Page 1
INTEGRATED CIRCUITS
DATA SH EET
TEA6330T
Sound fader control circuit
for car radios
Preliminary specification
Supersedes data of June 1991
File under Integrated Circuits, IC01
January 1992
Page 2
Philips Semiconductors Preliminary specification
Sound fader control circuit
TEA6330T
for car radios
FEATURES
• Stereo/hi-fi processor for car radios performed with
volume, balance, bass and treble controls
• Sound fader control (front/rear) down to −30 dB in steps
of 2 dB
• Fast muting via bus or via setting the muting pin
• Suitable for external audio equalizers, can be looped-in
controlled by the I2C-bus
• Power-on reset on chip sets the device into general
mute position
• AC and DC short-circuit protected concerning
neighbouring pins
• I2C-bus control for all functions.
QUICK REFERENCE DATA
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
V
P
I
P
V
i
V
o
∆G
v
THD total harmonic distortion −− 0.2 %
S/N(W) weighted signal-to-noise ratio − 67 − dB
α
CR
B frequency response (−1 dB) 35 to
supply voltage 7 8.5 10 V
supply current − 26 − mA
maximum AF input signal
(RMS value) 2 −− V
maximum AF output signal
(RMS value) 1.1 −− V
volume control range, separated −66 −+20 dB
fader control range, separated 0 −−30 dB
bass control range −12 −+15 dB
treble control range −12 −+12 dB
crosstalk attenuation − 90 − dB
GENERAL DESCRIPTION
This bipolar IC is an I2C-bus controlled sound/volume
controller for car radios, in addition with fader function and
the possibility of an external equalizer.
− 20000 − Hz
ORDERING INFORMATION
EXTENDED
TYPE NUMBER
TEA6330T
Note
1. Plastic small outline package; 20 leads; body width 7.5 mm; (SOT163A); SOT163-1; 1996 August 02.
January 1992 2
(1)
PINS PIN POSITION MATERIAL CODE
20 SO plastic SOT163A
PACKAGE
Page 3
Philips Semiconductors Preliminary specification
Sound fader control circuit
for car radios
TEA6330T
Fig.2 Connection of equalizer (Table 7).
In application with equalizer circuit
TEA6360 coupling capacitors are not
necessary. Connectors for RIGHT in
brackets.
Fig.1 Block and test circuit.
Fig.3 T-filter for enhanced bass control (Fig.5).
Connectors for LEFT in brackets.
January 1992 3
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Philips Semiconductors Preliminary specification
Sound fader control circuit
for car radios
PINNING
SYMBOL PIN DESCRIPTION
C
PS
IN-R 2 audio input signal RIGHT
GND1 3 analog ground (0 V)
C
BR1
C
BR2
C
TR
QRR 7 right audio output signal of rear
QRF 8 right audio output signal of front
MUTE 9 input to set mute externally
GND2 10 digital ground (0 V) for bus control
SCL 11 clock signal of I
SDA 12 data signal of I
QLF 13 left audio output signal of front
QLR 14 left audio output signal of rear
C
TL
C
BL2
C
BL1
V
P
IN-L 19 audio input signal LEFT
V
ref
1 filtering capacitor for power supply
4 capacitor for bass control RIGHT
and signal to equalizer
5 capacitor for bass control RIGHT
6 capacitor for treble control RIGHT,
input signal for equalizer RIGHT
channel
channel
2
C-bus
2
C-bus
channel
channel
15 capacitor for treble control LEFT,
input signal for equalizer LEFT
16 capacitor for bass control LEFT
17 capacitor for bass control LEFT
and signal to equalizer
18 +8.5 V supply voltage
20 reference voltage output (VP/2)
TEA6330T
Fig.4 Pin configuration.
January 1992 4
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Philips Semiconductors Preliminary specification
Sound fader control circuit
for car radios
FUNCTIONAL DESCRIPTION
This bipolar IC is an I2C-bus controlled sound/volume
controller for car radios including fader function and the
possibility of an external equalizer. The sound signal
setting is performed by resistor chains in combination with
multi-input operational amplifiers. The advantages of this
principle are the combination of low noise, low distortion
and a high dynamic range. The separated volume controls
of the left and the right channel make the balance control
possible. The value and the characteristic of the balance is
controlled via the I2C-bus.
The contour function is performed by setting an extra bass
control and optional treble, depending on the actual
volume position. Its switching points and its range are also
controllable via the I2C-bus.
An interface is assigned behind the volume control to
loop-in an equalizer (Fig.2). In this case the treble control
is switched off, and the bass control can be used to set the
contour.
TEA6330T
Low level control fader is included independent of the
volume controls, because the TEA6330T has four driver
outputs (for front and rear).
An extra mute position for the front, the rear or for all
channels is built in. The last function may be used for
muting during preset selection. No external interface is
required between the microcomputer and this circuit, for all
switching and controlling functions are controllable via the
two-wire I
The separate mute-pin allows to switch the fader into mute
position without using the I2C-bus.
The on chip power-on reset sets the TEA6330T into the
general mute mode.
2
C-bus.
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134). Ground pins 3 and 10 connected together.
SYMBOL PARAMETER MIN. MAX. UNIT
V
P
P
tot
T
stg
T
amb
V
ESD
* Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor.
** Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
supply voltage (pin 18) 0 10 V
total power dissipation 0 700 mW
storage temperature range −55 150 °C
operating ambient temperature range −40 85 °C
electrostatic handling* for all pins −±300 V
electrostatic handling** for all pins −±4000 V
January 1992 5
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Philips Semiconductors Preliminary specification
Sound fader control circuit
TEA6330T
for car radios
CHARACTERISTICS
= 8.5 V; load resistors at audio outputs 10 kΩ, fi = 1 kHz (RS = 600 Ω), bass and treble in linear position, fader in off
V
P
position and T
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
P
I
P
V
ref
V
O
Measurements over all
V
i
V
o
G
v
B frequency response −1 dB roll-off frequency 35 to
α
CR
THD total harmonic distortion f = 20 to 12500 Hz
RR ripple rejection for V
P
N
α
BUS
S/N(W) weighted signal-to-noise ratio for CCIR 468-2 quasi
= 25 °C; measurements taken in Fig.1 unless otherwise specified.
amb
supply voltage range (pin 18) 7 8.5 10 V
supply current − 26 − mA
reference voltage (pin 20) 0.45 VP0.5 V
DC voltage at output (pins 7, 8, 13, 14) − 0.5 V
P
P
0.55 VPV
− V
maximum AF input level for THD = 2 % Gv= −66 to −6 dB
at pins 2 and 19 (RMS value) and V
= 8.1 V 2 −−V
P
maximum AF output level for THD = 2% Gv= −4 to +20 dB
at pins 7, 8, 13, 14 (RMS value) and V
= 8.1 V 1.1 −−V
P
maximum gain by volume setting 19 20 21 dB
− 20000 − Hz
crosstalk attenuation f = 250 to 10000 Hz
= 0 dB 70 90 − dB
G
v
V
V
V
= 50 mV Gv = +20 dB − 0.1 0.3 %
i (RMS)
= 500 mV Gv = 0 dB − 0.05 0.2 %
i (RMS)
= 1.6 V Gv = −10 dB − 0.2 0.5 %
i (RMS)
< 200 mV RMS Gv = 0 dB
R
f = 100 Hz − 70 − dB
f = 40 Hz to 3 kHz − 60 − dB
f = 3 to 12.5 kHz − 50 − dB
noise power at output of a 25 W
powerstage with 26 dB gain
(only contribution of TEA6330T)
mute position
(V9 = 0)
−−10 nW
crosstalk attenuation between SDA, SCL
and signal output Gv = 0 dB − 110 − dB
(20 log V
(p-p)/Vo RMS)
BUS
peak for 6 W power
amplifier
Vi = 50 mV RMS Po = 50 mW − 65 − dB
V
= 500 mV RMS Po = 50 mW − 67 − dB
i
V
= 50 mV RMS Po = 1 W 65 72 − dB
i
V
= 500 mV RMS Po = 1 W 71 78 − dB
i
= 50 mV RMS Po = 6 W; Fig.9 − 72 − dB
V
i
V
= 500 mV RMS Po = 6 W; Fig.9 − 86 − dB
i
January 1992 6
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Philips Semiconductors Preliminary specification
Sound fader control circuit
TEA6330T
for car radios
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Audio frequency outputs QLF, QRF, QLR and QRR
V
o
R
o
R
L
C
L
V
N(W)
Volume control
R
l
G
v
∆G
v
α
mute
Bass control
G
v
∆G
v
Treble control
G
v
∆G
v
maximum output signal (RMS value) 1.1 −−V
output resistance (pins 7, 8, 13 and 14) − 100 150 Ω
admissible output load resistor to ground or V
CC
7.5 −−kΩ
admissible output load capacitor −−2.5 nF
weighted noise voltage at output CCIR 468-2 ; Fig.8
quasi peak
for maximum gain G
for 0 dB gain G
for minimum gain G
for mute position (V
= +20 dB − 110 220 µV
v
= 0 dB − 25 50 µV
v
= −66 dB − 19 38 µV
v
= 0) − 11 22 µV
9
R
= 600Ω
G
input resistance (pins 2 and 19) 35 50 65 kΩ
volume control range Table 2 −66 −+20 dB
step width − 2- dB
gain set error G
= −50 to +20 dB −−2dB
v
G
= −66 to −50 dB −−3dB
v
gain tracking error balance in mid position −−2dB
mute attenuation at volume mute set mute-bits 76 90 − dB
controllable bass range Table 3; Fig.6
maximum boost f = 40 Hz 14 15 16 dB
maximum boost f = 100 Hz 12 13 14 dB
maximum attenuation f = 40 Hz 11 12 13 dB
maximum attenuation f = 100 Hz 10 11 12 dB
step width f = 40 Hz 2.5 3 3.5 dB
controllable treble range Table 4; Fig.7
maximum boost f = 10 kHz 9 10 11 dB
maximum boost f = 15 kHz 11 12 13 dB
maximum boost f > 15 kHz −−15 dB
maximum attenuation f = 10 kHz 9 10 11 dB
maximum attenuation f = 15 kHz 11 12 13 dB
step width f = 15 kHz 2.5 3 3.5 dB
January 1992 7
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Philips Semiconductors Preliminary specification
Sound fader control circuit
TEA6330T
for car radios
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Fader control
G
v
α
MUTE
∆V
o
External mute (pin 9)
V
9
I
9
2
I
C-bus, SCL and SDA (pins 11 and 12)
V
11, 12
I
11, 12
V
ACK
Power-on reset, when reset is active the GMU-bit (general mute) is set and the bus receiver is in reset position
V
P
fader control range Table 5 0 to
−−30 − dB
step width 1.5 2 2.5 dB
mute attenuation GMB-bit = 1; Table 6 74 84 − dB
DC offset output voltage (pins 7, 8, 13,
14)
between any adjoining volume step
and any step to mute G
in any treble and fader position G
in any bass position G
= −66 to 0 dB − 0.2 10 mV
v
G
= 0 to +20 dB − 215mV
v
= −66 to 0 dB −− 10 mV
v
= −66 to 0 dB −− 10 mV
v
input voltage for MUTE-ON (LOW) fader is switched into
general mute position 0 − 1.5 V
input voltage for MUTE-OFF (HIGH) Tables 2 and 5 3 − V
P
V
input voltage for MUTE-OFF pin 9 open-circuit − 5 − V
input current −−±10 µA
input voltage HIGH-level 3 − V
P
V
input voltage LOW-level 0 − 1.5 V
input current −−±10 µA
output voltage at acknowledge (pin 12) I12 = −3 mA −−0.4 V
supply voltage for start of reset increasing voltage −−2.5 V
supply voltage for end of reset increasing voltage 5.2 6.0 6.8 V
supply voltage for start of reset decreasing voltage 4.2 5.0 5.8 V
January 1992 8
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Philips Semiconductors Preliminary specification
Sound fader control circuit
for car radios
TEA6330T
Fig.5 Bass control with enhanced control range (T-filter coupling, Fig.1).
Fig.6 Bass control with normal control range (Fig.1).
January 1992 9
Page 10
Philips Semiconductors Preliminary specification
Sound fader control circuit
for car radios
TEA6330T
Fig.7 Treble control.
Fig.8 Noise voltage on outputs (CCIR 468-2 weighted, quasi-peak).
January 1992 10
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Philips Semiconductors Preliminary specification
Sound fader control circuit
for car radios
TEA6330T
Fig.9 Signal-to-noise ratio (CClR 468-2 weighted, quasi-peak) for TEA6330T with a 6 W power amplifier
(20 dB gain, Fig.10). Measurements without noise contribution of the power amplifier.
Fig.10 Signal-to-noise ratio measurement (Fig.9) with Vi = 50 mV RMS, Vo = 500 mV RMS for P
January 1992 11
max
= 6 W.
Page 12
Philips Semiconductors Preliminary specification
Sound fader control circuit
TEA6330T
for car radios
I2C-BUS PROTOCOL
2
C-bus format
I
S SLAVE ADDRESS A SUBADDRESS A DATA P
S = start condition
SLAVE ADDRESS = 1000 000X
A = acknowledge, generated by the slave
SUBADDRESS = subaddress byte, Table 1
DATA = data byte, Table 1
P = stop condition
X = read/write control bit
X = 0, order to write (the circuit is slave receiver only)
If more than 1 byte DATA are transmitted, then auto-increment of the subaddress is performed.
Byte organisation
2
Table 1 I
volume left 0 0 0 0 0 0 0 0 0 0 VL5 VL4 VL3 VL2 VL1 VL0
volume right 0 0 0 0 0 0 0 1 0 0 VR5 VR4 VR3 VR2 VR1 VR0
bass 0 0 0 0 0 0 1 0 0 0 0 0 BA3 BA2 BA1 BA0
treble 0 0 0 0 0 0 1 1 0 0 0 0 TR3 TR2 TR1 TR0
fader 0 0 0 0 0 1 0 0 0 0 MFN FCH FA3 FA2 FA1 FA0
audio switch 0 0 0 0 0 1 0 1 GMU EQN 0 0 0 0 0 0
Function of the bits:
VL0 to VL5 volume control of left channel (balance control)
VR0 to VR5 volume control of right channel (balance control)
BA0 to BA3 bass control of both channels
TRO to TR3 treble control of both channels
FA0 to FA3 fader control front to rear
C-bus transmission
DATA BYTE
FUNCTION SUBADDRESS BYTE
D7 D6 D5 D4 D3 D2 D1 D0
FCH select fader channels front or rear
MFN mute control of the selected channels front or rear
GMU mute control, general mute
EQN equalizer switchover (0 = equalizer-on)
January 1992 12
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Philips Semiconductors Preliminary specification
Sound fader control circuit
for car radios
Table 2(a) Volume setting LEFT
G
V
DB VL5 VL4 VL3 VL2 VL1 VL0
+20111111
+18111110
+16111101
+14111100
+12111011
+10111010
+8111001
+6111000
+4110111
+2110110
0110101
−2110100
−4110011
−6110010
−8110001
−10110000
−12101111
−14101110
−16101101
−18101100
−20101011
−22101010
−24101001
−26101000
−28100111
−30100110
DATA
TEA6330T
G
V
DB VL5 VL4 VL3 VL2 VL1 VL0
−32100101
−34100100
−36100011
−38100010
−40100001
−42100000
−44011111
−46011110
−48011101
−50011100
−52011011
−54011010
−56011001
−58011000
−60010111
−62010110
−64010101
−66010100
mute
left
mute
left
--- --- ---
--- --- ---
--- --- ---
mute
left
010011
010010
000000
DATA
January 1992 13
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Philips Semiconductors Preliminary specification
Sound fader control circuit
for car radios
Table 2(b) Volume setting RIGHT
G
V
DB VR5 VR4 VR3 VR2 VR1 VL0
+20111111
+18111110
+16111101
+14111100
+12111011
+10111010
+8 111001
+6 111000
+4 110111
+2110110
0 110101
−2110100
−4110011
−6110010
−8110001
−10110000
−12101111
−14101110
−16101101
−18101100
−20101011
−22101010
−24101001
−26101000
−28100111
−30100110
DATA
TEA6330T
G
V
DB VR5 VR4 VR3 VR2 VR1 VL0
−32100101
−34100100
−36100011
−38100010
−40100001
−42100000
−44011111
−46011110
−48011101
−50011100
−52011011
−54011010
−56011001
−58011000
−60010111
−62010110
−64010101
−66010100
mute
right
mute
right
--- --- ---
--- --- ---
--- --- ---
mute
right
010011
010010
000000
DATA
January 1992 14
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Philips Semiconductors Preliminary specification
Sound fader control circuit
for car radios
Table 3(a)
Bass setting with equalizer passive (EQN =1)
G
V
DB D3 D2 D1 D0
+15 1 1 1 1
+15 1 1 1 0
+15 1 1 0 1
+15 1 1 0 0
+12 1 0 1 1
+9 1 0 1 0
+6 1 0 0 1
+3 1 0 0 0
00 1 1 1
−30 1 1 0
−60 1 0 1
−90 1 0 0
DATA
TEA6330T
Table 3(b)
Bass setting with equalizer active (EQN = 0)
G
V
DB D3 D2 D1 D0
+15 1 1 1 1
+15 1 1 1 0
+15 1 1 0 1
+15 1 1 0 0
+12 1 0 1 1
+91 0 1 0
+61 0 0 1
+31 0 0 0
00 1 1 1
00 1 1 0
00 1 0 1
00 1 0 0
DATA
−12 0 0 1 1
−12 0 0 1 0
−12 0 0 0 0
Table 4(a)
Treble setting with equalizer passive (EQN = 1)
G
V
DB D3 D2 D1 D0
+12 1 1 1 1
+12 1 1 1 0
+12 1 1 0 1
+12 1 1 0 0
+12 1 0 1 1
+91 0 1 0
+61 0 0 1
+31 0 0 0
00 1 1 1
−30 1 1 0
−60 1 0 1
−90 1 0 0
DATA
00 0 1 1
00 0 1 0
00 0 0 0
Table 4(b)
Treble setting with equalizer active (EQN = 0)
G
V
DB D3 D2 D1 D0
01 1 1 1
01 1 1 0
01 1 0 1
01 1 0 0
01 0 1 1
01 0 1 0
01 0 0 1
01 0 0 0
00 1 1 1
00 1 1 0
00 1 0 1
00 1 0 0
DATA
−12 0 0 1 1
−12 0 0 1 0
−12 0 0 0 0
January 1992 15
00 0 1 1
00 0 1 0
00 0 0 0
Page 16
Philips Semiconductors Preliminary specification
Sound fader control circuit
for car radios
Table 5(a) Fader function front
SETTING DATA
FRONT REAR
DB DB MFN FCH FA3 FA2 FA1 FA0
fader-off
00111111
00011111
fader-front
−20111110
−40111101
−60111100
−80111011
−10 0 111010
−12 0 111001
−14 0 111000
−16 0 110111
−18 0 110110
−20 0 110101
−22 0 110100
−24 0 110011
−26 0 110010
−28 0 110001
−30 0 110000
mute front
−84 0 011110
--- --- ---
--- --- ---
--- --- ---
−84 0 010000
TEA6330T
Table 5(b) Fader function rear
SETTING DATA
FRONT REAR
DB DB MFN FCH FA3 FA2 FA1 FA0
fader-off
0 0 101111
0 0 001111
fader rear
0 −2 101110
0 −4 1 01101
0 −6 1 01100
0 −8 1 01011
0 −101 01010
0 −121 01001
0 −141 01000
0 −161 00111
0 −181 00110
0 −201 00101
0 −221 00100
0 −241 00011
0 −261 00010
0 −281 00001
0 −301 00000
mute rear
0 −840 01110
--- --- ---
--- --- ---
--- --- ---
0 −840 00000
Table 6 Mute control
MUTE
CONTROL
active 1 outputs QLF, QLR, QRF
passive 0 no general mute
January 1992 16
DATA
GMU-BIT
REMARKS
and QRR are muted
Table 7 Equalizer
EQUALIZER
CONTROL
active 0 signal outputs for
passive 1 no general mute;
DATA
EQN-BIT
REMARKS
equalizer are pins 4 and
17, inputs are pins 6 and
15; Tables 3(b) and 4(b)
Tables 3(a) and 4(a)
Page 17
Philips Semiconductors Preliminary specification
Sound fader control circuit
for car radios
PACKAGE OUTLINE
SO20: plastic small outline package; 20 leads; body width 7.5 mm
D
c
y
Z
20
11
TEA6330T
SOT163-1
E
H
E
A
X
v M
A
pin 1 index
1
e
0 5 10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
A
max.
2.65
0.10
A
0.30
0.10
0.012
0.004
1
A2A
2.45
2.25
0.096
0.089
0.25
0.01
b
p
cD
0.32
0.23
0.013
0.009
3
0.49
0.36
0.019
0.014
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
10
w M
b
p
scale
(1)E(1) (1)
13.0
12.6
0.51
0.49
eHELLpQ
7.6
1.27
7.4
0.30
0.050
0.29
10.65
10.00
0.419
0.394
Q
A
2
A
1
1.4
0.055
1.1
0.4
0.043
0.016
detail X
1.1
1.0
0.043
0.039
(A )
L
p
L
0.25
0.01
A
3
θ
0.25 0.1
0.01
ywv θ
Z
0.9
0.4
8
0.004
0.035
0.016
0
o
o
OUTLINE
VERSION
SOT163-1
IEC JEDEC EIAJ
075E04 MS-013AC
REFERENCES
January 1992 17
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
Page 18
Philips Semiconductors Preliminary specification
Sound fader control circuit
for car radios
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
(order code 9398 652 90011).
TEA6330T
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
January 1992 18
Page 19
Philips Semiconductors Preliminary specification
Sound fader control circuit
TEA6330T
for car radios
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
January 1992 19
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