FILTER-CONTAINING VIDEO CHROMA, SYNCHRONIZING SIGNAL
PROCESSING LSI COMPATIBLE WITH NTSC/PAL SYSTEM
DESCRIPTION
The µPC1830 is a filter-containing video chroma, synchronizing signal processing LSI compatible with the NTSC/
PAL system. A decoder which converts composite video or separate Y/C video signals into a brightness signal and
a color difference signal and outputs the result, and a matrix which comprises independent brightness signal/color
difference signal input pins are integrated on one chip.
Decoder output can be used to drive an A/D converter; it is appropriate for picture-in-picture screen signal
processing and multimedia boards.
FEATURES
• Contains a trap filter, band-pass filter, delay line, and color difference output low-pass filter.
Peripheral parts can be drastically reduced.
• Low power consumption
Appropriate for use with digital boards because of 5-V single power supply operation.
• DC control for user adjustment pins
Centralized control can be performed by a microcontroller.
• One chip compatible with both NTSC and PAL systems
Boards common to NTSC and PAL systems can be easily constructed.
• S pin input
Supports composite and separate Y/C video signal inputs.
Pins for connecting a 32 fH
oscillation filter.
For resonator, use 500 kHz
ceramic resonator in both NTSC
and PAL modes. Bias of pin 1 is
supplied from pin 2 via an external
resistor between pins 1 and 2.
2.2 kΩ
4Horizontal AFC
filter
5GND
(synchronous
section)
3
1 mA
Pin for connecting filter of horizontal AFC detector.
Matrix Y signal input pin. This pin
also serves as a clamp pin. Input
the signal with C coupling. DC
level is approx. 2.0 V.
Video section power supply.
Matrix R-Y and B-Y color difference
signal input pins. These pins also
serve as clamp pins.
Input the signals with C coupling.
DC level is approx. 2.5 V.
Output in PAL mode is “pseud
PAL”.
Pin for connecting filter of fO
automatic adjustment loop.
µ
PC1830
32ACC filter
33GND (chroma
section)
34Separate
chroma input
VCC
VCC
500 Ω
1 kΩ5 kΩ
VCC
32
30 kΩ
80 A
µ
Pin for connecting filter of ACC
detector.
Chroma section ground.
Separate chroma signal input pin.
This pin also serves as a separate
and composite switch input pin. If
the pin voltage is set to 3.7 V or
more, composite input mode is
entered.
Composite video signal or separate
Y signal input pin. This pin also
serves as a clamp pin.
Input the signal with C coupling.
DC level is approx. 2.3 V.
(pins 28, 29) switch. When the pin
voltage is 2.8 V or more, the mode
changes to the 3.58 MHz mode;
when 2.2 V or less, to the 4.43
MHz mode.
42NTSC/PAL
switch
12
Pin for controlling switch of NTSC
and PAL modes of decoder and
V
CC
5 kΩ
42
5 kΩ
20 A
µ
matrix. One of the following three
combinations of decoder and
matrix modes can be selected
depending on the value of the pin
42 voltage V42:
1. When V42 = 0 V
decoder = PAL
matrix = PAL
2. When V42 = 2.5 V
decoder = NTSC
matrix = NTSC
3. When V42 = 5 V
decoder = NTSC
matrix = PAL
Page 13
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PC1830
5. BLOCK OPERATION
5.1 Video Signal Processing Section
(1) Input signal
After coupling by a capacitor (0.22 µF), a 1 Vp-p composite video signal is input to the composite video signal input
pin (pin 36).
(2) Clamp circuit
The clamp circuit controls the pedestal voltage level to be constant to make it a reference voltage for the post-stage
signal processing.
(3) Chroma trap circuit
Eliminates the chroma signal (NTSC system: approximately 3.58 MHz, PAL system: approximately 4.43 MHz) from
a composite video signal and extracts a brightness signal.
(4) Separate/composite switching circuit
Operates as shown in Table 5-1 according to the voltage of the separate chroma input pin (pin 34).
Table 5-1. Operation when Switching Separate/Composite Signals
Separate chroma inputModeBrightness signalACC amp input
pin (pin 34) voltageprocessing
Less than 3.7 VY/C separate inputWithout chroma trapInput from separate chroma
3.7 V or higherComposite video inputWith chroma trapInput from chroma BPF
(5) Delay circuit
Compensates for the delay between the brightness signal and chroma signal by delaying the brightness signal.
(6) Contrast adjustment circuit
Adjusts the amplitude of the brightness signal output from the Y output pin (pin 12) according to the voltage of the
contrast control pin (pin 38).
The control characteristic is shown in Figure 5-1.
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Page 14
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PC1830
Figure 5-1. Contrast Control Characteristic
(a) NTSC mode(b) PAL mode
400 mV
p-p
stair step (composite) input
2
V
CC
= 5 V
2
400 mV
p-p
stair step (composite) input
V
CC
= 5 V
)
p-p
1
Y output voltage (V
0 12345
Contrast control pin voltage (V)
5.2 Chroma Signal Processing Section
(1) Input signal
• Composite video signal input
After coupling by a capacitor (0.22 µF), a 1 Vp-p composite video signal is input to the composite video signal
input pin (pin 36).
• Separate chroma signal input
After coupling by a capacitor (1000 pF), a chroma signal whose burst signal amplitude is 150 mV
to the separate chroma input pin (pin 34).
)
p-p
1
Y output voltage (V
0 12345
Contrast control pin voltage (V)
p-p is input
(2) Chroma BPF circuit
Separates the chroma signal from a composite video signal.
(3) Separate/composite switching circuit
When the potential of the separate chroma input pin (pin 34) is 3.7 V or higher (in composite mode), switches the ACC
amp input from the chroma input pin to the chroma BPF circuit output. Processing of the brightness signal at this time
is switched so that it passes through the chroma trap circuit.
Operation when switching separate/composite signals is shown in Table 5-1.
(4) ACC (Auto Color Control) amplification circuit
Extracts the burst signal, detects its level and smoothes the voltage of the ACC filter pin (pin 32) by an external
capacitor.
This smoothed voltage controls color gain to keep the amplitude of the burst signal constant.
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PC1830
(5) Subcolor control circuit
According to the voltage of the subcolor control pin (pin 37), controls the amplitude of the chroma signal output from
the ACC amplification circuit after separating the burst signal from it, and adjusts the amplitude of the color difference
signal output from the R-Y output pin (pin 13) and B-Y output pin (pin 14). This controls color density on the screen.
The control characteristic is shown in Figure 5-2.
Figure 5-2. Subcolor Control Characteristic
(a) NTSC mode(b) PAL mode
p-p
Color bar (composite, burst: 300 mV
3
) input
VCC = 5 V
Color bar (composite, burst: 300 mV
3
p-p
CC
= 5 V
V
) input
2
1
B-Y output voltage (V)
0 12345
Subcolor control pin voltage (V)
2
1
B-Y output voltage (V)
0 12345
Subcolor control pin voltage (V)
(6) Chroma APC (Auto Phase Control) circuit
Detects the phase difference between the burst signal extracted from the chroma signal and the signal from f
and smoothes the chroma APC filter pin (pin 30) using a capacitor. This smoothed voltage is used to control the
SCVCXO oscillation frequency.
f
(7) Killer detection circuit
Detects the amplitude of the burst signal and executes a mute on the subcolor control circuit when there is no burst
signal, preventing it from outputting a chroma signal to avoid color noise. In this case, the output of the color killer
output pin (pin 8) is driven high.
The color killer sensitivity is determined by the time constant of a resistor and capacitor connected to the color killer
filter pin (pin 26).
SCVCXO
(8) IDENT detection circuit
Performs IDENT detection. With IDENT detection, if an NTSC signal (PAL signal in NTSC mode) is input in PAL mode,
the color killer turns on and no chroma signal is output.
(9) 3.58 MHz/4.43 MHz VCXO, PAL SW circuit
Switches the f
SCVCO input pin between pin 28 (for 3.58 MHz) and pin 29 (for 4.43 MHz) by controlling the voltage
of the fSC switching pin (pin 41) (2.8 V or higher: 3.58 MHz mode, 2.2 V or below: 4.43 MHz mode) to perform fSC
oscillation at 3.58 MHz or 4.43 MHz. VCXO is controlled by the voltage of the chroma APC filter pin (pin 30) smoothed
by the chroma APC circuit and its phase is synchronized with the input burst signal.
The PAL SW circuit inverts the phase of a signal on the R-Y demodulation axis every 1H by IDENT detection.
(10) R-Y, B-Y demodulation circuit
Performs demodulation using the chroma signal output from the ACC circuit, an R-Y demodulation axis signal and
a B-Y demodulation axis signal output from f
SCVCXO, and multiplies R-Y by 1.4 and B-Y by 2.03.
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5.3 Matrix Section
(1) Input signal
• Brightness input signal
µ
After coupling by a capacitor (0.22
pin (pin 16).
• Color difference input signal
After coupling by a capacitor (0.22
(pins 18 and 19).
(2) Y, R-Y and B-Y input clamp circuit
Clamps Y, R-Y and B-Y signals when the voltage of the clamp pulse input pin (pin 22) is 2.8 V or higher.
Input a clamp pulse to the clamp pulse input pin (pin 22) in synchronization with the burst section of an input signal
as shown in Figure 5-3.
In the application circuit example, adjust the position of the clamp pulse by DELAY (
resistor: 10 kΩ) and the clamp pulse width by PD (µPD4538B external variable resistor: 10 kΩ).
F), a brightness signal which has 1 Vp-p of video part is input to the Y input
µ
F), 1 Vp-p R-Y and B-Y signals are input to the R-Y and B-Y input pins
µ
PD4538B external variable
µ
PC1830
Figure 5-3. 22-Pin Input Clamp Pulse Waveform
Burst signal
Composite
video input
22-pin input
clamp pulse
(3) Amplification color control circuit
Adjusts the amplitude of a color difference signal input to the R-Y input pin (pin 18) and B-Y input pin (pin 19) according
to the voltage of the color control pin (pin 20). This controls the color density on the screen.
When using a matrix, adjust the color density mainly using this color control and fix the voltage of the subcolor control
pin (pin 37) at 2 V (TYP.).
The control characteristic is shown in Figure 5-4.
Video signal
Clamp operates at 2.8 V or higher.
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PC1830
Figure 5-4. Color Control Characteristic
(a) NTSC mode(b) PAL mode
400 mV
p-p
p-p
400 mV
Tint control pin voltage: 2 V
1.0
0.9
0.8
)
0.7
p-p
0.6
0.5
stair step B-Y input
V
CC
= 5 V
Tint control pin voltage: 2 V
1.0
0.9
0.8
)
0.7
p-p
0.6
0.5
stair step B-Y input
V
CC
= 5 V
0.4
0.3
B output voltage (V
0.2
0.1
0 12345
Color control pin voltage (V)
0.4
0.3
B output voltage (V
0.2
0.1
0 12345
Color control pin voltage (V)
(4) Tint control circuit
Controls the phase of a color difference signal whose amplitude is adjusted by the color control circuit, in a range of
±45° according to the voltage of the tint control pin (pin 21), and adjusts tint on the screen.
Table 5-2 shows the demodulation angle and demodulation ratio in each mode and Figure 5-5 shows the control
characteristic.
Table 5-2. Demodulation Angle and Demodulation Ratio when
Adds a brightness signal: Y to each of (R-Y)’, (B-Y)’ and G-Y to create R, G, and B signals.
5.4 Synchronizing Signal Processing Section
(1) Input signal
A composite video signal or brightness signal is input to the synchronizing separate input pin (pin 39) at 1 V
(2) Sync. separation circuit
Separates the sync. signal from a composite video signal. The slice level can be changed using an external resistor:
X (see Figure 5-6, TYP. = 220 Ω).
R
The operation of the µPC1830 sync. separation circuit is explained below.
Figure 5-6 is an equivalent circuit diagram of the µPC1830 sync. separation circuit.
µ
PC1830
P-P.
Figure 5-6.
V
CC
A733
µ
PC1830 Sync. Separate Input Section Equivalent Circuit
V
CC
16 kΩ
100 Ω
167Ω
TR1
1.8 kΩ
+
Co
Approx. 2.5 V
(when V
Isp
Rx
Ix
Ro
CC
= 5 V)
39
5 kΩ
5 kΩ
CC
V
5 kΩ
In Figure 5-6, the slice level of sync. separation is determined as follows:
When a negative sync. video signal is input, charge current ISP flows from the µPC1830 to CO so that the
synchronization peak (minimum potential) becomes approximately 2.5 V. The voltage of the sync. separate
input pin (pin 39) becomes 2.5 V or higher during a period other than the synchronization peak (minimum
potential), thus cutting off transistor TR1 (reducing the collector current of TR1). Consequently, a charge in C
is discharged via RO and RX by current IX during this cut-off period. Figure 5-7 illustrates this situation.
18
O
Page 19
Figure 5-7. Sync. Separation Waveform
µ
PC1830
Charge by I
V
S
V
S in Figure 5-7 represents the slice voltage and can be expressed in the following expression if it is assumed
SP
Discharge by I
T1 (4.7 s)T2 (58.86 s)
µ
µ
X
that CO is sufficiently large, and both IX and ISP are linear.
S = 2.5 × (RX/RO) × (T2/T1) [V]
V
The µPC1830 amplifies the part lower than this slice voltage (VS) to perform sync. separation.
To determine sync. separation sensitivity, change R
X to set VS. Decreasing VS is advantageous for separation
of the horizontal sync. part, but disadvantageous for separation of the vertical sync. part. On the contrary,
increasing VS may cause a sync. failure (jitter) due to noise (spikes) of the horizontal sync. part. Therefore, it
is necessary to optimize the constant in accordance with a signal input. As capacitance C
O, select a sufficiently
large value compared with the charge/discharge current. However, an excessive value may deteriorate the
excessive response characteristic, failing to catch up with drastic APL variations of the input signal.
The larger R
X, the larger the slice level becomes. However, with large RX if the sync. signal level drops (weak
electric field signal, etc.) a video signal may be confused with a sync. signal and sliced, making synchronization
unstable (abnormal).
CautionSince the measuring circuit uses capacitor coupling for input for ease of measurement, it is
susceptible to APL variations. Therefore, when configuring the actual circuit, use a Sync Tip
clamp circuit in the stage prior to inputting to the emitter follower to stabilize the synchronization
peak potential and this will make the circuit more resistant to APL variations.
(3) Vertical filter circuit
Separates the vertical sync. signal from the sync. signal separated by the sync. separation circuit.
(4) Horizontal sync. detection circuit
Detects the presence of a horizontal sync. signal and changes the AFC time constant.
(5) AFC detection circuit
Performs phase detection on an input sync. signal and f
H and outputs the phase difference in voltage.
Stops phase detection for 9H of the vertical blanking period.
(6) 32f
H VCO
Controls VCO according to the voltage output by the AFC detection circuit and generates 32fH oscillation clocks.
19
Page 20
(7) Horizontal/vertical counter circuit
• Horizontal counter circuit
Divides a 32f
• 525/625 counter circuit
Performs counting at 4f
Generates VD in 0.75H delay from the falling edge of a vertical sync. signal in an odd field and in 0.75H delay
from the falling edge of a vertical sync. signal in an even field.
H signal to generate horizontal timing signals such as HD and BLK signals.
H and generates a vertical timing signal.
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PC1830
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PC1830
6. ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings (TA = +25 °C unless otherwise specified)
ParameterSymbolRatingsUnit
Power supply voltageVCC7.0V
Video input signal voltageVIYVCCV
Chroma input signal voltageVICVCCV
Synchronous separation input signal voltageVISVCCV
Control signal voltageVIcntVCCV
Permissible package power dissipationPD500 (on board, TA = +75 °C)mW
Operating ambient temperatureTA–20 to +75°C
Storage temperatureTstg–40 to +125°C
Caution Even if one of the parameters exceeds its absolute maximum rating even momentarily, the quality
of the product may be degraded. The absolute maximum rating therefore specifies the upper
or lower limit of the value at which the product can be used without physical damages. Be sure
not to exceed or fall below this values when using the product.
Recommended Operating Conditions
ParameterSymbolConditionsMIN.TYP.MAX.Unit
Power supply voltageVCC4.55.05.5V
Composite video input voltageVYC—1.0—Vp-p
Separate chroma input signalVC—150—mV p-p
voltage
Synchronous separation inputVS—1.0—Vp-p
signal voltage
Control signal voltageVcont0—VCCV
Color difference input voltageVR-Y1.0VP-P
Separate/composite
switch, ACC amp.
subcolor control
Clamp
chroma
chroma
trap
Separate/composite switch
BPF
Delay
Y
HD, VD, blanking pulse,
killer output buffer
C
Contrast control
Filter f0
adjust
APC, killer detect,
IDENT detect
C
R-Y, B-Y
modulate
Y, R-Y, B-Y
output buffer
3.58 MHz/4.43 MHz
VCXO, PAL SW
fSC
R-Y B-Y
LPF
R-YYB-Y
Killer
fSC
Y, R-Y, B-Y
input clamp
Y
12345678910 11 12 13 14 15 16 17 18 19 20 21
330 Ω 4700
270 pF
2.2 kΩ
390 pF
500
kHz
2.7 kΩ
pF
Note 2
4.3 kΩ
+
2.2 F
Killer
detect BLK HD VD
0.1 F
µ
+
22F
µ
µ
VCC
R-Y
Y
B-Y
VCC
0.1
µ
F
+
22 F
µ
910
kΩ
RGB output
RBG
NTSC/PAL
matrix
R-Y
Tint control
R-Y
Amp. color
control
R-Y
NC
buffer
B-Y
G-Y
B-Y
B-Y
µ
PC1830
Page 39
8. OPERATING PRECAUTIONS
8.1 µPC1830 External Components
(1) Resistors
Use E24 series resistors (approximately 5% precision) of 1/4 W or higher.
(2) Capacitors
• Ceramic capacitors of 1000 pF or below
Capacitors used for the time constant circuit. Basically use E12 series (10% precision) ones with the center value
= 0 in nominal temperature characteristic.
• Ceramic capacitors of 1000 pF or higher
Equivalent to capacitors for non-critical time constant circuits and for clamp, and bypass capacitors between power
supply and GND. Use E12 series (10% precision) ones. Use a type whose capacitance is not extremely affected
by temperature variations (ie. with an excellent temperature characteristic).
µ
PC1830
• Electrolytic capacitors
Use E6 series (20% precision) ones. Use ones whose capacitance is not extremely affected by temperature
variations (ie. with an excellent temperature characteristic).
(3) Crystal resonators
Use crystal resonators of 16 pF load type as shown below.
• For PAL: 4.433 619 MHz (model name: HC-49/U, manufactured by Kinseki, Ltd.)
• For NTSC : 3.579 545 MHz (model name: TQC203A-8R (HC-49/U-10 type), manufactured by Toyo
Communication Equipment Co., Ltd.)
Note that use of crystal resonators other than the above may deteriorate electrical characteristics.
(4) Ceramic resonators
Use ceramic resonators as shown below.
• CSB500 F23 (manufactured by Murata Mfg. Co., Ltd.)
Note that use of ceramic resonators other than the above may deteriorate mainly electrical characteristics of the sync.
section.
39
Page 40
8.2 µPC1830 Pattern Wiring
(1) GND line
Solid grounding should be applied to three GNDs: synchronous section GND (pin 5), video section GND (pin 15) and
chroma section GND (pin 33). They should not be connected to other digital GNDs except the one point of origin.
Use thick connection (thick through hole) for each GND pin of the IC.
When an emitter follower circuit, amplifier, etc. is connected to the color difference output stage or RGB output stage,
separate the solid ground of the output stage from that of the IC output stage.
(2) Power supply line
The three analog power supplies, synchronous section power supply (pin 7), video section power supply (pin 17) and
chroma section power supply (pin 35) should be independent of each other and unified at the supply source. Ensure
that there is no unnecessary routing.
Separate the digital section power supply from the analog section power supply and connect them only at one point.
(3) Signal line
In order to avoid signal cross talk, ensure that the color difference signal line (pins 12, 13, and 14) and RGB signal
line (pins 23, 24, and 25) are not placed close to or in parallel with the digital signal line or HD (pin 10), VD (pin 11)
and BLK (pin 9) lines, or cross those lines.
µ
PC1830
(4) Placement of peripheral components of each pin
Place components which are connected with pins 1, 2, 5, 7, 15, 16, 17, 18, 19, 23, 24, 25, 28, 29, 33, 34, and 35 close
to the IC. When the placed components are connected to the power supply line or other lines, route low-impedance
lines and make sure that the thickest possible lines are used for connection with the IC pins.
40
Page 41
9. PACKAGE DRAWING
42 PIN PLASTIC SHRINK SOP (375 mil)
4222
detail of lead end
3°
+7°
–
3°
µ
PC1830
121
A
G
F
E
C
D
M
M
N
NOTE
Each lead centerline is located within 0.10
mm (0.004 inch) of its true position (T.P.) at
maximum material condition.
H
I
K
B
L
S42GT-80-375B-1
ITEMMILLIMETERSINCHES
A
B
C
D
E
F
G
H
I
J
K
L
M
N
18.16 MAX.
1.13 MAX.
0.8 (T.P.)
+0.10
0.35
–0.05
0.125±0.075
2.9 MAX.
2.5±0.2
10.3±0.3
7.15±0.2
1.6±0.2
+0.10
0.15
–0.05
0.8±0.2
0.10
0.100.004
0.715 MAX.
0.044 MAX.
0.031 (T.P.)
+0.004
0.014
–0.003
0.005±0.003
0.115 MAX.
+0.009
0.098
–0.008
+0.012
0.406
–0.013
+0.009
0.281
–0.008
0.063±0.008
+0.004
0.006
–0.002
+0.009
0.031
–0.008
0.004
J
41
Page 42
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PC1830
10. RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other
soldering processes are used, or if the soldering is performed under different conditions, please make sure to
consult with our sales offices.
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E).
Surface Mount Device
µ
PC1830GT: 42-pin plastic shrink SOP (375 mil)
ProcessConditionsSymbol
Infrared ray reflowPeak temperature: 235 °C or below (Package surface temperature),IR35-00-2
Reflow time: 30 seconds or less (at 210 °C or higher),
Maximum number of reflow processes: 2 times.
Vapor phase solderingPeak temperature: 215 °C or below (Package surface temperature),VP15-00-2
Reflow time: 40 seconds or less (at 200 °C or higher),
Maximum number of reflow processes: 2 times.
Partial heating methodPin temperature: 300 °C or below,—
Heat time: 3 seconds or less (Per each side of the device).
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the
device will be damaged by heat stress.
42
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[MEMO]
µ
PC1830
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µ
PC1830
[MEMO]
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special:Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96.5
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