Preliminary specification
File under Integrated Circuits, IC01
1995 Dec 19
Page 2
Philips SemiconductorsPreliminary specification
Sound fader control circuitTEA6322T
FEATURES
• Source selector for three stereo and one differential
stereo input for remote sources
• The differential stereo input works optional as a fourth
stereo input and the common mode pin can be used as
well as an additional mono input
• Interface for noise reduction circuits
• Interface for external equalizer
• Volume, balance and fader control
• Output at volume I for external booster
• Special loudness characteristic automatically controlled
in combination with volume setting
• Bass and treble control
• Mute control at audio signal zero crossing
• Logic output to read mute status
2
• Fast mute control via I
C-bus
• Fast mute control via pin
• I2C-bus control for all functions
• Power supply with internal power-on reset
• Power-down indication.
GENERAL DESCRIPTION
The sound fader control circuit TEA6322T is an I
2
C-bus
controlled stereo preamplifier for car radio hi-fi sound
applications.
QUICK REFERENCE DATA
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
CC
I
CC
V
o(rms)
G
v
G
step(vol)
G
bass
G
treble
G
step(treble)
(S+N)/Nsignal-plus-noise to noise ratio V
supply voltage7.58.59.5V
supply currentVCC= 8.5 V−26−mA
maximum output voltage levelVCC= 8.5 V; THD ≤ 0.1% −2000−mV
voltage gain−86−+20dB
step resolution (volume)−1−dB
bass control−15−+15dB
treble control−12−+12dB
step resolution (bass, treble)−1.5−dB
= 2.0 V; Gv= 0 dB;
O
−105−dB
unweighted
RR
100
ripple rejectionV
r(rms)
< 200 mV;
−75−dB
f = 100 Hz; Gv=0dB
CMRRcommon mode rejection ratio
4353−dB
differential stereo input
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAMEDESCRIPTIONVERSION
TEA6322TVSO40plastic very small outline package; 40 leadsSOT158-1
1995 Dec 192
Page 3
1995 Dec 193
BLOCK DIAGRAM
Philips SemiconductorsPreliminary specification
Sound fader control circuitTEA6322T
OVL
V
GND
input
left
source
input
mono
source
input
right
source
CC
100 µF
47 µF
9 x 220 nF
C
KIN
26
38
3
4
24
20
18
16
14
17
27
25
23
21
POWER
SUPPLY
8.2 nF
220 nF
13
SOURCE
SELECTOR
220 nF
8.2 nF
C
C
20 kΩ
KVL
KVL
20 kΩ
2.2 kΩ
150 nF
1211
VOLUME I
+20 to −31 dB
LOUDNESS
LEFT
VOLUME I
+20 to −31 dB
LOUDNESS
RIGHT
150 nF
2.2 kΩ
33 nF
BASS
LEFT
± 15 dB
LOGIC
BASS
RIGHT
± 15 dB
33 nF
TREBLE
LEFT
± 12 dB
TREBLE
RIGHT
± 12 dB
5.6 nF
FUNCTION
ZERO CROSS
DETECTOR
TEA6322T
34333231293028
5.6 nF
+ 5 V
MUTE
4.7 kΩ
278910
VOLUME II
0 to −55 dB
BALANCE
FADER REAR
VOLUME II
0 to −55 dB
BALANCE
FADER FRONT
I2C-BUS
RECEIVER
VOLUME II
0 to −55 dB
BALANCE
FADER FRONT
VOLUME II
0 to −55 dB
BALANCE
FADER REAR
40
35
36
MHA084
MUTE
5
output
left
6
SCL
1
SDA
output
right
OVR
Fig.1 Block diagram.
handbook, full pagewidth
Page 4
Philips SemiconductorsPreliminary specification
Sound fader control circuitTEA6322T
PINNING
SYMBOLPINDESCRIPTION
SDA1serial data input/output
MUTE2mute control input and output
DGND3digital ground
AGND4analog ground
OUTLR5output left rear
OUTLF6output left front
TL7treble control capacitor left channel or input from external equalizer
B2L8bass control capacitor left channel or output to an external equalizer
B1L9bass control capacitor, left channel
OVL10output volume I, left channel
IVL11input volume I, left control part
ILL12input loudness, left control part
QSL13output source selector, left channel
IDL14input D left source
i.c.15COMM, common mode rejection adjust, centre position
ICL16input C left source
COM17common mode input / mono source input
IBL18input B left source
i.c.19COML, common mode rejection adjust, left position
IAL20input A differential source left
IAR21input A differential source right
i.c.22COMR, common mode rejection adjust, right position
IBR23input B right source
CAP24electronic filtering for supply
ICR25input C right source
V
ref
IDR27input D right source
QSR28output source selector right channel
ILR29input loudness right channel
IVR30input volume I, right control part
OVR31output volume I, right channel
B1R32bass control capacitor right channel
B2R33bass control capacitor right channel or output to an external equalizer
TR34treble control capacitor right channel or input from an external equalizer
OUTRF35output right front
OUTRR36output right rear
n.c.37not connected
V
CC
n.c.39not connected
SCL40serial clock input
26reference voltage (0.5 VCC)
38supply voltage
1995 Dec 194
Page 5
Philips SemiconductorsPreliminary specification
Sound fader control circuitTEA6322T
The volume control function is split into two sections:
The source selector allows either the source selection
between the differential stereo input (IAL, IAR and COM)
and three stereo inputs, or selection of four stereo inputs
and the mono input (COM). The maximum input signal
voltage is V
= 2 V. The outputs of the source selector
i(rms)
and the inputs of the following volume control parts are
available at pins 13 and 11 for the left channel and pins 28
and 30 for the right channel. This offers the possibility of
interfacing a noise reduction system.
The volume control part is following the source selector.
The signal phase from input volume control part to all
outputs is 180°.
volume I control block and volume II control block.
The control range of volume I is between +20 dB and
−31 dB in steps of 1 dB. The volume II control range is
between 0 dB and −55 dB in steps of 1 dB. Although the
theoretical possible control range is 106 dB
(+20 to −86 dB), in practice a range of 86 dB
(+20 to −66 dB) is recommended. The gain/attenuation
setting of the volume I control block is common for both
channels.
The volume I control block operates in combination with
the loudness control. The filter is linear when the maximum
gain for the volume I control (+20 dB) is selected. The filter
characteristic increases automatically over a range of
32 dB down to a setting of −12 dB. That means the
maximum filter characteristic is obtained at −12 dB setting
of volume I. Further reduction of the volume does not
further influence the filter characteristic (see Fig.5). The
maximum selected filter characteristic is determined by
external components. The proposed application gives a
maximum boost of 17 dB for bass and 4.5 dB for treble.
The loudness may be switched on or off via I2C-bus control
(see Table 7).
The volume I control block has an output pin and is
followed by the bass control block. A single external
capacitor of 33 nF for each channel in combination with
internal resistors, provides the frequency response of the
bass control (see Fig.3). The adjustable range is between
−15 and +15 dB at 40 Hz.
Both loudness and bass control result in a maximum bass
boost of 32 dB for low volume settings.
The treble control block offers a control range between
−12 and +12 dB in steps of 1.5 dB at 15 kHz. The filter
characteristic is determined by a single capacitor of 5.6 nF
for each channel in combination with internal resistors
(see Fig.4).
The basic step width of bass and treble control is 3 dB. The
intermediate steps are obtained by switching 1.5 dB boost
and 1.5 dB attenuation steps.
The bass and treble control functions can be switched off
via I2C-bus. In this event the internal signal flow is
disconnected. The connections B2L and B2R are outputs
and TL and TR are inputs for inserting an external
equalizer.
1995 Dec 195
Page 6
Philips SemiconductorsPreliminary specification
Sound fader control circuitTEA6322T
The last section of the circuit is the volume II block. The
balance and fader functions are performed using the same
control blocks. This is realized by 4 independently
controllable attenuators, one for each output. The control
range of these attenuators is 55 dB in steps of 1 dB with an
additional mute step.
The circuit provides 3 mute modes:
1. Zero crossing mode mute via I2C-bus using
2 independent zero crossing detectors
(ZCM, see Tables 2 and 9).
2. Fast mute via MUTE pin.
3. Fast mute via I2C-bus either by general mute (GMU,
see Tables 2 and 9) or volume II block setting
(see Table 4).
The mute function is performed immediately if ZCM is
cleared (ZCM = 0). If the bit is set (ZCM = 1) the mute is
activated after changing the GMU bit. The actual mute
switching is delayed until the next zero crossing of the
audio frequency signal. As the two audio channels (left and
right) are independent, two comparators are built-in to
control independent mute switches.
To avoid a large delay of mute switching when very low
frequencies are processed or the output signal amplitude
is lower than the DC offset voltage a second I2C-bus
transmission is needed. Both transmissions have the
same data and the second transmission a delay time of
e.g. 100 ms. The first transmission starts the zero cross
circuit, but second transmission moves the mute switch
immediately if the circuit has no zero cross detected.
The mute function can also be controlled externally. If the
mute pin is switched to ground all outputs are muted
immediately (except the outputs volume left and right (OVL
and OVR) and hardware mute). This mute request
overwrites all mute controls via the I2C-bus for the time the
pin is held LOW. The hardware mute position is not stored
in the TEA6322T.
The MUTE pin can also be used as output. The mute pin
voltage is LOW when all outputs are in mute position.
For the turn on/off behaviour the following explanation is
generally valid. To avoid AF output caused by the input
signal coming from preceding stages, which produces
output during drop of VCC, the mute has to be set, before
the VCC will drop. This can be achieved by I2C-bus control
or by grounding the MUTE pin.
For use where is no mute in the application before turn off,
a supply voltage drop of more than 1 × VBE will result in a
mute during the voltage drop.
The power supply should include a VCC buffer capacitor,
which provides a discharging time constant. If the input
signal does not disappear after turn off the input will
become audible after certain time. A 4.7 kΩ resistor
discharges the VCC buffer capacitor, because the internal
current of the IC does not discharge it completely.
The hardware mute function is favourable for use in Radio
Data System (RDS) applications. The zero crossing mute
avoids modulation plops. This feature is an advantage for
mute during changing presets and/or sources (e.g. traffic
announcement during cassette playback).
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
CC
V
n
supply voltage010V
voltage at pins 1, 2 and 5 to 40
mute position−10−µV
total continuous control range−106−dB
recommended control range−86−dB
step resolution−1−dB
step error between any adjoining
−−0.5dB
step
attenuator set errorGv= +20 to −50 dB−−2dB
G
=−51 to −66 dB−−3dB
v
gain tracking errorGv= +20 to −50 dB−−2dB
mute attenuationsee Fig.9100110−dB
att
DC step offset between any
adjoining step
DC step offset between any step to
mute
Gv=0to−66 dB−0.210mV
=20to0dB−215mV
G
v
G
=0to−66 dB−−10mV
v
G
=20to0dB−−40mV
v
G
=0to−31 dB;
v
−−17mV
loudness on
Volume I control and loudness
CR
G
G
L
vol
v
step
Bmax
continuous volume control range−51−dB
voltage gain−31−+20dB
step resolution−1−dB
maximum loudness boostloudness on; referred to
loudness off; boost is
determined by external
components
f = 40 Hz−17−dB
f = 10 kHz−4.5−dB
Bass control
G
bass
bass control, maximum boostf = 40 Hz141516dB
maximum attenuationf = 40 Hz141516dB
G
step
step resolution (toggle switching)f = 40 Hz−1.5−dB
step error between any adjoining
f = 40 Hz−−0.5dB
step
V
offset
DC step offset in any bass position−−20mV
1995 Dec 199
Page 10
Philips SemiconductorsPreliminary specification
Sound fader control circuitTEA6322T
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Treble control
G
treble
G
step
V
offset
Volume II, balance and fader control
CRcontinuous attenuation fader and
G
step
treble control, maximum boostf = 15 kHz111213dB
maximum attenuationf = 15 kHz111213dB
maximum boostf > 15 kHz−−15dB
step resolution (toggle switching)f = 15 kHz−1.5−dB
step error between any adjoining
f = 15 kHz−−0.5dB
step
DC step offset in any treble position−−10mV
53.55556.5dB
volume control range
step resolution−12dB
attenuation set error−−1.5dB
Mute function
V
muteLOWI
input level for fast mute detection−−1.0V
input level for no mute detection2.2−−V
V
muteLOWO
V
muteHIGH
V
CCdrop
Power-on reset (when reset is active the GMU-bit (general mute) is set and the I
output level for muteI ≤ 1 mA; CL≤ 100 pF−−0.4V
pull-up voltageopen collector−−VCCV
supply drop to V
for mute active−−0.7−V
CAP
2
C-bus receiver is in
reset position)
V
CC
increasing supply voltage start of
−−2.5V
reset
end of reset5.26.57.2V
decreasing supply voltage start of
4.25.56.2V
reset
Digital part (I
V
iH
V
iL
I
iH
I
iL
V
oL
2
C-bus pins); note 3
HIGH level input voltage3−9.5V
LOW level input voltage−0.3−+1.5V
HIGH level input currentVCC= 0 to 9.5 V−10−+10µA
LOW level input current−10−+10µA
LOW level output voltageIL=3mA−−0.4V
Notes to the characteristics
1. The indicated values for output power assume a 6 W power amplifier at 4 Ω with 20 dB gain and a fixed attenuator
of 12 dB in front of it. Signal-to-noise ratios exclude noise contribution of the power amplifier.
2. The transmission contains: total initialization with MAD and subaddress for volume and 8 data words, see also
definition of characteristics, clock frequency = 50 kHz, repetition burst rate = 400 Hz, maximum bus signal
amplitude = 5 V (p-p).
3. The AC characteristics are in accordance with the I2C-bus specification. This specification, “
use it
”, can be ordered using the code 9398 393 40011.
The I2C-bus and how to
1995 Dec 1910
Page 11
Philips SemiconductorsPreliminary specification
Sound fader control circuitTEA6322T
I2C-BUS PROTOCOL
2
C-bus format
I
(1)
S
SLAVE ADDRESS
Notes
1. S = START condition.
2. SLAVE ADDRESS (MAD) = 1000 0000.
3. A = acknowledge, generated by the slave.
4. SUBADDRESS (SAD), see Table 1.
5. DATA, see Table 1; if more than 1 byte of DATA is transmitted, then auto-increment of the significant subaddress is
performed.
6. P = STOP condition.
Table 1 Second byte after MAD
(2)
(3)
A
SUBADDRESS
(4)
(3)
A
DATA
(5)
(3)
A
(6)
P
FUNCTIONBIT
765432
(1)
(1)
1
(1)
0
Volume/loudnessV00000000
Fader front rightFFR00000001
Fader front leftFFL00000010
Fader rear rightFRR00000011
Fader rear leftFRL00000100
BassBA00000101
TrebleTR00000110
SwitchS00000111
Note
1. Significant subaddress.
MSBLSB
1995 Dec 1911
Page 12
Philips SemiconductorsPreliminary specification
Sound fader control circuitTEA6322T
Table 2 Definition of third byte after MAD and SAD
FUNCTIONBIT
MSBLSB
76543210
Volume/loudnessVZCM
(1)
Fader front rightFFR00FFR5
Fader front leftFFL00FFL5
Fader rear rightFRR00FRR5
Fader rear leftFRL00FRL5
LOFF
(2)
V5
(3)
(6)
(8)
(5)
(7)
FFR4
FFL4
FRR4
FRL4
BassBA000BA4
TrebleTR000TR4
SwitchSGMU
(11)
0000SC2
Notes
1. Zero crossing mode.
2. Switch loudness on/off.
3. Volume control.
4. Don’t care bits (logic 1 during testing).
5. Fader control front right.
6. Fader control front left.
7. Fader control rear right.
8. Fader control rear left.
9. Bass control.
10. Treble control.
11. Mute control for all outputs except OVL and OVR (general mute).
12. Source selector control.
V4
(3)
(9)
(10)
(6)
(8)
(5)
(7)
V3
FFR3
FFL3
FRR3
FRL3
BA3
TR3
(3)
(10)
(9)
(6)
(5)
(7)
(8)
V2
FFR2
FFL2
FRR2
FRL2
BA2
TR2
(3)
(9)
(10)
(12)
(6)
(8)
(5)
(7)
V1
FFR1
FFL1
FRR1
FRL1
BA1
TR1
SC1
(3)
(9)
(10)
(12)
(6)
(8)
(5)
(7)
V0
FFR0
FFL0
FRR0
FRL0
BA0
TR0
SC0
(3)
(5)
(6)
(7)
(8)
(9)
(10)
(12)
1995 Dec 1912
Page 13
Philips SemiconductorsPreliminary specification
Sound fader control circuitTEA6322T
Table 3 Volume I setting
G
v
(dB)
Loudness on: the increment of the loudness characteristics is linear at every volume step in the range from
+20 to −11 dB
3. The last eight treble control data words select treble output.
4. The last treble control and bass control data words (00000) enable the external equalizer connection.
1995 Dec 1918
Page 19
Philips SemiconductorsPreliminary specification
Sound fader control circuitTEA6322T
Table 7 Loudness setting
CHARACTERISTICDATA LOFF
With loudness0
Linear1
Table 8 Selected input
FUNCTION
SC2SC1SC0
Stereo inputs IAL and IAR111
Stereo inputs IBL and IBR110
Stereo inputs ICL and ICR101
Stereo inputs IDL and IDR100
(Stereo inputs) IAL and IAR011
Differential inputs IAL, IAR
and COM
No input (input mute)001
Mono input COM000
DATA
010
Table 9 Mute mode
FUNCTION
Direct mute off00
Mute off delayed until the next zero
crossing
Direct mute10
Mute delayed until the next zero
crossing
DATA
GMUZCM
01
11
1995 Dec 1919
Page 20
Philips SemiconductorsPreliminary specification
Sound fader control circuitTEA6322T
18
handbook, full pagewidth
G
bass
(dB)
12
6
0
−6
−12
−18
10
MED423
2
10
3
10
f (Hz)
4
10
Fig.3 Bass control.
15
handbook, full pagewidth
G
treble
(dB)
10
5
0
−5
−10
−15
10
32
10
Fig.4 Treble control.
MED424
4
10
f (Hz)
5
10
1995 Dec 1920
Page 21
Philips SemiconductorsPreliminary specification
Sound fader control circuitTEA6322T
20
handbook, full pagewidth
G
v
(dB)
10
0
−10
−20
−30
−40
10
2
10
3
10
4
10
Fig.5 Volume control with loudness (including low roll-off frequency).
f (Hz)
MED425
5
10
100
handbook, full pagewidth
S/N
(dB)
90
80
70
60
50
−4
10
(1) Vi= 2.0V.
(2) Vi= 0.5V.
(3) Vi= 0.2V.
−3
10
−2
10
−1
10
1
Fig.6 Signal-to-noise ratio; noise weighted: CCIR468-2, quasi peak.
(1) Symmetrical input; loudness on.
(2) Symmetrical input; loudness off.
(3) Stereo/mono inputs; loudness on.
(4) Stereo/mono inputs; loudness off.
Fig.8 Noise output voltage; CCIR468-2, quasi peak.
(1)
(2)
(3)
(4)
gain (dB)
MHA086
30
1995 Dec 1922
Page 23
Philips SemiconductorsPreliminary specification
Sound fader control circuitTEA6322T
−60
handbook, full pagewidth
(dB)
−80
−100
−120
−140
MED429
2
10
3
10
2 x 10
3
5 x 10
3
4
10
f (Hz)
2 x 10
45020500200
Fig.9 Muting.
1995 Dec 1923
Page 24
Philips SemiconductorsPreliminary specification
Sound fader control circuitTEA6322T
If the 20 dB gain is not required for the maximum volume
position, it will be an advantage to use the maximum boost
gain and then increased attenuation in the last section,
Volume II.
handbook, halfpage
TEA6322T
= 200 mV
I(min)
Vo = 2 V for P
Therefore the loudness will be at the correct place and a
lower noise and offset voltage will be achieved.
POWER STAGE
G = 20 dB
P
= 100 W at 4 ΩV
(max)
(max)
MHA087
a.
a.Gain volume I =20 dB (G
b.Gain volume I = 20 dB (G
handbook, halfpage
= 200 mV
I(min)
TEA6322T
Vo = 1 V for P
POWER STAGE
G = 26 dB
P
= 100 W at 4 ΩV
(max)
(max)
MHA088
b.
); gain volume II = 0 dB; fader and balance range = 55 dB.
v(max)
); gain volume II = −6 dB global setting; fader and balance range now 49 dB, previously 55 dB.
v(max)
Fig.10 Level diagram.
1995 Dec 1924
Page 25
Philips SemiconductorsPreliminary specification
Sound fader control circuitTEA6322T
handbook, full pagewidth
+
V
CC
8.5 V
9 × 220 nF
9 × 600 Ω
V
P
4.7 kΩ
inputs
470 µF
20
18
16
14
17
27
25
23
21
38
TEA6322T
42426
3
47
Fig.11 Turn-on/off power supply circuit diagram.
+8.5 V to
oscilloscope
5
6
35
36
outputs to
oscilloscope
4 × 4.7 µF
100
µFµF
4 × 10 kΩ
MHA089
10
handbook, full pagewidth
(V)
8
6
4
2
0
01234
(1) VCC.
(2) VO.
(1)
(2)
Fig.12 Turn-on/off behaviour.
t (s)
MED433
5
1995 Dec 1925
Page 26
Philips SemiconductorsPreliminary specification
Sound fader control circuitTEA6322T
handbook, full pagewidth
V
P
10 kΩ
VCC = 8.5 V
1000 µF
0.2 V (RMS)
0.1 µF
600 Ω
100 µF
47 µF
220 nF
220 nF33 nF
13 119872
26
38
3
4
24
input A to D left and right
and input mono
28 30333432
33 nF220 nF
5.6 nF
TEA6322T
5.6 nF
Fig.13 Test circuit for power supply ripple rejection (RR).
+5 V
4.7 kΩ
output right
output left
front and rear
40
1
MHA090
4.7 µF
SCL
SDA
V
O
handbook, full pagewidth
V
p
470 µF
V
V
i
= 8.5 V
CC
0.1 µF
600 Ω
100 µF
47 µF
220 nF
220 nF
220 nF33 nF
13 119872
26
38
3
4
24
input A to D right and left
input A to D left and right
and input mono
28 30333432
33 nF220 nF
5.6 nF
TEA6322T
front and rear
5.6 nF
Fig.14 Test circuit for channel separation (αcs).
+5 V
4.7 kΩ
output left
output right
40
1
MHA091
4.7 µF
SCL
SDA
V
O
1995 Dec 1926
Page 27
Philips SemiconductorsPreliminary specification
Sound fader control circuitTEA6322T
Loudness filter calculation example
Figure 15 shows the basic loudness circuit with an
external low-pass filter application. R1 allows an
attenuation range of 21 dB while the boost is determined
by the gain stage V2. Both result in a loudness control
range of +20 to −12 dB.
Defining f
as the frequency where the level does not
ref
change while switching loudness on/off. The external
resistor R3 for f
=
R3R1
--------------------110
→∞ can be calculated as:
ref
G
v
------ 20
10
–
. With G
G
v
------ 20
= −21 dB and R1 = 33 kΩ,
v
R3 = 3.2 kΩ is generated.
For the low-pass filter characteristic the value of the
external capacitor C1 can be determined by setting a
specific boost for a defined frequency and referring the
If a loudness characteristic with additional high frequency
boost is desired, an additional high-pass section has to be
included in the external filter circuit as indicated in the
block diagram. A filter configuration that provides
AC coupling avoids offset voltage problems.
1995 Dec 1927
Page 28
Philips SemiconductorsPreliminary specification
Sound fader control circuitTEA6322T
INTERNAL PIN CONFIGURATIONS
Values shown in Figs 16 to 28 are typical DC values;
VCC= 8.5 V.
5
+
1
5 V
1.8 kΩ
80 Ω
MBE900
4.25 V
Fig.16 Pin 1: SDA (I2C-bus data).
7
4.25 V
+
2.4 kΩ
MHA094
+
MHA093
Fig.17 Pins 5, 6, 10, 31, 35, 36: output signals.
+
8
4.25 V
80 Ω
MHA095
Fig.18 Pins 7 and 34: treble control capacitors.
1995 Dec 1928
Fig.19 Pins 8 and 33: bass control capacitor outputs.
Page 29
Philips SemiconductorsPreliminary specification
Sound fader control circuitTEA6322T
9
4.16 kΩ
4.25 V
+
11
4.25 V
+
9.4 kΩ
4.25 V
MHA096
Fig.20 Pins 9 and 32: bass control capacitor inputs.
12
4.25 V
+
150 kΩ
4.25 V
MHA097
Fig.21 Pins 11 and 30: input volume 1, control part.
+
13
4.25 V
1.12 kΩ
MHA098
Fig.22 Pins 12 and 29: input loudness, control part.
Fig.26 Pin 24: filtering for supply; pin 26: reference voltage.
38
apply +8.5 V to this pin
MHA103
Fig.27 Pin 38: supply voltage.
1995 Dec 1930
MHA101
40
5 V
1.8 kΩ
MHA104
Fig.28 Pin 40: SCL (I2C-bus clock).
Page 31
Philips SemiconductorsPreliminary specification
Sound fader control circuitTEA6322T
PACKAGE OUTLINE
VSO40: plastic very small outline package; 40 leads
D
y
Z
40
pin 1 index
SOT158-1
E
c
H
E
21
A
2
A
1
L
p
L
A
X
v M
A
Q
(A )
A
3
θ
1
b
(1)E(2)
7.6
7.5
0.30
0.29
p
scale
0.7622.25
0.030.089
e
0510 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
OUTLINE
VERSION
SOT158-1
A
max.
2.70
0.11
0.3
0.1
0.012
0.004
A
b
0.42
0.30
p
0.0087
0.0055
cD
0.22
15.6
0.14
15.2
0.61
0.60
REFERENCES
2
3
2.45
0.25
2.25
0.096
0.089
IEC JEDEC EIAJ
0.010
0.017
0.012
UNITA1A
inches
Notes
1. Plastic or metal protrusions of 0.4 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
1995 Dec 1931
20
w M
eHELLpQywvθ
12.3
11.8
0.48
0.46
1.7
1.5
0.067
0.059
detail X
1.15
0.2
1.05
0.045
0.0080.004
0.041
EUROPEAN
PROJECTION
0.10.1
0.004
(1)
Z
0.6
0.3
0.024
0.012
ISSUE DATE
92-11-17
95-01-24
o
7
o
0
Page 32
Philips SemiconductorsPreliminary specification
Sound fader control circuitTEA6322T
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
Reflow soldering
Reflow soldering techniques are suitable for all VSO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
(order code 9398 652 90011).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
Wave soldering
Wave soldering techniques can be used for all VSO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
1995 Dec 1932
Page 33
Philips SemiconductorsPreliminary specification
Sound fader control circuitTEA6322T
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I
2
C COMPONENTS
Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
2
C components conveys a license under the Philips’ I2C patent to use the
1995 Dec 1933
Page 34
Philips SemiconductorsPreliminary specification
Sound fader control circuitTEA6322T
NOTES
1995 Dec 1934
Page 35
Philips SemiconductorsPreliminary specification
Sound fader control circuitTEA6322T
NOTES
1995 Dec 1935
Page 36
Philips Semiconductors – a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428)
BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. (02)805 4455, Fax. (02)805 4466
Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213,
Tel. (01)60 101-1236, Fax. (01)60 101-1211
Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands,
All rights are reserved. Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation
or contract, is believed to be accurate and reliable and may be changed without
notice. No liability will be accepted by the publisher for any consequence of its
use. Publication thereof does not convey nor imply any license under patent- or
other industrial or intellectual property rights.
Printed in The Netherlands
513061/1100/01/pp36Date of release: 1995 Dec 19
Document order number:9397 750 00535
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