GE Industrial Solutions EVW010A0B User Manual

Page 1
Data Sheet
f
September 4, 20 13
EVW010A0B Series (Eighth-Brick) DC-DC Converter Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
Applications
Distributed Power Architectures
Wireless Networks
Access and Optical Network Equipment
Enterprise Networks including Power over Ethernet
(PoE)
Options
Negative Remote On/Off logic
Over current/Over temperature/Over voltage
protections (Auto-restart)
Heat plate versions (-H)
Surface Mount version (-S)
Description
The EVW010A0B, Eighth-brick low-height power module is an isolated dc-dc converters that can deliver up to 10A of output current and provide a precisely regulated output voltage of 12V over a wide range of input voltages (V 75Vdc). The modules achieve typical full load efficiency of 93.5%. The open frame modules construction, available in both surface-mount and through-hole packaging, enable designers to develop cost and space efficient solutions. Standard features include remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and overtemperature protection.
* UL is a registered trademark of Underwriters Laboratories, I nc.
CSA is a registered trademark of Canadian Standards Association.
VDE is a trademark of Verband Deutscher Elektrotechniker e. V.
§
This product is intended for integration into end-user e quipment . All of the required procedures of end-us e equipment should be followed. ¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated. ** ISO is a registered trademark of the International Orga nization of Standards
RoHS Compliant
Features
Compliant to RoHS EU Directive 2002/95/EC
Compatible in a Pb-free or SnPb reflow
environment
High efficiency – 93.5% at 12V full load
Industry standard, DOSA compliant, Eighth brick
footprint
57.9mm x 22.9mm x 7.8mm
(2.28in x 0.90in x 0.31in)
Wide Input voltage range: 36-75 Vdc
Tightly regulated output
Constant switching frequency
Positive Remote On/Off logic
Input under/over voltage protection
Output overcurrent/voltage protection
Over-temperature protection
Remote sense
No minimum load required
No reverse current during output shutdown
Output Voltage adjust: 80% to 110% of V
Operating temperature range (-40°C to 85°C)
UL* 60950-1Recognized, CSA
60950-1-03 Certified, and VDE
C22.2 No.
0805:2001-12
(EN60950-1) Licensed
CE mark meets 73/23/EEC and 96/68/EEC
directives
§
Meets the voltage and current requirements for
ETSI 300-132-2 and complies with and licensed for Basic insulation rating per EN60950-1
2250 Vdc Isolation tested in compliance with
IEEE 802.3
ISO
¤
PoE standards
**
9001 and ISO 14001 certified
manufacturing facilities
Document No: DS09-006 ver. 1.2
PDF name: evw010_ds.pd
o,nom
IN = 36 -
Page 2
Data Sheet
September 4, 2013
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
EVW010A0B Series Power Modules
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are
absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in
excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for
extended periods can adversely affect the device reliability.
Parameter Device Symbol Min Max Unit
Input Voltage
Continuous All V
Transient (100 ms) All V
Operating Ambient Temperature All T
IN
IN,trans
A
-0.3 80 Vdc
-0.3 100 Vdc
-40 85 °C
(see Thermal Considerations section)
Storage Temperature All T
I/O Isolation voltage (100% factory Hi-Pot tested) All
stg
-55 125 °C
2250 Vdc
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions.
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage All VIN 36 48 75 Vdc
Maximum Input Current
(VIN= V
IN, min
to V
IN, max
, IO=I
Input No Load Current
(VIN = V
, IO = 0, module enabled)
IN, nom
Input Stand-by Current
(VIN = V
, module disabled)
IN, nom
O, max
)
All I
All I
All I
IN,max
IN,No load
IN,stand-by
3.4 3.7 Adc
75 mA
20 mA
Inrush Transient All I2t 0.5 A2s
Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1μH source impedance; V V
= I
IN, max, IO
; See Test configuration section)
Omax
IN, min
to
All 20 mA
p-p
Input Ripple Rejection (120Hz) All 50 dB
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an
integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included,
however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies
require a time-delay fuse with a maximum rating of 8 A (see Safety Considerations section). Based on the
information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a
lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information.
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Data Sheet
A
A
September 4, 2013
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
EVW010A0B Series Power Modules
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Nominal Output Voltage Set-point
VIN=V
IN, min
, IO=I
O, max
, TA=25°C)
All V
O, set
Output Voltage
(Over all operating input voltage, resistive load,
All V
and temperature conditions until end of life)
Output Regulation
Line (VIN=V Load (IO=I
Temperature (T
IN, min
O, min
to V
to I
O, max
ref=TA, min
) All
IN, max
)
to T
) All
A, max
All
Output Ripple and Noise on nominal output
(VIN=V
IN, nom
,IO= I
O, max
, TA=T
, min
to T
)
, max
RMS (5Hz to 20MHz bandwidth) All
Peak-to-Peak (5Hz to 20MHz bandwidth) All
External Capacitance All C
Output Current All I
Output Current Limit Inception (Hiccup Mode ) All (VO= 90% of V Output Short-Circuit Current
(VO≤250mV) ( Hiccup Mode )
)
O, set
All I
I
O, lim
O, s/c
o
Efficiency All η 93.5 %
VIN= V
IO=I
Switching Frequency (Input ripple is ½ fsw) All f
, TA=25°C
IN, nom
= V
O, max , VO
O,set
sw
Dynamic Load Response
(dIo/dt=0.1A/s; VIN = V
IN, nom
; TA=25°C)
Load Change from Io= 50% to 75% or 25% to 50% of Io,max;
Peak Deviation All V
Settling Time (Vo<10% peak deviation)
(dIo/dt=1A/s; VIN = V
IN, nom
; TA=25°C)
Load Change from Io= 50% to 75% or 25% to 50% of Io,max;
Peak Deviation All V
Settling Time (Vo<10% peak deviation)
pk
All t
s
pk
All t
s
11.76 12.0 12.24 V
O
-3.0
+3.0 % V
0.2 % V
0.2 % V
 
O
100
0
 
1.0 % V
30 mV
100 mV
2,000 μF
10 Adc
105 115 130
3 5 A
370 kHz
 
3
200
  s
% V
 
5
200
  s
% V
% I
dc
O, set
O, set
O, set
O, set
rms
pk-pk
rms
O, set
O, set
o
Isolation Specifications
Parameter Device Symbol Min Typ Max Unit
Isolation Capacitance All C
Isolation Resistance All R
I/O Isolation Voltage (100% factory Hi-pot tested) All All
iso
iso
10
1000
2250 Vdc
pF
M
General Specifications
Parameter Device Symbol Min Typ Max Unit
Calculated Reliability based upon Telcordia SR­332 Issue 2: Method
=40°C, airflow = 200 lfm, 90% confidence)
T
A
I Case 3 (I
=80%I
O
O, max
,
Weight (Open Frame) All
Weight (with Heatplate) All
All FIT 323.4 10
All MTBF 3,092,530 Hours
19
(0.67)
32
(1.13)
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9
/Hours
g
(oz.)
g
(oz.)
Page 4
Data Sheet
September 4, 2013
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
EVW010A0B Series Power Modules
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See Feature Descriptions for additional information.
Parameter Device Symbol Min Typ Max Unit
Remote On/Off Signal Interface
(VIN=V Signal referenced to V Negative Logic: device code suffix “1” Logic Low = module On, Logic High = module Off Positive Logic: No device code suffix required Logic Low = module Off, Logic High = module On
Logic Low - Remote On/Off Current All I
Logic Low - On/Off Voltage All V
Logic High Voltage – (Typ = Open Collector) All V
Logic High maximum allowable leakage current All I
Turn-On Delay1 and Rise Times
(IO=I
Case 1: On/Off input is set to Logic Low (Module ON) and then input power is applied (T instant at which V
Case 2: Input power is applied for at least 1 second and then the On/Off input is set from OFF to ON (T
from instant V
Output voltage Rise time (time for Vo to rise from 10% of V
Output voltage overshoot – Startup
IO= I
Remote Sense Range All V
(Max voltage drop is 0.5V)
Output Voltage Adjustment Range
Output Overvoltage Protection
Input Undervoltage Lockout All V
Turn-on Threshold
Turn-off Threshold
Hysterisis 1.5 2.0
Input Overvoltage Lockout All V
Turn-off Threshold
Turn-on Threshold
Hysterisis 1 2
Notes:
1. The module has an adaptable extended Turn-On Delay interval, T following either: 1) the rapid cycling of Vin from normal levels to less than the Input Undervoltage Lockout (which causes module shutdown), and then back to normal; or 2) toggling the on/off signal from on to off and back to on without removing the input voltage. The normal Turn-On Delay interval, T
2. Maximum trim up possible only for Vin>40V.
to V
IN, min
O, max , VIN=VIN, nom, TA
to 90% of V
o,set
; VIN=V
O, max
, will occur whenever a module restarts with input voltage removed from the module for the preceding 1 second.
delay
; open collector or equivalent,
IN, max
terminal)
IN-
on/off
on/off
on/off
on/off
-0.7
2.0 5.0 Vdc
= 25 oC)
= V
IN
toggles until VO = 10% of V
on/off
IN, min
until VO = 10% of V
IN, min
)
o, set
to V
IN, max
, TA = 25 oC
2
delay
from
O, set
O,set
)
All T
delay
).
All T
All T
All
All 80 110 % V
All V
, of 4 seconds. The extended T
delay
25 30 msec
delay
12 20 msec
delay
rise
10 15 msec
10 % V
SENSE
O, limit
UVLO
OVLO
13.8
30 34.5 36 Vdc
30 32.5
75 78
delay
1.0 mA
1.0 Vdc
10 μA
3 % V
16.5 Vdc
 
80 83 V
 
will occur when the module restarts
Vdc
Vdc
Vdc
Vdc
O, set
O, set
O, set
dc
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Data Sheet
V
V
V
September 4, 2013
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
EVW010A0B Series Power Modules
Characteristic Curves
The following figures provide typical characteristics for the EVW010A0B (12V, 10A) at 25oC. The figures are identical for either positive or negative remote On/Off logic.
95
90
85
Vin = 48
80
Vin = 36
75
Vin = 75
70
EFFICIENCY, (%)
0246810
OUTPUT CURRENT, IO (A) TIME, t (100µs/div)
(V) (200mV/div) Io(A) (2A/div)
O
V
OUTPUT VOLTAGE OUTPUT CURRENT
Figure 1. Converter Efficiency versus Output Current. Figure 4. Transient Response to 1.0A/µS Dynamic
Load Change from 50% to 75% to 50% of full load (V
(V) (50mV/div)
O
V
OUTPUT VOLTAGE
TIME, t (2s/div)
Figure 2. Typical output ripple and noise (V I
o = Io,max).
IN = VIN,NOM,
= V
On/Off VOLTAGE OUTPUT VOLTAGE
Figure 5. Typical Start-up Using Remote On/Off, negative logic version shown (VIN = VIN,NOM, Io = Io,max).
IN,NOM
(V) (2V/div)
On/Off
(V) (2V/div) V
O
V
(V) (2V/div)
O
).
TIME, t (5ms/div)
IN
(V) (200mV/div) Io(A) (2A/div)
O
V
OUTPUT VOLTAGE OUTPUT CURRENT
TIME, t (100µs/div) TIME, t (10ms/div)
Figure 3. Transient Response to 0.1A/µS Dynamic Load Change from 50% to 75% to 50% of full load (V = V
IN,NOM
).
IN
(V) (20V/div) V
IN
INPUT VOLTAGE OUTPUT VOLTAGE
V
Figure 6. Typical Start-up Using Input Voltage (V V
IN,NOM, Io = Io,max).
IN =
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Page 6
Data Sheet September 4, 2013
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
Test Configurations
SCOP E
Vout+
Vout-
CURRENT P ROBE
33-100μF
RESISTIVE
LOA D
V
O
x 100 %
Vin+
Vin-
R
contactRdistribution
R
contactRdistribution
R
LOAD
TO OSCILL OSCOPE
L
TEST
12μH
CS 220μF
BAT TERY
NOTE: M easure input r eflected ri pple current wi th a s imulated
E.S .R.<0 .1
@ 20° C 100kHz
source inductance (L possi ble batt ery imp edance. Mea sure current as shown above.
) of 12μH. Capacitor CS offs ets
TEST
Figure 7. Input Reflected Ripple Current Test Setup.
COPPER STRIP
V O (+)
V O ( – )
NOTE: A ll volt age mea surements to be tak en at the module
termin als, as shown ab ove. If sock ets are used th en Kelvi n connec tions are requ ired at th e module te rminals to av oid meas urement errors due to socket c ontact resistance.
10uF
1uF
GROUND PLANE
Figure 8. Output Ripple and Noise Test Setup.
R
R
contact
distribution
R
R
contact
distribution
NOTE: All voltage measurements to be taken at t he module
terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance.
Vin+
V
IN
Vin-
Figure 9. Output Voltage and Effici ency Tes t Setup.
. I
V
O
Efficiency
=
VIN. I
O
IN
EVW010A0B Series Power Modules
Design Considerations
Input Filt ering
The power module should be connected to a low ac-impedance source. Highly inductive source impedance can affect the stability of the power module. For the test configuration in Figure 7 a 33­100μF electrolytic capacitor (ESR<0.1 at 100kHz), mounted close to the power module helps ensure the stability of the unit. Consult the factory for further application guidelines.
Safety Considerations
For safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e., UL 60950-1-3, CSA C22.2 No. 60950­00, and VDE 0805:2001-12 (IEC60950-1).
If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75Vdc), for the module’s output to be considered as meeting the requirements for safety extra-low voltage (SELV), all of the following must be true:
The input source is to be provided with reinforced
insulation from any other hazardous voltages, including the ac mains.
One V
pin and one V
IN
pin are to be
OUT
grounded, or both the input and output pins are to be kept floating.
The input pins of the module are not operator
accessible.
Another SELV reliability test is conducted on the
whole system (combination of supply source and subject module), as required by the safety agencies, to verify that under a single fault, hazardous voltages do not appear at the module’s output.
Note: Do not ground either of the input pins of the
module without grounding one of the output pins. This may allow a non-SELV voltage to appear between the output pins and ground.
The power module has extra-low voltage (ELV) outputs when all inputs are ELV.
All flammable materials used in the manufacturing of these modules are rated 94V-0, or tested to the UL60950 A.2 for reduced thickness.
For input voltages exceeding –60 Vdc but less than or equal to –75 Vdc, these converters have been evaluated to the applicable requirements of BASIC INSULATION between secondary DC MAINS DISTRIBUTION input (classified as TNV-2 in Europe) and unearthed SELV outputs.
The input to these units is to be provided with a maximum 8 A time-delay fuse in the ungrounded lead.
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Data Sheet
E
September 4, 2013
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic turns the module on during a logic high voltage on the ON/OFF pin, and off during a logic low. Negative logic remote On/Off, device code suffix “1”, turns the module off during a logic high and on during a logic low.
Vin+
Vout+
EVW010A0B Series Power Modules
the module remains at or below the maximum rated power (Maximum rated power = Vo,set x Io,max).
SENSE(+)
SENSE(–)
V
I(+)
VO(+)
SUPPLY
CONTACT
RESISTANCE
I
I
I(-)
V
O(–)
V
IO
CONTACT AND
DISTRIBUTION LOSS
Figure 11. Circuit Configuration for remote sense .
LOAD
I
on/off
ON/OFF
TRIM
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout limit, the module operation is disabled. The module
V
on/off
will only begin to operate once the input voltage is raised above the undervoltage lockout turn-on
Vin-
Vout-
Figure 10. Remote On/Off Implementation.
To turn the power module on and off, the user must supply a switch (open collector or equivalent) to control the voltage (V terminal and the V low is 0V ≤ V
1.0V. The maximum I
on/off
) between the ON/OFF
on/off
(-) terminal (see Figure 10). Logic
IN
on/off
during a logic low is 1mA, the switch should be maintain a logic low level whilst sinking this current.
During a logic high, the typical maximum V
on/off
generated by the module is 5V, and the maximum allowable leakage current at V
= 5V is 1μA.
on/off
If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to V
(-).
IN
Remote Sense
Remote sense minimizes the effects of distribution losses by regulating the voltage at the remote-sense connections (See Figure 11). The voltage between the remote-sense pins and the output terminals must not exceed the output voltage sense range given in the Feature Specifications table:
[V
(+) – VO(–)] – [SENSE(+) – SENSE(–)] 0.5 V
O
Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim.
The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of
threshold, V
Once operating, the module will continue to operate until the input voltage is taken below the undervoltage turn-off threshold, V
Overtemperature Protection
To provide protection under certain fault conditions, the unit is equipped with a thermal shutdown circuit. The unit will shutdown if the thermal reference point Tref (Figure 13), exceeds 150 thermal shutdown is not intended as a guarantee that the unit will survive temperatures beyond its rating. The module can be restarted by cycling the dc input power for at least one second or by toggling the remote on/off signal for at least one second. If the auto-restart option (4) is ordered, the module will automatically restart upon cool-down to a safe temperature.
Output Overvoltage Protection
The output over voltage protection scheme of the modules has an independent over voltage loop to prevent single point of failure. This protection feature latches in the event of over voltage across the output. Cycling the on/off pin or input voltage resets the latching protection feature. If the auto-restart option (4) is ordered, the module will automatically restart upon an internally programmed time elapsing.
Overcurrent Protection
To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. If the unit is not configured with auto–restart, then it will latch off following the over current condition. The module can be restarted by cycling the dc input power for at least one second or by toggling the remote on/off signal for at least one second. If the unit is configured with the auto-restart option (4), it will remain in the hiccup mode as long as the overcurrent condition exists; it
UV/ON
.
UV/OFF
.
o
C (typical), but the
operates normally, once the output current is brought
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Data Sheet
September 4, 2013
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
Feature Descriptions (continued)
back into its specified range. The average output current during hiccup is 10% I
Output Voltage Programming
Trimming allows the output voltage set point to be increased or decreased, this is accomplished by connecting an external resistor between the TRIM pin and either the V
VIN(+)
ON/OFF
VIN(-)
Figure 12. Circuit Configurat i on t o Tr im Out pu t Voltage.
Connecting an external resistor (R the TRIM pin and the Vo(-) (or Sense(-)) pin decreases the output voltage set point. To maintain set point accuracy, the trim resistor tolerance should be ±1.0%.
The following equation determines the required external resistor value to obtain a percentage output voltage change of ∆%
Where
For example, to trim-down the output voltage of the module by 8% to 11.04V, Rtrim-down is calculated as follows:
R
Connecting an external resistor (R TRIM pin and the V the output voltage set point. The following equations determine the required external resistor value to obtain a percentage output voltage change of ∆%:
R
uptrim
Where
(+) pin or the VO(-) pin.
O
VO(+)
VOTRIM
VO(-)
R
downtrim
 
downtrim
 
VV
,
  
R
desiredseto
V
,
seto
511
 
8
downtrim
(+) (or Sense (+)) pin increases
O
V
,seto
   
VV
V
,
seto
511
%225.1
%
,
setodesired
O, max
 
 
8%
22.10
%)100(11.5
 
 
.
R
R
trim-down

22.10
 
100%

 
655.53
) between the
trim-up
511
100%
trim-up
trim-down
) between
%
LOAD

22.10
 
EVW010A0B Series Power Modules
For example, to trim-up the output voltage of the module by 5% to 12.6V, R
is calculated is as
trim-up
follows:
5%
511
R
uptrim
 
R
uptrim
)5100(0.1211.5
5225.1
5
8.938

22.10
 
The voltage between the Vo(+) and Vo(–) terminals must not exceed the minimum output overvoltage protection value shown in the Feature Specifications table. This limit includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment trim.
Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (Maximum rated power = V
O,set
x I
O,max
).
Thermal Considerations
The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation.
Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability. The thermal data presented here is based on physical measurements taken in a wind tunnel.
The thermal reference point, T specifications for open frame modules is shown in Figure 13. For reliable operation this temperature should not exceed 122
Figure 13. T
ref
o
C.
Temperature Measurement
Location for open Frame Module.
The thermal reference point, T specifications for modules with heat plates (–H) is shown in Figure 14. For reliable operation this temperature should not exceed 114
used in the
ref
used in the
ref
o
C.
AIRFLOW
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Data Sheet September 4, 2013
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
Thermal Considerations (continued)
AIRFLOW
Figure 14. T Location for Heat plate Module.
Heat Transfer via Convection
Increased airflow over the module enhances the heat transfer via convection. Derating curves showing the maximum output current that can be delivered by the open frame module versus local ambient temperature (T
A) for natural convection and up to 3m/s (600
ft./min) forced airflow are shown in Figure 15.
10
9
(A)
8
O
7
6
5
4
OUTPUT CURRENT, I
3
Figure 15. Output Current Derating for the Open Frame Module; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V.
For additional power, the module is available with an optional heatplate (-H), that allows for the use of heatsinks to improve the thermal derating. Derating curves showing the maximum output current that can be delivered by the heatplate module with different heatsink heights versus local ambient temperature (T
A) for natural convection and up to 3m/s (600
ft./min) forced airflow are shown in Figures 16 -19.
Temperature Measurement
ref
3.0 m/s
(600LFM)
2.0 m/s
(400LFM)
1.0 m/s
(200LFM)
0.5 m/s
(100LFM)
20 30 40 50 60 70 80 90
NC
AMBIENT TEMEPERATURE, TA (oC)
EVW010A0B Series Power Modules
10
9
(A)
8
O
7
6
5
4
OUTPUT CURRENT, I
3
20 30 40 50 60 70 80 90
AMBIENT TEMEPERATURE, TA (oC)
Figure 16. Output Current Derating for the Module with Heatplate; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V.
10
9
(A)
8
O
7
6
5
4
OUTPUT CURRENT, I
3
20 30 40 50 60 70 80 90
AMBIENT TEMEPERATURE, TA (oC)
Figure 17. Output Current Derating for the Module with Heatplate and 0.25 in. heatsink; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V.
10
9
(A)
8
O
7
6
5
4
OUTPUT CURRENT, I
3
20 30 40 50 60 70 80 90
AMBIENT TEMEPERATURE, TA (oC)
Figure 18. Output Current Derating for the Module with Heatplate and 0.5 in. heatsink ; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V.
3.0 m/s
(600LFM)
2.0 m/s
(400LFM)
1.0 m/s
(200LFM)
2.0 m/s
(400LFM)
2.0 m/s
(400LFM)
0.5 m/s
(100LFM)
1.0 m/s
(200LFM)
0.5 m/s
(100LFM)
1.0 m/s
(200LFM)
0.5 m/s
(100LFM)
NC
NC
NC
LINEAGE POWER 9
Page 10
Data Sheet September 4, 2013
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
Thermal Considerations (continued)
10
EVW010A0B Series Power Modules
product information such as product code, serial number and the location of manufacture.
9
(A)
8
O
7
6
5
4
OUTPUT CURRENT, I
3
20 30 40 50 60 70 80 90
AMBIENT TEMEPERATURE, TA (oC)
1.0 m/s
(200LFM)
0.5 m/s
(100LFM)
NC
Figure 19. Output Current Derating for the Module with Heatplate and 1.0 in. heatsink; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V.
Please refer to the Application Note “Thermal Characterization Process For Open-Frame Board­Mounted Power Modules” for a detailed discussion of thermal aspects including maximum device temperatures.
Through-Hole Soldering Information
The RoHS-compliant (Z codes) through-hole products use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS­compliant components. The RoHS-compliant with lead solder exemption (non-Z codes) through-hole products use Sn/Pb solder and RoHS-compliant components. Both non-Z and Z codes are designed to be processed through single or dual wave soldering machines. The pins have an RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3
C/s is suggested. The wave preheat process
should be such that the temperature of the power module board is kept below 210 the recommended pot temperature is 260 Pb-free solder pot is 270
C. For Pb solder,
C, while the
C max. Not all RoHS-
compliant through-hole products can be processed with paste-through-hole Pb or Pb-free reflow process. If additional information is needed, please consult with your Lineage Power representative for more details.
Surface Mount Information
Pick and Place
The EVW010A0B modules use an open frame construction and are designed for a fully automated assembly process. The modules are fitted with a label designed to provide a large surface area for pick and place operations. The label meets all the requirements for surface mount processing, as well as safety standards, and is able to withstand reflow temperatures of up to 300
o
C. The label also carries
Figure 20. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by using open frame construction. Even so, these modules have a relatively large mass when compared to conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The minimum recommended nozzle diameter for reliable operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be used within the space available.
Reflow Soldering Information
The surface mountable modules in the EVW family use our newest SMT technology called “Column Pin” (CP) connectors. Figure 21 shows the new CP connector before and after reflow soldering onto the end-board assembly.
Figure 21. Column Pin Connector Before and After
The CP is constructed from a solid copper pin with an integral solder ball attached, which is composed of tin/lead (Sn/Pb) solder for non-Z codes, or Sn/Ag/Cu (SAC) solder for –Z codes. The CP connector design is able to compensate for large amounts of co­planarity and still ensure a reliable SMT solder joint. Typically, the eutectic solder melts at 183 solder) or 217-218 and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow
Reflow Soldering.
EVW Board
Insulator
Solder Ball
o
C (SAC solder), wets the land,
End as sembl y PCB
o
C (Sn/Pb
LINEAGE POWER 10
Page 11
Data Sheet September 4, 2013
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
EVW010A0B Series Power Modules
Surface Mount Information (continued)
technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR.
The following instructions must be observed when SMT soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Fig. 24.
Tin Lead Soldering
300
The recommended linear reflow profile using Sn/Pb solder is shown in Figure 22 and 23. For reliable soldering the solder reflow profile should be established by accurately measuring the modules CP connector temperatures.
300
250
200
15 0
10 0
REFLOW TEMP (C)
50
0
Peak Temp 235oC
Heat zone
oCs-1
max 4
Soak zone 30-240s
Preheat zo ne
oCs-1
max 4
REFLOW TIME (S)
T
lim
205
Co o ling zo ne 1- 4
above
o
C
oCs-1
Figure 22. Recommended Reflow Profile for Tin/Lead (Sn/Pb) process.
240
235
230
225
220
215
210
MAX TEMP SOLDER (C)
205
200
0 10 2030405060
Figure 23. Time Limit, T
, Curve Above 205oC for
lim
Tin/Lead (Sn/Pb) process.
Lead Free Soldering
The –Z version of the EVW010A0B modules are lead­free (Pb-free) and RoHS compliant and are both forward and backward compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability.
LINEAGE POWER 11
Per J-STD-020 Rev. C
250
200
150
Heat ing Zone 1°C/Second
100
Reflow Temp (°C)
50
0
Peak Temp 260°C
* Min. Time Above 235°C 15 Seconds
*Time Above 217°C
60 Seconds
Reflow Time (Seconds)
Cooling Zone
Figure 24. Recommended linear reflow profile using Sn/Ag/Cu solder.
MSL Rating
The EVW010A0B modules have a MSL rating of 2A.
Storage and Handling
The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of
30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag seal date, when stored at the following conditions: <40°C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board Mounted Power Modules: Soldering and Cleanin g Application Note (AN04-001).
Page 12
Data Sheet September 4, 2013
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
EVW010A0B Series Power Modules
EMC Considerations
The circuit and plots in Figure 25 shows a suggested configuration to meet the conducted emission limits of EN55022 Class B.
Level [dBµV]
80
70
60
50
x
40
30
20
10
0
150k 300k 500k 1M 2M 3M 4M 5M 7M 10M 30M
x xMES CE0615090841_fin QP
MES CE0615090841_pre PK
Level [dBµV]
80
70
Frequency [Hz]
x
x
x
x
x
60
50
+
40
30
20
10
0
150k 300k 500k 1M 2M 3M 4M5M 7M 10M 30M
+ +MES CE0615090841_fin AV
MES CE0615090841_pre AV
Frequency [Hz]
+
+
+
+
+
Figure 25. EMC Considerations
For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).
LINEAGE POWER 12
Page 13
Data Sheet September 4, 2013
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
Mechanical Outline for Surface Mount Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm
x.xx mm
Top
#
View
0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
0.25 mm [x.xxx in 0.010 in.]
#
Top side label includes Lineage Power name, product designation and date code.
EVW010A0B Series Power Modules
Side
View
Bottom
View
LINEAGE POWER 13
Page 14
Data Sheet September 4, 2013
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
Mechanical Outline for Through-Hole Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm
x.xx mm
0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
0.25 mm [x.xxx in 0.010 in.]
#Top side label includes Lineage Power name, product designation and date code.
Top
#
View
EVW010A0B Series Power Modules
Side
View
Bottom
View
* For optional pin lengths, see Table 2 Device Options and Coding Scheme
LINEAGE POWER 14
Page 15
Data Sheet September 4, 2013
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
EVW010A0B Series Power Modules
Mechanical Outline for Through-Hole Module with Heat Plate (-H)
Dimensions are in millimeters and [inches].
Tolerances: x.x mm
x.xx mm
0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
0.25 mm [x.xxx in 0.010 in.]
Top
View
Side View
Bottom
View
#
* For optional pin lengths, see Table 2 Device Options and Coding Scheme
#
Bottom side label includes Lineage Power name, product designation and date code.
LINEAGE POWER 15
Page 16
Data Sheet September 4, 2013
Recommended Pad Layout
Dimensions are in millimeters and [inches].
Tolerances: x.x mm
x.xx mm
0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
0.25 mm [x.xxx in 0.010 in.]
EVW010A0B Series Power Modules
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
SMT Recommended Pad Layout (Component Side View)
TH Recommended Pad Layout (Component Side View)
LINEAGE POWER 16
Page 17
Data Sheet September 4, 2013
EVW010A0B Series Power Modules
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
Packaging Details
The surface mount versions of the EVW surface mount modules (suffix –S) are supplied as standard in the plastic tray shown in Figure 26. The tray has external dimensions of 135.1mm (W) x 321.8mm (L) x
12.42mm (H) or 5.319in (W) x 12.669in (L) x 0..489in (H).
Tray Specification
Material Antistatic coated PVC
Max surface resistivity 10
Color Clear
Capacity 12 power modules
Min order quantity 48 pcs (1 box of 4 full trays)
Each tray contains a total of 12 power modules. The trays are self-stacking and each shipping box will contain 4 full trays plus one empty hold down tray giving a total number of 48 power modules.
12
/sq
Figure 26. Surface Mount Packaging Tray.
LINEAGE POWER 17
Page 18
Data Sheet
a
©
September 4, 2013
36 – 75Vdc Input; 12.0Vdc Output; 10A Output Current
EVW010A0B Series Power Modules
Ordering Information
Please contact your Lineage Power Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
Product Codes Input Voltage
Output
Voltage
EVW010A0B41Z 48V (36-75Vdc) 12V 10A Negative Through hole CC109143203
EVW010A0B64Z 48V (36-75Vdc) 12V 10A Positive Through hole CC109156015
EVW010A0B641Z 48V (36-75Vdc) 12V 10A Negative Through hole CC109158473
EVW010A0B41-HZ 48V (36-75Vdc) 12V 10A Negative Through hole CC109152781
EVW010A0B41-SZ 48V (36-75Vdc) 12V 10A Negative Surface mount CC109153516
Table 2. Device Options and Coding Scheme Characteristic Character and Position Definition
Form Factor E E = Eighth Brick Family Designator V Input Voltage W W = Wide Input Voltage Range, 36V -75V Output Current 010A0 010A0 = 010.0 Amps Rated Output Current
Ratings
Output Voltage B B = 12.0 Vout Nominal
Omit = No Pin Trim
Pin Length
6 6 = Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.)
8 8 = Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.) Action following Omit = Latching Mode Protective Shutdown 4 4 = Auto-restart following shutdown (Overcurrent/Overvoltage)
On/Off logic
Options
Customer Specific XY XY = Customer Specific Modified Code, Omit for Standard Code
Omit = Positive Logic
1 1 = Negative Logic
-
Omit = Standard open Frame Module Mechanical Features
H H = Heat plate (not available with –S option)
S S = Surface mount connections
RoHS
Omit = RoHS 5/6, Lead Based Solder Used
Z Z = RoHS 6/6 Compliant, Lead free
Output
Current
On/Off
Logic
Connector
Type
Comcodes
Asia-Pacific Headquarters
Tel: +86.021.54279977*808
World Wide Headquarters Lineage Power Corporation
601 Shiloh Road, Plano, TX 75074, USA +1-888-LINEAGE(546-3243) (Outside U.S.A.: +1-972-244-WATT(9288))
www.lineagepower.com e-mail: techsupport1@lineagepower.com
Lineage Power reserves the right to make changes to the prod uct(s) or information contained herein without notice. No liability is assumed as a result of their use or
pplication. No rights under any patent accompany the sale of any such product (s) or information.
Lineage Power DC-DC products are protected under various pat ents. Information on these patents is available at www.lineagepower.com/patents.
2010 Lineage Power Corporation, (Plano, Texas) All Internationa l Rights Reserved.
Europe, Middle-East and Africa Headquarters
Tel: +49.89.878067-280
India Headquarters
Tel: +91.80.28411633
Document No: DS09-006 ver. 1.2
PDF name: evw010_ds.pdf
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