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DM74LS221 Dual Non-Retriggerable One-Shot
Functional Description
The basic output pulse width is determined by selection of
an external resistor (R
X
) and capacitor (CX). Once trig-
gered, the basic puls e w idth is independent of f urt her i np ut
transitions and is a functio n of the timing compon ents, or it
may be reduced or termin ated by use of the active low
CLEAR input. Stable output pulse width ranging from 30 ns
to 70 seconds is readily obtainable.
Operating Rules
1. An external resistor (RX) and an external capacitor
(C
X
) are required for prop er op er ati on . Th e val u e of C
X
may vary from 0 to approxima tely 1000 µF. For small
time constants h igh-grade mica, glass, polyp ropylene,
polycarbonate, or polystyrene material capacitor may
be used. For large time c onst ant s use ta nta lum or spe cial aluminum capacitor s. If timing capacitor has leakages approaching 10 0 nA or if stray capacit ance from
either terminal to gr ound is gr eater than 5 0 pF the tim ing equations may not repre sent the pulse width the
device generates.
2. When an electrol ytic capa ci to r is us ed for C
X
a switch-
ing diode is often requir ed for standard TTL one-shots
to prevent high inverse leakage current . Thi s switchin g
diode is not need ed for the DM7 4LS221 one- shot and
should not be used.
Furthermore, if a polarized timing capacitor is used on
the DM74LS221, the positive side of the capacitor
should be connected to the “C
EXT
” pin (Figure 1).
3. For C
X
>> 1000 pF, the output pulse width (tW) is
defined as follows:
t
W
= KRX C
X
where [RX is in kΩ]
[C
X
is in pF]
[t
W
is in ns]
K ≈ Ln2 = 0.70
4. The multiplicative factor K is plotted as a function of C
X
for design considerations: (See Figure 4).
5. For C
X
< 1000 pF see F igure 3 for tW vs. CX family
curves with R
X
as a parameter.
6. To obtain variable pulse widths by remote trim ming,
the following circuit is recommended: (See Figure 2).
7. Output pulse width versus V
CC
and temperatures: Fig-
ure 5 depicts the relationship between pulse width variation versu s V
CC
. Figure 6 depicts pulse width variation
versus temperatures.
8. Duty cycle is defined as t
W
/T × 100 in percentage, if it
goes above 50% the output pulse width will become
shorter. If the duty cycle varies between LOW and
HIGH values, this causes out put pulse w idth to var y, or
jitter (a function of the R
EXT
only). To reduce jitter, R
EXT
should be as large as possible, for example, with
R
EXT
= 100k jitter is not appreciable until the duty cycle
approaches 90%.
9. Under any operating condition C
X
and RX must be kept
as close to the one-shot device pins as possible to minimize stray capacitance, to reduce noise pick-up, and
to reduce I-R and Ldi/d t voltage devel oped along th eir
connecting paths. If the lead leng th from C
X
to pins (6)
and (7) or pins (14) an d (15) is greate r than 3 cm, for
example, the output pulse width might be quite different
from values predicte d from the appropriat e equations.
A non-inductive and low capacitive path is necessary to
ensure complete discharge of C
X
in each cycle of its
operation so that the output pulse width will b e accurate.
10. Although the DM74LS221's pin-out is id entical to the
DM74LS123 it should be remembered that they are not
functionally identica l. The DM74LS123 is a retriggerable device such that the output is dependent upon the
input transitions when its output “Q” is at the “High”
state. Furthermore, it is recommended for the
DM74LS123 to externally ground the C
EXT
pin for
improved system performance. However, this pin on
the DM74LS221 is not an int ernal connection to the
device gro un d. He nc e , if s u bst i tu tion of an DM 74LS221
onto an DM74LS123 d esi g n la yout w he re the C
EXT
pin
is wired to the ground, the device will not function.
11. V
CC
and ground wiring shoul d conform to good high-
frequency standards and practices so that switching
transients on the V
CC
and ground return leads do not
cause interaction between one-shots. A 0.01 µF to 0.10
µF bypass capacitor (disk ce ramic or monolithic type)
from V
CC
to ground is necessar y on each de vice. Fur-
thermore, the bypass capacitor sho uld be located as
close to the V
CC
-pin as spac e permits.