Product specification
File under Integrated Circuits, IC02
July 1990
Page 2
Philips SemiconductorsProduct specification
PLL stereo decoder (BTSC system)TEA5582
GENERAL DESCRIPTION
The TEA5582, a 20-pin integrated phase-locked loop
(PLL) stereo decoder, is designed primarily for low cost
stereo decoding in a low- to medium-line TV. The MUX
input (pin 1) is a low impedance current input, the gain of
the input amplifier is therefore determined by the external
resistor R1 (see Fig.5). All characteristics are measured
with R1 = 47 kΩ. The de-emphasis of (L, R) and (L-R) can
be chosen by means of external capacitors and resistors.
The supply voltage range of the device is from 7 V to 16 V.
Features
• Wide supply voltage range
• Automatic mono/stereo switching (pilot presence
detector)
• LED driver for stereo indicator
• Smooth mono/stereo control
• Matrix and two amplifiers for left and right output signals
• A source selector to switch between the MUX signal and
an external signal
• Mute circuit for 60 dB muting of the output level
• External de-emphasis control of (L, R) and (L − R)
• 6 dB fixed attenuation of (L − R) with respect to (L + R)
prior to matrix
• All pins are protected against Electrostatic Discharge
(ESD)
QUICK REFERENCE DATA
PARAMETERCONDITIONSSYMBOLMIN.TYP.MAX.UNIT
Supply voltage rangeV
Total current consumptionwithout LED driverI
S
tot
7.08.516V
−1925mA
Decoder
Overall gainmono; R1 = 47 kΩG
AF output voltage (RMS value)V
Total harmonic distortionV
= 600 mVTHD−0.3−%
o
Output channel unbalanceV
)45.87dB
o(Vo/Vi
= V
14
15
−0.1−dB
14/V15
−245−mV
Channel separationL = 1; R = 0α2428−dB
Source selector
Suppression of MUX signalV
Suppression of external signalV
≥ 2 Vα8090−dB
6
≤ 0.8 Vα5660−dB
6
Output amplifiers
Gain output amplifier
MUX signalG
external signalG
AF output voltage (RMS value)V
Mute suppressionV
≤ 0.8 V
7
v
v
11=V10
6.77.27.7dB
−0.50+0.5dB
460560640mV
MUX signalα5660−dB
external signalα5660−dB
PACKAGE OUTLINE
20-LEAD DIL; PLASTIC (SOT146); SOT146-1; 1996 November 18.
July 19902
Page 3
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July 19903
Philips SemiconductorsProduct specification
PLL stereo decoder (BTSC system)TEA5582
Fig.1 Block diagram.
Page 4
Philips SemiconductorsProduct specification
PLL stereo decoder (BTSC system)TEA5582
PINNING
Fig.2 Pinning diagram.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETERSYMBOLMIN.MAX.UNIT
Supply voltage range (pin 5)V
LED-driver current (peak value)I
Total power dissipationP
Storage temperature rangeT
Operating ambient temperature rangeT
Electrostatic handling
(1)
P
3
tot
stg
amb
V
es
−18V
−75mA
−65+150°C0+70°C
−2+2kV
Note
1. ESD withstand voltage is defined by MIL STD 883C (C = 100 pF; R = 1.5 kΩ).
see Fig.3
July 19904
Page 5
Philips SemiconductorsProduct specification
PLL stereo decoder (BTSC system)TEA5582
Fig.3 Power derating curve.
DC CHARACTERISTICS
All voltages are with respect to ground (pin 20); all currents are positive into the device; all parameters are measured in
the test set-up (see Fig.5) at a nominal supply voltage of V
= 8.5 V; T
S
= 25 °C unless otherwise specified.
amb
PARAMETERCONDITIONSSYMBOLMIN.TYP.MAX.UNIT
Supply voltageV
Total current consumptionwithout LED driverI
Power dissipationP
S
tot
tot
7.08.516V
−1925mA
−160−mW
Voltage
pin 1V
pins 8, 9, 10, 11, 12 and 13V
1
− V
8
13
−2.1−V
−4.2−V
DC output current
pins 14 and 15−I
, I
14
15
1.11.41.8mA
LED-driver current
pin 3I
3
−−20mA
Switch “VCO-OFF”
voltageI19= 50 µAV19−2−V
Switch “VCO-OFF”
currentI
19
50−−µA
July 19905
Page 6
Philips SemiconductorsProduct specification
PLL stereo decoder (BTSC system)TEA5582
AC CHARACTERISTICS
Measured in the test circuit of Fig.5; V
AC conditions: (1) input signal (V
signal (V
) of 1.2 V p-p for L = 1, R = 0 and no DBX; fm= 1 kHz (stereo) and V
i
specified (without L−R filter); voltage controlled oscillator (VCO) adjusted to 188.8 kHz at V
with an external IF roll-off network (−2 dB at 31.5 kHz = 2f
All the above conditions apply unless otherwise specified.
PARAMETERCONDITIONSSYMBOLMIN.TYP.MAX.UNIT
= 8.5 V; T
S
) of 815 mV p-p for L = 1, R = 1 (mono) fm= 1 kHz (= 80% modulation). (2) MUX input
i
amb
= 25 °C.
= 200 mV p-p. (3) S1 open, unless
pilot
= 0 V; values are measured
i
) at the input (dashed components RS and CS in Fig.5).
H
Overall performance (V
Input current (RMS value)I
Overall gainmono; R1 = 47 kΩG
to Vo)
i
l(rms)
o(Vo/Vi
−−12µA
)45.87dB
AF output voltage (mono)
(RMS value)V11= V
10
460560640mV
AF output voltage (mono)
(RMS value)V
= V
15
14
−245−mV
Total harmonic distortionnote 1THD−0.30.5%
Output voltageTHD = 1%V11= V
Output channel unbalanceV
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
A
UNIT
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
max.
mm
OUTLINE
VERSION
SOT146-1
12
min.
max.
1.73
1.30
0.068
0.051
IEC JEDEC EIAJ
b
b
1
0.53
0.38
0.021
0.015
0.36
0.23
0.014
0.009
REFERENCES
cD E eM
(1)(1)
26.92
26.54
1.060
1.045
SC603
July 199011
6.40
6.22
0.25
0.24
10
(1)
M
e
L
1
3.60
8.25
3.05
7.80
0.14
0.32
0.12
0.31
EUROPEAN
PROJECTION
H
E
10.0
0.2542.547.62
8.3
0.39
0.010.100.30
0.33
ISSUE DATE
w
92-11-17
95-05-24
Z
max.
2.04.20.513.2
0.0780.170.0200.13
Page 12
Philips SemiconductorsProduct specification
PLL stereo decoder (BTSC system)TEA5582
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
be necessary immediately after soldering to keep the temperature within the permissible limit.
(order code 9398 652 90011).
). If the printed-circuit board has been pre-heated, forced cooling may
stg max
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
July 199012
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