptographic integrity

TPM 1.2

HP ThinPro/Smart Zero Core and Windows Embedded Standard 7E models

TPM 2.0

Windows 10 IoT Enterprise and No OS models

Security features

System BIOS designed to address NIST SP 800-147 guidelines

Other BIOS details

See t630 Thin Client Troubleshooting Guide

STORAGE

Type:

NAND flash memory; non-volatile

Number of Sockets:

(2) M.2 designated as primary and secondary

Capacities:

Primary storage options:

 No OS, Smart Zero & ThinPro = 8, 16, 32, 64 and 128 GB  WES 7E-32bit = 16, 32, 64 and 128 GB  Win 10 IoT-64 bit = 32, 64 and 128 GB

NOTE: The primary socket supports M.2 flash up to size 2280 modules; the secondary socket accommodates up to size 2242 modules. The highest capacity offered in the secondary slot is 64 GB.

Secondary storage options:

 All configurations = 8, 16, 32 & 64 GB  WES 7E-32bit restrictions for factory = The secondary drive must be equal to or

greater than the capacity of the primary drive.

NOTE: Secondary SSD capacity restrictions are for factory only. Therefore, customer may change secondary storage to any capacity desired after received from factory.

Solid-state flash-based memory modules are the primary operating system storage media for thin clients supporting highly virtualized operating environments. Thin clients display a hosted session from a data center through standard IP networks which minimizes the required size of local flash-based storage. In a traditional thin client environment, data and application files are stored securely in the remote data center and not on the local storage device.

The HP t630 Thin Client uses three types of flash memory: MLC (2-bits per cell), Ultra MLC (2-bits per cell, but only 1 is utilized) and TLC (3-bits per cell). Because the classic thin client use cases seldom require writing to flash memory storage, a relatively low capacity MLC flash memory module is typically used to provide the best cost and performance. However, when the use case calls for writing to the local flash memory storage module careful consideration should be given to the selection of the proper storage module. A larger capacity and/or the use of Ultra MLC technology could be required to adequately support the usage being planned or expected from the thin client.

Flash Memory Specification

MLC (Multi-level Cell)

UMLC (Ultra MLC)

TLC (Triple-level Cell)

Bits per cell 2 2 (only 1 is used)

Terabytes Written (TBW) *

5 TBW* – 8GB 10 TBW* – 16GB 20 TBW* – 32GB

50 TBW* – 16GB

100 TBW* – 32GB

70 TBW* - 128GB

QuickSpecs

HP t630 Thin Client

Technical Specifications

c04984422 — DA – 15562 Worldwide — Version 1 —August 15, 2016

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* Terabytes Written (TBW) calculated based on JESD-219 SSD Client workload

Input/Output

USB Interfaces:

(2) Hi-Speed USB 2.0 (front access) (2) Hi-Speed USB 2.0 (rear access) (2) SuperSpeed USB 3.0 (front access) (1) SuperSpeed USB 3.0 (inside chassis)

Video Outputs:

(2) DisplayPort™ 1.2 digital outputs (standard) (1) VGA analog output (optional)

NOTE: the optional VGA output does not increase the number of displays supported.

I/O Interfaces:

(2) PS/2 keyboard/mouse ports (1) RJ45 network interface connector (1) Serial port (standard): can be configured to produce 5V of power (1) 2nd Serial port (optional)

Audio

(1) 3.5 mm headset port (front) (1) 3.5 mm audio combo line-out/ line-in port (rear)

NOTE: a single position at the back of the system is utilized for one of four optional outputs. One of the following can be configured to any system:

 Optional VGA video output  Optional 2

serial port

 Optional Fiber Optic NIC interface  Optional external Wi-Fi antenna

AUDIO/VIDEO

Audio Subsystem

 Internal amplified speaker system for basic audio playback  3.5 mm headset socket (front access)  3.5 mm combo line-out/ line-in socket (rear access)

Audio CODECs

 MP3  AAC Stereo  HE AAC  Includes hardware acceleration support

Video CODECs

 MPEG-4 part 2 (DivX, Xvid)  MPEG-4 part 10 (H.264, AVC)  WMV 7/8/9 VC-1 & ASF Demuxer  Includes hardware acceleration support

HARDWARE SECURITY

 Security lock slot (cable lock sold separately)  Power cord retention clip  Internal SuperSpeed USB 3.0 port  Trusted Platform Module (version 1.2 or 2.0 depending upon the model’s configured operating system)

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