Data Sheet
March 2008
FLTR100V10 Filter Module
75 Vdc Input Maximum, 10 A Maximum
Features
RoHS Compliant
The FLTR100V10 Filter Module is encapsulated in a small, nonconductive plastic case.
Application
n Common-mode and differential-mode filtering of
power supply dc input and output lines
n Computer applications
n Communications equipment
n Compatible with RoHS EU Directive 200295/EC
n Compatible in Pb- free or SnPb reflow environment
n Small size: 51 mm x 28 mm x 12 mm
(2.0 in. x 1.1 in. x 0.46 in.)
n Optimized for use with high-frequency dc-to-dc
power modules
n Printed-circuit board mountable
n Operating case temperature range:
–40 °C to +100 °C
n UL* 60950 Recognized, CSA
†
C22.2 No. 60950-00
Certified; VDE 0805 (IEC60950) Licensed
n CE mark meets 73/23/EEC and 93/68/EEC
directives
‡
Options
n Short pin: 2.8 mm (o.110 in.)
n Short pin: 3.7 mm (0.145 in.)
n Short pin: 4.6 mm (0.180 in.)
Description
The FLTR100V10 Filter Module is designed to reduce the conducted common-mode and differential-mode
noise on input or output lines of high-frequency switching power supplies. The module has a maximum current
rating of 10 A. It provides high insertion loss throughout the frequency range regulated by the U.S. Federal
Communications Commission (FCC) and the International Special Committee on Radio Interference (CISPR)
for conducted emissions.
The module is 51 mm long, 28 mm wide, and 12 mm high (2.0 in. x 1.1 in. x 0.46 in.) and mounts on a PC board
in a natural convection or forced-air environment.
* UL is a registered trademark of Underwriters Laboratories, Inc.
† CSA is a registered trademark of Canadian Standards Assn.
‡ This product is intended for integration into end-use equipment. All the required procedures for CE marking of end-use equipment should
be followed. (The CE mark is placed on selected products.)
FLTR100V10 Filter Module
75 Vdc Input Maximum, 10 A Maximum
Data Sheet
March 2008
Introduction
High-density power modules are usually designed to operate at a high switching frequency to reduce the size of
the internal filter components. The small EMI filters internal to the modules are often inadequate to meet stringent
international EMI requirements. Many high-density electronic packaging techniques can increase the noise conducted onto the modules’ input and output lines. For example, the close proximity of switching components to the
input pins increases internal noise coupling; and planar transformers, designed to handle high-power levels in lowprofile packages, have high interwinding capacitance that can increase common-mode current levels. Also, metal
substrates used to facilitate heat transfer from the power train components to an external heat sink add to common-mode noise because of the large capacitance between switching components and the metal substrate.
Many international agencies specify conducted and radiated emissions limits for electronic products. Included
among these are CISPR, FCC, VCCI, and the new CE specifications. Most agency-conducted noise limits apply
only to noise currents induced onto the ac power lines in finished products. European Telecommunication Standard
Instructions (ETSI) are an exception, applying CE requirements to dc supplies with cables over three meters long.
Although not required to do so by agency standards, some system designers apply the conducted emissions
requirements to subassemblies within the product to reduce internal interference between subsystems and to
reduce the difficulty of meeting overall system requirements.
To meet these requirements, external filtering of the power module is often required. When used in conjunction with
the recommended external components and layout, t
conducted differential and common-mode noise returned to the power source. CISPR and FCC class B requirements can be met by using the filter as described in the following sections.
he Lineage Power filter module will significantly reduce the
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
Parameter Symbol Min Max Unit
Input Voltage:
Continuous
Transient (100 ms)
Voltage from GND to Either Input Lead (1 minute) — — 1500 Vdc
Operating Case Temperature T
Storage Temperature* T
* For the processing, handling and storage (module not powered), the filter module can handle -55°C to 125°C exposure.
I
V
VI, trans
C –40 100 °C
stg –55 125 °C
—
—
75
100
Vdc
V
2 Lineage Power
Data Sheet
March 2008
75 Vdc Input Maximum, 10 A Maximum
FLTR100V10 Filter Module
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage and temperature conditions.
Parameter Symbol Min Typ Max Unit
Resistance per Leg R — — 14 mΩ
Maximum Average Current
(T
A = 60 °C, 2.03 m/s (400 lfm) air)
Maximum Average Current
A = 60 °C, natural convection)
(T
Common-mode Insertion Loss
(50 Ω circuit, 500 kHz)
Differential-mode Insertion Loss
(50 Ω circuit, 500 kHz)
I
max ——10A
I
max ——6.5A
——36—dB
——44—dB
Characteristics
12
10
8
6
4
2
0
20 30 40 50 60 70 80 90
Figure 1. Derating output current vs. Local
NC
200 LFM
400 LFM
ambient temperature and Airflow (Vin =
48Vdc)
0
-20
-40
-60
-80
COMMON-MODE INSERTION LOSS (dB)
-100
0.1 10
1.0
FREQUENCY (MHz)
8-1326b
Figure 2. Typical Common-Mode Insertion Loss in
a 50 Ω Circuit
Lineage Power 3
Data Sheet
March 2008
FLTR100V10 Filter Module
75 Vdc Input Maximum, 10 A Maximum
Characteristics (continued)
0
-20
-40
-60
-80
DIFFERENTIAL-MODE INSERTION LOSS (dB)
-100
0.1 10
Figure 3. Typical Differential-Mode Insertion Loss
in a 50 Ω Circuit
1.0
FREQUENCY (MHz)
8-1327b
Table 2: Failure Rate in FITs:
amb
temp
10A 8 6A
20 24.248 11.679 6.89
30 38.244 18.925 11.388
40 58.588 29.736 18.227
50 87.415 45.433 28.336
60 127.327 67.671 42.899
70 181.441 98.481 63.394
80 253.416 140.302 91.632
Internal Schematics
IN
OUT
GND
8
1•10
II = 6 A
I
MTBF (T)
7
5•10
20 30 40 6050 8070
AMBIENT TEMPERATURE (˚C)
I = 8 A
I
I = 10 A
1-0324
Figure 5. Internal Schematic
Figure 4. MTBF vs Ambient temperature for 6A, 8A,
and 10A Input Current
Table 1: MTBF in Hours:
amp
temp
20 4.124•10
30 2.615•10
40 1.707•10
50 1.144•10
60 7.854•10
70 5.511•10
80 3.946•10
10A 8A 6A
7
7
7
7
6
6
6
8.563•10
5.284•10
3.363•10
2.201•10
1.478•10
1.015•10
7.127•10
7
7
7
7
7
7
6
1.451•10
8.781•10
5.486•10
3.529•10
2.331•10
1.577•10
1.091•10
8
7
7
7
7
7
7
4 Lineage Power
8-1324b
FLTR100V10 Filter Module
75 Vdc Input Maximum, 10 A Maximum
Data Sheet
March 2008
Application
Conducted noise on the input power lines can occur as
either differential-mode or common-mode noise currents. Differential-mode noise is measured between the
two input lines, and is found mostly at the lowfrequency end of the spectrum. This noise shows up as
noise at the fundamental switching frequency and its
harmonics. Common-mode noise is measured
between the input lines and ground and is mostly
broadband noise above 10 MHz. The high-frequency
nature of common-mode noise is mostly due to the
high-speed switching transitions of power train components. Either or both types of noise may be covered in
a specification, as well as a combination of the two. An
approved measurement technique is often described,
as well.
Differential-mode noise is best attenuated using a filter
composed of line-to-line capacitors (X caps) and series
inductance, provided by either a discrete inductor or
the leakage inductance of a common-mode choke. In
addition to the differential filtering provided by the filter
module, it is recommended that an electrolytic capacitor be located at the converter side of the filter to provide additional attenuation of low-frequency differential
noise and to provide a low source impedance for the
converter, preventing input filter oscillations and loadtransient induced input voltage dips.
Common-mode noise is best attenuated by capacitors
from power module input to power module output,
capacitors from each input line to a shield plane
(Y caps), and common-mode chokes. It is recommended that ceramic capacitors be added around each
power module from each input and output pin to a
shield plane under the module. The shield plane should
be connected to the CASE pin.
The GND pin of the filter module is attached to Y caps
within the module. This pin should be tied to a quiet
chassis ground point away from the power modules.
GND of the filter module should not be tied to the
CASE pin of the power module since this is a noisy
node and will inject noise into the filter, increasing the
input common-mode noise.
If no quiet grounding point is available, it is best to
leave the filter module GND pin unattached. Each
power system design will be different, and some experimentation may be necessary to arrive at the best configuration.
Figure 6 shows a typical schematic of a power module
with filter module and recommended external components. Figure 7 is a proposed layout. More than one
power module may be attached to a single filter module
as long as input current does not exceed 10 A. Figure 8
shows the recommended schematic for two power
modules attached to a single filter.
In applications where the addition of input to output
capacitors is undesirable, do not use C3 and C4 shown
in Figures 6 and 7, and do not use C3, C4, C8, and C9
shown in Figure 8.
In –48 V applications where the shield plane and the
power module case must be tied to a signal, remove
C1 in Figures 6 and 7, remove C1 and C6 in Figure 8,
and connect the shield plane and CASE pin to the V
plane.
In +48 V applications where the shield plane and the
power module case must be tied to a signal, remove
C2 in Figures 6 and 7, remove C2 and C7 in Figure 8,
and connect the shield plane and CASE pin to the V
plane.
I(+)
I(–)
55 Lineage Power
FLTR100V10 Filter Module
75 Vdc Input Maximum, 10 A Maximum
Application (continued)
Data Sheet
March 2008
Vdc INPUT(+)
Vdc INPUT(-)
CHASSIS GROUND
VI(+)
V
I(-)
FILTER
MODULE
GND
V
V
O(+)
O(-)
C5
C1
I(+)
V
VI(-)
POWER MODULE
CASE
C2
SHIELD PLANE
VO(+)
VO(-)
C3 C4
8-1325b
Note: C1 through C4 can be 0.01 µF to 0.1 µF. Select the voltage rating to meet input-to-output isolation requirements. C5 should be the
recommended value indicated in the power module data sheet.
Figure 6. Recommended Schematic When Used as the Input Filter to a High-Frequency dc-to-dc Converter
POWER
MODULE
C1 C4
FILTER
Vdc INPUT(+)
Vdc INPUT(-)
CHASSIS
GROUND
MODULE
C5
VI(+)
I(-)
V
CASE
SHIELD
PLANE
C2 C3
O(+)
V
V
8-1328d
Note: Vdc input(+) and Vdc input(–) planes should overlay each other, as should the VI(+) and VI(–) planes, as should the VO(+) and VO(–)
planes. Avoid routing signals or planes under the power module or the filter module. Ensure all connections are low impedance.
Figure 7. Recommended Layout When Used as the Input Filter to a High-Frequency dc-to-dc Converter
O(-)
6 Lineage Power
Data Sheet
March 2008
Application (continued)
Vdc INPUT(+)
VI(+)
FLTR100V10 Filter Module
75 Vdc Input Maximum, 10 A Maximum
I1
(+)
V
O
(+)
V
O1
(+)
V
Vdc INPUT(-)
CHASSIS GROUND
V
I
(-)
FILTER
MODULE
GND
C5
V
O
(-)
VI1(-)
C1
I2
(+)
V
POWER MODULE 1
C2
SHIELD PLANE
POWER MODULE 2
CASE 1
V
O1
(-)
C3 C4
O2
(+)
V
V
O2
(-)
C8 C9
8-1362a
C6
VI2(-)
CASE 2
C7
SHIELD PLANE
Note: C1 through C4 and C6 through C9 can be 0.01 µF to 0.1 µF. Select the voltage rating to meet input-to-output isolation requirements.
C5 should be the recommended value indicated in the power module data sheet.
Figure 8. Recommended Schematic of Filter Module with Two Power Modules
Lineage Power 7
Data Sheet
March 2008
FLTR100V10 Filter Module
75 Vdc Input Maximum, 10 A Maximum
Application (continued)
Figures 9 and 10 show some experimental results
obtained by using the filter module, together with the
recommended external components shown in Figures
6 and 7. The JW075A5 module is a lower-noise version
of the standard JW series with internal modifications to
the power module. The lower noise of the JW075A5
module is achieved at the cost of lower efficiency, and
a reduced maximum power rating. Measured noise is
highly dependent on layout, grounding, cable orientation, and load characteristics and will, therefore, vary
from application to application.
Thermal Considerations
Filter modules operate in a variety of thermal environments; however, sufficient cooling should be provided
to help ensure reliable operation. Considerations
include ambient temperature, airflow, module power
dissipation, and the need for increased reliability. A
reduction in the operating temperature of the module
will result in an increase in reliability.
The thermal data presented in the data sheet is based
on physical measurements taken in a wind tunnel. The
thermal reference point used for thermal derating
curves presented in Figure 1 is the case of the module.
For reliable operation this temperature should not
exceed 100
o
C.
Other Considerations
The fundamental switching frequency noise spike can
be somewhat reduced by adding a high-frequency
capacitor of a few microfarads across the input lines of
the filter module.
Adding additional components to the input filter to
improve performance usually has very limited payback,
and may actually increase the noise conducted onto
the input lines. Adding Y caps to the input side of the filter module couples any noise in the ground plane
directly into the input lines, usually degrading performance. Adding additional X and Y caps to the power
module side of the filter module produces lowimpedance loops for high-frequency currents to flow,
possibly degrading performance.
Adding additional common-mode or differential-mode
filtering to the power module output leads decreases
the power module output noise, and also frequently
reduces the input noise by decreasing the noise coupled from output leads to input leads. Common-mode
output filtering is particularly important if the load is tied
to chassis ground. If common-mode filtering is added
to the power module output, ensure that remote-sense
leads sense the output voltage before the commonmode filter. Do not use remote-sense on the load side
of an output common-mode filter.
If input noise performance is unsatisfactory after applying the filter module as described previously, the best
remedy is to modify the layout and grounding scheme.
It is often useful to make a model of the power card,
using copper tape and a vector card, to experiment
with various layout and grounding approaches prior to
committing to a printed-wiring board.
It is essential for good EMI performance that the input
lines not be contaminated with noise after passing
through the filter. Filtered input traces should therefore
be kept away from noise sources such as power modules and switching logic lines. If input voltage sense
traces must be routed past the power modules from the
quiet side of the filter module, they should be filtered at
the point where they leave the quiet input lines. Input
traces should be kept as far away from output power
traces as possible.
8 Lineage Power
FLTR100V10 Filter Module
75 Vdc Input Maximum, 10 A Maximum
Other Considerations (continued)
Data Sheet
March 2008
8-1387(F)
Figure 9. JW075A1 Conducted Noise with Filter
8-1388(F)
Figure 10. JW075A5 Conducted Noise with Filter
99 Lineage Power
FLTR100V10 Filter Module
2
75 Vdc Input Maximum, 10 A Maximum
Outline Diagram
Dimensions are in millimeters and (inches).
Tolerances: x.x ± 0.5 mm (0.02 in.), x.xx ± 0.25 mm (0.010 in.).
Top View
50.8 (2.00) MAX
Data Sheet
March 2008
Side View
Bottom View
0.51
(0.020)
3.8
(0.15)
19.05
(0.750)
27.9
(1.10)
MAX
I1
V
FLTR100V10
IN
Filter Module
IN
= 75 Vdc Max.
V
IN
= 10 Adc Max.
I
GND
0.79 (0.031) DIA
ROUND PIN (TYP)
12.06
(0.475)
31.11 (1.225)
GND
OUT
11.7 (0.46)
MAX
7.4 (0.
VO1
V
4.6 (0.18)
I2
VO2
8-1323c1
10 Lineage Power
Data Sheet
March 2008
75 Vdc Input Maximum, 10 A Maximum
Recommended Hole Pattern
Component-side footprint.
Dimensions are in millimeters and (inches).
Tolerances: x.x ± 0.5 mm (0.02 in.), x.xx ± 0.25 mm (0.010 in.).
Note: Do not route copper paths beneath power module standoffs.
FLTR100V10 Filter Module
4.6
(0.18)
19.05
(0.750)
3.81
(0.150)
VI2
VI1
MODULE OUTLINE
GND
31.11 (1.225)
12.06
(0.475)
VO2
VO1
8-1323c2
Lineage Power 11
FLTR100V10 Filter Module
75 Vdc Input Maximum, 10 A Maximum
Post Solder Cleaning and Drying Consideratrions
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing.The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the testability
of the finished circuit-board assembly.For guidance on
appropriate soldering,cleaning and drying procedures,refer to
Modules:Soldering and Cleaning Application Note.
Lineage Power Board Mounted Power
Through-Hole Lead Free Soldering Information
The RoHS-compliant through-Hole products use the
SAC(Sn/Ag/Cu) Pb-free solder and RoHS- compliant
components.They are designed to be processed
through single or dual wave soldering machines.The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.A
Maximum preheat rate 3
preheat process should be such that the temperature
of the power module board is kept below 210
solder,the recommended pot temperature is
0
C,while the Pb-free solder pot is 2700C max.Not
260
all RoHS-compliant through-hole products can be processed with paste-through-hole Pb or Pb-free reflow
process.If additional information is needed,please consult with your
details.
Lineage Power representative for more
0
C/s is suggested.The wave
0
C.For Pb
Data Sheet
March 2008
12 Lineage Power
Data Sheet
March 2008
Ordering Information
Device Code Comcode Description
FLTR100V10 107742447 Standard Pin Length
FLTR100V610 108799131 0.145 in. Pin Length
FLTR100V810 108799123 0.110 in. Pin Length
FLTR100V10-62 108997607 0.180 in. Pin Length
FLTR100V10-62Z CC109103801 0.180 in. Pin Length
RoHS compliant
FLTR100V10Z 109100154 Standard Pin Length
RoHS compliant
FLTR100V610Z CC109103264 0.145 in. Pin Length
RoHS compliant
FLTR100V810Z CC1091103272 0.110 in. Pin Length
RoHS compliant
Option Codes
FLTR100V10 Filter Module
75 Vdc Input Maximum, 10 A Maximum
Option
Short pin: 2.8 mm ± 0.25 mm
Device Code
Suffix
8
(0.110 in. ± 0.010 in.)
Short pin: 3.7 mm ± 0.25 mm
6
(0.145 in. ± 0.010 in.)
Short pin: 4.6 mm ± 0.25 mm
-62
(0.180 in. ± 0.010 in.)
A sia - P a c i fic Head qu art ers
Tel: +65 6 416 4283
World Wide Headquarters
Line ag e Po w er Corp or ation
30 00 Skyline Drive, Mesquite, TX 75149, USA
Tyco Electronics Power Systems, Inc.
+1-800-526-7819
3000 Skyline Drive, Mesquite, TX 75149, USA
(Outside U.S.A.: +1- 972-2 84-2626)
+1-800-526-7819 FAX: +1-888-315-5182
ww w.line agep owe r .co m
(Outside U.S.A.: +1-972-284-2626, FAX: +1-972-284-2900)
e-m ail: techsupport1@linea gep ower.com
http://power.tycoelectronics.com
Lineage Power reserves the right to make changes to the product(s) or inform ation contained herein without notice. No liability is assum ed as a result of their use or
applic ation. No rights under any patent accompany the sale of any such product(s) or information.
Tyco Electronics Corporation reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application.
No rights under any patent accompany the sa le of any such product(s) or information.
© 2008 Lineage Power Corporation, (Mesquite, Texas) All International Rights Reserved.
© 2003 Tyco Electronics Power Systems, Inc. (Mesquite, Texas) All International Rights Reserved.
Printed in U.S.A.
March 2008 (rev e)
FDS01-044EPS (Replaces FDS01-043EPS)
Europe, Middle-East and Africa He adquarters
Tel: +49 8 9 6089 286
India Head quarters
Tel: +91 8 0 28411633
Loading...