Datasheet TEA6422 Datasheet (SGS Thomson Microelectronics)

BUS-CONTROLLED AUDIO MATRIX

.

6 STEREOINPUTS

.

3 STEREOOUPUTS

.

GAIN CONTROL 0dB/MUTE FOR EACH OUT­PUT

.

CASCADABLE(2DIFFERENTADDRESSES)

.

SERIALBUS CONTROLLED

.

VERYLOWNOISE

.

VERYLOWDISTORSION

.

FULLYESD PROTECTED

DESCRIPTION

The TEA6422 switches 6 stereo audio inputs on
3 stereo outputs.
All theswitchingpossibilities arechangedthrough

2

the I

CBUS.

TEA6422

SHRINK 24

(Plastic Package)

ORDER CODE : TEA6422

SO28

(Plastic Micropackage)

ORDER CODE : TEA6422D

PIN CONNECTIONS

GND

CAPACITANCE

V

S

L1
L2
L3
L4
L5
L6

LOUT1

ROUT1

LOUT2

May 1996

SDIP24

1
2
3
4
5
6
7
8
9
10
11
12

SO28

24

SDA

23

SCL

22

ADDR

21

R1

20

R2

19

R3

18

R4

17

R5

16

R6

15

ROUT3

14

LOUT3

13

ROUT2

CAPACITANCE

GND

LOUT1

ROUT1

V
L1
L2

L3
NC
NC

L4

L5

L6

1
2
3

S

4
5
6
7
8
9
10
11
12
13
14

28
27
26
25
24
23
22
21
20
19
18
17
16
15

SDA
SCL
ADDR
R1
R2
R3
NC
NC
R4
R5
R6
ROUT3
LOUT3
ROUT2LOUT2

6422-01.EPS / 6422-02.EPS

1/9

TEA6422

BLOCK DIAGRAM

RIGHT INPUTS

GND

T

E

GAIN = 0/2/4/6dB

A

6
4
2

RIGHT
OUTPUTS

2

V

S

C

SUPPLY BUS DECODER

GAIN = 0/2/4/6dB

LEFT INPUTS

SDA

SCL
ADDR

LEFT
OUTPUTS

6422-03.EPS

ABSOLUTEMAXIMUM RATINGS

Symbol Parameter Value Unit

V

CC

T

oper

T

stg

Supply Voltage 12 V
Operating Temperature 0, + 70
Storage Temperature - 20, + 150

THERMAL DATA

Symbol Parameter Value Unit

R

th(j-a)

Junction - ambient ThermalResistance SDIP24

SO28

75
75

o

C/W

o

C/W

o

C

o

C

6422-01.TBL

6422-02.TBL

2/9

TEA6422

ELECTRICAL CHARACTERISTICS

=25oC, VS= 9V,RL=10kΩ,RG= 600Ω, f =1kHz (unless otherwise specified)

T

A

Symbol Parameter Test Conditions Min. Typ. Max. Unit

SUPPLY

V

I

S

SVR Ripple Rejection V

MATRIX

V

IN

R

C

OUTPUT BUFFER

V

OUT

R

OUT

e

NI

S/N Signal to Noise Ratio V

G Gain -1 0 + 1 dB

d Distortion V

V

CL

R

Supply Voltage 8 9 10.2 V

S

Supply Current 3 8 mA

= 500mV

IN

, f = 1kHz 70 80 dB

RMS

Input DC Level 4.5 V
Input Resistance 30 50 100 kΩ

I

Channel Separation VIN=2V

S

, f = 1kHz 80 90 dB

RMS

Output DC Level 4.2 4.5 4.8 V
Output Resistance 50 100 Ω
Input Noise BW = 20- 20kHz, flat 3 µV

IN=VOUT

IN=VOUT

=1V

=1V

RMS

RMS

110 dB

0.01 0.05 %
Clipping Level d = 0.3% 2 2.5 V
Output Load Resistance 2 kΩ

L

RMS

6422-03.TBL

3/9

TEA6422

2

I

C BUS CHARACTERISTICS

Symbol Parameter Test Conditions Min. Max. Unit

SCL

V
V

I

f

SCL

t

t

C

SDA

V
V

I
C
t

t

V

t

C

TIMING

t

LOW

t

HIGH

t

SU, DAT

t

HD, DAT

t

SU, STO

t

BUF

t

HD, STA

t

SU, STA

Figure 1 : I2C Bus Timing

Low Level Input Voltage - 0.3 + 1.5 V

IL

High Level Input Voltage 3.0 VCC+ 0.5 V

IH

Input Leakage Current VI= 0 to V

LI

CC

-10 +10 µA
Clock Frequency 0 100 kHz
Input Rise Time 1.5Vto 3V 1000 ns

R

Input Fall Time 1.5Vto 3V 300 ns

F

Input Capacitance 10 pF

I

Low Level Input Voltage - 0.3 + 1.5 V

IL

High Level Input Voltage 3.0 VCC+ 0.5 V

IH

Input Leakage Current VI= 0 to V

LI

Input Capacitance 10 pF

I

Input Rise Time 1.5Vto 3V 1000 ns

R

Input Fall Time 1.5Vto 3V 300 ns

F

Low Level Output Voltage IOL= 3mA 0.4 V

OL

Output Fall Time 3V to 1.5V 250 ns

F

Load Capacitance 400 pF

L

CC

-10 +10 µA

Clock Low Period 4.7 µs
Clock High Period 4.0 µs
Data Set-upTime 250 ns
Data Hold Time 0 340 ns
Set-up Time from Clock High to Stop 4.0 µs
Start Set-up Time following a Stop 4.7 µs
Start Hold Time 4.0 µs
Start Set-up Time following Clock Low-to High Transition 4.7 µs

6422-04.TBL

4/9

SDA

SCL

SDA

t

BUF

t

LOW

t

HD,STA t

t

r

t

SU,STA t

HD,DAT

t

HIGH

t

f

t

SU,DAT

SU,STO

6422-04.EPS

TEA6422

POWERON RESET

After power-on reset alloutputs are in mute mode

Symbol Parameter Conditions Min. Typ. Max. Unit

Reset Start of Reset

End of Reset

SOFTWARESPECIFICATION

1. Chip address

Address HEX ADDR

1001 1000 98 0
1001 1010 9A 1

2. Data bytes

Output select

X0

0
1

0
1
0

XXI

Input select

XQ

X =don’t care - MSB is transmitted first
Example : 0 10 XX 100 connects outputs 3 with input 5.

Q0XX0

1

2

0
0
0
1
1
1

I

0
0
1
1
0
0
1

1

Incr.V
Decr.V
Incr.V

I

0

0
1
0
1
0
1
0

CC

CC

CC

Output 1
Output 2
Output 3

Input 1
Input 2
Input 3
Input 4
Input 5
Input 6
Mute

2.5

4.2

4.5

V
V
V

6422-05.TBL

6422-06.TBL

5/9

TEA6422

Figure2 : DistorsionLevel versus Input Voltage

dis (%)

0.1
V=9V

S

f = 1kHz

0.08
T=25°C

amb

0.06

0.04

0.02

V

IN(VRMS

)

0

2.0 2.1 2.2 2.3 2.4 2.5 2.6

Figure4 : SupplyVoltage Rejection versus

frequency(V

SVR (dB)

98
95
92
89

86

83
80
77
74

= 500mV

IN

)

RMS

V=9V

S

freq (kHz)

0.05 0.5 5 20

Figure3 : ClippingLevel versusSupply Voltage

VV

()

3.5

3.3

3.1

2.9

2.7

2.5

2.3

2.1

7.5 8 8.5 9

6422-05.EPS

6422-07.EPS

RMSclipp

dis = 0.3%
f = 1kHz
T=25°C

amb

9.5 10

V (V)

10.5 11

S

6422-06.EPS

6/9

PIN CONFIGURATIONS (SDIP24Package)
Figure5 : Audio IN

V

CC

Figure6 : Audio OUT

TEA6422

V

CC

Pins 4-5-6-7-8-9

16-17-18-19-20-21

L (R) x in

x = 1, 2, 3, 4, 5, 6

Figure7 : ADDR

22

50kΩ

VCC/2

V

CC

50kΩ

Matrix

Point

to CMOS

6422-08.EPS

Figure8 : Bus Inputs(SDA, SCL)

Pins

23- 24

ACKN

6422-10.EPS

For SDA only

Pins
10- 11-12
13-14-15

L (R) x out
x = 1, 2, 3

6422-09.EPS

V

CC

ESD

PROT.

V

REF

toCMOS

X4

6422-11.EPS

TYPICALAPPLICATION (SDIP24Package)

1

C1 - C18 = 4.7µF

Left

Inputs

CH1

Output

+9V

L
R
L

22µF

100nF

C1
C2
C3
C4

C5
C11
C12
C13
C14

2

3

4

5

6

7

8

9

10

11

12 13

T
E
A
6
4
2
2

24

SDA

23

SCL

22

21

20

19

18

17

16

15

14

C6
C7
C8
C9
C10
C18
C17
C16
C15

R
L

R

Bus
Inputs

SW

Right
Inputs

CH3
Output

CH2 OutputCH2 Output

6422-12.EPS

7/9

TEA6422

PACKAGEMECHANICALDATA

24 PINS- PLASTICSHRINK

BeB1

A1

A2

Stand-off

E

E1

LA

e1
e2

SDIP24

c

E

.015
0,38

Gage Plane

e3
e2

Dimensions

D

24

1

13

F

12

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 5.08 0.20
A1 0.51 0.020
A2 3.05 3.30 4.57 0.120 0.130 0.180

B 0.36 0.46 0.56 0.0142 0.0181 0.0220
B1 0.76 1.02 1.14 0.030 0.040 0.045

C 0.23 0.25 0.38 0.0090 0.0098 0.0150

D 22.61 22.86 23.11 0.890 0.90 0.910

E 7.62 8.64 0.30 0.340
E1 6.10 6.40 6.86 0.240 0.252 0270

e 1.778 0.070
e1 7.62 0.30
e2 10.92 0.430
e3 1.52 0.060

L 2.54 3.30 3.81 0.10 0.130 0.150

PMSDIP24.EPS

SDIP24.TBL

8/9

PACKAGEMECHANICALDATA

28 PINS- PLASTICMICROPACKAGE (SO)

Dimensions

Min. Typ. Max. Min. Typ. Max.

A 2.65 0.104

a1 0.1 0.3 0.004 0.012

b 0.35 0.49 0.014 0.019
b1 0.23 0.32 0.009 0.013

C 0.5 0.020

c1 45

D 17.7 18.1 0.697 0.713
E 10 10.65 0.394 0.419

e 1.27 0.050
e3 16.51 0.65

F 7.4 7.6 0.291 0.299

L 0.4 1.27 0.016 0.050

S8

Millimeters Inches

o

(Typ.)

o

(Max.)

TEA6422

PM-SO28.EPS

SO28.TBL

Information furnished is believed to be accurate and reliable. However,SGS-THOMSON Microelectronics assumes no responsibility
for the consequences of use of suchinformation nor for any infringement of patentsor other rights of third parties which may result
from itsuse. No licence is granted by implication or otherwise under anypatent or patent rights of SGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life
support devices or systems withoutexpress written approval of SGS-THOMSON Microelectronics.

 1996 SGS-THOMSON Microelectronics - All Rights Reserved

Purchase of I

2

I

C Patent. Rights to use these components in a I2C system,is granted provided that the system conforms to

Australia - Brazil - Canada - China - France -Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco

The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.

2

C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips

2

the I

C Standard Specifications as defined by Philips.

SGS-THOMSON Microelectronics GROUP OF COMPANIES

9/9