GE Industrial Solutions ESTW006A0B User Manual

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Page 1

Data Sheet

November 5, 2012

ESTW006A0B Series (Eighth-Brick) DC-DC Converter Power Modules

Barracuda Series™

RoHS Compliant

Applications

 Distributed Power Architectures

 Wireless Networks

 Access and Optical Network Equipment

 Industrial Equipment

Options

 Negative Remote On/Off logic (preferred)

 Overcurrent/Overtemperature/Overvoltage

protections (Auto-restart) (preferred)

 Heat plate version (-H)

 Surface Mount version (-S)

36 - 75V

Input; 12V/6A

Output

Features

 Compliant to RoHS EU Directive 2002/95/EC (-Z

versions)

 Flat and high-efficiency curve

 Industry standard, DOSA compliant footprint

57.9mm x 22.8mm x 7.6mm (2.28 in x 0.9 in x 0.30 in)

 Low-profile height and reduced component skyline

 Ultra-wide input voltage range: 36-75 V

 Tightly regulated output

 Remote sense

 Output voltage adjust: 90% to 110% of V

 Constant switching frequency

 Positive remote On/Off logic

 Input under/overvoltage protection

 Output overcurrent and overvoltage protection

 Overtemperature protection

 No reverse current during output shutdown

 Wide operating temperature range (-40°C to 85°C)

 Suitable for cold wall cooling using suitable Gap Pad

applied directly to top side of module

 UL*Recognized to UL60950-1, CAN/CS A

No.60950-1, and EN60950-1(

 CE mark meets 2006/95/EC directive

 Meets the voltage and current requirements for ETSI

300-132-2 and complies with and licensed for basic insulation rating per EN60950-1

 2250 Vdc Isolation tested in compliance with IEEE

 ISO

PoE standards

802.3

9001 and ISO 14001 certified manufacturing

facilities

‡

VDE

0805-1) Licensed

O,nom

†

C22.2

Description

The ESTW006A0B [Barracuda™] Series, eighth-brick, low-height power modules are isolated DC-DC converters that provide a single, precisely regulated output voltage over an input voltage range of 36-75V provides 12V

nominal output voltage rated for 6Adc output current. The module incorporates Lineage Power’s vast

heritage for reliability and quality, while also using the latest in technology and component and process standardization to achieve highly competitive cost. The open frame module construction, available in both surface mount and through-hole packaging, enables designers to develop cost and space efficient solutions. The module achieves typical full load efficiency greater than 90% at V

=48Vdc. Standard features include remote On/Off, remote

sense, output voltage adjustment, overvoltage, overcurrent and overtemperature protection. An optional heat plate allows for external standard, eighth-brick heat sink attachment to achieve higher output current in high temperature applications.

. The ESTW006A0B

UL is a registered trademark of Underwriters Laboratories, Inc.

†

CSA is a registered trademark of Canadian Standar ds Association.

‡

VDE is a trademark of Verband Deutscher Elektrotechniker e.V.

This product is intended for integration into end-user equipm ent . All of the required procedures of end-use e quipment should be followed. ¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated. ** ISO is a registered trademark of the International Or ganization of Standards

Document No: ver. 1.2

PDF name: ESTW006A0B.pd

Page 2

Data Sheet November 5, 2012

ESTW006A0B Series Eighth-Brick Power Modules

36 - 75Vdc Input; 12V/6A

Output

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.

Parameter Device Symbol Min Max Unit

Input Voltage

Continuous All V

Transient, operational (≤100 ms) All V

Operating Ambient Temperature All T

(see Thermal Considerations section)

Storage Temperature All T

I/O Isolation Voltage (100% factory Hi-Pot tested) All

IN,trans

stg

 

-0.3 80 Vdc

-0.3 100 Vdc

-40 85 °C

-55 125 °C

2250 Vdc

Electrical Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load and temperature conditions.

Parameter Device Symbol Min Typ Max Unit

Operating Input Voltage All VIN 36 48 75 Vdc

Maximum Input Current

(VIN= V

Input No Load Current

(VIN = 48V, IO = 0, module enabled)

Input Stand-by Current All

(VIN = 48V, module disabled)

Inrush Transient All I2t 0.5 A2s

IN, min

to V

IN, max

, VO= V

O, set

, IO=I

O, max

)

All I

IN,No load

IN,stand-by

2.6 3.0 Adc

80 mA

5 8 mA

Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1μH source impedance; V IO= I

; See test configuration section)

Omax

Input Ripple Rejection (120Hz) All 50 dB

IN, min

to V

IN, max,

All 30 mA

p-p

CAUTION: This power module is not internally fused. An input line fuse must always be used.

This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included; however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 10 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum DC input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information.

LINEAGE POWER 2

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Data Sheet

November 5, 2012

ESTW006A0B Series Eighth-Brick Power Modules

36 - 75Vdc Input; 12V/6A

Output

Electrical Specifications (continued)

Parameter Device Symbol Min Typ Max Unit

Nominal Output Voltage Set-point

VIN= 48V IO=I

O, max

, TA=25°C)

All V

O, set

Output Voltage

(Overall operating input voltage, resistive load, and

All V

temperature conditions until end of life)

Output Regulation

Line (VIN=V Load (IO=I

Temperature (T

IN, min

O, min

to V

to I

O, max

ref=TA, min

) All

IN, max

)

to T

) All

A, max

All

Output Ripple and Noise

(VIN=V

IN, min

to V

IN, max

, IO= I

O, max

, TA=T

, min

to T

)

, max

RMS (5Hz to 20MHz bandwidth) All

Peak-to-Peak (5Hz to 20MHz bandwidth) All

External Capacitance All C

O, max

Output Current All I

Output Current Limit Inception (Hiccup Mode )

(VO= 90% of V

O, set

)

Output Short-Circuit Current

(VO≤250mV) ( Hiccup Mode )

All

All I

O, lim

O, s/c

Efficiency

VIN=48V, TA=25°C, IO=3A, VO = 12V All η 90.0 %

VIN=48V, TA=25°C, IO=6A, VO = 12V All η 90.5 %

Switching Frequency All f

Dynamic Load Response

(dIo/dt=0.1A/s; VIN = 48V; TA=25°C; CO>100μF) Load Change from Io= 50% to 75% or 25% to 50% of

o,max

Peak Deviation All V

Settling Time (Vo<10% peak deviation)

All t

11.80 12.00 12.24 V

11.64



 

12.36 V

±0.2 % V

  ±0.2 % V

 

0 6 Adc

25 50 mV

75 200 mV 

±1.0

2,000 μF

% V

6.6 7.8 9.0 Adc

5 A

280 kHz

 

200

  s

% V

O, set

pk-pk

rms

O, set

rms

Isolation Specifications

Parameter Device Symbol Min Typ Max Unit

Isolation Capacitance All C

Isolation Resistance All R

I/O Isolation Voltage (100% factory Hi-pot tested) All All

iso



100

 

1000

 



2250 Vdc

MΩ

General Specifications

Parameter Device Symbol Min Typ Max Unit

Calculated Reliability based upon Telcordia SR-332 Issue 2: Method airflow = 200 lfm, 90% confidence)

Weight (Open Frame) All 19 (0.7) g (oz.)

Weight (with Heat Plate) All 30 (1.1) g (oz.)

I Case 3 (I

=80%I

O, max

, TA=40°C,

All FIT 381.7 10

/Hours

All MTBF 2,619,994 Hours

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Data Sheet November 5, 2012

ESTW006A0B Series Eighth-Brick Power Modules

36 - 75Vdc Input; 12V/6A

Output

Feature Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load and temperature conditions. See Feature Descriptions for additional information.

Parameter Device Symbol Min Typ Max Unit

Remote On/Off Signal Interface

(VIN=V Signal referenced to V Negative Logic: device code suffix “1” Logic Low = module On, Logic High = module Off Positive Logic: No device code suffix required Logic Low = module Off, Logic High = module On

Logic Low - Remote On/Off Current All I

Logic Low - On/Off Voltage All V

Logic High Voltage – (Typ = Open Collector) All V

Logic High maximum allowable leakage current All I

Turn-On Delay and Rise Times

(IO=I

Case 1: Input power is applied for at least 1 second then the On/Off input is set from OFF to ON

delay

Case 2: On/Off input is set to Logic Low (Module ON) then input power is applied (T

Output voltage Rise time (time for Vo to rise from 10% of V

Output Voltage Overshoot – Startup

IO= I

Remote Sense Range All V

Output Voltage Adjustment Range All 90 110 % V

Output Overvoltage Protection

Overtemperature Protection – Hiccup Auto Restart

Heat Plate

Input Undervoltage Lockout All V

Turn-on Threshold

Turn-off Threshold

Hysteresis 1 2.0 Vdc

Input Overvoltage Lockout All V

Turn-on Threshold 76 77

Turn-off Threshold

Hysteresis 1 2

to V

IN, min

O, max , VIN=VIN, nom, TA

; open collector or equivalent,

IN, max

terminal)

IN-

= 25oC)

= On/Off pin transition until VO = 10% of V

= VIN reaches V

delay

to 90% of V

o,set

; VIN=V

O, max

IN, min

until Vo=10% of V

IN, min

)

o, set

to V

IN, max

, TA = 25 oC

O,set

O, set

)

on/off

)

All T

All

All V

Open frame

Heat

Plate

delay

rise

SENSE

O, limit

ref

UVLO

OVLO

 

-0.7

2.5

 

― 12 ― msec

― 22 35 msec

― 15 25 msec

― 3 % V

10 % V

13.8



135 OC

120 OC



34 36 V

28 31 32 Vdc



79 81 Vdc

0.15 mA

0.6 Vdc

6.7 Vdc

25 μA

O, set

16.5 Vdc



Vdc

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Data Sheet November 5, 2012

ESTW006A0B Series Eighth-Brick Power Modules

36 - 75Vdc Input; 12V/6A

Output

Characteristic Curves

The following figures provide typical characteristics for the ESTW006A0B (12.0V, 6A) at 25oC. The figures are identical for either positive or negative remote On/Off logic.

(A)

EFFICIENCY,  (%)

INPUT CURRENT, I

OUTPUT CURRENT, IO (A) OUTPUT CURRENT, IO (A)

Figure 1. Converter Efficiency versus Output Current. Figure 2. Input Current versus Output Current.

(V) (5V/div)

On/Off

(V) (100mV/div)

OUTPUT VOLTAGE

(V) (5V/div) V

TIME, t (2s/div)

Figure 3. Typical output ripple and noise (I

OUTPUT VOLTAGE On/Off VOLTAGE

o = Io,max). Figure 4. Typical Start-up Using Remote On/Off,

TIME, t (10ms/div)

negative logic version shown (V

(V) (20V/div)

IN = 48V, Io = Io,max).

(V) (5V/div) V

(V) (200mV/div) Io(A) (1A/div)

OUTPUT VOLTAGE OUTPUT CURRENT

TIME, t (200µs/div) TIME, t (10ms/div)

Figure 5. Transient Response to 0.1A/µS Dynamic Load Change from 50% to 75% to 50% of full load, Vin=48V, C

>100μF.

OUTPUT VOLTAGE INPUT VOLTAGE

Figure 6. Typical Start-up Using Input Voltage (V 48V, I

o = Io,max).

IN =

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Data Sheet November 5, 2012

ESTW006A0B Series Eighth-Brick Power Modules

Test Configurations

Vout+

Vout-

33-10 0μF

CURRENT PROBE

SCOP E

x 100 %

Vi n+

Vin-

RESISTIVE

LOAD

contactRdistribution

LOAD

TO OSCILLOSCOPE

TEST

12μH

CS 220 μF

BAT TER Y

NOT E: Meas ure input refl ected r ipple cur rent wi th a sim ulated

E.S .R.< 0.1

@ 20 °C 10 0kHz

source indu ctance (L possible battery impedance. Measure current as shown above.

) of 12μH. Capacitor CS offs ets

TEST

Figure 7. Input Reflected Ripple Current Test Setup.

COPPER STR IP

V O (+)

V O ( – )

NOTE: A ll volta ge mea surements to be ta ken a t the mod ule

1uF

10uF

GROUND PLANE

termin als, as shown ab ove. If so ckets are used then Kel vin c onnectio ns ar e requ ired at th e module te rminals to av oid measureme nt errors due to sock et contact resistance.

Figure 8. Output Ripple and Noise Test Setup.

contact

distribution

contact

distribution

NOTE: All voltage measurements to be taken at the module

terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance.

Vin+

Vin-

Figure 9. Output Voltage and Efficiency Test Setup.

. I

Efficiency



VIN. I

36 - 75Vdc Input; 12V/6A

Output

Design Considerations

Input Filtering

The power module should be connected to a low AC impedance source. Highly inductive source impedance can affect the stability of the power module. For the test configuration in Figure 7, a 33100μF electrolytic capacitor (ESR<0.7 at 100kHz), mounting close to the power module helps ensure the stability of the unit. Consult the factory for further application guidelines.

Safety Considerations

For safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e., UL60950-1, CSA C22.2 No.60950-1, and VDE0805-1(IEC60950-1).

If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75Vdc), for the module’s output to be considered as meeting the requirements for safety extra-low voltage (SELV), all of the following must be true:

 The input source is to be provided with reinforced

insulation from any other hazardous voltages, including the AC mains.

 One V

pin and one V

pin are to be

OUT

grounded, or both the input and output pins are to be kept floating.

 The input pins of the module are not operator

accessible.

 Another SELV reliability test is conducted on the

whole system (combination of supply source and subject module) as required by the safety agencies to verify that under a single fault, hazardous voltages do not appear at the module’s output.

Note: Do not ground either of the input pins of the

module without grounding one of the output pins. This may allow a non-SELV voltage to appear between the output pins and ground.

The power module has extra-low voltage (ELV) outputs when all inputs are ELV.

All flammable materials used in the manufacturing of these modules are rated 94V-0 or tested to the UL60950 A.2 for reduced thickness.

For input voltages exceeding –60 Vdc but less than or equal to –75 Vdc, these converters have been evaluated to the applicable requirements of basic insulation between secondary DC mains distribution input (classified as TNV-2 in Europe) and unearthed SELV outputs.

The input to these units is to be provided with a maximum 10 A fast-acting fuse in the ungrounded lead.

LINEAGE POWER 6

Page 7

Data Sheet

November 5, 2012

ESTW006A0B Series Eighth-Brick Power Modules

Feature Descriptions

Remote On/Off

Two remote On/Off options are available. Positive logic turns the module on during a logic high voltage on the On/Off pin and off during a logic low. Negative logic remote On/Off, device code suffix “1”, turns the module off during a logic high and on during a logic low.

36 - 75Vdc Input; 12V/6A

Output

The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (maximum rated power = Vo,set x Io,max).

on/off

Vin+

ON/OFF

on/off

Vin-

Vout+

TRIM

Vout-

Figure 10. Remote On/Off Implementation.

To turn the power module on and off, the user must supply a switch (open collector or equivalent) to control the voltage (V terminal and the V low is 0V ≤ V

≤ 1.2V. The maximum I

on/off

) between the On/Off

on/off

(-) terminal (see Figure 10). Logic

on/off

during a logic low is 1mA and the switch should maintain a logic low level while sinking this current.

During a logic high, the typical maximum V

on/off

generated by the module is 5.6V and the maximum allowable leakage current at V

= 5.6V is 25μA.

on/off

If not using the remote On/Off feature:

For positive logic, leave the On/Off pin open.

For negative logic, short the On/Off pin to V

(-).

Remote Sense

Remote sense minimizes the effects of distribution losses by regulating the voltage at the remote-sense connections (See Figure 11). The voltage between the remote-sense pins and the output terminals must not exceed the output voltage sense range given in the Feature Specifications table:

(+) – VO(–)] – [SENSE(+) – SENSE(–)]  0.5 V

SENSE(+)

SENSE(–)

I(+)

SUPPLY

CONTACT

RESISTANCE

VO(+)

I(-)

O(–)

LOAD

CONTACT AND

DISTRIBUTION LOSS

Figure 11. Circuit Configuration for Remote Sense .

Input Undervoltage Lockout

At input voltages below the input undervoltage lockout limit, the module operation is disabled. The module will only begin to operate once the input voltage is raised above the undervoltage lockout turn-on threshold, V

UV/ON

Once operating, the module will continue to operate until the input voltage is taken below the undervoltage turn-off threshold, V

UV/OFF

Overtemperature Protection

To provide protection under certain fault conditions, the unit is equipped with a thermal shutdown circuit. The unit will shut down if the thermal reference point, Tref, exceeds 135

C (Figure 13, typical) or 120 OC (Figure 14, typical), but the thermal shutdown is not intended as a guarantee that the unit will survive temperatures beyond its rating. The module will automatically restart upon cool-down to a safe temperature.

Output Overvoltage Protection

The output overvoltage protection scheme of the modules has an independent overvoltage loop to prevent single point of failure. This protection feature latches in the event of overvoltage across the output. Cycling the On/Off pin or input voltage resets the latching protection feature. If the auto-restart option (4) is ordered, the module will automatically restart upon an internally programmed time elapsing.

Overcurrent Protection

To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. If the unit is not configured with auto–restart, it will latch off following the overcurrent condition. The module can be restarted by cycling the DC input power for at least

LINEAGE POWER 7

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Data Sheet



November 5, 2012

ESTW006A0B Series Eighth-Brick Power Modules

one second or by toggling the remote On/Off signal for at least one second.

If the unit is configured with the auto-restart option (4), it will remain in the hiccup mode as long as the overcurrent condition exists. Once the output current is brought back into its specified range, the unit will operate normally. The average output current during hiccup is 10% I

O, max

Output Voltage Programming

Trimming allows the output voltage set point to be increased or decreased from the default value. This is accomplished by connecting an external resistor between the TRIM pin and either the V V

(-) pin.

VIN(+)

ON/OFF

VIN(-)

VO(+)

VOTRIM

VO(-)

Figure 12. Circuit Configuration to Trim Output Voltage.

Connecting an external resistor (R the TRIM pin and the V

(-) (or Sense(-)) pin

decreases the output voltage set point. To maintain set point accuracy, the trim resistor tolerance should be ±1.0%.

The following equation determines the required external resistor value to obtain a percentage output voltage change of ∆%

511









downtrim







0.12



 





desired



0.12



Where

% 



For example, to trim-down the output voltage of the module by 6% to 11.28V, Rtrim-down is calculated as follows:

6% 

trim-down

22.10

100

(+) pin or the

trim-up

trim-down

) between



  

LOAD

36 - 75Vdc Input; 12V/6A



Where



desired

% 



 

0.12



100

 

Output

For example, to trim-up the output voltage of the module by 4% to 12.48V, R

is calculated is as

trim-up

follows:

4% 



511







uptrim

 



uptrim

The voltage between the V

)4100(0.1211.5

4225.1

16.1

(+) and VO(–) terminals

MR







22.10

 

must not exceed the minimum output overvoltage protection value shown in the Feature Specifications table. This limit includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment trim.

Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (maximum rated power = V

O,set

x I

O,max

Thermal Considerations

The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation.

Considerations include ambient temperature, airflow, module power dissipation and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability. The thermal data presented here is based on physical measurements taken in a wind tunnel.

The thermal reference points, T specifications for open frame modules is shown in Figure 13. For reliable operation, these temperatures should not exceed 125

used in the

ref,

511





downtrim





downtrim

Connecting an external resistor (R TRIM pin and the V

(+) (or Sense (+)) pin increases

the output voltage set point. The following equation determines the required external resistor value to obtain a percentage output voltage change of ∆%:







uptrim

 







22.10

 

9.74

) between the

trim-up

Figure 13. T

Temperature Measurement

ref

Locations for Open Frame Module.

AIRFLOW

The thermal reference point, T



511

%)100(0.1211.5





%225.1









22.10

 

specifications for modules with a heat plate is shown in Figure 14. For reliable operation, this temperature should not exceed 115

used in the

ref,

LINEAGE POWER 8

Page 9

Data Sheet November 5, 2012

AIRFLOW

ESTW006A0B Series Eighth-Brick Power Modules

36 - 75Vdc Input; 12V/6A

Output

cold wall, as shown in Figure 19. This capability is achieved by insuring the top side component skyline profile achieves no more than 1mm height difference between the tallest and the shortest power train part that benefits from contact with the gap pad material. The output current derating versus cold wall temperature, when using a gap pad such as Bergquist GP2500S20, is shown in Figure 20.

Figure 14. T Location for Module with Heat plate.

Temperature Measurement

ref

Heat Transfer via Convection

Increased airflow over the module enhances the heat transfer via convection. Derating curves showing the maximum output current that can be delivered by each module versus local ambient temperature (T

) for natural convection and up to 2m/s (400 ft./min) forced airflow are shown in Figures 15 - 36.

Please refer to the Application Note ‘Thermal Characterization Process For Open-Frame BoardMounted Power Modules’ for a detailed discussion of thermal aspects including maximum device temperatures.

(A)

OUTPUT CURRENT, I

AMBIENT TEMPERATURE, TA (oC)

Figure 15. Output Current Derating for the Open Frame Module; Airflow in the Transverse Direction from V

(A)

OUTPUT CURRENT, I

(-) to V

out

(+); VIN =48.

out

AMBIENT TEMPERATURE, TA (oC)

Figure 16. Output Current Derating for the Module with Heat plate; Airflow in the Transverse Direction from V

(-) to V

out

(+);VIN =48V.

out

Heat Transfer via Conduction

The module can also be used in a sealed environment with cooling via conduction from the module’s top surface through a gap pad material to a

Figure 19. Cold Wall Mounting

(A)

OUTPUT CURRENT, I

COLD PLATE TEMPERATURE, T

(oC)

Figure 20. Derated Output Current versus Cold Wall Temperature with Local Ambient Temperature Around Module at 85C; V

Through-Hole Soldering Information

= 48V.

Lead-Free Soldering

The ESTW006A0Bxx RoHS-compliant through-hole products use SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. They are designed to be processed through single or dual wave soldering machines. The pins have a RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept below 210C. For Pb solder, the recommended pot temperature is 260C, while the Pb-free solder pot is 270C max.

Paste-in-Hole Soldering

The ESTW006A0Bxx module is compatible with reflow paste-in-hole soldering processes shown in Figures 23-25. Since the ESTW006A0BxxZ module is not packaged per J-STD-033 Rev.A, the module must be baked prior to the paste-in-hole reflow process. ESTW006A0Bxx-HZ modules are not compatible with paste-in-hole reflow soldering. Please contact your Lineage Power Sales Representative for further information.

LINEAGE POWER 9

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Data Sheet November 5, 2012

ESTW006A0B Series Eighth-Brick Power Modules

Surface Mount Information

MSL Rating

The ESTW006A0B-SZ module has a MSL rating of 2a.

Storage and Handling

The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are provided for the ESTW006A0Bxx-SZ modules. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of humidity varies according to the MSL rating (see JSTD-033A). The shelf life for dry packed SMT packages is a minimum of 12 months from the bag seal date, when stored at the following conditions: < 40° C, < 90% relative humidity

Pick and Place

The ESTW006A0Bxx-S modules use an open frame construction and are designed for a fully automated assembly process. The modules are fitted with a label designed to provide a large surface area for pick and place operations. The label meets all the requirements for surface mount processing, as well as safety standards, and is able to withstand reflow temperatures of up to 300 product information such as product code, serial number and the location of manufacture.

Figure 21. Pick and Place Location.

Nozzle Recommendations

The module weight has been kept to a minimum by using open frame construction. Even so, these modules have a relatively large mass when compared to conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The minimum recommended nozzle diameter for reliable operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 9 mm.

Oblong or oval nozzles up to 11 x 9 mm may also be used within the space available.

Reflow Soldering Information

The surface mountable modules in the ESTW006A0Bxx-S family use our newest SMT

 30°C and 60% relative

C. The label also carries

36 - 75Vdc Input; 12V/6A

technology called “Column Pin” (CP) connectors. Figure 22 shows the new CP connector before and after reflow soldering onto the end-board assembly. The CP is constructed from a solid copper pin with an integral solder ball attached, which is composed of tin/lead (Sn/Pb) solder for non-Z codes, or Sn/Ag (SAC) solder for –Z codes.

EHHD Board

Insulator

Solder Ball

Figure 22. Column Pin Connector Before and After Reflow Soldering.

End assembly PCB

Output

/Cu

The CP connector design is able to compensate for large amounts of planarity and still ensure a reliable SMT solder joint. Typically, the eutectic solder melts at 363°C (Sn/Pb solder) or 217-236°C (SAC solder), wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. The following instructions must be observed when SMT soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability.

Tin Lead Soldering

The ESTW006A0Bxx-S power modules are lead free modules and can be soldered either in a lead-free solder process or in a conventional Tin/Lead (Sn/Pb) process. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each application board assembly. The following instructions must be observed when soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability.

In a conventional Tin/Lead (Sn/Pb) solder process, peak reflow temperatures are limited to less than 235°C. Typically, the eutectic solder melts at 363°C, wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. For

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Data Sheet November 5, 2012

ESTW006A0B Series Eighth-Brick Power Modules

Surface Mount Information (continued)

established by accurately measuring the modules CP reliable soldering, the solder reflow profile should be connector temperatures.

Lead Free Soldering

The –Z version of the ESTW006A0B modules are lead-free (Pb-free) and RoHS compliant and are both forward and backward compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability.

Pb-free Reflow Profile

Power systems will comply with J-STD-015 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for

300

250

200

15 0

10 0

REFLOW TEMP (C)

Figure 23. Reflow Profile for Tin/Lead (Sn/Pb) process.

240

235

230

225

220

215

210

MAX TEMP SOLDER (C)

205

200

0 10 203040 5060

Figure 24. Time Limit Curve Above 205oC for Tin/Lead (Sn/Pb) process.

both Pb-free solder profiles and MSL classification procedures. This standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Figure 25.

Peak Temp 235oC

Heat zo ne

oCs-1

max 4

Soak zo ne 30-240s

Pr eheat zo ne

oCs-1

max 4

REFLOW TIME (S)

T 205

lim

Cooling zo ne 1- 4

above

oCs-1

36 - 75Vdc Input; 12V/6A

300

Per J-STD-020 Rev. C

250

200

150

Heating Zone 1°C/Second

100

Reflow Temp (°C)

Peak Temp 260°C

* Min. Time Above 235°C 15 Seconds

*Time Above 217°C

60 Seconds

Reflow Time (Seconds)

Output

Cooling Zone

Figure 25. Recommended linear reflow profile using Sn/Ag/Cu solder.

Post Solder Cleaning and Drying Considerations

Post solder cleaning is usually the final circuit board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit board assembly. For guidance on appropriate soldering, cleaning and

drying procedures, refer to Lineage Power Board Mounted Power Modules: Soldering and Cleanin g

Application Note (AN04-001).

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Data Sheet November 5, 2012

ESTW006A0B Series Eighth-Brick Power Modules

36 - 75Vdc Input; 12V/6A

Output

EMC Considerations

The circuit and plots in Figure 26 shows a suggested configuration to meet the conducted emission limits of EN55022 Class B.

Figure 26. EMC Considerations.

For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).

VIN = 48V, Io = I

o,max

, L Line

Blue= Quasi-peak, Red = Avg

VIN = 48V, Io = I

Blue= Quasi-peak, Red = Avg

o,max

, N Line

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Data Sheet November 5, 2012

ESTW006A0B Series Eighth-Brick Power Modules

36 - 75Vdc Input; 12V/6A

Mechanical Outline for Through-Hole Module

Dimensions are in millimeters and [inches].

Tolerances: x.x mm

x.xx mm

*Top side label includes Lineage Power name, product designation and date code.

 0.5 mm [x.xx in.  0.02 in.] (unless otherwise indicated)

 0.25 mm [x.xxx in  0.010 in.]

Output

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Data Sheet November 5, 2012

ESTW006A0B Series Eighth-Brick Power Modules

36 - 75Vdc Input; 12V/6A

Mechanical Outline for Surface Mount Module (-S Option)

Dimensions are in millimeters and [inches].

Tolerances: x.x mm

x.xx mm

* Top side label includes Lineage Power name, product designation and date code.

 0.5 mm [x.xx in.  0.02 in.] (unless otherwise indicated)

 0.25 mm [x.xxx in  0.010 in.]

Output

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Data Sheet November 5, 2012

ESTW006A0B Series Eighth-Brick Power Modules

36 - 75Vdc Input; 12V/6A

Mechanical Outline for Through-Hole Module with Heat Plate (-H Option)

Dimensions are in millimeters and [inches].

Tolerances: x.x mm

x.xx mm

 0.5 mm [x.xx in.  0.02 in.] (unless otherwise indicated)

 0.25 mm [x.xxx in  0.010 in.]

Output

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Data Sheet November 5, 2012

Recommended Pad Layout

Dimensions are in millimeters and [inches]. Tolerances: x.x mm x.xx mm

Pin Function

1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+)

 0.5 mm [x.xx in.  0.02 in.] (unless otherwise indicated)

 0.25 mm [x.xxx in  0.010 in.]

ESTW006A0B Series Eighth-Brick Power Modules

36 - 75Vdc Input; 12V/6A

Output

SMT Recommended Pad Layout (Component Side View)

Pin Function

1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+)

NOTES: FOR 0.030” X 0.025” RECTANGULAR PIN, USE 0.050” PLATED THROUGH-HOLE DIAMETER FOR 0.62 DIA” PIN, USE 0.076” PLATED THROUGH-HOLE DIAMETER

TH Recommended Pad Layout (Component Side View)

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Page 17

Data Sheet November 5, 2012

ESTW006A0B Series Eighth-Brick Power Modules

36 - 75Vdc Input; 12V/6A

Output

Packaging Details

The surface mount versions of the ESTW006A0B (suffix –S) are supplied as standard in the plastic trays shown in Figure 27.

Tray Specification

Material Antistatic coated PVC Max surface resistivity 10 Color Clear Capacity 12 power modules Min order quantity 48 pcs (1 box of 4 full trays

/sq

+ 1 empty top tray)

Each tray contains a total of 12 power modules. The trays are self-stacking and each shipping box for the ESTW006A0B (suffix –S) surface mount module contains 4 full trays plus one empty hold-down tray giving a total number of 48 power modules.

Figure 27. Surface Mount Packaging Tray.

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Data Sheet

November 5, 2012

ESTW006A0B Series Eighth-Brick Power Modules

36 - 75Vdc Input; 12V/6A

Output

Ordering Information

Please contact your Lineage Power Sales Representative for pricing, availability and optional features.

Table 1. Device Codes

Product Codes Input Voltage

Output

Voltage

ESTW006A0B41Z 48V (36-75Vdc) 12.0V 6A Negative Through-hole 150027602

ESTW006A0B41-HZ 48V (36-75Vdc) 12.0V 6A Negative Through-hole Contact GE PLM

ESTW006A0B41-SZ 48V (36-75Vdc) 12.0V 6A Negative Surface mount Contact GE PLM

Table 2. Device Coding Scheme and Options

Output

Current

On/Off

Logic

Connector

Type

Comcodes

Asia-Pacific Headquarters

Tel: +86.021.54279977*808

World Wide Headquarters Lineage Power Corporation

601 Shiloh Road, Plano, TX 75074, USA +1-888-LINEAGE(546-3243) (Outside U.S.A.: +1-972-244-WATT(9288))

www.lineagepower.com e-mail: techsupport1@lineagepower.com

Europe, Middle-East and Africa Headquarters

Tel: +49.89.878067-280

India Headquarters

Tel: +91.80.28411633

Lineage Power reserves the right to make changes to the produ ct(s) or information contained herein without notice. No liability is assumed as a result of their use or

pplication. No rights under any patent accompany the sale of any such p roduct(s) or information.

Lineage Power DC-DC products are protected under various paten ts. Information on these patents is available at www.lineagepower.com/patents.

2010 Lineage Power Corporation, (Plano, Texas) All Internatio nal Rights Reserved.

Document No: ver. 1.2

PDF name: ESTW006A0B.pdf