2.3 Under Voltage Lock-out Circuit........................................................................................................................12
3. NOTES ON USE........................................................................................................................................14
3.1 Setting the Output Voltage ...............................................................................................................................14
3.2 Setting the Oscillation Frequency...................................................................................................................15
3.3 Preventing Malfunction of the Timer Latch-Method Short Circuit Protection Circuit..................................15
3.6 Maximum Duty Limit.........................................................................................................................................20
3.7 Notes on Actual Pattern Wiring........................................................................................................................20
4.2 List of External Parts........................................................................................................................................22
Absolute Maximum Ratings (unless otherwise specified, TA
ParameterSymbolRatingsUnit
Supply voltageV
Output voltageV
Output current (open drain output)I
Total power dissipationP
Operating ambient temperatureT
Storage temperatureT
CC
O
O
T
A
stg
====
25
C)
°°°°
30V
30V
21mA
400mW
–20 to + 85
–55 to + 150
°
C
°
C
Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any
parameter. That is, the absolute maximum ratings are rated values at which the product is on the verge
of suffering physical damage, and therefore the product must be used under conditions that ensure
that the absolute maximum ratings are not exceeded.
Caution The recommended operating range may be exceeded without causing any problems provided that the
absolute maximum ratings are not exceeded. However, if the device is operated in a way that exceeds
the recommended operating conditions, the margin between the actual conditions of use and the
absolute maximum ratings is small, and therefore thorough evaluation is necessary. The recommended
operating conditions do not imply that the device can be used with all values at their maximum values.
Data Sheet G13418EJ3V0DS00
5
Page 6
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1935
Electrical Characteristics (unless otherwise specified, TA = 25
The reference voltage generator is comprised of a band-gap reference circuit, and outputs a temperature-compensated
reference voltage (2.1 V). The reference voltage can be used as the power supply for internal circuits, or as a reference
voltage, and can also be accessed externally via the V
2.2 Oscillator
REF
pin (pin 2).
1935
The oscillator self-oscillates if a timing resistor is attached to the R
inverted input pins (channel 1 and 2) or non-inverted input pin (channel 3) of the three PWM comparators to determine the
oscillation frequency.
2.3 Under Voltage Lock-out Circuit
The under voltage lock-out circuit prevents malfunctioning of the internal circuits when the supply voltage is low, such as
when the supply voltage is first applied, or when the power supply is interrupted. When the voltage is low, the three output
transistors are cut off at the same time.
2.4 Error Amplifiers
The non-inverted input pins of the error amplifiers E/A
threshold voltages are all 0.3 V (TYP.)). The circuits of the error amplifiers E/A
first stage of the error amplifier is a P-channel MOS transistor input.
2.5 PWM Comparators
The output ON duty is controlled according to the outputs of the error amplifiers and the voltage input to the Dead Time
Control pin (fixed internally for channel 1).
A triangular waveform is input to the inverted pin, and the error amplifier output and Dead Time Control pin voltage (fixed
1
, E/A2, and E/A3 are connected internally to 0.3 V (the input
T
pin (pin 3) . This oscilla tor waveform is i nput to the
1
, E/A2, and E/A3 are exactly the same. The
internally for channel 1) are input to the non-inverted pins of the PWM comparators for channel 1 and channel 2.
Therefore, the output transistor ON period is the period when the triangular waveform is lower than the error amplifier
output and Dead Time Control pin voltage (fixed internally for channel 1).
Channel 3 is the logical inverse of channel 1 and channel 2. Consequently, the triangular waveform is input to the noninverted input pin, and the error amplifier output and Dead Time Control pin voltage are input to the inverted input pins of
the PWM comparator for channel 3. Therefore, the transistor ON period is the period when the triangular waveform is
higher than the error amplifier output and Dead Time Control pin voltage (refer to
12
Data Sheet G13418EJ3V0DS00
Timing Charts
).
Page 13
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2.6 Timer Latch-Method Short Circuit Protection Circuit
When the outputs of the converters for each channel drop, the FB outputs of the error amplifiers of those outputs go
1935
high (FB
lower than the timer latch input detection voltage (VTH = 0.63 V)), then the output of the SCP comparator goes low, and Q
goes off.
flip-flop. When the DLY pin voltage reaches the UV detection voltage (V
low, and the output stage of each channel is latched to OFF (refer to
FB output of channels 1 and 2, and SCP comparator input.
short-circuit protection circuit has operated.
2.7 Output Circuit
rating), and an output current of 21 mA (absolute maximum rating).
3
output goes low). If the FB output exceeds the timer latch input detection voltage (VTH = 1.9 V) (FB3 output goes
When Q
The logic of channels 1 and 2 is reverse to that of channel 3. Consequently, an inverter circuit is inserted between the
Make the power supply voltage briefly less than the reset voltage (V
The output circuit has an N-channel open-drain output providing an output withstand voltage of 30 V (absolute maximum
1
turns OFF, the constant-current supply charges C
DLY
via the DLY pin. The DLY pin is internally connected to a
UV
= 0.8 V (TYP.)), the output Q of the flip-flop goes
Figure 2-1 Block Diagram
CCR
, 1.0 V TYP.) to reset the latch circuit when the
).
1
Data Sheet G13418EJ3V0DS00
13
Page 14
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1935
3. NOTES ON USE
3.1 Setting the Output Voltage
Figure 3-1 illustrates the method of setting the output voltage. The output voltage is obtained using the formula shown in
the figure.
The input threshold value of the error amplifier is 0.3 V (TYP.) for all the error amplifiers, E/A
Therefore, select a resistor value that gives this voltage.
Figure 3-1 Setting the Output Voltage
(1) When setting a positive output voltage using error amplifier E/A
1
V
OUT
(positive voltage)
R
1
R
2
V
OUT
6
C
NF
R
NF
7
0.3 V
= 1 +
E/A
1
R
0.3
R
2
1
1
, E/A2, and E/A3.
.
(2) When setting a positive output voltage using error amplifier E/A
R
V
OUT
(positive voltage)
R
1
R
2
V
OUT
= 1 +
11
C
NF
R
NF
E/A
10
0.3 V
1
0.3
R
2
2
.
2
14
Data Sheet G13418EJ3V0DS00
Page 15
PC
(3) When setting a negative output voltage using error amplifier E/A3.
2
V
REF
R
1
15
C
R
2
V
OUT
(negative voltage)
V
OUT
= 1 +
NF
R
NF
14
R
2
0.3
R
1
0.3 V
R
R
E/A
2
1
3
V
REF
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1935
3.2 Setting the Oscillation Frequency
Choose R
T
according to the oscillation frequency (f
Characteristics Curves f
OSC
OSC
) vs timing resistor (RT) characteristics (refer to
vs R
T
). The formula below (3-1) gives an approximation of f
OSC
. However, the result of
Typical
formula 3-1 is only an approximation, and the value must be confirmed in actual operation, especially for high-frequency
operation.
OSC
f
[Hz] ≅ 1.856 x 109/RT[Ω] (3-1)
3.3 Preventing Malfunction of the Timer Latch-Method Short Circuit Protection Circuit
The timer latch short-circuit protection circuit operates when the error amplifier outputs of channel 1 or channel 2 (pin 7
and 10) exceed approximately 1.9 V, or when the error amplifier output of channel 3 (pin 14) goes below approximately
0.63 V, and cuts off the output. However, if the rise of the power supply voltage is fast, or if there is noise on the DLY pin
(pin 5), the latch circuit may malfunction and cut the output off.
To prevent this, keep the wiring impedance between the DLY pin and the GND pin (pin 4) low, and avoid applying noise
to the DLY pin.
Data Sheet G13418EJ3V0DS00
15
Page 16
PC
3.4 Connecting Unused Error Amplifiers
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When the unused circuit of the three control circuits provided internally is error amplifier E/A
a way as to make sure that the output of the error amplifier is low. When the unused circuit is error amplifier E/A
2
, connect the circuit in such
3
, connect
the circuit in such a way as to make sure that the output of the error amplifier is high. In the case of error amplifier E/A1,
the Dead Time Control pin is fixed internally, so be sure to always use this amplifier.
Figure 3-2 shows examples of how to connect unused error amplifiers.
Figure 3-2 Examples of Connecting Unused Error Amplifiers
(1) Error amplifier E/A
2
V
REF
11
E/A
10
0.3 V
12
DTC
2
2
2
(2) Error amplifier E/A
2
V
REF
15
E/A
3
14
0.3 V
16
DTC
3
3
16
Data Sheet G13418EJ3V0DS00
Page 17
PC
3.5 ON/OFF Control
3.5.1 Channel 1 (for step-up)
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1935
The ON/OFF signal control method of the output oscillation of channel 1 is to input the ON/OFF signal from ON
1
as
shown in Figure 3-3. For channel 1, soft start or timer latch (SCP) is internally selected. Soft start is executed when the
first start signal is input. When the end of soft start is detected, the soft start select switch is turned OFF and the timer
latch circuit operates.
Figure 3-3 ON/OFF Control (channel 1 for step-up)
V
O1
FB
R
11
I
I1
R
12
–
+
Error amplifier
0.3 V
1
SCP comparator
(common to each channel)
+
–
Q
1
0.63 V
V
REF
R
Dead time
setting: 85 %
(internally fixed)
Q
11
C
DLY
1
Oscillation section
SW
(common to each channel)
+
+
–
To output stage
PWM comparator
DLY
ON
(Converter
output
voltage)
D
11
1
(1) When ON
11
Q
: ON → DLY pin: Low level → Output duty of PWM comparator: 0 %
11
D
: ON → I
(2) When ON
Q
: OFF → C
11
D
: OFF → II1 pin: Low level → FB1 output: High level
11
(3) When ON
11
Q
: ON → DLY pin: Low level (Nothing happens because SW is OFF.)
is high: OFF status
1
I1
pin: High level → FB1 output: Lo w level
1
is low: ON status (start up)
is charged in the sequence of [V
DLY
goes high again after start up (SW: OFF): OFF status
1
→ R1 → SW → DLY pin → C
REF
] → Soft start
DLY
D11: ON → II1 pin: High level → FB1 output: Lo w level → PWM comparator output duty: 0 %
O1
Converter output voltage (V
→
Caution Even if start up is executed by making ON
) drops.
low again afte r (3), soft sta rt is n ot executed b ecause the
1
soft start select switch (SW) remains OFF. To execute soft start of channel 1 again, drop V
once.
Data Sheet G13418EJ3V0DS00
to 0 V
CC
17
Page 18
PC
3.5.2 Channel 2 (for step-up)
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1935
The ON/OFF signal control method of the output oscillation of channel 2 is to input the ON/OFF signal from ON
shown in Figure 3-4. The PWM converter can be turned ON/OFF by controlling the level of the DTC
2
pin. However, it is
2
as
necessary to keep the level of the FB2 output low (the SCP comparator input high) so that the timer latch does not start
when the PWM converter is OFF. In this circuit example, the FB
2
output level is controlled by controlling the level of the I
pin.
Figure 3-4 ON/OFF Control (channel 2: step-up)
V
O2
D
21
(Converter
output
voltage)
R
21
I
I2
–
R
22
+
0.3 V
V
REF
R
23
Error
amplifier
FB
2
SCP comparator
(common to each channel)
+
–
0.63 V
+
+
–
PWM comparator
DLY
Q
1
To output stage
C
DLY
I2
DTC
ON
2
(1) When ON
21
Q
: ON → DTC2 pin: Low level → Output duty of PWM comparator: 0 %
21
D
: ON → II2 pin: High level → FB2 output: Lo w level → SCP comparator output: High level → Timer latch stops.
D21: OFF → II2 pin: Low level → FB2 output: High level → SCP comparator output: Low level → Q1 is OFF
DLY
Charging C
→
Caution Keep the low-level voltage of the DTC
0.3 V or higher. The maximum voltage that is applied to the I
V
.
REF
starts (timer latch start).
pin within 1.2 V and the high-level voltage of the II2 pin at
2
pin must be equal to or lower than
I2
18
Data Sheet G13418EJ3V0DS00
Page 19
PC
3.5.3 Channel 3 (for inverted output)
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1935
The ON/OFF signal control method of the output oscillation of channel 3 is to input the ON/OFF signal from ON
shown in Figure 3-5. The PWM converter can be turned ON/OFF by controlling the level of the DTC
3
pin. However, it is
3
as
necessary to keep the level of the FB3 output high so that the timer latch does not start when the PWM converter is OFF.
In this circuit example, the FB
3
output level is controlled by controlling the level of the II3 pin.
Because channel 3 supports an inverted converter, its PWM comparator logic is different from that of channels 1 and 2.
Figure 3-5 ON/OFF Control (channel 3: for inverted output)
V
REF
FB
3
SCP comparator
–
+
(common to each channel)
Error
amplifier
Oscillation section
(common to each channel)
+
–
0.63 V
–
–
+
PWM comparator
DLY
Q
1
To output stage
C
DLY
ON
R
31
I
I3
R
Q
33
32
–V
O3
0.3 V
(Converter
output voltage)
V
REF
Q
32
R
33
C
31
DTC
3
Q
31
R
34
3
(1) When ON
31
Q
: ON → Q32: ON → DTC3 pin: High level → Output duty of PWM comparator: 0 %
33
Q
: ON → II3 pin: Low level → FB3 output: High level → SCP comparator output: High level → Q1 is ON.
(2) When ON
31
Q
: OFF → Q32 is OFF. → C31 is charged in the sequence of [V
33
: OFF → II3 pin: High level → FB3 output: Low lev el → SCP comparator output: Low level → Q1: OFF
Q
Caution Keep the high-level voltage of the DTC
is high: OFF status
3
Timer latch stops.
→
is low: ON status
3
Soft start
→
Charging C
→
DLY
starts (timer latch start).
REF
→ C31 → R34] → DTC3 pin voltage drops.
pin at 1.6 V or higher and the low-level voltage of the II3 pin
3
within 0.3 V. The maximum voltage that is applied to the II3 pin must be equal to or lower than V
REF
.
Data Sheet G13418EJ3V0DS00
19
Page 20
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3.6 Maximum Duty Limit
Channel 1 is switched internally between Soft Start and Timer Latch. For this reason, the DTC voltage is fixed internally,
and the maximum duty is limited to 85%.
The DTC voltage for channel 2 and channel 3 can be set externally, so the maximum duty is not limited.
3.7 Notes on Actual Pattern Wiring
When actually carrying out the pattern wiring, it is necessary to separate control-related grounds and power-related
grounds, and make sure that they do not share impedances as far as possible. In addition, make sure the high-frequency
impedance is lowered using capacitors and other components to prevent noise input to the V
REF
pin.
1935
20
Data Sheet G13418EJ3V0DS00
Page 21
PC
4. APPLICATION EXAMPLE
4.1 Application Example
Figure 4-1 shows an example circuit for obtaining ±5 V/50 mA and +12 V/50 mA from a +3 V power supply.
68 µ FOutput capacitor20SA68MSANYOOS-CON, SA series
Schottkey diodeD1FS4SHINDENGEN
47 µ HChoke inductor636FY-470MTOKOD73F series
Switching transistor2SB1572NEC
Buffer transistor2SA812NEC
Buffer transistor2SC1623NEC
Transistor for switch2SA812NEC
Transistor for switch2SC1623NEC
Transistor for switch2SC1624NEC
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1935
Remarks 1. The capacitors that are not specified in the above list are multilayer ceramic capacitors.
2. The resistors that are not specified in the above list are 1/4W resistors.
22
Data Sheet G13418EJ3V0DS00
Page 23
PC
5. PACKAGE DRAWING
16-PIN PLASTIC TSSOP (5.72 mm (225))
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1935
16
9
detail of lead end
F
G
R
P
L
S
1
A
A'
8
E
H
I
J
S
C
D
M
M
B
K
S
N
NOTE
Each lead centerline is located within 0.10 mm of
its true position (T.P.) at maximum material condition.
Data Sheet G13418EJ3V0DS00
ITEM
MILLIMETERS
A
A'
B
C
D
E0.09
F1.01
G
H
I
J
K
L
M
N
P
R
S
S16GR-65-PJG-1
5.15±0.15
5.0±0.1
0.375 MAX.
0.65 (T.P.)
+0.06
0.24
−0.04
+0.06
−0.04
+0.09
−0.06
0.92
6.4±0.2
4.4±0.1
1.0±0.2
+0.055
0.145
−0.045
0.5
0.10
0.10
+5°
3°
−3°
0.25
0.6±0.15
23
Page 24
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6. RECOMMENDED SOLDERING CONDITIONS
Recommended solder conditions for this product are described below.
For details on recommended soldering conditions, refer to Information Document
Technology Manual” (C10535E)
For soldering methods and conditions other than those recommended, consult NEC.
Surface Mount Type
PC1935GR: 16-pin plastic TSSOP (5.72 mm (225))
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Soldering MethodSoldering ConditionsSymbol of Recommended
Infrared reflowPackage peak temperature: 235 °C, Time: 30 seconds MAX. (210 °C MIN.),
Number of times: 3 MAX.
VPSPackage peak temperature: 215 °C, Time: 40 seconds MAX. (200 °C MIN.),
Number of times: 3 MAX.
Wave soldering
Soldering bath temperature: 260 °C MAX., Time: 10 seconds MAX., Number
of times: 1,
Preheating temperature: 120 °C MAX. (package surface temperature)
.
“Semiconductor Device Mounting
Conditions
IR35-00-3
VP15-00-3
WS60-00-1
1935
Caution Do not use two or more soldering methods in combination.
24
Data Sheet G13418EJ3V0DS00
Page 25
PC
[MEMO]
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Data Sheet G13418EJ3V0DS00
25
Page 26
PC
[MEMO]
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1935
26
Data Sheet G13418EJ3V0DS00
Page 27
PC
NOTES FOR BiCMOS DEVICES
1PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need
to be taken for PW boards with semiconductor devices on it.
2HANDLING OF UNUSED INPUT PINS
Note:
No connection for device inputs can be cause of malfunction. If no connection is provided to the
input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. Input levels of devices must be fixed high or low by using a pull-up or pull-
DD
down circuitry. Each unused pin should be connected to V
considered to have a possibility of being an output pin. All handling related to the unused pins must
be judged device by device and related specifications governing the devices.
or GND with a resistor, if it is
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1935
3STATUS BEFORE INITIALIZATION OF BiCMOS DEVICES
Note:
Power-on does not necessarily define initial status of device. Production process of BiCMOS does
not define the initial operation status of the device. Immediately after the power source is turned
ON, the devices with reset function have not yet been initialized. Hence, power-on does not
guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset
signal is received. Reset operation must be executed immediately after power-on for devices
having reset function.
Data Sheet G13418EJ3V0DS00
27
Page 28
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[MEMO]
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
1935
M7 98. 8
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