Page 1
Data Sheet
May 6, 2011
ESTW015A0F Series (Eighth-Brick) DC-DC Converter Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output Current
* UL is a registered trademark of Underwriters Laboratories, Inc.
†
CSA is a registered trademark of Canadian Standards Association.
‡
VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
§
This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed.
¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.
** ISO is a registered trademark of the International Organization of Standards
Document No: DS09-004 ver.1.03
PDF name: ESTW015A0F.pdf
STINGRAY™ SERIES
Features
Compliant to RoHS EU Directive 2002/95/EC (-Z
versions)
Compliant to ROHS EU Directive 2002/95/EC with
lead solder exemption (non-Z versions)
Delivers up to 15A Output current
High efficiency 91% at full load (Vin=48Vdc)
Full load at TA=85 oC for airflow of 1 m/s(200 LFM)
or greater
Industry standard, DOSA compliant footprint
57.9mm x 22.8mm x 8.5mm
(2.28 in x 0.9 in x 0.335 in)
Wide input voltage range: 36-75 Vdc
Tightly regulated output
Constant switching frequency
Positive remote On/Off logic
Input under voltage protection
Output overcurrent and overvoltage protection
Over-temperature protection
Remote sense
Output Voltage adjust: 80% to 110% of V
o,nom
Wide operating temperature range (-40°C to 85°C)
UL* 60950-1, 2nd Ed. Recognized, CSA† C22.2 No.
60950-1-07 Certified, and VDE‡ (EN60950-1, 2nd
Ed.) Licensed
CE mark meets 2006/95/EC directive§
Meets the voltage and current requirements for
ETSI 300-132-2 and complies with and licensed for
Basic insulation rating per EN60950-1
2250 Vdc Isolation tested in compliance with IEEE
802.3¤ PoE standards
ISO**9001 and ISO 14001 certified manufacturing
facilities
Applications
Distributed power architectures
Wireless networks
Access and optical network Equipment
Enterprise Networks including Power over Ethernet
(PoE)
Latest generation IC’s (DSP, FPGA, ASIC) and
Microprocessor powered applications
Options
Negative Remote On/Off logic (-1 option,
preferred/standard)
Surface Mount version (-S option)
Auto-restart (-4 option, preferred/standard)
Trimmed leads (-6 or -8 options)
Description
The Lineage Power® Stingray™ Series, ESTW015A0F, Eighth-brick power modules are cost optimized isolated dc-dc
converters that can deliver up to 15A of output current and provide a precisely regulated output voltage over a wide range of
input voltages (Vin = 36 -75Vdc). The module achieves full load efficiency of 91% at 3.3Vdc output voltage. The open frame
modules construction, available in both surface-mount and through-hole packaging, enable designers to develop cost- and
space-efficient solutions. Standard features include remote On/Off, remote sense, output voltage adjustment, overvoltage,
overcurrent and overtemperature protection.
RoHS Compliant
Page 2
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
Parameter
Device
Symbol
Min
Max
Unit
Input Voltage
Continuous
All
V
IN
-0.3
80
Vdc
Transient, operational (≤100 ms)
All
V
IN,trans
-0.3
100
Vdc
Operating Ambient Temperature
All
TA -40
85
°C
(see Thermal Considerations section)
Storage Temperature
All
T
stg
-55
125
°C
I/O Isolation voltage (100% factory Hi-Pot tested)
All
2250
Vdc
Parameter
Device
Symbol
Min
Typ
Max
Unit
Operating Input Voltage
All
VIN
36
48
75
Vdc
Maximum Input Current
All
I
IN,max
2.0
Adc
(VIN= V
IN, min
to V
IN, max
, IO=I
O, max
)
Input No Load Current
All
I
IN,No load
30 mA
(VIN = V
IN, nom
, IO = 0, module enabled)
Input Stand-by Current
All
I
IN,stand-by
6 8 mA
(VIN = V
IN, nom
, module disabled)
Inrush Transient
All
I2t
1
A2s
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; V
IN, min
to V
IN, max,
IO= I
Omax
; See Test configuration section)
All
30 mA
p-p
Input Ripple Rejection (120Hz)
All
50 dB
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute
stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those
given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can
adversely affect the device reliability.
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions.
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an
integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included,
however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies
require a fast-acting fuse with a maximum rating of 5 A (see Safety Considerations section). Based on the information
provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating
can be used. Refer to the fuse manufacturer’s data sheet for further information.
LINEAGE POWER 2
Page 3
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
Parameter
Device
Symbol
Min
Typ
Max
Unit
Nominal Output Voltage Set-point
VIN=V
IN, nom
, IO=I
O, max
, TA=25°C)
All
V
O, set
3.25
3.3
3.35
V
dc
Output Voltage
All
VO 3.2 3.4
V
dc
(Over all operating input voltage, resistive load, and
temperature conditions until end of life)
Output Regulation
Line (VIN=V
IN, min
to V
IN, max
)
All
±0.1
% V
O, set
Load (IO=I
O, min
to I
O, max
)
All
10
mV
Temperature (T
ref=TA, min
to T
A, max
)
All
±0.2
% V
O, set
Output Ripple and Noise on nominal output
(VIN=V
IN, nom
,IO= I
O, max
, TA=T
A, min
to T
A, max
)
RMS (5Hz to 20MHz bandwidth)
All
8
20
mV
rms
Peak-to-Peak (5Hz to 20MHz bandwidth)
All
40
75
mV
pk-pk
External Capacitance
All
C
O, max
0 5,000
μF
Output Current
All
Io 0 15.0
Adc
Output Current Limit Inception (Hiccup Mode )
All
I
O, lim
19 Adc
(VO= 90% of V
O, set
)
Output Short-Circuit Current (VO≤250mV)
All
I
O, s/c
60
2.5
A
pk
A
AVG
( Hiccup Mode)
Efficiency
VIN= V
IN, nom
, TA=25°C, IO=I
O, max , VO
= V
O,set
All η 90.0
91.0 %
VIN= V
IN, nom
, TA=25°C, IO=10A
, VO
= V
O,set
All η 90.0
91.0 %
VIN= V
IN, nom
, TA=25°C, IO=4A
, VO
= V
O,set
All η 85.5
87.0 %
Switching Frequency
All
f
sw
355 kHz
Dynamic Load Response
(dIo/dt=0.1A/ s; VIN = V
IN, nom
; TA=25°C)
Load Change from Io= 50% to 75% or 25% to 50% of
I
o,max
Peak Deviation
All
V
pk
210 mV
Settling Time (Vo<10% peak deviation)
All
t
s
200
s
Parameter
Device
Symbol
Min
Typ
Max
Unit
Isolation Capacitance
All
C
iso
1000 pF
Isolation Resistance
All
R
iso
10
MΩ
I/O Isolation Voltage (100% factory Hi-pot tested)
All
All
2250
Vdc
Parameter
Device
Symbol
Min
Typ
Max
Unit
Calculated Reliability based upon Telcordia SR-332
Issue 2: Method I Case 3 (IO=80%I
O, max
, TA=40°C,
airflow = 200 lfm, 90% confidence)
All
FIT
212.2
109/Hours
All
MTBF
4,713,305
Hours
Weight
All
15.2
(0.6)
g
(oz.)
Electrical Specifications (continued)
Isolation Specifications
General Specifications
LINEAGE POWER 3
Page 4
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
Parameter
Device
Symbol
Min
Typ
Max
Unit
Remote On/Off Signal Interface
(VIN=V
IN, min
to V
IN, max
; open collector or equivalent,
Signal referenced to V
IN-
terminal)
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On
Logic Low - Remote On/Off Current (V
on/off
= -0.7 Vdc)
All
I
on/off
0.15
mA
Logic Low - On/Off Voltage
All
V
on/off
-0.7 0.6
Vdc
Logic High Voltage (I
on/off
= 0Adc)
All
V
on/off
2.4 15.0
Vdc
Logic High maximum leakage current
All
I
on/off
25
μA
Turn-On Delay1 and Rise Times
(IO=I
O, max , VIN=VIN, nom, TA
= 25oC)
Case 1: Input power is applied for >1 second and then
the On/Off input is set to ON (T
delay
= time from instant
On/Off signal is ON until VO = 10% of V
O, set
)
All
T
delay
― 12 ― msec
Case 2: On/Off input is set to Logic Low (Module
ON) and then input power is applied (T
delay
= time
at which VIN = V
IN, min
until Vo=10% of V
O,set
)
All
T
delay
― 20 ― msec
Output voltage Rise time (time for Vo to rise from 10%
of V
o,set
to 90% of V
o, set
)
All
T
rise
― 4 ―
msec
Output voltage overshoot – Startup
All
― 5 % V
O, set
IO= I
O, max
; VIN=V
IN, min
to V
IN, max
, TA = 25 oC
Remote Sense Range
All
V
SENSE
10
% V
O, set
Output Voltage Adjustment Range
All -20 +10
% V
O, set
Output Overvoltage Protection (CO=220μF)
All
V
O, limit
3.9 5.0
Vdc
Overtemperature Protection – Hiccup Auto Restart
All
T
ref
138
O
C
Input Undervoltage Lockout
All
V
UVLO
Turn-on Threshold
32
34.5
Vdc
Turn-off Threshold
27.5
30 Vdc
Hysteresis
1
2 Vdc
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See Feature Descriptions for additional information.
1. The module has an adaptable extended Turn-On Delay interval, T
either: 1) the rapid cycling of Vin from normal levels to less than the Input Undervoltage Lockout (which causes module shutdown), and then back
to normal; or 2) toggling the on/off signal from on to off and back to on without removing the input voltage. The normal Turn-On Delay interval, T
will occur whenever a module restarts with input voltage removed from the module for the preceding 1 second.
LINEAGE POWER 4
, of 25mS. The extended T
delay
will occur when the module restarts following
delay
delay
,
Page 5
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
EFFICIENCY, (%)
OUTPUT CURRENT OUTPUT VOLTAGE
Io(A) (5A/div) V
O
(V) (200mV/div)
OUTPUT CURRENT, IO (A)
TIME, t (200µs/div)
Figure 1. Converter Efficiency versus Output Current.
Figure 4. Transient Response to 0.1A/µS Dynamic
Load Change from 50% to 75% to 50% of full load.
OUTPUT VOLTAGE
V
O
(V) (20mV/div)
On/Off VOLTAGE OUTPUT VOLTAGE
V
O
(V) (2V/div) V
On/Off
(V) (1V/div)
TIME, t (2 s/div)
TIME, t (10ms/div)
Figure 2. Typical output ripple and noise (VIN = VIN,NOM,
Io = Io,max).
Figure 5. Typical Start-up Using Remote On/Off,
negative logic version shown (VIN = VIN,NOM, Io = Io,max).
OUTPUT CURRENT OUTPUT VOLTAGE
Io(A) (5A/div) V
O
(V) (200mV/div)
INPUT VOLTAGE OUTPUT VOLTAGE
V
O
(V) (20V/div V
IN
(V) (1V/div)
TIME, t (200µs/div)
TIME, t (5ms/div)
Figure 3. Transient Response to 0.1A/µS Dynamic
Load Change from 25% to 50% to 25% of full load.
Figure 6. Typical Start-up Using Input Voltage (VIN =
VIN,NOM, Io = Io,max).
Characteristic Curves
The following figures provide typical characteristics for the ESTW015A0F (3.3V, 15A) at 25oC. The figures are
identical for either positive or negative remote On/Off logic.
LINEAGE POWER 5
Page 6
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
TO OSCILLOSCOPE
CURRENT PROBE
L
TEST
12μH
BATTERY
CS 220μF
E.S.R.<0.1
@ 20°C 100kHz
33μF
Vin+
Vin-
NOTE: Measure input reflected ripple current with a simulated
source inductance (L
TEST
) of 12μH. Capacitor CS offsets
possible battery impedance. Measure current as shown
above.
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
V O (+)
V O ( – )
0.01uF
RESISTIVE
LOAD
SCOPE
COPPER STRIP
GROUND PLANE
10uF
0.1uF
Vout+
Vout-
Vin+
Vin-
R
LOAD Rcontact Rdistribution
R
contact Rdistribution Rcontact
R
contact Rdistribution
R
distribution
V
IN
V
O
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
=
VO.
I
O
VIN.
I
IN
x 100 % Efficiency
Test Configurations
Design Considerations
Input Filtering
The power module should be connected to a low
ac-impedance source. Highly inductive source
impedance can affect the stability of the power
module. For the test configuration in Figure 7 a 33μF
electrolytic capacitor (ESR<0.7 at 100kHz), mounted
close to the power module helps ensure the stability of
the unit. Consult the factory for further application
guidelines.
Safety Considerations
For safety-agency approval of the system in which the
power module is used, the power module must be
Figure 7. Input Reflected Ripple Current Test
Setup.
Figure 8. Output Ripple and Noise Test Setup.
Figure 9. Output Voltage and Efficiency Test
Setup.
installed in compliance with the spacing and
separation requirements of the end-use safety agency
standard, i.e. UL60950-1, CSA C22.2 No.60950-1,
and VDE0805-1(IEC60950-1).
If the input source is non-SELV (ELV or a hazardous
voltage greater than 60 Vdc and less than or equal to
75Vdc), for the module’s output to be considered as
meeting the requirements for safety extra-low voltage
(SELV), all of the following must be true:
The input source is to be provided with reinforced
insulation from any other hazardous voltages,
including the ac mains.
One VIN pin and one V
pin are to be grounded,
OUT
or both the input and output pins are to be kept
floating.
The input pins of the module are not operator
accessible.
Another SELV reliability test is conducted on the
whole system (combination of supply source and
subject module), as required by the safety
agencies, to verify that under a single fault,
hazardous voltages do not appear at the
module’s output.
Note: Do not ground either of the input pins of the
module without grounding one of the output
pins. This may allow a non-SELV voltage to
appear between the output pins and ground.
The power module has extra-low voltage (ELV)
outputs when all inputs are ELV.
All flammable materials used in the manufacturing of
these modules are rated 94V-0, or tested to the
UL60950 A.2 for reduced thickness.
For input voltages exceeding –60 Vdc but less than or
equal to –75 Vdc, these converters have been
evaluated to the applicable requirements of BASIC
INSULATION between secondary DC MAINS
DISTRIBUTION input (classified as TNV-2 in Europe)
and unearthed SELV outputs.
The input to these units is to be provided with a
maximum 5 A fast-acting fuse in the ungrounded lead.
LINEAGE POWER 6
Page 7
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
ON/OFF
Vin+
Vin-
I
on/off
V
on/off
Vout+
TRIM
Vout-
Figure 11. Circuit Configuration for remote
sense .
VO(+)
SENSE(+)
SENSE(–)
VO(–)
VI(+)
VI(-)
IO
LOAD
CONTACT AND
DISTRIBUTION LOSSES
SUPPLY
II
CONTACT
RESISTANCE
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic
turns the module on during a logic high voltage on the
ON/OFF pin, and off during a logic low. Negative logic
remote On/Off, device code suffix “1”, turns the
module off during a logic high and on during a logic
low.
Figure 10. Remote On/Off Implementation.
To turn the power module on and off, the user must
supply a switch (open collector or equivalent) to
control the voltage (V
terminal and the VIN(-) terminal (see Figure 10). Logic
low is -0.7V ≤ V
on/off
a logic low is 0.15mA, the switch should maintain a
logic low level while sinking this current.
During a logic high, the typical maximum V
generated by the module is 15V, and the maximum
allowable leakage current at V
If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to VIN(-).
Remote Sense
Remote sense minimizes the effects of distribution
losses by regulating the voltage at the remote-sense
connections (See Figure 11). The voltage between the
remote-sense pins and the output terminals must not
exceed the output voltage sense range given in the
Feature Specifications table:
[VO(+) – VO(–)] – [SENSE(+) – SENSE(–)] 0.5 V
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim.
The amount of power delivered by the module is
defined as the voltage at the output terminals
multiplied by the output current. When using remote
sense and trim, the output voltage of the module can
) between the ON/OFF
on/off
≤ 0.6V. The maximum I
= 2.4V is 25μA.
on/off
on/off
on/off
during
be increased, which at the same output current would
increase the power output of the module. Care should
be taken to ensure that the maximum output power of
the module remains at or below the maximum rated
power (Maximum rated power = Vo,set x Io,max).
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout
limit, the module operation is disabled. The module
will only begin to operate once the input voltage is
raised above the undervoltage lockout turn-on
threshold, V
UV/ON
.
Once operating, the module will continue to operate
until the input voltage is taken below the undervoltage
turn-off threshold, V
UV/OFF
.
Overtemperature Protection
To provide protection under overtemperature fault
conditions, the unit is equipped with a thermal
shutdown circuit. The unit will shutdown if the thermal
reference points Trefx (Figure 13), exceed 138oC
(typical). However, the thermal shutdown is not
intended as a guarantee that the unit will survive
temperatures beyond its rating. The module restarts
automatically after the unit cools down below the
overtemperature protection thresholds.
Output Overvoltage Protection
The output over voltage protection scheme of the
modules has an independent over voltage loop to
prevent single point of failure. This protection feature
latches in the event of over voltage across the output.
Cycling the on/off pin or input voltage resets the
latching protection feature. If the auto-restart option
(4) is ordered, the module will automatically restart
upon an internally programmed time elapsing.
Overcurrent Protection
To provide protection in a fault (output overload)
condition, the unit is equipped with internal
current limiting circuitry and can endure current
limiting continuously. At the point of current limit
inception, the unit enters hiccup mode. If the unit is
not configured with auto–restart, then it will latch off
following the over current condition. The module can
be restarted by cycling the dc input power for at least
one second or by toggling the remote on/off signal for
at least one second. If the unit is configured with the
LINEAGE POWER 7
Page 8
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
VO(+)
VOTRIM
VO(-)
R
trim-down
LOAD
VIN(+)
ON/OFF
VIN(-)
R
trim-up
22.10
%
511
downtrim
R
100%
,,seto
desiredseto
V
VV
8%
22.10
8
511
downtrim
R
655.53
downtrim
R
22.10
%
511
%225.1
%)100(11.5
,seto
uptrim
V
R
100%
,,seto
setodesired
V
VV
5%
22.10
5
511
5225.1
)5100(3.311.5
uptrim
R
7.176
uptrim
R
Feature Descriptions (continued)
auto-restart option (4), it will remain in the hiccup
mode as long as the overcurrent condition exists; it
operates normally, once the output current is brought
back into its specified range. The average output
current during hiccup is 10% I
O, max
.
Output Voltage Programming
Trimming allows the output voltage set point to be
increased or decreased, this is accomplished by
connecting an external resistor between the TRIM pin
and either the VO(+) pin or the VO(-) pin (Figure 12).
Figure 12. Circuit Configuration to Trim Output
Voltage.
Connecting an external resistor (R
the TRIM pin and the VO(-) (or Sense(-)) pin
decreases the output voltage set point. To maintain
set point accuracy, the trim resistor tolerance should
be ±1.0%.
The following equation determines the required
external resistor value to obtain a percentage output
voltage change of Δ%
trim-down
) between
Where
For example, to trim-up the output voltage of the
module by 5% to 3.465V, R
is calculated is as
trim-up
follows:
The voltage between the VO(+) and VO(–) terminals
must not exceed the minimum output overvoltage
protection value shown in the Feature Specifications
table. This limit includes any increase in voltage due
to remote-sense compensation and output voltage
set-point adjustment trim.
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim. The amount of power
delivered by the module is defined as the voltage at
the output terminals multiplied by the output current.
When using remote sense and trim, the output voltage
of the module can be increased. Therefore, for the
same output current, this would increase the output
power of the module. Care should be taken to ensure
that the maximum output power of the module
remains at or below the maximum rated power
(Maximum rated power = V
O,set
x I
O,max
).
Where
For example, to trim-down the output voltage of the
module by 8% to 3.036V, Rtrim-down is calculated as
follows:
Connecting an external resistor (R
) between the
trim-up
TRIM pin and the VO(+) (or Sense (+)) pin increases
the output voltage set point. The following equation
determines the required external resistor value to
obtain a percentage output voltage change of Δ%:
LINEAGE POWER 8
Page 9
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
OUTPUT CURRENT, I
O
(A)
AMBIENT TEMEPERATURE, TA (oC)
10
11
12
13
14
15
16
20 30 40 50 60 70 80 90
NC
0.5m/s
(100LFM)
1.0m/s
(200LFM)
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel.
The thermal reference points, Trefx used in the
specifications for open frame modules are shown in
Figure 13. For reliable operation Tref1 and Tref2
temperatures should not exceed 125oC and Tref3
temperature should not exceed 110 oC.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
the thermal aspects including maximum device
temperatures.
Figure 13. T
Temperature Measurement
ref
Location for Open Frame Module.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating curves, showing the
maximum output current that can be delivered by
the module versus local ambient temperature (TA)
for natural convection and up to 1m/s (200 ft./min)
forced airflow, are shown in Figure 14. Full power up
to TA=85 oC, is achieved for airflow of 1 m/s(200 LFM)
or greater.
Figure 14. Output Current Derating for the Open
Frame Module; Airflow in the Transverse Direction
from Vout(+) to Vout(-); Vin =48V.
LINEAGE POWER 9
Page 10
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
REFLOW TEMP ( C)
REFLOW TIME (S)
MAX TEMP SOLDER ( C)
Surface Mount Information
Pick and Place
The ESTW015A0F modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a
label designed to provide a large surface area for pick
and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300oC. The label also carries
product information such as product code, serial
number and the location of manufacture.
Figure 15. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
Tin Lead Soldering
The ESTW015A0F power modules are lead free
modules and can be soldered either in a lead-free
solder process or in a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235oC. Typically, the eutectic solder melts at 183oC,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
Figure 16. Reflow Profile for Tin/Lead (Sn/Pb)
process.
Figure 17. Time Limit Curve Above 205oC for
Tin/Lead (Sn/Pb) process
Lead Free Soldering
The –Z version of the ESTW015A0F modules are
lead-free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.
Reflow Soldering Information
The surface mountable modules in the
ESTW015A0F-S family use our newest SMT
technology called “Column Pin” (CP) connectors.
LINEAGE POWER 10
Page 11
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
ESTW Board
Insulator
Solder Ball
End assembly PCB
Per J-STD-020 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
Reflow Temp (°C)
Heating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone
Surface Mount Information (continued)
Figure 18 shows the new CP connector before and
after reflow soldering onto the end-board assembly.
at conditions of 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
Figure 18. Column Pin Connector Before and After
Reflow Soldering .
The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn63/Pb37) solder for non-Z codes, or
Sn/Ag
3.8
/Cu
(SAC) solder for –Z codes. The CP
0.7
connector design is able to compensate for large
amounts of co-planarity and still ensure a reliable
SMT solder joint. Typically, the eutectic solder melts
at 183oC (Sn/Pb solder) or 217-218 oC (SAC solder),
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure 19.
MSL Rating
The ESTW015A0F modules have a MSL rating of 1.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
both the reliability of a power module and the
testability of the finished circuit board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).
Figure 19. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have a RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3 C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210 C. For Pb solder, the recommended pot
temperature is 260 C, while the Pb-free solder pot is
270 C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
representative for more details.
LINEAGE POWER 11
Page 12
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
LISN connected to L Line
LISN connected to N Line
C1
L1
C2 C3
C4 C5
DC/DC
C6
++
-48V
RTN
GND
VCC
GND
LOAD
EMC Considerations
The filter circuit schematic and plots in Figure 20 shows a suggested configuration as tested to meet the conducted
emission limits of EN55022 Class A.
Note: Customer is ultimately responsible for the proper selection, component rating and verification of the suggested
parts based on the end application.
Figure 20. EMC Considerations
For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).
LINEAGE POWER 12
Page 13
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
Top
View*
Top side label includes Lineage Power name, product designation and date code.
Side
View
*For optional pin lengths, see Table 2, Device Options
Bottom
View
Pin
Function
1
Vi(+) 2 ON/OFF
3
Vi(-) 4 Vo(-)
5
SENSE(-)
6
TRIM
7
SENSE(+)
8
Vo(+)
Mechanical Outline for Through-Hole Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
LINEAGE POWER 13
Page 14
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
Top
View*
* Top side label includes Lineage Power name, product designation and date code.
Side
View
Bottom
View
Pin
Function
1
Vi(+)
2
ON/OFF
3
Vi(-) 4 Vo(-) 5 SENSE(-)
6
TRIM
7
SENSE(+)
8
Vo(+)
Mechanical Outline for Surface Mount Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
LINEAGE POWER 14
Page 15
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
SMT Recommended Pad Layout (Component Side View)
TH Recommended Pad Layout (Component Side View)
Recommended Pad Layout
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
LINEAGE POWER 15
Page 16
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
Packaging Details
The surface mount versions of the ESTW015A0F
modules (suffix –S) are supplied as standard in
the plastic tray shown in Figure 21. The tray has
external dimensions of 135.1mm(W) x 321.8mm(L) x
12.42mm(H) or 5.319in(W) x 12.669in(L) x 0.489in(H).
Tray Specification
Material Antistatic coated PVC
Max surface resistivity 1012/sq
Color Clear
Capacity 12 power modules
Min order quantity 48 pcs (1 box of 4 full trays)
Each tray contains a total of 12 power modules. The
trays are self-stacking and each shipping box will
contain 4 full trays plus one empty hold down tray
giving a total number of 48 power modules.
Figure 21. Surface Mount Packaging Tray.
LINEAGE POWER 16
Page 17
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
Document No: DS09-004 ver.1.03
PDF name: ESTW015A0F.pdf
Product Codes
Input Voltage
Output
Voltage
Output
Current
On/Off
Logic
Connector
Type
Comcodes
ESTW015A0F61
48V (36-75Vdc)
3.3V
15A
Negative
Through hole
CC109158093
ESTW015A0F641
48V (36-75Vdc)
3.3V
15A
Negative
Through hole
CC109158102
ESTW015A0F41Z
48V (36-75Vdc)
3.3V
15A
Negative
Through hole
CC109158085
ESTW015A0F641-Z
48V (36-75Vdc)
3.3V
15A
Negative
Through hole
CC109159942
ESTW015A0F41-SZ
48V (36-75Vdc)
3.3V
15A
Negative
Surface Mount
CC109159422
Ordering Information
Please contact your Lineage Power Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
Table 2. Device Options
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