Datasheet TEA1566 Datasheet (Philips)

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INTEGRATED CIRCUITS

DATA SH EET

TEA1566

GreenChip; SMPS module

Preliminary specification
File under Integrated Circuits, IC11

1999 Apr 20

Philips Semiconductors Preliminary specification

GreenChip; SMPS module TEA1566

FEATURES
Distinctive features

• High level of integration results in 20 to 50 fewer
components compared to a power supply with discrete
components

• On-chip 600 V MOSFET

• On/off function replaces expensive mains switch with

functional switch

• Direct off-line operation (90 to 276 VAC)

• On-chip 5% accurate oscillator.

Green features

• Low power consumption in off-mode (<100 mW)

• On-chip efficient start-up current source giving fast

start-up

• Burst mode stand-by (<2 W) for overall improved
system efficiency

• Low power operation mode with lower frequency to
reduce switching losses.

Protection features

APPLICATIONS

mains

TEA1566

9

8

7

6

5

4

3

2

1

output

Vin

NC

OOB

Dem

Gnd

Vctrl

Iref

Vaux

Isense

• Demagnetization protection

• Cycle by cycle current limitation with programmable

current trip level

• Over voltage protection

• Over temperature protection

• Safe-restart mode with reduced power for system fault

conditions.

Highly versatile

• Usable in Buck and flyback topology

• Interfaces both primary and secondary side feedback.

MGR691

Fig.1 Typical flyback application.

GENERAL DESCRIPTION

The GreenChip, intended for off-line 90 to 276 VAC
power supply applications, is a monolithic high voltage
family of ICs that combines analog and digital circuits to
implement all necessary control functions for a switched
mode power supply. The functions include integrated high
voltage start-up current source, voltage mode PWM
control, 5% accurate trimmed oscillator, band gap derived
reference voltages, comprehensive fault protection, and
leading edge blanking. High level of integration leads to
cost effective power supplies that are compact, weigh less,
and at the same time give higher efficiency, are more
reliable and simple to design. Efficient green features lead
to very low power operation modes and a novel on/off
function helps replace the expensive mains switch with a
low cost functional switch.

1999 Apr 20 2

Philips Semiconductors Preliminary specification

GreenChip; SMPS module TEA1566

ORDERING INFORMATION

TYPE NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TEA1566S SIL9P plastic single in-line power package; 9 leads SOT131-2
TEA1566J DBS9P plastic DIL-bent-SIL power package; 9 leads (lead length12 mm) SOT157-2

BLOCK DIAGRAM

handbook, full pagewidth

OOB

Vaux

VAUX

ON/OFF

1 kΩ

7

MANAGEMENT

CURRENT SOURCE

START-UP

TEA1566

VinIref

923

Vctrl

Dem

4

6

5.5 V

SAMPLE

AND

HOLD1

DEMAGNETIZATION

NEGATIVE

CLAMP

burst mode
stand-by

TEMPERATURE

MANAGEMENT

OVER

PROTECTION

SAMPLE

AND

HOLD2

amplifier

OSCILLATOR

Fig.2 Block diagram.

error

5

Gnd

PWM

comparator

R

Q

S

OVER CURRENT

PROTECTION

LEADING EDGE

BLANKING

FREQUENCY

CONTROL

81

NC

driver
stage

power

MOSFET

6 Ω

MGR692

Isense

1999 Apr 20 3

Philips Semiconductors Preliminary specification

GreenChip; SMPS module TEA1566

PINNING

SYMBOL PIN DESCRIPTION

Isense 1 programmable current sense

resistor
Vaux 2 IC supply capacitor
Iref 3 reference resistor for setting

internal reference currents
Vctrl 4 feedback voltage for duty cycle

control
Gnd 5 ground
Dem 6 demagnetization input signal from

primary side auxiliary winding
OOB 7 on/off/burst mode input signal
NC 8 not connected
Vin 9 MOSFET drain connection

handbook, halfpage

Isense

Vaux

Iref

Vctrl

Gnd

Dem

OOB

NC
Vin

1
2
3
4
5
6
7
8
9

TEA1566

MGR693

Fig.3 Pin configuration.

FUNCTIONAL DESCRIPTION

The GreenChip family of ICs are highly integrated, with
most common PWM functions like error amplifier,
oscillator, bias current generator, and band gap based
reference voltage circuits fully integrated in the ICs.
High level of integration leads to easy and cost effective
design of power supplies.The ICs have been fabricated in
a Philips proprietary high voltage BCDMOS process that
enables devices of up to 720 V to be fabricated on the
same chip with low voltage circuitry.

An efficient on-chip start-up circuit enables fast start-up
and dissipates negligible power after start up. On-chip
accurate oscillator generates a saw tooth waveform which
is used by the voltage mode feedback control circuitry to
generate a pulse width modulated signal for driving the
gate of the power MOSFET. A novel regulation scheme is
used to implement both primary and secondary side
regulation to minimize external component count.
Protection features like over voltage, over current, over
temperature, and demagnetization protection, give
comprehensive safety against system fault conditions.
The GreenChip offers some advanced features that
greatly enhance the efficiency of the overall system.
Off-mode reduces the power consumption of the IC below
100 mW. Burst mode stand-by reduces the power
consumption of the system to below 2 W. Low power
operation mode reduces the operating frequency of the
system, when the system is working under low load
conditions, to reduce the switching losses.

Start-up current source and Vaux management

A versatile on-chip start-up current source makes an
external, highly dissipating, trickle-charge circuit
unnecessary. See Fig.2 for the block diagram of the IC.

The start-up current source derives power from the mains
via pin Vin (drain). It supplies current (see symbols
‘Istart-low’ and ‘Istart-high’ of Chapter “Characteristics”) to
charge the Vaux (IC supply) capacitor and at the same
time provides current to the control circuitry of the IC. Once
the Vaux capacitor is charged to its start-up voltage level
(11 V), the on-chip oscillator starts oscillating and the IC
starts switching the power MOSFET. Power is then
supplied to the load capacitor via the secondary winding.

Figure 1 shows a typical flyback application diagram.
The Vaux capacitor is also supplied by an auxiliary
winding on the primary side. This winding is coupled to the
secondary side winding supplying the output capacitor.
As the output capacitor voltage increases and approaches
its nominal value, the re-supply of the Vaux capacitor is
done by the auxiliary winding. Figure 4 shows relevant
waveforms at start-up. For successful take over of supply
of Vaux capacitor by the auxiliary winding, it is important
that the re-supply of Vaux capacitor starts before its
voltage drops to its Under Voltage Lockout (UVLO) level of

8.05 V of the system and stops delivering power to the
output.

1999 Apr 20 4

Philips Semiconductors Preliminary specification

GreenChip; SMPS module TEA1566

In case of output short circuit, the Vaux capacitor is no
longer supplied by the auxiliary winding and its voltage
drops till it reaches the UVLO level. If the output is an open
circuit, the output voltage will rise till it reaches the Over
Voltage Protection (OVP) level. The IC will detect this state
and stop switching.

In absence of switching of the power device, the Vaux
capacitor will not be re-supplied and its voltage will drop till
it reaches UVLO level. Once the Vaux voltage drops to
UVLO level, the start-up current source is re-activated and
it charges the Vaux capacitor to its start level and the
system goes through a cycle similar to the start-up cycle.

Figure 5 shows the relevant waveforms during safe-restart
mode. The charging current (see symbol ‘Irestart-prot’ in
Chapter “Characteristics”) from the start-up circuit during
the safe-restart mode is lower than the normal start-up
current (see symbol ‘Istart-high’ in
Chapter “Characteristics”) in order to implement a low
“hiccup” duty cycle. This helps insure devices on the
output secondary winding do not get destroyed during
output short circuit, violating safety conditions.
The start-up current source also plays a key role in
implementation of burst mode stand-by (see symbol
‘Irestart-stby’ in Chapter “Characteristics”), which will be
explained later.

Vaux

Vout

Vgate

(1) Start-up current charges capacitor V
(2) Charging of capacitor V

11 V

(2)

8.05 V

(1)

switchingoff

.

is taken-over by the auxiliary winding.

aux

aux

Fig.4 Normal start-up waveforms.

t

t

t

MGR694

handbook, full pagewidth

(1) Start-up current source charges capacitor V

Vaux

Vgate

normal operation

.

aux

fault condition

(1)

switching off

Fig.5 Safe-start mode waveforms.

1999 Apr 20 5

MGR695

t

t

Philips Semiconductors Preliminary specification

GreenChip; SMPS module TEA1566

Reference

All reference voltages are derived from a temperature
compensated, on-chip, band gap. The band gap reference
voltage is also used, together with an external resistor
connected at pin Iref, to generate accurate, temperature
independent, bias currents in the chip:

V

REF

I

REF

=

------------- ­R

REF

[A]

The frequency of the controller is also set by the reference
resistor Rref (also see Section “Oscillator”).

Sample and hold

GreenChip ICs employ voltage mode feedback for
regulating the output voltage. In primary feedback mode, a
novel sample and hold circuit is used. The sample and
hold circuit works by sampling the current into pin Dem,
which is related to the output voltage via Rdem, during the
time that the secondary current is flowing:

a × V

V

dem+

out=Iref

× R

dem+Vdem+

where:

is specified in chapter “Characteristics”

a = a constant determined by turn ratio of the
transformer.

This sampled current information is stored on the external
capacitor connected to pin Vctrl. The pulse width
modulator uses this voltage information to set the duty
cycle of operation for the power MOSFET. In secondary
feedback, the feedback voltage is provided by an
opto-coupler.

Oscillator

The oscillator is used to set the switching duty cycle by
comparing the oscillator ramp to the output of the error
amplifier in the pulse width modulator circuit.The oscillator
is fully integrated and works by charging and discharging
an internal capacitor between two voltage levels to create
a sawtooth waveform with a rising edge which is 80% of
the oscillator cycle. This ratio is used to set a maximum
switching duty cycle of 80% for the IC. The oscillator is
internally trimmed to 5% accuracy. The oscillator
frequency can be adjusted between 50 to 100 kHz
(see symbol f

osc-h-range

in Chapter “Characteristics”) by
changing the external reference resistor (see symbol Rref
in Chapter “Characteristics”) that sets the chip bias
currents. This gives additional flexibility to the power
supply designer in the choice of his system
components.The frequency is correlated with the value of
the reference resistor Rref (see Fig.6).

In Chapter “Characteristics” f

osc-typical

osc-l

and f

osc-h

and

, f

the Rref operating resistor range are specified.

MGR936

110

handbook, halfpage

high

frequency

(kHz)

90

55

low

frequency

(kHz)

45

Pulse width modulator

The pulse width modulator, which is made up of an
inverting error amplifier and a comparator (see Fig.2),
drives the power MOSFET with a duty cycle which is
inversely proportional to the voltage on pin Vctrl.
In primary feedback mode, this is the voltage on the
sample and hold capacitor and in secondary feedback
mode, this voltage is provided by an opto-coupler. A signal
from the oscillator sets a latch that turns on the power
MOSFET. The latch is reset by the signal from the pulse
width modulator or by the duty cycle limiting circuit.
The latching PWM mode of operation prevents multiple
switching of the power switch. The maximum duty cycle is
set internally at 80%.

Figure 7 shows the normal switching operation of the IC.

1999 Apr 20 6

70

50

30

10 20 30 40

(1) High frequency mode.
(2) Low frequency mode.

(1)

(2)

Fig.6 Frequency as function of the R

R

REF

(kΩ)

REF

35

25

15

value.

Philips Semiconductors Preliminary specification

GreenChip; SMPS module TEA1566

Multi frequency control

The oscillator is also capable of working at a lower
frequency (see f

in Chapter “Characteristics”). A ratio

osc-l

of 1 : 2.5 is maintained between high and low frequency of
the oscillator. Low frequency operation is invoked if the
power supply is working at or below one ninth of its peak
power. By working at a lower frequency, the switching
losses in the power supply are reduced. A novel scheme
is used to ensure that the transfer of high to low frequency
and vice versa has no effect on the regulation of the output
voltage.

Gate driver

The gate driver has a totem-pole output stage that has
current sourcing capability of 120 mA and a current sink
capability of 550 mA. This is to enable fast turn on and turn
off of the power device for efficient operation.

A lower driver source current has been chosen in order to
limit the ∆V/∆t at switch-on. This is advantageous for EMI
(ElectroMagnetic Interference) and reduces the current
spike across Rsense.

Demagnetization protection

This feature guarantees discontinuous conduction mode
operation for the power supply which simplifies the design
of feedback control and gives faster transient response.

Demagnetization protection is an additional protection
feature that protects against saturation of the
transformer/inductor. Demagnetization protection also
protects the power supply components against excessive
stresses at start-up, when all energy storage components
are completely discharged. The converter is cycle by cycle
protected during shorted output system fault condition due
to the demagnetization protection. The value of the
demagnetization resistor (R

) can be calculated with the

dem

formula given in Section “Sample and hold”.

Negative clamp

The negative clamp circuit does not let the voltage on
pin Dem go below −0.4 V, when the auxiliary winding
voltage goes negative during the time that the power
device is turned on, to ensure correct operation of the IC.

Over voltage protection

An Over Voltage Protection (OVP) mode has been
implemented in the GreenChip series. This circuit works
by sensing the Vaux voltage. If the output voltage exceeds
the preset voltage limit, the OVP circuit turns off the power
MOSFET. With no switching of the power device, the Vaux
capacitor is not re-supplied and discharges to UVLO level
and the system goes into the low dissipation safe-restart
mode described earlier. The system recovers from the
safe-restart mode only if the OVP condition is removed.

Over current protection

Cycle by cycle Over Current Protection (OCP) is provided
by sensing the voltage on an external resistor which is
connected to the source of the power MOSFET.
The voltage on the current sense resistor, which reflects
the amplitude of the primary current, is compared
internally with a reference voltage using a high speed
comparator. This threshold voltage is specified as V

th(Imax)

in the chapter “Characteristics”. The maximum primary

V

(protection) current is therefore: [A]

I

prot

th Imax()

=

-----------------------­R

sense

If the power device current exceeds the current limit, the
comparator trips and turns off the power device.
The power device is typically turned off in 210 ns
(see tDin Chapter “Characteristics”).

The availability of the current sense resistor off-chip for
programming the OCP trip level increases design flexibility
for the power supply designer. An off-chip current sense
resistor also reduces the risk of an OCP condition being
sensed incorrectly. At power MOSFET turn-on the
∆V/∆t limiters capacitance discharge current does not
have to flow through the sense resistor, because this
capacitor can be connected between drain and source of
the power MOSFET directly.

The Leading Edge Blanking (LEB) circuit works together
with the OCP circuit and inhibits the operation of the OCP
comparator for a short duration (see t

LEB

in
Chapter “Characteristics”) when the power device is
turned on. This ensures that the power device is not turned
off prematurely due to false sensing of an OCP condition
because of current spikes caused by discharge of
primary-side snubber and parasitic capacitances.
LEB time is not fixed and it tracks the oscillator frequency.

1999 Apr 20 7

Philips Semiconductors Preliminary specification

GreenChip; SMPS module TEA1566

Over temperature protection

Protection against excessive temperature is provided by
an analog temperature sensing circuit that turns off the
power device when the temperature exceeds typically
140 °C.

On/off mode

The expensive mains switch can be replaced by an
in-expensive functional switch by using the on/off mode.
Figure 13 shows a flyback converter configured to use the
on/off mode. Depending upon the position of switch S1,
either voltage close to ground or a voltage of greater than
typical 2.5 V exists on pin OOB.

The difference between these voltages is detected
internally by the IC. The IC goes into the off-mode if the
voltage is low, where it consumes a current of typical
350 µA (see Iin-off in Chapter “Characteristics”). If the
voltage on pin OOB is typically 2.5 V (see Von/off in
Chapter “Characteristics”), the IC goes through the
start-up sequence and commences normal operation.

In Fig.14 a Mains Under Voltage Lock Out (MUVLO)
function has been created using 3 resistors. Assuming that
R3 is chosen very high ohmic, the GreenChip™ starts

operating if:

V

MAINS

R1

------- ­R2

V

OOB

R1 R2»()×≈

Burst mode stand-by

Pin OOB is also used to implement the burst mode
stand-by. In burst mode stand-by, the power supply goes
into a special low dissipation state where it typically
consumes less than 2 W of power. Figure 14 shows a
flyback converter using the burst mode stand-by feature.
The system enters burst mode when the microcontroller
closes switches S2 and S3 on the secondary side.
Switch S2 shorts the output capacitor to the voltage level
of the microcontroller capacitor. The output secondary
winding now supplies the microcontroller capacitor. When
the voltage on the microcontroller capacitor exceeds the
zener voltage (V

) the opto-coupler is activated which

z

sends a signal to pin OOB. In response to this signal, the
IC stops switching and goes into a “hiccup” mode.

Figure 7 shows the burst-mode operation graphically.
The hiccup mode during burst mode operation differs from
the hiccup in safe-restart mode during system fault. For
safe restart mode, the power has to be reduced. For burst
mode, sufficient power to supply the microcontroller has to
be delivered. To prevent transformer rattle, the
transformer peak current is reduced by a factor of 3.
Burst mode stand-by operation continues till the
microcontroller opens switches S2 and S3. The system
then goes through the start-up sequence and commences
normal switching behaviour.

In this way it is assured that the power supply only starts
working above a Vmains of e.g. 80 V. The bleeder current
through R1 should be low (e.g. 30 µA at 300 V).

1999 Apr 20 8

Philips Semiconductors Preliminary specification

GreenChip; SMPS module TEA1566

handbook, full pagewidth

Vin

Vin

Vdrain

Vout

Vaux

Vgate

Iaux

burst mode

VµP

0

(1)

start up

sequence

normal

operation

over voltage

protection

output short

circuit

burst mode stand-by

normal

operation

MGR696

(1) All negative currents are currents out the chip.

Fig.7 Typical waveforms.

1999 Apr 20 9

Philips Semiconductors Preliminary specification

GreenChip; SMPS module TEA1566

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); unless noted all voltages are measured with
respect to pin GND.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

I(max)

I

D

V

OOB

I

OOB

I

demag

V

ctrl

V

lsense

I

ref

V

aux

T

j

T

stg

V

es

maximum DC input voltage − 600 V

during inductive turn-off;

− 720 V

note 1
supply current − 7A
mode detect input voltage −0.3 +14 V
mode detect input current −+2mA
demagnetization input current −±1mA
feedback input voltage −0.3 +5 V
current sense input voltage −0.3 +5 V
reference input current −−1mA
auxiliary supply voltage −0.3 +18 V
operating junction temperature −10 +140 °C
storage temperature −40 +150 °C
electrostatic handling voltage class 2

human body model; note 3 − 2500 V
machine model; note 4 − 250 V

Notes

1. Repetitive clamped inductive turn-off energy <15 mJ.

2. Single pulse avalanche energy at T

<25°C: 570 mJ.

j

3. Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor.

4. Equivalent to discharging a 200 pF capacitor through a 0.75 mH coil.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

IC controller

R
R

th(j-a)
th(j-c)

thermal resistance from junction to ambient 70 K/W
thermal resistance from junction to case 31 K/W

Power FET

R
R

th(j-a)
th(j-c)

thermal resistance from junction to ambient 37 K/W
thermal resistance from junction to case 0.85 K/W

QUALITY SPECIFICATION

In accordance with

“SNW-FQ-611 part E”

.

1999 Apr 20 10

Philips Semiconductors Preliminary specification

GreenChip; SMPS module TEA1566

CHARACTERISTICS

= −10 to +110 °C; Vin= 300 V; V

T

j

currents out of the chip are negative; all voltages are measured with respect to ground.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Input voltage and current on pin 9

V

dlow

I

in

I

in(off)

minimum start drain voltage 100 −−V
input current normal operation 20 60 100 µA
off mode current V

Start-up current source and Vaux management on pin 2

V

start

V

uvlo

V

hys

I

start(low)

I

start(high)

l

aux

I

restart(prot)

I

restart(stdby)

V

clamp

start-up voltage 10.4 11 11.6 V
under voltage lockout 7.4 8.05 8.6 V
operation voltage hysteresis V
start-up current 0 V < V
start-up current 0.5 V < V
IC supply current in high frequency mode 7.0 7.7 8.5 mA
restart current in protection mode −600 −530 −460 µA
restart current in stand-by mode −2.5 −2.1 −1.7 mA
clamp voltage level l

Reference input on pin 3

V

ref

R

ref

reference voltage capacitor pin Iref = 50 nF 2.37 2.47 2.57 V
operating resistor range 16.9 24.9 33.2 kΩ

Oscillator

f

osc-l

f

osc-h

δ

max

f

ratio

f

osc-h-range

low frequency low power mode;

high frequency normal mode;

maximum duty cycle f = f
ratio f

osc-h/fosc-l

range of f

osc-h

Demagnetization input on pin 6

V

th(comp)

t

PD

demag comparator threshold V
propagation delay to output

buffer

I

bias

V

clamp(neg)

V

clamp(pos)

input bias current V
negative clamp level I
positive clamp level I

Sample and hold input on pin 6

I

dem

l

) sample threshold current % of Idem 78 83 88 %

th(sh

t

PD

normal control current lref = 100 µA 90 100 110 µA

propagation delay of current
comparator

= 8.6 to 13 V; R

aux

= 24.9 kΩ±0.1%; all currents into the chip are positive and all

Iref

< 1.95 V 150 350 550 µA

OOB

start-Vuvlo

< 0.5 V −270 −230 −190 µA

aux

aux<Vstart

= 5 mA (non switching) 15 − 18 V

aux

2.60 2.95 3.30 V

−5.0 −3.0 −1.0 mA

27.5 29 30.5 kHz

C

=50nF

IREF

66 70 74 kHz

C

=50nF

IREF

osc-h

78 80 82 %

2.30 2.45 2.60

with changing R

decreasing 50 65 80 mV

dem

IREF

50 70 100 kHz

300 500 700 ns

=65mV −0.50

dem

= −500 µA −0.45 −0.35 0 V

dem

= 100µA 2.3 2.6 2.9 V

dem

(1)

−−0.10

(1)

µA

δVdemag/δt positive 170 450 730 ns
δVdemag/δt negative 20 90 160 ns

1999 Apr 20 11

Philips Semiconductors Preliminary specification

GreenChip; SMPS module TEA1566

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Over voltage protection on pin 2

V

OVP

t

d(OVP)

Isense and low power on pin 1

t

LEB

V

th(Imax)

t

d

V

th(lopower)

Control

dδ/dV gain f

V

CTRL(min)

V

CTRL(max)

I

CTRL(leak)

absolute maximum OVP level fixed maximum level 14.0 14.7 15.5 V
OVP delay time 350 550 800 ns

leading edge blanking time R

= 0.7 × R

ref

R

ref=Rref(nom)

= 1.3 × R

R

ref

ref(nom)

ref(nom)

180 260 340 ns
240 340 440 ns

415 470 560 ns
maximum current limit voltage 0.46 0.49 0.53 V
delay to MOSFET off time to MOSFET off at

150 210 270 ns

dV/dt = 200 mV/µs;
Cgs = 500 pF

threshold voltage for switch over to low power 155 165 175 mV

−95 −85 −75 %/V

−60 −50 −40 %/V

2.00 2.15 2.30 V

minimum control voltage on

osc-h

f

osc-l

pin 4
maximum control voltage on

2.90 3.05 3.20 V

pin 4
leakage current in/out on

note 1 −1 − +1 µA

pin 4

Over temperature protection

T

trip

temperature limit 130 140 155 °C

On/off/burst mode selection input on pin 7

V
V

on/off
burst

on/off trip level 2.3 2.5 2.8 V
burst mode trip level active 6.5 − 7.5 V

inactive −−5.5 V

I

OOB

output current on pin OOB V

> 400 mV; note 1 −5 − -0.1 µA

OOB

Power MOSFET 7N60E; note 2
V

DS(break)

R

DS(on)

drain-to-source breakdown
voltage

drain-to-source on-state
resistance

Tj=25°C;
Vgs = 0 V; Id = 0.25 mA

Tj=25°C;
Vgs=10V;Vaux=10V;

600 −−V

− 1.0 1.2 Ω

Id = 7A

Notes

1. Min. and max. values are guaranteed by design.

2. The power MOSFET outputs of these devices are similar to the Philips Semiconductor type PHP7N60. These
devices feature an excellent combination of fast switching, ruggedized device design, low on-resistance and cost
effectiveness.

1999 Apr 20 12

Philips Semiconductors Preliminary specification

GreenChip; SMPS module TEA1566

160

handbook, halfpage

P

(W)

120

80

40

0

0 40 80 160

MGR937

120

T

case

Fig.8 Normalised power derating.

(°C)

3

10

handbook, halfpage

C

j

(pF)

2

10

10

11010

Coss

2103

VDS (V)

Fig.9 Junction capacitance.

MGR939

handbook, halfpage

3

a

2

1

0

−80

a = R

DS(on)/RDS(on)

ID= 6.2A; V

aux

at 25 °C.

>10V.

0 16080

Tj (°C)

Fig.10 Normalised drain-to-source on-state

resistance.

MGR938

1.2

handbook, halfpage

a

1.1

1

0.9

−100 0 100 200
Tj (°C)

Fig.11 Normalised drain-to-source breakdown

voltage.

MGR940

1999 Apr 20 13

Philips Semiconductors Preliminary specification

GreenChip; SMPS module TEA1566

handbook, full pagewidth

I

VS= 50V; I
V

= 0.5 V; V

dem

IVC= 6mA; V
L =25 mH

MAX

=7A

aux

CLAMP

closed

=11V

= 720V

open

vc

Vctrl

Vaux

Vin

TEA1566

Dem Gnd

Fig.12 Clamped inductive test circuit.

APPLICATION INFORMATION

A converter using the GreenChip is usually a flyback or
a Buck converter that is made up of the EMI filter, full
bridge rectifier, filter capacitor, transformer, output
stage(s), and some snubber circuitry.

Depending upon the type of feedback used, either an
auxiliary winding (primary regulation) or an opto-coupler
(secondary regulation) is used. GreenChip, due to its
high level of integration uses very few external
components. A sense resistor converts the primary current
into a voltage on pin Isense. The IC uses this information
for setting the peak current in the converter.

A capacitor supplied by an auxiliary winding buffers the
internal supply of the IC and is connected on pin Vaux.

L

V

MGR941

S

Isense

I

MAX

CURRENT

SENSING

CIRCUIT

CLAMP

CIRCUIT

The primary side auxiliary winding is connected via a
resistor to pin Dem. Besides being used for
demagnetization protection, pin Dem is also used for
primary side regulation.

Pin OBB is a multi use pin and depending upon connection
can be used for implementation of the on/off/burst mode
functions.

Pin 8 is not connected and serves as a high voltage spacer
pin.

Pin Vin is the connection for the drain of the internal power
MOSFET and is a high voltage pin. The internal start-up
current source also uses this pin as a supply for charging
up the Vaux capacitor during start-up and safe-restart
modes.

The auxiliary winding is also used for primary mode output
voltage regulation. A resistor connected on pin Iref sets
the reference currents in the IC. A small capacitor
(0.2 to 2 nF) connected on pin Vctrl is used by the internal
sample and hold circuit for regulation in primary feedback
scheme. The same pin is also used for secondary sensing
and serves as the input for the signal from the
opto-coupler.

Pin Gnd is the ground connection pin.

1999 Apr 20 14

GreenChip is a versatile IC that can be used in flyback
and Buck converter topologies and can be configured to
work in different modes. The application diagrams on the
next pages give some examples.

For additional information also see:

•

Application note AN98011: “200 W SMPS with
TEA1504”

•

Application note AN98058: “75 W SMPS with
TEA1566”

.

Philips Semiconductors Preliminary specification

GreenChip; SMPS module TEA1566

handbook, full pagewidth

mains

TEA1566

9

8

7

6

5

4
3

2

1

Vin

NC

OOB

Dem

Gnd

Vctrl
Iref

Vaux

Isense

R

SENSE

C

R

DEM

R

REF

REF

C

R

AUX

OOB

S1

MGR697

R

CTRL

output

Fig.13 Typical flyback configuration with secondary sensing and on/off feature.

1999 Apr 20 15

Philips Semiconductors Preliminary specification

GreenChip; SMPS module TEA1566

handbook, full pagewidth

mains

TEA1566

9

8

7

6

5

4

3

2

1

Vin

NC

OOB

Dem

Gnd

Vctrl

Iref

Vaux

Isense

R1

R2

S1

S2

output

from
microcontroller

microcontroller

supply

V

z

R3

Fig.14 Flyback configuration using the burst mode stand-by, MUVLO and on/off features.

1999 Apr 20 16

MGR698

Philips Semiconductors Preliminary specification

GreenChip; SMPS module TEA1566

handbook, full pagewidth

mains

output

Vin

9

NC

8

OOB

7

Dem

6

Gnd

TEA1566

5

4

3

2

1

Vctrl

Iref

Vaux

Isense

MGR699

Fig.15 Typical Buck configuration with primary sensing.

handbook, full pagewidth

mains

output

Vin

9

NC

8

OOB

7

Dem

6

Gnd

TEA1566

5

Vctrl

4

Iref

3

Vaux

2

Isense

1

MGR700

Fig.16 Typical Buck configuration with secondary sensing.

1999 Apr 20 17

Philips Semiconductors Preliminary specification

GreenChip; SMPS module TEA1566

PACKAGE OUTLINES

SIL9P: plastic single in-line power package; 9 leads

D

d

seating plane

b

SOT131-2

non-concave

x

E

h

view B: mounting base side

A

B

j

A

1

D

h

2

E

19

Z

DIMENSIONS (mm are the original dimensions)

A

UNIT A

mm

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

1

max.

2.0

OUTLINE
VERSION

SOT131-2

4.6

4.2

e

b

b

cD

max.

1.1

p2

0.75

0.48

0.60

0.38

IEC JEDEC EIAJ

b

p

(1)

24.0

23.6

REFERENCES

w M

0 5 10 mm

scale

deD

h

20.0

10 2.54

19.6

1999 Apr 20 18

E

12.2

11.8

L

c

Q

(1)

E

h

6

3.4

3.1

Lj

Q

17.2

2.1

16.5

1.8

EUROPEAN

PROJECTION

0.25w0.03

ISSUE DATE

92-11-17
95-03-11

(1)

Z

x

2.00

1.45

Philips Semiconductors Preliminary specification

GreenChip; SMPS module TEA1566

DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm)

non-concave

D

d

j

x

E

h

B

D

h

view B: mounting base side

A

2

E

A

SOT157-2

19

e

Z

DIMENSIONS (mm are the original dimensions)

UNIT A A e

17.0

15.5

4.6

4.2

mm

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE
VERSION

SOT157-2

1

e

(1)

cD

0.75

0.48

0.60

0.38

IEC JEDEC EIAJ

deD

24.0

20.0

23.6

19.6

w M

b

p

E

h

12.2

10 5.08

11.8

REFERENCES

0 5 10 mm

scale

(1)

12bp

2.54

e

5.08

L

3

L

E

2

h

6

Q

LL3m

3.4

12.4

3.1

11.0

c

m

e

2.4

1.6

PROJECTION

2

4.3

EUROPEAN

2.1

1.8

v M

(1)

v

Qj

0.8

0.25w0.03

ISSUE DATE

95-03-11
97-12-16

Z

x

2.00

1.45

1999 Apr 20 19

Philips Semiconductors Preliminary specification

GreenChip; SMPS module TEA1566

SOLDERING
Introduction to soldering through-hole mount

packages

This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our

Packages”

Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.

Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.

Suitability of through-hole mount IC packages for dipping and wave soldering methods

DBS, DIP, HDIP, SDIP, SIL suitable suitable

“Data Handbook IC26; Integrated Circuit

(document order number 9398 652 90011).

PACKAGE

The total contact time of successive solder waves must not
exceed 5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.

SOLDERING METHOD

DIPPING WAVE

(1)

stg(max)

). If the

Note

1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1999 Apr 20 20

Philips Semiconductors Preliminary specification

GreenChip; SMPS module TEA1566

NOTES

1999 Apr 20 21

Philips Semiconductors Preliminary specification

GreenChip; SMPS module TEA1566

NOTES

1999 Apr 20 22

Philips Semiconductors Preliminary specification

GreenChip; SMPS module TEA1566

NOTES

1999 Apr 20 23

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© Philips Electronics N.V. 1999 SCA63
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Printed in The Netherlands 295002/50/01/pp24 Date of release: 1999 Apr 20 Document order number: 9397 750 03312