GE Industrial Solutions EQW006 User Manual

Data Sheet
July 27, 2011

EQW006 Series, Eighth-Brick Power Modules: DC-DC Converter

36 –75Vdc Input; 12Vdc Output; 6A Output Current

RoHS Compliant

Applications

 Distributed power architectures

 Wireless networks

 Access and optical network Equipment

 Enterprise Networks

 Latest generation IC’s (DSP, FPGA, ASIC)

and Microprocessor powered applications

Options

 Remote On/Off logic (positive or negative)

 Surface Mount (-S Suffix)

 Short Pins

Features

 Compliant to RoHS EU Directive 2002/95/EC (-Z

versions)

 Compliant to ROHS EU Directive 2002/95/EC with lead

solder exemption (non-Z versions)

 Delivers up to 6A output current

 High efficiency: 91.5% at 12V full load (VIN = 48Vdc)

 Industry-Standard Eighth-brick foot print:

57.9 mm x 22.8 mm x 8.52 mm

(2.28 in x 0.90 in x 0.335 in)

 Low output ripple and noise

 Surface mount or through hole

 Cost efficient open frame design

 Remote On/Off positive logic (primary referenced)

 Remote Sense

 Adjustable output voltage

 Constant switching frequency (330 kHz)

 Output over voltage and over current protection

 Over temperature protection

 Input undervoltage lockout

 Wide operating temperature range (-40°C to 85°C)
 UL* 60950 Recognized, CSA

Certified, and VDE

Licensed

‡

0805 (IEC60950, 3rd edition)

†

C22.2 No. 60950-00

 CE mark meets 73/23/EEC and 93/68/EEC directives

 ISO** 9001 and ISO14001 certified manufacturing

facilities

 Meets the voltage and current requirements for ETSI

300-132-2 and complies with and licensed for Basic
insulation rating per IEC60950 3

rd

edition

§

Description

The EQW series, Eighth-brick power modules are isolated dc-dc converters that can deliver up to 6A of output
current and provide a precisely regulated output voltage of 12Vdc over a wide range of input voltages (Vi = 36 ­75Vdc). The modules achieve full load efficiency of 91.5% at 12Vdc output voltage. The open frame modules
construction, available in both surface-mount and through-hole packaging, enable designers to develop cost- and
space-efficient solutions. Standard features include remote On/Off, remote sense, output voltage adjustment, over
voltage, over current and over temperature protection.

* UL is a re gistered trademark of Underwriters Laboratories, Inc.

†

CSA is a reg istered trademark of Canadian Standards Associat ion.

‡

VDE is a t rademark of Verband Deutscher Elektrotechniker e.V.

** ISO is a registered trademark of the International Or ganization of Standards

Document No: DS03-119 ver. 1.10

PDF name: EQW006A0B.pdf

Data Sheet

r

July 27, 2011

EQW006 Series, Eight-Brick Power Modules: DC-DC Converte

36 – 75Vdc Input; 12Vdc Output; 6A Output Current

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are
absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in
excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for
extended periods can adversely affect the device reliability.

Parameter Device Symbol Min Max Unit

Input Voltage

Continuous All V

Transient (100 ms) All V

Operating Ambient Temperature All T

(see Thermal Considerations section)

Storage Temperature All T

I/O Isolation voltage (100% factory Hi-Pot tested) All

IN

IN,trans

A

stg

 

-0.3 80 Vdc

-0.3 100 Vdc

-40 85 °C

-55 125 °C

1500 Vdc

Electrical Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions.

Parameter Device Symbol Min Typ Max Unit

Operating Input Voltage All VIN 36 48 75 Vdc

Maximum Input Current All I

(VIN= V

Input No Load Current All I

(VIN = V

Input Stand-by Current All I

(VIN = V

IN, min

to V

IN, nom

IN, nom

, IO=I

IN, max

, IO = 0, module enabled)

, module disabled)

)

O, max

IN,max

IN,No load

IN,stand-by

2.5 Adc

75 mA

3 mA

Inrush Transient All I2t 1 A2s

Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; V
V

= I

IN, max, IO

Input Ripple Rejection (120Hz) All 50 dB

EMC,EN5022 See EMC Considerations section

; See Test configuration section)

Omax

IN, min

to

All 13 mAp-p

CAUTION: This power module is not internally fused. An input line fuse must always be used.

This power module can be used in a wide variety of applications, ranging from simple standalone operation to an
integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included,
however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies
require a time-delay fuse with a maximum rating of 6 A (see Safety Considerations section). Based on the
information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a
lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information.

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Data Sheet

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July 27, 2011

EQW006 Series, Eight Brick Power Modules: DC-DC Converte

36 – 75Vdc Input; 12Vdc Output; 6A Output Current

Electrical Specifications (continued)

Parameter Device Symbol Min Typ Max Unit

Output Voltage Set-point All V

(VIN=

IN, min

, IO=I

, TA=25°C)

O, max

Output Voltage All V

(Over all operating input voltage, resistive load, and
temperature conditions until end of life)

Adjustment Range

Selected by external resistor

All V

O, set

O

O

Output Regulation

Line (VIN=V

Load (IO=I

Temperature (T

IN, min

O, min

to V

to I

ref=TA, min

) All

IN, max

) All

O, max

to T

) All  0.2

A, max

Output Ripple and Noise on nominal output
measured with 10F Tantalum, 1F ceramic

(VIN=V

IN, nom

,IO= I

O, max

, TA=T

A, min

to T

)

A, max

RMS (5Hz to 20MHz bandwidth) All

Peak-to-Peak (5Hz to 20MHz bandwidth) All

External Capacitance All C

Output Current All I

Output Current Limit Inception (Hiccup Mode )

(VO= 90% of V

O, set

)

Output Short-Circuit Current

(VO≤250mV) ( Hiccup Mode )

All

All I

O, max

I

O, lim

O, s/c

o

Efficiency

VIN= V

IO=I

Switching Frequency All f

, TA=25°C All η 91.5 %

IN, nom

= V

O, max , VO

O,set

sw

Dynamic Load Response
(dIo/dt=0.1A/s; VIN = V

IN, nom

; TA=25°C)

Load Change from Io= 50% to 75% of Io,max; 220F
Tantalum or Electrolytic external capacitance

Peak Deviation All V

Settling Time (Vo<10% peak deviation)

(Io/t=0.1A/s; Vin=Vin,set; TA=25°C)

Load Change from Io= 50% to 25% of Io,max;

220F Tantalum or Electrolytic external capacitance

Peak Deviation All V

Settling Time (Vo<10% peak deviation)

pk

All t

s

pk

All t

s

11.8 12.0 12.2 Vdc

11.6



12.4 Vdc

10.8

 
 



13.2 Vdc

0.1 % V

0.1 % V







0

0





15 25 mV

40 75 mV




7.0

0.5

1000 μF

6 Adc





% V

O, set

O, set

O, set

pk-pk

Adc

Adc

rms

300 kHz




200

250


 s

mV




200

250


 s

mV

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Data Sheet

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July 27, 2011

EQW006 Series, Eight Brick Power Modules: DC-DC Converte

36 – 75Vdc Input; 12Vdc Output; 6A Output Current

Isolation Specifications

Parameter Device Symbol Min Typ Max Unit

Isolation Capacitance All C

Isolation Resistance All R

I/O Isolation Voltage All All

iso

iso



10

 

1000

 



1500 Vdc

General Specifications

Parameter Device Min Typ Max Unit

Calculated MTBF (VIN=V

Telcordia SR332 Issue 1: Method 1, Case 3

Weight All

IN, nom

, IO=0.8I

, TA=40C)

O,max

1,795,700 Hours



15.2 (0.6)



g (oz.)

pF

MΩ

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Data Sheet

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July 27, 2011

EQW006 Series, Eight Brick Power Modules: DC-DC Converte

36 – 75Vdc Input; 12Vdc Output; 6A Output Current

Feature Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See Feature Descriptions for additional information.

Parameter Device Symbol Min Typ Max Unit

Remote On/Off Signal Interface

(VIN=V

Signal referenced to V

Negative Logic: device code suffix “1”

Logic Low = module On, Logic High = module Off

Positive Logic: No device code suffix required

Logic Low = module Off, Logic High = module On

Logic Low - Remote On/Off Current All I

Logic Low - On/Off Voltage All V

Logic High Voltage – (Typ = Open Collector) All V

Logic High maximum allowable leakage current All I

Turn-On Delay and Rise Times

(IO=I

Case 1: On/Off input is set to Logic Low (Module
ON) and then input power is applied (delay from
instant at which V

Case 2: Input power is applied for at least 1 second
and then the On/Off input is set from OFF to ON (T
from instant at which V

Output voltage Rise time (time for Vo to rise from 10%
of V

Output voltage overshoot – Startup ―

IO= 80% of I

Remote Sense Range All V

Over temperature Protection

Output Overvoltage Protection

Input Undervoltage Lockout

Turn-on Threshold All V

Turn-off Threshold

to V

IN, min

O, max , VIN=VIN, nom, TA

o,set

IN, max

to 90% of V

; VIN=V

O, max

IN

= V

o, set

; open collector or equivalent,

terminal)

IN-

on/off

on/off

on/off

on/off



-0.7



 

0.15 1.0 mA



1.2 V

15 V

10 μA

= 25 oC)

All Tdelay ― 20 ― msec

until Vo=10% of Vo,set)

IN, min

until VO = 10% of V

IN=VIN, min

)

to V

IN, min

=

delay

).

O, set

, TA = 25 oC

IN, max

All Tdelay ― 12 ― msec

All Trise

SENSE

All T

All V

ref

O, limit

UVLO

― 5 ― msec

5

% V

0.5 Vdc



13.8

120





15 V

― 32 36 V

25 27 ― V

°C

O, set

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Data Sheet

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V

V

July 27, 2011

EQW006 Series, Eight Brick Power Modules: DC-DC Converte

36 – 75Vdc Input; 12Vdc Output; 6A Output Current

Characteristic Curves

The following figures provide typical characteristics for the EQW006A0B1 (12V, 6A) at 25oC. The figures are
identical for either positive or negative remote On/Off logic.

94

90

86

82

78

74

EFFICIENCY,  (%)

70

0 123456

VIN=36

VIN=48

VIN=75

OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC

Figure 1. Converter Efficiency versus Output Current. Figure 4. Derating Output Current versus Local

7

6

5

4

3

NC

10 0 LF M

2

200 LFM

1

300 LFM

400 LFM

0

OUTPUT CURRENT, Io (A)

20 30 40 50 60 70 80 90

Ambient Temperature and Airflow.

(V) (10mV/div)

O

V

OUTPUT VOLTAGE

TIME, t (1s/div)

Figure 2. Typical output ripple and noise (VIN = VIN,NOM,
I

o = Io,max).

(V) (200mV/div)

O

Io (A) (1A/div) V

OUTPUT CURRENT, OUTPUT VOLTAGE

TIME, t (200 s /div)

Figure 3. Transient Response to Dynamic Load
Change from 50% to 75% to 50% of full load.

(V) (5V/div)

O

(V) (2V/div) V

On/off

On/Off VOLTAGE OUTPUT VOLTAGE

V

TIME, t (5ms/div)

Figure 5. Typical Start-up Using Remote On/Off,
negative logic version shown (VIN = VIN,NOM, Io =
I

o,max).

(V) (5V/div)

O

(V) (20V/div) V

IN

INPUT VOLTAGE OUTPUT VOLTAGE

V

TIME, t (5ms/div)

Figure 6. Typical Start-up Using Input Voltage (VIN =
V

IN,NOM, Io = Io,max).

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Data Sheet

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July 27, 2011

Test Configurations

TO OSCILLOSCOPE

L

TEST

12μH

CS 220μF

BATTERY

E.S.R.<0.1

@ 20°C 100kHz

EQW006 Series, Eight Brick Power Modules: DC-DC Converte

36 – 75Vdc Input; 12Vdc Output; 6A Output Current

Design Considerations

CURRENT PROBE

Vin+

33μF

Vin-

Input Filt ering

The power module should be connected to a low
ac-impedance source. Highly inductive source
impedance can affect the stability of the power
module. For the test configuration in Figure 7 a 33μF
electrolytic capacitor (ESR<0.7 at 100kHz),
mounted close to the power module helps ensure the
stability of the unit. Consult the factory for further
application guidelines.

NOTE: Measure input reflected ripple current with a simulated

source inductance (L
possible battery impedance. Measure current as shown
above.

) of 12μH. Capacitor CS offsets

TEST

Figure 7. Input Reflected Ripple Current Test
Setup.

COPPER STRIP

V

(+)

O

V

( – )

O

0.01uF

NOTE: All voltage measurements to be taken at the module

terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.

0.1uF

10uF

GROUND PLANE

SCOPE

RESISTIVE
LOAD

Figure 8. Output Ripple and Noise Test Setup.

R

R

contact

distribution

R

R

contact

distribution

NOTE: All voltage measurements to be taken at t he module

terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.

Vout+

Vin+

V

IN

Vin-

Vout-

R

contactRdistribution

R

R

contactRdistribution

LOAD

V

O

Figure 9. Output Voltage and Effici ency Tes t
Setup.

. I

V

O

Efficiency

=



VIN. I

O

IN

x 100 %

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Data Sheet

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July 27, 2011

EQW006 Series, Eight Brick Power Modules: DC-DC Converte

36 – 75Vdc Input; 12Vdc Output; 6A Output Current

Safety Considerations

For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and
separation requirements of the end-use safety agency
standard, i.e., UL60950, CSA C22.2 No. 60950-00
and VDE 0805:2001-12 (IEC60950, 3

These converters have been evaluated to the spacing
requirements for Basic Insulation, per the above
safety standards; and 1500 Vdc is applied from Vi to
Vo to 100% of outgoing production.

For all input voltages, other than DC MAINS, where
the input voltage is less than 60V dc, if the input
meets all of the requirements for SELV, then:

 The output may be considered SELV. Output

voltages will remain within SELV limits even with
internally-generated non-SELV voltages. Single
component failure and fault tests were performed
in the power converters.

 One pole of the input and one pole of the output

are to be grounded, or both circuits are to be kept
floating, to maintain the output voltage to ground
voltage within ELV or SELV limits.

For all input sources, other than DC MAINS, where
the input voltage is between 60 and 75V dc
(Classified as TNV-2 in Europe), the following must
be adhered to, if the converter’s output is to be
evaluated for SELV:

 The input source is to be provided with reinforced

insulation from any hazardous voltage, including
the AC mains.

 One Vi pin and one Vo pin are to be reliably

earthed, or both the input and output pins are to
be kept floating.

 Another SELV reliability test is conducted on the

whole system, as required by the safety
agencies, on the combination of supply source
and the subject module to verify that under a
single fault, hazardous voltages do not appear at
the module’s output.

The power module has ELV (extra-low voltage)
outputs when all inputs are ELV.

All flammable materials used in the manufacturing of
these modules are rated 94V-0, and UL60950 A.2 for
reduced thickness. The input to these units is to be
provided with a maximum 6A time- delay in the
unearthed lead

.

rd

Ed).

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Data Sheet

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July 27, 2011

EQW006 Series, Eight Brick Power Modules: DC-DC Converte

36 – 75Vdc Input; 12Vdc Output; 6A Output Current

Feature Description

Remote On/Off

Two remote on/off options are available. Positive logic
turns the module on during a logic high voltage on the
ON/OFF pin, and off during a logic low. Negative logic
remote On/Off, device code suffix “1”, turns the
module off during a logic high and on during a logic
low.

The amount of power delivered by the module is
defined as the voltage at the output terminals
multiplied by the output current. When using remote
sense and trim, the output voltage of the module can
be increased, which at the same output current would
increase the power output of the module. Care should
be taken to ensure that the maximum output power of
the module remains at or below the maximum rated
power (Maximum rated power = Vo,set x Io,max).

I

on/off

V

Vin+

ON/OFF

on/off

Vin-

Vout+

TRIM

Vout-

Figure 10. Remote On/Off Implementation.

To turn the power module on and off, the user must
supply a switch (open collector or equivalent) to
control the voltage (V
terminal and the V
low is 0V ≤ V

≤ 1.2V. The maximum I

on/off

) between the ON/OFF

on/off

(-) terminal (see Figure 10). Logic

IN

on/off

during a
logic low is 1mA, the switch should be maintain a
logic low level whilst sinking this current.

During a logic high, the typical maximum V

on/off

generated by the module is 15V, and the maximum
allowable leakage current at V

= 5V is 1μA.

on/off

If not using the remote on/off feature:

For positive logic, leave the ON/OFF pin open.

For negative logic, short the ON/OFF pin to V

(-).

IN

Remote Sense

Remote sense minimizes the effects of distribution
losses by regulating the voltage at the remote-sense
connections (See Figure 11). The voltage between
the remote-sense pins and the output terminals must
not exceed the output voltage sense range given in
the Feature Specifications table:

[VO(+) – VO(–)] – [SENSE(+) – SENSE(–)]  0.5 V

Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim.

SENSE(+)

SENSE(–)

V

I(+)

SUPPLY

CONTACT

RESISTANCE

I

I

VO(+)

V

I(-)

V

O(–)

DISTRIBUTION LOSS

IO

LOAD

CONTACT AND

Figure 11. Circuit Configuration for remote
sense .

Input Undervoltage Lockout

At input voltages below the input undervoltage lockout
limit, the module operation is disabled. The module
will only begin to operate once the input voltage is
raised above the undervoltage lockout turn-on
threshold, V

UV/ON

.

Once operating, the module will continue to operate
until the input voltage is taken below the undervoltage
turn-off threshold, V

UV/OFF

.

Overtemperature Protection

To provide protection under certain fault conditions,
the unit is equipped with a thermal shutdown circuit.
The unit will shutdown if the thermal reference point
Tref (Figure 14), exceeds 110

o

C (typical), but the
thermal shutdown is not intended as a guarantee that
the unit will survive temperatures beyond its rating.
The module will automatically restarts after it cools
down.

Output Overvoltage Protection

The output overvoltage protection consists of circuitry
that internally clamps the output voltage. If a more
accurate output overvoltage protection scheme is
required then this should be implemented externally
via use of the remote on/off pin.

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July 27, 2011

EQW006 Series, Eight Brick Power Modules: DC-DC Converte

36 – 75Vdc Input; 12Vdc Output; 6A Output Current

Feature Descriptions (continued)

Output Voltage Programming

Trimming allows the output voltage set point to be
increased or decreased, this is accomplished by
connecting an external resistor between the TRIM pin
and either the V

(+) pin or the VO(-) pin (COM pin) .

O

VIN(+)

ON/OFF

VIN(-)

Figure 12. Circuit Configurat i on t o Tr im Out pu t
Voltage.

Connecting an external resistor (R
the TRIM pin and the Vo(-) (or Sense(-)) pin
decreases the output voltage set point. To maintain
set point accuracy, the trim resistor tolerance should
be ±0.1%.

The following equation determines the required
external resistor value to obtain a percentage output
voltage change of Δ%

For output voltage: 12Vdc

downRtrim

Where



,





% 




For example, to trim-down the output voltage of 12V
module (EQW006A0B1) by 8% to 11.04V, Rtrim­down is calculated as follows:

VO(+)

VOTRIM

VO(-)

trim-down

510



 2.10





%



VdesiredsetVo

setVo

,

downRtrim












100



8% 

510



 2.10



8



R

R






 55.53downRtrim

trim-up

trim-down



LOAD

) between

Connecting an external resistor (R
TRIM pin and the V
the output voltage set point. The following equations
determine the required external resistor value to
obtain a percentage output voltage change of Δ%:

For output voltage: 12Vdc

 2.10

upRtrim

Where



% 








For example, to trim-up the output voltage of 12V
module by 6% to 12.72V, Rtrim-up is calculated is as
follows:

(+) (or Sense (+)) pin increases

O






setVo



%225.1

,



setVoVdesired

100



,

setVo




6% 



 2.10

upRtrim



The voltage between the Vo(+) and Vo(–) terminals
must not exceed the minimum output overvoltage
protection value shown in the Feature Specifications
table. This limit includes any increase in voltage due
to remote-sense compensation and output voltage
set-point adjustment trim.

Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim. The amount of power
delivered by the module is defined as the voltage at
the output terminals multiplied by the output current.
When using remote sense and trim, the output
voltage of the module can be increased, which at the
same output current would increase the power output
of the module. Care should be taken to ensure that
the maximum output power of the module remains at
or below the maximum rated power (Maximum rated
power = Vo,set x Io,max).







6225.1

trim-up



)6100(121.5

787upRtrim

) between the

%)100(,1.5

510





%

510



6

















Overcurrent Protection

To provide protection in a fault (output overload)
condition, the unit is equipped with internal
current-limiting circuitry and can endure current
limiting continuously. At the point of current-limit
inception, the unit enters hiccup mode. The unit
operates normally once the output current is brought
back into its specified range. The average output
current during hiccup is 10% I

O, max

.

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Data Sheet

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July 27, 2011

EQW006 Series, Eight Brick Power Modules: DC-DC Converte

36 – 75Vdc Input; 12Vdc Output; 6A Output Current

Thermal Considerations

The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.

Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel as shown in the
Figure 13.

25.4_

ind Tunne l

PWBs

x

5.97_

(0.235)

(1.0)

76.2_
(3.0)

Po we r M o d ule

Probe Location
for measuring
airflow and
ambient
temperature

flow

Figure 13. Thermal Test Set-up.

The thermal reference point, T
specifications is shown in Figure 14. For reliable
operation this temperature should not exceed 120

used in the

ref

o

C.

Tref

Air Flow

Figure 14. T
Locations.

Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board­Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.

Temperature Measurement

ref

Heat Transfer via Convection

Increased airflow over the module enhances the heat
transfer via convection. Derating figures showing the
maximum output current that can be delivered by
each module versus local ambient temperature (T
for natural convection and up to 2m/s (400 ft./min) are
shown in the respective Characteristics Curves
section.

)

A

Layout Considerations

Copper paths must not be routed beneath the power
module mounting inserts. Recommended SMT layout
shown in the mechanical section are for reference
only. SMT layout depends on the end PCB
configuration and the location of the load. For
additional layout guide-lines, refer to FLTR100V10
data sheet or contact your local Lineage Power field
application engineer.

LINEAGE POWER 11

Data Sheet

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July 27, 2011

EQW006 Series, Eight Brick Power Modules: DC-DC Converte

36 – 75Vdc Input; 12Vdc Output; 6A Output Current

Mechanical Outline for Surface Mount Module

Dimensions are in millimeters and [inches].
Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (unless otherwise indicated)
x.xx mm  0.25 mm [x.xxx in  0.010 in.]

Top View

Side View

Bottom View

Pin Function

1 VI(+)

2 On/Off

3 VI(-)

4 Vo(-)

5 Sense(-)

6 Trim

7 Sense(+)

8 Vo(+)

LINEAGE POWER 12

Data Sheet

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July 27, 2011

EQW006 Series, Eight Brick Power Modules: DC-DC Converte

36 – 75Vdc Input; 12Vdc Output; 6A Output Current

Mechanical Outline for Through-Hole Module

Dimensions are in millimeters and [inches].
Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (unless otherwise indicated)
x.xx mm  0.25 mm [x.xxx in  0.010 in.]

Top View

Side View

Bottom View

Pin Function

1 VI(+)

2 On/Off

3 VI(-)

4 Vo(-)

5 Sense(-)

6 Trim

7 Sense(+)

8 Vo(+)

LINEAGE POWER 13

Data Sheet

r

July 27, 2011

EQW006 Series, Eight Brick Power Modules: DC-DC Converte

36 – 75Vdc Input; 12Vdc Output; 6A Output Current

Recommended Pad Layout

Dimensions are in millimeters and [inches].
Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (unless otherwise indicated)
x.xx mm  0.25 mm [x.xxx in  0.010 in.]

Low Current

High Current

1.

LINEAGE POWER 14

0

Data Sheet

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July 27, 2011

EQW006 Series, Eight Brick Power Modules: DC-DC Converte

Recommended Pad Layout

Dimensions are in millimeters and [inches].

Tolerances: x.x mm

x.xx mm

 0.5 mm [x.xx in.  0.02 in.] (unless otherwise indicated)

 0.25 mm [x.xxx in  0.010 in.]

Component

side view

36 – 75Vdc Input; 12Vdc Output; 6A Output Current

LINEAGE POWER 15

Data Sheet

r

July 27, 2011

EQW006 Series, Eight Brick Power Modules: DC-DC Converte

36 – 75Vdc Input; 12Vdc Output; 6A Output Current

Packaging Details

The surface mount versions of the EQW surface
mount modules (suffix –S) are supplied as standard in
the plastic tray shown in Figure 15. The tray has
external dimensions of 135.1mm (W) x 321.8mm (L) x

12.42mm (H) or 5.319in (W) x 12.669in (L) x 0..489in
(H).

Tray Specification

Material Antistatic coated PVC

Max surface resistivity 10

Color Clear

Capacity 12 power mod ules

Min order quantity 48 pcs (1box of 4 full
trays)

Each tray contains a total of 12 power modules. The
trays are self-stacking and each shipping box will
contain 4 full trays plus one empty hold down tray
giving a total number of 48 power modules.

12

/sq

Figure 15. Surface Mount Packaging Tray.

LINEAGE POWER 16

Data Sheet

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July 27, 2011

EQW006 Series, Eight Brick Power Modules: DC-DC Converte

36 – 75Vdc Input; 12Vdc Output; 6A Output Current

Surface Mount Information

Pick and Place

The SMT versions of the EQW series of DC-to-DC
power converters use an open-frame construction and
are designed for surface mount assembly within a
fully automated manufacturing process.

The EQW-S series modules are fitted with a label
designed to provide a large flat surface for pick and
placing. The label is located covering the center of
gravity of the power module. The label meets all the
requirements for surface-mount processing, as well
as meeting UL safety agency standards. The label will
withstand reflow temperatures up to 300
also carries product information such as product
code, date and location of manufacture.

C. The label

Figure 16. Pick and Place Location.

Z Plane Height

The ‘Z’ plane height of the pick and place label is 9.15
mm (0.360 in) nominal with an RSS tolerance of +/-

0.25 mm.

Nozzle Recommendations

The module weight has been kept to a minimum by
using open frame construction. Even so, they have a
relatively large mass when compared with
conventional smt components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.

The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm. Oblong or oval nozzles
up to 11 x 9 mm may also be used within the space
available.

For further information please contact your local
Lineage Power Technical Sales Representative.

Tin Lead Soldering

The following instructions must be observed when
SMT soldering these units. Failure to observe these
instructions may result in the failure of or cause

damage to the modules, and can adversely affect
long-term reliability.

The surface mountable modules in the EQW family
use our newest SMT technology called “Column Pin”
(CP) connectors. Figure 17 shows the new CP
connector before and after reflow soldering onto the
end-board assembly.

EQW Board

Insulator

Solder Ball

End assembly PCB

Figure 17. Column Pin Connector Before and After

Reflow Soldering.

The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn/Pb-63/37) solder. The CP connector
design is able to compensate for large amounts of co­planarity and still ensure a reliable SMT solder joint.

o

Typically, the eutectic solder melts at 183

C, wets the
land, and subsequently wicks the device connection.
Sufficient time must be allowed to fuse the plating on
the connection to ensure a reliable solder joint. There
are several types of SMT reflow technologies
currently used in the industry. These surface mount
power modules can be reliably soldered using natural
forced convection, IR (radiant infrared), or a
combination of convection/IR. For reliable soldering
the solder reflow profile should be established by
accurately measuring the modules CP connector
temperatures.

300

250

200

15 0

10 0

REFLOW TEMP (C)

50

0

Peak Temp 235oC

Heat zone

oCs-1

max 4

So ak zone
30-240s

Preheat zo ne

oCs-1

max 4

REFLOW TIME (S)

T

lim

205

Co o ling
zo ne
1- 4

above

o

C

oCs-1

Figure 18. Reflow Profile for Tin/Lead (Sn/Pb)
process.

LINEAGE POWER 17

Data Sheet

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July 27, 2011

EQW006 Series, Eight Brick Power Modules: DC-DC Converte

36 – 75Vdc Input; 12Vdc Output; 6A Output Current

Surface Mount Information (continued)

240

235

230

225

220

215

210

MAX TEMP SOLDER (C)

205

200

0 102030405060

Figure 19. Time Limit Curve Above 205oC for
Tin/Lead (Sn/Pb) process.

Lead Free Soldering

The –Z version of the EQW006 modules are lead-free
(Pb-free) and RoHS compliant and are both forward
and backward compatible in a Pb-free and a SnPb
soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to
the modules and can adversely affect long-term
reliability.

Pb-free Reflow Profile

Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Fig. 20.

MSL Rating

The EQW006 modules have a MSL rating of 2.

Storage and Handling

The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of
varies according to the MSL rating (see J-STD-033A).

 30°C and 60% relative humidity

The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.

Post Solder Cleaning and Drying
Considerations

Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power

Mounted Power Modules: Soldering and Cleanin g

Board

Application Note (AN04-001).

300

Per J-STD-020 Rev. C

250

200

150

100

Reflow Temp (°C)

50

0

Heat ing Zone
1°C/Second

Peak Temp 260°C

* Min. Time Above 235°C
15 Seconds

*Time Above 217°C

60 Seconds

Reflow Time (Seconds)

Cooling
Zone

Figure 20. Recommended linear reflow profile
using Sn/Ag/Cu solder.

Through-Hole Lead-Free Soldering
Information

The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3
wave preheat process should be such that the
temperature of the power module board is kept below

C. For Pb solder, the recommended pot

210
temperature is 260

C max. Not all RoHS-compliant through-hole

270

C, while the Pb-free solder pot is

products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
representative for more details.

C/s is suggested. The

LINEAGE POWER 18

Data Sheet

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a

©

July 27, 2011

EQW006 Series, Eight Brick Power Modules: DC-DC Converte

36 – 75Vdc Input; 12Vdc Output; 6A Output Current

Ordering Information

Please contact your Lineage Power Sales Representative for pricing, availability and optional features.

Table 1. Device Codes

Input Voltage

48V (36-75Vdc) 12.0 V 6 A Negative Through Hole EQW006A0B1 108986415

48V (36-75Vdc) 12.0 V 6 A Negative Through Hole EQW006A0B1Z CC109107034

48V (36-75Vdc) 12.0 V 6 A Negative Surface Mount EQW006A0B1-SB 108994851

48V (36-75Vdc) 12.0 V 6 A Negative Surface Mount EQW006A0B1-SZ 108995635

Output

Voltage

-Z Indicates RoHS Compliant modules

Table 2. Device Options

Negative remote on/off logic (On/Off pin fitted) 1

Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.) 6

Short Pins: 2.79 mm ± 0.25 mm (0.110 in ±0.010 in) 8

Surface mount connections -S

*Note: Legacy device codes may contain a –B option suffix to indicate 100% factory Hi-Pot tested to the isolation voltage specified
in the Absolute Maximum Ratings table. The 100% Hi-Pot test is now applied to all device codes, with or without the –B option
suffix. Existing comcodes for devices with the –B suffix are still valid; however, no new comcodes for devices containing the –B
suffix will be created.

Output

Current

On/Off

Logic

Connector

Type

Product codes Comcodes

Option* Suffix*

Asia-Pacific Headquarters

Tel: [phone]*808

World Wide Headquarters
Lineage Power Corporation

601 Shiloh Road, Plano, TX 75074, USA
+1-888-LINEAGE(546-3243)
(Outside U.S.A.: +1-972-244-WATT(9288))

www.lineagepower.com
e-mail: [e-mail]

Europe, Middle-East and Africa Headquarters

Tel: [phone]

India Headquarters

Tel: [phone]

Lineage Power reserves the right to make changes to the prod uct(s) or information contained herein without notice. No liability is assumed as a result of their use or

pplication. No rights under any patent accompany the sale of any such product (s) or information.

Lineage Power DC-DC products are protected under various pat ents. Information on these patents is available at www.lineagepower.com/patents.

2010 Lineage Power Corporation, (Plano, Texas) All Internationa l Rights Reserved.

Document No: DS03-119 ver. 1.10

PDF name: EQW006A0B.pdf