2XSRFINI/AAnalog RF signal input after passing through the equalizer
3XSIPINI/AInverting input pin of data slicer
5XSDSSLVO/ASlice level output pin
6XSRSLINTI/AReference current setting pin for analog data slicer
8XSAWRCO/AOutput for enlarge VCO range. Analog output from DAC buffer
9XSRFGCO/ARF gain control output
10XSEFGCO/AE,F gain control output
11XSFOCUSO/AOutput voltage level for focusing buffer IC
12XSTRACKO/AOutput voltage level for tracking buffer IC
13XSSLEGO/AOutput voltage level for sledge buffer IC
15XSMOTORO/AOutput voltage level for spindle motor buffer IC
17XSRFRPLPI/AHigh bandwidth low pass filter input for RFRP
18XSTELPI/AHigh bandwidth low pass filter input for TE
19XSVREF2I/A2.1V reference voltage input
20XSRFRPI/ARF ripple/envelope signal input
21XSTEXII/ATracking zero crossing input signal
23XSTEII/ATracking error input signal
24XSFEII/AFocus error input signal
25XSCEII/A
1. Center error input signal
2. Photo Interrupt input
DescriptionPin No.
PC
MPEG
DEC.
7
DVD-310
8
Pin Name
27XSSBADI/ASub-beam addition signal input
166XSPDIREFI/A
167XSFDIREFI/A
169XSPLLFTR2I/AData PLL loop filter pin#2
171XSFDOO/AOutput node of frequency detector charge pump circuit
172XSFTROPII/AInput node of loop filter OP circuit
173XSVR_PLLI/APLL reference voltage input
174XSPDOFTR2I/APhase detector filter pin#1
175XSVREFOO/AReference voltage output
176XSAWRCVCOI/AAuto Wide Range Control of VCO input pin. For enlarge VCO range in CAV mode
29XSDFCTIDetect detection signal input
30XSCSJOChip select signal for accessing control registers
31XSCLKOClock output for accessing control registers
32XSDATAI/ORegisters data input/output pin
33XSLDCOLaser diode on/off control output for both CD/DVD
34XSFGINIMotor Hall sensor input
35XSSPDONOSpindle motor on output
36, 37, 38, 39 XSFLAG[3:0]OThese pins are used to monitor some status of ser vo control block
48, 51, 52XGPIO[2:0]I/O
40XMP1_7I/OInternal microcontroller programmable I/O port 1.7.
41XMP1_6I/OInternal microcontroller programmable I/O port 1.6.
43XMP1_5I/OThis pin is now changed to be NC.
44XMP1_4I/OInternal microcontroller programmable I/O port 1.4.
45XMP1_3I/OInternal microcontroller programmable I/O port 1.3.
47XMP1_2I/OInternal microcontroller programmable I/O port 1.2.
49XMP1_1I/OInternal microcontroller programmable I/O port 1.1.
57XMP1_0I/O
46XMFSCSJI/OOutput chip select connected to external flash ROM chip enable pin
54XMPSENJI/OOutput program store enable connected to external ROM PSENJ pin.
56XMALEI/OThis signal is used as address latch signal in address/data mux mode
70XMCSJI/O
71XMRDJI/O
72XMWRJI/OThis signal is used as the Wire Strobe signal
73XMINT1JI/O
74, 75, 77, 78,
79, 80, 81, 82,
83, 84, 85, 86,
87, 89, 90, 91
62, 63, 64, 65,
66, 67, 68, 69bus for the 8-bit processor mode.
163XTPLCKI/OPLCK test pin
164XTSLRFI/OSLRF test pin
59XOSC1ICrystal input/System clock. The input frequency from outside crystal or oscillator is 33.8688MHz
60XOSC2OCrystal output
53XCRSTJI
94XHCS1JIThis pin is used to select the command block task file registers
93XHCS3JIThis pin is used to select the control block task file registers
103XHIORJIAsserted by the host during a host I/O read operation
104XHIOWJIAsserted by the host during a host I/O write operation
105XHDRQO
101XHDACKJI
99XHCS16JO
50XHRSTJIHost Reset. The reset of ATA bus
100XHINTO
XMA[15:0]I/OThese pins are used as address bus
XMD[7:0]I/O
Type
Phase detector reference current generator. Connect a resistor between this pin and
ground to set reference current
Frequency detector reference current generator. Connect a resistor between this pin and
ground to set reference current
1. These pins are used as general purpose I/O bus
2. When use internal microcontroller, XGPIO[2] can be used as programmable I/O port 3.6.
Internal microcontroller programmable I/O port 1.0.
This pin is default used as the A16 (microcontroller address line 16)
1. This signal must be asserted for all microcontroller accesses to the register of this chip
2. When use internal microcontroller, this signal can be used as programmable I/O port 3.1
1. This signal is used as the Read Strobe signal
2. When use internal microcontroller, this signal can be used as programmable I/O port 3.0
1. This signal is an interrupt line to the microcontroller
2. When use internal microcontroller, this signal can be used as programmable I/O port 3.7
These pins are used as data bus for the 16-bit processor mode, or the address/data mux
Chip Reset. As asserted low input generates a component reset that stops all operations within
the chip and deasserts all output signals. All input/output signals are set to input.
DMA request. This pin is configured as the DMA request signal, and is used during DMA transfer
1.
between the host and the controller. This pin is tri-stated when DMA transfers are not enabled.
2.
MPEG acknowledge. This pin is used as the ACKJ signal when MPEG interface mode is selected.
1. DMA acknowledge. This pin is configured as DACKJ, and is used as the DMA acknowledge
signal during DMA data transfers.
2. MPEG request. This pin is used as the REQ signal when MPEG interface mode is selected
1. 16-bit data select. This signal indicates that a 16-bit data transfer is active on the host data
bus. This pin is open-drain tri-state output.
2. MPEG clock. This pin is used as the CLOCK signal when MPEG interface mode is selected.
1. Host interface request. This tri-state pin is the host interrupt request, and is asserted to
indicate to the host that the controller needs attention.
2. MPEG begin. This pin is used as the BEGIN signal when MPEG interface mode is selected
DescriptionPin No.
8
DVD-310
9
Pin Name
97XHPDIAGJI/OThis pin is used as the Passed Diagnostics signal, and may be an input or an open-drain output
92XHDASPJI/O
102XHIORDYI/O
95, 96, 98XHA[2:0]I
106, 107, 108,2.
109, 111, 112,3. VCD I/F. Bit3-0 are used as VCD I/F signal when VCD function is enabled. The relationship of
113, 114, 116,bit3-0 and VCD I/F is as follow
117, 118, 119,HD0—CD-DATA
120, 121, 122,HD1—CD-LRCK
123HD2—CD-BCK
143XRSDCLKOThis signal is the clock output for SDRAM
147XROEJO
142XRWEJOThis signal is asserted low when a buffer memory write operation is active
124, 125, 126,
127, 128, 129,
131, 132, 134,
135, 136, 137,
138, 139, 140,
141
4AVDD5_DSAnalog Power +5V for Data Slicer part
14AVDD5_DAAnalog Power +5V for DAC part
26AVDD5_ADAnalog Power +5V for ADC part
168AVDD5_PLAnalog Power +5V for Data PLL part
7, 55, 58, 76,
115, 146,
150, 162
1AVSS_DSAnalog Ground for Data Slicer part
16AVSS_DAAnalog Ground for DAC part
22AVSS_ADAnalog Ground for ADC part
170AVSS_PLAnalog Ground for Data PLL part
28, 42, 61,
88, 110, 130,
138, 154, 165
XHD[15.0]I/O
XRA[11:0]O1: Normal operation
XRD[15:0]I/OThese signals are the 8-bit parallel data lines to/from the buffer memory.
VDDPower +3.3V for digital core logic and pad
GNDDigital Ground core logic and pad.
Type
This pin is used as the Drive Active/Slave Present signal, and is an input or an open-drain
output. This pin is used for Master/Slave drive communication and/or for driving an LED
1. I/O channel ready. This signal is driven low to extend host transfer cycles when the controller
is not ready to respond. This pin will be tri-stated when a read or write is not in progress.
2. MPEG error. This pin is used as the ERROR signal when MPEG interface mode is selected
Host address lines. The host address lines A[2:0] are used to access the various host control,
status, and data registers
1. Host data bus. This bus is used to transfer data and status between the host and the controller.
MPEG data bus 7-8. The HD[7:0] are used as the DATA [7:0] when MPEG interface mode is selected.
HD3—CD-C2PO
This signal is used as the memory output enable for external DRAM buffers. After RSTJ is
asserted, this signal will be low
This signal is used as Row address output to external DRAM buffer. After RSTJ is asserted, this
signal will be high
This signal is used as column address output to external DRAM. After RSTJ is asserted, this
signal will be high
1. RAM address lines. These are bits11-0 for addressing the buffer memory.
2. Hardware setting. The bits6-0 are used as hardware setting for some functions.
RA[9] : FLASH size is 64K/128K
1: FLASH size is 64K
0: FLASH size is 128K
RA[8] : External CPU is 8032/H8
1: 8032
0: H8
RA[7] : Microcontroller programmable I/O port 1 pin control
1: By internal microcontroller
0: By registers to decide input/output
RA[6] : System test pin output
0: System test pin output
RA[5] : For testing purpose, don’t need to set
RA[4] : IDE master/slave
1: Slave
0: Master
RA[3] : For testing purpose, don’t need to set
RA[2] : For testing purpose, don’t need to set
RA[1-0] : MCU Mode selection
11: Normal Mode (internal uP, internal address latch)
10: Outside uP Mode (ICE Mode)
01: Test mode for internal uP testing
00: Internal uP mode with external address latch
DescriptionPin No.
9
SP3721A (ME: U2)
CDRF
CDRDDC
ATOP
ATON
AIN
AIP
DVD-310
HOLD1
VNA
FNN
FNP
DIP
DIN
RX
BYP
SIGO
VPA
49505152535455565758596061626364
10
DVDRFP
DVDRFN
PD1
PD2
A2
B2
C2
D2
CP
CN
1
2
3
4
5
6
7
8
9
10
11
D
12
C
13
B
14
A
15
F
16
E
NC
VCI2
CDTE
TOP VIEW
VNB
DVDLD
DVDPD
CDPD
CDLD
LDON#
VC
VCI
VPB
VIIRR
VIP
32313029282726252423222120191817
VIB
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
FDCHG#
SDEN
SD ATA
SCLK
LCP
LCN
CE
FE
TE
MEI
MEV
TPH
DFT
PI
MIN
MEVO
MLPF
SP3721A Terminal Function
Pin Name
Type
1, 2DVDREP, DVDRENIRF Signal Inputs. Differential RF signal attenuator input pins
63CDRFIRF Signal Inputs. Single-ended RF signal attenuator input pin
Analog inputs for RF Single Buffer. Differential analog inputs to the RF single-ended output buffer
and full wave rectifier
Low Impedance Enable. A TTL compatible input pin that activates the FDCHG switches. A low
32FDCHG#I
level activates the switches and the falling edge of the internal FDCHG triggers the fast decay for
the MIRR bottom hold circuit. (open high)
49HOLD1I
Hold Control. A TLL compatible control pin which, when pulled high, disables the RF AGC charge
pump and holds the RF AGC amplifier gain at its present value. (open high)
11~14D, C, B, AIPhoto Detector Interface Inputs. Inputs from the main beam Photo detector matrix outputs
5~8A2, B2, C2, D2I
Photo Detector Interface Inputs. AC coupled inputs for the DPD from the main beam Photo
detector matrix outputs
15~16F, EICD tracking Error Inputs. Inputs from the CD photo detector error outputs.
3~4PD1, PD2ICD Photo detector Interface Inputs. Inputs from the CD photo detector error outputs
40MEIIMirror Envelope Inputs. The SIGO envelope input pin
35MINI
RF signal Input for Mirror. AC coupled inputs for the mirror detection circuit from the pull-in signal
output. (PI)
21DVDPDIAPC Input. DVD APC input pin from the monitor photo diode
23CDPDIAPC Input. CD APC input pin from the monitor photo diode
25LDON#IAPC Output On/Off. APC output control pin. A low level activates the LD output. (open high)
22DVDLDOAPC output. DVD APC output pin to control the laser power
24CDLDOAPC output. CD APC output pin to control the laser power
56BYPI/OThe RF AGC integration capacitor CBYP, is connected between BYP and VPA
9CPI/O
10CNI/O
45LCP—Center Error LPF pin. An external capacitance is connected between this pin and the LCN pin
44LCN—Center Error LPF pin. An external capacitance is connected between this pin and the LCP pin
30MP—MIRR signal Peak hold pin. An external capacitance is connected to between this pin and VPB
31MB—MIRR signal Bottom hold pin. An external capacitance is connected to between this pin and VPB
39MEV—Sigo Bottom Envelope pin. An external capacitance is connected to between this pin and VPB
17CDTE—CD Tracking. E-F Opamp output for feedback
38TPH—PI Top Hold pin. An external capacitance is connected to between this pin and VPB
26VC—
27VCI—Reference Voltage input. DC bias voltage input for the servo input reference
18VCI2—Reference Voltage input. DC bias voltage input for the servo input reference
55RX—
33MLPF—MIRR signal LPF pin. An external capacitance is connected between this pin and VPB
19NC—No Connect
48SDENI
47SDATAI/O
46SCLKI
58VPAPower. Power supply pin for the RF block and serial port
28VPBPower. Power supply pin for the servo block
50VNAGround. Ground pin for the RF block and serial port
20VNBGround. Ground pin for the servo bolck
Type
Defect Output. Pseudo CMOS output. When a defect is detected, the DFT output goes high. Also
the servo AGC output can be monitored at this pin, when CAR bits 7-4 are ‘0011’
Pull-in Signal Output. The summing signal output of A, B, C, D or PD1, PD2 for mirror detection.
Reference to VCI
Differential Phase tracking LPF pin. An external capacitance is connected between this pin and
the CN pin
Differential Phase tracking LPF pin. An external capacitance is connected between this pin and
the CP pin
Reference Voltage output. This pin provides the internal DC bias reference voltage (+2.5V lix).
Output Impedance is less than 50ohms
Reference Resistor Input. An external 8.2kohm, 1% resistor is connected from this pin to ground
to establish a precise PTAT (proportional to absolute temperature) reference current for the filter
Serial Data Enable. Serial Enable CMOS input. A high level input enable the serial port (Not to be
left open)
Serial Data. Serial data bi-directional CMOS pin. NRZ programming data for the internal registers
is applied to this input ( Not to be left open)
Serial Clock. Serial Clock CMOS input. The clock applied to this pin is synchronized with the data
applied to SDATA (Not to be left open)
Active on the positive going edge to sample all input.
Disables or enables device operation by masking or enabling all input
except CLK,CKE and L(U)DQM
Masks system clock to freeze operation from the next clock cycle.
CKE should be enabled at least one cycle prior to new command.
Disable input buffers for power down in standby.
Row/column aaddresses are multiplexed on the same pins.
Row address : RA0 ~ RA10,column address : CA0 ~ CA7
Selects bank to activated during row address latch time.
Select bank for read/write during column address latch time.
Latches row addresses on the positive going edge of the CLK
with RAS low.
Enables row access & precharge.
Latches column addresses on the positive going edge of the CLK
with CAS low.
Enables column access.
Enables write operation and row precharge.
Latches data in starting from CAS, WE active.
Makes data output Hi-Z, t
Blocks data input when L(U)DQM active.
Data inputs/outputs are multiplexed on the same pins.
Powe and ground for the input buffers and the core logic.
Isolated power supply and ground for the output buffers to provide
improved noise immunity.
This pin is recommended to be left No Connection on the device.
SHZ after the clock and masks the output.
15
MX29LV160ABTC-70 (ME: U10)
1
A15
2
A14
3
A13
4
A12
5
A11
6
A10
7
A9
8
A8
9
A19
10
NC
11
WE
NC
NC
A18
A17
12
13
14
15
16
17
18
A7
19
A6
20
A5
21
A4
22
A3
23
A2
24
A1
RESET
RY/B Y
BLOCK DIAGRAM
DVD-310
48
A16
47
BYTE
46
GND
45
Q15/A-1
44
Q7
43
Q14
42
Q6
41
Q13
40
Q5
39
Q12
38
Q4
37
VCC
36
Q11
35
Q3
34
Q10
33
Q2
32
Q9
31
Q1
30
Q8
29
Q0
28
OE
27
GND
26
CE
25
A0
16
CE
OE
WE
RESET
A0-A19
CONTROL
INPUT
LOGIC
ADDRESS
LATCH
AND
BUFFER
PROGRAM/ERASE
HIGH VOLTAGE
X-DECODER
FLASH
ARRAY
Y-DECODER
Y-PASS GATE
SENSE
AMPLIFIER
ARRAY
SOURCE
PGM
DATA
HV
HV
WRITE
S TAT E
MACHINE
(WSM)
STATE
REGISTER
COMMAND
DA TA
DECODER
COMMAND
DATA LATCH
Q0-Q15/A-1
PROGRAM
DATA LAT C H
I/O BUFFER
16
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