ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise specified)
ParameterSymbolRatingsUnit
Supply voltageVCC7V
Input signal voltage (Chroma signal)ei43Vp-p
Input signal voltage (H sync separation)ei363Vp-p
Input signal voltage (V sync separation)ei343Vp-p
Input signal voltage (EXT)ei18VCCVp-p
Tint control signal voltageec3VCCV
Output currentIO–7mA
Permissible package power dissipationPD570 (TA = 75°C)mW
(when mounted on PCB)
Operating ambient temperatureTA–10 to +75°C
Storage temperatureTstg–40 to +125°C
Caution Expose to Absolute Maximum Rating for extended periods may affect device reliability; exceeding the
ratings could cause permanent damage. The parameters apply independently.
The device should be operated within the limits specified under DC and AC Characteristics.
RECOMMENDED OPERATING CONDITIONS
ParameterSymbolMIN.TYP.MAX.Unit
Supply voltageVCC4.55.05.5V
Input signal voltage (Chroma signal)ei4150mVp-p
Input signal voltage (H sync separation)ei361.0Vp-p
Input signal voltage (V sync separation)ei341.0Vp-p
Input signal voltage (EXT IN HIGH voltage)eiH182.0V
Input signal voltage (EXT IN LOW voltage)eiL180.8V
Divider selector voltage 1 (1/8)V17 (8)4.8V
Divider selector voltage 2 (1/4)V17 (4)0.2V
Tint control voltageV32.5V
NTSC/PAL select voltage (PAL)V19P4.5V
NTSC/PAL select voltage (NTSC)V19N0.5V
Supply currentICC (C)VCC (C) = 5 V172125mA
of chroma sectionNo current on pin 2, 14 and 15
ACC amplitudeACC1Fluctuation of chroma output level at +6 dB–2.00+2.0dB
characteristic 1change of chroma input burst signal
(0 dB = 150 mVp-p)
ACC amplitudeACC2Fluctuation of chroma output level at –20 dB–5.0–1.0+1.0dB
characteristic 2change of chroma input burst signal
(0 dB = 150 mVp-p)
Color killer set pointeKSInput level at killer ON with chroma input burst–45–39–33dB
sig. (0 dB = 150 mVp-p) being attenuated
Color residual of color killereKRResidual level of chroma output in Killer ON--15mVp-p
state when chroma input burst signal of
150 mVp-p is input
Chroma output levelECOUTChroma output level when chroma input burst1.11.31.5Vp-p
signal of 150 mVp-p is input
Color killer outputECKOH (1)High level of color killer output at color killer2.73.5-V
High level (1)OFF
IOH = –400 µA
Color killer outputECKOH (2)High level of color killer output at color killer3.54.0-V
High level (2)OFF
IOH = –20 µA
Color killer outputECKOLLow level of color killer output at color killer ON-0.20.4V
Low levelIOL = +2 mA
APC lock-in rangefPFrequency pulled by APC with chroma input±400±600-Hz
burst frequency changed (fSC conversion)
VCO control sensitivity
Phase variable range
VCO output leveleVCOOVCO output level when chroma input burst1.01.31.6Vp-p
fSC output leveleSCOfSCO output level when chroma input burst210300390mVp-p
Divider select voltage
NTSC/PAL select voltageVN/PTfV = 60 Hz if VN/P < VN/PT1.72.02.3V
β
PRate of variation of frequency when APC filter8.010.012.0Hz/mV
pin is changed from –0.025 V to +0.025 V
(fSC conversion)
θ
CONTAmount of phase shift when voltage of phase±40±55-deg
control pin is set at 2.5 V + 1 V
signal of 150 mVp-p is input
signal of 150 mVp-p is input
VDIVSL
VDIVSH
1/4 freq. division if VDIVS < VDIVSL
EXT IN with VDIVS : OPEN
1/8 freq. division if VDIVSH < VDIVS
fV = 50 Hz if VN/PT < VN/P
--0.5V
4.5--V
19
Page 20
µ
Sync section
ParameterSymbolConditionMIN.TYP.MAX.Unit
Supply currentICC (1)VCC (1) = 5 V121518mA
of Sync sectionNo current on pin 25
DC level of H syncVSSIVoltage of pin 36 when connected to GND via1.92.22.5V
separation input10 kΩ resistor
DC level of V syncVVSSIVoltage of pin 34 when connected to GND via1.92.22.5V
separation input10 kΩ resistor
Sync separation outputECSOH1High level of sync separation output when only2.73.8-V
High level (1)0.3 Vp-p sync signal is input to pin 36
IOH = –400 µA
Sync separation outputECSOH2High level of sync separation output when only3.54.3-V
High level (2)0.3 Vp-p sync signal is input to pin 36
IOH = –20 µA
Sync separation outputECSOLLow level of sync separation output when only-0.10.4V
Low level0.3 Vp-p sync signal is input to pin 36
IOL = +2 mA
HD outputENHSOH1High level of synchronized HD output when2.73.8-V
High level (1)only 0.3 Vp-p sync signal is input to pin 36
IOH = –400 µA
HD outputENHSOH2High level of synchronized HD output when3.54.3-V
High level (2)only 0.3 Vp-p sync signal is input to pin 36
IOH = –20 µA
HD outputENHSOLHigh level of synchronized HD output when-0.10.4V
Low levelonly 0.3 Vp-p sync signal is input to pin 36
IOL = +2 mA
VD outputEVSOH1High level of synchronized VD output when2.73.8-V
High level (1)only 0.3 Vp-p sync signal is input to pin 36
IOH = –400 µA
VD outputEVSOH2High level of synchronized VD output when3.54.3-V
High level (2)only 0.3 Vp-p sync signal is input to pin 36
IOH = –20µA
VD outputEVSOLHigh level of synchronized VD output when-0.10.4V
Low levelonly 0.3 Vp-p sync signal is input to pin 36
IOL = +2 mA
Clamp outputECPOH1High level of synchronized Clamp output when2.73.8-V
High level (1)only 0.3 Vp-p sync signal is input to pin 36
IOH = –400 µA
Clamp outputECPOH2High level of synchronized Clamp output when3.54.3-V
High level (2)only 0.3 Vp-p sync signal is input to pin 36
IOH = –20 µA
Clamp outputECPOLHigh level of synchronized Clamp output when-0.10.4V
Low levelonly 0.3 Vp-p sync signal is input to pin 36
IOL= +2 mA
PC1862
20
Page 21
µ
PC1862
ParameterSymbolConditionMIN.TYP.MAX.Unit
Field ident. outputEFIOH1High level of synchronized Field ident. output2.73.8-V
High level (1)when only 0.3 Vp-p sync signal is input to pin 36
IOH = –400 µA
Field ident. outputEFIOH2High level of synchronized Field ident. output3.54.3-V
High level (2)when only 0.3 Vp-p sync signal is input to pin 36
IOH = –20 µA
Field idnet. outputEFIOLHigh level of synchronized Field ident. output-0.10.4V
Low levelwhen only 0.3 Vp-p sync signal is input to pin 36
IOL = +2 mA
H detection outputEFIOH1High level of asynchronized H detect output2.73.8-V
High level (1)without H sync input
IOH = –400 µA
H detection outputEFIOH2High level of asynchronized H detect output3.54.3-V
High level (2)without H sync input
IOH = –20 µA
H detection outputEFIOLHigh level of synchronized H detect output-0.10.4V
Low levelwhen only 0.3 Vp-p sync signal is input to pin 36
IOL= +2 mA
H sync lock-in rangefHPFrequency range that can be pulled when only±400±500-Hz
0.3 Vp-p sync signal is input to pin 36 and H
sync frequency is varied (fSC conversion)
Horizontal VCO control
sensitivitypin is changed form 3.0 V to 3.4 V without H
Horizontal VCO free-runfHOFrequency difference of HD output from fH–100–25+50Hz
frequencywhen H sync input is not applied
Pulse width of HD outputPWNHSOPulse width of synchronized HD output when3.84.04.2
Pulse width of VD outputPWVSO1Pulse width of synchronized VDODD-6.0-H
Pulse width of Clamp output PWCPOPulse width of synchronized Clamp output when3.43.63.8
Oscillation start voltage ofVSTOutput voltage at HD when VCC is gradually--4.2V
horizontal VCOincreased from 0 V without H sync input
H killer output Low levelEHKOLLow level of synchronized H killer output when--0.4V
Burst gate inputVBGPE1Burst gate pulse input voltage when Clamp1.61.92.0V
Threshold level 1voltage begins Low level is gradually increased
β
HRate of variation of frequency when APC filter–1.6–1.3–0.9Hz/mV
sync input (fSC conversion)
only 0.3 Vp-p sync signal is input to pin 36
PWVSO2
output when only 0.3 Vp-p sync
signal is input to pin 36
only 0.3 Vp-p sync signal is input to pin 36
only 0.3 Vp-p sync signal is input to pin 36
Change value of Chroma output
from 0 V without signal input
EVEN-5.5-H
µ
µ
s
Note
Note
s
Note H: Horizontal scanning period
21
Page 22
µ
PC1862
ParameterSymbolConditionMIN.TYP.MAX.Unit
Burst gate inputVBGPE2Burst gate pulse input voltage when Clamp3.84.04.2V
Threshold level 2voltage begins High level is gradually
increased from VBGPE1 without signal input
Vertical free-runningfV1 (50)Frequency ratio of HD output to VD output-fH/352-Hz
frequency 1H sync input: No signal
fV1 (60)Pin 33 input: VCC-fH/288-Hz
V sync input: VCC
Vertical free-runningfV2 (50)Same as fV1 with the following exception-fH/288-Hz
frequency 2fV2 (60)V sync input: GND-fH/240-Hz
Vertical free-runningfV3 (50)Same as fV1 with the following exception-fH/368-Hz
frequency 3fV3 (60)Pin 33 input: GND-fH/296-Hz
Vertical free-runningfV4 (50)Same as fV1 with the following exception-fH/272-Hz
frequency 4
fV4 (60)
Pin 33 input: GND
V sync input: GND
-fH/232-Hz
22
Page 23
TIMING CHARTS (Horizontal Period)
1 s
µ
Comp Video
Input
Comp Sync
Output
(CSO)
This delay is fixed by the application of pin 36.
HD Output
(NHSO)
4 s
µ
PC1862
Burst Signal
µ
CLAMP
Output
(CPO)
4 s
µ
This rising edge is cut by Comp Sync Output.
23
Page 24
24
TIMING CHARTS (Vertical Period)
Comp Video Input
HD Output
(NHSO)
CLAMP Output
(CPO)
VD Output
(VSO)
FIELD Output
(FIO)
<Odd Field>
Note
0.5 H
<Even Field>
6 H
Note
Comp Video Input
HD Output
(NHSO)
CLAMP Output
(CPO)
VD Output
(VSO)
FIELD Output
(FIO)
Note H: Horizontal scanning period
0.5 H
Note
5.5 H
Note
µ
PC1862
Page 25
µ
PC1862
CAUTION AT DESIGNING
Resonators
NEC evaluates µPC1862 using resonators which are shown below in design and development process.
If the different product is used as a resonator, electrical specification value described in this document is not assured.
And when connecting resonator to external circuit, there is need to consider temperature specification, voltage
fluctuation and product variation. In this case, normal operation is not assured in the application circuit including the
different product.
Use the resonators which are shown below when you design circuit.
H VCO resonator X1: in application example circuit
32 f
X1(PAL): CSB500F2 (MURATA)
(NTSC) : CSB503F2 (MURATA)
SC VCO resonator X2
nf
X2: HC-49/U (KINSEKI, µPC1860 adoption)
Reference data of 4f
ItemNTSC for 4fSCNTSC for 8fSCPAL for 4fSC
NameHC-49/U
Frequency14.31818 MHz28.63636 MHz17.34475 MHz
Overtone OrderFundamental (AT cut)Fundamental (BT cut)Fundamental (AT cut)
Operating Temperature–10 to +70°C
Frequency Permitted±30 × 10
Tolerance (25±5°C)
Frequency Temperature±30 × 10
Specification (to 25°C)
Equivalent Serial Resistance50 Ω or less
Parallel Capacitance7.0 pF or less
3rd harmonic standard3rd harmonic frequency is over–3rd harmonic frequency is over
PC1862 generates system clock for synchronous signal processing and clock generate processing.
The
If the supply voltage, line placement and routing are not set appropriately that the µPC1862 cannot generate correct
system clock.
Though the recommended pattern is not shows in this document, note points shown below at designing.
1.For synchronous section and chroma section, each power supply must be isolated.
2.Lines to pin 9 to pin 13 should be as thick and short as possible.
3.Connect resonator as near IC as possible. Don’t put GND line between resonator pins for parasitism capacitance.
µ
PC1862
26
Page 27
APPLICATION CIRCUIT
5 V
1 kΩ
2SA1175
or
equivalent
39 kΩ
10 F
+
75 Ω 11
k Ω
Comp
video IN
4.7 F
100 k
Ω
++
Comp
sync OUT
100
kΩ
4.7
F
220
Ω
100 kΩ
220 Ω
1000
pF
0.01
F
H DET
OUT
1.5 kΩ
1500pF2.7
kΩ
2.2 kΩ
270 Ω X
1
4.7 F
+
0.015 F
5 V
X1:CSB503F2(Murata)
Burst gate input
‘H’: In the period of burst
‘M’: Out the period of burst
‘L’: Internal
HD
Clamp output
Field ID output
VD
NTSC/PAL
H DET32f
H
VCOAFC
H count down
LPFACC DET
f
2
Phase shift
ACC AMP
Color
killer
DET
APCnf
SC
VCO
BPF
47 pF
68 pF
15 H
680 Ω
0.01 F
10 kΩ
5 V
0.01 F
680 Ω
10 kΩ
2SC2785
or
equivalent
f
SC
OUT
5 V
Tint
cont.
0.1
F
CGND
0.47
F
0.01
F
5 V
++
+
1
M Ω
0.1
F
2.2 kΩ
4.7
kΩ
4.7
F
Chroma
OUT
0.022 F
510 Ω
68 pF
100 Ω
C
2C1
X2
X2:HC-49/U(KINSEKI)
5 V
VCO OUT
External subcarrier input
Divider ratio select input
C1
C2
4 fSC
18 pF
22 pF
8 f
SC
No connect
10 pF
‘H’
‘M’
‘L’
12345
6
7 8 9 10111213161718
363534333231302928272625242322212019
220 pF
SGNDSV
CC
8.2
kΩ
12 pF
18 pF
NTSC
(N/P =‘L’)
PAL
(N/P =‘H’)
–
–
X
2
C1
C2
15
Cannot correspond 8f
SC
of PAL.
H
sync
SEP
V
sync
SEP
V count down
Color killer OUT
…1/8
…EXT
…1/4
f
4
µ
µ
µ
µ
µ
µ
µ
µ
µ
µ
µ
µ
µ
µ
µ
2.2 kΩ
Chroma IN
14
27
µ
PC1862
Page 28
Care Point for Planning of Application Circuit
µ
PC1862
1.Processing of V
CC pin
Please isolate Chroma. VCC from Sync. VCC as follows. If you have external processing block of digital signal, don’t
directly supply of the block’s VDD.
VDD
Processing IC of
digital signal, etc
GND
5 V
SGND
Sync (Pin 19 to pin 36)
Chroma (Pin 1 to pin 18)
CV
CC1CVCC2CVCC3
0.01 F47 F0.01 F
µµµ
CGND
µµ
0.01 F 47 F
3025
SV
µ
PC1862
1410215
CC
2.Application of no using Chroma pin
µ
If you don’t use Chroma pin but use Sync pin on
5 V
SCO
CV
CC1
123456789101112131415161718
CINCKOACCFCKF
TINT
PC1862, you process pin 1 to pin 18 as follows.
PC1862
µ
CV
COUT APCF
CGND
SCOF1 SCOF2SCOF3
CV
CC2
CC3
VCOO DIVS ESCI
0.01
µ
F
47 F
µ
0.01 F
µ
3.Application of no using Sync pin
If you don’t use Sync pin but use Chroma pin on µPC1862, you process pin 19 to pin 36 as follows. In this case, you
need to input a pin 24 with burst gate pulse from external.
In this application, you can’t use output of pin 20 to pin 23.
Video signal
input
Comp Sync Output
5 V
Open
363533343231302928272625242322212019
SSI CSO VSSI HDF
HDOSGND
HKO
2.2 kΩ
HSOF1
HSOF2
PC1862
µ
HSOF3
AFCF
3.3 kΩ
BGPENHSO CPO FIO VSO N/P
SV
CC
3.3 k
5 V
0 V
Ω
Burst Gate Input
Open
(Don’t use)
28
Page 29
PACKAGE DRAWING
36 PIN PLASTIC SHRINK SOP (300 mil)
µ
PC1862
118
A
G
F
E
C
MD
N
M
NOTE
Each lead centerline is located within 0.10
mm (0.004 inch) of its true position (T.P.) at
maximum material condition.
1936
detail of lead end
5°±5°
H
I
K
L
B
P36GM-80-300B-3
ITEMMILLIMETERSINCHES
0.612 MAX.
0.039 MAX.
0.031 (T.P.)
+0.004
0.014
–0.003
0.005±0.003
0.071 MAX.
0.061
0.303±0.012
0.220
0.043
+0.004
0.008
–0.002
+0.008
0.024
–0.009
0.004
M
A
B
C
D
E
F
G
H
I
J
K
L
15.54 MAX.
0.97 MAX.
0.8 (T.P.)
+0.10
0.35
–0.05
0.125±0.075
1.8 MAX.
1.55
7.7±0.3
5.6
1.1
+0.10
0.20
–0.05
0.6±0.2
0.10
N0.100.004
J
29
Page 30
µ
PC1862
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales
offices.
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E).
Surface Mount Device
µ
PC1862GS: 36-pin plastic shrink SOP (300 mil)
ProcessConditionsSymbol
Infrared ray reflowPeak temperature: 235 °C or below (Package surface temperature),IR35-00-2
Reflow time: 30 seconds or less (at 210 °C or higher),
Maximum number of reflow processes: 2 times.
VPSPeak temperature: 215 °C or below (Package surface temperature),VP15-00-2
Reflow time: 40 seconds or less (at 200 °C or higher),
Maximum number of reflow processes: 2 times.
Wave SolderingSolder temperature: 260 °C or below, Flow time: 10 seconds or less,WS60-00-1
Maximum number of flow process: 1 time,
Pre-heating temperature: 120 °C or below (Package surface temperature).
Partial heating methodPin temperature: 300 °C or below,–
Heat time: 3 seconds or less (Per each side of the device).
Caution Apply only one kind of soldering condition to a device, except for “Partial heating method”, or the
device will be damaged by heat stress.
30
Page 31
[MEMO]
µ
PC1862
31
Page 32
µ
PC1862
[MEMO]
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special:Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96.5
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