Datasheet UPC1909GS, UPC1909CX Datasheet (NEC)

DATA SHEET

Bipolar Analog Integrated Circuit

SWITCHING REGULATOR CONTROL IC

µµµµ

PC1909

The µPC1909 is a switching regulator control IC ideal for primary side control of active-clamp type
converters. This IC has 2 outputs employing a totem-pole circuit with peak output current 1.2 A, and is capable of
directly driving a power MOS-FET. As a result, it has been possible to realize primary side control of an active-clamp
type converter on a single chip.

It is necessary to obtain license from Vicor Corporation before using the µPC1909 in an active-clamp type

Note

circuit.

FEATURES

• 2 on-chip outputs; for Q and Q

• Capable of directly driving a power MOS-FET

• Drive supply voltage range: 7 V to 24 V

• On-chip remote control circuit

• On-chip pulse-by-pulse overcurrent protection circuit

• On-chip overvoltage latch circuit

ORDERING INFORMATION

Part Number Package

µ

PC1909CX 16-pin plastic DIP (300 mil s)

µ

PC1909GS 16-pin plastic SOP (300 mi l s )

Note

DC/DC

The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.

Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.

Document No. G14309EJ1V0DS00 (1st edition)
Date Published July 1999 N CP(K)
Printed in Japan

1999©

BLOCK DIAGRAM

C

16 15 14

OLS

T

Oscillator

µµµµ

PC1909

EMI

V

R

T

REF

DTC

1

FB

OUT

1

1

V

CC

13 12 11 10 9

PWM

Reference
power
supply

comparator 1

–
+
+

Over­voltage
protection

ON/OFF
control

Over­current
protection

+
–
–

PWM
comparator 2

1 2 3 4 5 6 7 8

OV C

T2

GND OC DTC

2

OUT

2

ON/OFF

EMI

2

2

Data Sheet G14309EJ1V0DS00

PIN CONFIGURATION (TOP VIEW)

16-pin plastic DIP (300 mils)

PC1909CX

µµµµ

16-pin plastic SOP (300 mils)

PC1909GS

µµµµ

µµµµ

PC1909

OV

C

GND

OC

DTC2
OUT2

ON/OFF

EMI

1

T2

2

3

4
512
611
710

2

89

16

15

14

13

CT

RT
VREF

DTC1

FB
OUT1
EMI1
VCC

PIN FUNCTION LIST

Pin Number Pin Name Function Pin Number Pin Name Function

1 OV Overvoltage protection 9 V
2CT2OLS shift setting 10 EMI
3 GND Ground 11 OUT
4 OC Overcurrent protection 12 FB Feedback i nput
5DTC
6OUT

2

OUT2 dead-time setting 13 DTC

2

OUT2 output 14 V
7 ON/OFF ON/OFF control 15 R
8EMI

2

OUT2 emitter 16 C

CC

REF

Power supply

1

OUT1 emitter

1

OUT1 output

1

OUT1 dead-time setting
Reference voltage output

T

T

Timing resistance
Timing capacitance

Data Sheet G14309EJ1V0DS00

3

ELECTRICAL SPECIFICATIONS

µµµµ

PC1909

Absolute Maximum Ratings (Unless otherwise specified, TA = 25

Parameter Symbol
Supply Voltage V
Output Current (DC, per output) I
Output Current (peak, per output) I

C (peak)

Total Power Dissipat i on P
Operating Ambient Temperature T
Operating Junction Temperature T
Storage Temperature T

CC

C (DC)

T

A

J

stg

PC1909CX

µ

C)

°°°°

PC1909GS Unit

µ

26 V

100 mA

1.2 A

1000 694 mW

20 to +85

−

20 to +150

−

55 to +150

−

Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any

parameter. That is, the absolute maximum ratings are rated values at which the product is on
the verge of suffering physical damage, and therefore the product must be used under
conditions that ensure that the absolute maximum ratings are not exceeded.

Recommended Operating Conditions

Parameter Symbol MIN. TYP. MAX. Unit

C

°

C

°

C

°

Supply Voltage V
Oscillation Frequency f
Output Load Capacitance C
Output Load Resistance R
Operating Junction Temperature T

CC

OSC

71024V

50 200 500 kHz

L

L

J

10 k

20 +100

−

2200 3000 pF

°

Ω

C

4

Data Sheet G14309EJ1V0DS00

µµµµ

PC1909

Electrical Characteristics (Unless otherwise specified, TA = 25

C, VCC = 10 V, RT = 10 k

°°°°

, fosc = 200 kHz)

ΩΩΩΩ

Block Parameter Symbol Conditions MIN. TYP. MAX. Unit

CC (SB)

CC (L to H)

REF

V

∆

O short

∆f/∆
∆f/∆

V

OSC

VCC = 7 V 0.1 mATotal

CC

Without load 6 12 18 mA

H

REF

REF

I

IN

8 V ≤ VCC ≤ 15 V,

REF

I

L

1 mA ≤ I

= 0 A 4.7 4.9 5.1 V

= 0 A

/∆T−10°C ≤ TA ≤ +85°C,

REF

= 0 A

I

REF

I

= 0 A 15 mA

V8 V
T

VCC ≤ 15 V 1 %

≤

−10°C ≤

8910VUnder­345V

110mV

REF

≤ 4 mA 6 12 mV

400 (700)

180 200 220 kHz

TA ≤ +85°C2(5)%

Voltage
Lockout
Circuit

Reference
Voltage

Oscillation

Standby Current I
Circuit Current I
Start-Up Threshold Voltage V
Operating Voltage Hysteres i s

Width

Output Voltage V
Line Regulation REG

Load Regulation REG
Output Voltage Temperature

Coefficient
Short Circuit Current I
Oscillation Frequency f
Frequency Line Regulation
Frequency Temperature

Coefficient

PWM
Comparator

Output

Remote
Control

Overcurrent
Latch

Overvoltage
Latch

B (COMP1)VCOMP1

I

B (COMP2)VCOMP2

I
Low-level Threshold Voltage V
High-level Threshold Voltage V
Dead-time Temperature

DT/∆T−10°C ≤ TA ≤ +85°C,

∆

Coeficient
Low-level Output Voltage V
High-level Output Voltage V
Rise Time t
Fall Time t
Input Voltage at Output ON V
Input Voltage at Output OFF V
Hysteresis Width V
Overcurrent Threshold Voltage V
Input Bias Current I
Delay to Output t
Overvoltage Threshold Voltage V
Input Bias Current I
OVL Reset Voltage V
Delay to Output t

TH (L)

TH (H)

OL

OH

r

f

IN (ON)

IN (OFF)

H

TH (OC)

B (OC)

d (OC)

TH (OV)

B (OV)

R (OV)

d (OV)

D

V

SINK

I

SOURCE

I
RL = 15 Ω, CL = 2200 pF 60 ns
RL = 15 Ω, CL = 2200 pF 40 ns

VCC = 0 V 200

VOV = V

REF

= V
= V

REF

10
10

1.5 V

3.5 V
3%

= 0.46 V

REF

= 3 mA 0.5 V

= 30 mA

VCC − 1.6

2.4 2.6 2.8 V

2.2 2.4 2.6 V

0.1 0.2 0.3 V

190 210 230 mV

150 ns

22.42.8V

REF

4

2V

750 ns

µ

V/°C

AInput Bias Current

µ

A

µ

V

A

µ

A

µ

Remark

Values in parentheses ( ) represent reference values.

Data Sheet G14309EJ1V0DS00

5

µµµµ

PC1909

TYPICAL CHARACTERISTICS CURVES (UNLESS OTHERWISE SPECIFIED, TA = 25

T

vs. T

P

1.2
PC1909CX

µ

1.0

125 °C/W

0.8
PC1909GS

µ

0.6

180 °C/W

0.4

- Total Power Dissipation - W

T

P

0.2

0

25 50 75 100 125 150

A

- Ambient Temperature - °C

T

ICC vs. V

18

16

A

15

12.5

10

7.5

- Output voltage - V

5

OUT1

V

2.5

0

CC

18

16

Under-Voltage Lockout Circuit

V

CC (H to L)

2.5 5 7.5 10 12.5 15

ICC vs. VCC (During OVL Operation)

°°°°

C, VCC = 10 V, REFERENCE V AL UE S )

V

H

CC

- Supply Voltage - V

V

V

CC (L to H)

14

12

V

10

- Circuit Current - mA

CC

0.8

I

0.4

CC (SB)

I

0

5 10152025

V

250

200

µ

150

100

- Standby Current - A

CC(SB)

I

50

H

CC

- Supply Voltage - V

I

CC(SB)

vs. T

A

f

OSC

= 200 kHz

Without load

14

12

V

10

- Circuit Current - mA

CC

0.8

I

0.4

CC (SB)

I

0

5 10152025

V

20

15

10

- Output Voltage - V

OUT1

5

V

V

IN (OFF)

H

CC

- Supply Voltage - V

V

OUT1

vs. V

IN

V

IN (ON)

f

OSC

= 200 kHz

0

−25

6

05025 75 100

T

A

- Ambient Temperature - °C

Data Sheet G14309EJ1V0DS00

0

123456

V

IN

- Remote Control Voltage - V

µµµµ

PC1909

REF vs. TA

V

∆

30

20

10

0

−10

−20

VREF - Reference Voltage Deviation - mV

∆

−30

−25

05025 75 100

T

A - Ambient Temperature - °C

fosc vs. T

225
220
215
210
205
200
195
190
185

fosc - Oscillation Frequency - kHz

180
175

−25

05025 75 100

T

A - Ambient Temperature - °C

fosc vs. RT, CT

1000

500

CT = 220 pF

100

50

CT = 470 pFCT = 1000 pF

fosc - Oscillation Frequency - kHz

10

R

T - Timing Resistance - kΩ

A

VCC

− 1

V

CC

− 1.5

V

CC

− 2

Voltage - V

VOH - High-Level Output

V

OH, VOL vs. TA

50 100

1.53

1.49

VOL - Low-Level Output

Voltage - V

1.45
–25

05025 75 100

T

A - Ambient Temperature - °C

100

80

60

40

r - OUT1 Output Rise Time - ns

t

tr - OUT1 Output Fall Time - ns

20

0

−25

05025 75 100

T

A - Ambient Temperature - °C

f, tr vs. TA (OUT1)

t

tr

tf

fOSC = 555 kHz

Data Sheet G14309EJ1V0DS00

100

80

60

40

r - OUT2 Output Rise Time - ns

t

tr - OUT2 Output Fall Time - ns

20

0

−25

05025 75 100

T

A - Ambient Temperature - °C

tf, tr vs. T

A (OUT2)

fOSC = 555 kHz

tr

tf

7

µµµµ

PC1909

45
44
43
42
41
40
39

Duty-ON Duty - %

38
37
36
35

−25

05025 75 100

T

Duty vs. T

A

- Ambient Temperature - °C

A

8

Data Sheet G14309EJ1V0DS00

TIMING CHART

µµµµ

PC1909

Feedback input

V

d

output waveform

output waveform

OUT

OUT

Oscillation
waveform C

FB

t

qc

1

2

T

Oscillation
waveform C

qd

t

T

’

(1) Oscillation waveform (CT)

T

This waveform is determined by the external capacitor connected to the C

pin (pin 16) and the external resistor
connected to the RT pin (pin 15). It is usually a 1.5-V to 3.5-V triangle waveform (the rise and fall times are the
same).

(2) Output waveform (OUT

Whichever is the lower of the DTC

1

)

1

pin (pin 13) and FB pin (pin 12) voltages is compared with the triangle wave

of the CT pin (pin 16). The OUT1 pin (pin 11) is high level while the triangle wave is low.

(3) Output waveform (OUT

Whichever is the higher of the DTC

2

)

2

pin (pin 5) and FB pin (pin 12) voltages is compared with the level-shifted

triangle wave (CT’). The OUT2 pin (pin 6) is high level while the level-shifted triangle wave is high.

(4) Triangle wave level shift

The triangle wave that controls OUT2 is the original triangle wave of the CT pin (pin 16) shifted to a lower
potential via the level shift circuit (OLS). The amount of shift (Vd) can be adjusted using the resistor (R
connected between the CT2 pin (pin 2) and the V
The relationship between the shift amount (Vd) and the resistance value (kΩ) of the resistor R

REF

pin.

CT2

connected to

the CT2 pin (pin 2) is as follows.

R

CT2

4.3

[kΩ] + 10

Vd = × 2 [V]

(5) Dead-time (tqc, tqd) adjustment

1

The dead time between the fall of OUT

and the rise of OUT2 (tqc) and the dead time between the fall of OUT
and the rise of OUT1 (tqd) is determined by the oscillation frequency and the amount of level shift of the triangle
wave. Although usually tqc = tqd, if setting these independently, connect a suitable resistor between the CT pin
and the V

REF

pin, as well as between the CT pin and GND, and adjust the dead time by making the oscillation

waveform asymmetrical.

CT2

)

2

Data Sheet G14309EJ1V0DS00

9

PACKAGE DRAWINGS

16 PIN PLASTIC DIP (300 mil)

16 9

18

µµµµ

PC1909

A

K

J

I

H

G

NOTES

Each lead centerline is located within 0.25 mm (0.01 inch)

1)
of its true position (T.P.) at maximum material condition.

Item "K" to center of leads when formed parallel.

2)

F

M

D

N

+0.10
–0.05

L

0.800 MAX.

0.050 MAX.

0.100 (T.P.)

0.043 MIN.

0.138±0.012

0.020 MIN.

0.170 MAX.

0.200 MAX.

0.300 (T.P.)

0.256

0.01

0.043 MIN.
0∼15°

P16C-100-300B-1

R

+0.004
–0.005

+0.004
–0.003

P

C

B

M

ITEM MILLIMETERS INCHES

A

20.32 MAX.

B

1.27 MAX.

C

2.54 (T.P.)
D 0.50±0.10 0.020
F

1.1 MIN.
G

3.5±0.3
H

0.51 MIN.

I

4.31 MAX.

J

5.08 MAX.
K

7.62 (T.P.)

L

6.5
M 0.25 0.010

0.25

N

1.1 MIN.

P
R0∼15°

10

Data Sheet G14309EJ1V0DS00

16 PIN PLASTIC SOP (300 mil)

18

A

µµµµ

PC1909

916

detail of lead end

P

F

G

S

N

C

D

M

M

E

NOTE

Each lead centerline is located within 0.12 mm of
its true position (T.P.) at maximum material condition.

H

I

J

S

B

L

K

ITEM MILLIMETERS

A

10.2±0.2

B

0.78 MAX.

C

1.27 (T.P.)
D 0.42
E

F
G
H

I

J
K 0.22
L 0.6±0.2

M
N

P3°

+0.08

−0.07

0.1±0.1

1.65±0.15

1.55

7.7±0.3

5.6±0.2

1.1±0.2

+0.08

−0.07

0.12

0.10

+7°

−3°

P16GM-50-300B-5

Data Sheet G14309EJ1V0DS00

11

µµµµ

RECOMMENDED SOLDERING CONDITIONS

The µPC1909 should be soldered and mounted under the following recommended conditions. For the details of

the recommended soldering conditions, refer to the document

Manual (C10535E)

. For soldering methods and conditions other than those recommended below, contact your NEC

sales representative.

Insertion Type

PC1909CX: 16-pin plastic DIP (300 mils)

µµµµ

Soldering Method Soldering Conditions
Wave soldering (pins only) Solder bath temperature: 260°C Max., Time: 10 seconds m ax.
Partial heating Pin temperature: 300°C max., Time: 3 sec onds max. (per pin)

Caution Apply wave soldering only to the pins and be careful not to bring solder into direct contact with

the package.

Semiconductor Device Mounting Technology

PC1909

Surface Mounting Type

PC1909GS: 16-pin plastic SOP (300 mils)

µµµµ

Soldering Method Soldering Conditions

Infrared reflow Package peak temperature: 235°C, Time: 30 seconds max.

(at 210°C or higher), Count: Twice or less

VPS Pac k age peak temperature: 215°C, Time: 40 seconds max.

(at 200°C or higher), Count: Twice or less

Wave soldering Soldering bath t em perat ure: 260°C or less, Time: 10 sec onds max.,

Count: Once, Preheating temperature: 120°C MAX.
(package surface temperature)

Caution Do not use different soldering methods together.

Recommended
Condition symbol

IR35-00-2

VP15-00-2

WS60-00-1

12

Data Sheet G14309EJ1V0DS00

[MEMO]

µµµµ

PC1909

Data Sheet G14309EJ1V0DS00

13

[MEMO]

µµµµ

PC1909

14

Data Sheet G14309EJ1V0DS00

[MEMO]

µµµµ

PC1909

Data Sheet G14309EJ1V0DS00

15

µµµµ

PC1909

• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.

• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.

• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.

• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.

• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.

• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.

M7 98. 8