© 1999 Fairchild Semiconductor Corporation DS500169 www.fairchildsemi.com
May 1999
Revised September 1999
GTLP18T612 18-Bit LVTTL/GTLP Universal Bus Transceiver
GTLP18T612
18-Bit LVTTL/GTLP Universal Bus Transceiver
General Description
The GTLP18T612 is an 18-bit universal bus transceiver
which provides LVTTL to GTLP sign al level translation. It
allows for transparent, latched and clocked modes of data
transfer. The device provides a high speed interface for
cards operating at LVTTL logic levels and a backplane
operating at GTLP logic levels. High speed backplane
operation is a direct res ult of GTL P ’s reduced out put sw ing
(< 1V), reduced input threshold levels and output edge rate
control. The edge rate c ontrol min imizes b us settli ng time.
GTLP is a Fairchild Semiconduct or derivative of the Gunning Transistor logic (GTL) JEDEC standard JESD8-3.
Fairchild's GTLP has inte rnal ed ge-ra te cont rol and is Process, Voltage, and Temperature (PVT) compensated. Its
function is similar to BTL or GTL but with different output
levels and receiver thresholds. GTLP outpu t LOW level is
less than 0.5V, the output HIGH is 1.5V and the receiver
threshold is 1.0V.
Features
■ Bidirectional interface between GTLP and LVTTL logic
levels
■ Edge Rate Control to minimize noise on the GTLP port
■ Power up/down high impedance for live insertion
■ External V
REF
pin for receiver threshold
■ BiCMOS technology for low power dissipation
■ Bushold data input s on A Port eliminates the need for
external pull-up resistors for unused inputs
■ LVTTL compatible Driver and Control inputs
■ Flow-through architecture optimizes PCB layout
■ Open drain on GTLP to support wired-or connection
■ A-Port source/sink −24 mA/+24 mA
■ B-Port sink capability +50 mA
■ D-type flip-flop, latch and transparent data paths
Ordering Code:
Device also available in Tape and Reel. Specify by appending s uffix let te r “X” to the ordering code.
Order Number Package Number Package Description
GTLP18T612MEA MS56A 56-Lead Shrink Small Outline Package (SSOP), JE DEC MO-118, 0.300” Wide
GTLP18T612MTD MTD56 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide