Datasheet UPC2708TB-E3, UPC2708TB, UPC2708T-E3, UPC2708T Datasheet (NEC)

DATA SHEET

BIPOLAR ANALOG INTEGRATED CI RCUIT

µµµµ

PC2708TB

5 V, SUPER MINIMOLD SILICON MMIC

MEDIUM OUTPUT POWER AMPLIFIER

DESCRIPTION

The µPC2708TB is a silicon monolithic integrated circuit designed as buffer amplifier for BS/CS tuners. This IC is

packaged in super minimold package which is smaller than conventional minimold.

The µPC2708TB has compatible pin connections and performance to µPC2708T of conventional minimold

version. So, in the case of reducing your system size, µPC2708TB is suitable to replace from µPC2708T.

This IC is manufactured using NEC’s 20 GHz fT NESATTM lll silicon bipolar process. This process uses silicon
nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and
prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.

FEATURES

• High-density surface mounting : 6-pin super minimold package

• Wideband response : f

• Medium output power : P

• Supply voltage : V

• Power gain : G

• Port impedance : input/output 50

u

= 2.9 GHz TYP. @ 3 dB bandwidth

O(sat)

= +10 dBm TYP. @ f = 1 GHz with external inductor

CC

= 4.5 to 5.5 V

P

= 15 dB TYP. @ f = 1 GHz

Ω

APPLICATION

• 1st IF amplifiers in BS/CS converters, etc.

• 1st IF stage buffer in BS/CS tuners, etc.

ORDERING INFORMATION

Part Number Package Marking Supplying Form

µ

PC2708TB-E3 6-pin super minimold C1D Embossed tape 8 mm wide.

1, 2, 3 pins face to perforat i on side of the tape.
Qty 3 kp/reel.

Remark

To order evaluation samples, please contact your local NEC sales office. (Part number for sample order:

PC2708TB)

µ

The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.

Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.

Document No. P13442EJ2V0DS00 (2nd edition)
Date Published May 1999 N CP(K)
Printed in Japan

Caution Electro-static sensitive devices

The mark shows major revised points.

1998, 1999©

PIN CONNECTIONS

(Top View) (Bottom View)

3

µµµµ

PC2708TB

Pin No. Pin Name

1 INPUT

4

4

3

2GND

2

1

PRODUCT LINE-UP (TA = +25°C, VCC = V

Part No.

PC2708T 6-pin minimold

µ

PC2708TB

µ

Remark

Notice

Typical performance. Please refer to

The package size distinguishes between minimold and super minimold.

f

(GHz)

2.9 +10.0 15 6.5 26

C1D

u

5

6

O(sat)

P

(dBm)

5

6

out

= 5.0 V, ZL = ZS = 50

P

G

(dB)

2

1

ΩΩΩΩ

NF

(dB)

ELECTRICAL CHARACTERISTICS

)

CC

I

(mA)

6-pin super minimold

in detail.

3GND
4OUTPUT
5GND
6V

Package Marking

CC

C1D

2

Data Sheet P13442EJ2V0DS00

SYSTEM APPLICATION EXAMPLE

EXAMPLE OF DBS CONVERTERS

µµµµ

PC2708TB

BS Antenna
(DBS ODU)

Parabola

Antenna

EXAMPLE OF 2.4 GHz BAND RECIEVER

RX

SW

Oscillator

PLL

PC2711TB

µ
µ

PC2712TB

IF Amp.RF Amp. Mixer

PC2708T/TB

µ

PLL

DEMO

To IDU

I

Q

Driver

TX

PA

PC2708T/TB

µ

To know the associated products, please refer to each latest data sheet.

I

0°

φ

90°

Q

Data Sheet P13442EJ2V0DS00

3

PIN EXPLANATION

µµµµ

PC2708TB

Pin
No.

Pin Name

Applied
Voltage (V)

Pin
Voltage

Note

(V)

Function and Applications Internal Equivalent Circ ui t

1 INPUT – 1.16 Signal input pin. A i nternal

matching circuit, configured with
resistors, enables 50

Ω

connection over a wide band.
A multi-feedback ci rcuit is
designed to cancel the

FE

deviations of h

and resistance.
This pin must be coupled to
signal source with capac i t or for
DC cut.

4 OUTPUT Voltage

as same

CC

as V
through
external

– Signal output pin. The induct or

must be attached between V
and output pins to supply
current to the internal output
transistors.

inductor

6VCC4.5 to 5.5 – Power supply pin, whi ch biases

the internal input transis tor.
This pin should be externally
equipped with bypass capaci t or
to minimize its i m pedance.

2
3
5

GND 0 – Ground pin. This pin should be

connected to system ground
with minimum inductanc e.
Ground pattern on the board
should be formed as wide as
possible.
All the ground pins must be
connected together with wide
ground pattern to decrease
impedance difference.

6

V

CC

4

CC

1

IN

23 5

GNDGND

OUT

Pin voltage is measured at V

Note

4

CC

= 5.0 V

Data Sheet P13442EJ2V0DS00

ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Conditions Ratings Unit

µµµµ

PC2708TB

Supply Voltage V
Total Circuit Current I
Power Dissipation P

Operating Ambient Temperature T
Storage Temperature T
Input Power P

CC

CC

stg

TA = +25 °C, Pin 4 and 6 6 V
TA = +25 °C 60 mA

D

Mounted on doublesided copper clad

A

50 × 50 × 1.6 mm epoxy glass PWB (T

A

in

TA = +25 °C +10 dBm

= +85 °C)

200 mW

40 to +85 °C

−

55 to +150 °C

−

RECOMMENDED OPERATING CONDITIONS

Parameter Symbol MIN. TYP. MAX. Unit Remark

O(sat)

∆

CC

A

CC

P

u

in

out

P

G

4.5 5.0 5.5 V The same v ol tage should be applied
to pin 4 and 6.

40 +25 +85 °C

−

C, VCC = V

°°°°

out

= 5.0 V, ZS = ZL = 50

)

ΩΩΩΩ

No Signal 20 26 33 mA
f = 1 GHz 13.0 15. 0 18.5 dB
f = 1 GHz, Pin = 0 dBm +7.5 +10.0 – dBm

3 dB down below flat gain at

2.7 2.9 – GHz

f = 0.1 GHz

f = 1 GHz 8 11 – dB
f = 1 GHz 16 20 – dB
f = 0.1 to 2.6 GHz – ±0.8 – dB

Supply Voltage V

Operating Ambient Temperature T

ELECTRICAL CHARACTERISTICS (TA = +25

Parameter Symbol Test Conditions MIN. TYP. MAX . Unit
Circuit Current I
Power Gain G
Maximum Output Level P
Noise Figure NF f = 1 GHz – 6.5 8.0 dB
Upper Limit Operating Frequency f

Isolation ISL f = 1 GHz 18 23 – dB
Input Return Loss RL
Output Return Loss RL
Gain Flatness

Data Sheet P13442EJ2V0DS00

5

TEST CIRCUIT

1 000 pF

C

3

µµµµ

PC2708TB

V

CC

6

1

C

1 000 pF 1 000 pF

1

2, 3, 5

L

C

4

50 Ω50 Ω

2

OUTIN

COMPONENTS OF TEST CIRCUIT
FOR MEASURING ELECTRICAL

EXAMPLE OF ACTURAL APPLICATION COMPONENTS

CHARACTERISTICS

Type Value Type Value Operating Frequency

2

C1, C

3

C

L Bias Tee 1 000 nH 100 nH 100 MHz or higher

Bias Tee 1 000 pF C1 to C

Capacitor 1 000 pF 300 nH 10 MHz or higher

3

Chip Capacitor 1 000 pF 100 MHz or higher

L Chip Inductor

10 nH 1.0 GHz or higher

INDUCTOR FOR THE OUTPUT PIN

The internal output transistor of this IC consumes 20 mA, to output medium power. To supply current for output

CC

transistor, connect an inductor between the V

pin (pin 6) and output pin (pin 4). Select large value inductance, as

listed above.

The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum
voltage drop to output enable high level. In terms of AC, the inductor make output-port impedance higher to get
enough gain. In this case, large inductance and Q is suitable.

CAPACITORS FOR THE V

Capacitors of 1000 pF are recommendable as the bypass capacitor for the V

CC

, INPUT AND OUTPUT PINS

CC

pin and the coupling capacitors for

the input and output pins.

The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias
can be supplied against VCC fluctuation.

The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial
impedance. Their capacitance are therefore selected as lower impedance against a 50 Ω load. The capacitors thus
perform as high pass filters, suppressing low frequencies to DC.

To obtain a flat gain from 100 MHz upwards, 1000 pF capacitors are used in the test circuit. In the case of under
10 MHz operation, increase the value of coupling capacitor such as 10000 pF. Because the coupling capacitors are
determined by equation, C = 1/(2 πRfc).

6

Data Sheet P13442EJ2V0DS00

ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD

AMP-2

Top View

321

C1D

456

Mounting Direction

IN OUT

CC

L

CC

V

C

µµµµ

PC2708TB

COMPONENT LIST

Value

C 1 000 pF

L 300 nH

Notes

1.

30 × 30 × 0.4 mm double sided copper clad polyimide board.

2.

Back side: GND pattern

3.

Solder plated on pattern

4.

: Through holes

For more information on the use of this IC, refer to the following application note: USAGE AND APPLICATION OF

SILICON MEDIUM-POWER HIGH-FREQUENCY AMPLIFIER MMIC (P12152E).

Data Sheet P13442EJ2V0DS00

7

TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25 °C)

µµµµ

PC2708TB

9

8

CIRCUIT CURRENT vs. SUPPLY VOLTAGE

40

No signal

35

30

(mA)

25

CC

20

15

Circuit Current I

10

5

0

0

123456

Supply Voltage VCC (V) Operating Ambient Temperature TA (°C)

NOISE FIGURE AND INSERTION POWER
GAIN vs. FREQUENCY

20

(dB)

P

15

G

P

VCC = 5.5 V

CIRCUIT CURRENT vs.
OPERATING AMBIENT TEMPERATURE

40

No signal

CC

= 5.0 V

V

35

30

(mA)

25

CC

20

15

Circuit Current I

10

5
0

–40 –20 +40 +60 +80

0–60 +20 +100

INSERTION POWER GAIN vs. FREQUENCY

20

(dB)

P

TA = –40 °C

TA = +25 °C

CC

= 5.0 V

V

TA = +85 °C

7

6

Noise Figure NF (dB)

VCC = 5.5 V

10

Insertion Power Gain G

VCC = 4.5 V

5

5

0.1

0

–10

–20

–30

Isolation ISL (dB)

–40

VCC = 5.0 V

VCC = 4.5 V

NF

VCC = 5.0 V

0.3 1.0 3.0
Frequency f (GHz)

ISOLATION vs. FREQUENCY

CC

V

= 5.0 V

15

TA = +85 °C

Insertion Power Gain G

10

INPUT RETURAN LOSS, OUTPUT RETURN
LOSS vs. FREQUENCY

0

–10

(dB)

out

(dB)

in

–20

–30

Input Return Loss RL

Output Return Loss RL

TA = –40 °C

TA = +25 °C

0.3 1.0 3.00.1
Frequency f (GHz)

RL

in

V

CC

= 5.0 V

RL

out

–50

0.1 0.3 1.0

3.0

–40

0.1

1.00.3 3.0

Frequency f (GHz) Frequency f (GHz)

8

Data Sheet P13442EJ2V0DS00

+15

+10

µµµµ

OUTPUT POWER vs. INPUT POWER OUTPUT POWER vs. INPUT POWER

+15

+10

f = 1.0 GHz
VCC = 5.0 V

TA = +85 °C

f = 1.0 GHz

VCC = 5.5 V

PC2708TB

+5

(dBm)

out

0

VCC = 4.5 V

VCC = 5.0 V

–5

–10

Output Power P

–15

–20

–30 0 +5

–15 –10 –5

–20–25

Input Power Pin (dBm) Input Power Pin (dBm)

OUTPUT POWER vs. INPUT POWER OUTPUT POWER vs. INPUT POWER

+15

f = 2.0 GHz

+10

VCC = 5.5 V

+5

(dBm)

out

0

VCC = 4.5 V

VCC = 5.0 V

–5

–10

Output Power P

+5

(dBm)

out

0

TA = –40 °C

TA = +25 °C

–5

–10

Output Power P

–15

–20

–30 0 +5

–15 –10 –5

–20–25

+15

VCC = 5.0 V

f = 1.0 GHz

+10

+5

(dBm)

out

0

f = 2.0 GHz

f = 2.9 GHz

–5

–10

Output Power P

–15

–20

–30 0 +5

–15 –10 –5

–20–25 –30 0 [phone]

Input Power P

in

(dBm)

SATURATED OUTPUT POWER vs. FREQUENCY

+15

VCC = 5.5 V

P
VCC = 5.0 V

(dBm)

+10

O (sat)

VCC = 4.5 V

+5

Saturated Output Power P

0

0.1

0.3 1.0 –10 –8 –6 –4 –2 0 +2 +4 +6 +8 +103.0
Frequency f (GHz) Output Power of Each Tone P

in

= 0 dBm

–15

–20

in

Input Power P

(dBm)

THIRD ORDER INTERMODULATION DISTORTION
vs. OUTPUT POWER OF EACH TONE

–60

f1 = 1 .000 GHz

(dBc)

3

f2 = 1 .002 GHz

–50

VCC = 5.0 V

–40

–30

–20

Third Order Intermodulation Distotion IM

–10

VCC = 4.5 V

VCC = 5.5 V

O (each)

(dBm)

Data Sheet P13442EJ2V0DS00

9

µµµµ

PC2708TB

S-PARAMETER (TA = +25 °C, VCC = V

S11-FREQUENCY

out

= 5.0 V)

1.0 GHz

2.0 GHz

0.1 GHz

3.0 GHz

S22-FREQUENCY

3.0 GHz

0.1 GHz

2.0 GHz

10

Data Sheet P13442EJ2V0DS00

TYPICAL S-PARAMETER VALUES (TA = +25 °C)

PC2708TB

µ

VCC = V

out

= 5.0 V, ICC = 27 mA

µµµµ

PC2708TB

FREQUENCY

MHz MAG.ANG.MAG.ANG.MAG.ANG.MAG.ANG.

100.0000 0.039 138.9 5.815 –4.8 0.077 –0.8 0.051 0.9 1.34

200.0000 0.053 119.7 5.822 –9.8 0.075 –1.5 0.048 1.4 1.36

300.0000 0.069 106.7 5.815 –14.3 0.074 –0.6 0.049 5.9 1.38

400.0000 0.088 97.2 5.813 –18.8 0.074 –0.5 0.054 8.9 1.36

500.0000 0.105 91.6 5.794 –23.8 0.072 –1.1 0.054 8.8 1.39

600.0000 0.123 84.9 5.823 –28.4 0.071 –0.6 0.056 10.4 1.40

700.0000 0.144 79.7 5.871 –33.0 0.070 0.1 0.060 11.5 1.40

800.0000 0.164 74.7 5.890 –38.2 0.071 0.5 0.065 11.6 1.37

900.0000 0.186 70.7 5.938 –42.8 0.073 2.3 0.072 11.1 1.34

1000.0000 0.205 66.1 5.960 –47.6 0.070 1.0 0.074 8.2 1.36

1100.0000 0.226 61.7 6.072 –52.7 0.069 3.3 0.075 9.4 1.34

1200.0000 0.245 57.7 6.097 –57.5 0.070 4.4 0.082 5.6 1.31

1300.0000 0.263 53.7 6.174 –63.0 0.067 2.5 0.085 0.6 1.33

1400.0000 0.286 48.6 6.275 –68.4 0.069 5.0 0.091 –4.6 1.28

1500.0000 0.308 44.3 6.371 –74.3 0.070 5.4 0.092 –8.2 1.24

1600.0000 0.328 40.7 6.419 –79.8 0.066 7.1 0.097 –12.6 1.26

1700.0000 0.344 36.2 6.470 –85.9 0.067 5.6 0.096 –19.6 1.23

1800.0000 0.364 31.0 6.555 –92.1 0.069 8.2 0.100 –23.9 1.18

1900.0000 0.382 26.0 6.542 –98.3 0.070 8.4 0.100 –32.0 1.15

2000.0000 0.395 21.2 6.570 –104.7 0.070 8.7 0.101 –38.9 1.13

2100.0000 0.405 16.8 6.528 –111.3 0.070 10.1 0.100 –47.2 1.12

2200.0000 0.417 11.8 6.527 –118.5 0.071 9.4 0.096 –57.2 1.09

2300.0000 0.427 6.6 6.438 –124.7 0.072 9.5 0.098 –66.1 1.09

2400.0000 0.431 2.2 6.336 –131.3 0.071 10.7 0.095 –76.5 1.09

2500.0000 0.431 –3.0 6.247 –138.1 0.072 12.8 0.098 –86.1 1.09

2600.0000 0.434 –8.2 6.127 –145.0 0.071 15.4 0.094 –99.9 1.10

2700.0000 0.423 –12.3 5.952 –151.7 0.071 14.5 0.088 –116.7 1.14

2800.0000 0.419 –17.1 5.816 –158.2 0.070 16.1 0.081 –134.4 1.18

2900.0000 0.408 –21.5 5.619 –165.0 0.073 15.3 0.074 –149.7 1.19

3000.0000 0.400 –26.2 5.354 –171.5 0.074 17.1 0.065 –170.3 1.24

3100.0000 0.386 –29.3 5.134 –177.4 0.075 17.1 0.053 172.8 1.28

11

S

21

S

12

S

22

S

K

Data Sheet P13442EJ2V0DS00

11

PACAGE DIMENSIONS

6 pin super minimold (Unit: mm)

µµµµ

PC2708TB

2.1 ±0.1

1.25 ±0.1

0.2

+0.1
–0

0.65 0.65

1.3

2.0 ±0.2

0.1 MIN.

0.7

0.9 ±0.1

0.15

+0.1
–0

0 to 0.1

12

Data Sheet P13442EJ2V0DS00

µµµµ

PC2708TB

NOTES ON CORRECT USE

(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).

All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to VCC line.
(4) The inductor must be attached between VCC and output pins. The inductance value should be determined in

accordance with desired frequency.
(5) The DC cut capacitor must be attached to input pin.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered under the following recommended conditions. For soldering methods and

conditions other than those recommended below, contact your NEC sales representative.

Soldering Method Soldering Conditions Recommended Condition Symbol

Infrared Reflow Package peak temperature: 235 °C or below

Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limi t: None

VPS Package peak temperature: 215 °C or below

Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limi t: None

Wave Soldering Soldering bath temperature: 260 °C or below

Time: 10 seconds or less
Count: 1, Exposure limi t: None

Partial Heating Pin temperature: 300 °C

Time: 3 seconds or less (per side of device)
Exposure limit: None

After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.

Note

Note

Note

Note

Note

IR35-00-3

VP15-00-3

WS60-00-1

–

Caution Do not use different soldering methods together (except for partial heating).

For details of recommended soldering conditions for surface mounting, refer to information document

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

Data Sheet P13442EJ2V0DS00

13

[MEMO]

µµµµ

PC2708TB

14

Data Sheet P13442EJ2V0DS00

[MEMO]

µµµµ

PC2708TB

Data Sheet P13442EJ2V0DS00

15

µµµµ

PC2708TB

NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.

• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.

• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.

• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.

• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.

• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.

• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.

M7 98. 8